KR20210051876A - The method for fabricating a dye-sensitized solar cell - Google Patents

Abstract

The present invention relates to a method for manufacturing a dye-sensitized solar cell, which comprises the following steps of: performing a series of calcination processes (or curing processes) in advance to primarily form a barrier rib (an upper barrier rib or a lower barrier rib) having a higher calcination temperature on a particular substrate (an upper substrate or a lower substrate); and forming a barrier rib (an upper barrier rib or a lower barrier rib) having a lower calcination temperature on a counterpart substrate opposing to the particular substrate (on the lower substrate when the particular substrate is the upper substrate, and on the lower substrate when the particular substrate is the upper substrate) to make each barrier rib sandwiched between the two substrates, and then subsequentially calcinating (or curing) the barrier rib (the upper barrier rib or the lower barrier rib) on the counterpart substrate to join the two substrates. Accordingly, a manufacturer of the product can widely utilize the barrier rib (the upper barrier rib or the lower barrier rib) on the particular substrate, which is completely formed in advance, as a gap maintaining means through a series of calcination processes (or curing processes) without a separate spacer, thereby normally joining each substrate in a form of a sandwich without difficulties. Therefore, a variety of damages that may be caused by additional process of disposing a spacer, such as complexity of the whole processes, reduction of the overall process efficiency, an increase in overall production time of a product and the like, can be effectively avoided.

Description

The method for fabricating a dye-sensitized solar cell

The present invention relates to a method of manufacturing a dye-sensitized solar cell, and more particularly, by pre-progressing a series of firing processes (or curing processes), the firing temperature on a specific substrate (upper substrate or lower substrate) is Measures to first form higher barrier ribs (upper barrier rib or lower barrier rib)>, <Firing on a counter substrate (lower substrate when a specific substrate is an upper substrate, lower substrate when a specific substrate is an upper substrate) After forming the partition wall (the upper partition wall or the lower partition wall) with a lower temperature, two substrates are arranged in a sandwich type via each partition wall, and the partition wall on the counter substrate side (the upper partition wall or the lower partition wall) is fired (or, Curing) and combining the two substrates> etc. are flexibly taken, and through this, the product producer side selects and forms a selection into a completed form through a series of firing processes (or curing processes) without a separate spacer. By using the partition wall (the upper partition wall or the lower partition wall) of a specific substrate as a gap maintaining means, and inducing the normal bonding of each substrate in a sandwich type without any difficulty, in the end, the spacer arrangement process can be further progressed. Related to the manufacturing method of dye-sensitized solar cells that can support effectively avoiding various damages (e.g., damages that increase the overall process complexity, decreases overall process efficiency, increases overall product production time, etc.) will be.

In recent years, with the rapid development of electric/electronic/material related technologies, various types of dye-sensitized solar cells have been widely developed/distributed.

For example, Korean Patent Publication No. 10-2012-114888 (Name: Dye-sensitized solar cell encapsulant and dye-sensitized solar cell encapsulation method using the same) (published on October 17, 2012), Korean Patent No. 10-1223736 No. (name: electrolyte for dye-sensitized solar cell and dye-sensitized solar cell using the same) (announcement on Jan. 21, 2013) discloses an example of a dye-sensitized solar cell according to the prior art in more detail.

Meanwhile, as shown in FIG. 1, a dye-sensitized solar cell according to a conventional technique, for example, an alternating-array type (W-type) dye-sensitized solar cell 10, includes conductive material layers 13 and 14 ) Are separated from each other by a partition wall 15 in a state interposed between the upper and lower substrates 11 and 12 of glass material and the upper and lower substrates 11 and 12, respectively, and the upper and lower substrates A plurality of electrolyte-accommodating cells 16 arranged along (11, 12) and accommodating an electrolyte, a light absorbing layer 18 alternately disposed on the upper substrate 11 or the lower substrate 12, and the Counter electrodes 17 alternately disposed on the upper substrate 11 or lower substrate 12 so as to face the light absorbing layer 18, and a bus electrode 19 formed on the upper substrate 11 ) Is systematically combined.

At this time, the light absorbing layer 18 _{forms a structure in which the dye is adsorbed to the metal oxide particles (eg, TiO 3} particles), absorbs the light L incident from the light source, and generates a current based on this. .

Under such a conventional system, the product producer proceeds a series of assembly processes to assemble/integrate the upper substrate 11 and the lower substrate 12 into a sandwich type, and through this, a dye-sensitized solar cell in a completed form. After configuring (10), a process of injecting an electrolyte and a dye polymer through an electrolyte injection port (not shown) formed on the side of the upper/lower substrates 11 and 12 is performed.

Of course, as described above, when the process of constructing the dye-sensitized solar cell 10 in a finished form by assembling/integrating the upper substrate 11 and the lower substrate 12 into a sandwich type proceeds, the product producer On the side, an effort to stably maintain the gap between the upper substrate 11 and the lower substrate 12 is made in-depth.

This is because if the gap between the upper substrate 11 and the lower substrate 12 is not stably maintained, a large problem may occur in the quality of the dye-sensitized solar cell 10.

However, in the case of the alternating-array type (W-type) dye-sensitized solar cell 10 according to the prior art, since it does not have any separate means for maintaining the gap (for reference, between the partition walls) In the case of a Z-type dye-sensitized solar cell in which a grid electrode is inserted, the grid electrode can be widely used as a means for maintaining a gap), and the upper substrate 11 and the lower substrate 12 are assembled in a sandwich type. / When incorporating, the product producer has no choice but to proceed with a separate spacer arrangement process, and in the end, various damages (e.g., damage that the overall process becomes complicated, damage that the overall process efficiency decreases) , The overall product production time increases, etc.).

Korean Patent Publication No. 10-2012-114888 (Name: sealing material for dye-sensitized solar cells and sealing method of dye-sensitized solar cells using the same) (published on October 17, 2012) Domestic Registration Patent No. 10-1223736 (Name: Electrolyte for dye-sensitized solar cell and dye-sensitized solar cell using the same) (announced on Jan. 21, 2013)

Accordingly, the object of the present invention is to first advance a series of firing processes (or curing processes) to first form a partition wall (upper partition wall or lower partition wall) with a higher firing temperature on a specific substrate (upper substrate or lower substrate). Actions to be taken>, <A partition wall (upper partition wall or lower partition wall) with a lower firing temperature is placed on the counter substrate (lower substrate if a specific substrate is an upper substrate, lower substrate if a specific substrate is an upper substrate) against a specific substrate. After formation, the two substrates are arranged in a sandwich type via each partition wall, and the partition wall on the counter substrate side (the upper partition wall or the lower partition wall) is subsequently fired (or cured) to bond the two substrates>, etc. Take it flexibly, and through this, the partition wall of a specific substrate (upper partition or lower partition) that was selected and formed in a completed form through a series of firing processes (or curing processes) without a separate spacer on the side of the product producer As a means of maintaining a gap, by inducing the normal bonding of each substrate in a sandwich type without any difficulty, in the end, various damages due to the additional progress of the spacer arrangement process (e.g., damage that the overall process becomes complicated, It is to support effectively avoiding damages that reduce overall process efficiency, damages that increase overall product production time, etc.).

Other objects of the present invention will become more apparent from the following detailed description and accompanying drawings.

In order to achieve the above object, in the present invention, the light absorbing layer and the counter electrode are alternately formed on the upper substrate, and the light absorbing layer and the counter electrode are alternately formed on the lower substrate; Forming an upper partition wall on the upper substrate and then firing the upper partition wall; After forming a lower partition wall on the lower substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the lower partition is fired to combine the lower and lower substrates. Disclosed is a method of manufacturing a dye-sensitized solar cell comprising the step of, wherein the firing temperature of the upper partition wall is higher than the firing temperature of the lower partition wall.

In addition, in another aspect of the present invention, the step of alternately forming a light absorbing layer and a counter electrode on an upper substrate, and alternately forming a light absorbing layer and a counter electrode on the lower substrate; Forming a lower partition wall on the lower substrate and then firing the lower partition wall; After forming an upper partition wall on the upper substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the upper partition is fired to combine the lower and lower substrates. Disclosed is a method of manufacturing a dye-sensitized solar cell comprising the step of, wherein the firing temperature of the lower partition wall is higher than the firing temperature of the upper partition wall.

Further, in another aspect of the present invention, the step of alternately forming a light absorbing layer and a counter electrode on an upper substrate, and alternately forming a light absorbing layer and a counter electrode on the lower substrate; Forming an upper partition wall on the upper substrate and then curing the upper partition wall; After forming a lower partition wall on the lower substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the lower partitions are cured to combine the lower and lower substrates. Disclosed is a method of manufacturing a dye-sensitized solar cell comprising the step of:

Further, in another aspect of the present invention, the step of alternately forming a light absorbing layer and a counter electrode on an upper substrate, and alternately forming a light absorbing layer and a counter electrode on the lower substrate; Forming a lower partition wall on the lower substrate and then curing the lower partition wall; After forming an upper partition wall on the upper substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the upper partition is hardened to combine the lower and lower substrates. Disclosed is a method of manufacturing a dye-sensitized solar cell comprising the step of:

In the present invention, <measure to first form a partition wall (upper partition wall or lower partition wall) with a higher firing temperature on a specific substrate (upper substrate or lower substrate) by pre-progressing a series of firing processes (or curing processes)>, <After forming a partition wall (upper partition wall or lower partition wall) with a lower firing temperature on a counter substrate (lower substrate if a specific substrate is an upper substrate, lower substrate if a specific substrate is an upper substrate) against a specific substrate, The two substrates are arranged in a sandwich type via each partition, and the counterpart substrate side partition (upper partition or lower partition) is fired (or cured) after firing to combine the two substrates. , Under the implementation environment of the present invention, on the side of the product producer, without a separate spacer, through a series of firing processes (or curing processes), partition walls (upper partition walls or lower partition walls) of a specific substrate that were selected and formed in a completed form As a means of maintaining a gap, it is possible to normally combine each substrate in a sandwich type without any difficulty, and in the end, various damages due to the additional progress of the spacer arrangement process (e.g., damage that the overall process becomes complex, overall Damages that reduce process efficiency, damages that increase overall product production time, etc.) can be effectively avoided.

1 is an exemplary view conceptually showing a dye-sensitized solar cell according to the prior art.
2 is an exemplary view conceptually showing a dye-sensitized solar cell employing the present invention.
3 to 22 are process flow charts sequentially showing a method of manufacturing a dye-sensitized solar cell according to each embodiment of the present invention.

Hereinafter, a method of manufacturing a dye-sensitized solar cell according to the present invention will be described in more detail with reference to the accompanying drawings.

As shown in Fig. 2, a dye-sensitized solar cell employing the present invention, for example, an alternating-array type (W-type) dye-sensitized solar cell 20 includes conductive material layers 23 and 24. In a state interposed between the upper/lower substrates 21 and 22 made of a glass material and the upper/lower substrates 21 and 22 each provided, they are separated from each other by a partition wall 25, and the upper/lower substrates 21 A plurality of electrolyte-accommodating cells 26 arranged along the ,22), and a light absorbing layer 28 alternately disposed on the upper substrate 21 or the lower substrate 22, and the light absorbing layer Counter electrodes 27 alternately disposed on the upper substrate 21 or the lower substrate 22 so as to face 28, and a bus electrode 19 formed on the upper substrate 21 It takes a systematically combined composition.

Even at this time, the light absorbing layer 28 _{forms a structure in which the dye is adsorbed to the metal oxide particles (eg, TiO 3} particles), absorbs the light L incident from the light source, and generates a current based on this. do.

Even under the system of the present invention, the product production subject proceeds a series of assembly processes to assemble/integrate the upper substrate 21 and the lower substrate 22 into a sandwich type, and through this, the dye-sensitized type After configuring the solar cell 20, a process of injecting an electrolyte and a dye polymer is performed through an electrolyte injection port (not shown) formed on the sides of the upper/lower substrates 21 and 22.

Of course, even at this time, if the process of assembling/assembling the upper substrate 21 and the lower substrate 22 in a sandwich type to form the dye-sensitized solar cell 20 in a completed form proceeds, the product producer side Efforts to stably maintain the gap between the substrate 21 and the lower substrate 12 are made in-depth. This is because if the gap between the upper substrate 21 and the lower substrate 22 is not stably maintained, a large problem may occur in the quality of the dye-sensitized solar cell 20.

Under such a sensitive situation, in the present invention, the partition wall (upper partition wall or lower partition wall) of a specific substrate that was selected and formed in a completed form through a series of firing processes (or curing processes) without a separate spacer is used as a gap maintaining means. The present invention discloses a method of manufacturing a dye-sensitized solar cell that can be used widely and induce normal bonding of each substrate in a sandwich type without any difficulty.

First, as shown in FIG. 3, in the present invention, by performing a series of coating processes, the light absorbing layers 28 alternately disposed on the upper substrate 21 made of a glass material having a conductive material layer 23 and The counter electrode 27 and a separate bus electrode 29 are formed.

In addition, in the present invention, as shown in FIG. 5, a series of coating processes are performed independently of the above procedure, so that light alternately disposed on the lower substrate 22 made of a glass material having a conductive material layer 24. A procedure of forming the absorbing layer 28 and the counter electrode 27 is performed.

Meanwhile, when the formation of the light absorbing layer 28, the counter electrode 27, and the bus electrode 29 on the upper substrate 21 is completed through the above-described procedure, in the present invention, as shown in FIG. Likewise, after a series of coating processes are carried out to form an upper partition wall 25a having, for example, a glass frit material on the upper substrate 21, a procedure of firing the upper partition wall 25a is performed. It is done. Of course, when this procedure is completed, the upper partition wall 25a side has a solid solidified form in advance, so that in the sandwich-type bonding phase of the upper/lower substrates 21 and 22 that proceeds later, without any other problems, it is as if It can additionally perform the same role as a spacer.

Through the above-described procedure, when firing/forming of the upper partition wall 25a on the upper substrate 21 is completed, as shown in FIG. 6, in the present invention, a series of coating processes are performed, and the lower substrate 22 After forming, for example, a lower partition wall 25b having a glass frit material, as shown in FIG. 7, the upper substrate 25a and the lower partition wall 25b are used as a medium. A procedure of combining the lower substrate 21 and the lower substrate 22 by placing the 21 and the lower substrate 22 in a sandwich type and performing a series of firing processes to fire the lower partition wall 25b. Will proceed.

At this time, as described above, since the upper partition wall 25a side had a solid solidified form in advance, in the sandwich-type coupling phase of the upper/lower substrates 21 and 22, it was like a spacer without any other problems. As a result, it is possible to perform a role, and as a result, it is possible to normally maintain/control the gaps of the upper/lower substrates 21 and 22 without additionally performing a separate spacer arrangement process on the side of the product producer.

Here, in the present invention, measures to induce the firing temperature of the upper partition wall 25a to be higher than the firing temperature of the lower partition wall 25b (that is, the upper partition wall 25a is at a higher temperature than the lower partition wall 25b). Measures to induce firing) (i.e. measures to induce the material constituting the upper partition wall 25a to be fired at a higher temperature than the material constituting the lower partition wall 25b) (in this case, for example, the lower When the partition wall 25b is made of a material fired at 400°C, the upper partition 25a is made of a material fired at 480°C), so that from the side of the upper partition 25a, the lower partition 25b Even under the firing process of ), it is induced to perform the'role as a gap maintaining spacer' given to itself without any other deformation.

On the other hand, as shown in FIG. 8, in another embodiment of the present invention, first, a series of coating processes are performed, and light alternately disposed on a lower substrate 22 made of a glass material having a conductive material layer 24. A procedure of forming the absorbing layer 28 and the counter electrode 27 is performed.

In addition, in the present invention, as shown in FIG. 10, a series of coating processes are performed independently of the above procedure, so that light alternately disposed on the upper substrate 21 made of a glass material having a conductive material layer 23 is performed. The absorption layer 28, the counter electrode 27, and a separate bus electrode 29 are formed.

On the other hand, through the above-described procedure, when the formation of the light absorbing layer 28 and the counter electrode 27 on the lower substrate 22 is completed, in the present invention, as shown in FIG. 9, a series of coating processes are performed. Thus, after forming a lower partition wall 25b having, for example, a glass frit material on the lower substrate 22, a procedure of firing the lower partition wall 25b is performed. Of course, when this procedure is completed, the lower partition wall 25b side has a solid solidified form in advance, so that in the sandwich-type bonding phase of the upper/lower substrates 21 and 22, which proceeds later, without any problems, It can additionally perform the same role as a spacer.

Through the above-described procedure, when the firing/forming of the lower partition wall 25b on the lower substrate 21 is completed, as shown in FIG. 11, in the present invention, a series of coating processes are performed, and the upper substrate 21 After forming an upper partition wall 25a having, for example, a glass frit material, as shown in FIG. 12, the upper substrate 25a and the lower partition wall 25b are used as a medium. A procedure of combining the lower substrate 21 and the lower substrate 22 by placing the 21 and the lower substrate 22 in a sandwich type and performing a series of firing processes to fire the upper partition wall 25a. Will proceed.

At this time, as described above, since the bottom partition wall 25b had a solid solidified form in advance, in the sandwich-type bonding phase of the upper/lower substrates 21 and 22, it was like a spacer without any other problems. As a result, it is possible to perform a role, and as a result, it is possible to normally maintain/control the gaps of the upper/lower substrates 21 and 22 without additionally performing a separate spacer arrangement process on the side of the product producer.

Here, in the present invention, measures to induce the firing temperature of the lower partition wall 25b to be higher than the firing temperature of the upper partition wall 25a (that is, the lower partition wall 25b is at a higher temperature than the upper partition wall 25a). Measures to induce firing) (i.e. measures to induce the material constituting the lower partition wall 25b to be fired at a higher temperature than the material constituting the upper partition wall 25a) (in this case, for example, the upper When the partition wall 25a is made of a material fired at 400°C, the lower partition 25b is made of a material fired at 480°C), so that from the side of the lower partition 25b, the upper partition 25a Even under the firing process of ), it is induced to perform the'role as a gap maintaining spacer' given to itself without any other deformation.

On the other hand, under another implementation of the present invention, as shown in FIG. 13, in the present invention, first, a series of coating processes are performed, on the upper substrate 21 made of a glass material having a conductive material layer 23. A procedure of forming the light absorbing layers 28 and counter electrodes 27 alternately disposed, and a separate bus electrode 29 is performed.

In addition, in the present invention, as shown in FIG. 15, a series of coating processes are performed independently of the above procedure, so that light alternately disposed on the lower substrate 22 made of a glass material having a conductive material layer 24. A procedure of forming the absorbing layer 28 and the counter electrode 27 is performed.

Meanwhile, when the formation of the light absorbing layer 28, the counter electrode 27, and the bus electrode 29 on the upper substrate 21 is completed through the above-described procedure, in the present invention, as shown in FIG. 14 Likewise, after a series of coating processes are performed to form an upper partition wall 25a having, for example, a UV curing type organic sealing material or a heat curing type organic sealing material on the upper substrate 21, the upper partition wall 25a The procedure (process) of curing is carried out. In this case, the curing procedure (process) may preferably be a UV curing process or a thermal curing process.

Of course, when such a procedure is completed, the upper partition wall 25a side has a solid solidified form in advance, so that in the sandwich-type bonding phase of the upper/lower substrates 21 and 22 that proceeds later, without any other problems, It can additionally perform the same role as a spacer.

When the upper partition wall 25a is cured/formed on the upper substrate 21 through the above-described procedure, as shown in FIG. 16, in the present invention, a series of coating processes are performed, and the lower substrate 22 After forming a lower partition wall 25b having, for example, a UV curing type organic sealing material or a heat curing type organic sealing material, as shown in FIG. 17, the upper partition wall 25a and the lower partition wall 25b are formed. As a medium, the upper substrate 21 and the lower substrate 22 are arranged in a sandwich type, and a series of curing processes (eg, UV curing process or thermal curing process) are performed to cure the lower partition wall 25b. , A procedure of combining the lower substrate 21 and the lower substrate 22 is performed.

At this time, as described above, since the upper partition wall 25a side had a solid solidified form in advance, in the sandwich-type coupling phase of the upper/lower substrates 21 and 22, it was like a spacer without any other problems. As a result, it is possible to perform a role, and as a result, it is possible to normally maintain/control the gaps of the upper/lower substrates 21 and 22 without additionally performing a separate spacer arrangement process on the side of the product producer.

On the other hand, as shown in FIG. 18, in another embodiment of the present invention, first, a series of coating processes are performed, and are alternately disposed on a lower substrate 22 made of a glass material having a conductive material layer 24. A procedure of forming the light absorbing layer 28 and the counter electrode 27 is performed.

In addition, in the present invention, as shown in FIG. 20, a series of coating processes are performed independently of the above procedure, so that light alternately disposed on the upper substrate 21 made of a glass material having a conductive material layer 23 is performed. The absorption layer 28, the counter electrode 27, and a separate bus electrode 29 are formed.

Meanwhile, when the formation of the light absorbing layer 28 and the counter electrode 27 on the lower substrate 22 is completed through the above-described procedure, in the present invention, as shown in FIG. 19, a series of coating processes are performed. Thus, after forming the lower partition wall 25b having, for example, a UV curing type organic sealing material or a thermal curing type organic sealing material on the lower substrate 22, a procedure of curing the lower partition wall 25b is performed. . Even in this case, the curing procedure (process) may preferably be a UV curing process or a thermal curing process.

Of course, even when such a procedure is completed, the lower partition wall 25b side has a solid solidified form in advance, so that the sandwich-type bonding phase of the upper and lower substrates 21 and 22 to be proceeded later, without any particular problem. , It is possible to additionally perform a role like a spacer.

When the lower partition wall 25b is cured/formed on the lower substrate 21 through the above-described procedure, as shown in FIG. 21, in the present invention, a series of coating processes are performed, and the upper substrate 21 After forming an upper partition wall 25a having, for example, a UV curing type organic sealing material or a heat curing type organic sealing material, as shown in FIG. 22, the upper partition wall 25a and the lower partition wall 25b are formed. As a medium, the upper substrate 21 and the lower substrate 22 are arranged in a sandwich type, and a series of curing processes (eg, UV curing process or thermal curing process) are performed to cure the upper partition wall 25a. , A procedure of combining the lower substrate 21 and the lower substrate 22 is performed.

Even at this time, as described above, since the lower partition wall 25b side had a solid solidified form in advance, in the sandwich-type bonding phase of the upper/lower substrates 21 and 22, it was as if the spacer and the spacer were The same role can be performed, and as a result, the gap between the upper/lower substrates 21 and 22 can be normally maintained/adjusted without further proceeding with a separate spacer arrangement process on the product producer side.

As described above, in the present invention, a partition wall (upper partition wall or lower partition wall) having a higher firing temperature is first formed on a specific substrate (upper substrate or lower substrate) by pre-progressing a series of firing processes (or curing processes). Actions>, <Formation of a partition wall (upper partition wall or lower partition wall) with a lower firing temperature on the counter substrate (lower substrate if a specific substrate is an upper substrate, lower substrate if a specific substrate is an upper substrate) against a specific substrate After that, the two substrates are arranged in a sandwich type via each partition wall, and the partition wall on the counter substrate side (the upper partition wall or the lower partition wall) is fired (or cured) after firing to bond the two substrates>, etc. Therefore, under the implementation environment of the present invention, on the side of the product producer, without a separate spacer, through a series of firing processes (or curing processes), partition walls (upper partition walls or While using the lower partition wall as a means for maintaining a gap, it is possible to normally combine each substrate in a sandwich type without any difficulty, and in the end, various damages (e.g., the overall process becomes complicated) due to the further progress of the spacer arrangement process. Damage, damage that decreases overall process efficiency, damage that increases overall product production time, etc.) can be effectively avoided.

The present invention is not limited to a specific field, and exhibits useful effects in general in various fields requiring the use of solar cells.

And, in the above, although specific embodiments of the present invention have been described and illustrated, it is obvious that the present invention may be variously modified and implemented by those skilled in the art.

Such modified embodiments should not be individually understood from the technical spirit or point of view of the present invention, and such modified embodiments should fall within the scope of the appended claims of the present invention.

L: rays
10,20: Dye-sensitized solar cell
11.21: upper substrate
12, 22: lower substrate
13,23,14,24: conductive material layer
15,25: bulkhead
16,26: electrolyte receiving cell
17,27: counter electrode
18,28: light absorbing layer
19,29: bus electrode
25a,25c: upper bulkhead
25b, 25d: lower bulkhead

Claims (7)

Alternately forming light absorbing layers and counter electrodes on the upper substrate and alternately forming light absorbing layers and counter electrodes on the lower substrate;
Forming an upper partition wall on the upper substrate and then firing the upper partition wall;
After forming a lower partition wall on the lower substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the lower partition is fired to combine the lower and lower substrates. It includes the step of,
The method of manufacturing a dye-sensitized solar cell, wherein the firing temperature of the upper partition wall is higher than the firing temperature of the lower partition wall. Alternately forming light absorbing layers and counter electrodes on the upper substrate and alternately forming light absorbing layers and counter electrodes on the lower substrate;
Forming a lower partition wall on the lower substrate and then firing the lower partition wall;
After forming an upper partition wall on the upper substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the upper partition is fired to combine the lower and lower substrates. It includes the step of,
The method of manufacturing a dye-sensitized solar cell, wherein the firing temperature of the lower partition wall is higher than the firing temperature of the upper partition wall. [3] The method of claim 1 or 2, wherein the upper partition wall or the lower partition wall has a glass frit material. Alternately forming light absorbing layers and counter electrodes on the upper substrate and alternately forming light absorbing layers and counter electrodes on the lower substrate;
Forming an upper partition wall on the upper substrate and then curing the upper partition wall;
After forming a lower partition wall on the lower substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the lower partition is hardened to combine the lower and lower substrates. A method of manufacturing a dye-sensitized solar cell, comprising the step of: Alternately forming light absorbing layers and counter electrodes on the upper substrate and alternately forming light absorbing layers and counter electrodes on the lower substrate;
Forming a lower partition wall on the lower substrate and then curing the lower partition wall;
After forming an upper partition wall on the upper substrate, the upper and lower substrates are arranged in a sandwich type through the upper and lower partitions, and the upper partition is hardened to combine the lower and lower substrates. A method of manufacturing a dye-sensitized solar cell, comprising the step of: The method of claim 4 or 5, wherein the upper or lower barrier ribs are cured by a UV curing process or a thermal curing process. [6] The method of claim 4 or 5, wherein the upper partition wall or the lower partition wall has a UV curing type organic sealing material or a thermal curing type organic sealing material.

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