KR20210031558A - Bonding device - Google Patents

Abstract

According to an embodiment of the present invention, a bonding device includes: a heating unit including a heat source and moving in a vertical direction; a pressing unit disposed under the heating unit; a protrusion unit disposed on a side of the pressing unit; and a sensor unit spaced apart from the protrusion unit in a horizontal direction. The sensor unit measures vertical displacements of a plurality of measurement portions defined in the protrusion unit when the pressing unit contacts an object to be pressed. The present invention provides the bonding device capable of measuring the flatness of the pressing unit of the bonding device in real time.

Description

Bonding device {BONDING DEVICE}

The present invention relates to a bonding device, and more particularly, to a bonding device capable of measuring the flatness of a pressing tip in real time.

In general, a display device includes a display panel including a plurality of pixels and a driving chip for driving the pixels. The driving chip is disposed on the flexible film, and the flexible film is connected to the display panel. The driving chip is connected to the pixels of the display panel through the flexible film. This connection method is defined as a chip-on film method.

A plurality of pads connected to the driving chip are disposed on the flexible film, and the display panel includes a plurality of connection pads connected to the pixels. The pads are connected to each other by contacting the connection pads, thereby connecting the driving chip to the pixels.

Pads and connection pads are connected in various ways. For example, a bonding device is disposed on top of the pads, and the bonding device applies heat and pressure to the pads. Accordingly, the pads and the connection pads may be electrically connected to each other by an anisotropic conductive film (ACF).

An object of the present invention is to provide a bonding device capable of measuring the flatness of a pressing portion of the bonding device in real time.

A bonding apparatus according to an embodiment of the present invention includes a heating unit including a heat source and moving in a vertical direction, a pressing unit disposed under the heating unit, a protrusion disposed on a side of the pressing unit, and a horizontal direction spaced apart from the protrusion. It includes a sensor unit. The sensor unit measures vertical displacements of a plurality of measurement portions defined on the protrusion when the pressing unit contacts the pressing object.

According to an embodiment of the present invention, a protrusion is disposed on a side surface of the pressing unit that presses the pressing object, and the sensor unit is disposed horizontally spaced apart from the protrusion. The sensor unit may measure the flatness of the pressing unit by measuring vertical displacements of the plurality of measurement portions defined on the protrusion when the pressing unit contacts the pressing object.

1 is a perspective view of a bonding device according to an embodiment of the present invention.
FIG. 2 is a first side view of FIG. 1 as viewed from one direction.
3 is a second side view of FIG. 1 as viewed from a different direction.
4A, 4B, and 4C are diagrams illustrating states of the bonding device shown in FIG. 2 moved in a vertical direction.
5 is a diagram illustrating capacitance values measured by a sensor unit in FIGS. 4A, 4B, and 4C.
6 is a diagram illustrating a deformed state of the pressing portion of the bonding device illustrated in FIG. 3.
7 is a diagram illustrating capacitance values measured by each of the sensors in FIG. 6.
FIG. 8 is a diagram illustrating another state in which the pressing portion of the bonding device shown in FIG. 3 is deformed.
9 is a diagram illustrating capacitance values measured by each of the sensors in FIG. 8.

In the present specification, when a component (or region, layer, part, etc.) is referred to as “on”, “connected”, or “coupled” to another component, it is placed directly on the other component/ It means that it may be connected/coupled or a third component may be disposed between them.

The same reference numerals refer to the same elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content.

"And/or" includes all combinations of one or more that the associated configurations may be defined.

Terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In addition, terms such as “below”, “lower”, “above”, and “upper” are used to describe the relationship between the components shown in the drawings. The terms are relative concepts and are described based on the directions indicated in the drawings.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless interpreted as an ideal or excessively formal meaning, explicitly defined herein. do.

Terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features, numbers, or steps. It is to be understood that it does not preclude the possibility of addition or presence of, operations, components, parts, or combinations thereof.

The bonding device according to an embodiment of the present invention may be used to connect a chip on film to a display panel. Specifically, the bonding device may apply heat and pressure to connect the chip-on film to the display panel. An anisotropic conductive film may be disposed between the chip-on film and the display panel. When the bonding device applies heat and pressure to the chip-on film, a plurality of conductive balls in the anisotropic conductive film may be arranged between pads disposed on the chip-on film and connection pads disposed on the display panel. Accordingly, the chip-on film and the display panel may be electrically connected to each other.

Hereinafter, a bonding apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a perspective view of a bonding device according to an embodiment of the present invention.

FIG. 2 is a first side view of FIG. 1 as viewed from one direction.

3 is a second side view of FIG. 1 as viewed from a different direction.

FIG. 2 is a view of the bonding device shown in FIG. 1 as viewed from the first direction DR1, and FIG. 3 is a view of the bonding device shown in FIG. 1 as viewed from the second direction DR2. It is a drawing of. For convenience of explanation, illustration of the fixing part supporting the sensor part is omitted in FIGS. 1 and 3.

1 to 3, the bonding device (BD) includes a pressing part (CP), a heating part (HP), a plurality of bolts (CO), a protrusion (TA), And a sensor unit SP.

The pressing part CP may be disposed under the heating part HP. The pressing part CP may include a pressing tip CT and a first body BO1.

The pressing tip CT may be disposed under the pressing part CP. The pressing tip CT may extend downward from the first body BO1. The pressing tip CT may contact a pressing object (not shown). The bonding device (BD) may apply pressure and heat to the object to be pressed through the pressing tip (CT). For example, the object to be pressed may be a chip-on film.

The pressing tip CT may extend in the first direction DR1. When viewed from the second direction DR2, the pressing tip CT may have a long side in the first direction DR1 and a short side in the third direction DR3.

Hereinafter, the second direction DR2 indicates a direction perpendicularly intersecting with the first direction DR1. A plane defined by the first direction DR1 and the second direction DR2 may be parallel to the horizontal plane. The third direction DR3 may indicate a direction perpendicular to the horizontal plane. The "vertical position" or "height" of any configuration may mean a position in the third direction DR3.

The first body BO1 may be disposed above the pressing tip CT. The width of the first body BO1 in the second direction DR2 may be changed (see FIG. 2 ). Specifically, the first body BO1 may include a first sub-body SBO1 and a second sub-body SBO2.

The first sub-body SBO1 is defined as a portion in which the width of the second direction DR2 changes from the first body BO1 to the third direction DR3, and the second sub-body SBO2 is the first body. In (BO1), it may be defined as a portion in which the width of the second direction DR2 is kept constant.

The first sub-body SBO1 may be disposed on the pressing tip CT. The width of the first sub-body SBO1 in the second direction DR2 may be changed. The lower portion of the first sub-body SBO1 may be connected to the pressing tip CT, and the upper portion of the first sub-body SBO1 may be connected to the second sub-body SBO2. The width of the first sub-body SBO2 in the second direction DR2 may be the smallest in the lower portion and the largest in the upper portion.

When viewed from the first direction DR2, the outer surface (right side in FIG. 2) of the first sub-body SBO1 may be an inclined surface. The inner surface (left in FIG. 2) of the first sub-body SBO1 may include both an inclined surface and a vertical surface.

When viewed from the second direction DR2, the first sub-body SBO1 may have a rectangular shape having a long side in the first direction DR1 and a short side in the third direction DR3.

The second sub-body SBO2 may extend upward from the first sub-body SBO1. The width of the second sub-body SOB2 in the second direction DR2 may be constant.

When viewed from the first direction DR1, both the outer and inner surfaces of the second sub-body SBO2 may be parallel to the third direction DR3.

When viewed from the second direction DR2, the second sub-body SBO2 may have a rectangular shape having a long side in the first direction DR1 and a short side in the third direction DR3.

Hereinafter, the outer surface OSF of the first body BO1 is defined as the outer surface of the second sub-body SBO2, and the inner surface of the first body BO1 is the first sub-body SBO1 and the second sub-body. It may be defined as inner surfaces of the body SBO2.

The pressing tip CT of the pressing part CP and the first body BO1 may include a conductor. For example, the pressing part CP may include a metallic material.

The pressing tip CT of the pressing part CP and the first body BO1 may be integrally formed. However, the present invention is not limited thereto, and the pressure tip CT and the first body BO1 may be separately manufactured and connected to each other.

The heating unit HP may be disposed on the pressing unit CP. The heating unit HP may apply heat to the pressurization unit CP. The upper part of the heating part HP may be connected to a pressure transmitting part (not shown) and a moving part (not shown). The pressure transmitting unit may transmit pressure to the pressurizing unit CP through the heating unit HP, and the moving unit may move the bonding device BD. The heating part HP and the pressing part CP may move in the vertical direction (the third direction DR3) by the moving part.

The heating unit HP may include a second body BO2 and a heat source HS. The second body BO2 may extend in the first direction DR1.

When viewed from the first direction DR1, the second body BO2 may have a rectangular shape in which a portion of the lower portion protrudes.

When viewed from the second direction DR2, the second body BO2 may have a rectangular shape having a long side in the first direction DR1 and a short side in the third direction DR3. The length of the second body BO2 in the first direction DR1 may be the same as the length of the first body BO1 in the first direction DR1.

The second body BO2 may be disposed on the inner side or the upper surface of the first body BO1 of the pressing part CP. Specifically, the lower surface of the second body BO2 may face the upper surface of the first body BO1 of the pressing part CP. The inner surface of the second body BO2 may face the inner surface of the first body BO1.

The second body BO2 may include a conductor. For example, the second body BO2 may include a metallic material.

The heat source HS may be disposed inside the second body BO2. The heat source HS may be implemented with one or more heat wires. The heat source HS may extend in the first direction DR1. The heat source HS may be disposed at a position higher than the pressing part CP in the third direction DR3. The heat source HS generates heat, and the heat may be transferred to the pressurization part CP through the second body BO2.

The pressing part CP and the heating part HP may be separately manufactured and connected to each other. For example, the pressurizing part CP may be a consumable that is replaced when its life is over.

The pressing part CP may be fixed to the heating part HP by a plurality of bolts CO.

Although five bolts CO are shown in FIGS. 1 and 3, these are merely illustrative, and the number of bolts is not limited thereto.

The plurality of bolts CO may be disposed between the inner surface of the pressing part CP and the inner surface of the heating part HP. The plurality of bolts CO may physically fix the pressing part CP to the heating part HP.

Specifically, the plurality of bolts CO may be disposed to be spaced apart from each other along the first direction DR1. The plurality of bolts CO may be respectively inserted into bolt holes (not shown) defined on the outer surface OSF of the first body BO1 of the pressing part CP. Each bolt CO may pass through the first body BO1 of the pressurization part CP and may be fastened to the heating part HP. That is, the plurality of bolts CO may fix the pressing part CP to the heating part HP in the second direction DR2.

The user may tighten or loosen a plurality of bolts CO. For example, when the user needs to replace the pressurization unit CP, the user may unscrew a plurality of bolts CO to separate the mounted pressurization unit CP from the heating unit HP. The user may fix the pressing part CP to the heating part HP by arranging a new pressing part CP under the heating part HP and fastening a plurality of bolts CO.

However, the plurality of bolts CO do not necessarily have to be fastened in the second direction DR2. The plurality of bolts CO may be fastened in different directions. For example, the plurality of bolts CO may fix the pressing part CP to the heating part HP in the third direction DR3. Specifically, the plurality of bolts CO penetrates the upper surface of the first body BO1 of the pressurization unit CP and the lower surface of the second body BO2 of the heating unit HP, and is formed under the heating unit HP. Can be fastened. The plurality of bolts CO may be disposed to be spaced apart from each other in the first direction DR1.

The protrusion TA may be disposed on the side of the pressing part CP. Specifically, the protrusion TA may be disposed on the outer surface OSF of the first body BO1. The protrusion TA may extend in the first direction DR1. When viewed from the second direction DR1, the protrusion TA may have a rectangular shape having a long side in the first direction DR1 and a short side in the second direction DR2.

The protrusion TA may be disposed at a different height from the plurality of bolts CO based on the third direction DR3. The protrusion TA is disposed in the lower area of the outer surface OSF of the first body BO1, and the plurality of bolts CO are disposed in the upper area of the outer surface OSF of the first body BO1. I can. Accordingly, the user can tighten or loosen the plurality of bolts CO even in the state in which the protrusion TA is disposed.

The protrusion TA may extend from the pressing part CP. For example, the protrusion TA may be integrally formed with the pressing part CP by molding an object including a metallic material. However, the protruding part TA and the pressing part CP may be separately manufactured and connected to each other.

The protrusion TA may include a conductor. For example, the protrusion TA may include a metallic material. However, the present invention is not limited thereto, and the protrusion TA may include an insulator.

A plurality of measurement portions may be defined in the protrusion TA. Specifically, a first measurement portion TA1, a second measurement portion TA2, and a third measurement portion TA3 may be defined in the protrusion TA.

When viewed from the second direction DR2, the first measurement portion TA1 and the third measurement portion TA3 are defined as both side portions of the projection TA, and the second measurement portion TA2 is the projection TA ) Can be defined as the central part.

The first measurement portion TA1 may be disposed at a corner portion of an outer surface of the first body BO1.

The second measurement portion TA2 may be disposed at a central portion of the outer surface of the first body BO1.

The third measurement portion TA3 may be disposed at the other side corner portion of the outer surface of the first body BO1.

The protrusion TA may be integrally formed, as shown in FIG. 1. That is, the first to third measurement portions TA1, TA2, and TA3 may be connected to each other. However, the present invention is not limited thereto, and the first measurement portion TA1, the second measurement portion TA2, and the third measurement portion TA3 may be disposed to be spaced apart from each other in the first direction DR1. For example, the three protrusions may be formed separately and disposed on the outer surface OSF of the first body BO1. In this case, the first measurement portion TA1, the second measurement portion TA2, and the third measurement portion TA3 may each be defined as one protrusion.

The sensor unit SP may be disposed to be spaced apart from the protrusion TA in the horizontal direction. The sensor unit SP may measure vertical displacements of a plurality of measurement portions defined in the protrusion TA in real time when the pressing unit CP contacts the pressing object.

Specifically, the sensor unit SP may include a first sensor SP1, a second sensor SP2, and a third sensor SP3. The first sensor SP1 may be disposed to be spaced apart from the first measurement part TA1 in the second direction DR2. The second sensor SP2 may be disposed to be spaced apart from the second measurement part TA2 in the second direction DR2. The third sensor SP3 may be disposed to be spaced apart from the third measurement portion TA3 in the second direction DR2.

The first to third sensors SP1, SP2, and SP3 may be disposed to be spaced apart from each other in the first direction DR1.

The position of the sensor unit SP may be fixed by the fixing unit FP (see FIG. 2 ). For example, the upper part of the fixing part FP may be connected to the supporting configuration (not shown) of the bonding device, and the lower part may be connected to the sensor part SP. Accordingly, the sensor unit SP may be fixed in the vertical direction.

The height of the center portion of the sensor unit SP may be defined as _{a reference height H S.}

When the virtual line indicating the reference height H _S passes the center of the protrusion TA, the pressing tip CT of the pressing unit CP may contact the pressing object to transfer heat and pressure to the pressing object.

At this time, the first sensor SP1 measures the vertical displacement of the first measurement portion TA1, the second sensor SP2 measures the vertical displacement of the second measurement portion TA2, and the third sensor SP3 ) May measure the vertical displacement of the third measurement part TA3.

The sensor unit SP may include capacitive sensors. The first to third sensors SP1, SP2, and SP3 may be capacitive sensors. The sensor unit SP may include an electrode plate (not shown) to measure the capacitance. The capacitance value measured by the sensor unit SP may be in inverse proportion to the electrode plate of the sensor unit SP and a distance between the electrode plate and an adjacent conductor. Here, the conductor may be a protrusion TA.

Hereinafter, the relationship between the vertical position H of the protrusion TA and the capacitance value C measured by the sensor unit SP will be described in detail.

4A, 4B, and 4C are diagrams illustrating states of the bonding device shown in FIG. 2 moved in a vertical direction.

5 is a diagram illustrating capacitance values measured by a sensor unit in FIGS. 4A, 4B, and 4C.

4A, 4B, and 4C, the vertical positions of the first to third measurement portions TA1, TA2, and TA3 of the protrusion TA are all the same, and the pressing portion CP, the heating portion HP, and It is assumed that the protrusion TA includes a conductor.

4A and 5, the center of the protrusion TA is located at a first height H ₁ . The first height H ₁ is lower than the _{reference height H S} , which is the center height of the sensor unit SP. In this case, the conductor facing the sensor unit SP is the first body BO1 of the pressing unit CP. The sensor unit SP is spaced apart from the first body BO1 by a first distance d _{1 in the second direction DR2.}

When the distance between the sensor unit SP and the first body BO1 is the first distance d ₁ , the capacitance value C measured by the sensor unit SP is the first capacitance C ₁ .

As the heating part HP moves upward, the height of the center of the protrusion TA may gradually increase from _{the first height H 1.} A part of the sensor part SP may face the second body BO2, and the other part may face the protrusion TA. As the heating part HP moves upward, the area of the protrusion TA facing the sensor part SP may gradually increase. A partial area of the protrusion TA facing the sensor unit SP may function as a conductor. Since the distance between the sensor unit SP and the protrusion TA is smaller than the distance between the sensor unit SP and the first body BO1, the capacitance value C measured by the sensor unit SP is the first capacitance It may increase gradually from (C _{1 ).}

Referring to FIGS. 4B and 5, the height of the center of the protrusion TA gradually increases and may be positioned _{at the second height H 2.} The second height H ₂ may be the same as the reference height H _S. In this case, the conductor facing the sensor unit SP is the protrusion TA. The sensor unit SP is spaced apart from the protrusion TA by a second distance d _{2 in the second direction DR2.}

The second distance d ₂ may be defined as a distance when the distance between the sensor unit SP and the conductor is minimum.

When the distance between the sensor unit SP and the protrusion TA is the second distance d ₂ , the capacitance value measured by the sensor unit SP is the second capacitance C ₂ . The second capacitance C ₂ may be defined as a maximum capacitance value measured by the sensor unit SP.

Referring to FIGS. 4C and 5, as the heating part HP continues to move upward, the height of the center of the protrusion TA moves from the second height H ₂ to the third height H ₃ .

As the height of the center of the protrusion TA increases, the area of the protrusion TA facing the sensor unit SP may gradually decrease. In this section, the capacitance value measured by the sensor unit SP may gradually decrease.

When the height of the center of the protrusion TA reaches the third height H3, the conductor facing the sensor unit SP may be the first body BO1 of the pressing unit CP.

The sensor unit SP may be spaced apart from the first body BO1 of the pressing unit CP by a third distance d _3. The third distance d ₃ may be greater than the second distance d _2.

When the distance between the sensor unit SP and the protrusion TA is the third distance d ₃ , the capacitance value measured by the sensor unit SP is the third capacitance C ₃ . The third capacitance C ₃ may be smaller than the second capacitance C _2.

As a result, the capacitance value C measured by the sensor unit SP may be determined by the distance d between the sensor unit SP and the conductor facing the sensor unit SP.

6 is a diagram illustrating a deformed state of the pressing portion of the bonding device illustrated in FIG. 3.

7 is a diagram illustrating capacitance values measured by each of the sensors in FIG. 6.

FIG. 8 is a diagram illustrating another state in which the pressing portion of the bonding device shown in FIG. 3 is deformed.

9 is a diagram showing capacitance values measured by each of the sensors in FIG. 8. Hereinafter, with reference to FIGS. 6 to 9, changes in capacitance values measured by the respective sensors will be described as the flatness or inclination of the pressing unit changes.

6 and 7, in a process of bonding the chip-on film to the display panel, the flatness of the pressing part CP' may be changed. Specifically, the flatness may mean the flatness of the lower surface of the pressing tip CT' in contact with the pressing object.

The flatness of the pressing tip CT' may be deformed by various factors. For example, the change in the flatness of the pressing tip (CT') is the temperature difference between the pressing part (CP') and the heating part (HP), and the material included in the pressing part (CP') and the heating part (HP). It may occur due to differences in physical properties (eg, coefficient of thermal expansion) of these.

In the bonding process, the shape of the pressing tip CT' may be convexly deformed downward. When the shape of the pressing tip CT' is deformed to be convex downward, appropriate pressure and heat may not be transferred to a pressing object (ie, a chip-on film) that comes into contact with both sides of the pressing tip CT'. Accordingly, a defect may occur in the display device.

As the shape of the pressing tip CT' is deformed, the shape of the protrusion TA' disposed on the side of the pressing portion CP' may also be convexly deformed downward.

As the shape of the protrusion TA' is deformed, the capacitance values C measured by the sensors SP1, SP2, and SP3 may change. Specifically, the vertical position of the second measurement part TA2 ′ defined on the protrusion TA ′ may be changed. Here, the vertical position may mean the height of the center.

The vertical position of the second measurement part TA2 ′ may be lower than the _{reference height H S.} The vertical position of the first measurement part TA1 ′ and the vertical position of the third measurement part TA3 ′ may be the same. The vertical positions of the first and third measurement portions TA1 ′ and TA3 ′ may also be lowered. However, vertical displacements of the first measurement portion TA1 ′ and the third measurement portion TA3 ′ may be considerably smaller than the vertical displacement of the second measurement portion TA2 ′.

As the vertical positions of the first and third measurement parts TA1 ′ and TA2 ′ are lowered, the capacitance value C _a measured by the first and third sensors SP1 and SP3 becomes the second capacitance ( It may be smaller than C- _{2 ).}

As the vertical position of the second measurement part TA2 ′ decreases, the capacitance value C _b measured by the second sensor SP2 may be smaller than the second capacitance C _2.

_{The capacitance value C a} measured by the first and third sensors SP1 and SP3 may be greater than the _{capacitance value C b} measured by the second sensor SP2.

The user can check the capacitance values measured by the first to third sensors (SP1, SP2, SP3) in real time, and the flatness of the pressing tip CT in real time through the difference between the measured capacitance values. Can be measured.

As a result, the sensor unit SP measures the vertical displacements of the first to third measurement portions TA1', TA2', and TA3' defined in the protrusion TA' that is integrally deformed with the pressure tip CT'. By measuring in real time, the flatness of the pressing part CP can be measured. Accordingly, when a problem occurs in the flatness of the pressing unit, the defect rate of the display device can be reduced by checking and taking measures in real time.

8 and 9, the inclination of the pressing part CP" may be changed. Here, the inclination of the pressing part CP" may mean the inclination of the pressing tip CT" in contact with the pressing object. For example, when viewed from the second direction DR2, the heights of the left and right sides of the pressing tip CT ″ may be different from each other. The inclination of the pressing tip CT'' may be caused by the degree of coupling of the bolts BO.

As shown, when the right side of the pressing tip CT'' is inclined downward, appropriate pressure and heat may not be transferred to the portion in contact with the left side of the pressing tip CT ″ in the chip-on film, and thus Accordingly, a defect in the display device may occur.

The protrusion TA ″ may be inclined together with the pressing tip CT ″. The protrusion TA'' may be inclined by an angle α in the clockwise direction with respect to the first direction DR1. Accordingly, the second measurement portion TA ″ and the third measurement portion TA ″ may move below the original position. The vertical displacement of the third measurement portion TA ″ may be greater than the vertical displacement of the second measurement portion TA ″. The first measurement portion TA'' may also move downward, but the vertical displacement of the first measurement portion TA1 ″ is a vertical displacement of the second measurement portion TA2 ″ and the third measurement portion TA3 ″. It can be quite small compared to the displacement.

_{The capacitance value C C} measured by the first sensor SP1 may be smaller than the second capacitance C _2.

_{The capacitance value C d} measured by the second sensor SP2 may be smaller than the _{capacitance value C c} measured by the first sensor SP1.

_{The capacitance value C f} measured by the third sensor SP3 may be smaller than the _{capacitance value C d} measured by the second sensor SP2.

That is, capacitance values measured by each of the sensors SP1, SP2, and SP3 may be the largest in the first sensor SP1 and the smallest in the third sensor SP3.

The user may measure the inclination of the pressing tip CT'' in real time based on the capacitance values measured by the first to third sensors SP1, SP2, and SP3.

As a result, the sensor unit SP has the first to third measurement portions TA1 ″, TA2 ″, and TA3 ″ defined in the protrusion TA ″ that is integrally deformed with the pressing tip CT ″. ) By measuring the vertical displacements in real time, it is possible to measure the slope of the pressing tip (CT``) Accordingly, when a problem occurs in the inclination of the pressing tip CT″, it is possible to immediately take measures to reduce the defective rate of the display device.

According to an embodiment of the present invention, the bonding device (BD) may further include a control unit. The control unit may control the operation of the moving unit and the heating unit. The control unit may control the operation of the moving unit and the heating unit based on the vertical displacements of the plurality of measurement parts measured by the sensor unit SP.

Referring back to FIG. 7, the control unit includes a capacitance value (C _{a ) measured by the first and third sensors (SP1, SP3) and a capacitance value (C b} ) measured by the second sensor (SP2). When the difference is greater than a predetermined value, it is determined that a problem has occurred in the flatness of the pressing tip CT, and the operation of the heating unit HP may be stopped. The predetermined value can be set by the user. For example, the user may set a predetermined value in consideration of the degree of flatness of the pressing tip required in the bonding process.

Referring back to FIG. 9, the control unit has a difference between the capacitance value C _{c measured by the first sensor SP1 and the capacitance value C f} measured by the third sensor SP3 is a predetermined value. If it is larger, it is determined that a problem has occurred in the inclination of the pressing tip CT, and the operation of the heating unit HP may be stopped. The predetermined value may be set in consideration of the slope of the pressing tip CT required in the bonding process.

As a result, when a problem occurs in the flatness or inclination of the pressing tip CT, the controller of the bonding device BD increases the completion of the bonding process by stopping the operation of the heating unit HP and reduces the defect rate of the display device. I can make it.

Although described with reference to the above embodiments, those skilled in the art will understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention described in the following claims. I will be able to.

For example, the protrusion may include an insulator. In this case, the protrusion may act as a dielectric having a specific dielectric constant value. The capacitance value measured by each sensor may vary depending on the dielectric constant. As another example, the sensor unit may be implemented as a laser device. In this case, the sensor unit may determine the vertical position of each point based on time information in which the laser is reflected on the object and returned.

The embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, and all technical ideas within the scope of the following claims and equivalents should be construed as being included in the scope of the present invention.

BD: bonding device HP: heating unit
CP: pressurization part BO1, BO2: first body, second body
CT: Pressurized tip HS: Heat source
TA: protruding part SP: sensor part
CO: Volts

Claims (15)

A heating unit including a heat source and moving in a vertical direction;
A pressing unit disposed under the heating unit;
A protrusion disposed on the side of the pressing part; And
And a sensor part spaced from the protrusion in a horizontal direction,
The sensor unit, when the pressing unit is in contact with a pressing object, a bonding device for measuring vertical displacements of a plurality of measurement portions defined on the protrusion. The method of claim 1,
The pressing part extends in the first direction,
The bonding device that the protrusion is disposed on one of both side surfaces of the pressing unit opposite to each other in a second direction crossing the first direction. The method of claim 2,
The pressing part,
A body disposed below the heating unit; And
It includes a pressure tip extending in a downward direction from the body,
The bonding device that the protrusion is disposed on an outer surface of the body extending in the first direction. The method of claim 3,
The sensor unit measures vertical displacements of a first measurement portion, a second measurement portion, and a third measurement portion defined on the protrusion,
The first measurement portion is disposed at one corner portion of the outer surface of the body,
The second measurement portion is disposed in the central portion of the outer surface of the body,
The third measurement portion is a bonding device disposed at the other corner portion of the outer surface of the body. The method of claim 4,
The bonding device wherein the first measurement portion, the second measurement portion, and the third measurement portion are spaced apart from each other in a first direction. The method of claim 1,
The sensor unit,
A bonding apparatus including a plurality of sensors respectively corresponding to the plurality of measurement portions of the protrusion. The method of claim 6,
The bonding device including a plurality of capacitive sensors in the sensor unit. The method of claim 1,
The bonding device wherein the protrusion includes a conductor. The method of claim 1,
The bonding device of the protrusion includes an insulator. The method of claim 1,
The bonding device that the protrusion extends from the pressing portion. The method of claim 1,
The bonding device that the pressing unit is fixed to the heating unit by a plurality of bolts. The method of claim 11,
The plurality of bolts is a bonding device disposed between the side of the pressing portion and the side of the heating portion facing the side of the pressing portion. The method of claim 11,
The plurality of bolts is a bonding device disposed between an upper surface of the pressing unit and a lower surface of the heating unit facing the upper surface of the pressing unit. The method of claim 1,
The bonding apparatus further comprises a control unit receiving the vertical displacements measured by the sensor unit and controlling the operation of the heating unit based on the measured vertical displacements. The method of claim 14,
The control unit,
When a difference between a vertical displacement of one measurement portion and a vertical displacement of another measurement portion of the plurality of measurement portions is greater than a predetermined value, the operation of the heating unit is stopped.

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