KR20210022894A - Modular ic gripping device in chamber - Google Patents

Abstract

The present invention relates to a module IC gripping device for testing the performance of a module IC produced in a manufacturing process, in which a picker directly grips the module IC under high or low temperature conditions inside a sealed chamber to insert the module IC into a test socket or take it out. To this end, the module IC gripping device of the present invention comprises: a plurality of test sockets (111) installed to be electrically connected to the upper portion of a tester (110); a chamber (100) in which each of the test sockets (111) is accommodated, an inlet shutter (101) and an outlet shutter (102) are installed so as to be opened and closed on both sides, and a temperature suitable for the test conditions of the module IC (200) is maintained; upper and lower plates (121 and 122) fixed to the upper and lower portions of a plurality of guide rods (123) installed to penetrate the upper portion of the chamber (100), respectively; a movable plate (140) installed on the lower surface of the lower plate (122) to be transported by the installation interval of the test socket (111) along the linear motion (141); a gripper unit (150) installed on the lower plate (122) in which a long hole (122a) is formed in the same direction as the moving direction of the movable plate (140) to handle the module IC (200); and a driving means (160) installed on the upper plate (121) and driving the gripper unit (150).

Description

Module IC gripping device in chamber {Modular ic gripping device in chamber}

The present invention relates to a module IC gripping device for testing the performance of a module IC (hereinafter referred to as'module IC') produced in a manufacturing process, and more specifically, a high or low temperature inside a sealed chamber. The present invention relates to a module IC gripping device in a chamber in which a picker directly grips the module IC under conditions and can be inserted into or taken out of a test socket.

In general, a module IC is an independent circuit configured by soldering and fixing a plurality of ICs and components 3 on one or both sides of the board 2 as shown in FIG. 1, and is mounted on the main board to expand the capacity. It has a function to let you know.

Since such module IC 1 has higher added value than selling the produced ICs individually, IC manufacturers are developing and selling them as a flagship product.

The module IC (1) assembled through the manufacturing process is expensive, so the reliability of the product is also very important, and only the product judged as good through strict quality inspection is shipped, and the module IC judged as defective is partially modified or All of it is being disposed of.

In the early stages of the development of the module IC, an equipment that automatically loads the produced module IC 1 into the test socket and performs a test, then automatically classifies it according to the test result and unloads it into a customer carrier (custom tray) was developed. There wasn't.

Therefore, in order to test the module IC that has been produced, the operator had to manually take one module IC out of the carrier, load it into the test socket, conduct the test for a set period of time, and then classify the module IC into the customer carrier according to the test result. The work efficiency was deteriorated according to the IC test.

In addition, due to the boredom of simple labor, it caused a decrease in productivity due to the performance test.

Therefore, a handler for automatically testing the performance of a module IC has been developed and registered as Patent No. 177341 (Patent Document 1).

However, such a conventional device has the advantage of automatically loading the manufactured module IC into the test socket to perform the test, and then classifying it into good and defective products according to the test result, but only the good products are shipped by testing the produced module IC at room temperature. , When the shipped module IC is mounted on the product and used in practice, it is driven in a high temperature state where a lot of heat is generated according to the driving, so the conditions during the test and the conditions during actual use differ, and thus the reliability of the product is degraded.

The reason is that in order to heat the module IC, the pickup means must put or take out the module IC in the sealed chamber, but the pickup means could not handle the module IC in the sealed chamber.

In view of the above problems, a new type of handler capable of testing module ICs in a high-temperature chamber while transporting the carrier by placing a plurality of module ICs contained in a tray in a carrier was developed. Patent No. 277538 (October 11, 2000) It has been registered as (Patent Document 2).

FIG. 2 is a perspective view showing a main part of a conventional device. FIG. 3 is a cross-sectional view taken along line B-B of FIG. 2, and FIG. 4 is a plan view of FIG. 3, in which the conventional device is sealed to maintain a temperature suitable for testing. Carrier transfer control means that is provided on the lower panel 15 to determine the position of the carrier 16 containing the plurality of module ICs 1 to be tested and at the same time transfer the carrier 16 to the outside of the chamber 14 after the test is completed. , Carrier transfer guide means for guiding the transfer of the carrier when moving forward and backward toward the socket assembly 17 for testing, a pushing means for pushing the carrier 16 towards the socket assembly 17 during testing, after the test is completed It is constituted by a take-out means or the like for removing the module IC 1 contained in the carrier 16 from the socket assembly.

The carrier transfer control means includes a transfer plate 18 installed on the lower plate 15 constituting the chamber 14 so as to be movable in the same direction as the transfer direction of the carrier 16, and on the transfer plate. The fixed stopper 19 is installed to control the transfer of the carrier 16 that is transferred to the inside of the chamber, and the carrier 16 is installed to be rotatable around the shaft 20 on the inlet side of the carrier. A movable stopper 21 supporting the side surface and installed on the bottom of the transfer plate 18 to be hinged to one end of the movable stopper rotates the movable stopper 21 as the carrier 16 is transferred into the chamber. It is composed of a cylinder 22 to allow, and a driving unit installed on the bottom surface of the transfer plate to horizontally transfer the transfer plate 18.

The length of the transfer plate 18 for transferring the carrier 16 placed on the outside of the chamber according to the driving of the driving unit is sufficiently lengthened so that the end of the carrier 16 is not separated from the chamber even if it escapes to the outside of the chamber as much as possible as shown in the dashed-dotted line in FIG. Is set up.

As the carrier 16 is transferred into the chamber 14, the rod of the cylinder 22 to support the side of the carrier 16 by rotating the movable stopper 21 rotates around the shaft 20 It is fitted with a pin 23 at one end of the movable stopper 21 so that when the cylinder 22 is driven, the pin 23 draws an arc around the shaft 20 and the position is changed, so the other end of the cylinder 22 is also The movable stopper 21 can be rotated around the shaft 23 only when it is coupled with the pin 24 so as to be rotatable.

As shown in FIG. 3, the driving part for transferring the transfer plate 18 has a ball screw 25 installed to be idle on the lower plate 15 of the chamber 14, and a closing plate 26 surrounding the ball screw. A motor 27 for rotating the ball screw 25 is installed at the bottom of the ball screw 25, and the motor 27 powers the ball screw 25 between the ball screw and the pulleys 28a and 28b fixed to the motor shaft. A timing belt 29 is wound for transmission to the) side.

A slider 30 fixed to the bottom of the transfer plate 18 is coupled to the ball screw 25 that idles according to the driving of the motor 27, so that the ball screw 25 rotates by driving the motor 27. When the transfer plate 18 is moved horizontally along the ball screw.

In addition, the driving part is surrounded by a'U'-shaped closing plate 26 installed to extend to the outside of the chamber 14, so that the inside and outside of the chamber are isolated by the slider 30.

Guide blocks 32 fitted into the LM guider 31 are fixed on both sides of the slider 30 fitted in the ball screw 25, and through holes 30a penetrating the inside of the slider 30 are formed. A heat-resistant tube 33 is connected between the cylinder 22 located in the chamber 14 and the through hole, and a general tube 34 is connected to the outside of the chamber and through the through hole on the other side.

The carrier transfer guide means that is transferred to the inside of the chamber 14 by the carrier transfer control means and guides the positioned carrier 16 to the socket assembly 17 side when the carrier transfer guide means is attached to the transfer plate 18 of the carrier transfer control means. The lower guider 35 installed to be advanced and retracted toward the socket assembly, the upper guide 37 installed at the rear plate 36 so as to be advanced and retracted toward the socket assembly 17, and an LM guider guiding the transport of the upper and lower guides. It consists of (38)(39).

And during the test, the pushing means that pushes the carrier 16 toward the socket assembly 17 is a pair of guide rods 41 coupled to the front plate 40 so as to be transportable, and is installed at the tip of the guide rod so that the guide rod moves forward. As a result, a pusher 42 that pushes the carrier 16 toward the socket assembly 17 and a ball screw fixed to the other end of the guide rod located outside the chamber 14 so as to be able to rotate idle on the bracket 43 It is composed of a support block 45 fitted in 44, and a motor 47 that is fixedly installed on the bracket and transmits power to the ball screw 44 through a timing belt 46 to rotate the ball screw.

The power according to the driving of the motor 47 is transmitted to the ball screw 44 by a timing belt 46 wound around the motor shaft and pulleys 48a and 48b fixed to one end of the ball screw 44.

A support frame 49 having a guide rail 49a is fixed to the tip of a guide rod 41 that moves forward and backward as the ball screw 44 rotates by the drive of the motor 47, and a guide formed on the support frame A pusher 42 that pushes the carrier 16 toward the socket assembly 17 is detachably mounted on the rail 49a.

After the test is completed, the module IC take-out means for removing the module IC 1 contained in the carrier 16 from the socket assembly 17 is fixed to both sides of the upper guider 37, which is the carrier transfer guide means, as shown in FIG. When restoring the upper locking lever 50 to pull the upper part of the carrier 16, which was guided by the upper guider 37, to the upper part of the pusher 42 in the opposite direction of the socket assembly 17, and the pushing means The lower part of the carrier 16, which was longly fixed in the center at the lower part of the support frame 49, and the tip was caught in the concave groove 35a formed in the lower guider 35, and was guided to the lower guider 35 when the pushing means was restored. It consists of a lower locking lever 51 to be pulled in the opposite direction of the socket assembly.

Therefore, as shown by the dashed-dotted line in FIG. 2, when the carrier 16 containing the module IC 1 is located in the heating chamber and the carrier is not located in the chamber 14, the movable stopper 21 is used as the lower guider. It maintains a state rotated counterclockwise around the shaft 20 so as to be located at a point lower than the upper surface of (35).

In this state, the inlet-side shutter (not shown) is opened, and the ball screw 25 is rotated according to the driving of the motor 27 to move the slider 53 on which the pushing plate 52 is fixed to the right in the drawing. The carrier 16 is transferred to the chamber 14 side by a push plate. In the above-described operation, the carrier 16 is guided to the upper and lower guiders 35 and 37, which are guide means located in the chamber 14. Is transferred to the state.

In this way, when the carrier 16 is transferred to the inside of the chamber 14 and the tip is caught by the fixed stopper 19 fixed to the lower guider 35 and the transfer is controlled, the slider 53 to which the pushing plate 52 is fixed is initially At the same time as it is returned to the state, the inlet-side shutter is closed to close the chamber 14.

After the carrier 16 containing the module IC 1 to be tested is transferred into the chamber 14 by the above operation, compressed air is supplied to the inside of the cylinder 22 installed under the transfer plate 18. 22 is driven to push the rod.

When the cylinder rod advances, the movable stopper 21 rotates clockwise around the shaft 20 and is in close contact with the side wall of the carrier 16, the carrier 16 fitted in the upper and lower guiders 35 and 37 Does not flow.

Thereafter, the motor 47, which is a pushing means, is driven to transmit the driving force of the motor to the ball screw 44 through the timing belt 46, and when the ball screw is idle, the support block 45 inserted into the ball screw is shown. It advances to the left of the statue.

In this way, when the support block 45 moves to the left in the drawing, the support frame 49 fixed by the guide rod 41 to the support block 44 moves forward with the guide rail 49a of the support frame 49. The pusher 42 mounted in) pushes the module IC 1 contained in the carrier 16 toward the socket assembly 17.

Accordingly, the module IC 1 contained in the carrier 16 is inserted into the test socket 54 mounted on the socket assembly 17 and electrically communicates with the tester (not shown). The test is done.

As described above, when the carrier 16 advances toward the socket assembly 17 due to the advancement of the pusher 42, the carrier 16 is installed on the upper and lower guiders 35 and 37. It moves more stably by

After the test is carried out for a set time, the pushing means is returned to the initial state by driving of the motor 47. As described above, the module IC 1 that was plugged into the test socket 54 when the pushing means returns to the initial state. Is separated from the socket assembly 17 by the take-out means.

When the pusher 42, which was moved to the right in the drawing by the reverse driving of the motor 47, is restored, the lower locking lever 51 which was fixed to the support frame 49 and fitted in the concave groove 35a of the lower guider 35, and The upper and lower guiders 35 and 37 are pulled at the same time by the upper locking lever 50 connected to the rear of the pusher 42, so the carrier 16 that was mounted on the upper and lower guiders 35 and 37 Is retracted together with the pusher 42 which is the pushing means.

Accordingly, the module IC 1 plugged into the test socket 54 of the socket assembly 17 is pulled out of the test socket.

After all the tests of the module IC 1 contained in the carrier 16 are completed, the carrier must be taken out of the chamber 14, and the motor 27, which is a driving part of the carrier transfer control means, is driven to drive the ball screw. When the ball screw is rotated (25), the slider 30 fixed to the bottom of the transfer plate 18 is inserted into the ball screw, so the transfer plate moves to the right side in the drawing, exits the chamber 14, and is shown on the right side of FIG. It is located like a dashed-dotted line.

After the carrier 16 containing the tested module IC 1 is pulled out of the chamber 14, the cylinder 22 is restarted to rotate the movable stopper 21 supporting the side of the carrier. At the same time, the carrier 16 placed on the lower guider 35 is withdrawn by a separate rotator, and then the module IC contained in the carrier is classified into good and defective products according to the test result.

(Prior technical literature)

(Patent Document 0001) Korean Patent Publication No. 10-177341 (registered on November 17, 1998)

(Patent Document 0002) Korean Patent Publication No. 10-277538 (registered on October 11, 2000)

(Patent Document 0003) Republic of Korea Patent Publication 10-277539 (registered on October 11, 2000)

(Patent Document 0004) Korean Patent Publication 10-291586 (registered on December 23, 2000)

However, such a conventional device has the advantage of improving the reliability of a product by performing a test under conditions that occur when the module IC is actually used in a high temperature chamber, but there are several problems as follows.

First, since the module IC to be tested must be loaded and unloaded on the carrier, an expensive carrier is required according to the module IC test.

Second, since a separate loading and unloading means for loading or unloading a plurality of module ICs contained in the tray are required, the size of the handler increases as well as the cost of manufacturing the handler increases.

Third, as the carrier containing the module IC is transferred one step at a time and then supplied to the interior of the chamber, the structure of the transfer means becomes complicated and a lot of transfer structures are required.

Fourth, the fabrication of the carrier is complicated and the lifespan is short due to the structure, so frequent replacement is required.

Fifth, when performing a test by contacting the module IC to the test socket while a plurality of module ICs are contained in the carrier, a part (lower part) of the carrier touches the test socket and wears out, thereby shortening the life of the test socket.

Sixth, if the carrier is transferred with the module IC loaded in a bad state because it is not possible to check the loading state of the module IC inside the carrier, the module IC will hit the structure and be damaged, or a good module due to poor contact of the test socket. There have been cases where the IC is judged as a defective product.

The present invention was conceived to solve such a problem in the related art, and the structure of the handler was improved so that the loading picker grips the module IC contained in the loading buffer inside the chamber without using a separate carrier, and then directly tests it. The purpose is to insert into a socket to perform a test, or to allow the unloading picker to take the tested module IC out of the test socket and unload it into the unloading buffer.

Another object of the present invention is that the loading picker directly grips the plurality of module ICs contained in the loading buffer and inserts them into the test socket, so that the module IC is damaged by colliding with the structure during the transfer of the module IC, or a contact failure of the test socket occurs. It is to be able to prevent the phenomenon in advance.

According to an aspect of the present invention for achieving the above object, a plurality of test sockets installed to be electrically connected to the upper part of the tester, each of the test sockets are accommodated, inlet shutters and outlet shutters are installed to be openable and closed on both sides, and a module A chamber that maintains a temperature suitable for the test conditions of the IC, an upper and lower plate fixedly installed on the upper and lower portions of a plurality of guide rods installed through the upper part of the chamber, and a test socket along a linear motion on the lower surface of the lower plate A movable plate installed to be transported by the installation interval of the movable plate, a gripper unit installed on a lower plate having a long hole in the same direction as the moving direction of the movable plate to handle the module IC, and a drive installed on the upper plate to drive the gripper unit In-chamber module IC gripping device, characterized in that consisting of means is provided.

The present invention has several advantages over the prior art.

First, the loading picker grips the module IC contained in the loading buffer that appears and exits the chamber and inserts it into the test socket, and the unloading picker grips the tested module IC and unloads it into the unloading buffer that appears inside the chamber. Since it is loaded, it becomes possible to test the module IC without using an expensive carrier, thereby extending the life of the test socket.

Second, since the loading and unloading pickers are designed to directly take out the module IC from the loading buffer or put it in the unloading buffer, there is no need for a separate loading means and takeout means to load or take out the module IC into the carrier, so the size of the handler is reduced. It is possible to reduce, and accordingly, it is possible to significantly reduce the cost of manufacturing the handler.

Third, since the module IC to be tested is directly taken out of the loading buffer transferred into the chamber and inserted into the test socket, a separate transfer structure with a complex structure is not required.

Fourth, since the module IC to be tested is loaded and handled in the loading and unloading buffer without using a carrier, it is possible to prevent the module IC from colliding with the structure during transfer and damaged or the contact failure of the test socket in advance.

1 is a front view showing a typical module IC
2 is a perspective view showing a main part of a conventional device
3 is a cross-sectional view taken along line B-B of FIG. 2
Figure 4 is a plan view of Figure 3
5 is a cross-sectional view taken along line C-C of FIG. 2
6 is a front view showing a carrier conveying means of a conventional device
7 is a perspective view showing the configuration of the present invention
8 is a perspective view showing a main part of the present invention
9A is a cross-sectional view taken along line D-D of FIG. 8
9B is a cross-sectional view taken along line E-E in FIG. 8
10 is a perspective view showing the gripper unit and driving means of the present invention
11 is an exploded perspective view showing the gripper unit of the present invention
12 is a front view showing a loading and unloading picker of the present invention
13A to 13D are longitudinal cross-sectional views for explaining the operating state of the loading and unloading picker of the present invention,
13A is a diagram illustrating a loading picker gripping a module IC to be tested, and an unloading picker positioned directly above the test socket.
13B is a diagram illustrating a state in which an unloading picker descends and grips the module IC in the test socket.
13C is a diagram illustrating a state in which an unloading picker has risen to top dead center
13D is a diagram illustrating a state in which the gripper unit moves by 1 pitch and the module IC gripped on the loading picker is positioned directly above the test socket.
13e is a diagram showing a state in which the loading picker is lowered and the module IC to be tested is inserted into the test socket.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. It should be noted that the drawings are schematic and have not been drawn to scale. Relative dimensions and ratios of parts in the drawings are exaggerated or reduced in size for clarity and convenience in the drawings, and any dimensions are merely exemplary and not limiting. In addition, the same reference numerals are used to indicate similar features to the same structure, element, or part appearing in two or more drawings.

Figure 7 is a perspective view showing the configuration of the present invention, Figure 8 is a perspective view showing a main part of the present invention, Figures 9a and 9b is a cross-sectional view of Figure 8 and line D-D and line E-E, the present invention is a tester ( A plurality of test sockets 111 installed to be electrically connected to the top of 110, and each of the test sockets 111 are accommodated, and a loading buffer and an unloading buffer (not shown) enter and exit on both sides thereof ( 101) and the withdrawal shutter 102 are installed to be openable and closed, and a chamber 100 that maintains a temperature suitable for the test condition of the module IC 200, and a plurality of guide rods installed to penetrate the upper portion of the chamber 100 ( 123), the upper and lower plates 121 and 122 fixedly installed at the upper and lower portions of the 123), and the lower plates 122 are installed on the bottom surface of the lower plate 122 to follow the linear motion 141 by driving the first actuator 130. The module IC is installed through a long hole 122a of a movable plate 140 that is transferred by the installation interval of the test socket 111 and a lower plate 122 that is elongated in the same direction as the moving direction of the movable plate 140. It consists of a gripper unit 150 for handling 200, and a driving means 160 installed on the upper plate 121 to drive the gripper unit 150, and the like.

At this time, a plurality of test sockets 111 are arranged in two or more rows on the upper part of the tester 110, and the lower plate 122 has a gripper unit ( If 150) is installed so as to be able to rise and fall, it is more preferable because a large number of module ICs 200 can be tested within the same time, thereby maximizing the test efficiency of the module IC 200.

The gripper unit 150 includes a support block 151 installed on the movable plate 140 and a first insertion hole 151a formed on both sides of the support block 151 as shown in FIG. 11 shown as an exemplary embodiment of the present invention. ), a plurality of lifting blocks 154 that are elastically installed with a support bar 152 having a third elastic member 153 inserted therein, and are installed in each of the lifting blocks 154 to test the odd number of rows in the loading buffer. A loading and unloading picker that grips the module IC 200 and inserts it into the test socket 111, and grips the tested module IC 200 in the test socket 111 for even rows and unloads it into the unloading buffer. (155) (156) and a plurality of loading pickers by horizontally moving the movable plate 140 installed to be movable along the linear motion 141 on the lower plate 122 by 1 pitch by the installation interval of the test socket 111 (155) or a first actuator 130 for placing the unloading picker 156 directly below the test socket 111, and an odd-numbered row of loading pickers 155 or It is composed of a loading and unloading picker driving means 170 for selectively raising and lowering the unloading pickers 156 of even rows.

As shown in FIG. 12, the loading and unloading pickers 155 and 156 are simultaneously opened or closed along the LM guides 157 on both sides of each of the lifting blocks 154, as shown in FIG. A pair of sliders 159 elastically installed by the sliders 159 and fingers 142 fixed to each of the sliders 159 to wrap and grip the upper both ends of the module IC 200, and at the center of the support block 151 A plurality of lifting rods 144 elastically installed by the second elastic member 143 to be lifted and lowered in the formed second insertion hole 151b, and a slider 159 provided at the lower end of each lifting rod 144 It consists of a wedge-shaped plunger (145) to operate.

At this time, if the bearings 146 are respectively installed to face the pair of sliders 159 so that the bearings 146 are connected to the inclined surface 145a of the plunger 145, the plunger 145 is repeatedly connected. It is more preferable because the frictional resistance can be reduced to reduce abrasion at their connection parts and at the same time reduce noise due to friction.

In addition, the loading and unloading picker driving means 170, as shown in Fig. 11, pressurized to simultaneously press the even-numbered elevating rods 144 and the odd-numbered elevating rods 144 on the top of the elevating rods 144 The first and second pressing members 171 and 172 dividedly formed so that the pieces 171a and 172a are positioned in a zigzag, and a loading and unloading block that presses any one pressing member by the driving means 160 Consisting of (173) (174), as the driving means 160 selectively presses the loading and unloading blocks 173 and 174, the loading and unloading pickers 155 and 156 It is designed to grip or ungrip 200 at the same time.

The first and second pressing members 171 and 172 have pressing pieces 171a and 172a arranged to face each other in a zigzag arrangement, so that they are installed in a meshed state, and each of the pressing pieces 171a and 172a The elevating rod 144 is positioned directly below it.

In addition, a plurality of pressing members 147 that simultaneously press the pull-out latches 112 formed on both sides of the plurality of test sockets 111 are installed on both sides of the support block 151, so that the test-completed module IC 200 is gripped. Before the unit 150 grips and withdraws, the pressing member 147 first simultaneously presses the withdrawal latches 112 of each of the test sockets 111.

This is for unloading the module IC 200 more smoothly by releasing the state pressed into the test socket 111 before the module IC 200 that has been tested is pulled out from the test socket 111.

The first and second pressing members 171 and 172 are respectively installed so that a plurality of rollers 175 are exposed upward, so that the loading block 173 or the unloading block 174 is pressed by the driving means 160 The lifting rods 144 alternately positioned according to the above are designed to descend at the same time, which reduces frictional resistance when the loading block 173 or the unloading block 174 is repeatedly connected to the roller 175 as described above. This is to reduce abrasion at their connection parts and at the same time reduce noise due to friction.

The driving means 160 is installed to pass through the chamber 100 on the upper plate 121, and the loading and unloading pressure rods 161 to which the loading block 173 and the unloading block 174 are fixed at the bottom, respectively. ) 162, and two second actuators 163 for selectively raising and lowering the loading and unloading pressure rods 161 and 162.

A pressing member pressing rod 176 is installed on the upper plate 121, and a pressing block 177 that presses the pressing member 147 is fixed at the lower end of the pressing member pressing rod 176.

At this time, the pressing member fixing piece 148 is fixed on the upper portion of the pressing member 147, and the pressing member fixing piece 148 is a third insert formed in the support block 151 by a plurality of guide pins 149 It is inserted into the ball (151a) is elastically installed by the fourth elastic member (131).

This is to ensure that when the pressing member 147 is pressed by the driving means 160 and presses the withdrawal latch 112 of the test socket 111, it is always pressed with an appropriate pressure.

In the present invention, it is understandable that the first and second actuators 130 and 163 may apply hydraulic or pneumatic cylinders, step motors, servo motors, or the like as necessary.

The operation of the present invention will be described as follows.

First, as the loading buffer (not shown) containing the plurality of module ICs 200 to be tested is moved to the inside of the chamber 100 with the retractable shutter 101 open, the loading picker 155 is moved from the loading buffer. A plurality of module ICs 200 are gripped and loaded into the test socket 111. At this time, it is assumed that the module IC 200 is inserted into the plurality of test sockets 111 as shown in FIG. 13A to perform a performance test. I will explain.

When the control means detects that the loading buffer containing the plurality of module ICs 200 reaches the loading position in the chamber 100 due to the opening of the retractable shutter 101, the actuator (not shown) by the control unit (not shown) ) Presses the upper plate 121 downward, and accordingly, the upper plate 121 and the lower plate 122 fixed by the guide rod 123 and the movable plate 140 descend together, so the gripper unit (150) will also descend.

When the loading buffer 155 is brought into the interior of the chamber 100, the rail (not shown) to which the loading buffer is moved is located above the test socket 111 and is inserted into the test socket 111 for testing. It does not cause mutual interference with the module IC 200 that implements.

As described above, when the second actuator 163 of the driving means 160 is driven when the gripper unit 150 descends, and the loading pressure rod 161 is lowered, the loading fixed to the lower end of the loading pressure rod 161 Since the block 173 presses the first pressing member 171, the pressing piece 171a formed on the first pressing member 171 simultaneously presses the odd-numbered rows of lifting rods 144 installed in the lifting block 154. do.

When the odd rows of lifting rods 144 installed in the lifting block 154 descend at the same time, the plunger 145 fixed at the lower end of each lifting rod 144 also descends so that the inclined surface 145a of the plunger 145 becomes a slider. Since it passes between the bearings 146 installed opposite to the 159, a pair of sliders 159 expand to the left and right while compressing the first elastic member 158, and accordingly, the fingers fixed to the slider 159 142 is wider than the width of the module IC 200.

At this time, the second elastic member 143 fitted to the upper portion of the lifting rod 144 is compressed by pressing the pressing piece 171a of the first pressing member 171 and thus has a restoring force.

As described above, when the gripper unit 150 descends with the fingers 142 of the loading picker 155 open and the lower end of the finger 142 is connected to the module IC 200 in the loading buffer, the second actuator 163 As the loading pressure rod 161 rises, the pressing force of the first pressure member 171 by the loading block 173 is released.

When the gripper unit 150 is lowered, the lower end of the finger 142 is connected to the module IC 200 in the loading buffer, and even if the support block 151 is further lowered, the lifting block 154 is attached to the support block 151. ) Is fitted with a plurality of support rods 152 in which the third elastic member 153 is inserted, so that the third elastic member 153 absorbs it, so that the finger 142 is stably connected to the upper surface of the module IC 200 It will remain in a state of being.

When the pressing force by the loading block 173 from the first pressing member 171 is released, the lifting rods 144 of odd rows pressed by the pressing pieces 171a of the first pressing member 171 become a second elastic member ( Since it rises to the top dead center by the restoring force of 143, the slider 159 that was open on both sides by the plunger 145 returns to the initial position as shown in FIG. 12 by the restoring force of the first elastic member 158, and the module IC ( 200) is wrapped around both ends of the upper part and gripped.

After the loading picker 155 descends in the above-described operation and grips the module IC 200 to be tested in the loading buffer, the upper plate 121 rises to the top dead center by driving the actuator, contrary to the above. Then, the loading buffer comes out of the chamber 100 through the inlet shutter 101.

At this time, the module IC 200 gripped by the loading picker 155 of the gripper unit 150 as shown in FIG. 13A is located between the test sockets 111, and the module IC 200 is in the unloading picker 156. Is located directly above the test socket 111 in a state that is not gripped.

In this state, as described above, when the actuator is re-driven by the control unit and the upper plate 121 is lowered again, the gripper unit 150 installed on the movable plate 140 is also lowered. 2 Since the actuator 163 is driven to lower the unloading pressure rod 162, the unloading block 174 fixed at the lower end of the unloading pressure rod 162 presses the second pressure member 172. The pressing piece 172a formed on the second pressing member 172 simultaneously presses the even-numbered elevator bars 144 installed in the elevator block 154.

When the even-numbered lifting rods 144 installed in the lifting block 154 descend at the same time, the plunger 145 fixed at the lower end of each lifting rod 144 also descends so that the inclined surface 145a of the plunger 145 becomes a slider. Since it passes between the bearings 146 installed opposite to the 159, a pair of sliders 159 expand to the left and right while compressing the first elastic member 158, and accordingly, the fingers fixed to the slider 159 142 is wider than the width of the module IC 200.

As described above, the pair of fingers 142 descends in an open state, and the pressure member pressure rod 176 descends before gripping the module IC 200 in which the fingers 142 were inserted into the test socket 111. Thus, the pressing block 177 fixed at the lower end of the pressing member pressing rod 176 presses the pressing member fixing piece 148 fixed to the pressing member 147 so that it can be rotated at both ends of the test socket 111. The installed withdrawal latch 112 is pressed, and accordingly, the inserted state of the module IC 200 that has been tested in the test socket 111 is released.

After the bottom surface of the finger 142 is connected to the upper surface of the module IC 200 as shown in FIG. 13B in a state in which the module IC 200 is inserted from the test socket 111 is released, the unloading pressure rod as described above. Since 162 is raised to release the pressurized state of the second pressing member 172, a pair of sliders 159 are retracted inward to each other, and a pair of fingers 142 is used to remove the tested module IC 200. You will be gripping.

Thereafter, when the upper plate 121 rises to the top dead center due to the re-drive of the actuator, the tested module IC 200 gripped on the unloading picker 156 rises as shown in FIG. 13C and is the same as the loading picker 155. It is located on the horizon.

The module IC 200 tested by the above operation is gripped by the unloading picker 156 and pulled out of the test socket 111, and the first actuator 130 is driven to move the movable plate 140 by one step. When the movable plate 140 moves along the linear motion 141 in the direction of the arrow in FIG. 13D, the module IC 200 to be tested gripped by the loading picker 155 is directly above the test socket 111 Will be located in.

Accordingly, the module IC 200 gripped by the loading picker 155 in the above-described operation is inserted into the test socket 111 as shown in FIG. 13E and then rises to the top dead center and the withdrawal shutter 102 is opened. Through this, the module IC 200, which has been tested, is unloaded into the unloading buffer introduced into the chamber 100, so that the module IC 200 can be selected for good and defective products according to the test result.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but those of ordinary skill in the art to which the present invention pertains will be able to understand that it can be implemented in other specific forms without changing the technical idea or essential features. will be.

Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects, and the scope of the present invention described in the detailed description is indicated by the claims to be described later, and the meaning of the claims and It should be construed that all changes or modifications derived from the scope and equivalent concepts are included in the scope of the present invention.

100: chamber 101: inlet shutter
102: withdrawal shutter 111: test socket
112: withdrawal latch 121: upper plate
122: lower plate 123: guide rod
130: first actuator 140: movable plate
141: linear motion 142: finger
144: lifting rod 145: plunger
147: pressing member 148: pressing member fixing piece
150: gripper unit 151: support block
152: support bar 154: elevating block
155: loading picker 156: unloading picker
159: slider 160: driving means
161: loading pressure rod 162: unloading pressure rod
163: second actuator 170: loading and unloading picker driving means
171: first pressing member 172: second pressing member
173: loading block 174: unloading block
176: pressure member pressure rod 177: pressure block
200: module IC

Claims (10)

A plurality of test sockets 111 installed to be electrically connected to the upper part of the tester 110, and each of the test sockets 111 are accommodated, and inlet shutters 101 and withdrawal shutters 102 are installed to be openable and closed on both sides. The upper and lower chambers 100 that maintain a temperature suitable for the test conditions of the module IC 200, and the upper and lower portions of the plurality of guide rods 123 installed to penetrate the upper and lower portions of the chamber 100, respectively. Plates 121, 122, and a movable plate 140 installed to be transferred to the bottom of the lower plate 122 by an installation interval of the test socket 111 along a linear motion 141, and the movable plate 140 The gripper unit 150 is installed on the lower plate 122 in which the long hole 122a is formed in the same direction as the moving direction of the unit 150 to handle the module IC 200, and the gripper unit 150 is installed on the upper plate 121 to handle the module IC 200. In-chamber module IC gripping device, characterized in that consisting of a driving means (160) for driving.
The method according to claim 1,
A plurality of test sockets 111 are arranged in two or more rows on the upper portion of the tester 110, and the lower plate 122 has a gripper unit 150 in the same manner as the row of the test sockets 111 installed in the tester 110. In-chamber module IC gripping device, characterized in that installed to be able to rise and fall.
The method according to claim 1 or 2,
The gripper unit 150,
A support block 151 installed on the movable plate 140,
A plurality of lifting blocks 154 that are elastically installed on both sides of the support block 151 with support rods 152 fitted with third elastic members 153 to move up and down,
It is installed in each of the lifting blocks 154, the odd-numbered rows grip the module IC 200 to be tested in the loading buffer and put them into the test socket 111, and the even-numbered rows are the module ICs tested in the test socket 111 ( Loading and unloading pickers 155 and 156 for gripping 200 and unloading into the unloading buffer,
A plurality of loading pickers 155 or unloading pickers by horizontally moving the movable plate 140 installed on the lower plate 122 to be movable along the linear motion 141 by one pitch by the installation interval of the test socket 111 A first actuator 130 that positions 156 in each of the test sockets 111 directly underneath the test socket 111,
It is installed on the upper part of the lifting block 154, characterized in that consisting of a loading and unloading picker driving means 170 for selectively raising and lowering the loading pickers 155 of odd rows or the unloading pickers 156 of even rows Module IC gripping device in the chamber.
The method of claim 3,
The loading and unloading pickers 155 and 156,
A pair of sliders 159 elastically installed by a first elastic member 158 so as to simultaneously open or close along the LM guide 157 on both sides of each of the lifting blocks 154,
Fingers 142 fixed to each of the sliders 159 to surround and grip both upper ends of the module IC 200,
A plurality of lifting rods 144 elastically installed in the center of the support block 151 by a second elastic member 143 to enable lifting and descending,
In-chamber module IC gripping device, characterized in that consisting of a wedge-shaped plunger (145) provided at the lower end of each of the lifting bars (144) to operate the slider (159).
The method of claim 3,
The loading and unloading picker driving means 170,
The first and second pressing members ( 171)(172) and,
Consisting of loading and unloading blocks 173 and 174 that press any one pressing member by the driving means 160, the driving means 160 selectively selects the loading and unloading blocks 173 and 174. A module IC gripping device in a chamber, characterized in that the loading and unloading pickers 155 and 156 grip or ungrip the plurality of module ICs 200 at the same time according to the pressing.
The method of claim 4,
In-chamber module IC gripping device, characterized in that bearings 146 are respectively installed to face the pair of sliders 159 so that the bearings 146 are connected to the inclined surface 145a of the plunger 145.
The method of claim 3,
A plurality of pressing members 147 that simultaneously press the pull-out latches 112 formed on both sides of the plurality of test sockets 111 on both sides of the support block 151 are resilient with the fourth elastic member 131 to enable lifting and descending. In the chamber, characterized in that the pressing member 147 simultaneously presses the withdrawal latches 112 of each test socket 111 before the gripper unit 150 grips and withdraws the installed and tested module IC 200 Module IC gripping device.
The method of claim 5,
A plurality of rollers 175 are respectively installed on the first and second pressing members 171 and 172 so as to be exposed upwards, so that the plurality of rollers 175 are alternately positioned as the plurality of rollers 175 are simultaneously pressed by the driving means 160 In-chamber module IC gripping device, characterized in that the lifting rod 144 descends simultaneously.
The method according to claim 1,
The driving means 160,
The loading and unloading pressure rods 161 and 162 are installed in the upper plate 121 so as to pass through the chamber 100 so that the loading block 173 and the unloading block 174 are fixed at the bottom, respectively,
In-chamber module IC gripping device, characterized in that consisting of two second actuators (163) for selectively raising and lowering the loading and unloading pressure rods (161 and 162).
The method of claim 9,
A chamber, characterized in that a pressurizing member pressurizing rod 176 is installed on the upper plate 121 and a pressurizing block 177 that presses the pressurizing member 147 is fixed to the lower end of the pressurizing member pressurizing rod 176 My module IC gripping device.

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