KR20210022611A - Touch window and display with the same - Google Patents

Abstract

A touch window with the improved reliability according to an embodiment of the present invention comprises: a substrate; a first sensing electrode pattern disposed on the substrate and extending in a first direction; a sensing electrode contacting an intersection of the first sensing electrode pattern and including a second sensing electrode pattern extending in a second direction intersecting the first direction; a wiring pad unit of one end connected to at least one sensing electrode pattern of the first sensing electrode pattern and the second sensing electrode pattern; and a wiring including an electrode pad of the other end connected to a printed circuit board. At least one of the first sensing electrode pattern and the second sensing electrode pattern connected to the wiring pad unit includes a first portion between the wiring pad unit and the intersection closest to the wiring pad unit and a second portion other than the first portion. The first portion includes a second sensing unit in direct contact with the wiring pad unit and a first sensing unit electrically connected to the wiring pad unit through the second sensing unit. A width of the second sensing unit extending in a length direction of the wiring pad unit at a position of the second sensing unit in direct contact with the wiring pad unit is greater than a width of the first portion and a width of the second portion.

Description

Touch window and display device including the same {TOUCH WINDOW AND DISPLAY WITH THE SAME}

The present disclosure relates to a touch window and a display device including the same.

Recently, in various electronic products, a touch panel for inputting an image displayed on a display device by contacting an input device such as a finger or a stylus has been applied.

The touch panel may be typically divided into a resistive type touch panel and a capacitive type touch panel. When a pressure is applied to an input device, a resistive touch panel detects a change in resistance according to a connection between electrodes, and a position is detected. The capacitive touch panel detects a change in capacitance between electrodes when a finger touches it and detects a position. In view of the convenience and sensing power of the manufacturing method, the capacitive method has recently attracted attention in small models.

On the other hand, the sensing electrode of the touch panel is electrically connected to the wiring, and this wiring is connected to an external circuit, thereby enabling driving. At this time, there is a problem that disconnection may occur due to a change in design or a change in density between the sensing electrode and the wiring. In addition, there is a problem in that characteristics are deteriorated because the wiring cannot be electrically connected smoothly due to cracks in the sensing electrode.

The embodiment is to provide a touch window with improved reliability.

The touch window according to the embodiment includes: a substrate; A first sensing electrode pattern disposed on the substrate and extending in a first direction; And a second sensing electrode pattern that is in contact with an intersection of the first sensing electrode pattern and extends in a second direction crossing the first direction. And a wiring pad part at one end connected to at least one of the first sensing electrode pattern and the second sensing electrode pattern. And a wiring including an electrode pad at the other end connected to the printed circuit board, wherein at least one of the first sensing electrode pattern and the second sensing electrode pattern connected to the wiring pad unit is closest to the wiring pad unit. A first portion between the crossing point and the wiring pad portion; And a second detection unit including a second portion excluding the first portion, wherein the first portion directly contacts the wiring pad portion; And a first sensing unit electrically connected to the wiring pad unit through the second sensing unit, and the second sensing unit extending in a length direction of the wiring pad unit at a position of the second sensing unit in direct contact with the wiring pad unit. The width of the sensing unit is greater than the width of the first part and the width of the second part.

The touch window according to the embodiment may sufficiently secure an area in which the sensing electrode contacts the wiring. Accordingly, electrical characteristics of the touch window may be improved by preventing disconnection between the sensing electrode and the wiring. In addition, even if a sensing electrode crack or disconnection occurs, it may be electrically connected to the wiring, thereby improving reliability.

In particular, when the sensing electrode is formed in a mesh shape, the risk of disconnection at the bottleneck between the sensing electrode and the wiring is high, and is susceptible to damage by static electricity (ESD). Accordingly, it is possible to prevent a sudden increase in resistance due to static electricity generation, physical damage, and bending damage between the sensing electrode and the wiring. In other words, it is possible to compensate for the concentrated resistance of a portion that passes from the large-area wiring pad portion to the small-area mesh pattern.

1 is a schematic plan view of a touch window according to an embodiment
2 is a plan view of a touch window according to an embodiment.
3 is an enlarged view showing an enlarged view of A of FIG. 2.
4 is an enlarged view of a touch window according to another exemplary embodiment.
5 is an enlarged view of a touch window according to another exemplary embodiment.
6 is a cross-sectional view illustrating a cross section taken along line I-I' of FIG. 5.
7 is a cross-sectional view of a touch window according to another exemplary embodiment.
8 is an enlarged view of a touch window according to another exemplary embodiment.
FIG. 9 is a cross-sectional view taken along line II-II' of FIG. 8.
10 is an enlarged view of a touch window according to another exemplary embodiment.
FIG. 11 is a cross-sectional view illustrating a cross section taken along line III-III' of FIG. 10.
12 is an enlarged view of a touch window according to another embodiment.
13 is a cross-sectional view illustrating a cross section taken along line IV-IV' of FIG. 12.
14 is an enlarged view of a touch window according to another embodiment.
FIG. 15 is a cross-sectional view illustrating a cross section taken along V-V' of FIG. 14.
16 is an enlarged view of a touch window according to another embodiment.
17 is a cross-sectional view illustrating a display device in which a touch window is disposed on a display panel according to an exemplary embodiment.

In the description of the embodiments, each layer (film), region, pattern, or structure is “on” or “under/under” the substrate, each layer (film), region, pad, or patterns. The description that "is formed in" includes all that are formed directly or through another layer. The standards for the top/top or bottom/bottom of each layer will be described based on the drawings.

In the drawings, the thickness or size of each layer (film), region, pattern, or structure may be modified for clarity and convenience of description, and thus the actual size is not entirely reflected.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, a touch window according to an embodiment will be described in detail with reference to FIGS. 1 to 3. 1 is a schematic plan view of a touch window according to an embodiment. 2 is a plan view of a touch window according to an embodiment. 3 is an enlarged view showing an enlarged view of A of FIG. 2.

1 to 3, the touch window 10 according to the embodiment is arranged around an effective area AA for detecting the position of an input device (eg, a finger, etc.) and the effective area AA. And a substrate 100 on which an invalid area UA is defined.

Here, the sensing electrode 200 may be formed in the effective area AA and the non-effective area UA to detect the input device. In addition, a wiring 300 electrically connecting the sensing electrode 200 may be formed in the non-effective area UA. In addition, an external circuit connected to the wiring 300 may be located in the non-effective area UA.

When an input device such as a finger comes into contact with such a touch window, a difference in capacitance occurs at a portion where the input device is in contact, and a portion where the difference occurs may be detected as a contact position.

This touch window will be described in more detail as follows.

The substrate 100 may be formed of a glass substrate, a polyethylene terephthalate (PET) film, or a plastic substrate including a resin. However, the embodiment is not limited thereto, and various materials on which the sensing electrode 200 and the wiring 300 may be formed may be included.

An outer dummy layer is formed in the non-effective area UA of the substrate 100. The outer dummy layer may be formed by coating a material having a predetermined color so that the wiring 300 and a printed circuit board connecting the wiring 300 to an external circuit are not visible from the outside. The outer dummy layer may have a color suitable for a desired appearance, and for example, may include black pigment and the like to exhibit black. In addition, a desired logo or the like can be formed on the outer dummy layer in various ways. Such an outer dummy layer may be formed by deposition, printing, wet coating, or the like.

A sensing electrode 200 may be formed on the substrate 100. The sensing electrode 200 may detect whether an input device such as a finger is in contact. In FIG. 2, the sensing electrode 200 is shown to extend on the substrate in the second direction, but the embodiment is not limited thereto. Accordingly, the sensing electrode 200 may extend in a first direction crossing the second direction. In addition, the sensing electrode 200 may include two types of sensing electrodes 200 having a shape extending in a first direction and a shape extending in a second direction.

Meanwhile, the sensing electrode 200 may be arranged in a mesh shape. In this case, the mesh shape may be formed randomly so as to prevent the moire phenomenon. The moire phenomenon is a pattern created by overlapping periodic stripes. As neighboring stripes overlap, the thickness of the stripes becomes thicker, making them stand out compared to other stripes. Therefore, in order to prevent such a moire phenomenon, the mesh shape may be variously arranged.

Specifically, the sensing electrode 200 includes a conductive pattern opening OA and a conductive pattern line part LA. In this case, the line width of the conductive pattern line part LA may be 0.1 µm to 10 µm. The conductive pattern line portion LA having a line width of 0.1 μm or less may not be possible due to a manufacturing process. When the line width is 10 μm or less, the pattern of the sensing electrode 200 may be made invisible. Preferably, the line width of the conductive pattern line part LA may be 1 µm to 5 µm.

Meanwhile, as shown in FIG. 3, the conductive pattern opening OA may have a rectangular shape. However, the embodiment is not limited thereto, and the conductive pattern opening OA may have various shapes such as a diamond shape, a pentagonal shape, a hexagonal polygonal shape, or a circular shape.

Since the sensing electrode 200 has a mesh shape, the pattern of the sensing electrode 200 may not be seen on the effective area AA. That is, even if the sensing electrode 200 is formed of metal, the pattern may not be seen. In addition, even when the sensing electrode 200 is applied to a large-sized touch window, the resistance of the touch window can be reduced. In addition, when the sensing electrode 200 is formed by a printing process, a high-quality touch window can be secured by improving print quality.

Referring to FIG. 3, the sensing electrode 200 includes a first sensing unit 210 and a second sensing unit 220.

The first sensing unit 210 may be a sensing electrode 200 disposed on the effective area AA.

The second sensing unit 220 may be a sensing electrode 200 disposed on the ineffective area UA. The second sensing unit 220 may be disposed between the first sensing unit 210 and the wiring 300. The second sensing unit 220 may electrically connect the first sensing unit 210 and the wiring 300. The second sensing unit 220 may directly contact the wiring pad unit 310.

The conductive pattern of the first sensing unit 210 and the conductive pattern of the second sensing unit 220 may have different shapes.

The line width W1 of the conductive pattern of the first sensing unit 210 and the line width W2 of the conductive pattern of the second sensing unit 220 are different from each other. Specifically, the line width W2 of the conductive pattern of the second sensing unit 220 may be thicker than the line width W1 of the conductive pattern of the first sensing unit 210.

In addition, a pitch P1 between conductive patterns of the first sensing unit 210 may be different from a gap P2 between conductive patterns of the second sensing unit 220. Specifically, the gap P2 between the conductive patterns of the second detection unit 220 may be narrower than the gap P1 between the conductive patterns of the first detection unit 210.

The line width W2 of the conductive pattern of the second sensing unit 220 is larger than the line width W1 of the conductive pattern of the first sensing unit 210, and the gap between the conductive patterns of the first sensing unit 210 It may be less than 1/2 of (P1). When the line width W2 of the conductive pattern of the second sensing unit 220 is greater than 1/2 of the distance P1 between the conductive patterns of the first sensing unit 210, the second sensing unit 220 ), electrical short may occur due to contact with each other.

Through this, an area in which the sensing electrode 200 contacts the wiring 300 may be sufficiently secured. That is, a contact area between the sensing electrode 200 and the wiring pad part 310 may be improved. Accordingly, electrical characteristics of the touch window may be improved by preventing disconnection between the sensing electrode 200 and the wiring 300. In addition, even if a crack or disconnection of the sensing electrode 200 occurs, it may be electrically connected to the wiring 300 through the second sensing unit 220, thereby improving reliability.

In particular, when the sensing electrode 200 is formed in a mesh shape, the risk of disconnection at the bottleneck between the sensing electrode 200 and the wiring 300 is high, and is susceptible to damage by static electricity (ESD). This can be improved through the second detection unit 220. Accordingly, through the second sensing unit 220, it is possible to prevent a sudden increase in resistance due to static electricity generation, physical damage, and bending damage between the sensing electrode 200 and the wiring 300. That is, it is possible to compensate for the concentrated resistance of a portion of the large-area wiring pad part 310 to a small-area mesh pattern.

A wiring 300 electrically connecting the sensing electrode 200 may be formed in the ineffective area UA. The wiring 300 may be made of a metal having excellent electrical conductivity. For example, the wiring 300 may be formed of chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), and alloys thereof. In particular, the wiring 300 may include various metal paste materials that can be formed through a printing process.

A wiring pad part 310 may be disposed between the wiring 300 and the sensing electrode 200. The wiring pad part 310 may apply an electrical signal by bundling a plurality of conductive patterns with the sensing electrode 200 as a unit.

An electrode pad 400 is positioned at an end of the wiring 300. The electrode pad 400 may be connected to a printed circuit board. Specifically, although not shown in the drawings, a connection terminal is located on one surface of the printed circuit board, and the electrode pad 400 may be connected to the connection terminal. The electrode pad 400 may have a size corresponding to the connection terminal.

As the printed circuit board, various types of printed circuit boards may be applied. For example, a flexible printed circuit board (FPCB) may be applied.

Hereinafter, touch windows according to other embodiments will be described with reference to FIGS. 4 to 16. For clarity and brief description, detailed descriptions of parts that are the same or similar to those described above are omitted. 4 is an enlarged view of a touch window according to another exemplary embodiment. 5 is an enlarged view of a touch window according to another exemplary embodiment. 6 is a cross-sectional view illustrating a cross-section taken along line Ⅰ-Ⅰ' of FIG. 5. 7 is a cross-sectional view of a touch window according to another exemplary embodiment. 8 is an enlarged view of a touch window according to another exemplary embodiment. 9 is a cross-sectional view taken along line II-II' of FIG. 8. 10 is an enlarged view of a touch window according to another exemplary embodiment. 11 is a cross-sectional view illustrating a cross section taken along line III-III' of FIG. 10. 12 is an enlarged view of a touch window according to another embodiment. FIG. 13 is a cross-sectional view taken along line IV-IV' of FIG. 12. 14 is an enlarged view of a touch window according to another embodiment. FIG. 15 is a cross-sectional view taken along line V-V' of FIG. 14. 16 is an enlarged view of a touch window according to another embodiment.

First, referring to FIG. 4, the line widths W2 and W2 ′ of the conductive pattern of the second sensing unit 220 are thicker than the line width W1 of the conductive pattern of the first sensing unit 210. In this case, the line widths W2 and W2 ′ of the conductive pattern of the second sensing unit 220 may be different depending on the location. Specifically, the line widths W2 and W2 ′ of the conductive pattern of the second sensing unit 220 may increase gradually as they become closer to the wiring 300. That is, the line widths W2 and W2 ′ of the conductive pattern of the second sensing unit 220 may be widest at a point in contact with the wiring pad unit 310.

In addition, the spacing P1 between the conductive patterns of the first sensing unit 210 may be different from the spacing P2 and P2 ′ between the conductive patterns of the second sensing unit 220. Specifically, the gaps P2 and P2 ′ between the conductive patterns of the second sensing unit 220 may be gradually narrowed as they become closer to the wiring pad unit 310.

Subsequently, referring to FIGS. 5 and 6, the thickness T2 of the conductive pattern of the second sensing unit 220 may be different from the thickness T1 of the conductive pattern of the first sensing unit 210. The thickness T2 of the conductive pattern of the second sensing unit 220 may be thicker than the thickness T1 of the conductive pattern of the first sensing unit 210.

Meanwhile, referring to FIG. 7, the thicknesses T2 and T2 ′ of the conductive patterns of the second sensing unit 220 may increase as they become closer to the wiring. That is, the thicknesses T2 and T2 ′ of the conductive pattern of the second sensing unit 220 may be the thickest at a point in contact with the wiring pad unit 310.

8 and 9, the sensing electrode 200 may include a first sub-pattern 211, a second sub-pattern 212, and electrode layers 222 and 223.

The first sub-pattern 211 is disposed on the substrate 100. The first sub-pattern 211 is disposed on the conductive pattern line part LA. Accordingly, the first sub-pattern 211 is arranged in a mesh shape. The first sub-pattern 211 may be embossed. However, the embodiment is not limited thereto, and the first sub-pattern 211 may be intaglio.

The second sub-pattern 212 is disposed on the substrate 100. The second sub-pattern 212 is disposed in the conductive pattern opening OA. Accordingly, the second sub-pattern 212 may be disposed between the first sub-patterns 211. The second sub-pattern 212 may be embossed. However, the embodiment is not limited thereto, and the second sub-pattern 212 may be intaglio.

The first sub-pattern 211 and the second sub-pattern 212 may include resin or polymer.

The electrode layer 222 is disposed on the first sub-pattern 211. When the first sub-pattern 211 is intaglio, the electrode layer 222 may be disposed in the intaglio. Accordingly, the electrode layer 222 is disposed on the conductive pattern line portion LA, and the electrode layer 222 is disposed in a mesh shape. The electrode layer 222 may include various metals having excellent electrical conductivity. For example, the electrode layer 222 may include Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof.

The electrode layer 222 may be formed through etching after forming an electrode material on the first sub-pattern 211 and the second sub-pattern 212. In this case, a difference in etching area occurs according to a difference in a bonding area between the structure of the first sub-pattern 211 and the second sub-pattern 212 and the electrode material. That is, since the bonding area between the first sub-pattern 211 and the electrode material is larger than the bonding area between the second sub-pattern 212 and the electrode material, it is formed on the first sub-pattern 211 Less etching of the electrode material to be generated occurs. That is, according to the same etching rate, the electrode material formed on the first sub-pattern 211 remains, and the electrode material formed on the second sub-pattern 212 is etched and removed. Accordingly, the electrode layer 222 may be formed only on the first sub-pattern 211, and the electrode layer 222 may be disposed in a mesh shape.

Meanwhile, the sensing electrode 200 may be defined as a first region 1A and a second region 2A. The first area 1A corresponds to the effective area AA.

The second area 2A is an area disposed adjacent to the wiring pad part 310 than the first area 1A. The second area 2A may be disposed in the ineffective area UA.

The number of the second sub-patterns 212 ′ disposed in the second region 2A may be different from the number of the second sub-patterns 212 ′ disposed in the first region 1A. Specifically, the number of second sub-patterns 212 ′ disposed in the second region 2A may be greater than the number of second sub-patterns 212 ′ disposed in the first region 1A.

The distance D2 between the second sub-patterns 212 ′ disposed in the second region 2A is closer than the distance D1 between the second sub-patterns 212 ′ disposed in the first region 1A. I can.

Accordingly, when etching after deposition of the electrode material, the etching of the electrode material disposed on the second sub-pattern 212 ′ of the second region 2A is performed by the second sub-pattern 212 of the first region 1A. It may occur less than the etching of the electrode material disposed thereon. Accordingly, the electrode layer 223 remaining without being etched may be formed on the second sub-pattern 212 ′ of the second region 2A. Accordingly, the area of the electrode layer 223 may increase in the second region 2A.

Meanwhile, referring to FIGS. 10 and 11, contrary to FIGS. 8 and 9 described above, the number of second sub-patterns 212 ′ disposed in the second region 2A is in the first region 1A. It may be less than the number of the second sub-patterns 212 disposed.

The distance D2 between the second sub-patterns 212 ′ disposed in the second region 2A is greater than the distance D1 between the second sub-patterns 212 ′ disposed in the first region 1A. I can.

Accordingly, when etching after deposition of the electrode material, the etching of the electrode material disposed on the second sub-pattern 212 ′ of the second region 2A is performed by the second sub-pattern 212 of the first region 1A. It may occur less than the etching of the electrode material disposed thereon. Accordingly, the electrode layer 223 remaining without being etched on the second sub-pattern 212 ′ of the second region 2A and the substrate 100 may be formed. Accordingly, the area of the electrode layer 223 may increase in the second region 2A.

12 and 13, the second sub-pattern may not be disposed in the second area 2A. Accordingly, after the electrode layer 223 is directly deposited on the substrate 100 of the second region 2A, less etching may occur.

14 and 15, the height H2 of the first sub-pattern 211 ′ disposed in the second region 2A is that of the first sub-pattern 211 ′ disposed in the first region 1A. It may be lower than the height H1. Specifically, the height H2 of the first sub-pattern 211 ′ disposed in the second region 2A may decrease as it approaches the wiring pad part 310. Accordingly, the electrode layer 223 disposed on the first sub-patterns 211 and 211 ′ may become thicker as it approaches the wiring pad part 310.

Referring to FIG. 16, the first sensing unit 210 may have a diamond shape. That is, the first sensing unit 210 may have a diamond shape rather than a mesh shape.

A connection part 215 may be disposed between the first sensing parts 210. The connection part 215 may connect the first detection parts 210. The connection part 215 may be integrally formed with the first sensing part 210.

In this case, the line widths W2 and W2' of the second sensing unit 220 in contact with the wiring pad unit 310 may be wider as it approaches the wiring 300. In addition, line widths W2 and W2 ′ of the second detection unit 220 may be wider than the connection unit 215. In this case, the line widths W2 and W2' of the second sensing unit 220 may be different depending on the location. Specifically, the line widths W2 and W2 ′ of the second sensing unit 220 may increase gradually as they become closer to the wiring 300. That is, the line widths W2 and W2 ′ of the second sensing unit 220 may be widest at a point in contact with the wiring pad unit 310.

In addition, the interval P1 between the connection portions 215 may be different from the intervals P2 and P2' of the second sensing unit 220. Specifically, the gaps P2 and P2 ′ between the second sensing units 220 may be gradually narrowed as they become closer to the wiring pad unit 310.

Meanwhile, in FIG. 16, the first sensing unit 210 is shown to extend in the second direction, but the embodiment is not limited thereto. Accordingly, a diamond-shaped sensing unit extending in a first direction crossing the second direction may be further disposed on the substrate 100. Meanwhile, referring to FIG. 17, such a touch window 10 may be disposed on the display panel 20 that is a driver. The touch window 10 and the display panel 20 are bonded together to form a display device.

The display panel 20 has a display area for outputting an image. A display panel applied to such a display device may generally include an upper substrate 21 and a lower substrate 22. A data line, a gate line, and a thin film transistor (TFT) may be formed on the lower substrate 22. The upper substrate 21 may be bonded to the lower substrate 22 to protect components disposed on the lower substrate 22.

The display panel 20 may be formed in various shapes depending on what kind of display device the display device according to the present invention is. That is, the display device according to the present invention includes a liquid crystal display (LCD), a field emission display, a plasma display (PDP), an organic light-emitting display (OLED), and an electrophoretic display (EPD). Accordingly, the display panel 20 may be configured in various forms.

Features, structures, effects, and the like described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention pertains are illustrated above within the scope not departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications that have not been made are possible. For example, each component specifically shown in the embodiments can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (1)

Board;
A first sensing electrode pattern disposed on the substrate and extending in a first direction; And a second sensing electrode pattern that contacts an intersection of the first sensing electrode pattern and extends in a second direction crossing the first direction. And
A wiring pad part at one end connected to at least one of the first sensing electrode pattern and the second sensing electrode pattern; And a wiring including an electrode pad at the other end connected to the printed circuit board,
At least one of the first sensing electrode pattern and the second sensing electrode pattern connected to the wiring pad portion may include a first portion between the wiring pad portion and the intersection point closest to the wiring pad portion; And a second portion excluding the first portion,
The first part may include a second sensing unit in direct contact with the wiring pad unit; And a first sensing unit electrically connected to the wiring pad unit through the second sensing unit,
A touch window having a width of the second sensing unit extending in the length direction of the wiring pad unit at a position of the second sensing unit in direct contact with the wiring pad unit is greater than a width of the first portion and a width of the second portion.

Images