KR102053230B1 - Touch panel - Google Patents

Touch panel Download PDF

Info

Publication number
KR102053230B1
KR102053230B1 KR1020130089663A KR20130089663A KR102053230B1 KR 102053230 B1 KR102053230 B1 KR 102053230B1 KR 1020130089663 A KR1020130089663 A KR 1020130089663A KR 20130089663 A KR20130089663 A KR 20130089663A KR 102053230 B1 KR102053230 B1 KR 102053230B1
Authority
KR
South Korea
Prior art keywords
conductive material
electrode pattern
electrode
touch panel
deposited
Prior art date
Application number
KR1020130089663A
Other languages
Korean (ko)
Other versions
KR20150014242A (en
Inventor
조수현
최동섭
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130089663A priority Critical patent/KR102053230B1/en
Publication of KR20150014242A publication Critical patent/KR20150014242A/en
Application granted granted Critical
Publication of KR102053230B1 publication Critical patent/KR102053230B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

In one embodiment, a touch panel includes a substrate; An electrode part formed on the substrate, wherein the electrode part comprises a resin layer including an electrode pattern; And a conductive material deposited in the electrode pattern, wherein the conductive material is deposited at a height lower than the height of the electrode pattern.

Description

Touch panel {TOUCH PANEL}

An embodiment relates to a touch panel.

Recently, various electronic products have been applied to a touch panel for inputting a method of contacting an input device such as a finger or a stylus to an image displayed on a display device.

The touch panel may be typically classified into a resistive touch panel and a capacitive touch panel. The resistive touch panel detects a change in resistance according to a connection between electrodes when a pressure is applied to an input device, thereby detecting a position. The capacitive touch panel detects a change in capacitance between electrodes when a finger touches and detects a position thereof. In view of the convenience of the manufacturing method, the sensing force and the like, in the small model, the capacitive method has recently attracted attention.

Indium tin oxide (ITO), which is most widely used as a transparent electrode of such a touch panel, is expensive, and is physically easily hit by bending and bending of the substrate, thereby deteriorating the characteristics of the electrode. flexible) There is a problem that it is not suitable for the device. In addition, when applied to a large size touch panel, a problem due to high resistance occurs.

Accordingly, in recent years, research into a method of forming a transparent electrode using another metal conductive material instead of indium tin oxide has been actively conducted.

However, there is a problem that the reliability of the touch panel is lowered due to the limitation of the fine line width and the high resistance when forming the transparent electrode. Accordingly, there is a need for a touch panel having a new structure.

Embodiments provide a touch panel having a new structure having a small line width and low resistance.

In one embodiment, a touch panel includes a substrate; An electrode part formed on the substrate, wherein the electrode part comprises a resin layer including an electrode pattern; And a conductive material deposited in the electrode pattern, wherein the conductive material is deposited at a height lower than the height of the electrode pattern.

Since the touch panel according to the embodiment forms a fine electrode pattern on the substrate and then fills the conductive material in the electrode pattern by sputtering or plating, disconnection can be prevented and the bulk is not a metal paste in the electrode pattern. Since metal is deposited, the electrical resistance can be reduced.

In addition, the touch panel according to the embodiment may implement a fine line width of 1 μm or less and reduce resistance, thereby improving efficiency and reliability of an application to which the electrode member is applied.

1 is a schematic plan view of a touch panel according to an embodiment.
2 is a cross-sectional view illustrating a cross section of the touch panel according to the embodiment.
3 to 4 are cross-sectional views of touch panels of various embodiments according to shapes of electrode patterns.
5 to 8 illustrate a method of manufacturing a touch panel according to an embodiment.
9 is a cross-sectional view illustrating a display apparatus in which a touch panel is disposed on a display panel, according to an exemplary embodiment.
10 is a schematic perspective view of a mobile terminal to which a touch panel according to an embodiment is applied.

In the description of embodiments, each layer, region, pattern, or structure may be “on” or “under” the substrate, each layer, region, pad, or pattern. Substrate formed in ”includes all formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

In the drawings, the thickness or size of each layer (film), region, pattern, or structure may be modified for clarity and convenience of description, and thus do not necessarily reflect the actual size.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

A touch panel according to an embodiment will be described in detail with reference to FIGS. 1 to 8. 1 is a schematic plan view of a touch panel according to an embodiment, FIG. 2 is a cross-sectional view illustrating a cross section of a touch panel according to an embodiment, and FIGS. 3 to 4 are views of a touch panel according to various embodiments according to shapes of electrode patterns. 5 is a cross-sectional view illustrating a method of manufacturing a touch panel according to an embodiment.

Referring to FIG. 1, the touch panel 10 according to the embodiment may have an effective area AA for detecting a position of an input device (for example, a finger, etc.) and an invalid area disposed around the effective area AA. Area UA includes a substrate defined.

Here, the sensing electrode may be formed in the effective area AA so as to sense the input device. In addition, a wiring electrode for electrically connecting the sensing electrode may be formed in the ineffective area UA. In addition, an external circuit connected to the wiring electrode may be positioned in the ineffective area UA.

When an input device such as a finger is in contact with such a touch panel, a difference in capacitance occurs at a portion where the input device contacts, and a portion where such a difference occurs can be detected as a contact position.

2 to 8, the touch panel according to the embodiment will be described in detail as follows.

2 to 8, the touch panel according to the embodiment includes a substrate 100 and an electrode unit 200 formed on the substrate.

The substrate 100 may be formed of various materials capable of supporting the electrode part 200 formed on the substrate 100. The substrate 100 may include, for example, a glass substrate or a plastic substrate.

An outer dummy layer is formed in the ineffective area UA of the substrate 100. The outer dummy layer may be formed by applying a material having a predetermined color so that the wiring electrode and the printed circuit board connecting the wiring electrode to an external circuit are not visible from the outside. The outer dummy layer may have a color suitable for a desired appearance, and may include black, for example, as a black pigment. In addition, the outer dummy layer may form a desired logo and the like in various ways. The outer dummy layer may be formed by deposition, printing, wet coating, or the like.

The electrode part 200 is formed on the effective area AA of the substrate 100. In detail, the electrode unit 200 may be a sensing electrode unit capable of detecting whether an input device such as a finger is in contact. The electrode part 200 includes a resin layer 210 including an electrode pattern 220 and a conductive material 230 deposited in the electrode pattern 220.

The resin layer 210 may include a thermosetting resin. For example, the resin layer 210 may include various thermosetting resins such as UV resins.

The electrode pattern 220 is formed on the resin layer 210 at a predetermined width and interval. The electrode pattern 220 may be formed by preparing an embossed mold or an intaglio mold in a desired pattern, and then imprinting the mold on the resin layer 210.

The electrode pattern 220 may be formed to have a fine line width. In detail, the electrode pattern 220 may have a line width of about 1 μm or less. In more detail, the electrode pattern 220 may be formed with a line width of 500 nm to 1 μm.

The electrode pattern 220 may be formed in various shapes.

For example, as shown in FIG. 3, the electrode pattern 220 may be formed to be narrower from the upper surface of the resin layer 210 toward the lower surface of the electrode pattern 220. As the electrode pattern 220 is formed to be narrower toward the lower side, the conductive material 230 may be more easily deposited in the electrode pattern 220 during the sputtering or plating process.

Alternatively, as shown in FIG. 4, the electrode pattern 220 may be formed to have a curved surface. In detail, the electrode pattern 220 may be formed in a U-shape by forming a curved surface where a point where the left side and a bottom side meet, and a point where the right side and the bottom side meet.

The conductive material 230 may be filled in the electrode pattern 220. In detail, the conductive material 230 may be deposited in the electrode pattern 220.

The conductive material 230 may include a metal. For example, the conductive material 230 may include Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof. In detail, the conductive material 230 may be bulk, Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof may be directly deposited in the electrode pattern 220.

The conductive material 230 may be deposited in the electrode pattern 220 by sputtering or plating. In detail, the conductive material 230 may be deposited in direct contact with the left side, the right side, and the bottom side of the electrode pattern 220. In addition, the deposition height of the conductive material 230 deposited in the electrode pattern 220 may be lower than the height of the electrode pattern 220.

In addition, the conductive material 230 may be deposited in the same shape as that of the electrode pattern 220.

That is, as shown in FIGS. 3 and 4, the conductive material 230 may be deposited along the inner surface of the electrode pattern 220 without being completely filled in the electrode pattern 220. That is, the conductive material 230 may be deposited in contact with the left side, the right side, and the bottom side of the electrode pattern 220 according to the shape of the electrode pattern 220 in the electrode pattern 220.

Accordingly, the deposition height of the conductive material 230 deposited in the electrode pattern 220 may be lower than the height of the electrode pattern 220.

A protective layer 300 is further formed on the conductive material 230. The protective layer 300 may surround the conductive material 230 exposed to the outside, and protect the conductive material 230 from oxidation or external shock.

The electrode member according to the embodiment may implement a small line width, prevent disconnection of the electrode, and reduce the resistance. That is, the electrode member according to the embodiment may realize a line width of about 1 μm or less. And a low resistance of about 0.5 * 10 −6 Pa · cm to about 1.0 * 10 −5 Pa · cm.

Hereinafter, a method of manufacturing an electrode member according to an exemplary embodiment will be described with reference to FIGS. 5 to 8.

Referring to FIG. 5, after the resin layer 210 is formed on the substrate 100, an electrode pattern 220 is formed on the resin layer 210. The electrode pattern 220 may be formed by various methods. For example, the electrode pattern 220 may be formed by an imprinting process. That is, according to a desired pattern, an electrode pattern 220 may be formed on the resin layer 210 by imprinting the mold on the resin layer 210 using an embossed mold or an intaglio mold.

Subsequently, referring to FIG. 6, the conductive material 230 may be deposited on the resin layer 210. In detail, the conductive material 230 may deposit a metal conductive material on the upper surface of the resin layer 210 and the inner surface of the electrode pattern.

In this case, the conductive material 230 may include Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof. In detail, the conductive material 230 may include a bulk metal. That is, bulk Cu, Au, Ag, Al, Ti, Ni, or an alloy thereof may be deposited on the resin layer 210.

The conductive material 230 may be deposited on the resin layer 210 by various methods. In detail, the conductive material 230 may be deposited on the resin layer 210 by a sputtering or plating process.

Subsequently, referring to FIG. 7, a photosensitive material 500 is coated on the resin layer 210. In this case, the photosensitive material 500 may include a photoresist. The photosensitive material 500 may be applied and filled in the electrode pattern 220 of the resin layer 210.

That is, the photosensitive material 500 may be in direct contact with the conductive material 230 deposited in the electrode pattern 220 and filled in the electrode pattern 220.

Subsequently, regions other than the partial region to which the photosensitive material 500 is applied may be etched through an etching process. Accordingly, the conductive material 230 positioned in a region other than the electrode pattern 220 where the photosensitive material 500 is positioned on the resin layer 210 may be etched.

In FIG. 7, only a method of using a photoresist is disclosed. However, embodiments are not limited thereto, and a mask may be formed on the resin layer 210 to form a conductive material in a region other than the electrode pattern 220. Of course, it is possible to etch 230).

Subsequently, referring to FIG. 8, a portion of the conductive material 230 and the photosensitive material 500 remain in the electrode pattern 220 by the etching process, and the photosensitive material 500 may be cleaned by a cleaning process. To be removed, only the conductive material 230 may be left in the electrode pattern 220 of the resin layer 210. However, the embodiment is not limited thereto, and the photosensitive material 500 may not be removed and may be left on the conductive material 230.

Accordingly, in the touch panel according to the embodiment, the conductive material 230 may be deposited at a height lower than the height of the electrode pattern 220. That is, recesses may be formed in the electrode part 200 at regular intervals according to the height difference between the electrode pattern and the conductive material.

Conventionally, after forming a resin layer on the substrate, forming an electrode pattern on the resin layer, applying a conductive paste on the substrate, then rolling by a bar or the like to form a conductive paste in the electrode pattern Filled.

However, when filling the inside of the electrode pattern with the conductive paste, a portion that is not partially filled may occur, so that disconnection of the electrode may occur, and a maximum width of 3.5 μm or more is required for filling. Accordingly, there was a problem that can not implement a fine line width.

In addition, since the conductive face is used, there is a problem that the resistance is higher than that of the bulk metal.

Accordingly, the touch panel according to the embodiment is formed by forming a fine electrode pattern on the substrate, and then filled in the electrode pattern by sputtering or plating, thereby preventing disconnection, and thus depositing a pure bulk metal instead of a paste. , The resistance can be reduced.

Accordingly, the touch panel according to the embodiment may implement a fine line width of 1 μm or less and reduce resistance, thereby improving efficiency and reliability of an application to which the electrode member is applied.

Meanwhile, referring to FIG. 9, the touch panel 10 according to the embodiment may be disposed on the display panel 20. The touch panel 10 and the display panel 20 may be joined to form a display device.

The display panel 20 has a display area for outputting an image. The display panel applied to such a display device may generally include an upper substrate 21 and a lower substrate 22. The lower substrate 22 may include a data line, a gate line, and a thin film transistor (TFT). The upper substrate 21 may be bonded to the lower substrate 22 to protect components disposed on the lower substrate 22.

The display panel 20 may be formed in various forms according to what kind of display apparatus the display apparatus according to the present invention is.

Referring to FIG. 10, a mobile terminal to which a touch panel according to an embodiment is applied is shown.

Referring to FIG. 10, the mobile terminal 1000 may include a valid area AA and an invalid area UA. The effective area AA may detect a touch signal by a touch of a finger or the like, and a command icon pattern part and a logo may be formed in the invalid area.

The mobile terminal 1000 includes an electrode unit included in the touch panel described above. Accordingly, the resistance of the sensing electrodes included in the mobile terminal 1000 may be reduced to improve electrical characteristics, and thus, the overall reliability of the mobile terminal 1000 may be improved.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiments, which are merely illustrative and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains are described above within the scope not departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (10)

Board;
An electrode portion disposed on the substrate; And
A protective layer disposed on the electrode portion;
The electrode unit,
A resin layer comprising an electrode pattern; And
A conductive material deposited in the electrode pattern;
The conductive material includes bulk Cu, Au, Ag, Al, Ti, Ni or alloys thereof,
The conductive material,
A first conductive material deposited on the bottom surface of the electrode pattern;
A second conductive material deposited on one side of the electrode pattern; And
A third conductive material deposited on the other side of the electrode pattern,
The height of the first conductive material, the second conductive material and the third conductive material is lower than the height of the electrode pattern,
The first conductive material, the second conductive material and the third conductive material are connected to each other,
The second conductive material and the third conductive material are spaced apart from each other,
The protective layer is in direct contact with the first conductive material, the second conductive material, the third conductive material and the resin layer,
The conductive material is deposited to a height lower than the height of the electrode pattern. delete delete The method of claim 1,
The electrode pattern is narrower as the electrode pattern extends from the upper surface of the resin layer to the electrode pattern. The method of claim 4, wherein
The electrode pattern may include a square shape or a circular shape. The method of claim 1,
The electrode part has a resistance of 0.5 * 10 -6 Pa · cm to 1.0 * 10 -5 Pa · cm. The method of claim 1,
The electrode pattern is formed in a width of 1㎛ or less. The method of claim 7, wherein
The electrode pattern is formed in a width of 500nm to 1㎛ touch panel. The method of claim 1,
The touch panel further comprises a photosensitive material formed on the conductive material The method of claim 1,
The electrode unit includes a concave portion.
KR1020130089663A 2013-07-29 2013-07-29 Touch panel KR102053230B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130089663A KR102053230B1 (en) 2013-07-29 2013-07-29 Touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130089663A KR102053230B1 (en) 2013-07-29 2013-07-29 Touch panel

Publications (2)

Publication Number Publication Date
KR20150014242A KR20150014242A (en) 2015-02-06
KR102053230B1 true KR102053230B1 (en) 2019-12-06

Family

ID=52571149

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130089663A KR102053230B1 (en) 2013-07-29 2013-07-29 Touch panel

Country Status (1)

Country Link
KR (1) KR102053230B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102326454B1 (en) * 2017-03-07 2021-11-17 삼성디스플레이 주식회사 Electronic apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110100034A (en) * 2010-03-03 2011-09-09 미래나노텍(주) Electrostatic capacity type touch panel and manufacuring method thereof
KR101728818B1 (en) * 2010-08-09 2017-04-21 미래나노텍(주) Electrostatic capacity type touch panel and manufacturing method thereof
KR20120055367A (en) * 2010-11-23 2012-05-31 삼성전기주식회사 Touch panel
KR101978666B1 (en) * 2011-06-10 2019-05-15 미래나노텍(주) Substrate for Touch Screen Sensor, Touch Screen Sensor and Touch Screen Panel

Also Published As

Publication number Publication date
KR20150014242A (en) 2015-02-06

Similar Documents

Publication Publication Date Title
US11340741B2 (en) Touch window having a sensing electrode with a variable width of a conductive line
US10091872B2 (en) Touch window and display including the same
TWI634471B (en) Touch panel and touch device with the same
KR102191575B1 (en) Touch window and display with the same
JP2014106974A (en) Touch window
KR20150103977A (en) Touch window and display with the same
KR102053238B1 (en) Touch window
US9442613B2 (en) Touch window
KR102053230B1 (en) Touch panel
KR102237797B1 (en) Touch window and display with the same
KR102237964B1 (en) Electrod members, touch window with the same and display with the same
KR102302818B1 (en) Touch window and display with the same
KR102108843B1 (en) Touch window
KR102251870B1 (en) Touch window
KR102238822B1 (en) Touch window
KR102251874B1 (en) Touch window
KR102074875B1 (en) Touch window
KR20150084542A (en) Touch window and display with the same
KR102098127B1 (en) Touch window
KR20150014375A (en) Touch window and method of the same
KR102008732B1 (en) Touch panel and method of fabricating the same
KR102085876B1 (en) Electrode member and touch panel with the same
KR102019059B1 (en) Touch window
KR102288813B1 (en) Touch window
KR102187787B1 (en) Touch window

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant