KR20210020058A - Camera Module - Google Patents

Abstract

A camera module according to the present invention comprises: a first printed circuit board on which an image sensor is mounted; a housing unit arranged on the upper side of the first printed circuit board; a holder module which is arranged to be separated from the inner bottom surface of the housing unit at a predetermined distance, has a first coil wound around the outer circumferential surface thereof, and includes at least one lens therein; a second printed circuit board coupled to the bottom surface of the holder module; a third printed circuit board installed on the upper side of the holder module; a plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; and a buffer unit which is integrally formed with the wire spring in a connection part between the wire spring and the third printed circuit board. According to the present invention, component loss due to assembly failure can be minimized.

Description

Camera Module

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently impacted during use, and the camera module may slightly shake due to shaking of the user's hand while shooting. In view of this point, in recent years, a camera module having a hand shake preventing means has been disclosed.

As an example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a Gyro sensor IC or an angular velocity sensor is installed inside a device on which a camera module such as a mobile phone is mounted to compensate for hand shake. How to do it is being introduced.

However, when a separate angular velocity detection sensor is provided as described above, since a separate detection sensor must be provided to implement the hand shake prevention function, it causes an increase in manufacturing cost, and is used to configure and install a hand shake prevention device separate from the camera module. There is a hassle of having to prepare space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilizer function.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed spaced apart from the inner bottom surface of the housing unit by a predetermined distance, the first coil wound around the outer circumferential surface, and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed on the upper side of the holder module; A plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; And a buffer unit integrally formed with the wire spring at a connection portion between the wire spring and the third printed circuit board.

The buffer unit may be formed by bending the wire spring in zigzag, or may be formed by bending the wire spring in a coil spring shape.

The housing unit may include: a first housing disposed above the first printed circuit board; A second housing disposed above the first housing and on which the third printed circuit board is installed; First and second permanent magnets interposed between the first and second housings; It is preferable to include; a yoke disposed between the first and second permanent magnets to transmit magnetic force into the holder module.

The housing unit may include: a first housing disposed above the first printed circuit board; A second housing disposed above the first housing and on which the third printed circuit board is installed; First and second permanent magnets positioned on inner surfaces of the first and second housings; It is preferable to include; a yoke disposed between the first and second permanent magnets to transmit magnetic force into the holder module.

According to a preferred embodiment of the present invention, a shield can having a through hole at a position corresponding to the connecting portion of the third printed circuit board and the wire spring and the lens module, and installed to surround the housing unit; may further include have.

The holder module may include an outer blade having a first coil wound on an outer circumferential surface thereof; A bobbin that is elastically supported by an elastic member on the upper side of the outer blade, is disposed to move up and down inside the outer blade, a second coil is wound on an outer circumferential surface thereof, and at least one lens is installed therein; And upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein a magnetic force can be invested in the center of the first coil toward the second coil. It is preferable that the space portion is formed so as to be.

In addition, it is preferable that the yoke has a protruding portion near the center toward the holder module.

The holder module may include an outer blade having a first coil wound on an outer circumferential surface thereof; A bobbin that is elastically supported by an elastic member on the upper side of the outer blade, is disposed to move up and down inside the outer blade, a second coil is wound on an outer circumferential surface thereof, and at least one lens is installed therein; And upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade.

It is preferable that the second printed circuit board is installed on the bottom surface of the outer blade.

It is preferable that the second printed circuit board is fixed to the bottom surface of the outer blade with an adhesive member.

The wire spring may be formed of a metal material, and may be connected to the second and third printed circuit boards to be energized.

In addition, at least six wire springs are provided, and two polarities for auto-focusing control and four polarity power for OIS driving are supplied to the holder module through connection with the second and third printed circuit boards. It is desirable to do.

In addition, it is preferable that the wire springs are of the same length and are arranged in two corners of the holder module, so that a total of eight wire springs are provided.

In this case, it is preferable that the second coil is energizedly connected to the lower spring, and the lower spring is energizedly connected to the wire spring on the second printed circuit board.

In addition, the second coil may be directly connected to the second printed circuit board so as to be energized.

In addition, a space portion may be formed in the center of the first coil so that magnetic force can be invested toward the second coil.

In the present invention, since the wire spring has a buffer part to absorb the load applied repeatedly, it can be firmly connected to the connection part of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, since it can absorb the excessive force applied from the buffer member, assembling property can be improved and component loss due to assembly failure can be minimized.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
2 is an AA cross-sectional view of FIG. 1,
3 is a side view of a camera module according to an embodiment of the present invention,
4 is a side view showing a state in which the shield can of FIG. 3 is removed;
5 is an enlarged view of portion B of FIG. 2 according to the first embodiment of the present invention, and,
6 is an enlarged view of portion B of FIG. 2 according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is an AA cross-sectional view of FIG. 1, FIG. 3 is a side view of the camera module according to an embodiment of the present invention, and FIG. 4 is a shield of FIG. A side view showing a state in which the can is removed, FIG. 5 is an enlarged view of part B of FIG. 2 according to the first embodiment of the present invention, and FIG. 6 is a view of FIG. 2 according to the second embodiment of the present invention. It is an enlarged view showing part B.

The camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20 as shown in FIG. 2 showing a schematic plan view of FIG. 1 and a schematic side view of FIG. 1. , A holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60, and a buffer unit 100.

In the first printed circuit board 10, the image sensor 11 is mounted approximately in the vicinity of the center, and it is preferable that the first printed circuit board 10 is provided as a PCB board. Components for operation of the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal portions may be provided to supply power and output information of the image sensor 11. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, a first and second permanent magnets 23 and 24, and a yoke 25. Includes.

The first housing 21 is a base and is disposed on the upper side of the first printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. If necessary, a filter member capable of filtering an image incident on the image sensor 11 may be further installed in the first housing 21.

The second housing 22 is disposed above the first housing 21 and is configured to cover the first housing 21. An opening is formed at a corresponding position so that an image can be transmitted to the image sensor 11 in an approximate center of the second housing 22. On the upper side of the second housing 22, a third printed circuit board 50, which will be described later, is adhesively fixed by a fixing member such as double-sided tape or an adhesive, but this is not limited, and depending on the product design, the The third printed circuit board 50 may be provided with a separate third housing such as a case or a shield can, and the third printed circuit board 50 may be fixed to the inner surface thereof with the fixing member. If the third housing is provided, it may be supported by pressing the third printed circuit board 50 with the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to inject magnetic force into the holder module 30. It is preferable that the first and second permanent magnets 23 and 24 have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, if the size of the first and second permanent magnets 23 and 24 increases, the OIS drive increases even with a small current, and if the first and second permanent magnets 23 and 24 have a constant size, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS drive increases. In conclusion, the larger the size of the first and second permanent magnets 23, 24, the better the OIS drive, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a protruding shape around the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided the same as the first and second permanent magnets 23, 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance, and is composed of an outer blade 31 and a bobbin 32. The holder module 30 may perform a pendulum movement in the front/rear/left/right and diagonal directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31, and are elastically supported by the spring members 35, and are connected to enable the vertical movement of the bobbin 32.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound around the outer circumferential surfaces of the four sides, and the central portion of the four sides on which the coils 31a to 31d are wound It is pierced without a coil. The yoke 25 may be disposed at a position corresponding to the opened space, and the yoke 25 may be partially inserted into the space.

The second printed circuit board 40 may be fixed to the bottom of the outer blade 31 with a fixing member 33 such as double-sided tape or an adhesive. The outer blade 31 is, in accordance with the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a, the outer blades 31 are horizontally or diagonally It is suspended by a plurality of wire springs 60 so as to be movable, and is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

In addition, the outer blade 31 may be provided with a plurality of spring through-holes 37 so that the wire spring 60 can pass through and be connected to the second printed circuit board 40.

The bobbin 32 is disposed so that the outer blade 31 is movable up and down inside, and at least one lens 34 is installed therein. A second coil 32a is wound on the outer circumferential surface of the bobbin 32, the second coil 32a is the first coils 31a to 31d of the outer blade 31 through the yoke 25 The operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. The larger the size of the yoke 25, the better the AF driving, but this may also vary according to the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting and lowering of the bobbin 32.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, and a wire spring 60 is provided to supply power to the first and second coils 31a and 32a. Connected. The connection method can be any method as long as it can be connected by soldering or other conductive material. That is, the connection part (w') of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, and the wire spring 60 ) By transmitting the power supplied through the first and second coils 31a and 32a to form an electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, and as shown in FIG. 2, first, after being connected to the lower spring 36, the lower spring 36 ) May be connected to the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 with a fixing member such as double-sided tape and an adhesive member as described above, and the third printed circuit board 50 is connected to the first printed circuit board 10. Power delivered through the terminal portion 52 of the printed circuit board 50 is transferred to the second printed circuit board 40 through a wire spring 60 connected like the second printed circuit board 40. The connection method can be any method as long as it can be connected by soldering or other conductive material.

The third printed circuit board 50 is provided to cover one side wall surface of the first and second housings 21 and 22, as shown in FIGS. 3 and 4, wherein the first and A window 55 is formed on a surface facing the second permanent magnets 23 and 24 and the yoke 25, so that interference with them may be avoided.

This is a configuration to avoid this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later with a fixing means such as epoxy.

On the other hand, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a rigid FPCB (Rigid FPCB integrated type). It is not limited and any substrate that is electrically connected may be used.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected by a pad 51 formed on the third printed circuit board 50, as shown in FIG. 5, and the wire spring is at the center of the pad 51 A through hole 53 through which 60 is passed is formed. The connection method can be any method as long as it can be connected by soldering or other conductive material. On the other hand, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected to enable electricity by opening a solder resistor. have.

In this way, the wire spring 60 connected from the pad 51 supplies the power supplied through the terminal portion 52 to the second printed circuit board 40 side, and the first and second coils 31a ( 32a) makes it possible to interact with the first and second permanent magnets 23 and 24.

In addition, the other end of the wire spring 60, as shown in Figure 2, passing through the spring through hole 37 formed in the outer blade 31, the second installed on the bottom surface of the outer blade 31 It is connected to the printed circuit board 40. At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, the pad A through hole (not shown) through which the wire spring 60 passes is formed in the center of (not shown). The connection method can be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, and the outer blade ( It is possible to correct the vibration of 31) by the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity and can conduct electricity so as to withstand impact.

On the other hand, as the thickness of the wire spring 60 is thinner, the motion for correcting hand shake is improved even with a small current, but this may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several ㎛ to hundreds of ㎛, preferably it is good to have a 1 to 100㎛.

In addition, it is preferable that at least six wire springs 60 are provided, at least two polarities for auto-focusing control and four polarity power supplies for hand shake correction movement and hand shake correction are supplied to the second and third printed circuits. It is necessary to supply it to the holder module 30 through connection with the substrates 40 and 50.

According to a preferred embodiment of the present invention, as shown in Figs. 1 and 2, it is good to have a total of 8 provided and balanced, each having two of the same length and arranged at the corners of the holder module 30. .

Meanwhile, as shown in FIG. 2, when a separate third housing such as the shield can 70 is further included, as described above, the third printed circuit board 50 is the first and second permanent Since the magnet 23, 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, in order to avoid this coupling part, a window 55 is formed to form the first and second housings. (21) Cover the side wall of (22).

If the shield can 70 has been deleted, the third printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke ( 25) may be attached and fixed, and as described above, the third printed circuit board 50 is composed of a PCB, and a window 55 as described above is provided to the window 55. The first and second permanent magnets 23 and 24 and the yoke 25 may be inserted, and may be additionally reinforced with a shielding tape on the outside.

It is preferable that the buffer part 100 is integrally formed in a partial section of the wire spring 60. The buffer unit 100 may be formed by bending the wire spring 60 in a zigzag, as shown in FIG. 5, or may be formed by bending in a coil spring shape, as shown in FIG. Do. The buffer unit 100 may include a shape bent to have an acute angle as shown in FIG. 5 or may have a curved shape as shown in FIG. 6. As shown in FIG. 5, the buffer unit 100 includes a first portion 101 extending in a first direction, and a second portion 102 extending from the first portion 101 in a second direction different from the first direction. ), and a third portion 103 extending from the second portion 102 in a third direction different from the second direction.

In this case, the buffer part 100 may design the shape of the second housing 22 at a position where the wire spring 60 does not interfere with the second housing 22.

It is preferable that the buffer unit 100 has an upper light lower narrow structure, and as shown in FIGS. 5 and 6, has a conical funnel shape that becomes narrower toward the lower side. The support hole 122 is formed coaxially with the through hole 53 and is preferably formed to correspond to or larger than the diameter of the through hole 53.

The diameter of the through hole 53 is preferably formed to be slightly larger than the diameter of the wire spring 60, and when the wire spring 60 and the pad 51 formed on the third printed circuit board 50 are connected by soldering or It may be designed such that a connecting material such as other conductive material flows down through the through hole 53 and is connected to and fixed to the wire spring 60 on both upper and lower surfaces of the third printed circuit board 50.

The diameter of the support hole 122 is preferably formed slightly larger than the diameter of the wire spring 60, and may be formed equal to or larger than the diameter of the through hole 53. That is, the wire spring 60 may be designed to prevent interference due to contact with the second holder 22 near the support hole 122.

Since the buffer unit 100 configured as described above serves to absorb the load applied to the wire spring 60, the load applied to the pad 51 provided on the third printed circuit board 50 is reduced, It is possible to reduce the load directly applied to the connection portion (w) fixing the wire spring (60).

On the other hand, the general assembly procedure is after combining the bobbin 32 and the outer blade 31, and then using a jig, the second housing 22, the second and third printed circuit boards 40, 50, and the wire spring ( 60) is connected, the bobbin 32 provided with the lens barrel is connected, the first housing 21 is connected, and this is mounted on the first printed circuit board 10. Before connecting the first housing 21, a permanent magnet and yoke combination may be performed first. This assembly sequence can be changed as needed. In other words, it may be possible right from the machine without a jig. In this process, even if a force for inserting and coupling the bobbin 32 provided with the lens barrel is excessively applied and an excessive force is applied to the connection part w, the buffer part 100 may absorb such excessive force.

That is, the buffer unit 100 is the wire spring 60 in the vicinity of the connection portion (w) between the wire spring 60 and the third printed circuit board 50, as shown in Figs. 2, 5 and 6 ) When a load is generated and is pulled in the direction of gravity or shakes left and right, the load generated is absorbed as the deformation energy of the buffer unit 100.

Therefore, it is possible to prevent the hassle of performing the connection operation again due to the damage of the connection part (w) during the assembly process, or the parts becoming unusable, and it is possible to produce a camera module with more reliability.

Meanwhile, according to a preferred embodiment of the present invention, the third printed circuit board 50 has a through hole at a position corresponding to the lens module 30 around the connection part w of the wire spring 60, and the housing A shield can 70 installed to surround the units 21 and 22 may be further included. In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required and may be omitted depending on the configuration of the housing units 21 and 22.

Meanwhile, as shown in FIG. 2, in order to fix the shield can 70 to the first housing 21, hook units 80 may be provided on four or at least one or more surfaces. The location may be within the range allowed by the center or edge design, and the number may be provided as one or more.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81, and If necessary, the reverse can also be configured.

Embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those of ordinary skill in the technical field of the present invention can improve and change the technical idea of the present invention in various forms. Therefore, such improvements and changes will fall within the scope of the present invention as long as it is apparent to those of ordinary skill in the art.

10; A first printed circuit board 20; Housing unit
21; First housing 22; Second housing
23; First permanent magnet 24; 2nd permanent magnet
25; York 30; Holder module
31; Outer blade 31a; 1st coil
32; Bobbin 32a; 2nd coil
40; A second printed circuit board 50; 3rd printed circuit board
51; Pad 52; Terminals
53; Aperture 60; Wire spring
70; 100 shield cans; Buffer
W; Connection 122; Support hole

Claims (20)

Base;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;
A second coil disposed on the bobbin;
A magnet for moving the bobbin by interaction with the second coil;
A first coil for moving the holder module by interaction with the magnet;
A wire supporting the holder module; And
It includes a buffer part connected to the wire,
The buffer part is electrically connected to the second coil,
The image stabilization device including a curved shape or a curved shape such that the buffer part has an acute angle. The method of claim 1,
The shock absorber is formed by bending in a zigzag or bent in a coil spring shape. The method of claim 1,
The shock absorber is a camera shake correction device that absorbs the load applied to the holder module. The method of claim 1,
The buffer unit includes a first portion extending in a first direction, a second portion extending from the first portion in a second direction different from the first direction, and the second portion in a third direction different from the second direction. An image stabilization device including a third portion extending from The method of claim 4,
The third direction is a camera shake correction device parallel to the first direction. The method of claim 1,
The image stabilization device including a shape in which one strand is bent at least two times or more. The method of claim 6,
Including a first connection portion disposed at the end of the wire by soldering,
The first connection portion is disposed closer to the buffer portion than the bobbin,
The bobbin moves in the optical axis direction for focusing,
The first connection portion has a first width in a horizontal direction perpendicular to the optical axis direction,
The thickness of the one strand of the buffer part is smaller than the first width of the first connector. The method of claim 1,
An image stabilization device in which the buffer unit is formed such that a distance between both ends of the buffer unit is variable. The method of claim 1,
A third printed circuit board including a first portion disposed on the base and a second portion extending downward from the first portion,
The wire is a camera shake correction device that is coupled to the first portion of the third printed circuit board. The method of claim 9,
The wire includes 6 wires having the same length,
The buffer unit includes six buffer units,
An image stabilization device that is connected to each of the six buffers and the six wires. The method of claim 10,
The third printed circuit board includes a plurality of terminals,
The plurality of terminals of the third printed circuit board includes two terminals for focusing and four terminals for camera shake correction,
The second coil is electrically connected to the two terminals for focusing through two of the spring member and the six wires. The method of claim 9,
The third printed circuit board includes a pad formed in the first portion of the third printed circuit board and including a hole,
The pad includes a first surface facing the holder module and a second surface disposed opposite the first surface,
The wire passes through the hole of the pad and is coupled to the second surface of the pad. The method of claim 1,
The spring member includes an upper spring member coupled to an upper portion of the outer blade, and a lower spring member coupled to a lower portion of the outer blade,
The buffer portion is disposed closer to the outer blade than the base,
The shock absorber is disposed closer to the upper spring member than the lower spring member. A first printed circuit board;
An image sensor disposed on the first printed circuit board;
The image stabilization device of claim 1 disposed on the first printed circuit board; And
A camera module including a lens coupled to the bobbin of the image stabilization device. A mobile phone comprising the camera module of claim 14. Base;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;
A second coil disposed on the bobbin;
A magnet for moving the bobbin by interaction with the second coil;
A first coil for moving the holder module by interaction with the magnet;
A wire supporting the holder module; And
It includes a buffer part connected to the wire,
The buffer part is electrically connected to the second coil,
The buffer unit includes a first portion extending in a first direction, a second portion extending from the first portion in a second direction different from the first direction, and the second portion in a third direction different from the second direction. An image stabilization device including a third portion extending from The method of claim 16,
The third direction is a camera shake correction device parallel to the first direction. The method of claim 16,
The image stabilization device including a shape in which one strand is bent at least two times or more. The method of claim 18,
Including a first connection portion disposed at the end of the wire by soldering,
The first connection portion is disposed closer to the buffer portion than the bobbin,
The bobbin moves in the optical axis direction for focusing,
The first connection portion has a first width in a horizontal direction perpendicular to the optical axis direction,
The thickness of the one strand of the buffer part is smaller than the first width of the first connector. Base;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;
A second coil disposed on the bobbin;
A magnet for moving the bobbin by interaction with the second coil;
A first coil for moving the holder module by interaction with the magnet; And
An image stabilization device comprising a wire supporting the holder module.

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