KR20210000665A - Ball tool for dual type solder ball placement system - Google Patents

Abstract

The present invention relates to a ball tool for a dual-type solder ball placement system. More specifically, by using the ball tool configured to link two types of ball mounting lines to one solder ball placement system, so that solder balls can be mounted in various ways. In particular, the present invention uses the ball tool configured to avoid interference of the first mounted solder ball, and simultaneously mounts the same solder ball or two types of solder balls having different purposes in two lines in one device, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the present invention allows mounting of the solder ball serving as a terminal and a core ball serving as a support at the same time through an inline system, and prevents bending of a board, a unit, or a chipset according to light, thin and small trends. Therefore, reliability and competitiveness can be increased in a semiconductor field, a semiconductor package manufacturing field, a PCB manufacturing field, especially a wafer level chip scale package (WLCSP)-based manufacturing field, a solder ball placement system field, as well as similar or related fields.

Description

Ball tool for dual type solder ball placement system

The present invention relates to a ball tool for a dual-type solder ball placement system, and more particularly, configured to allow two types of ball mounting lines to interlock with one solder ball placement system. By using a ball tool, solder balls can be mounted in various ways.

In particular, the present invention allows the same solder ball or two types of solder balls having different purposes to be simultaneously mounted in two lines in one device by using a ball tool configured to avoid interference of the first mounted solder balls. , It relates to a ball tool for a dual-type solder ball placement system that can efficiently mount solder balls arranged in various purposes and patterns.

The technology in the semiconductor field has been developed in the direction of improving miniaturization and integration, and in recent years, according to the trend of miniaturization of IT devices, it is developing in the direction of developing low-power, high-performance chips that process large amounts of data.

Flip chip, one of the semiconductor chip packages by such technology development, does not use a metal lead (wire) when mounting a semiconductor unit, also called a die, on a substrate, It is manufactured by attaching directly to the substrate using a solder ball, which is a bump ball, and is also referred to as a wireless semiconductor.

In this way, as wafers become thinner and input/output (I/O) terminals increase, the trend of high performance, low power, light, thin and short of electronic devices continues. Technologies of the WLCSP (Wafer Level Chip Scale Package) method are being developed, and a system for attaching solder balls in this way is called a solder ball placement system.

In addition, such a solder ball placement system includes a substrate, a unit, or a chipset, such as Korean Laid-Open Patent Publication No. 10-2017-0054055,'Ball Box and Solder Ball Attachment Device A ball tool that attaches solder balls to chipsets, etc. is constructed.

Meanwhile, as the trend of light, thin, and short semiconductor products continues, semiconductor units such as chipsets mounted on substrates are also becoming thinner.

In this way, when the thickness of the semiconductor unit becomes thin, warpage of the corresponding unit may occur in the process of mounting the semiconductor unit on the substrate, and this may cause defects in the contact point of the solder ball. Can increase.

In order to prevent this, a separate support structure must be applied between the substrate and the semiconductor unit, but this leads to a decrease in the efficiency of the manufacturing process and an increase in the defect rate as the structure of the semiconductor product becomes complicated.

In addition, in order to apply the corresponding structure, a separate facility must be additionally configured, which increases the manufacturing cost of semiconductor products, as well as lowers efficiency in the operation and management of the facility.

Republic of Korea Patent Publication No. 10-2017-0054055'Ball box and solder ball attaching device having the same'

In order to solve the above problems, the present invention uses a ball tool configured so that two types of ball mounting lines can be interlocked with one solder ball placement system. The purpose is to provide a ball tool for a dual-type solder ball placement system that can mount a solder ball.

In particular, the present invention allows the same solder ball or two types of solder balls having different purposes to be simultaneously mounted in two lines in one device by using a ball tool configured to avoid interference of the first mounted solder balls. It is an object of the present invention to provide a ball tool for a dual-type solder ball placement system capable of efficiently mounting solder balls arranged in various purposes and patterns.

Through this, the present invention prevents the warpage of the substrate, unit, or chipset according to the trend of light, thin, and short by simultaneously mounting a solder ball serving as a terminal and a core ball serving as a local area as an in-line system. The purpose is to provide a ball tool for a dual type solder ball placement system that can be prevented.

In order to achieve the above object, the ball tool for a dual-type solder ball placement system according to the present invention includes a tool body having a plurality of negative pressure lines for adsorbing solder balls, and a tool body coupled to a lower portion of the tool body, and the negative pressure line And a tool cover having a plurality of adsorption holes formed therethrough so as to be spatially connected to the solder ball, and having a ball interference preventing groove into which a core ball mounted earlier than the solder ball is inserted when the solder ball is mounted.

By the above solution, the present invention uses a ball tool configured to interlock with two types of ball mounting lines to one solder ball placement system, in various ways. There is an advantage of being able to mount a solder ball.

In particular, the present invention is advantageous in that two types of solder balls having different purposes can be simultaneously mounted as a single device by using a ball tool configured to avoid interference of first mounted solder balls.

Using this, the present invention has the advantage of being able to efficiently mount solder balls arranged in various purposes and patterns.

Specifically, the present invention has the advantage of being able to simultaneously mount a solder ball serving as a terminal and a core ball serving as a support in an in-line system.

Accordingly, the present invention has the advantage of preventing the bending phenomenon of the substrate, unit, or chipset according to the trend of light, thin, and short.

As a result, the present invention can provide the driving force for technology development in the relevant field so that better products can be produced in accordance with the development direction and trend of semiconductor products such as light, thin and short, and improve product quality and price competitiveness. There is an effect that can be made.

In addition, in the present invention, even when the same solder ball is mounted, the mounting speed of the solder ball can be greatly improved by using the dual method, thereby improving productivity and competitiveness for existing products.

Accordingly, it is possible to improve reliability and competitiveness in the semiconductor field, semiconductor package manufacturing field, PCB manufacturing field, especially wafer level chip scale package (WLCSP)-based manufacturing field, solder ball placement system field, as well as similar or related fields. .

1 is a partially enlarged bottom perspective view showing an embodiment of a ball tool for a dual type solder ball placement system according to the present invention.
FIG. 2 is a diagram illustrating an embodiment in which each region is set on the bottom of FIG. 1.
3 is a partially enlarged cross-sectional view showing embodiments of the ball interference prevention groove shown in FIG. 1.
4 is a diagram for explaining the function of FIG. 1.
5 is a diagram illustrating another embodiment of FIG. 3.
6 is a block diagram showing an embodiment of a dual-type solder ball placement system to which the present invention is applied.

Examples of the ball tool for a dual-type solder ball placement system according to the present invention can be applied in various ways, and hereinafter, the most preferred embodiment will be described with reference to the accompanying drawings.

1 is a partially enlarged bottom perspective view showing an embodiment of a ball tool for a dual-type solder ball placement system according to the present invention, and FIG. 2 is a view illustrating an embodiment in which each region is set on the bottom of FIG. 1.

Referring to FIG. 1, a ball tool A for a dual-type solder ball placement system may include a tool body 100 and a tool cover 200.

The tool body 100 may have a plurality of negative pressure lines for adsorbing solder balls. Here, the negative pressure line and the configuration, structure, and method of forming the negative pressure in the negative pressure line are not limited to specific ones because they can be variously applied according to the needs of those skilled in the art.

* The tool cover 200 is coupled to the lower portion of the tool body 100, and a plurality of adsorption holes 210 may be formed through it so as to be spatially connected to the negative pressure line.

Further, on the lower surface of the tool cover 200, a ball interference prevention groove 220 into which the core ball, which is the first solder ball mounted earlier than the second solder ball, is inserted when the second solder ball to be described below is mounted may be formed. have. For example, a core ball, which is a first solder ball, may perform a pre-regional role between a substrate and a chipset, and the second solder ball may serve as a terminal.

At this time, the ball interference preventing groove 220 may be formed in a sufficient size so that the core ball is not in contact.

At this time, as shown in FIG. 2, the area F2 made up of a plurality of ball interference preventing grooves 220 is in the area F1 in which the suction holes 210 are formed with respect to the entire lower surface of the tool cover 200. In comparison, it is preferably formed in a narrow area.

In addition, it is natural that the number of ball interference preventing grooves 220 is formed in a relatively small number compared to the number of adsorption holes 210.

3 is a partially enlarged cross-sectional view showing embodiments of the ball interference prevention groove shown in FIG. 1.

Referring to FIG. 3, the ball interference preventing groove 220 may be formed such that a conical space portion extends inside the cylindrical space portion.

As shown in (a) of FIG. 3, when the ball interference preventing groove 220 is formed in a space in which a cylindrical and conical shape are combined, a core ball (second solder ball) flows into the inside as shown in FIG. In this state, interference with the core ball can be avoided with a minimum space, and thus the processing volume of the ball interference preventing groove 200 can be minimized.

Meanwhile, as the size of the solder ball gradually decreases due to the trend of light, thin, and short semiconductor products, in the case of a solder ball having a predetermined size or less, unnecessary solder balls may be attached to the lower surface of the tool cover 200.

This phenomenon is a phenomenon that occurs when a small amount of force (magnetic force such as an electrostatic phenomenon, etc.) that is negligible in a solder ball of sufficient size is developed as the size of the solder ball decreases. This phenomenon is caused by the ball interference prevention groove 200 ), it may cause defects such as falling of the mounted core ball.

In order to prevent this in advance, in the present invention, a shielding layer 221 for preventing static electricity generation may be formed on the inner surface of the ball interference prevention groove 220 as shown in FIG. 3B.

Therefore, compared to the second solder ball, the ball tool A of the present invention can minimize physical interference with the first solder ball (core ball) mounted first, as well as non-physical interference caused by a force such as magnetic force.

4 is a diagram for explaining the function of FIG. 1.

First, when the target substrate 1 on which the core ball 2 is mounted is positioned by the first ball mounting line 20 shown in FIG. 6, the ball tool A of the second ball mounting line 30 is a solder ball ( 3) After the core ball 2 is positioned inside the ball interference preventing groove 220 in a state in which it is adsorbed, the solder ball 3 may be mounted on the target substrate 10. Here, the target substrate 1 may include a wafer, a substrate, a unit, a chipset, etc. on which a solder ball is to be mounted.

Accordingly, the second ball mounting line 30 may mount the solder ball 3 at a desired position while excluding interference with the first mounted core ball 2.

Hereinafter, a dual type solder ball placement system in which the ball tool A according to the present invention is configured will be described.

6 is a block diagram showing an embodiment of a dual-type solder ball placement system to which the present invention is applied.

6, the dual type solder ball placement system of the present invention includes an onloading unit 10, a first ball mounting line 20, a second ball mounting line 30, and a flux screening unit. It includes a (Flux cleaning) unit 40, an offloading unit 50, and a rejecting unit 60.

The onloading unit 10 supplies target materials such as wafers, substrates, units, chipsets, etc. on which solder balls are to be mounted, an onload conveyor 11 that supplies target materials from the outside, and the supplied target materials It may include an on-load picker (12) to pick up and transport.

The first ball mounting line 20 mounts the first solder ball at a set position on the target substrate, and the first ball tool 21 for adsorbing the first solder ball, the first ball box 22 containing the first solder ball, and the solder ball And a first flux tool 23 for applying the flux to a position where the flux is to be mounted and a first flux box 24 containing the flux. The first ball tool 21 of the first ball mounting line 20 is moved through the first ball toll flux tool rail 25, and the solder balls of the first ball box 22 are transferred to the first substrate transfer rail 80 or the second It is mounted on a target substrate transferred through the substrate transfer rail 90. The first flux tool 23 of the first ball mounting line 200 is moved through the first ball tool flux rail 25 and transfers the flux of the first flux box 24 to the first substrate transfer rail 80 or the second. It is applied to the target substrate transferred through the substrate transfer rail 90.

The second ball mounting line 30 mounts a second solder ball at a set position on the target substrate, and a second ball tool 31 that adsorbs a second solder ball, a second ball box 32 containing a second solder ball, and a solder ball And a second flux tool 33 for applying the flux to a location where the flux is to be mounted and a second flux box 34 containing the flux. The second ball tool 31 of the second ball mounting line 30 is moved through the second ball toll flux tool rail 35, and the second solder ball of the second ball box 32 is transferred to the first substrate transfer rail 80. Alternatively, it is mounted on a target substrate transferred through the second substrate transfer rail 90. The second flux tool 33 of the second ball mounting line 30 is moved through the second ball tool flux tool rail 35, and the flux of the second flux box 34 is transferred to the first substrate transfer rail 80 or 2 Apply to the target substrate transferred through the substrate transfer rail 90.

As described above, the first solder ball mounted by the first ball mounting line 20 and the second solder ball mounted by the second ball mounting line 30 may be of the same type or different types as described above. .

When configured with different types, the first solder ball and the second solder ball may be configured with at least one of different sizes, shapes, configurations, and characteristics.

First, when the same first solder ball and second solder ball are used for one target material, the same solder ball can be mounted on two lines at the same time, thereby greatly improving the mounting speed of the solder ball using the dual method. .

When the same first and second solder balls are mounted on a target substrate, while the first ball mounting line 20 mounts the first solder ball on the target substrate on the first substrate transfer rail 80, the second ball mounting line Reference numeral 20 indicates that by mounting the second solder ball on the target substrate on the second substrate transfer rail 90, it is possible to mount simultaneously in two lines using a dual method. While the first ball mounting line 20 mounts the first solder ball on the target base material on the second base material transfer rail 80, the second ball mounting line 20 moves from the first base material transfer rail 90 to the target base material. By mounting a second solder ball different from the first solder ball, it is possible to mount simultaneously in two lines using a dual method.

The same solder ball is mounted on one target base material, but when different solder balls are mounted for each target base material, while the first ball mounting line 20 mounts the first solder ball on the target base material on the first base material transfer rail 80, The second ball mounting line 20 can be mounted simultaneously on two lines using a dual method by mounting a first solder ball and a second solder ball different from the first solder ball on the target substrate on the second substrate transfer rail 90. Conversely, while the first ball mounting line 20 mounts the first solder ball on the target base material on the second base material transfer rail 80, the second ball mounting line 20 is the target base material on the first base material transfer rail 90. By mounting a second solder ball different from the first solder ball on the device, it is possible to mount simultaneously on two lines using the dual method.

When different solder balls are mounted on one target base material, while the first ball mounting line 20 mounts the first solder ball on the target base material on the first base material transfer rail 80, the second ball mounting line 20 The second solder ball is mounted on the target substrate on the second substrate transfer rail 90 in a state in which the first solder ball is mounted on the second substrate transfer rail 90 by the first ball mounting line.

While the first ball mounting line 20 mounts the first solder ball on the target base material on the second base material transfer rail 90, the second ball mounting line mounts the first solder ball at the first base material transfer rail 80. The second solder ball is mounted on the target substrate of the first substrate transfer rail 80 in the state in which the first solder ball is mounted on the first substrate transfer rail 80 in the state.

More specifically, the first solder ball may include a core ball that performs a local area between the substrate and the chipset (or unit), and the second solder ball serves as a terminal between the substrate and the chipset (or unit). Can be done.

At this time, in order to stably support the core ball between the substrate and the chipset (or unit), a nickel (Ni) and solder (Solder) layer may be formed on the outer surface of the ball of a metal material.

In addition, various structures may be applied to the first solder ball and the second solder ball, and the same may be selected according to the needs of those skilled in the art.

For example, the first ball mounting line 20 and the second ball mounting line 30 according to the present invention may be configured to divide and place solder balls that are previously mounted as one line, and accordingly, the existing product can be Of course, the speed of production can be improved.

In other words, by allowing the same solder ball to be mounted on two lines at the same time, the mounting speed of the solder ball can be greatly improved by using the dual method.

More specifically, while the first ball mounting line 20 mounts the solder ball on the target base material on the first base material transfer rail 80, the second ball mounting line 20 is the target base material on the second base material transfer rail 90. By mounting the solder ball on the device, it is possible to mount at the same time in two lines using the dual method, and the mounting speed of the solder ball can be greatly improved.

On the other hand, when the first ball mounting line 20 and the second ball mounting line 30 continuously mount the first solder ball and the second solder ball in an in-line method in one system, the first ball mounting line 20 and the second ball mounting line 30 2 Since the solder ball must be mounted, it is necessary not to interfere with the first solder ball mounted first in the process of mounting the second solder ball.

To this end, the ball tool (A) 31 of the second ball mounting line 30 may have a ball interference preventing groove 220 formed in a portion corresponding to the mounting position of the first solder ball as described above.

Meanwhile, as described above, at least one ball interference preventing groove 220 is formed in the ball tool A, for effective interlocking and operation of the first ball mounting line 20 and the second ball mounting line 30 , It is preferable that the number of the portions F2 where the first solder balls are located is smaller than the portion F1 where the second solder balls are adsorbed or the mounting area is narrower.

For example, the first ball mounting line 20 mounts a relatively small number of core balls (or a narrow mounting area), and the second ball mounting line 30 By forming the interference preventing groove 220, it is possible to more efficiently mount the core ball and the solder ball.

The flux cleaning unit 40 is for removing the flux remaining in the first flux tool 23 and the second flux tool 33, and the specific configuration is the structural characteristics of the flux tool and the requirements of those skilled in the art. It can be changed in various ways according to, of course, not limited to a specific one.

The offloading unit 50 is for transferring the target material on which the first and second solder balls are normally mounted to the next process, and an off-road picker for transferring the target material on which the solder ball is mounted to a tray. 51) and an off-road conveyor 52 for transferring the corresponding tray.

The rejecting unit 60 is for recovering a target substrate in which at least one of the first solder ball and the second solder ball is abnormally mounted, and a reject tray stage for loading a tray containing the abnormal substrate, 61) and a reject elevator 62 for recovering the reject tray. Here, the role of putting the abnormally mounted target material in the reject tray may be performed by the off-road picker 51 of the off-loading unit 50.

Meanwhile, in the dual-type solder ball placement system of the present invention, whether the target substrate on which the first solder ball and the second solder ball are mounted by the off-road picker 51 is normally transferred through the off-loading unit 50 or the rejecting unit In order to determine whether to recover through (60), a look up vision (71) and an inspection vision (72) for inspecting the mounted solder ball may be further included.

The lookup vision 71 is to perform vision inspection on the first solder ball, and the inspection vision is to perform vision inspection on the second solder ball 72, and the order of mounting and vision inspection of the solder ball is according to the needs of those skilled in the art. It can be performed in various combinations.

For example, after mounting the first solder ball, the first solder ball may be inspected, and the second solder ball may be inspected after the second solder ball is mounted. As another example, after mounting both the first solder ball and the second solder ball, the first solder ball and the second solder ball may be simultaneously inspected.

Meanwhile, in the dual-type solder ball placement system comprising the ball tool (A) of the present invention, the core ball (2) and the solder ball (3) can be sequentially mounted in a state where the flux is applied to the target substrate (1). After applying the flux for the core ball (2), the core ball (2) is mounted, and when the mounting of the core ball (2) is completed, the flux for the solder ball (3) is applied and the solder ball (3) Can be implemented.

Accordingly, the present invention provides a ball interference prevention groove 220 formed in the ball tool A of the present invention, if necessary, according to the function and structure of the second flux tool 33 of the second ball mounting line 30. 2 It goes without saying that it can also be formed on the lower surface of the flux tool 33.

5 is a diagram illustrating another embodiment of FIG. 3.

Referring to FIG. 5, the ball interference preventing groove 312b formed on the lower surface of the tool cover 312 may be formed so that the curved space portion extends inside the cylindrical space portion. Here, the curved space portion may include a hemispherical shape.

For example, in the process of picking up the solder balls 12 contained in the ball boxes 220 and 320 using the ball tools 210 and 310 in the solder ball mounting process, the solder balls 12 are moved into the ball interference prevention groove 312b. Inflow may occur.

At this time, as shown in FIG. 3 above, when the conical space is formed to extend inside the cylindrical space, since the conical space is in line contact with the solder ball 12, the contact part may be widened. There may be a case where the solder ball 12 flowing into the interference preventing groove 312b cannot be discharged and remains in the ball interference preventing groove 312b.

For this reason, in the subsequent mounting process of the solder ball 12, interference with the core ball 11 may occur, resulting in a defect in the process.

Thus, as shown in Figure 5, when forming the inside of the ball interference prevention groove (312b) in a curved (hemispherical), the solder ball 12 and the ball interference prevention groove (312b) flowing into the inside of the ball interference prevention groove (312b) ) By making point contact, it is possible to minimize the possibility that the separated or scattered solder ball 12 may be caught in the ball interference prevention groove 312b, and the solder ball 12 can be easily separated from the ball interference prevention groove 312b. have.

Through this, the reliability of the subsequent mounting process of the solder ball 12 can be improved, and the yield and quality of the product can be greatly improved.

In the above, a ball tool for a dual type solder ball placement system according to the present invention has been described. It will be appreciated that the technical configuration of the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention by those skilled in the art.

Therefore, the embodiments described above are illustrative in all respects and should be understood as non-limiting.

A: Ball tool
100: tool body
200: tool cover 210: suction hole
220: ball interference prevention groove 221: shielding layer

Claims (2)

In the ball tool for dual type solder ball placement system,
The ball tool includes a first ball tool and a second ball tool,
The placement system,
A first ball mounting line for mounting the first solder ball at a set position; And
Includes; a second ball mounting line for mounting the second solder ball at a set position,
The first ball mounting line includes a first ball box containing a first solder ball, a first flux box containing a flux, and a first flux tool for applying a flux to a position where the first solder ball is to be mounted, and the first A ball tool adsorbs the first solder ball from the first ball box and mounts it at a set position,
The second ball mounting line is the second ball mounting line is a second ball box containing a second solder ball, a second flux box containing the flux, and a second flux tool for applying flux to a position where the second solder ball is to be mounted. Including, wherein the second ball tool adsorbs the second solder ball from the second ball box and mounts at a set position,
The first flux tool is moved through the first ball tool flux tool rail, and the flux of the first flux box is applied to the target substrate transferred through the first substrate transfer rail or the second substrate transfer rail, and the first ball mounting line The first ball tool of is moved through the first ball toll flux tool rail, and the first solder ball of the first ball box is mounted on the target substrate transferred through the first substrate transfer rail or the second substrate transfer rail,
The second flux tool is moved through the second ball tool flux rail, and the flux of the second flux box is applied to the target substrate transferred through the first substrate transfer rail or the second substrate transfer rail, and the second ball mounting line The second ball tool is moved through the second ball tol flux tool rail, and the second solder ball of the second ball box is mounted on the target substrate transferred through the first substrate transfer rail or the second substrate transfer rail,
When mounting the same first solder ball and second solder ball on the target substrate,
While the first ball mounting line mounts the first solder ball on the target substrate on any one of the first substrate transfer rail and the first substrate transfer rail, the second ball mounting line includes the first substrate transfer rail and Mounting a second solder ball on the target substrate on the other substrate transfer rail among the first substrate transfer rails,
In the case of mounting different solder balls on one target material,
While the first ball mounting line mounts the first solder ball on the target substrate on any one of the first substrate transfer rail and the first substrate transfer rail, the second ball mounting line is already a first ball mounting line. The second solder ball is mounted on the target substrate on the other substrate transfer rail in a state in which the first solder ball is mounted on the other substrate transfer rail among the first substrate transfer rail and the first substrate transfer rail by
The second ball tool,
Tool body having a plurality of negative pressure lines for adsorbing solder balls: and
A tool that is coupled to the lower portion of the tool body, has a plurality of adsorption holes through which it is spatially connected to the negative pressure line, and has a ball interference prevention groove into which a core ball mounted earlier than the solder ball is inserted when the solder ball is mounted A ball tool for a dual-type solder ball placement system comprising: a cover.
The method of claim 1,
The ball interference prevention groove,
A ball tool for a dual-type solder ball placement system, characterized in that the curved space is formed to extend inside the cylindrical space.

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