KR20200123712A - Jig for processing via holes and via holes boring device thereof - Google Patents

Abstract

According to the embodiment of the present invention, a jig for machining a via hole is a plate-shaped auxiliary member which is disposed between a processing plate having an adsorption part disposed at the lower part and including a second suction hole and a work piece. A first suction hole for adsorbing and supporting the workpiece by suction air provided through the second suction hole is formed in the auxiliary member, and the auxiliary member may include a first area a second area surrounding the first area. The first suction hole may include a 1-1 suction hole which is formed in the first area; and a 1-2 suction hole which is formed in the second area and has a shape different from that of the 1-1 suction hole. The present invention can improve fixing power to the workpiece while minimizing damage to the processing plate.

Description

A jig for machining a via hole, and a via hole machining device including the same {JIG FOR PROCESSING VIA HOLES AND VIA HOLES BORING DEVICE THEREOF}

The embodiment relates to a jig, and in particular, to a jig for machining a via hole capable of minimizing the occurrence of wrinkles of a workpiece occurring during machining of a via hole, and a via hole machining apparatus including the same.

Recently, according to the trend toward light, thin, and small electronic products, parts of electronic products are also required to be highly integrated, ultra-thin, and highly functional. Accordingly, in order to reflect the above requirements on a printed circuit board on which highly integrated, ultra-thin, and highly functional parts are mounted, micro via hole technology for diversifying circuit design of the board is being introduced.

In the case of processing a via hole in such a printed circuit board, a mechanical processing or exposure method using a mechanical fine drill has been mostly used, but a via hole processing apparatus using a laser light has recently been used.

The via-hole processing apparatus using laser light is superior to the mechanical processing using a fine drill in that it can cope with the reduction in processing speed and hole diameter.

In the via hole processing apparatus using such a laser light, a laser light using a CO ₂ laser or a high frequency solid state laser is generally used in that the price and maintenance cost of the laser oscillator are low.

The via hole processing for the laser light is performed on a jig in which a plurality of first suction holes are formed to fix the workpiece disposed on the processing plate.

The jig is formed at a position corresponding to a plurality of second suction holes formed in the processing plate, and accordingly sucks air through the first suction hole to fix the position of the workpiece disposed on the jig.

Meanwhile, as the number of via holes has recently increased, the maximum temperature generated on the surface of the processed plate may rise to 700° C. during via hole processing using a CO ₂ laser. In addition, as the surface temperature of the processing plate increases, expansion and contraction are repeated in the workpiece fixed on the processing plate, resulting in surface wrinkles, resulting in a problem of lowering flatness.

At this time, the flatness of the workpiece is related to the positional accuracy of the via hole. That is, when the flatness of the workpiece is deteriorated, the position of the via hole or the shape of the via hole is distorted, and thus the reliability of the printed circuit board is lowered.

In the embodiment, a jig for machining a via hole that can improve reliability and a via hole machining apparatus including the same are provided.

In addition, in the embodiment, a jig for machining a via hole capable of increasing the fixing force of a workpiece mounted on a machining plate and a via hole machining apparatus including the same are provided.

In addition, in the embodiment, a jig for machining a via hole capable of improving positional accuracy and shape uniformity of a via hole formed in a workpiece, and a via hole machining apparatus including the same.

In addition, in the embodiment, a jig for machining a via hole capable of maintaining a flatness of the workpiece by maximizing a suction area of the workpiece and a via hole machining apparatus including the same are provided.

In addition, in the embodiment, a jig for machining a via hole capable of improving a fixing force of a workpiece while minimizing damage to a machining plate and a via hole machining apparatus including the same are provided.

The technical tasks to be achieved in the proposed embodiment are not limited to the technical tasks mentioned above, and other technical tasks that are not mentioned are clear to those of ordinary skill in the technical field to which the proposed embodiment belongs from the following description. Can be understood.

A jig for machining a via hole according to an embodiment is a plate-shaped auxiliary member disposed between a processing plate including a processing plate including a second suction hole and a workpiece having an absorption unit disposed at a lower portion thereof, and the auxiliary member includes the second suction hole A first suction hole for adsorbing and supporting the workpiece is formed by suction air provided through the auxiliary member, and the auxiliary member includes: a first region; And a second area surrounding the first area, wherein the first suction hole comprises: a 1-1 suction hole formed in the first area; And a 1-2 suction hole formed in the second region and having a shape different from that of the 1-1 suction hole.

Further, the 1-1 suction hole includes a first portion extending in a first direction and a second portion extending in a second direction different from the first portion, and the first direction is the second It is perpendicular to the direction.

In addition, the 1-1 suction hole has a cross shape or an X shape.

Further, the center of the first suction hole is aligned on the same vertical line as the center of the second suction hole.

In addition, the length of the first region is the same as the length of the second region.

In addition, the first portion and the second portion have a length in the range of 4.5mm to 7.5mm.

In addition, the first portion and the second portion include overlap regions that overlap each other in a vertical direction, and a plan area of the overlap region is smaller than a plane area of the second suction hole.

In addition, the first area is an area overlapping a plurality of strip areas of the workpiece, and the second area is an outer area of the auxiliary member excluding the first area.

In addition, the 1-2 suction hole may include a first hole disposed around the first region; And a second hole portion disposed around the first hole portion, and the first and second hole portions have a mutually symmetric shape.

In addition, the first hole part may include a 1-1 part extending along a periphery of the first area; And a portion 1-2 protruding from the portion 1-1 toward an edge of the auxiliary member, wherein the second hole portion comprises: a portion 2-1 extending along a periphery of the first hole portion; And a 2-2 part protruding from the 2-1 part toward the first hole part.

In addition, the first and second hole portions have a T-shape.

In addition, the 1-2 suction hole includes a third hole portion disposed in a corner region of the second region, and the third hole portion has a shape different from that of the first and second hole portions.

Further, the third hole portion has an L shape.

On the other hand, the via hole processing apparatus according to the embodiment includes a processing plate; An adsorption unit disposed under the processing plate; A jig disposed on the processing plate and having a plurality of first suction holes for adsorbing and supporting the workpiece; And a head portion disposed on the jig and irradiating laser light to a position where a via hole is formed of the workpiece, and the processing plate includes a plurality of second suction holes aligned on a vertical line with the first suction hole And, the center of the second suction hole is aligned on the same vertical line as the center of the first suction hole, the jig, the first region; And a second area surrounding the first area, wherein the first suction hole comprises: a 1-1 suction hole formed in the first area; And a 1-2 suction hole formed in the second region and having a shape different from that of the 1-1 suction hole, wherein the first region is a region overlapping a plurality of strip regions of the workpiece. , The second area is an outer area excluding the first area.

In addition, the 1-2 suction hole may include third and fourth hole portions disposed in a corner region of the second region; And first and second hole portions disposed in an area other than the corner area of the second area, and the first and second hole portions have different shapes from those of the third and fourth hole portions.

According to the present embodiment, by changing the shape of the suction hole formed in the jig, the suction area of the workpiece can be maximized without loss of suction power, and thus the flatness of the workpiece can be maintained.

In addition, according to the present embodiment, it is possible to improve the flatness of the workpiece disposed on the processing plate, and accordingly, the positional accuracy and shape uniformity of the via hole formed in the workpiece.

In addition, according to the present exemplary embodiment, it is possible to reduce the distribution of the size of the via hole compared to the related art, and thereby improve the reliability by improving the processing capability of the via hole.

In addition, according to the embodiment, the size ratio of the upper width and the lower width of the via hole may be reduced, and accordingly, the problem of a via short circuit caused by debris remaining at the bottom of the via hole during the via hole processing. Can be solved.

In addition, according to the embodiment, a suction hole having a shape capable of maximizing the suction power is formed in the edge region of the jig, and accordingly, the loss of suction power occurring in the outer region of the workpiece is minimized, so that the positioning accuracy and shape uniformity of the via hole Can improve.

1 is a block diagram illustrating a via hole processing apparatus according to an exemplary embodiment.
2 is a cross-sectional view showing in detail a partial configuration of the via hole processing apparatus of FIG. 1.
3 is a view showing an example of a workpiece according to the embodiment.
4 is a diagram showing the structure of a printed circuit board according to an embodiment.
5 is a plan view showing a processing plate and a jig according to a comparative example.
6 and 7 are diagrams showing examples of defective via holes according to a comparative example.
8 is a diagram showing an example of a failure of a jig according to a comparative example
9 is a plan view of a jig according to an embodiment.
10 is a view showing a processing plate according to the embodiment.
11 is a diagram illustrating a 1-1 suction hole disposed in a first area of a jig according to an exemplary embodiment.
12 is an enlarged view of a part of the first area of the jig shown in FIG. 11.
13 is an enlarged view of the 1-1 suction hole shown in FIG. 11.
14 and 15 are views illustrating a 1-2 suction hole formed in a second region of a jig according to an exemplary embodiment.
16 is a diagram illustrating a difference in scale of an outer area of a panel according to a comparative example.
17 is a diagram illustrating a difference in scale of an outer area of a panel according to an exemplary embodiment.
18 is a view showing a modified example of the 1-1 suction hole of the jig according to the embodiment.
19 is a view showing another modified example of the 1-1 suction hole of the jig.
20 is a diagram illustrating a printed circuit board according to an embodiment.

Hereinafter, exemplary embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but identical or similar elements are denoted by the same reference numerals regardless of reference numerals, and redundant descriptions thereof will be omitted. The suffixes "module" and "unit" for components used in the following description are given or used interchangeably in consideration of only the ease of preparation of the specification, and do not have meanings or roles that are distinguished from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, when it is determined that a detailed description of related known technologies may obscure the subject matter of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings, and all modifications included in the spirit and scope of the present invention It should be understood to include equivalents or substitutes.

Terms including ordinal numbers, such as first and second, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.

When a component is referred to as being "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. Should be. On the other hand, when a component is referred to as being "directly connected" or "directly connected" to another component, it should be understood that there is no other component in the middle.

Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, terms such as "comprises" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating a via hole processing apparatus according to an exemplary embodiment in a block diagram, and FIG. 2 is a cross-sectional view illustrating a configuration of a via hole processing apparatus of FIG. 1 in detail.

A via hole processing apparatus according to an embodiment will be described with reference to FIGS. 1 and 2.

1 and 2, the via hole processing apparatus may include a head unit 110, a processing plate 120, a jig 130, and a control unit 140.

The head unit 110 may generate a laser light on the workpiece 200 disposed on the processing plate 120, for example, a panel to form a via hole VH in the workpiece 200. have.

To this end, the head unit 110 may include a laser light source 112, a light source moving unit 114 and a lens unit 116.

The laser light source 112 emits laser light. The laser light source 112 may also be referred to as a laser oscillator. The laser light source 112 may emit heating light according to a CO ₂ continuous wave laser. In addition, the laser light source 112 may include a laser drill such as an excimer or a YAG laser (Nd:YAG). In this case, the wavelength of light generated from the laser light source 112 may be, for example, approximately 0.8 μm to 11 μm, but is not limited thereto.

In addition, the laser light source 112 may emit processing light for performing a via hole processing operation in the via hole formation region. For example, the laser light source 112 may emit a processed beam according to a pulse laser. Here, the processed light may have a pulse width in the range of milliseconds to femtoseconds. Here, the via hole VH refers to a hole penetrating the substrate, and may mean a hole for electrical connection between different layers without inserting separate components.

The laser light source 112 may include one light source that generates processing light for processing the via hole VH. Alternatively, the laser light source 112 may include a plurality of light sources each for generating processing light for processing the via hole VH and heating light for heating the workpiece 200. In addition, the laser light source 112 may include a plurality of light sources that generate a plurality of processing lights for simultaneously processing the via holes VH in a plurality of regions.

Preferably, the laser light source 112 may be a CO ₂ laser light source with a wavelength of 9.5 μm.

The light source moving unit 114 may move the position of the laser light generated from the laser light source 112. Preferably, the light source moving unit 114 may change the direction of laser light generated from the laser light source 112. The light source moving unit 114 may include one or two or more reflectors. In addition, the light source moving unit 114 may be configured as a scanner including a galvanometer having two axes of the X-axis and the Y-axis, or a three-axis galvano mirror of the X-axis, Y-axis and Z-axis. Here, although not shown in the drawing, a separate branch (not shown) may be disposed between the laser light source 112 and the light source moving unit 114, and based on this, a two-axis via hole processing having two optical systems You can also configure the device.

The lens unit 116 may focus the laser light whose position and direction are switched by the light source moving unit 114. To this end, the lens unit 116 may include a lens into which laser light whose irradiation direction is changed by the operation of a galvanometer constituting the light source moving unit 114 is incident. For example, the lens unit 116 may be configured as an f? lens, but is not limited thereto.

That is, the laser light source 112, the light source moving part 114, and the lens part 116 constitute the head part 110, and accordingly, the laser light for processing the via hole (VH) in the workpiece 200 Can be investigated. In this case, the head unit 110 may be configured as one, but is not limited thereto. For example, the head unit 110 may be composed of two or more, and thus productivity may be increased.

The workpiece 200 is disposed on the processing plate 120. For example, a panel on which the via hole VH is to be formed may be disposed on the processing plate 120. The panel constituting the workpiece 200 may be a copper clad laminate (CCL) including an insulating layer in which a copper foil layer is stacked, but is not limited thereto. For example, the panel constituting the workpiece 200 may be formed of a flexible copper clad laminate (FCCL).

A plurality of second suction holes 124 are formed in the processing plate 120. The processing plate 120 may include a plurality of second suction holes spaced apart from each other in a horizontal axis direction and a vertical axis direction.

In addition, a jig 130 may be coupled to an upper portion of the processing plate 120. The jig 130 may be detachable from the processing plate 120. For example, the upper surface of the processing plate 120 may include a coupling region (not shown) for coupling the jig 130, and the jig 130 may be detachably coupled to the coupling region. At this time, a plurality of first suction holes 132 are formed in the jig 130.

The jig 130 is a plate-shaped auxiliary member disposed between a processing plate having an adsorption unit disposed below and a workpiece.

Accordingly, the jig 130 described below may be referred to as an auxiliary member, and the'first jig layer, the second jig layer, the third jig layer', and the like are a first auxiliary member, a second auxiliary member, and a third auxiliary member. It can also be called absence.

Meanwhile, when the jig 130 is mounted on the processing plate 120, the plurality of first suction holes 132 may overlap the plurality of second suction holes 124 in a vertical direction. For example, the centers of the plurality of first suction holes 132 may be aligned with the centers of the plurality of second suction holes 124 in a vertical direction.

In addition, the number of first suction holes 132 formed in the jig 130 may correspond to the number of second suction holes 124 formed in the processing plate 120. In addition, in the first suction hole 132, the second suction holes 124 may be aligned 1:1. For example, the jig 130 may be disposed on the processing plate 120 such that the first suction hole 132 is aligned 1:1 with the second suction hole 124 in the vertical direction.

The second suction hole 124 may have a circular shape. In addition, the first suction hole 132 may have various shapes according to embodiments. The shape and standard of the first suction hole 132 will be described in more detail below.

Meanwhile, the processing plate 120 may include an adsorption unit 122. The adsorption part 122 may be disposed in the processing plate 120. Preferably, the adsorption part 122 may be disposed under the processing plate 120. More preferably, the adsorption unit 122 may be disposed under the plurality of second suction holes 124 formed in the processing plate 120.

The adsorption unit 122 may suck air through the second suction hole 124. Preferably, the adsorption unit 122 suctions air through the second suction hole 124 and the first suction hole 132 to adsorb and fix the workpiece 200 disposed on the jig 130. have. To this end, the adsorption unit 122 may include a suction fan (not shown), but is not limited thereto.

The controller 140 may control the overall operation of the via hole processing apparatus. That is, the controller 140 may control driving by controlling each component constituting the via hole processing apparatus.

To this end, the controller 140 may include a separate program for controlling each component, or a storage medium (not shown) for storing data generated during driving of each component. The storage medium constituting the control unit 140 may store processing condition information including the location or shape of the via hole VH to be formed in the workpiece 200.

The controller 140 may control at least one of the light source moving unit 114, the lens unit 116, and the processing plate 120 using the stored processing condition information. For example, the control unit 140 uses the processing condition information to determine at least one of the light source moving unit 114, the lens unit 116, and the processing plate 120 in an upward direction, a downward direction, a left direction, and a right direction, etc. You can control it to move and operate. In addition, the controller 140 may adjust the output of the laser light source 112 according to the size (depth or width, etc.) of the via hole VH or the material of the workpiece 200.

Referring to FIG. 2, a processing plate 120 is disposed on the adsorption part 122. And, the jig 130 is disposed on the processing plate 120. In addition, the workpiece 200 is disposed on the jig 130. At this time, the jig 130 may be formed of epoxy. Alternatively, the jig 130 may be formed of a metal material such as copper (Cu), aluminum (Al), and SUS, but is not limited thereto.

Looking at the operation of the via hole processing apparatus as described above, the jig 130 may be coupled to the processing plate 120 in which the suction unit 122 is disposed below. At this time, a plurality of first suction holes 132 are formed in the jig 130. In addition, a plurality of second suction holes 124 are formed in the processing plate 120.

In addition, the jig 130 may be disposed on the processing plate 120 such that the plurality of first suction holes 132 and the second suction holes 124 are aligned in a vertical direction. That is, each of the plurality of second suction holes 124 may overlap with each of the plurality of first suction holes 132 in the vertical direction. More preferably, the centers of each of the plurality of second suction holes 124 may be aligned with the centers of the plurality of first suction holes 132 in a vertical direction.

In addition, the workpiece 200 may be disposed on the jig 130. At this time, the adsorption unit 122 sucks air through the first suction hole 132 and the second suction hole 124, and accordingly, the workpiece 200 is applied to the jig 130 by the suction force according to the air suction. ) Can be fixed on adsorption.

3 is a view showing an example of a workpiece according to the embodiment.

Referring to FIG. 3, the workpiece 200 may be a panel PNL in the form of a copper clad laminate (CCL). In this case, the width of the panel PNL in the horizontal direction may be 415 to 430 mm. In addition, the width of the panel PNL in the vertical direction may be 510 to 550 mm. Here, the width in the horizontal direction of the panel PNL may be the width in the minor axis direction, and the width in the vertical direction may be the width in the major axis direction.

In this case, the panel PNL may be divided into a plurality of strips 210. The plurality of strips 210 may be spaced apart from each other in a horizontal direction and a vertical direction within the panel PNL. For example, one panel PNL may be divided into 16 strips 210. That is, one panel PNL may be divided into two regions in a horizontal direction and eight regions in a vertical direction, and each of the divided regions may constitute the strip 210.

Accordingly, the workpiece 200 may include a first region 201 in which a plurality of strips 210 are disposed and a second region 202 excluding the first region 201. The second area 202 may be a peripheral area of the first area 201. Preferably, the second region 202 may be an outer region of the workpiece 200. Preferably, the second region 202 may be an edge region of the workpiece 200.

In addition, each strip 210 may be divided into a plurality of units 220. For example, one strip 210 may be divided into 1,275 units 220. At this time, each unit 220 may have a width of 3 mm in the horizontal direction and a width of 2 mm in the vertical direction. Meanwhile, each of the units 220 may constitute one printed circuit board. In other words, one panel PNL may be divided into 16 strips 210 and 20,400 units 220.

Meanwhile, a plurality of via holes VH having a predetermined size may be formed in one unit 220. For example, a plurality of via holes VH having an upper width of 80 μm and a lower width of 60 μm may be formed in one unit 220.

At this time, about 150 via holes VH are formed in one unit 220. Accordingly, one panel PNL may include 20,400 units 220 in which about 150 via holes VH are formed. In conclusion, more than 3 million via holes VH are formed in one panel PNL.

In addition, in recent years, as circuit wiring becomes more complex and highly integrated, the number of via holes VH is gradually increasing. Accordingly, as at least 3 million via holes VH are formed in one panel PNL, the flatness of the panel PNL is maintained until the formation of the 3 million or more via holes VH is completed. It is important. That is, during laser processing for forming via holes, heat is applied to the panel PNL, and accordingly, the surface temperature of the panel PNL rises to a maximum of 700°C. At this time, the panel PNL repeatedly expands and contracts, and accordingly, wrinkles are generated on the surface of the panel PNL, and via holes ( The location or shape of VH) will be different. Therefore, it is necessary to minimize problems such as wrinkles occurring in the panel PNL to maintain the flatness of the panel PNL.

4 is a diagram showing the structure of a printed circuit board according to an embodiment.

Referring to FIG. 4, the printed circuit board may be one unit 220 divided by the panel PNL.

The printed circuit board includes a via 320 disposed in a via hole VH penetrating the insulating layer 310 and the insulating layer 310, an upper land 330 disposed above the via 320, and the It may include a lower land 340 disposed under the via 320.

In this case, the printed circuit board may be a multilayer laminated board. In addition, when the printed circuit board is a multilayer laminated substrate, FIG. 4 may show any one of the multilayered laminated substrates. Preferably, FIG. 4 may show a central layer disposed at the center in the multilayered substrate. In addition, in FIG. 4, it has been described that the land disposed on the surface of the via 320 having a wide width is the upper land 330, and the land disposed on the surface having a narrow width is the lower land 340, This could be interchangeable.

The insulating layer 310, the upper land 330, and the lower land 340 may be part of the copper clad laminate constituting the panel PNL. Preferably, the insulating layer 310 may be an insulating member constituting a copper clad laminate. In addition, a portion of the upper land 330 and the lower land 340 may be copper foil layers stacked above and below the insulating member, respectively.

The insulating layer 310 is a substrate on which an electric circuit capable of changing wiring is arranged, and an insulation capable of forming an upper land 330, a lower land 340, and a circuit pattern (not shown) formed as such Prints made of materials, wiring boards and insulating substrates may all be included.

The insulating layer 310 may be rigid or flexible. For example, the insulating layer 310 may include glass or plastic. In detail, the insulating layer 310 includes a chemically strengthened/semi-tempered glass such as soda lime glass or aluminosilicate glass, or polyimide (PI), polyethylene terephthalate (PET). , Reinforced or flexible plastics such as propylene glycol (PPG) polycarbonate (PC), or sapphire may be included.

In addition, the insulating layer 310 may include a photoisotropic film. For example, the insulating layer 310 may include Cyclic Olefin Copolymer (COC), Cyclic Olefin Polymer (COP), photoisotropic polycarbonate (PC), or photoisotropic polymethylmethacrylate (PMMA).

Also, the insulating layer 310 may be bent while having a partially curved surface. That is, the insulating layer 310 may be bent while partially having a flat surface and partially having a curved surface. In detail, the insulating layer 310 may be bent while its end has a curved surface or may have a surface including a random curvature, and may be bent or bent.

In addition, the insulating layer 310 may be a flexible substrate having flexible characteristics. Further, the insulating layer 310 may be a curved or bent substrate. In this case, the insulating layer 310 represents an electrical wiring connecting circuit components based on a circuit design as a wiring diagram, and an electrical conductor may be reproduced on an insulating material. In addition, the insulating layer 310 may mount electric components and form wirings that circuitly connect them, and mechanically fix components other than the electrical connection function of the components.

An upper land 330 and a lower land 340 may be disposed on the surface of the insulating layer 310. In this case, the upper land 330 and the lower land 340 may be formed together with a circuit pattern (or wiring, not shown) that is disposed on the surface of the insulating layer 310 to transmit a novel signal. The upper land 330 and the lower land 340 may be formed of a metal material having high electrical conductivity. To this end, the upper land 330 and the lower land 340 are gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It may be formed of at least one metal material selected from among. In addition, the upper land 330 and the lower land 340 are gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), zinc ( Zn) may be formed of a paste or solder paste including at least one metal material selected from among). Preferably, the upper land 330 and the lower land 340 may be formed of copper (Cu) having high electrical conductivity and relatively low cost.

The upper land 330 and the lower land 340 are a conventional additive process, a subtractive process, a Modified Semi Additive Process (MSAP), and a semi-additive process (SAP), which are conventional printed circuit board manufacturing processes. Additive Process) is possible, and detailed descriptions are omitted here.

Meanwhile, a via 320 penetrating the upper and lower surfaces of the insulating layer 310 is disposed in the insulating layer 310. The via 320 may be formed by filling the inside of the via hole VH penetrating the upper and lower surfaces of the insulating layer 310 with a metal material.

As described above, the via hole VH may be formed by a laser processing method. That is, the via hole VH may be formed by a via hole processing apparatus using a CO ₂ laser method.

In addition, the via 320 is any one metal material selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd) inside the via 320 It can be formed by filling. At this time, the filling of the metallic material may use any one of electroless plating, electroplating, screen printing, sputtering, evaporation, ink jetting, and dispensing, or a combination thereof. have.

Prior to the description of the present embodiment, a comparative example (conventional technique) compared to the present embodiment will be described.

5 is a plan view showing a processed plate and a jig according to a comparative example, FIGS. 6 and 7 are views showing a defective example of a via hole according to the comparative example, and FIG. 8 is a view showing a defective example of a jig according to the comparative example . Hereinafter, problems of the comparative example will be described with reference to FIGS. 5 to 8.

5A, a plurality of second suction holes 410 are formed in the processing plate 400 according to the comparative example. At this time, the plurality of second suction holes 410 have a circular shape. That is, the second suction hole 410 has a circular shape having a first diameter d1.

In addition, the plurality of second suction holes 410 are disposed to be spaced apart by a first distance d2 in the horizontal axis direction. In addition, the plurality of second suction holes 410 are disposed to be spaced apart by a second distance d3 in the vertical axis direction.

At this time, the first diameter d1 of the second suction hole 410 is 3 mm. In addition, the first distance d2 of the second suction hole 410 in the horizontal axis direction is 15 mm. In addition, the second distance d3 of the second suction hole 410 in the vertical axis direction is 15 mm. That is, in the processing plate 400 in the comparative example, the second suction holes 410 having a diameter of 3 mm are disposed 15 mm apart in the horizontal axis direction and the vertical axis direction. On the other hand, the second suction hole 410 is formed by being fixed to the processing plate 400, the operator cannot arbitrarily change the size, position, and number.

5B, a plurality of first suction holes 510 are formed in the jig 500 according to the comparative example. At this time, the plurality of first suction holes 510 have a circular shape. That is, the first suction hole 510 has a circular shape having a second diameter d4.

In addition, the plurality of first suction holes 510 are disposed to be spaced apart by a third distance d5 in the horizontal axis direction. In addition, the plurality of first suction holes 510 are disposed to be spaced apart by a fourth distance d6 in the vertical axis direction.

At this time, the second diameter d4 of the first suction hole 510 is 1.5 mm. In addition, the third distance d5 of the first suction hole 510 in the horizontal axis direction is 15 mm. In addition, the fourth distance d6 of the first suction hole 510 in the vertical axis direction is 15 mm. That is, in the jig 500 in the comparative example, the first suction holes 510 having a diameter of 1.5 mm are disposed 15 mm apart in the horizontal axis direction and the vertical axis direction, respectively.

Here, the first to fourth distances d2, d3, d5, and d6 mean a distance (also referred to as a pitch) between the center and the center of the adjacent hole.

As described above, the first suction hole 510 in the comparative example has a circular shape having a diameter of 1.5 mm. Accordingly, the distance between the adjacent first suction holes 510 is 13.5 mm. That is, in the comparative example, one first suction hole 510 adsorbs and fixes the panel PNL within a range of 13.5 mm (eg, including the left and right directions of the hole in the horizontal direction) based on the center of the hole. However, the diameter of one first suction hole 510 is only 1.5 mm, and accordingly, it is difficult to stably suction and fix the above range with a hole of 1.5 mm. In addition, if the diameter of the first suction hole 510 is simply increased, there is a problem that the overall suction power is lowered due to excessive ventilation.

6 and 7, in the printed circuit board according to the comparative example, a via hole deformation defect, a via hole alignment defect, and a land alignment defect occur.

That is, referring to FIG. 7A, in the printed circuit board according to the comparative example, a deformation defect of the via hole occurs due to insufficient suction power or a suction area of the jig 500. That is, the center of the upper and the lower center of the via hole VH should coincide with each other. When the center of the upper portion and the center of the lower portion of the via hole VH coincide, it means that the shape of the via hole VH has an ideal trapezoidal shape. However, according to the comparative example, the center L1 of the upper portion and the center L2 of the lower portion of the via hole VH are shifted by an interval of'a' rather than on the same line. That is, the shape of the via hole VH according to the comparative example has a parallelogram shape rather than a trapezoid shape due to laser eccentricity.

In addition, referring to FIG. 7B, in the printed circuit board according to the comparative example, a via hole alignment failure occurs due to a lack of suction power or a suction area of the jig 500. That is, the center of the via hole VH must be aligned with the centers of the upper and lower lands on the same line. When the center of the via hole VH and the center of the upper and lower lands are aligned, it means that the via hole is accurately positioned at the center of the upper and lower lands. However, according to the comparative example, the center L4 of the via hole VH is shifted by an interval'b' from the center L3 of the lower land and the upper land. That is, the via hole VH according to the comparative example is formed to be skewed in the outer portion of the upper land and the lower land, not the center.

In addition, referring to FIG. 7C, in the printed circuit board according to the comparative example, land alignment failure occurs due to insufficient suction force or suction area of the jig 500. That is, the center of the upper land and the center of the lower land must be aligned on the same line. However, according to the comparative example, a separation distance exists between the center L5 of the upper land and the center of the lower land L6 by the'c' interval.

And, the above-described defects cause the following problems. The occurrence of a shift between the via hole (VH) and the land, such as a via hole deformation defect or a via hole defect, decreases reliability due to the occurrence of noise in the electrical signal due to the adjacent pattern, and increases the path of the electrical signal. Efficiency decreases, and in the case of via holes for heat dissipation, not electric circuits, component performance deteriorates due to lower heat dissipation efficiency. In addition, the occurrence of a shift between lands and lands occurs when the overlapping positions in the vertical direction are different, the inductance decreases as the overlap area decreases, and thus the efficiency of the capacitance is low, resulting in a problem that the transmission efficiency decreases.

In addition, referring to FIG. 8, in the comparative example, when the jig 500 is used for a certain number of times or more, there is a problem that a cavity of 40 μm to 80 μm is generated as in the area A, and carbonization (organic matter) as in the area B. And there is a problem that debris such as metal materials (Cu, etc.) accumulate.

In addition, the jig 500 in the comparative example includes a suction hole formed below the first region 201 of the workpiece 200 and a suction hole formed below the second region 202 of the workpiece 200. The holes had the same shape. At this time, the suction hole has a design for increasing the suction power only for the region where the strip 210 of the workpiece 200 is located, and accordingly, in the second region 202 compared to the suction power for the first region 201 Had a problem that the suction power of was relatively low.

Accordingly, in the embodiment, the shape of the suction hole formed in the jig is changed, so that the suction area can be maximized while minimizing the loss of suction power due to an increase in the area of the suction hole.

In addition, in the embodiment, not only the first region 201 of the workpiece 200 but also the second region 202 corresponding to the outer region can be increased in suction power, thereby improving product reliability.

9 is a plan view of a jig according to an embodiment.

Referring to FIG. 9, a plurality of first suction holes 730 are formed in the jig 700.

In this case, the jig 700 may be divided into a first region R1 and a second region R2 other than the first region R1. The first region R1 of the jig 700 may correspond to the first region 201 of the workpiece 200. In other words, the first region R1 of the jig 700 may be aligned with the first region 201 of the workpiece 200 in a vertical direction. That is, the first region R1 of the jig 700 may provide a suction force to the first region 201 of the workpiece 200.

The second region R2 of the jig 700 may correspond to the second region 202 of the workpiece 200. In other words, the second region R2 of the jig 700 may be aligned with the second region 202 of the workpiece 200 in a vertical direction. That is, the second region R2 of the jig 700 may provide a suction force to the second region 202 of the workpiece 200.

Preferably, the first region R1 of the jig 700 may be a central region, and the second region R2 may be an outer region or an edge region of the jig 700 disposed surrounding the central region.

The second region R2 may be divided into a plurality of regions.

Preferably, the second area R2 may include a first outer area X1, a second outer area X2, a third outer area Y1, and a fourth outer area Y2. In addition, the second region R2 may include a first corner region C1, a second corner region C2, a third corner region C3, and a fourth corner region C4.

The first outer region X1 may be an outer region located below the first region R1. The second outer area X2 may be an area located above the first area R1. That is, the first and second outer regions X1 and X2 may be regions extending long in the first direction. Preferably, the first and second outer regions X1 and X2 may be regions extending in the X-axis direction.

The third outer area Y1 may be an outer area located to the left of the first area R1. The fourth outer area Y2 may be an area located to the right of the first area R1. That is, the third and fourth outer regions Y1 and Y2 may be regions extending in a second direction perpendicular to the first direction. Preferably, the third and fourth outer regions Y1 and Y2 may be regions extending in the Y-axis direction.

The first corner region C1 may be a corner region between the first outer region X1 and the third outer region Y1. The second corner region C2 may be a corner region between the first outer region X1 and the fourth outer region Y2. The third corner region C3 may be a corner region between the second outer region X2 and the third outer region Y1. The fourth corner region C4 may be a corner region between the second outer region X2 and the fourth outer region Y2.

In this case, a first suction hole 730 may be formed in the jig 700. In addition, the first suction hole 730 includes a 1-1 suction hole 710 formed in the first region R1 and a 1-2 suction hole 720 formed in the second region R2. Can include.

Here, the 1-1st suction hole 710 and the 1-2nd suction hole 720 may have different shapes. That is, as the 1-1th suction hole 710 is disposed in the central region, it may have a shape capable of maximizing the suction power in the central region.

In addition, as the 1-2th suction hole 720 is disposed in the outer region, it may have a shape capable of maximizing the suction power in the outer region.

Further, the 1-2 suction hole 720 includes suction holes formed in the first to fourth outer regions X1, X2, Y1, and Y2, and the first to fourth corner regions C1, C2, C3, and C4. The suction holes formed in) may have different shapes.

Hereinafter, the shapes of the 1-1st suction hole 710 and the 1-2nd suction hole 720 will be described in more detail.

10 is a view showing a processing plate according to the embodiment.

Referring to FIG. 10A, a plurality of second suction holes 610 are formed in the processing plate 600. In this case, the plurality of second suction holes 610 may have a circular shape. That is, the second suction hole 610 may have a circular shape having a first diameter D1.

In addition, the plurality of second suction holes 610 are disposed to be spaced apart by a first distance D2 in the horizontal axis direction. In addition, the plurality of second suction holes 610 are disposed to be spaced apart by a second distance D3 in the vertical axis direction.

In this case, the first diameter D1 of the second suction hole 610 may be 3 mm. In addition, the first distance D2 of the second suction hole 610 in the horizontal axis direction may be 15 mm. In addition, the second distance D3 of the second suction hole 610 in the vertical axis direction may be 15 mm. That is, in the processing plate 600 according to the embodiment, a plurality of second suction holes 610 having a diameter of 3 mm may be disposed 15 mm apart from each other in the horizontal axis direction and the vertical axis direction. Meanwhile, the second suction hole 610 is formed by being fixed to the processing plate 600 and cannot be arbitrarily changed in size, position, and number.

11 is a diagram illustrating a 1-1 suction hole disposed in a first area of a jig according to an exemplary embodiment.

Referring to FIG. 11, a plurality of 1-1 suction holes 710 are formed in the first region R1 of the jig 700 according to the embodiment. In this case, the plurality of 1-1 suction holes 710 may have a shape different from that of the plurality of second suction holes 610. Preferably, the plurality of 1-1 suction holes 710 may have a'+' shape. The plurality of 1-1 suction holes 710 pass through the center of the hole and the first part 712 (refer to FIG. 13) passing through the center of the hole and a second part perpendicular to the first part 712. Portion 714 (see FIG. 13). The first part 712 may pass through the center of the 1-1st suction hole 711 in the horizontal direction. The first portion 712 may extend in the horizontal direction. The first portion 712 may have a first length D4. The second portion 714 may pass through the center of the hole in the vertical direction. That is, the second portion 714 may extend in a vertical direction perpendicular to the first portion 712. The second portion 714 may have a second length D5. In this case, the lengths of the first portion 712 and the second portion 714 may be the same. Preferably, the length of the first portion 712 may be 0.9 to 1.1 times the length of the second portion 714.

The lengths D4 and D5 of the first portion 712 and the second portion 714 may be 3.5mm to 11mm, respectively. Preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 4.0mm to 9mm, respectively. More preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 4.5mm to 7.5mm, respectively.

At this time, when the lengths (D4, D5) of the first part 712 and the second part 714 are less than 3.5mm, air from the adsorption part 122 may not be sufficiently delivered (that is, the breathability decreases). In this way, it is not possible to provide a suction force for stably adsorbing and supporting the panel PNL. In addition, if the lengths (D4, D5) of the first portion 712 and the second portion 714 are greater than 11 mm, suction loss may occur due to excessive ventilation due to an increase in the overall size of the 1-1 suction hole 710. I can.

In addition, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 1.1 to 3.5 times the diameter of the second suction hole 610, respectively. Preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 1.3 to 3 times the diameter of the second suction hole 610, respectively. More preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 1.5 to 2.5 times the diameter of the second suction hole 610, respectively.

At this time, when the lengths (D4, D5) of the first part 712 and the second part 714 are less than 1.1 times the diameter of the second suction hole 610, the air from the adsorption part 122 is sufficiently transmitted. It may not be possible (that is, air permeability may be deteriorated), and accordingly, a suction force for stably adsorbing and supporting the panel PNL is not provided. In addition, if the lengths D4 and D5 of the first portion 712 and the second portion 714 are larger than 3.5 times the diameter of the second suction hole 610, the overall size of the 1-1 suction hole 710 Inhalation loss may occur due to excessive ventilation due to the increase.

In addition, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.2 to 0.7 times the pitch between the plurality of second suction holes 610, respectively. Preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.25 times to 0.6 times the pitch between the plurality of second suction holes 610, respectively. More preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.3 times to 0.5 times the pitch between the plurality of second suction holes 610, respectively.

At this time, when the lengths D4 and D5 of the first portion 712 and the second portion 714 are less than 0.2 times the pitch between the plurality of second suction holes 610, the air from the adsorption unit 122 May not be sufficiently delivered (ie, air permeability may be deteriorated), and thus, a suction force for stably adsorbing and supporting the panel PNL is not provided. In addition, if the lengths D4 and D5 of the first portion 712 and the second portion 714 are larger than 0.7 times the pitch between the plurality of second suction holes 610, the 1-1 suction hole 710 Inhalation loss may occur due to excessive ventilation due to an increase in the overall size of the body.

In addition, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.2 to 0.7 times the pitch between the plurality of 1-1 suction holes 710, respectively. Preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.25 times to 0.6 times the pitch between the plurality of 1-1 suction holes 710, respectively. More preferably, the lengths D4 and D5 of the first portion 712 and the second portion 714 may be 0.3 times to 0.5 times the pitch between the plurality of 1-1 suction holes 710, respectively.

In addition, the plurality of 1-1 suction holes 710 are disposed to be spaced apart by a third distance D6 in the horizontal axis (X axis) direction. In addition, the plurality of 1-1 suction holes 710 are disposed to be spaced apart by a fourth distance d7 in the vertical axis (Y axis) direction. That is, the third distance D6 corresponding to the horizontal pitch of the plurality of 1-1 suction holes 710 may be 15 mm. In addition, the fourth distance D7 corresponding to the vertical pitch of the plurality of 1-1 suction holes 710 may be 15 mm. That is, the pitch of the 1-1 suction hole 710 and the pitch of the second suction hole 610 may be the same. In other words, in a state in which the jig 700 is coupled to the processing plate 400, the center of the 1-1 suction hole 710 and the center of the second suction hole 610 may be aligned on the same vertical line. have.

In the embodiment, as described above, the shape of the 1-1th suction hole 710 is changed from the existing circular shape to the'+' shape. At this time, when the 1-1 suction hole 710 has a'+' shape, the maximum suction power can be provided even with the minimum hole area, and accordingly, the flatness of the panel PNL can be kept constant. I can.

FIG. 12 is an enlarged view of a part of the first region of the jig shown in FIG. 11, and FIG. 13 is an enlarged view of the 1-1 suction hole shown in FIG. 11.

12 and 13, the plurality of 1-1 suction holes 710 may have a shape different from that of the plurality of second suction holes 610. Preferably, the plurality of 1-1 suction holes 710 may have a'+' shape or a'X' shape. The plurality of 1-1 suction holes 710 are a first portion 712 passing through the center of the hole and a second portion 714 passing through the center of the hole and perpendicular to the first portion 712 with respect to the center of the hole. It may include. The first part 712 may pass through the center of the hole in the horizontal direction. The first portion 712 may extend in the horizontal direction. The first portion 712 may have a first length D4. The second portion 714 may pass through the center of the hole in the vertical direction. That is, the second portion 714 may extend in a vertical direction perpendicular to the first portion 712. The second portion 714 may have a second length D5. In this case, the lengths of the first portion 712 and the second portion 714 may be the same.

In this case, it is preferable that the first portion 712 and the second portion 714 cross each other at right angles. That is, when the first portion 712 and the second portion 714 intersect each other at an angle between 1° and 89°, which is not a right angle, it was confirmed that adsorption was concentrated in a specific area. That is, if the first part 712 and the second part 714 are not perpendicular, the angle between the first part 712 and the second part 714 will be 90 degrees or less in some areas, and other parts In the area, it appears larger than 90 degrees. At this time, the suction power is concentrated in an area of 90 degrees or less, and accordingly, the suction power is reduced in an area greater than 90 degrees. Accordingly, in the embodiment, the angle between the first portion 712 and the second portion 714 is made to have a right angle. Preferably, the angle between the first portion 712 and the second portion 714 has a right angle within an error range of 5 degrees.

In this case, the first portion 712 may have a first width W1. Also, the second portion 714 may have a second width W2. In this case, the first width W1 and the second width W2 may be the same. For example, the first width W1 and the second width W2 may be 0.5 mm to 1.5 mm, respectively. Preferably, the first width W1 and the second width W2 may be 0.8mm to 1.0mm.

In addition, the first width W1 and the second width W2 may be 0.15 to 0.5 times the diameter of the second suction hole 610. Preferably, the first width W1 and the second width W2 may be 0.25 times to 0.35 times the diameter of the second suction hole 610.

Meanwhile, the separation distance D9 between the first portion 712 of the adjacent 1-1 suction hole 710 may be 7.5 mm to 10.5 mm. In addition, the separation distance D8 between the second portions 714 of the adjacent 1-1 suction holes 710 may be 7.5 mm to 10.5 mm.

Meanwhile, the 1-1st suction hole 710 in the embodiment includes a first portion 712 and a second portion 714.

The first portion 712 and the second portion 714 overlap the second suction hole 610 in a vertical direction and include an overlap region 716 where the centers 718 meet each other.

In addition, the area of the overlap area 716 is preferably smaller than the area of the second suction hole 610 disposed below. That is, if the area of the overlap area 716 is larger than the area of the second suction hole 610, a suction power loss occurs accordingly. In addition, if the area of the overlap region 716 is too small, suction power may not be normally transmitted. Accordingly, in the embodiment, the first width W1 and the second width W2 of the first portion 712 and the second portion 714 as described above are determined, so that the optimal overlap area 716 is determined. do. Accordingly, the entire overlapping region 716 may overlap the second suction hole 610 located at the lower portion in the vertical direction.

According to the present embodiment, by changing the shape of the suction hole formed in the jig, the suction area of the workpiece can be maximized without loss of suction power, and thus the flatness of the workpiece can be maintained.

In addition, according to the present embodiment, it is possible to improve the flatness of the workpiece disposed on the processing plate, and accordingly, the positional accuracy and shape uniformity of the via hole formed in the workpiece.

In addition, according to the present exemplary embodiment, it is possible to reduce the distribution of the size of the via hole compared to the related art, and thereby improve the reliability by improving the processing capability of the via hole.

In addition, according to the embodiment, the size ratio of the upper width and the lower width of the via hole can be reduced, and accordingly, the problem of the via short circuit caused by debris remaining at the bottom of the via hole during the via hole processing. Can be solved.

On the other hand, when the same cross-shaped suction hole as the 1-1 suction hole 710 is formed in the second region R2 of the jig 700, the second region R2 compared to the first region R1 The suction power of is low, and accordingly, a suction leak in the second area 202 of the workpiece 200 may occur. In addition, by a suction leak in the second region 202 of the workpiece 200, wrinkles are generated not only in the second region 202 of the workpiece 200, but also in the first region 201 to form a via hole. It may cause defects. Accordingly, in the embodiment, a 1-2 suction hole 720 having a shape different from that of the first region R1 is formed in the second region R2, thereby minimizing suction leakage in the second region. Make it possible.

14 and 15 are views illustrating a 1-2 suction hole formed in a second region of a jig according to an exemplary embodiment.

Preferably, FIG. 14 shows a 1-2 suction hole 720 formed in the first to fourth outer regions X1, X2, Y1, and Y2 in the second region R2 of the jig 700. . In addition, FIG. 15 illustrates a 1-2 suction hole 720 formed in the first to fourth corner regions C1, C2, C3, and C4 in the second region R2 of the jig 700.

The 1-2 suction hole 720 may include a first hole portion 721 and a second hole portion 722 formed in the first to fourth outer regions X1, X2, Y1, and Y2. In addition, the 1-2 suction hole 720 may include a third hole portion 723 and a fourth hole portion 724 formed in the first to fourth corner regions C1, C2, C3, and C4.

The first hole portion 721 may be disposed to surround the first region R1. That is, the first hole portion 721 may be disposed adjacent to the first region R1 in each of the first to fourth outer regions X1, X2, Y1, and Y2.

In addition, the second hole portion 722 may be disposed surrounding the first hole portion 721. That is, the second hole portion 722 may be disposed adjacent to the edge portion of the jig 700 in each of the first to fourth outer regions X1, X2, Y1, and Y2.

A plurality of first hole portions 721 may be disposed in the first to fourth outer regions X1, X2, Y1, and Y2 and are spaced apart from each other by a predetermined interval.

The first hole part 721 protrudes toward the edge of the jig 700 from the 1-1 part 721a and the 1-1 part 721a extending along the surrounding area of the first area R1 A 1-2 part 721b may be included.

That is, the first hole part 721 may have a T-shape including the 1-1 part 721a and the 1-2 part 721b. However, the first hole portion 721 may be disposed such that the first-2 portion 721b corresponding to the protrusion faces the edge of the jig 700. In other words, the first hole portion 721 may be disposed such that the 1-2 portion 721b corresponding to the protrusion faces the second hole portion 722.

For example, the 1-2 part 721b of the first hole part 721 disposed in the first outer region X1 may be disposed to face downward. The 1-2th portion 721b of the first hole part 721 disposed in the second outer region X2 may be disposed to face upward. The 1-2 part 721b of the first hole part 721 disposed in the third outer region Y1 may be disposed to face the left direction. The 1-2 part 721b of the first hole part 721 disposed in the fourth outer region Y2 may be disposed to face the right direction.

The second hole part 722 may have a symmetrical shape with the first hole part 721.

Preferably, the second hole part 722 is the first part of the jig 700 from the 2-1 part 722a and the 2-1 part 722a extending along the edge part of the jig 700. A 2-2 part 722b protruding toward the first region R1 may be included.

That is, the second hole portion 722 may have a T-shape including the 2-1 part 722a and the 2-2 part 722b. However, the second hole portion 722 may be disposed so that the second-2 portion 722b corresponding to the protrusion faces the first region R1 rather than the edge of the jig 700. In other words, the second hole portion 722 may be disposed so that the second-2 portion 721b corresponding to the protrusion faces the first hole portion 721.

For example, the 2-2 part 721b of the second hole part 722 disposed in the first outer area X1 may be disposed to face upward. The 2-2 part 722b of the second hole part 7201 disposed in the second outer area X2 may be disposed to face downward. The 2-2 part 721b of the second hole part 722 disposed in the third outer region Y1 may be disposed to face the right direction. The 2-2 part 722b of the second hole part 722 disposed in the fourth outer area Y2 may be disposed to face the left direction.

Accordingly, in an embodiment, the 1-1 part 721a and 2-1 part 722a of the first hole part 721 and the second hole part 722 are around the first area R1 and the By extending and disposing along the edge of the jig 700, it is possible to minimize a suction leak occurring in a region adjacent to the first region R1 and at an edge portion of the jig 700.

Meanwhile, the length D9 of the first-first portion 721a and the length D11 of the second-first portion 722a may be the same. The width of the 1-1 part 721a and the width of the 2-1 part 722a may be the same.

Preferably, the length D9 of the 1-1st part 721a and the length D11 of the 2-1st part 722a may be 3.5mm to 11mm, respectively. Preferably, the length D9 of the 1-1 part 721a and the length D11 of the 2-1 part 722a may be 4.0mm to 9mm, respectively. More preferably, the length D9 of the 1-1 part 721a and the length D11 of the 2-1 part 722a may be 4.5mm to 7.5mm, respectively.

Meanwhile, the length D10 of the 1-2nd part 721b and the length D12 of the 2nd-2 part 722b may be the same. The width of the 1-2nd part 721b and the width of the 2-2nd part 722b may be the same.

Preferably, the length D10 of the 1-2nd part 721b and the length D12 of the 2nd-2 part 722b may be 1.5mm to 9mm, respectively. Preferably, the length D10 of the 1-2nd part 721b and the length D12 of the 2nd-2 part 722b may be 2.0mm to 7mm, respectively. More preferably, the length D10 of the 1-2nd part 721b and the length D12 of the 2nd-2 part 722b may be 2.5mm to 5.5mm, respectively.

Further, referring to FIG. 15, the 1-2 suction hole 720 includes a third hole portion 723 and a fourth hole portion 724 formed in the first to fourth corner areas C1, C2, C3, and C4. It may include.

The third hole portion 723 may be disposed in a region between each of the first to fourth outer regions X1, X2, Y1, and Y2.

Specifically, the third hole part 723 is one of the first hole part 721 disposed at the leftmost and the first hole part disposed in the third outer area Y1 among the first hole parts disposed in the first outer area X1. It may be disposed between the first hole portions 721 disposed at the lowermost side.

In addition, the third hole portion 723 is the lowest of the first hole portion 721 disposed on the rightmost side of the first hole portion disposed in the first outer area X1 and the first hole portion disposed in the fourth outer area Y2. It may be disposed between the first hole portions 721 disposed on the side.

In addition, the third hole portion 723 is the highest of the first hole portion 721 disposed at the leftmost and the first hole portion disposed in the third outer area Y1 among the first hole portions disposed in the second outer area X2. It may be disposed between the first hole portions 721 disposed on the side.

In addition, the third hole portion 723 is the uppermost of the first hole portion 721 disposed on the rightmost side of the first hole portion disposed in the second outer area X2 and the first hole portion disposed in the fourth outer area Y2. It may be disposed between the first hole portions 721 disposed on the side.

The fourth hole part 724 may be disposed in a region between each of the first to fourth outer regions X1, X2, Y1, and Y2.

Specifically, the fourth hole part 723 is among the second hole parts 722 disposed at the leftmost and the second hole parts disposed in the third outer area Y1 among the second hole parts disposed in the first outer area X1. It may be disposed between the second hole portions 722 disposed at the lowermost side.

In addition, the fourth hole part 724 is the lowest among the second hole parts 722 disposed on the rightmost side of the second hole parts disposed in the first outer area X1 and the second hole part disposed in the fourth outer area Y2. It may be disposed between the second hole portions 722 disposed on the side.

In addition, the fourth hole portion 724 is the top of the second hole portion 722 disposed at the leftmost of the second hole portion disposed in the second outer area X2 and the second hole portion disposed in the third outer area Y1. It may be disposed between the second hole portions 722 disposed on the side.

In addition, the fourth hole portion 724 is the top of the second hole portion 722 disposed on the rightmost side of the second hole portion disposed in the second outer area X2 and the second hole portion disposed in the fourth outer area Y2. It may be disposed between the second hole portions 722 disposed on the side.

The third hole portion 723 and the fourth hole portion 724 may have a bent shape. Preferably, the third hole portion 723 and the fourth hole portion 724 disposed in each corner region may have the same shape. That is, the third hole portion 723 and the fourth hole portion 724 disposed in the first corner region C1 may have the same shape. In addition, the third hole portion 723 and the fourth hole portion 724 disposed in the second corner region C2 may have the same shape. The third hole portion 723 and the fourth hole portion 724 disposed in the third corner region C3 may have the same shape. The third hole portion 723 and the fourth hole portion 724 disposed in the fourth corner region C4 may have the same shape.

The third hole portion 723 and the fourth hole portion 724 may have a shape corresponding to each corner area. Preferably, the third hole portion 723 and the fourth hole portion 724 may have an L-shaped shape extending toward an adjacent hole portion based on the center. The third hole portion 723 and the fourth hole portion 724 may have an L-shaped shape corresponding to a shape of the corner region to minimize suction leakage occurring in the corner region.

That is, the third hole portion 723 and the fourth hole portion 724 disposed in the first corner region C1 may have an L-shape. In addition, the third hole portion 723 and the fourth hole portion 724 disposed in the second corner region C2 may have an L shape rotated by 90 degrees in a counterclockwise direction. The third hole portion 723 and the fourth hole portion 724 disposed in the third corner region C3 may have an L shape rotated by 90 degrees in the clockwise direction. The third hole portion 723 and the fourth hole portion 724 disposed in the fourth corner region C4 may have an L shape rotated by 90 degrees in a clockwise or counterclockwise direction.

Meanwhile, an alignment mark 740 may be formed on the jig 700. The alignment mark 740 may be formed in a corner area of the jig 700. That is, the alignment mark 740 may be formed in any one of the first to fourth corner areas. The alignment mark 740 may be formed at an edge portion of any one corner area. Accordingly, in a situation where the workpiece is seated on the jig 700, the alignment mark 740 can be used to improve the positional accuracy of the workpiece, and the via formed in the workpiece is accurately positioned. To be formed in.

16 is a diagram illustrating a difference in scale of an outer region of a panel according to a comparative example, and FIG. 17 is a diagram illustrating a difference in scale of an outer region of a panel according to an exemplary embodiment.

Referring to FIG. 17, in the comparative example, it was confirmed that the scale difference of the long axis increases and the scale difference of the short axis increases according to the number of times the jig is used.

Here, the scale difference means that the length of each outer region of the panel PNL placed on the jig is measured before the via hole VH is processed, and the panel PNL where the via hole VH is processed. The length of each outer area of) is measured, and the change in the size of the panel PNL is measured accordingly.

Accordingly, in the comparative example, it was confirmed that the difference in the scale for the long axis was about 0.020%P to 0.030%P, and the difference in the scale for the short axis occurred about 0.015%P to 0.020%P depending on the number of uses. In addition, it was confirmed that the defective rate in the comparative example was 0.5%.

On the contrary, referring to FIG. 17, it was confirmed that the difference in scale was not severe even when the jig 700 according to the embodiment was used and the number of times the jig was used increased. That is, even if one jig is used more than 20 times, it can be confirmed that the difference in scale in the outer area of the panel PNL hardly occurs, and accordingly, it can be confirmed that the defective rate falls to 0.01% or less.

18 is a view showing a modified example of the 1-1 suction hole of the jig according to the embodiment.

Referring to FIG. 18, a plurality of 1-1 suction holes 710A may be formed in the first region R1 of the jig 700.

At this time, the plurality of 1-1 suction holes 710A have a'X' shape rather than a'+' shape as in the previous embodiment.

Here, each of the plurality of 1-1 suction holes 710A is formed in a first portion formed in a first diagonal direction on the first region R1 of the jig and in a second diagonal direction perpendicular to the first diagonal direction. Includes a second part. At this time, even if the 1-1 suction hole 710A has an X-shaped shape, the first and second portions are formed in the first and second diagonal directions, respectively, at right angles to each other, thereby providing a uniform suction force in all areas of the panel. And thus, the flatness of the panel can be maintained.

19 is a view showing another modified example of the 1-1 suction hole of the jig.

Referring to FIG. 19, in the previous embodiment, as in FIG. 19A, the 1-1 suction hole 710 formed in the jig 700 has a'+' shape or a'X' shape. Was formed. Accordingly, the first suction area SO1 for each of the 1-1 suction holes 710 has a rhombus shape. That is, the first suction region SO1 with respect to the 1-1 suction hole 710 has a rhombus shape connecting each end in a straight line.

Accordingly, in the embodiment, in order to maximize the suction area according to the first suction hole, the shape of the first suction hole 1-1 is changed.

That is, as shown in FIG. 19B, the first region R1 of the jig in the modified example includes a plurality of first-1 suction holes 910.

In addition, the plurality of 1-1 suction holes 910 includes a first portion 912 and a second portion 924. The first portion 912 and the second portion 914 overlap the second suction hole in the vertical direction and include an overlap region where the centers meet each other.

In this case, the first part 912 may include a first sub-part 912a at one end that is bent toward the center of the 1-1 suction hole. The first sub-part 912a may have a U-shaped concave at the center of the 1-1 suction hole 910. Further, the first part 912 may include a second sub-part 912b bent toward the center of the 1-1 suction hole at the other end opposite to the one end. The second sub-portion 912b may have a U-shape concave at the center of the 1-1th suction hole 910.

In addition, the second part 914 may include a third sub-part 914a at one end that is bent toward the center of the 1-1 suction hole. The third sub-part 914a may have a U-shape concave at the center of the 1-1 suction hole 910. Further, the second part 914 may include a fourth sub-part 914b bent toward the center of the 1-1 suction hole at the other end opposite to the one end. The fourth sub-part 914b may have a U-shape concave at the center of the 1-1 suction hole 910.

According to the above embodiment, the first to fourth sub-parts 912a, 912b, 914a, and 914b are additionally formed at the ends of the 1-1th suction hole. Accordingly, the second suction area SO2 formed by the 1-1 suction hole 912 according to the embodiment may have a circular shape different from the previous first suction area SO1, and accordingly, It can have a large suction area.

20 is a view showing a printed circuit board according to an embodiment.

Referring to FIG. 20, the printed circuit board may be one unit 220 divided by the panel PNL.

The printed circuit board may include an insulating layer 1010 and a via 1020 disposed in a via hole VH penetrating the insulating layer 1010.

Vias 1020 penetrating the upper and lower surfaces of the insulating layer 1010 are disposed in the insulating layer 1010. The via 1020 may be formed by filling the inside of the via hole VH penetrating the upper and lower surfaces of the insulating layer 1010 with a metallic material.

As described above, the via hole VH may be formed by a laser processing method. That is, the via hole VH may be formed by a via hole processing apparatus using a CO ₂ laser method.

And, the via 1020 is any one metal material selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd) inside the via hole (VH). It can be formed by filling. At this time, the filling of the metallic material may use any one of electroless plating, electroplating, screen printing, sputtering, evaporation, ink jetting, and dispensing, or a combination thereof. have.

In this case, the top surface of the via 1020 or the via hole VH may have a third width W3. Also, the lower surface of the via 1020 or the via hole VH may have a fourth width W4. In this case, the third width W3 and the fourth width W4 are different. Preferably, the third width W3 is greater than the fourth width W4.

Here, in the embodiment, a difference between the third width W3 and the fourth width W4 may be minimized by changing the shape of the first suction hole formed in the jig.

According to the present embodiment, by changing the shape of the suction hole formed in the jig, it is possible to maximize the suction area of the workpiece without loss of suction power, and thus the flatness of the workpiece may not be maintained.

In addition, according to the present embodiment, it is possible to improve the flatness of the workpiece disposed on the processing plate, and accordingly, the positional accuracy and shape uniformity of the via hole formed in the workpiece.

In addition, according to the present exemplary embodiment, it is possible to reduce the distribution of the size of the via hole compared to the related art, and thereby improve the reliability by improving the processing capability of the via hole.

In addition, according to the embodiment, the size ratio of the upper width and the lower width of the via hole may be reduced, and accordingly, the problem of a via short circuit caused by debris remaining at the bottom of the via hole during the via hole processing. Can be solved.

Features, structures, effects, and the like described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment can be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be interpreted as being included in the scope of the embodiments.

Although the embodiments have been described above, these are only examples and are not intended to limit the embodiments, and those of ordinary skill in the field to which the embodiments belong are not departing from the essential characteristics of the embodiments. It will be seen that branch transformation and application are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set in the appended claims.

Claims (16)

It is a plate-shaped auxiliary member disposed between the processing plate and the workpiece having an adsorption unit disposed at the lower portion and a second suction hole,
In the auxiliary member,
A first suction hole for adsorbing and supporting the workpiece is formed by suction air provided through the second suction hole,
The auxiliary member,
A first area; And
Including a second region surrounding the first region,
The first suction hole,
A 1-1 suction hole formed in the first area; And
It is formed in the second region and includes a 1-2 suction hole having a different shape from the 1-1 suction hole
Jig for machining via holes. The method of claim 1,
The 1-1 suction hole,
A first portion extending in the first direction,
And a second portion extending in a second direction different from the first portion,
The first direction is,
Perpendicular to the second direction
Jig for machining via holes The method of claim 2,
The 1-1 suction hole,
Cross-shaped or X-shaped
Jig for machining via holes. The method of claim 1,
The center of the first suction hole,
Aligned on the same vertical line as the center of the second suction hole
Jig for machining via holes. The method of claim 2,
The length of the first region is,
Equal to the length of the second area
Jig for machining via holes. The method of claim 5,
The first part and the second part,
With a length ranging from 4.5mm to 7.5mm
Jig for machining via holes. The method of claim 2,
The first part and the second part,
Including overlapping areas overlapping each other in a vertical direction,
The plane area of the overlap area is,
Smaller than the plane area of the second suction hole
Jig for machining via holes. The method of claim 1,
The first area,
A region overlapping with a plurality of strip regions of the workpiece,
The second area,
The outer area of the auxiliary member excluding the first area
Jig for machining via holes. The method of claim 1,
The 1-2 suction hole,
A first hole disposed around the first region; And
And a second hole portion disposed around the first hole portion,
The first and second hole portions,
Mutually symmetrical
Jig for machining via holes. The method of claim 9,
The first hole portion,
A portion 1-1 extending along the periphery of the first area; And
A portion 1-2 protruding from the portion 1-1 toward an edge of the auxiliary member,
The second hole portion,
A portion 2-1 extending along the periphery of the first hole portion; And
Including a 2-2 part protruding from the 2-1 part toward the first hole part
Jig for machining via holes. The method of claim 9,
The first and second hole portions,
T-shaped
Jig for machining via holes. The method of claim 9,
The 1-2 suction hole,
And a third hole disposed in a corner area of the second area,
The third hole part,
Having a different shape from the first and second holes
Jig for machining via holes. The method of claim 12,
The third hole part,
L-shaped
Jig for machining via holes. The method of claim 1,
The auxiliary member,
Including an alignment mark formed at an edge portion of the second region
Jig for machining via holes. Processing plate;
An adsorption unit disposed under the processing plate;
A jig disposed on the processing plate and having a plurality of first suction holes for adsorbing and supporting the workpiece;
It is disposed on the jig and includes a head portion for irradiating a laser light to the via hole formation position of the workpiece,
The processing plate,
And a plurality of second suction holes aligned on a vertical line with the first suction hole,
The center of the second suction hole,
It is aligned on the same vertical line as the center of the first suction hole,
The jig,
A first area; And
Including a second region surrounding the first region,
The first suction hole,
A 1-1 suction hole formed in the first area; And
It is formed in the second region, and includes a 1-2 suction hole having a different shape from the 1-1 suction hole,
The first area,
A region overlapping with a plurality of strip regions of the workpiece,
The second area,
The outer area excluding the first area
Laser processing device. The method of claim 15,
The 1-2 suction hole,
Third and fourth hole portions disposed in a corner area of the second area; And
First and second hole portions disposed in an area other than the corner area of the second area,
The first and second hole portions,
Having a different shape from the third and fourth holes
Laser processing device.

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