KR20200117843A - 복합 소자 및 이를 구비하는 전자기기 - Google Patents
복합 소자 및 이를 구비하는 전자기기 Download PDFInfo
- Publication number
- KR20200117843A KR20200117843A KR1020200015797A KR20200015797A KR20200117843A KR 20200117843 A KR20200117843 A KR 20200117843A KR 1020200015797 A KR1020200015797 A KR 1020200015797A KR 20200015797 A KR20200015797 A KR 20200015797A KR 20200117843 A KR20200117843 A KR 20200117843A
- Authority
- KR
- South Korea
- Prior art keywords
- discharge
- electrode
- void
- sheet
- region
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 69
- 230000000903 blocking effect Effects 0.000 claims abstract description 26
- 239000011800 void material Substances 0.000 claims description 139
- 239000002131 composite material Substances 0.000 claims description 126
- 230000007423 decrease Effects 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 33
- 238000000926 separation method Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 abstract description 2
- 230000004048 modification Effects 0.000 description 46
- 238000012986 modification Methods 0.000 description 46
- 238000007747 plating Methods 0.000 description 38
- 229910052751 metal Inorganic materials 0.000 description 30
- 239000002184 metal Substances 0.000 description 30
- 239000004020 conductor Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 239000010949 copper Substances 0.000 description 13
- 230000006870 function Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 5
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- -1 BaCO 3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0066—Constructional details of transient suppressor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2020/003783 WO2020204416A1 (ko) | 2019-04-05 | 2020-03-19 | 복합 소자 및 이를 구비하는 전자기기 |
| TW109109402A TW202105422A (zh) | 2019-04-05 | 2020-03-20 | 複合組件以及包括其之電子裝置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20190040417 | 2019-04-05 | ||
| KR1020190040417 | 2019-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20200117843A true KR20200117843A (ko) | 2020-10-14 |
Family
ID=72847310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200015797A KR20200117843A (ko) | 2019-04-05 | 2020-02-10 | 복합 소자 및 이를 구비하는 전자기기 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20200117843A (zh) |
| TW (1) | TW202105422A (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160131843A (ko) | 2015-05-07 | 2016-11-16 | 주식회사 모다이노칩 | 적층체 소자 |
-
2020
- 2020-02-10 KR KR1020200015797A patent/KR20200117843A/ko not_active Application Discontinuation
- 2020-03-20 TW TW109109402A patent/TW202105422A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160131843A (ko) | 2015-05-07 | 2016-11-16 | 주식회사 모다이노칩 | 적층체 소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202105422A (zh) | 2021-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101808797B1 (ko) | 적층형 소자 및 이를 구비하는 전자기기 | |
| US20190333700A1 (en) | Complex device and electronic device having same | |
| KR102084737B1 (ko) | 복합 소자의 제조 방법, 이에 의해 제조된 복합 소자 및 이를 구비하는 전자기기 | |
| TWI684324B (zh) | 電路保護裝置 | |
| KR101828991B1 (ko) | 복합 보호 소자 및 이를 구비하는 전자기기 | |
| KR20170135146A (ko) | 감전 방지 컨택터 | |
| KR101949442B1 (ko) | 복합 소자 및 이를 구비하는 전자기기 | |
| KR101900881B1 (ko) | 적층형 소자 | |
| KR101789243B1 (ko) | 복합 보호 소자 및 이를 구비하는 전자기기 | |
| KR20200117843A (ko) | 복합 소자 및 이를 구비하는 전자기기 | |
| KR20180065008A (ko) | 복합 보호 소자 및 이를 구비하는 전자기기 | |
| KR102053355B1 (ko) | 적층형 소자 및 이를 구비하는 전자기기 | |
| KR20180044018A (ko) | 회로 보호 소자 | |
| KR102053356B1 (ko) | 복합 소자의 제조 방법, 이에 의해 제조된 복합 소자 및 이를 구비하는 전자기기 | |
| KR101934084B1 (ko) | 복합 소자 및 이를 구비하는 전자기기 | |
| KR102227327B1 (ko) | 복합 소자 | |
| KR101825696B1 (ko) | 칩 부품 및 그 제조 방법 | |
| KR102335084B1 (ko) | 복합 소자 및 이를 구비하는 전자기기 | |
| KR101842212B1 (ko) | 감전 방지 컨택터 및 이를 구비하는 전자기기 | |
| KR101828990B1 (ko) | 복합 보호 소자 및 이를 구비하는 전자기기 | |
| KR102522082B1 (ko) | 적층형 소자 | |
| KR20180066003A (ko) | 감전 방지 컨택터 | |
| KR20180062988A (ko) | 복합 보호 소자 및 이를 구비하는 전자기기 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |