KR20200095950A - Temperature Controller of selected area for Gas cylinder - Google Patents

Abstract

An embodiment relates to a temperature control apparatus capable of controlling a temperature for each region of a gas cylinder. The temperature control apparatus capable of controlling the temperature for each region of the gas cylinder according to the embodiment may comprise: a heat conduction unit (370) including a first heat conduction unit module (371) disposed in a first region of a predetermined gas cylinder (110) and a second heat conduction unit module (372) disposed in a second region of the gas cylinder (110); and a thermoelectric module unit (320) including a first thermoelectric module (321) disposed on the first heat conduction unit module (371) and a second thermoelectric module (322) disposed on the second heat conduction unit module (372).

Description

Temperature controller that can control the temperature of each gas cylinder by area {Temperature Controller of selected area for Gas cylinder}

The embodiment relates to a temperature control device of a gas cylinder, and in particular, the embodiment relates to a temperature control device capable of controlling the temperature of the gas cylinder by region.

Gas cylinder refers to a cylindrical container in which compressed high-pressure gas or liquefied gas is placed. For example, gas cylinders include nitrogen tanks, helium tanks, argon tanks, carbon dioxide tanks, oxygen tanks, and LGP tanks.

Since such a gas cylinder stores high pressure gas or liquefied gas, it needs to be maintained at an appropriate temperature. For example, when an LGP tank or a portable oxygen tank is used or transported for work, a dangerous situation such as an explosion may occur when the LGP tank or a portable oxygen tank is heated.

In the prior art, safety measures are taken to avoid direct sunlight when using or transporting an LGP tank or a portable oxygen tank, but in actual transport or use situations, exposure to direct sunlight or exposure to the heating of the tank itself poses a dangerous situation. It is occurring, but the situation is not taking appropriate measures.

On the other hand, as the prior art related to the cooling device of the cylinder, there are patents for a cooling device using a thermoelectric module as in the following patent documents. However, these prior patents are technology for a temperature control device in which a thermoelectric module is provided in the cylinder itself, and a technology for a temperature control device for a general gas cylinder without its own cooling device has not been disclosed.

In particular, a variety of special gases are required in the semiconductor manufacturing process, LCD, or OLED manufacturing process, and conventionally, the special gases are only accommodated in a predetermined gas cabinet. Some of these special gases need to maintain a specific temperature, but it is difficult to control them to an optimum temperature.

However, in the prior art, if the proper temperature cannot be maintained for the gas cylinder in which the special gas is stored, pollutants are generated in the gas cylinder, and if these pollutants are introduced to the semiconductor equipment or OLED equipment through the gas line along with the gas, The main equipment may be damaged, and as the maintenance stock price of the main equipment is shortened, there is a problem that results in a significant decrease in yield.

In addition, in the prior art, when the special gas is stored in a gas cylinder and used, 100% of the gas cannot be used, and a predetermined residual amount of gas remains, causing loss. Conventionally, even if the amount of special gas remaining in the gas cylinder is large, there is no way to use it without the remaining amount, and thus the situation is treated as a loss, and this is a considerable cost loss.

Japanese Publication Number (Publication Date): JP2008-077B9 (1996-01-11) Japanese registered patent number (registration date): JP2089487B9 (1996-09-02) Japanese registered patent number (registration date): JP3284585B9 (2002-03-08)

One of the technical problems of the embodiment is to provide a temperature control device capable of controlling the temperature of each region of a gas cylinder capable of controlling the temperature of a process gas so as to provide an optimum process condition for each process.

In addition, one of the technical problems of the embodiment is to provide a temperature control device capable of controlling the temperature of each area of the gas cylinder that can prevent the occurrence of contaminants in the gas cylinder in which the special gas is stored.

In addition, one of the technical problems of the embodiment is to provide a temperature control device capable of controlling the temperature of each area of the gas cylinder that can prevent the residual amount of gas.

In addition, one of the technical problems of the embodiment is to provide a temperature control device capable of controlling temperature for each area of a gas cylinder capable of precise temperature control and maintenance by applying thermoelectric technology.

Technical problems of the embodiments are not limited to those described in this item, and include those that can be grasped through the description of the invention as a whole.

The temperature control device capable of controlling the temperature of each gas cylinder according to the embodiment includes a first heat conduction module 371 disposed in a first region of a predetermined gas cylinder 110 and a second region of the gas cylinder 110. A heat conduction unit unit 370 including a second heat conduction unit module 372 disposed in, and a first thermoelectric module 321 and the second heat conduction unit module disposed on the first heat conduction unit module 371 ( A thermoelectric module unit 320 including a second thermoelectric module 322 disposed on the 372 may be included.

The heat conduction unit 370 may be detachable from the outer surface of the gas cylinder.

The first thermoelectric module 321 and the second thermoelectric module 322 may be controlled at different temperatures.

The first thermoelectric module 321 may be controlled to a higher temperature than the second thermoelectric module 322.

In addition, in an embodiment, the temperature of the first thermoelectric module 321 may be controlled to be equal to or lower than the temperature of the second thermoelectric module 322.

The first heat conduction module 371 may include a temperature sensor that measures the temperature of the gas cylinder 110.

The embodiment may include a first group of cooling water inlets 391a and a first group of cooling water outlets 391b divided by regions.

For example, the embodiment includes a first coolant inlet 391a1 and a first coolant outlet 391b1 disposed on the first heat conduction unit module 371, and on the second heat conduction unit module 372 A second cooling water inlet 391a2 and a second cooling water outlet 391b2 may be provided.

The first cooling water inlet 391a1 and the first cooling water outlet 391b1 may be disposed in a horizontal direction of a ground on which the gas cylinder 110 is disposed.

In addition, the embodiment may include a second group of cooling water inlets 392a and a second group of cooling water outlets 392b extending in the vertical direction of the ground on which the gas cylinder 110 is disposed.

According to the embodiment, it is possible to provide a temperature control device capable of controlling the temperature for each region of a gas cylinder capable of providing an optimum process condition for each process.

For example, according to an embodiment, the development of a device capable of setting and maintaining the temperature of gas cylinders, laboratory machinery, specimen storage boxes, etc., which require maintenance of a specific high temperature or ultra-low temperature, etc. This is in desperate need.

One of the technical features is that the embodiment includes a thermal electronic jacket capable of heating and cooling using a thermoelectric device, and in particular, temperature control of an optional portion of the thermal electronic device is possible.

In addition, according to the embodiment, as temperature control of an optional part is possible, the utilization efficiency of the controlled object can be increased and the overall energy saving effect of the thermoelectric jacket can be maximized.

In particular, according to the embodiment, the optimum process can be carried out by precisely controlling the appropriate temperature required for the semiconductor manufacturing process or the special gas for LCD and OLED manufacturing processes to maintain a stable state to meet the optimum process conditions for each process. There is a technical effect of providing a temperature control device capable of controlling the temperature of the gas cylinder by region.

In particular, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a necessary area, there is a technical effect that can be applied to gas cylinders of various sizes.

In addition, according to the embodiment, there is a technical effect of reducing power consumption by cutting off power supply to an unnecessary area through temperature control in a necessary area.

In addition, according to the embodiment, there is a special technical effect in that the gas contained in the gas cylinder is controlled differently for each region so that all of the gas contained in the gas cylinder can be used without leaving almost any gas.

The technical effects of the embodiments are not limited to those described in this item, and include those that can be grasped throughout the description of the invention.

1 is an exemplary view of a gas cylinder equipped with a temperature control device capable of controlling temperature for each region of a gas cylinder according to an embodiment.
2A is a cross-sectional view of a temperature control device capable of controlling temperature for each region of the gas cylinder according to the first embodiment.
2B is another cross-sectional view of a temperature control device capable of controlling temperature for each region of the gas cylinder according to the first embodiment.
3A to 9B are cross-sectional views of a manufacturing process of a temperature control device capable of controlling the temperature of the gas cylinder according to the first embodiment.
10A is a cross-sectional view of a temperature control device capable of controlling temperature for each region of a gas cylinder according to a second embodiment.
10B is another cross-sectional view of a temperature control device capable of controlling temperature for each region of the gas cylinder according to the second embodiment.
11 is a conceptual diagram of a first cooling method of a temperature control device capable of controlling temperature for each region of a gas cylinder according to an embodiment.
12 is a conceptual diagram of a second cooling method of a temperature control device capable of controlling temperature for each region of a gas cylinder according to an embodiment.

Hereinafter, embodiments that can be specifically realized for solving the above problems will be described with reference to the accompanying drawings.

In the description of the embodiment, in the case where it is described as being formed in "on or under" of each element, the upper (upper) or lower (lower) (on or under) is Both elements are in direct contact with each other or one or more other elements are formed indirectly between the two elements. In addition, when expressed as "on or under", the meaning of not only an upward direction but also a downward direction based on one element may be included.

(Example)

1 is an exemplary diagram of a temperature control device 300 capable of controlling temperature for each region of a gas cylinder according to an embodiment.

The temperature control device 300 capable of controlling a temperature for each region of a gas cylinder according to the embodiment includes a heat conduction unit 370 disposed on an outer surface of a predetermined gas cylinder 110 and on the heat conduction unit 370. It may include the arranged thermoelectric module unit 320.

In an embodiment, the heat conduction unit 370 may include a plurality of heat conduction unit modules. For example, the heat conduction unit 370 includes a first heat conduction unit module 371 disposed in a first area of an outer surface of the gas cylinder 110 and a second area of the gas cylinder 110 A second heat conduction unit module 372 disposed in, a third heat conduction unit module 373 disposed in a third area of the outer surface of the gas cylinder 110, and a fourth heat conduction unit module 372 disposed at the outer surface of the gas cylinder 110 It may include a fourth heat conduction unit module 374 disposed in the region.

In addition, in an embodiment, the thermoelectric module unit 320 may include a plurality of thermoelectric modules. For example, the thermoelectric module unit 320 includes a first thermoelectric module 321 disposed on the first heat conduction unit module 371 and a second thermoelectric unit disposed on the second heat conduction unit module 372. A module 322, a third thermoelectric module 323 disposed on the third heat conduction unit module 373, and a fourth thermoelectric module 324 disposed on the fourth heat conduction unit module 374 I can.

The embodiment may include a control unit 384 that controls the thermoelectric module unit 320. The controller 384 may communicate with the thermoelectric module unit 320 by wire or wirelessly to control the thermoelectric module unit 320.

According to the embodiment, it is possible to provide a temperature control device capable of controlling the temperature for each region of a gas cylinder capable of providing an optimum process condition for each process.

For example, one of the technical features is that the embodiment includes a thermal electronic jacket capable of heating and cooling using a thermoelectric element, and in particular, temperature control of an optional part of the thermal electronic device is possible.

According to the embodiment, development of a device capable of setting and maintaining the temperature of gas cylinders, laboratory machinery, specimen storage boxes, etc. that requires maintenance of a specific high temperature or cryogenic temperature is urgently required. have.

For example, in the semiconductor manufacturing process, LCD, OLED manufacturing process, rare gas such as Xenon, Neon, Krypton, etching gas such as CH ₃ F, or special gas such as doping gas such as B ₂ H ₆ are used. When the gas is maintained at the optimum temperature, the highest process yield can be obtained, but conventionally, it is difficult to control the gas to the optimum temperature, which adversely affects the process yield.

According to the embodiment, there is a technical effect of providing a temperature control device capable of controlling a temperature for each region of a gas cylinder capable of performing an optimum process by precisely controlling a special gas used for each process to an optimum temperature.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a required area, there is a technical effect that can be applied to gas cylinders of various heights. The control unit 384 divides the entire area of the temperature control device into an area suitable for use and precisely controls the temperature of each area, thereby increasing the utilization of the temperature control device.

In addition, according to the embodiment, there is a technical effect of reducing power consumption by cutting off power supply to an unnecessary area through temperature control in a necessary area. Accordingly, according to the embodiment, as temperature control in a selective region becomes possible, there is a technical effect of increasing the utilization efficiency of the controlled object and maximizing the overall energy saving effect of the thermoelectric jacket.

In addition, according to an embodiment, the temperature is controlled differently for each region so that all rare gases such as Xenon, Neon, Krypton, etc. contained in the gas cylinder or special gases such as etching gas such as CH ₃ F or doping gas such as B ₂ H ₆ can be used Therefore, there is a special technical effect that can be used without leaving the gas.

In addition, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature.

Next, the gas cylinder 110 to which the embodiment is applied may include a body 112 and an injection hole 114. The body 112 may have a cylindrical shape or a cylindrical shape, but is not limited thereto, and may include a polygonal shape. The gas cylinder 110 may be a nitrogen tank, a helium tank, an argon tank, a carbon dioxide tank, an oxygen tank, an LGP tank or a semiconductor, a special gas tank for an LCD or OLED process, but is not limited thereto. In addition, the shape, size, etc. of the gas cylinder 110 may be determined according to a predetermined product standard, and the temperature control device capable of controlling the temperature of each area of the gas cylinder of the embodiment is also Size, etc. can be prepared.

In addition, in an embodiment, the heat conduction unit 370 may be disposed on a predetermined support 382. For example, the support 382 may include first to fourth support 382a, 382b, 382c, and 382d.

For example, the first support 382a may support the first heat conduction unit module 371, the second support 382b may support the second heat conduction unit module 372, and the third support ( 382c may support the third heat conduction unit module 373, and the fourth support 382d may support the fourth heat conduction unit module 374.

In addition, according to the embodiment, it is possible to provide a temperature control device capable of controlling the temperature of the gas cylinder for each region having a technical effect that is detachable from the gas cylinder.

In addition, the embodiment may provide a temperature control device capable of controlling the temperature of the gas cylinder for each region, which has a technical effect in which the cooling function of the thermoelectric element can be realized as much as possible by being in close contact with the gas cylinder.

In addition, the embodiment may provide a temperature control device capable of controlling a temperature for each region of a gas cylinder having a technical effect capable of improving the reliability of a thermoelectric module.

Next, with reference to FIGS. 2A and 2B, technical features of the embodiment will be described in more detail.

2A is A1 to A1 for the first heat conduction unit 371 and the first thermoelectric module 321 of the temperature control device 300 capable of controlling the temperature of the gas cylinder according to the first embodiment shown in FIG. 1. It is a cross-sectional view along the line, and FIG. 2B is another embodiment of a temperature control device 300 capable of controlling the temperature of each region of the gas cylinder according to the first embodiment shown in FIG. 2A. The embodiment of FIG. 2A is a two stage structure having one hinge portion 311c, and the embodiment of FIG. 2B includes a first hinge portion 311c1 and a second hinge portion 311c2. It is a three stage structure. Hereinafter, it will be described with reference to FIG. 2A.

Referring to FIG. 2A, a temperature control apparatus 300 capable of controlling temperature for each region of a gas cylinder according to the first embodiment includes a frame 311 and the frame 311 disposed on an outer surface of a predetermined gas cylinder 110. ), a first thermoelectric module 321 disposed on the first thermoelectric module 321, and a first heat conduction unit 371 disposed on the first thermoelectric module 321.

The embodiment has a technical feature that enables rapid and efficient temperature control by employing the thermoelectric module 321. In particular, the embodiment is a temperature control capable of controlling the temperature of a gas cylinder in which the optimum process can be performed by precisely controlling the temperature of the semiconductor manufacturing process or the special gas for the LCD and OLED manufacturing processes to suit the optimum process conditions for each process. There is a technical effect that can provide the device.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a necessary area, there is a technical effect that can be applied to gas cylinders of various heights.

The first heat conduction part 371 may include a heat dissipation block 331, a sealing part 341, an insulating material 351, and a cover 361.

According to an embodiment, a heat dissipation block 331 is disposed on the first thermoelectric module 321 to effectively dissipate heat generated from the first thermoelectric module 321, thereby cooling efficiency and operation of the first thermoelectric module 321 Can maintain performance.

In addition, a sealing part 341 is disposed on the side of the first thermoelectric module 321 and the heat dissipation block 331 to block the incoming air to suppress condensation and maintain the temperature, thereby increasing the optimum process temperature of the gas. Can be maintained.

Through this, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at the optimum temperature.

In addition, the embodiment may include a heat insulating material 351 on the heat dissipation block 331 and the sealing part 341 to block the inflow and outflow of heat from the outside to improve the heat insulation effect. The insulating material 351 may be made of a material of a heat insulating material such as a pearlite board or a foam plate made of styrofoam, but is not limited thereto.

In addition, the embodiment may include a metal cover 361 on the insulating material 351 to improve mechanical reliability.

Referring to FIG. 2A, it is an example of a two stage structure having one hinge part 311c, and a hinge part 311c is disposed on the cover 361 to form a first heat conduction part 371. It can be opened and closed left and right, but is not limited thereto. Also, referring to FIG. 2B, it is a three stage structure in which two hinge parts are arranged, and a first hinge part 311c1 and a second hinge part 311c2 are disposed on the cover 361 to conduct a first heat conduction. The part 371 may be opened and closed left and right, but is not limited thereto.

Hereinafter, with reference to FIGS. 3A to 9B, a temperature control device capable of controlling a temperature for each region of a gas cylinder according to an exemplary embodiment will be described in more detail.

Referring to FIG. 3A, the frame 311 may be opened and closed in a two-stage structure, and referring to FIG. 3B, the frame 311 may be opened and closed in a three-stage structure.

3A and 3B, the inside of the frame 311 may have a circular or spherical structure so as to correspond to the shape of the gas cylinder 110, and the outside of the frame 311 is formed in a polygonal structure to provide a thermoelectric module to be disposed thereafter. Can be placed firmly. The frame 311 may be an anodized aluminum frame having easy heat transfer and excellent insulating properties, but is not limited thereto.

In the embodiment, the inside of the frame 311 is flexible, so that the temperature control device 300 of the embodiment is in close contact with the gas cylinder 110, thereby maximizing heat transfer between the jacket and the gas cylinder. For example, the inside of the frame 311 may be made of a material that has excellent thermal conductivity and is flexible. For example, the inside of the frame 311 may be made of a flexible thermally conductive material such as graphite sheet or graphite tape, but is not limited thereto.

The temperature control device 300 of the gas cylinder according to the embodiment may change the shape of the gas cylinder to the outer shape of the gas cylinder in correspondence with the shape of the gas cylinder due to the flexible characteristic inside the frame 311. There is a technical feature that can maximize the cooling performance or heating performance of the thermoelectric module by performing the heat transfer function by being in close contact with the gas cylinder without being limited by the outer shape of the cylinder.

In addition, in the embodiment, the outside of the frame 311 has a rigid characteristic, so that even though the thermoelectric module is stably mounted on the frame 311, separate mechanical stress or damage is not applied during actual use. There is a technical effect of improving the mechanical reliability of the thermoelectric module and also improving the electrical reliability during operation.

The outer side of the frame 311 may include a metal-based material having good thermal conductivity, such as Al, Al ₂ O ₃ , Ag, and Cu, or a ceramic-based material.

In addition, a thermally conductive material layer (not shown) may be further included between the inside and the outside of the frame 311. For example, since the thermally conductive material layer is formed of powder having excellent thermal conductivity, the heat dissipation efficiency can be maximized while maximizing the characteristics of flexibility inside the frame 311. For example, the thermally conductive material layer may include a metal-based material having good thermal conductivity such as Al, Al ₂ O ₃ , Ag, and Cu, or a powder of a ceramic-based material. However, it is not limited thereto.

In addition, according to an embodiment, by including a single or a plurality of temperature sensors (not shown) that measure the temperature of the gas cylinder 110, the temperature of each part of the gas cylinder is measured in real time, and based on this, a thermoelectric module provides rapid and efficient temperature control. There are technical features available.

For example, the temperature sensor may be disposed on the frame 311, may be a sensor that senses heat from the gas cylinder 110 and generates an electric signal, and may be a contact type or a non-contact type. For example, the temperature sensor may be an electronic circuit element having a characteristic of a negative resistance temperature coefficient whose resistance value decreases when the temperature increases, and because the heat capacity is small, a rapid resistance change occurs even with a small temperature change, so that temperature control is efficient. I can.

For example, the first heat conduction unit module 371 may include a first temperature sensor (not shown) that measures the temperature of the first region of the gas cylinder 110. In addition, the second heat conduction unit module 372 may include a second temperature sensor (not shown) that measures the temperature of the second region of the gas cylinder 110. In addition, the third heat conduction unit module 373 may include a third temperature sensor (not shown) that measures the temperature of the third region of the gas cylinder 110. In addition, the fourth heat conduction unit module 374 may include a fourth temperature sensor (not shown) that measures the temperature of the fourth region of the gas cylinder 110.

Next, referring to FIGS. 4A and 4B, a first thermoelectric module 321 may be disposed outside the frame 311. The first thermoelectric module 321 may include a plurality of thermoelectric modules. For example, the embodiment may include a plurality of first thermoelectric modules 321 disposed outside the frame 311.

The embodiment has a technical feature that enables rapid and efficient temperature control by employing the thermoelectric module 321. In particular, the embodiment is a temperature control capable of controlling the temperature of a gas cylinder in which the optimum process can be performed by precisely controlling the temperature of the semiconductor manufacturing process or the special gas for the LCD and OLED manufacturing processes to suit the optimum process conditions for each process. There is a technical effect that can provide the device.

In addition, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature.

In addition, referring to FIG. 2A, the embodiment includes a first thermoelectric module 321, a second thermoelectric module 322, a third thermoelectric module 323, and a fourth thermoelectric module 324 that can be controlled at different temperatures. Since it is possible to selectively control temperature only in a necessary area, there is a technical effect that can be applied to gas cylinders of various heights.

In addition, according to the embodiment, there is a special technical effect in that the gas contained in the gas cylinder is controlled differently for each area so that the gas contained in the gas cylinder can be used without leaving almost any gas.

For example, if the temperature of the first thermoelectric module 321 disposed at the bottom is controlled higher than the temperature of the fourth thermoelectric module 324 disposed at the upper side, the gas located at the bottom moves upward and the fourth thermoelectric module 321 There is a special technical effect of using all of the special gases without residual amount by being controlled to the optimum temperature required in the module 324.

On the other hand, in the first to fourth thermoelectric modules 321 to 324 in the embodiment, one side does not necessarily have a high temperature and the other one has a low temperature, and the user may designate and control the temperature according to the process situation. . For example, the temperature of the first thermoelectric module 321 may be controlled to be equal to or lower than the temperature of the second thermoelectric module 322.

Next, FIG. 5 is a cross-sectional view of a first thermoelectric module 321 in a temperature control apparatus capable of controlling temperature for each region of a gas cylinder according to an embodiment. In the embodiment, there is a technical feature that enables rapid and efficient temperature control by employing a thermoelectric module.

The first thermoelectric module 321 according to the embodiment may be cooled or heated using a Peltier effect, which is a phenomenon in which heat is absorbed or generated by an electric current. The Peltier effect is a phenomenon in which when two types of metal ends are connected and current is passed through them, one terminal absorbs heat and the other terminal generates heat depending on the current direction. If semiconductors such as bismuth tellurium, which have different electrical conduction methods, are used instead of two kinds of metals, a Peltier device having a high efficiency endothermic and exothermic action can be obtained. The Peltier device can switch between endothermic and heat generation according to the current direction, and the endothermic and heat generation amount may be adjusted according to the amount of current.

In an embodiment, the first thermoelectric module 321 may cool or heat the frame 311 according to the polarity of the applied voltage. The voltage may be, for example, a direct current (DC) voltage.

The first thermoelectric module 321 may include a plurality of semiconductor layers. For example, the first thermoelectric module 321 may include a single or a plurality of thermoelectric elements. For example, the first thermoelectric module 321 may include a first n-type semiconductor layer n1 and a first p-type semiconductor layer p1. In addition, the first thermoelectric module 321 may include a second n-type semiconductor layer n2 and a second p-type semiconductor layer p2. The first n-type semiconductor layer n1 and the second n-type semiconductor layer n2 are formed of a semiconductor material containing an n-type dopant, and a first p-type semiconductor layer p1 and a second p-type semiconductor layer (p2) may be formed of a semiconductor material including a p-type dopant.

The plurality of semiconductor layers may receive power through a predetermined electrode 321d. The electrode 321d may include a plurality of electrodes, and may include a first electrode 321d1, a second electrode 321d2, and a third electrode 321d3, and a plurality of thermoelectric modules are electrically connected in series or Can be connected in parallel.

For example, the first n-type semiconductor layer n1 is electrically connected to the first electrode 321d1, and the first p-type semiconductor layer p1 and the second n-type semiconductor layer n2 are second electrodes. It is electrically connected to 321d2, and the second p-type semiconductor layer p2 is electrically connected to the third electrode 321d3, so that two thermoelectric elements may be connected in series.

The first thermoelectric module 321 according to the embodiment may include a conductive heat transfer layer 321c. The conductive heat transfer layer 321c may be formed of a material such as copper (Cu) having electrical conductivity and excellent heat transfer efficiency, but is not limited thereto.

For example, the first conductive heat transfer layer 321c1 may have a heat dissipation effect while electrically connecting one end of the first n-type semiconductor layer n1 and one end of the first p-type semiconductor layer p1. In addition, the second conductive heat transfer layer 321c2 may have a heat dissipation effect while electrically connecting one end of the second n-type semiconductor layer n2 and one end of the second p-type semiconductor layer p2.

A first insulating heat conductive layer 321a may be disposed between the conductive heat transfer layer 321c and the frame 311. The first insulating thermally conductive layer 321a may be formed of an alumina-based material, an aluminum nitride-based material, a silicon-based material, etc. having electrical insulation and excellent thermal conductivity, but is not limited thereto.

In the embodiment, an adhesive active material capable of improving thermal conductivity such as thermal grease may be inserted between the first insulating thermal conductive layer 321a, which is the attachment surface of the thermoelectric element, and the frame 311.

In an embodiment, a second insulating thermally conductive layer 321b may be disposed on the electrode 321d. The second insulating thermal conductive layer 321b may be formed of an alumina-based material, an aluminum nitride-based material, a silicon-based material, etc. having electrical insulation and excellent thermal conductivity, but is not limited thereto.

According to the embodiment, there is a technical feature that enables rapid and efficient temperature control by employing the first thermoelectric module 321. For example, according to an embodiment, by employing a thermoelectric module, the temperature conversion speed is fast, the temperature range used can be expanded, and the temperature uniformity and efficiency can be excellent.

In addition, according to the embodiment, since heating and cooling can be performed through polarity switching of the thermoelectric module through a single electrical element, the device can be miniaturized and an energy saving effect can be obtained.

Next, referring to FIGS. 6A and 6B, a heat dissipation block 331 may be disposed on the first thermoelectric module 321.

According to the embodiment, the heat dissipation block 331 is disposed on the first thermoelectric module 321 to effectively dissipate heat generated from the first thermoelectric module 321, thereby cooling efficiency and operating performance of the first thermoelectric module 321 Can be maintained.

In addition, in the embodiment, an adhesive active material capable of improving thermal conductivity such as thermal grease may be inserted between the first thermoelectric module 321 and the heat dissipation block 331.

The heat dissipation block 331 may include a material having excellent thermal conductivity. For example, the heat dissipation block 331 may include a metal-based material having good thermal conductivity, such as Al, Al ₂ O ₃ , Ag, and Cu, or a ceramic-based material.

In addition, the heat dissipation block 331 may have a refrigerant for cooling or a flow path (mido) for air, but is not limited thereto. In the embodiment, the refrigerant refers to a material that causes a cooling action in a broad sense, and heat is removed from the surroundings by evaporating in a low-temperature part (evaporator) while circulating inside the cycle mainly of a refrigeration device, a heat pump, an air conditioner, and an engine using small temperature difference heat energy. It contains a working fluid that absorbs and releases heat from the high temperature part (condenser). For example, the refrigerants that can be employed in the examples include ammonia, freon (chloro-fluoro-carbon (ClFC)), hydro-fluoro-carbon (HCFC), and hydrogen fluorocarbon. There are lean carbon (HFC, hydro-fluoro-carbon), hydrogen fluorinated olefin (HFO, hydro-fluoro-olefin), and methyl chloride, and liquid helium, liquid hydrogen, etc. can be used to lower the temperature to cryogenic temperatures.

Next, referring to FIGS. 7A and 7B, the embodiment may include a sealing part 341 on the side surface of the first thermoelectric module 321 and the heat dissipation block 331 and on the frame 311. For example, in the embodiment, a sealing part 341 made of a material such as urethane or silicon is disposed on the side surface of the first thermoelectric module 321 and the heat dissipation block 331 and on the frame 311 to prevent air introduced from the outside. By blocking, condensation can be prevented and the temperature can be maintained.

Next, referring to FIGS. 8A and 8B, the embodiment includes an insulating material 351 on the heat dissipation block 331 and the sealing part 341 to block the outflow of heat from the outside to improve the insulation efficiency. have. The insulating material 351 may be a material of a thermal insulation material such as pearlite board, a foam plate of styrofoam, asbestos, rock wool, glass fiber, tex, or cork, but is not limited thereto.

Next, referring to FIGS. 9A and 9B, in the embodiment, a cover 361 is provided on the insulating material 351 to improve mechanical reliability of the temperature control device 300. The cover 361 may be formed of a metal material such as aluminum, titanium, and an intermetallic compound between aluminum, but is not limited thereto.

Referring to FIG. 9A, the embodiment may be a two-stage structure having one hinge portion 311c. Referring to FIG. 9B, the embodiment is a first hinge portion 311c1 and a second hinge portion. It may be a three-stage structure having a branch portion 311c2.

In addition, the temperature control device 300 capable of controlling the temperature for each region of the gas cylinder according to the embodiment is detachable from the body 112 of the gas cylinder, so that the gas cylinder 110 is provided with the gas cylinder according to the embodiment. There is a technical effect of controlling the temperature of the gas cylinder by being mounted so that the temperature control device 300 capable of controlling the individual temperature is closely attached.

For example, the temperature control device 300 capable of controlling the temperature for each region of the gas cylinder according to the embodiment is detachable from the body 112 of the gas cylinder, so that a separate temperature control device is not built into the gas cylinder. There is a technical effect of controlling the temperature of the gas cylinder by efficiently installing a temperature control device 300 capable of controlling the temperature of each region of the gas cylinder according to the embodiment when necessary in the non-gas cylinder.

In addition, the embodiment is provided with a thermal electronic jacket capable of heating and cooling using a thermoelectric element, and in particular, one of the technical features is that temperature control of an optional portion of the thermal electronic device is possible.

In addition, according to the embodiment, as temperature control of an optional part is possible, the utilization efficiency of the controlled object can be increased and the overall energy saving effect of the thermoelectric jacket can be maximized.

In addition, according to the embodiment, it is possible to provide a temperature control device capable of controlling the temperature of each area of the gas cylinder in which the optimum process can be performed by precisely controlling the holding temperature of each semiconductor manufacturing process or special gas for LCD and OLED manufacturing processes. There is a technical effect.

In addition, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature. Further, according to the embodiment, temperature control is selectively performed only in a necessary area. As it is possible, there is a technical effect that can be applied to gas cylinders of various heights.

In addition, according to the embodiment, there is a technical effect of reducing power consumption by cutting off power supply to an unnecessary area through temperature control in a necessary area.

In addition, according to the embodiment, there is a special technical effect in that the gas contained in the gas cylinder is controlled differently for each area so that the gas contained in the gas cylinder can be used without leaving almost any gas.

Next, FIG. 10A is a cross-sectional view of a temperature control device capable of controlling temperature for each area of a gas cylinder according to the second embodiment, and FIG. 10B is another temperature control device capable of controlling temperature for each area of the gas cylinder according to the second embodiment. It is a cross-sectional view.

The second embodiment can adopt the technical features of the first embodiment.

For example, the temperature control device capable of controlling temperature for each region of the gas cylinder according to the second embodiment includes a frame 311 disposed on an outer surface of a predetermined gas cylinder 110 and a frame 311 disposed on the frame 311. It may include a first thermoelectric module 321 and a first heat conduction part 371 disposed on the first thermoelectric module 321. A hinge portion 311c is disposed on the frame 311 to open and close the first heat conduction portion 371 left and right.

The embodiment has a technical feature that enables rapid and efficient temperature control by employing the thermoelectric module 321. In particular, the embodiment has a technical effect that can provide a temperature control device capable of controlling the temperature of each area of a gas cylinder capable of performing an optimal process by precisely controlling the holding temperature of a semiconductor manufacturing process or a special gas for LCD and OLED manufacturing processes. have.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a necessary area, there is a technical effect that can be applied to gas cylinders of various heights.

The first heat conduction part 371 may include a second heat dissipation block 332, a sealing part 341, a heat insulating material 351, and a cover 361. According to an embodiment, a second heat dissipation block 332 is disposed on the first thermoelectric module 321 to effectively dissipate heat generated from the first thermoelectric module 321 to provide cooling efficiency and the first thermoelectric module 321. Can maintain the operating performance of

In addition, a sealing part 341 is disposed on the side surfaces of the first thermoelectric module 321 and the second heat dissipation block 332 to block the incoming air from the outside, prevent condensation, and maintain the temperature for optimum gas consumption. The process temperature can be maintained.

In addition, the embodiment may include a heat insulating material 351 on the second heat dissipation block 332 and the sealing part 341 to block outflow of heat from the outside, thereby improving heat insulation efficiency. The insulating material 351 may be made of a material of a heat insulating material such as a pearlite board or a foam plate made of styrofoam, but is not limited thereto. In addition, the embodiment may include a metal cover 361 on the insulating material 351 to improve mechanical reliability.

Hereinafter, the main features of the second embodiment will be described.

In the second embodiment, the second heat dissipation block 332 is disposed on the plurality of first thermoelectric modules 321 to effectively dissipate heat generated from the thermoelectric module, thereby further maximizing the cooling efficiency and improving the operating performance of the thermoelectric module. Can be maintained.

For example, in the second embodiment, the second heat dissipation block 332 is arranged in a manner in which the flat regions outside the frame 311 are connected to the first thermoelectric modules 321 disposed in different regions, thereby reducing heat dissipation efficiency. In addition, according to the second embodiment, the reliability of the thermoelectric module can be improved. In addition, according to the second embodiment, the semiconductor manufacturing process or the special gas for the LCD or OLED manufacturing process is maintained in a stable state according to the improvement of the heat dissipation efficiency and the reliability of the thermoelectric module. By precisely controlling the temperature to the optimum temperature required for this, an optimum process can be performed.

Further, according to the second embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by reliably and precisely maintaining the temperature of the gas cylinder in which the special gas is stored at the optimum temperature.

Next, FIG. 11 is a conceptual diagram of a first cooling method of a temperature control apparatus capable of controlling the temperature of a gas cylinder according to an embodiment, and FIG. 12 is a temperature control apparatus capable of controlling the temperature of a gas cylinder according to an embodiment. It is a conceptual diagram of the second cooling method.

For example, referring to FIG. 11, a temperature control device capable of controlling a temperature for each region of a gas cylinder according to an embodiment includes a cooling water inlet 391a of a first group and a cooling water outlet 391b of a first group branched by region. It can be provided.

For example, the embodiment may include a first coolant inlet 391a1 and a first coolant outlet 391b1 disposed on the first heat conduction module 371. The first coolant inlet 391a1 may be disposed above the first thermoelectric module 321 to efficiently dissipate heat generated from the first thermoelectric module 321. The first cooling water inlet 391a1 and the first cooling water outlet 391b1 may be disposed in a horizontal direction of a ground on which the gas cylinder 110 is disposed.

In addition, the embodiment may include a second cooling water inlet 391a2 and a second cooling water outlet 391b2 disposed on the second heat conduction module 372, and the second cooling water inlet 391a2 is It is disposed above the module 322 to efficiently dissipate heat generated from the second thermoelectric module 322.

In addition, the embodiment may include a third coolant inlet 391a3 and a third coolant outlet 391b3 disposed on the third heat conduction module 373, and the third coolant inlet 391a3 is the third thermoelectric device. It is disposed above the module 323 to efficiently dissipate heat generated from the third thermoelectric module 323.

In addition, the embodiment may include a fourth coolant inlet 391a4 and a fourth coolant outlet 391b4 disposed on the fourth heat conduction module 374, and the fourth coolant inlet 391a4 is the fourth thermoelectric device. It is disposed above the module 324 to efficiently dissipate heat generated from the fourth thermoelectric module 324.

The second cooling water inlet 391a2 to the fourth cooling water inlet 391a4 and the second cooling water outlet 391b2 to the fourth cooling water outlet 391b4 may be disposed in a horizontal direction of the ground on which the gas cylinder 110 is disposed. I can.

According to the embodiment, the heat dissipation efficiency can be increased by radiating only the necessary areas through the cooling water inlet 391a of the first group and the cooling water outlet 391b of the first group branched by region. For example, when only the first thermoelectric module 321 and the second thermoelectric module 322 are operated, only the first cooling water inlet 391a1 and the second cooling water inlet 391a2 are opened, and the remaining third cooling water inlet By blocking the (391a3) and the fourth cooling water inlet (391a4), it is possible to increase the heat dissipation efficiency by radiating heat using the cooling water only in a necessary area.

In addition, according to the embodiment, the temperature of the cooling water flowing in the required region is uniform, so that the performance of the thermoelectric module in the region can be uniformly controlled.

In addition, according to the embodiment, as temperature control of an optional part is possible, the utilization efficiency of the controlled object can be increased and the overall energy saving effect of the thermoelectric jacket can be maximized.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a necessary area, there is a technical effect that can be applied to gas cylinders of various sizes.

In addition, according to the embodiment, there is a technical effect of reducing power consumption by cutting off power supply to an unnecessary area through temperature control in a necessary area.

In addition, according to the embodiment, the optimum process can be carried out by precisely controlling the appropriate temperature required to maintain a stable state of the semiconductor manufacturing process or the special gas for the LCD or OLED manufacturing process to suit the optimum process conditions for each process. There is a technical effect of providing a temperature control device capable of controlling the temperature of the gas cylinder by region.

In addition, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature.

In addition, according to the embodiment, there is a special technical effect in that the gas contained in the gas cylinder is controlled differently for each region so that all of the gas contained in the gas cylinder can be used without leaving almost any gas.

Next, referring to FIG. 12, in the temperature control apparatus according to the embodiment, a cooling water inlet 392a of a second group and a cooling water outlet 392b of a second group extending in a vertical direction of the ground on which the gas cylinder 110 is disposed. It can be provided.

For example, in the embodiment, the cooling water inlet 392a of the second group is the fifth cooling water inlet 392a1, the sixth cooling water inlet 392a2, and the seventh. A cooling water inlet 392a3 and an eighth cooling water inlet 392a4 may be included.

In addition, in the embodiment, the cooling water outlet 392b of the second group includes a fifth cooling water outlet 392b1, a sixth cooling water outlet 392b2, and a seventh cooling water outlet 3 extending in the vertical direction of the ground on which the gas cylinder 110 is disposed. 392b3) and an eighth cooling water outlet 392b4 may be included.

The fifth cooling water outlet 392b1 may extend in a vertical direction with the fifth cooling water inlet 392a1. In addition, the sixth cooling water outlet 392b2 may extend in a vertical direction with the sixth cooling water inlet 392a2. In addition, the seventh cooling water outlet 392b3 may extend in a vertical direction with the seventh cooling water inlet 392a3. The eighth cooling water outlet 392b4 may extend in a vertical direction with the eighth cooling water inlet 392a4.

The temperature control device according to the embodiment has a second group of cooling water inlets 392a and a second group of cooling water outlets 392b extending in the vertical direction of the ground on which the gas cylinder 110 is disposed, thereby ensuring even distribution of cooling water. There is a possible effect.

In addition, according to the embodiment, it is possible to provide a temperature control device capable of controlling the temperature for each region of a gas cylinder capable of providing an optimum process condition for each process.

In addition, the embodiment is provided with a thermal electronic jacket capable of heating and cooling using a thermoelectric element, and in particular, one of the technical features is that temperature control of an optional portion of the thermal electronic device is possible.

In addition, according to the embodiment, as temperature control of an optional part is possible, the utilization efficiency of the controlled object can be increased and the overall energy saving effect of the thermoelectric jacket can be maximized.

In addition, according to the embodiment, since the temperature can be selectively controlled only in a necessary area, there is a technical effect that can be applied to gas cylinders of various sizes.

In addition, according to the embodiment, there is a technical effect of reducing power consumption by cutting off power supply to an unnecessary area through temperature control in a necessary area.

In particular, according to the embodiment, the optimum process can be carried out by precisely controlling the appropriate temperature required for the semiconductor manufacturing process or the special gas for LCD and OLED manufacturing processes to maintain a stable state to meet the optimum process conditions for each process. There is a technical effect of providing a temperature control device capable of controlling the temperature of the gas cylinder by region.

In addition, according to the embodiment, there is a special technical effect of preventing the occurrence of contaminants in the gas cylinder by maintaining the temperature of the gas cylinder in which the special gas is stored at a specific temperature.

In addition, according to the embodiment, there is a special technical effect in that the gas contained in the gas cylinder is controlled differently for each region so that all of the gas contained in the gas cylinder can be used without leaving almost any gas.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, and the like exemplified in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be interpreted as being included in the scope of the embodiments.

Although the embodiments have been described above, these are only examples and are not intended to limit the embodiments, and those of ordinary skill in the field to which the embodiments belong to various embodiments not illustrated above without departing from the essential characteristics of the embodiment. It will be seen that branch transformation and application are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set in the appended claims.

Claims (6)

A heat conduction unit including a first heat conduction unit module disposed in a first region of a predetermined gas cylinder and a second heat conduction unit module disposed in a second region of the gas cylinder;
And a thermoelectric module unit including a first thermoelectric module disposed on the first heat conducting unit module and a second thermoelectric module disposed on the second heat conducting unit module, and
The heat conduction unit is a temperature control device capable of controlling a temperature for each region of a gas cylinder that is detachable from an outer surface of the gas cylinder. According to claim 1,
The first thermoelectric module and the second thermoelectric module are controlled at different temperatures,
A temperature control device capable of controlling temperature for each area of the gas cylinder, further comprising a temperature sensor measuring the temperature of the gas cylinder. According to claim 1,
A temperature control device capable of controlling the temperature of the gas cylinder in which the temperature of the first thermoelectric module is equal to or lower than the temperature of the second thermoelectric module. The method according to any one of claims 1 to 3,
A temperature control device capable of controlling a temperature for each region of a gas cylinder having a first group of cooling water inlets and a first group of cooling water outlets branched by region. The method of claim 4,
And a first cooling water inlet and a first cooling water outlet disposed on the first heat conduction unit module,
And a second cooling water inlet and a second cooling water outlet disposed on the second heat conduction unit module,
The first cooling water inlet and the first cooling water outlet are a temperature control device capable of controlling the temperature of each region of the gas cylinder disposed in a horizontal direction of the ground on which the gas cylinder is disposed. The method according to any one of claims 1 to 3,
A temperature control device capable of controlling a temperature for each region of a gas cylinder having a second group of cooling water inlets and a second group of cooling water outlets extending in a vertical direction of a ground on which the gas cylinders are disposed.

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