KR20200092990A - Sealing composition and semiconductor device - Google Patents

Abstract

The sealing composition contains an epoxy resin, a curing agent, and an inorganic filler containing particles of an inorganic material having a Mohs hardness of 8 or more and particles of an inorganic material having a Mohs hardness of 5 or less.

Description

Sealing composition and semiconductor device

The present invention relates to a sealing composition and a semiconductor device.

In recent years, with the miniaturization and high integration of the semiconductor package, heat generation inside the semiconductor package is concerned. Due to heat generation, there is a fear that performance deterioration of an electrical component or an electronic component having a semiconductor package occurs. Therefore, high thermal conductivity is required for the member used for the semiconductor package. For example, it is desired to make the sealing material of a semiconductor package highly heat-conductive.

As one of the methods for making the sealing material highly heat-conducting, a method of using silica and alumina, which is a high-heat-conducting filler, is used as an inorganic filler contained in the sealing material (for example, see Patent Document 1).

Moreover, when sealing a semiconductor package with a sealing material, warping after sealing may become a problem in some cases. This problem tends to become prominent in the case of compression mold molding, which is a bulk sealing in a large area. In addition to this, when the semiconductor package after sealing receives various thermal histories, the bending behavior of the semiconductor package may change. As a result, there is a concern that handling of the semiconductor package in other processes becomes difficult.

Japanese Patent No. 4188634

In the method described in Patent Literature 1, sufficient thermal conductivity may not be obtained because silica having a lower thermal conductivity than that of alumina is used as part of the inorganic filler.

In addition, since both silica and alumina are hard fillers, the elastic modulus of the cured product tends to increase. When the elastic modulus of the cured product rises, warpage may occur in the semiconductor package after sealing, such that handling in other processes becomes difficult.

One aspect of the present invention is made in view of the above-mentioned conventional circumstances, and has an object to provide a sealing composition having high thermal conductivity and suppressing the occurrence of warpage and a semiconductor device using the same.

Specific means for achieving the above object are as follows.

<1> A sealing composition containing an epoxy filler, a curing agent, and an inorganic filler containing particles of an inorganic material having a Mohs hardness of 8 or more and particles of an inorganic material having a Mohs hardness of 5 or less.

<2> The sealing composition according to <1>, wherein the average circularity of the particles of the inorganic material having a Mohs hardness of 5 or less is 0.6 or more.

<3> The sealing composition according to <1> or <2>, wherein a particle ratio of the inorganic material having a Mohs hardness of 5 or less in the inorganic filler is less than 30% by mass.

<4> The sealing composition according to any one of <1> to <3>, wherein the content of the inorganic filler is 88 vol% or less.

<5> A semiconductor device comprising a semiconductor element and a cured product of the sealing composition according to any one of <1> to <4>, which is formed by sealing the semiconductor element.

According to one aspect of the present invention, it is possible to provide a sealing composition having high thermal conductivity and suppressing occurrence of warpage and a semiconductor device using the same.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing the sealing composition of this invention and a semiconductor device is demonstrated in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential except where specifically indicated. The same applies to numerical values and ranges thereof, and does not limit the present invention.

In the numerical range shown by using "to" in this disclosure, the numerical values described before and after "to" are included as the minimum value and the maximum value, respectively.

In the numerical ranges described in stages during the present disclosure, the upper or lower limit values described in one numerical range may be substituted with the upper or lower limit values of the numerical ranges in another stepwise description. In addition, in the numerical range described during this disclosure, the upper limit value or the lower limit value of the numerical range may be substituted with the values shown in the examples.

In the present disclosure, each component may contain a plurality of substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component means the total content or content of the plurality of substances present in the composition, unless otherwise specified.

In this disclosure, the particle|grains corresponding to each component may contain multiple types. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component means a value relating to a mixture of the plurality of particles present in the composition, unless otherwise specified.

<Sealing composition>

The sealing composition of the present disclosure may be referred to as "hard particles" (hereinafter, referred to as "hard particles") of an epoxy resin, a curing agent, and an inorganic material having a Mohs hardness of 8 or more (hereinafter sometimes referred to as "hard material"). ) And an inorganic filler containing particles of an inorganic material having a Mohs hardness of 5 or less (hereinafter sometimes referred to as "soft material") (hereinafter sometimes referred to as "soft particle").

The sealing composition of the present disclosure has high thermal conductivity and suppression of warpage is suppressed. Although the reason is not clear, it estimates as follows.

The sealing composition contains hard particles and soft particles as an inorganic filler. In the hardened|cured material of a sealing composition, when hard particles come into contact, since the said particle is hard, the contact between hard particles becomes point contact on the particle surface. On the other hand, in the hardened|cured material of a sealing composition, when a hard particle and a soft particle contact, the soft particle which contacted the hard particle is deformed at the place which contacts a hard particle, and it is easy to make surface contact between a hard particle and a soft particle. Compared to the case where the particles are in a point contact state, the heat conduction path formed between the inorganic fillers tends to be wider when the particles are in a surface contact state. Therefore, it is presumed that the sealing composition of the present disclosure containing hard particles and soft particles as an inorganic filler has high thermal conductivity.

Moreover, compared with the case where only the hard particles are contained as the inorganic filler, in the sealing composition of the present disclosure comprising soft particles as the inorganic filler together with the hard particles, the elastic modulus of the cured product is lowered. Therefore, it is presumed that the strain generated in the cured product is likely to be alleviated, and the occurrence of warpage is suppressed.

Hereinafter, each component constituting the sealing composition will be described. The sealing composition of the present disclosure may contain an epoxy resin, a curing agent, and an inorganic filler, and may contain other components as necessary.

-Epoxy resin-

The sealing composition contains an epoxy resin. The type of the epoxy resin is not particularly limited, and a known epoxy resin can be used.

Specifically, for example, phenol compounds (eg, phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F) and naphthol compounds (eg α-naphthol, β-naphthol And dihydroxynaphthalene), a furnace obtained by condensation or co-condensation of at least one member selected from the group consisting of aldehyde compounds (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst. Epoxidation of the volak resin (for example, phenol novolak type epoxy resin and orthocresol novolak type epoxy resin); At least one diglycidyl ether selected from the group consisting of bisphenols (eg, bisphenol A, bisphenol AD, bisphenol F and bisphenol S) and biphenols (eg, alkyl substituted or unsubstituted biphenols). ; Epoxides of phenol-aralkyl resins; Epoxides of adducts or polyadditions of at least one member selected from the group consisting of phenolic compounds and dicyclopentadiene and terpene compounds; Glycidyl ester type epoxy resins obtained by reaction of polybasic acids (eg, phthalic acid and dimer acid) with epichlorohydrin; Glycidylamine-type epoxy resins obtained by reaction of polyamines (eg, diaminodiphenylmethane and isocyanuric acid) with epichlorohydrin; Linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids (eg, peracetic acid); And an alicyclic epoxy resin is mentioned. Epoxy resins may be used alone or in combination of two or more.

From the viewpoint of corrosion prevention of aluminum wiring or copper wiring on an element such as an integrated circuit (IC), the purity of the epoxy resin is preferably high, and the amount of hydrolyzable chlorine is preferably low. From the viewpoint of improving the moisture resistance of the sealing composition, the amount of hydrolyzable chlorine is preferably 500 ppm or less based on mass.

Here, the amount of hydrolyzable chlorine is a value obtained by dissolving 1 g of the epoxy resin in the sample in 30 mL of dioxane, adding 5 mL of 1N-KOH methanol solution and refluxing for 30 minutes, followed by potentiometric titration.

The content of the epoxy resin occupied by the sealing composition is preferably 1.5% by mass to 20% by mass, more preferably 2.0% by mass to 15% by mass, and even more preferably 3.0% by mass to 10% by mass.

The content of the epoxy resin in the sealing composition excluding the inorganic filler is preferably 30% by mass to 65% by mass, more preferably 35% by mass to 60% by mass, and even more preferably 40% by mass to 55% by mass desirable.

-Hardener-

The sealing composition contains a curing agent. The type of curing agent is not particularly limited, and a known curing agent can be used.

Specifically, for example, phenolic compounds (eg, phenol, cresol, resorcin, catechol, bisphenol A and bisphenol F) and naphthol compounds (eg α-naphthol, β-naphthol and dihydroxy Naphthalene) and a novolac resin obtained by condensation or co-condensation of at least one selected from the group consisting of aldehyde compounds (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst; Phenol aralkyl resins; Biphenyl aralkyl resin; Triphenylmethane type phenol resin; And naphthol aralkyl resins. One type of curing agent may be used alone, or two or more types may be used in combination.

It is preferable that the curing agent is blended so that the equivalent of the functional group of the curing agent (for example, phenolic hydroxyl group in the case of novolac resin) is 0.5 to 1.5 equivalents based on 1 equivalent of the epoxy group of the epoxy resin, particularly, 0.7 equivalents to It is preferable that the curing agent is blended to have 1.2 equivalents.

-Inorganic filler-

The sealing composition contains an inorganic filler containing particles of an inorganic material having a Mohs hardness of 8 or more and particles of an inorganic material having a Mohs hardness of 5 or less. When the sealing composition contains an inorganic filler, the hygroscopicity of the sealing composition is reduced, and the strength in the cured state tends to be improved.

The content of the inorganic filler is preferably 60% by volume or more, more preferably 65% by volume or more, and more preferably 70% by volume or more, from the viewpoint of hygroscopicity, reduction in coefficient of linear expansion, strength improvement and solder heat resistance. desirable. The content of the inorganic filler is preferably 88% by volume or less, and more preferably 85% by volume or less.

Examples of the hard material include alumina (Mohs hardness: 9), aluminum nitride, silicon carbide, and diamond. Among these, alumina is preferred from the viewpoints of thermal conductivity, fluidity and reliability. The hard material has a Mohs hardness of 8 or more, and preferably 9 or more. The Mohs hardness of a hard material may be 10 or less.

The average particle diameter of the hard particles is preferably 0.1 μm to 80 μm, more preferably 0.3 μm to 50 μm, and even more preferably 1 μm to 40 μm.

The average particle diameter of the inorganic filler can be measured by the following method.

To the solvent (pure water), the inorganic filler to be measured is added within a range of 0.01% by mass to 0.05% by mass, vibrated for 1 minute to 5 minutes with a 110W ultrasonic cleaner, and the inorganic filler is dispersed. About 10 mL of the dispersion is injected into the measuring cell and measured at 25°C. The measurement device uses a laser diffraction/scattering type particle size distribution measuring device (for example, Horiba Seisakusho, LA920 (trade name)) to measure the particle size distribution based on volume. The average particle diameter is determined as the particle diameter (D50%) when the accumulation from the small diameter side becomes 50% in the volume-based particle size distribution.

The proportion of the hard particles in the inorganic filler is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. The proportion of the hard particles in the inorganic filler may be 95% by mass or less.

The average circularity of the hard particles is preferably 0.80 or more, more preferably 0.85 or more, and even more preferably 0.90 or more.

The circularity of the inorganic filler is calculated by dividing the circumferential length as a circle calculated from the circle equivalent diameter, which is the diameter of a circle having the same area as the projection area of the inorganic filler, by the circumferential length (the length of the outline) measured from the projection image of the inorganic filler. It is a numerical value obtained and is calculated|required by the following formula. In addition, the circularity is 1.00 in the true circle.

Roundness = (circumferential length of equivalent circle)/(circumferential length on particle cross section)

Specifically, the average circularity is observed by an image magnified at a magnification of 1000 times with a scanning electron microscope, arbitrarily selecting 10 inorganic fillers, measuring the circularity of each inorganic filler by the above method, and calculating it as an arithmetic mean value thereof Is the value. Incidentally, the circularity, the circumferential length of the equivalent circle, and the circumferential length of the projected image of the particle can be obtained by commercially available image analysis software.

Examples of the soft material include boehmite (Mohs hardness: 3.5 to 4), dolomite, mica, hexagonal boron nitride, and the like. Among these, boehmite and dolomite are preferred from the viewpoint of fluidity.

The Mohs hardness of the soft material is preferably 5 or less, and 4 or less. The Mohs hardness of the soft material may be two or more.

The average particle diameter of the soft particles is preferably 0.1 μm to 20 μm, more preferably 0.3 μm to 10 μm, and even more preferably 0.5 μm to 5 μm.

The proportion of soft particles in the inorganic filler is preferably less than 30% by mass, more preferably 20% by mass or less, and even more preferably 10% by mass or less. The proportion of the soft particles in the inorganic filler may be 5% by mass or more.

The average circularity of the soft particles is preferably 0.6 or more, more preferably 0.7 or more, and even more preferably 0.8 or more.

The inorganic filler may contain particles of other inorganic materials having a Mohs hardness of more than 5 and less than 8, other than hard particles and soft particles. Examples of other inorganic materials include silica (Mohs hardness: 7), magnesium oxide, and zinc oxide.

The particle ratio of other inorganic materials occupied by the inorganic filler may be 10% by mass or less, or 1% by mass or less.

(Curing accelerator)

The sealing composition may further contain a curing accelerator. The type of curing accelerator is not particularly limited, and a known curing accelerator can be used.

Specifically, 1,8-diaza-bicyclo[5.4.0]undecene-7,1,5-diaza-bicyclo[4.3.0]nonene, 5,6-dibutylamino-1,8 Cycloamidine compounds such as -diaza-bicyclo[5.4.0]undecene-7; Maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3 to cycloamidine compound -Quinone compounds such as dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, diazophenylmethane, phenol resin, etc. A compound having an intramolecular polarization formed by adding a compound having a π bond of; Tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of tertiary amine compounds; Imidazole compounds such as 2-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole, and derivatives of imidazole compounds; Organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris(4-methylphenyl)phosphine, diphenylphosphine, and phenylphosphine; A phosphorus compound having an intramolecular polarization formed by adding a compound having a π bond such as maleic anhydride, the quinone compound, diazophenylmethane, or phenol resin to the organic phosphine compound; Tetraphenylboronate salts such as tetraphenylphosphoniumtetraphenylborate, triphenylphosphinetetraphenylborate, 2-ethyl-4-methylimidazoletetraphenylborate, and N-methylmorpholinetetraphenylborate, and derivatives of tetraphenylboron salt ; And phosphine compounds such as triphenylphosphonium-triphenylborane and N-methylmorpholinetetraphenylphosphonium-tetraphenylborate, and adducts of tetraphenylborone salts. The curing accelerator may be used alone or in combination of two or more.

It is preferable that content rate of a hardening accelerator is 0.1 mass%-8 mass% with respect to the total amount of an epoxy resin and a hardening agent.

(Ion trap agent)

The sealing composition may further contain an ion trap agent.

The ion trap agent that can be used in the present disclosure is not particularly limited as long as it is an ion trap agent that is generally used in the sealing material used for the production use of semiconductor devices, and hydrotalcite. As an ion trap agent, you may use the compound represented by the following general formula (II-1) or the following general formula (II-2), for example.

Mg _1-a Al _a (OH) ₂ (CO ₃ ) _a/2 uH ₂ O (II-1)

(In general formula (II-1), a is 0<a≤0.5, and u is a positive number.)

BiO _b (OH) _c (NO ₃ ) _d (II-2)

(In the general formula (II-2), b is 0.9≤b≤1.1, c is 0.6≤c≤0.8, and d is 0.2≤d≤0.4.)

The ion trap agent is available as a commercial product. As a compound represented by general formula (II-1), for example, "DHT-4A" (Kyowa Kagaku Kogyo Co., Ltd., a brand name) can be obtained as a commercial item. Moreover, as a compound represented by general formula (II-2), "IXE500" (Doase Kose Co., Ltd., brand name) can be obtained as a commercial item, for example.

In addition, as the ion trapping agent other than the above, hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony, and the like can be mentioned.

The ion trapping agent may be used alone or in combination of two or more.

When the sealing composition contains an ion trap agent, the content of the ion trap agent is preferably 1 part by mass or more with respect to 100 parts by mass of the epoxy resin in the sealing composition from the viewpoint of realizing sufficient moisture proof reliability. From the viewpoint of sufficiently exerting the effects of other components, the content of the ion trap agent is preferably 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin in the sealing composition.

Moreover, it is preferable that the average particle diameter of an ion trap agent is 0.1 micrometer-3.0 micrometers, and it is preferable that the maximum particle diameter is 10 micrometers or less. The average particle diameter of the ion trap agent can be measured in the same manner as in the case of the inorganic filler.

(Coupling agent)

The sealing composition may further contain a coupling agent. The type of the coupling agent is not particularly limited, and a known coupling agent can be used. As a coupling agent, a silane coupling agent and a titanium coupling agent are mentioned, for example. The coupling agent may be used alone or in combination of two or more.

Examples of the silane coupling agent include vinyl trichlorosilane, vinyl triethoxysilane, vinyl tris(β-methoxyethoxy)silane, γ-methacryloxypropyl trimethoxysilane, β-(3,4- Epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-[bis (β-hydroxyethyl)]aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethyl)aminopropyldimethoxymethylsilane, N- (Trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ- Aminopropyl trimethoxysilane, γ-chloropropyl trimethoxysilane, hexamethyldisilane, γ-anilinopropyl trimethoxysilane (N-phenyl-3-aminopropyl trimethoxysilane), vinyl trimethoxysilane And γ-mercaptopropylmethyldimethoxysilane.

As a titanium coupling agent, for example, isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (Ditridecylphosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecylphosphite) titanate, bis(dioctylpyrophosphate)oxyacetate titanate, bis (Dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl di Acrylic titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate and tetraisopropyl bis (dioctyl phosphite) titanate.

When the sealing composition contains a coupling agent, the content of the coupling agent is preferably 3% by mass or less with respect to the entire sealing composition, and from the viewpoint of exerting its effect, it is preferably 0.1% by mass or more.

(Release agent)

The sealing composition may further contain a release agent. The type of the release agent is not particularly limited, and a known release agent can be used. Specifically, higher fatty acids, higher fatty acid esters, carnauba wax, and polyethylene-based waxes are exemplified. The mold release agent may be used alone or in combination of two or more.

When the sealing composition contains a mold release agent, the content ratio of the mold release agent is preferably 10% by mass or less with respect to the total amount of the epoxy resin and the curing agent, and from the viewpoint of exerting its effect, it is preferably 0.5% by mass or more.

(Colorants and modifiers)

The sealing composition may contain a coloring agent (for example, carbon black). Moreover, the sealing composition may contain a modifier (for example, silicone and silicone rubber). The colorant and the modifier may be used alone or in combination of two or more.

When using electroconductive particles, such as carbon black, as a coloring agent, it is preferable that electroconductive particle has a particle content of 10 micrometers or more in particle diameter of 1 mass% or less.

When the sealing composition contains conductive particles, the content of the conductive particles is preferably 3% by mass or less with respect to the total amount of the epoxy resin and the curing agent.

<Production method of sealing composition>

The method for producing the sealing composition is not particularly limited and can be performed by a known method. For example, it can be produced by sufficiently mixing a mixture of raw materials of a predetermined compounding amount with a mixer or the like, kneading it with a heat roll, an extruder, or the like, and undergoing treatments such as cooling and grinding. The state of the sealing composition is not particularly limited, and may be a powder, solid, liquid, or the like.

<Semiconductor device>

The semiconductor device of the present disclosure includes a semiconductor element and a cured product of the sealing composition of the present disclosure formed by sealing the semiconductor element.

The method of sealing a semiconductor element using a sealing composition is not particularly limited, and a known method can be applied. For example, the transfer mold method is common, but a compression mold method, an injection molding method, or the like may be used.

The semiconductor device of the present disclosure is suitable as an IC, large-scale integration (LSI), or a large-scale integrated circuit.

Example

Examples of the present invention will be described below, but the present invention is not limited to these. In addition, the numerical values in a table mean "parts by mass", unless otherwise specified.

(Examples 1 to 2 and Comparative Examples 1 to 2)

After pre-mixing (dry blending) the materials of the formulation shown in Table 1, kneading with a biaxial roll (roll surface temperature: about 80° C.) for about 15 minutes, followed by cooling and grinding to prepare a powdery sealing composition.

The details of the materials in Table 1 are as follows, respectively.

(Epoxy resin)

E1: biphenyl type epoxy resin, epoxy equivalent: 192 g/eq

E2: bisphenol-type epoxy resin, epoxy equivalent: 192 g/eq

(Curing agent)

H1: polyfunctional phenolic resin, triphenylmethane type phenolic resin having a hydroxyl group equivalent of 104 g/eq

(Curing accelerator)

Phosphorus hardening accelerator (organic compound)

(Coupling agent)

Anilinosilane (N-phenyl-3-aminopropyltrimethoxysilane)

(Release agent)

Carnauba wax

(Stress reliever)

Silicone resin

(coloring agent)

Carbon: carbon black

(Weapon filler)

·Hard particles

HF1: Alumina filler (average particle diameter: 10 µm)

HF2: Alumina filler (average particle diameter: 0.7 µm)

·Soft particles

SF1: Boehmite (average particle diameter: 1.7 µm, average circularity: 0.95)

Silica (average particle diameter: 1.4㎛)

<Evaluation of thermal conductivity>

Using the sealing composition obtained above, a semiconductor element was sealed under a condition of a mold temperature of 175°C to 180°C, a molding pressure of 7 MPa, and a curing time of 150 seconds by a compression molding machine to prepare a test piece for evaluating thermal conductivity. Next, the thermal conductivity of the test piece was measured by the xenon flash (Xe-flash) method. The thermal conductivity of 4.0 W/(m·K) or higher was referred to as A, and less than 4.0 W/(m·K) was referred to as B.

<Evaluation of warpage>

The bending evaluation of the sealing composition was performed as follows. Specifically, using the sealing composition obtained above, transfer molding was performed under conditions of a mold temperature of 180°C, a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a package of 40 mm x 40 mm. About this package, the amount of warpage at room temperature (25 degreeC) and the amount of warpage at high temperature (250 degreeC) were measured after heating at 250 degreeC for 30 minutes using a laser displacement meter. In addition, the amount of warpage at room temperature (25°C) and the amount of warpage after high-temperature heating were all referred to as A of 400 µm or less, and B when at least one of them exceeded 400 µm.

As shown in the results in Table 2, the thermal conductivity can be improved by containing hard particles and soft particles as the inorganic filler. This is presumed to be because, when the hard particles and the soft particles are in contact, the soft particles in contact with the hard particles are deformed at places where the hard particles are in contact, and the hard particles and the soft particles form surface contacts. In addition, since the proportion of the filler of the high-elasticity alumina can be lowered, it is estimated that the elastic modulus of the cured product is lowered, the deformation generated in the cured product is relaxed, and the occurrence of warpage is suppressed.

As for the indication of the Japanese patent application 2017-246587 for which it applied on December 22, 2017, the whole is taken in into this specification by reference.

All documents, patent applications, and technical specifications described in this specification are incorporated by reference in the present specification to the same extent as when individual documents, patent applications, and technical specifications are specifically and individually described by reference. do.

Claims (5)

A sealing composition containing an epoxy resin, a curing agent, and an inorganic filler containing particles of an inorganic material having a Mohs hardness of 8 or more and particles of an inorganic material having a Mohs hardness of 5 or less. The sealing composition according to claim 1, wherein the average circularity of the particles of the inorganic material having a Mohs hardness of 5 or less is 0.6 or more. The sealing composition according to claim 1 or 2, wherein a particle ratio of the inorganic material having a Mohs hardness of 5 or less in the inorganic filler is less than 30% by mass. The sealing composition according to any one of claims 1 to 3, wherein the content of the inorganic filler is 88% by volume or less. A semiconductor device comprising a semiconductor element and a cured product of the sealing composition according to any one of claims 1 to 4 formed by sealing the semiconductor element.