KR20200083251A - SiC 기판의 분단 방법 및 분단 장치 - Google Patents

SiC 기판의 분단 방법 및 분단 장치 Download PDF

Info

Publication number
KR20200083251A
KR20200083251A KR1020190171405A KR20190171405A KR20200083251A KR 20200083251 A KR20200083251 A KR 20200083251A KR 1020190171405 A KR1020190171405 A KR 1020190171405A KR 20190171405 A KR20190171405 A KR 20190171405A KR 20200083251 A KR20200083251 A KR 20200083251A
Authority
KR
South Korea
Prior art keywords
sic substrate
scribe line
dividing
main surface
divided
Prior art date
Application number
KR1020190171405A
Other languages
English (en)
Korean (ko)
Inventor
히로시 니와야마
유항 미야자키
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20200083251A publication Critical patent/KR20200083251A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B28D1/223—Hand-held or hand-operated tools for shearing or cleaving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
KR1020190171405A 2018-12-28 2019-12-20 SiC 기판의 분단 방법 및 분단 장치 KR20200083251A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-247950 2018-12-28
JP2018247950A JP2020107839A (ja) 2018-12-28 2018-12-28 ＳｉＣ基板の分断方法及び分断装置

Publications (1)

Publication Number Publication Date
KR20200083251A true KR20200083251A (ko) 2020-07-08

Family

ID=71449515

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190171405A KR20200083251A (ko) 2018-12-28 2019-12-20 SiC 기판의 분단 방법 및 분단 장치

Country Status (4)

Country Link
JP (1) JP2020107839A (zh)
KR (1) KR20200083251A (zh)
CN (1) CN111438442A (zh)
TW (1) TW202039138A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115521056A (zh) * 2022-10-25 2022-12-27 深圳市益铂晶科技有限公司 一种玻璃激光切割的劈裂方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066687A (ja) 2003-08-28 2005-03-17 National Institute Of Advanced Industrial & Technology 透明材料の微細アブレーション加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066687A (ja) 2003-08-28 2005-03-17 National Institute Of Advanced Industrial & Technology 透明材料の微細アブレーション加工方法

Also Published As

Publication number Publication date
CN111438442A (zh) 2020-07-24
TW202039138A (zh) 2020-11-01
JP2020107839A (ja) 2020-07-09

Similar Documents

Publication Publication Date Title
CN104838483B (zh) 晶片划切装置和晶片划切方法
JP7320130B2 (ja) 緩和された正の湾曲を有する炭化ケイ素ウェーハを処理するための方法
JP6703286B2 (ja) 脆性材料の切断方法
TWI522200B (zh) Laser processing method
KR101183865B1 (ko) 취성 재료 기판의 모따기 가공 방법 및 모따기 가공 장치
TWI392550B (zh) Method for processing brittle material substrates
JP2000156358A (ja) レ―ザ―を用いる透明媒質の加工装置及び加工方法
TW200920534A (en) Method for cutting a fragile material substrate
KR20150123694A (ko) 브레이크 방법 그리고 브레이크 장치
WO2009157319A1 (ja) 面取り加工装置
JP2011240363A (ja) ウェハ状基板の分割方法
KR20110106360A (ko) 취성 재료의 분할 장치 및 할단 방법
TWI703037B (zh) 貼合基板之分割方法及分割裝置
TW407329B (en) Manual precision micro-cleavage method
KR20200083251A (ko) SiC 기판의 분단 방법 및 분단 장치
TW201516010A (zh) 彈性支撐板、斷裂裝置及分斷方法
CN110301035A (zh) 剥离基板制造方法
JP5102557B2 (ja) サファイア基板の分断方法
JP3751122B2 (ja) 割断加工方法
JP2015074003A (ja) 内部加工層形成単結晶部材およびその製造方法
JP4298072B2 (ja) 硬質脆性板の割断方法
JPH10209086A (ja) 板状ワークの割断方法およびその装置
WO2017002656A1 (ja) ガラス板の切断方法、ガラス板の切断装置、及び切断ガラス板の製造方法
CN113649716A (zh) 硅棒快速解裂的激光加工装备及其方法
KR101924156B1 (ko) 취성 재료의 절단 방법 및 절단 장치