KR20200055012A - Adhesive film for semiconductor device manufacturing, and semiconductor device and method for manufacturing same - Google Patents

Abstract

The adhesive film according to the present disclosure includes a band-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged on the carrier film to be lined up in the longitudinal direction of the carrier film, and the adhesive piece is at least rectangular or square. On one side, at least one of the convex portion and the concave portion has a shape. A semiconductor device according to the present disclosure includes a semiconductor chip, a substrate to which the semiconductor chip is electrically connected, an adhesive piece disposed between the semiconductor chip and the substrate, and adhering the semiconductor chip to the substrate, the shape of the semiconductor chip And the shape of the adhesive piece are different.

Description

Adhesive film for semiconductor device manufacturing, and semiconductor device and method for manufacturing same

The present disclosure relates to an adhesive film used in a semiconductor device manufacturing process, and a semiconductor device and a method for manufacturing the same.

Conventionally, a semiconductor device is manufactured through the following steps. First, a semiconductor wafer is pasted to an adhesive sheet for dicing, and in that state, the semiconductor wafer is divided into semiconductor chips. Thereafter, a pick-up process, a mounting process, a reflow process, and a die bonding process are performed. Patent document 1 discloses a point adhesive sheet (dicing die bonding sheet) having both a function of fixing a semiconductor wafer in a dicing step and a function of adhering a semiconductor chip to a substrate in a die bonding step.

Patent Document 1: Japanese Patent Publication No. 2007-288170

By the way, in recent years, with the evolution of semiconductor devices for small devices typified by smartphones, the manufacturing process of semiconductor devices has also changed significantly from the prior art. For example, the commercialization of the process which does not perform the dicing process and the die bonding process using the point adhesive sheet (dicing die bonding sheet) described in patent document 1, or the reflow process is in progress. Accordingly, there is a demand for a new aspect of the adhesive film used in the manufacturing process of the semiconductor device. In addition to this situation, the present inventors have developed a convenient adhesive film for use in adhering a semiconductor chip of a shape according to this to a limited area of a substrate in order to cope with the high functionality and thinning of a small device on which a semiconductor device is mounted. I proceeded.

In a conventional semiconductor device, it is common that the shape of a semiconductor chip and the shape of an adhesive piece for adhering it to a substrate are the same, for example, these shapes were rectangular or square. However, for example, when the area of the substrate to which the semiconductor chip is to be adhered is limited, or when electrical connection between the semiconductor chip and the substrate is required at a position different from the conventional one, the adhesive having a complicated shape compared to the conventional shape There is an increasing demand to use side.

This disclosure aims at providing the adhesive film provided with the adhesive piece of a complicated shape useful for efficiently performing the adhesive process in the manufacturing process of a semiconductor device. Moreover, this disclosure aims at providing the semiconductor device using the adhesive piece of a complicated shape, and its manufacturing method.

The adhesive film for manufacturing a semiconductor device according to the present disclosure includes a band-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged on the carrier film to line up in the longitudinal direction of the carrier film, and the adhesive pieces are rectangular or square. At least one of the convex portion and the concave portion has a shape formed on at least one side.

According to this adhesive film, a plurality of adhesive pieces arranged to line up on a carrier film can be sequentially picked up, and then, each adhesive piece can be arranged in a predetermined area of the substrate, and the bonding process between the substrate and the semiconductor chip is efficiently Can be implemented. For example, if the band-shaped adhesive film is wound around a reel, the adhesive process can be performed more efficiently by the roll-to-roll method. As described above, the adhesive piece has a more complicated shape than a rectangle or square. The shape of the adhesive piece may be appropriately set depending on the shape of the region of the substrate to which the semiconductor chip is to be bonded, or the shape of the semiconductor chip. For example, the adhesive piece may have 6 or more corners, or 8 or more corners. Moreover, L-shape is mentioned as an example of the shape of the adhesive piece which has six corners.

The size and number of adhesive pieces disposed on the carrier film may be appropriately set according to the design of the semiconductor device to be manufactured. For example, the area of one adhesive piece can be in the range of 10 to 200 mm 2. The ratio of the area covered by the plurality of adhesive pieces as the surface of the carrier film can be 10 to 60% based on the area of the carrier film. On the carrier film, one or a plurality of rows including the plurality of adhesive pieces may be formed.

The plurality of adhesive pieces can be formed, for example, by die cutting an adhesive layer formed to cover the surface of the carrier film. From the viewpoint of processability of the adhesive film (to prevent inadvertent peeling of the adhesive piece from the carrier film at the time of die cutting and thereafter), it is preferable that the adhesive force between the carrier film and the adhesive piece is 0.5 to 18 N / m. Do.

The adhesive film according to the present disclosure may further include a first member on the carrier film side of the adhesive piece and a second side on the opposite side, and may further include a protective member having the same shape as the adhesive piece. By covering the adhesive piece with a protective member, it is possible to prevent dust or the like from adhering to the adhesive piece until use. The adhesive piece and the protective member can be formed by die cutting an adhesive layer formed to cover the surface of the carrier film and a protective film disposed to cover the adhesive layer.

It is preferable that the light transmittance of the protective member is lower than the light transmittance of the carrier film. By adopting such a configuration, it becomes possible to recognize the position of the adhesive piece with a device such as a camera, and it is easy to fully automate the bonding process.

From the viewpoint of the workability of the bonding process of the semiconductor chip and the substrate, the adhesive force between the adhesive piece and the protective member is preferably 16 N / m or less. For example, when the adhesive piece contains a resin composition having thermosetting properties, after 10 minutes of heat treatment at 100 ° C, the adhesive force between the adhesive piece and the protective member is preferably 16 N / m or less.

According to the present disclosure, there is provided an adhesive film having an adhesive piece having a complex shape useful for efficiently performing an adhesive process in a manufacturing process of a semiconductor device. Further, according to the present disclosure, a semiconductor device using a complex-shaped adhesive piece and a method of manufacturing the same are provided.

1 is a perspective view schematically showing an embodiment of an adhesive film according to the present disclosure.
FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1.
3 (a) to 3 (f) are plan views showing deformation of the shape of the adhesive piece.
4 is a plan view showing an example of the arrangement of the T-shaped adhesive piece and the semiconductor chip.
5 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order.
6 is a perspective view showing a state in which a plurality of adhesive pieces are formed on a carrier film by die cutting.
7 is a cross-sectional view schematically showing a state in which an adhesive piece and a protective member covering it are picked up from a carrier film.
8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using an adhesive piece according to the present disclosure.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. In addition, this invention is not limited to the following embodiment. In the present specification, (meth) acrylic means acrylic or methacryl.

<Adhesive film for semiconductor device manufacturing>

1 is a perspective view schematically showing an adhesive film according to the present embodiment. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1. The adhesive film 10 shown in these drawings is lined up in the longitudinal direction (direction of the arrow X shown in FIG. 1) on the carrier film 1 and the carrier film 1 having a width of 100 mm or less. A plurality of adhesive pieces 3p are arranged, and a protective member 5p covering the surface F2 of the adhesive pieces 3p and having the same shape as the adhesive pieces 3p is provided. As shown in Fig. 2, the surface F2 (second side) of the adhesive piece 3p is opposite to the side F1 (first side) of the adhesive piece 3p on the carrier film 1 side. Noodles.

The adhesive film 10 is applicable to various bonding processes (for example, bonding of a semiconductor chip and a substrate) in the manufacturing process of a semiconductor device. According to the adhesive film 10, a plurality of adhesive pieces 3p arranged to line up on the carrier film 1 are sequentially picked up, and then, each adhesive piece 3p can be arranged in a predetermined area of the substrate, , It is possible to efficiently perform the bonding process between the substrate and the semiconductor chip. In addition, although FIG. 1 and FIG. 2 showed the case where one row 3A of columns containing a plurality of adhesive pieces 3p is provided on the carrier film 1, two or more rows 3A are shown. It may be provided on the carrier film 1.

As shown in Fig. 1, the adhesive piece 3p according to the present embodiment has a thick T-shaped shape (T-shaped). This shape has eight corners C1 to C8, as shown in Fig. 3A. Moreover, this shape can be said to be the shape in which one convex part was formed in the center part of one side of a rectangle, and it can also be said to be the shape in which one recessed part was formed in both ends of one side of a rectangle.

The shape of the adhesive piece 3p is not limited to the shape shown in Fig. 3 (a), and may be a shape in which at least one of the convex portion and the concave portion is formed on at least one side of the rectangle or square. For example, as shown in Fig. 3B, it may be L-shaped or may have six corners C1 to C6. As shown in (c) of FIG. 3, as a shape in which one recess is formed in a rectangle or square, it may have eight angles C1 to C8. As shown in Fig. 3 (d), a concave portion is formed at one corner portion (bottom left in Fig. 3 (d)) of a rectangle or square, and at one side (Fig. 3 (d)) As the shape of the convex portion formed on the right side], it may have 10 corners (C1 to C10). As shown in Fig. 3 (e), a convex portion is formed on one side of a rectangle or square, and a concave portion is formed on the other side, and may have 12 corners C1 to C12. In addition, the shape of the concave portion or convex portion may be triangular or arcuate, as shown in Fig. 3F.

The shape of the adhesive piece may be appropriately set depending on the shape of the region of the substrate to which the semiconductor chip is to be bonded, or the shape of the semiconductor chip. Further, when the semiconductor chip has, for example, a rectangular or square shape, and a plurality of terminals are provided at its corners, and the wiring between these terminals and the substrate is to be connected, so that the terminals and the wiring are not turned over by an adhesive piece. The shape of the adhesive piece may be determined. 4 is a plan view showing an example of the arrangement of the T-shaped adhesive piece 3p and the rectangular semiconductor chip S. In the regions R1 and R2 shown in Fig. 4, an adhesive does not exist between the substrate and the semiconductor chip, and it is possible to electrically connect the substrate and the semiconductor chip in these regions R1 and R2.

It is assumed that the size of the adhesive piece 3p in this embodiment is sufficiently small, and the area of one adhesive piece 3p is, for example, 10 to 200 mm 2 and may be 20 to 160 mm 2 or 25 to 100 mm 2 good. The proportion of the area covered by the plurality of adhesive pieces 3p as the surface of the carrier film 1 (area percentage of the adhesive piece) is, for example, 10 to 60% based on the area of the carrier film 1, 10 It may be -35% or 15-33%. In this area ratio, the area A of one adhesive piece 3p is the pitch of the adhesive piece 3p (pitch P in FIG. 1) and the carrier film provided on the carrier film 1. It may be calculated by dividing by the product of the width of (1) (width W in Fig. 1). That is, the area ratio R may be a value calculated by the following equation.

Area ratio R (%) = A / (P × W) × 100

Hereinafter, the configuration of the adhesive film 10 will be described.

[Carrier Film]

As described above, the carrier film 1 has a width of 100 mm or less as a band. The width of the carrier film 1 may be appropriately set depending on the size of the adhesive piece 3p disposed thereon and the number of rows 3A. For example, as shown in Fig. 1, when the number of rows 3A is one, the width of the carrier film 1 is preferably 10 to 50 mm, and may be 10 to 30 mm or 10 to 20 mm. When the roll-to-roll method is adopted because the width of the carrier film 1 is 10 mm or more, it is easy to prevent the workability deterioration due to the warping of the carrier film 1.

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied in the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive piece 3p and / or the protective member 5p disposed thereon. As the carrier film 1, polyester-based films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene- 1, polyolefin-based films such as homopolymers or copolymers such as ethylene-vinyl acetate copolymers and ethylene-ethyl acrylate copolymers, or mixtures thereof, plastic films such as polyvinyl chloride films, polyimide films, and the like can be used. . The carrier film 1 may have a single-layer structure or a multi-layer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, for example, 10 to 200 μm, or 20 to 100 μm or 25 to 80 μm. These thickness ranges are practically no problem and are economically effective ranges.

In order to increase the adhesive force of the adhesive piece 3p to the carrier film 1, the surface of the carrier film 1 is chemically treated, such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high pressure electric shock exposure, ionizing radiation treatment, or the like. Physical surface treatment may be performed. As the carrier film 1, a film having a low surface energy containing a fluorine resin can also be used. Such films include, for example, A-63 (release agent: modified silicone based) manufactured by Teijin Film Solutions, and A-31 (release agent: Pt based silicone based manufactured by Teijin Film Solutions), etc. There is this.

In order to prevent excessive adhesion of the adhesive piece 3p to the carrier film 1, the surface of the carrier film 1 is composed of a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkylacrylate-based release agent. A release layer may be formed.

The adhesive force between the carrier film 1 and the adhesive piece 3p is preferably 0.5 to 18 N / m, more preferably 2 to 10 N / m, and 2 to 6 N / m or 2 to 4 N / m may be sufficient. Since this adhesion is 0.5 N / m or more, it is easy to prevent inadvertent peeling of the adhesive piece 3p from the carrier film 1 in the process of manufacturing the adhesive film 10, while being 18 N / m or less , When using the adhesive film 10, it is easy to stably pick up the adhesive piece 3p and the protective member 5p covering it from the carrier film 1. In addition, the adhesive force of the adhesive piece 3p to the carrier film 1 means 90 ° peel strength, and specifically, a width of 20 mm made of the same composition as the adhesive piece 3p on the carrier film 1 It means the peel strength measured when the sample in which the adhesive layer was formed is prepared, and this adhesive layer is peeled from the carrier film at an angle of 90 ° and at a peeling rate of 50 mm / min.

[Adhesives]

The adhesive piece 3p is a protective member 5p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 ) Is formed with (see FIG. 6). The thickness of the adhesive piece 3p may be appropriately selected within a range that does not impair workability, for example, 3 to 50 μm, or 5 to 40 μm or 7 to 30 μm. When the thickness of the adhesive piece 3p is 3 µm or more, it is easy to secure sufficient adhesiveness, while, when it is 50 µm or less, it is easy to suppress the adhesive composition constituting the adhesive piece 3p from protruding from the protective member 5p. .

The adhesive composition constituting the adhesive piece 3p only needs to have properties (for example, adhesiveness and heat resistance to heat of about 150 ° C) that can be used without problems in the manufacturing process of the semiconductor device, and conventionally, the manufacturing process of the semiconductor device It is good to employ what is being used in the appropriate way. The adhesive piece 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and if necessary, may include a photoreactive monomer, a photopolymerization initiator, and the like. With the thinning of the substrate, a substrate having a low heat resistance tends to be used, and there is a tendency that a lowering of the manufacturing process of the semiconductor device is required. It is preferable that the adhesive piece 3p is capable of adhering the object under a temperature condition of 160 ° C or less.

(Thermoplastic resin)

As the thermoplastic resin, a resin having thermoplasticity or at least an uncured thermoplastic resin which forms a crosslinked structure after heating can be used. As a thermoplastic resin, a (meth) acrylic copolymer having a reactive group (hereinafter referred to as "reactive group-containing (meth) acrylic copolymer") in terms of excellent shrinkability, heat resistance, and peelability as a tape for semiconductor processing. ] Is preferred.

When a reactive group-containing (meth) acrylic copolymer is included as the thermoplastic resin, the adhesive piece 3p may be in a form that does not contain a thermosetting resin. That is, an aspect including a reactive group-containing (meth) acrylic copolymer, a curing accelerator, and a filler may be used.

Thermoplastic resin can be used individually by 1 type or in combination of 2 or more type.

Examples of the (meth) acrylic copolymer include (meth) acrylic acid ester copolymers such as acrylic resin and acrylic rubber, and acrylic rubber is preferred. The acrylic rubber is composed mainly of an acrylic acid ester, and is preferably formed by copolymerization of a monomer selected from (meth) acrylic acid esters and acrylonitrile.

As (meth) acrylic acid ester, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, Lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethyl Hexyl methacrylate, lauryl methacrylate, etc. are mentioned.

As the (meth) acrylic acid ester copolymer, a copolymer containing butylacrylate and acrylonitrile as the copolymerization component, and a copolymer containing ethylacrylate and acrylonitrile as the copolymerization component are preferable.

It is preferable that the reactive group-containing (meth) acrylic copolymer is a reactive group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth) acrylic copolymer can be obtained by copolymerizing a (meth) acrylic monomer having a reactive group and a monomer composition containing the above-described monomer.

As the reactive group, from the viewpoint of improving heat resistance, an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, and an episulfide group are preferable, and among them, an epoxy group and a carboxyl group are more preferable from the viewpoint of crosslinking property.

In the present embodiment, the reactive group-containing (meth) acrylic copolymer is preferably an epoxy group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having an epoxy group as a copolymerization component. In this case, as the (meth) acrylic monomer having an epoxy group, glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexyl methyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4-epoxycyclohexyl methyl methacrylate, etc. are mentioned. The (meth) acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate from the viewpoint of heat resistance.

It is preferable that Tg of a thermoplastic resin is -50 degreeC-50 degreeC. When the Tg of the thermoplastic resin is 50 ° C or less, it is easy to ensure the flexibility of the adhesive piece 3p. Moreover, when unevenness exists when sticking to an adherend, it becomes easy to follow, and has appropriate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is -50 ° C or higher, it is easy to suppress the flexibility of the adhesive piece 3p from being excessively high, and excellent handling properties, adhesiveness, and peelability can be achieved.

The Tg of the thermoplastic resin is a midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is a midpoint glass calculated by a method in accordance with JIS K 7121: 1987 by measuring the change in heat amount under the conditions of a temperature increase rate of 10 ° C / min and a measurement temperature of -80 to 80 ° C. Transition temperature.

It is preferable that the weight average molecular weight of a thermoplastic resin is 100,000 or more and 2 million or less. When the weight average molecular weight is 100,000 or more, when used for the purpose of temporarily fixing, it becomes easy to ensure heat resistance. On the other hand, when the weight average molecular weight is 2 million or less, when used for the purpose of temporarily fixing, it is easy to suppress a decrease in flow and a decrease in adhesiveness. From the above-mentioned viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 to 2 million, and more preferably 1 to 2 million. In addition, the weight average molecular weight is a polystyrene conversion value using a calibration curve by standard polystyrene by gel permeation chromatography (GPC).

When the (meth) acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, the content thereof is 0.1 to 20% by mass based on the total amount of the copolymerization component. It is preferable, it is more preferable that it is 0.5-15 mass%, and it is still more preferable that it is 1.0-10 mass%. When the content is within the above range, it is easy to achieve all of the flexibility, adhesiveness, and peelability of the adhesive piece 3p at a higher level.

As mentioned above, as the (meth) acrylic copolymer having a reactive group, one obtained by polymerization methods such as pearl polymerization and solution polymerization may be used. Alternatively, commercial products such as HTR-860P-3CSP (trade name, manufactured by Nagase Chemtex Co., Ltd.) may be used.

(Thermosetting resin)

As the thermosetting resin, any resin that is cured by heat can be used without particular limitation. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin. These can be used individually by 1 type or in combination of 2 or more type.

The epoxy resin is not particularly limited as long as it is cured and has a heat-resistant action. As the epoxy resin, bifunctional epoxy resins such as bisphenol A-type epoxy, phenol novolac-type epoxy resins, and novolac-type epoxy resins such as cresol novolac-type epoxy resins and the like can be used. As the epoxy resin, conventionally known ones such as polyfunctional epoxy resins, glycidylamine-type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins can be used.

As the bisphenol A type epoxy resin, epicoat 807, epicoat 815, epicoat 825, epicoat 827, epicoat 828, epicoat 834, epicoat 1001, epicoat 1004, epicoat 1007, epicoat 1009 (all of Mitsubishi Chemicals Co., Ltd.), DER-330, DER-301, DER-361 (all manufactured by Dow Chemical Co., Ltd.), YD8125, YDF8170 (all manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd.) and the like.

Examples of the phenol novolac-type epoxy resin include Epicoat 152, Epicoat 154 (all manufactured by Mitsubishi Chemical Corporation), EPPN-201 (manufactured by Nihon Kayaku Co., Ltd.), DEN-438 (manufactured by Dow Chemical Co., Ltd.), and the like. Can be lifted.

As o-cresol novolac-type epoxy resins, YDCN-700-10 (manufactured by Shinnitetsu Sumikkin Chemical Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN- And 1027 (all manufactured by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703, and YDCN704 (all manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd.).

As a polyfunctional epoxy resin, Epon 1031S (made by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan), Denacol EX-611, EX-614, EX-614B, EX-622, EX-512 , EX-521, EX-421, EX-411, EX-321 (all manufactured by Nagase Chemtex).

As an amine type epoxy resin, Epicoat 604 (made by Mitsubishi Chemical Corporation), YH-434 (made by Shinnitetsu Sumikin Chemical Co., Ltd.), TETRAD-X, TETRAD-C (all manufactured by Mitsubishi Chemical Corporation) , ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.), and the like.

Examples of the heterocycle-containing epoxy resin include araldite PT810 (manufactured by BASF Japan), ERL4234, ERL4299, ERL4221, and ERL4206 (all manufactured by Union Carbide). These epoxy resins can be used alone or in combination of two or more.

As an epoxy resin curing agent which is a part of the thermosetting resin component, known resins that are commonly used can be used. Specifically, bisphenols having at least two phenolic hydroxyl groups such as amines, polyamide, acid anhydride, polysulfide, boron trifluoride, bisphenol A, bisphenol F and bisphenol S in one molecule, phenol novolak resin, bisphenol A phenol resin, such as novolak resin and cresol novolak resin, etc. are mentioned. As the epoxy resin curing agent, phenol resins such as phenol novolak resins, bisphenol A novolak resins, and cresol novolak resins are particularly preferred from the viewpoint of excellent corrosion resistance during moisture absorption.

Moreover, the epoxy curing agent may be used simultaneously with the epoxy resin, or may be used alone.

Among the phenolic resin curing agents, phenolite LF4871, phenolite TD-2090, phenolite TD-2149, phenolite VH-4150, phenolite VH4170 (all manufactured by DIC Corporation, trade name), H-1 (Meiwa Kasei Co., Ltd.) Manufactured by Shikagaisha, brand name), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Mirex XL, Mirex XLC, Mirex XLC-LL, Mirex RN, Mirex RS, Mirex VR (all Mitsubishi Chemical Corporation) It is preferable to use a material having a structure such as Gaisha Co., Ltd.

The content of the thermosetting resin in the adhesive piece 3p is preferably 10 to 500 parts by mass, more preferably 30 to 450 parts by mass, and even more preferably 50 to 400 parts by mass relative to 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within the above range, it is easy to achieve excellent adhesion after the thermosetting of the adhesive piece 3p.

(Curing accelerator)

As the curing accelerator, imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphoniumtetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1 And 8-diazabicyclo [5,4,0] undecene-7-tetraphenylborate. These can be used individually by 1 type or in combination of 2 or more type.

When the adhesive piece 3p contains a (meth) acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator that accelerates curing of the epoxy group contained in the acrylic copolymer. Examples of the curing accelerator that accelerates curing of the epoxy group include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, imidazoline curing agents, triazine based curing agents, and phosphine curing agents. Among these, it is preferable that it is an imidazole-type hardener which can expect reduction of process time and improvement of workability from a viewpoint of fast-curing property, heat resistance, and peelability. These compounds can be used individually by 1 type or in combination of 2 or more type.

The content of the curing accelerator in the adhesive piece 3p is preferably 0.01 to 50 parts by mass, more preferably 0.02 to 20 parts by mass, and even more preferably 0.025 to 10 parts by mass relative to 100 parts by mass of the thermoplastic resin. When the content of the curing accelerator is within the above range, there is a tendency that the decrease in storage stability can be sufficiently suppressed while improving the curability of the adhesive piece 3p.

(Weapon filler)

It is preferable that the adhesive piece 3p contains an inorganic filler. Examples of the inorganic filler include metal fillers such as silver powder, gold powder, and copper powder, and non-metallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide, and ceramics. The weapon filler can be selected according to the desired function.

It is preferable that the inorganic filler has an organic group on the surface. Since the surface of the inorganic filler is modified by an organic group, both the dispersibility with respect to the organic solvent when preparing the varnish for forming the adhesive piece 3p, and the high elastic modulus and excellent peelability of the adhesive piece 3p are compatible. Easy to do

The inorganic filler having an organic group on the surface can be obtained by mixing, for example, a silane coupling agent represented by the following formula (B-1) with an inorganic filler and stirring at a temperature of 30 ° C or higher. The surface of the inorganic filler modified by an organic group can be confirmed by UV measurement, IR measurement, XPS measurement, or the like.

In formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, glycidoxy group, acryloyl group, methacryloyl group, mercapto group, amino group, vinyl group, isocyanate group and methacryloxy group, s represents 0 or an integer of 1 to 10, and R ¹¹ , R ¹² and R ¹³ each independently represent an alkyl group having 1 to 10 carbon atoms.

Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group and isobutyl group.

From the viewpoint of easy availability, the alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group, and a pentyl group. X is preferably an amino group, a glycidoxy group, a mercapto group, and an isocyanate group from the viewpoint of heat resistance, and more preferably a glycidoxy group and a mercapto group. S in Formula (B-1) is preferably 0 to 5, and more preferably 0 to 4, from the viewpoint of suppressing the film fluidity at high heat and improving heat resistance.

As a silane coupling agent, trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy ) Silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-isocyanatepropyl Triethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3 -(Triethoxysilyl) -1-propanamine, N, N'-bis (3- (trimethoxysilyl) propyl) ethylenediamine, polyoxyethylene Propyl trialkoxysilane, polyethoxydimethylsiloxane, and the like.

Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferable, and trimethoxyphenylsilane , 3-glycidoxypropyl trimethoxysilane and 3-mercaptopropyl trimethoxysilane are more preferable. A silane coupling agent can be used individually by 1 type or in combination of 2 or more type.

The content of the coupling agent is preferably from 0.01 to 50 parts by mass, more preferably from 0.05 to 20 parts by mass, and more preferably from 0.05 to 20 parts by mass, with respect to 100 parts by mass of the inorganic filler, from the viewpoint of achieving a balance between heat resistance and storage stability. , 0.5 to 10 parts by mass is more preferable.

The content of the inorganic filler in the adhesive piece 3p is preferably 600 parts by mass or less, more preferably 500 parts by mass or less, and even more preferably 400 parts by mass or less, based on 100 parts by mass of the thermoplastic resin. Although there is no restriction | limiting in particular in the lower limit of content of an inorganic filler, It is preferable that it is 5 mass parts or more with respect to 100 mass parts of thermoplastic resins, and it is more preferable that it is 8 mass parts or more. By setting the content of the inorganic filler in the above range, shrinkage due to thermal curing can be suppressed, and it is easy to achieve high elastic modulus and excellent peelability of the adhesive piece 3p.

(Organic filler)

The adhesive piece 3p may contain an organic filler. Examples of the organic filler include carbon, rubber-based fillers, silicon-based fine particles, polyamide fine particles, and polyimide fine particles. The content of the organic filler is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 100 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. The lower limit of the content of the organic filler is not particularly limited, but is preferably 5 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.

(Organic solvent)

The adhesive piece 3p may be diluted with an organic solvent, if necessary. The organic solvent is not particularly limited, and can be determined by considering volatility during film formation from the boiling point. Specifically, a relatively low boiling point solvent such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, etc. It is preferable from the viewpoint that hardening of the film of the film is difficult to proceed. In addition, for the purpose of improving film forming properties, it is preferable to use a relatively high boiling point solvent such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone or cyclohexanone. These solvents can be used alone or in combination of two or more.

[Absence of protection]

The protective member 5p is an adhesive piece 3p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 ) Is formed with (see Fig. 6). Since the protective member 5p which concerns on this embodiment is formed simultaneously with the adhesive piece 3p by die cutting, it is substantially the same shape as the adhesive piece 3p. If the protective film 5 is one that can be punched in the manufacturing process of the adhesive film 10 and can easily peel the protective member 5p from the adhesive piece 3p in the manufacturing process of the semiconductor device. good.

The adhesive force between the adhesive piece 3p and the protective member 5p is preferably 16 N / m or less, more preferably 10 N / m or less, and may be 5 N / m or less or 4.5 N / m or less. In particular, when the adhesive piece 3p contains a resin composition having thermosetting properties, after 10 minutes of heat treatment at 100 ° C, it is preferable that the adhesive force of the protective member 5p to the adhesive piece 3p is within the above range. Since this adhesive force is 16 N / m or less, the adhesive piece 3p in the state covered with the protective member 5p is pressurized to the adherend (e.g., the substrate) under conditions of, for example, 100 ° C for 3 seconds, and then the adhesive The protective member 5p can be easily peeled from the piece 3p with an adhesive tape or the like. In addition, the adhesive force of the protective member 5p to the adhesive piece 3p means 90 ° peel strength, and specifically, the same width on the adhesive layer of 20 mm in width having the same composition as the adhesive piece 3p. Refers to the peel strength measured when a sample on which a protective film is disposed is prepared, and the protective film is peeled from the adhesive layer at an angle of 90 ° and at a peeling rate of 300 mm / min.

As the protective film 5, polyester-based films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene- 1, polyolefin-based films such as ethylene-vinyl acetate copolymers and homopolymers or copolymers such as ethylene-ethyl acrylate copolymers or mixtures thereof, plastic films such as polyvinyl chloride films, polyimide films, and the like can be used. The protective film 5 may have a single layer structure or a multilayer structure. By covering the adhesive layer 3 with the protective film 5, it is possible to prevent excessive tension from being applied to the adhesive layer 3, and to prevent foreign substances from entering the adhesive layer 3 during die cutting. Can be.

The thickness of the protective film 5 may be appropriately selected within a range that does not impair workability, for example, 10 to 200 μm, or 20 to 100 μm or 25 to 80 μm. The range of these thicknesses is practically no problem, and is an economically effective range.

It is preferable that the light transmittance of the protective member 5p is lower than the light transmittance of the carrier film 1. By adopting such a configuration, it becomes possible to recognize the position and direction of the adhesive piece 3p with a device such as a camera, and it is easy to automate the bonding process in the manufacturing process of the semiconductor device. For example, it is preferable to use, as the protective member 5p, colored light having a wavelength of 500 nm with a transmittance of less than 10% (more preferably less than 7%).

<Method for manufacturing adhesive film>

Next, the manufacturing method of the adhesive film 10 is demonstrated. The manufacturing method of this embodiment includes the following processes.

(A) A belt-shaped carrier film 1 having a width of 100 mm or less, an adhesive layer 3 formed to cover the surface of the carrier film 1, and a protective film 5 arranged to cover the adhesive layer 3 The process of preparing the laminated body 20 which has a.

(B) A plurality of adhesives arranged to line up in the longitudinal direction of the carrier film 1 on the carrier film 1 by die cutting the adhesive layer 3 and the protective film 5 in the laminate 20 The process of obtaining a piece (3p).

5 is a cross-sectional view schematically showing a laminate 20 prepared in step (A). The laminate 20 can be produced as follows. First, the coating solution obtained by dissolving the raw material resin composition of the adhesive layer 3 in a solvent such as an organic solvent is prepared. After coating this coating solution on the carrier film 1. The adhesive layer 3 is formed by removing the solvent. Examples of the coating method include a knife coat method, a roll coat method, a spray coat method, a gravure coat method, a bar coat method and a curtain coat method. Subsequently, the protective film 5 is bonded to the surface of the adhesive layer 3 under the conditions of room temperature to 60 ° C. Thereby, the laminated body 20 can be obtained. In addition, after forming the adhesive layer 3 on a wide carrier film, a laminated film is produced by bonding the protective film 5 to cover it, and then cutting (slit) it to a width of 100 mm or less to form a laminated body ( 20) may be obtained.

6 is a perspective view showing a state in which a plurality of adhesive pieces 3p and a protective member 5p covering the adhesive film 3 are formed on the carrier film 1 by die cutting in the step (B). As shown in FIG. 6, the stacked body 20 is provided between a rotating body 51 having a plurality of blades 51c for performing die cutting on the outer circumferential surface, and a roll 52 paired with the rotating body 51. ), The adhesive piece 3p and the protective member 5p according to the shape of the blade 51c are continuously formed on the carrier film 1. At this time, in the laminate 20, the surface on the protective film 5 side faces the rotating body 51, and the surface on the carrier film 1 side faces the roll 52. The stacked body (51c) is formed by the blade (51c) by adjusting the distance between the rotating shaft (51a) of the rotating body (51) and the rotating shaft (52a) of the roll (52) or The depth of the cut formed in 20) can be adjusted.

The stacked body 20 passing between the rotating body 51 and the roll 52 is separated into an adhesive film 10 and an unnecessary portion 30, as shown in FIG. 6, and each reel (not shown) Do not). The unnecessary portion 30 includes an adhesive layer 3 and a protective film 5 from which the adhesive piece 3p and the protective member 5p are cut out.

<How to use the adhesive film>

Next, a method of using the adhesive film 10 will be described. 7 is a cross-sectional view schematically showing how the adhesive piece 3p and the protective member 5p covering it are picked up from the carrier film 1. In a state in which a constant tension is applied to the adhesive film 10, while contacting the wedge-shaped member 60 with the surface of the carrier film 1 side of the adhesive film 10, the adhesive film 10 in the direction of the arrow shown in FIG. ). As a result, as shown in the drawing, the front side of the adhesive piece 3p and the protective member 5p is excited from the carrier film 1. In this state, for example, the adhesive piece 3p and the protective member 5p are picked up by a pickup device 65 having a suction force. For example, by using the pick-up device 65 provided with a camera or the like for observing the protective member 5p, it is possible to grasp the presence or absence of the adhesive piece 3p and the protective member 5p, and information such as direction. It is possible. Based on these information, subsequent bonding steps can be appropriately performed.

Subsequently, the adhesive piece 3p in a state covered with the protective member 5p is placed at a predetermined position and direction of the substrate (not shown). In this state, the adhesive piece 3p is pressed against the substrate. The press bonding may be performed over 0.1 to 10 seconds under conditions of, for example, a temperature of 60 to 150 ° C and a pressing force of 0.05 to 1 MPa. By pressure bonding, the adhesive piece 3p is adhered to such a degree that it is weak to the substrate but does not peel off from the substrate. In this state, the protective member 5p is peeled from the adhesive piece 3p using an adhesive tape or the like. After placing the semiconductor chip of the shape different from the adhesive piece 3p on the surface of the adhesive piece 3p exposed by peeling of the protective member 5p, the semiconductor chip is pressed against the substrate. Crimping may be performed over 0.1 to 10 seconds under conditions of, for example, a temperature of 60 to 150 ° C and a pressing force of 0.05 to 1 MPa. Further, depending on the thickness of the substrate, the heating temperature is preferably low, the compression temperature is preferably 160 ° C or lower, and the subsequent heat curing temperature is preferably 160 ° C or lower.

<Semiconductor device>

8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive piece 3p. The semiconductor device 100 shown in the figure is disposed between the semiconductor chip S, the substrate 50 to which the semiconductor chip S is electrically connected, and the semiconductor chip S and the substrate 50. , And an adhesive piece (3p) for bonding the semiconductor chip (S) and the substrate (50). The shape of the semiconductor chip S is, for example, rectangular or square, whereas the shape of the adhesive piece 3p is T-shaped, and the shape of the semiconductor chip S and the shape of the adhesive piece 3p are different. By adopting such a configuration, as shown in Fig. 4, it is possible to electrically connect the substrate 50 and the semiconductor chip S in the regions R1 and R2 by the conductive materials A1 and A2.

The manufacturing method of the semiconductor device 100 includes a process of preparing a laminate (not shown) in which the substrate 50, the adhesive piece 3p, and the semiconductor chip S are stacked in this order, and heating the laminate. By doing so, a process of adhering the substrate 50 and the semiconductor chip S through the adhesive piece is included. The temperature at the time of bonding the substrate 50 and the semiconductor chip S is preferably low temperature, for example, 160 ° C or less.

The embodiments of the present disclosure have been described above in detail, but the present disclosure is not limited to the above embodiments. For example, in the above embodiment, the case where the colored protective film 5 is used is illustrated so that the presence or absence and direction of the protective member 5p can be grasped by a camera or the like, but instead of this, the protective member 5p You may mark the predetermined position of. In addition, when the adhesive piece 3p is colored, it is not necessary to provide the protective member 5p. In addition, when the direction of the adhesive piece 3p is not a problem, it is not necessary to identify the direction.

Example

Hereinafter, the present disclosure will be described based on Examples. The present disclosure is not limited to the following examples.

<Example 1>

(Preparation of adhesive varnish)

The adhesive varnish was obtained by mixing the following materials and vacuum degassing.

Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase Chemtex Co., Ltd., acrylic rubber containing glycidyl group, molecular weight 1 million, Tg-7 ° C) 100 parts by mass

30 parts by weight of thermosetting resin: YDCN-700-10 (trade name, manufactured by Shinnitetsu Sumikin Chemical Co., Ltd., o-cresol novolac type epoxy resin, epoxy equivalent 210)

Thermosetting resin: LF-4871 (trade name, manufactured by DIC Corporation, bisphenol A type epoxy resin, epoxy equivalent 118) 95 parts by mass

Thermosetting resin: 100 parts by mass of YDF-8170C (trade name, manufactured by Shinnitetsu Sumikin Chemical Co., Ltd., bisphenol F-type epoxy resin, epoxy equivalent 157)

Curing accelerator: 0.3 parts by mass of 2PZ-CN (trade name, manufactured by Shikoku Chemical Co., Ltd., imidazole compound)

Surface treatment filler: SC-2050-HLG (trade name, manufactured by Admatex) 330 parts by mass

Silane coupling agent: 0.9 parts by weight of A-189 (trade name, manufactured by NUC Corporation, γ-mercaptopropyl trimethoxysilane)

Silane coupling agent: 2 parts by mass of A-1160 (trade name, manufactured by NUC Corporation, γ-ureidopropyltriethoxysilane)

(Preparation of adhesive film)

The adhesive varnish was coated on a 50 µm-thick surface release-treated polyethylene terephthalate film (Teijin Film Solutions Co., Ltd. trade name: Teijin Tetoron Film A-63). Through the drying step, a film in which an adhesive layer having a thickness of 25 μm was formed on one side of the polyethylene terephthalate film (carrier film) was obtained. A laminated film was obtained by bonding this film to a colored polyethylene film having a thickness of 50 µm (manufactured by Tama Poly Corporation, TDM-1). By slitting this laminated film to a width of 15 mm, a belt-shaped laminate was obtained.

An adhesive film according to this example was obtained by performing die cutting on the laminate obtained as described above using the apparatus of the configuration shown in FIG. 6. The shape of the adhesive piece was a shape in which some corners of a rectangle having a length of about 7 mm x a width of about 6 mm were cut off (area: 29 mm 2). The pitch P was set to about 9 mm. The area ratio R of the adhesive piece was 23%.

<Example 2>

An adhesive film was produced in the same manner as in Example 1, except that the size and pitch of the adhesive piece were changed.

<Example 3>

An adhesive film was produced in the same manner as in Example 2, except that the carrier film used in Example 2 was subjected to a different surface treatment and the shape of the adhesive piece was changed. As a carrier film, a polyethylene terephthalate film (Teijin Film Solutions, trade name: Teijin Tetoron Film A-53 manufactured by Teijin Film Solutions) having a thickness of 50 µm was used.

<Example 4>

The adhesive film was produced like Example 2 except having used the protective film different from the protective film used in Example 2. As the protective film, an uncolored polyethylene film (manufactured by Tama Poly Co., Ltd., trade name: NF-13, thickness: 20 µm) was used.

<Example 5>

The adhesive film was produced like Example 2 except having used the protective film different from the protective film used in Example 2. As the protective film, an uncolored polyethylene film (manufactured by Tama Poly Co., Ltd., trade name: GF-3, thickness: 30 µm) was used.

<Example 6>

An adhesive film was produced in the same manner as in Example 2, except that a carrier film different from the carrier film used in Example 2 was used. As a carrier film, a polyethylene terephthalate film (Teijin Film Solutions Co., Ltd. trade name: Teijin Tetoron Film G2, thickness: 50 µm), which was not subjected to surface release treatment, was used.

<Example 7>

An adhesive film was produced in the same manner as in Example 2, except that a carrier film different from the carrier film used in Example 2 was used. As the carrier film, a polyethylene terephthalate film (Teijin Film Solutions Co., Ltd., Teijin Tetoron Film G2, thickness: 38 µm) without surface release treatment was used.

<Example 8>

An adhesive film was produced in the same manner as in Example 2, except that the size of the adhesive piece was changed.

<Example 9>

An adhesive film was produced in the same manner as in Example 2, except that the size of the adhesive piece was changed.

The following items were evaluated about the adhesive film which concerns on the said Example. Table 1 and Table 2 show the results.

(1) Area ratio R of the adhesive piece

The area ratio R (%) of the adhesive piece was calculated by substituting the area A (㎟), the pitch P (mm), and the width W (mm) of the carrier film shown in Table 1 into the following formula.

Area ratio R (%) = A / (P × W) × 100

(2) Light transmittance

The transmittance of light having a wavelength of 500 nm in the region where the adhesive piece and the protective member covering the adhesive film was provided on the carrier film was measured using V-570 (trade name) manufactured by Nippon Bunko Corporation.

(3) Carrier film adhesion (90 ° peel strength)

A laminated film (carrier film / adhesive layer / protective film) without die cutting was cut to a width of 20 mm. After using the double-sided tape to attach the side of the carrier film to the aluminum plate, the protective film was peeled off. Thereafter, the adhesive layer was peeled from the carrier film by pulling the adhesive layer upward while maintaining the angle of the adhesive layer with respect to the carrier film at 90 °. The pulling speed was 50 mm / min, and the measurement environment temperature was 23 ± 2 ° C. The force required for the impression was measured. By substituting this measurement value (mN) and the width (20 mm) of the sample into the following formula, the adhesive force between the carrier film and the adhesive layer was calculated.

Adhesion (N / m) = Measured value (mN) / 20 (mm)

(4) Protective film adhesion (90 ° peel strength)

A laminated film (carrier film / adhesive layer / protective film) without die cutting was cut to a width of 20 mm. After the carrier film is peeled off, the surface of the adhesive layer side is attached to the aluminum plate using a double-sided tape, and then protected by pulling the protective film upward while maintaining the angle of the protective film to the adhesive layer at 90 °. The adhesive layer was peeled from the film. The pulling speed was 300 mm / min, and the measurement environment temperature was 23 ± 2 ° C. The force required for the impression was measured. The adhesive force between the protective film and the adhesive layer was calculated by substituting this measurement value (mN) and the width (20 mm) of the sample into the following formula.

Adhesion (N / m) = Measured value (mN) / 20 (mm)

Industrial availability

According to the present disclosure, there is provided an adhesive film having an adhesive piece having a complex shape useful for efficiently performing an adhesive process in a manufacturing process of a semiconductor device. Further, according to the present disclosure, a semiconductor device using a complex-shaped adhesive piece and a method of manufacturing the same are provided.

DESCRIPTION OF SYMBOLS 1 Carrier film 3 Adhesive layer
3p: Adhesive piece 5: Protective film
5p: protective member 10: adhesive film
50 substrate 100 semiconductor device
C1 to C12: edge of the adhesive piece F1: surface of the adhesive piece (first side)
F2: side of adhesive piece (second side) S: semiconductor chip

Claims (17)

A belt-shaped carrier film having a width of 100 mm or less,
A plurality of adhesive pieces arranged on the carrier film so as to line up in the longitudinal direction of the carrier film
Equipped with,
An adhesive film for manufacturing a semiconductor device, wherein the adhesive piece has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangular or square. The adhesive film according to claim 1, wherein the adhesive piece has six or more corners. The adhesive film according to claim 2, wherein the adhesive piece has an L-shape. The adhesive film according to claim 1, wherein the adhesive piece has eight or more edges. The adhesive film according to any one of claims 1 to 4, wherein an area of the adhesive piece is 10 to 200 mm 2. The adhesive film according to any one of claims 1 to 5, wherein a ratio of a region covered by the plurality of adhesive pieces as a surface of the carrier film is 10 to 60% based on the area of the carrier film. The adhesive film according to any one of claims 1 to 6, wherein one or more rows of the plurality of adhesive pieces are formed on the carrier film. The adhesive film according to any one of claims 1 to 7, wherein the adhesive piece is formed by die cutting an adhesive layer formed to cover the surface of the carrier film. The adhesive film according to any one of claims 1 to 8, wherein an adhesive force between the carrier film and the adhesive piece is 0.5 to 18 N / m. The adhesive according to any one of claims 1 to 9, further comprising a protective member covering the second surface opposite to the first surface on the carrier film side of the adhesive piece and having the same shape as the adhesive piece. film. The adhesive film according to claim 10, wherein the adhesive piece and the protective member are formed by die cutting an adhesive layer formed to cover the surface of the carrier film and a protective film disposed to cover the adhesive layer. The adhesive film according to claim 10 or 11, wherein a light transmittance of the protective member is lower than a light transmittance of the carrier film. The adhesive film according to any one of claims 10 to 12, wherein an adhesive force between the adhesive piece and the protective member is 16 N / m or less. Substrate,
A semiconductor chip,
The said adhesive piece of the adhesive film in any one of Claims 1-13.
Equipped with,
The adhesive piece is disposed between the substrate and the semiconductor chip, and the substrate and the semiconductor chip are bonded,
A semiconductor device in which the shape of the semiconductor chip and the shape of the adhesive piece are different. The manufacturing method of the semiconductor device using the said adhesive piece of the adhesive film in any one of Claims 1-13. 16. The method of claim 15, wherein the step of preparing a laminate in which the substrate, the adhesive piece and the semiconductor chip are laminated in this order,
A step of bonding the substrate and the semiconductor chip through the adhesive piece by heating the laminate
Including,
A method of manufacturing a semiconductor device, wherein the shape of the semiconductor chip is different from that of the adhesive piece. The method of manufacturing a semiconductor device according to claim 16, wherein the semiconductor chip is adhered to the substrate by the adhesive piece by heating the laminate to a temperature of 160 ° C or less.

Images