KR20200031517A - Drawing device and drawing method - Google Patents

Abstract

The present invention relates to a drawing device and a drawing method. The drawing device (1) comprises an optical unit (40) and a control part (60), wherein the control part (60) controls the optical unit (40) so that the optical unit (40) performs a multiple exposure process, and the multiple exposure process includes a plurality of exposure processes. The exposure processes represent a process of irradiating drawing light with the optical unit (40) on a predetermined area (W1) of a substrate (W) and each of the plurality of exposure processes includes a process of irradiating the drawing light in parallel by the optical unit (40) so that a connection region (G3) is formed. In addition, the connection region (G3) represents a region where a part of irradiation regions of the drawing light irradiated in parallel overlaps.

Description

Drawing device and drawing method {DRAWING DEVICE AND DRAWING METHOD}

The present invention relates to a drawing device and a drawing method.

The drawing apparatus described in Patent Document 1 separates a region to be exposed into a plurality of fields, and separates a field into a plurality of sub-fields. In addition, the drawing apparatus described in Patent Document 1 performs sequential exposure processing using a variable-forming electron beam for each separated field, and also performs multiple exposure processing at the boundary of adjacent fields to expose a desired pattern on the substrate. do.

Japanese Patent Application Publication No. 2000-260686

However, after pattern development, there was a fear that exposure streaks would occur in the border (connection region). The exposure streaks of the border portion may also cause the discontinuity of the pattern at the border portion (for example, the pattern is interrupted, thickened, or thinned). Since the exposure stripe was not a desired pattern, there was a fear that it would become NG during visual inspection. Moreover, when a photosensitive insulating film is used, when an exposure streak occurs, the exposure streak remains in the product. In this case, exposure streaks are not allowed without directly affecting the electrical properties of the product.

The present invention provides a drawing device and a drawing method capable of alleviating exposure streaks occurring in the connecting region.

According to the first aspect of the present invention, the drawing device draws a pattern on the substrate by irradiating drawing light to the substrate. The drawing device includes an irradiation unit and a control unit. The irradiation unit irradiates the above-mentioned drawing light. The control unit controls the irradiation unit. The control unit controls the irradiation unit so that the irradiation unit performs multiple exposure processing. The multiple exposure process includes a plurality of exposure processes. The exposure process refers to a process of irradiating the drawing light with the irradiation part on a predetermined area of the substrate. Each of the plurality of exposure processes includes a process of irradiating the drawing light in parallel by the irradiation unit so that a connection region is formed. The connection region represents a region where a part of the irradiation regions of the drawing light irradiated in parallel overlap.

In the drawing apparatus of the present invention, a plurality of the connection regions formed by the multiple exposure processing are located at locations not overlapping each other.

In the drawing apparatus of the present invention, in at least two exposure processes among the plurality of exposure processes, the control unit controls the irradiation unit so that the same pattern is drawn on the substrate.

In the drawing apparatus of the present invention, the connection area is an area where a pattern is drawn.

In the drawing apparatus of the present invention, when a predetermined pattern is drawn on the substrate by the multiple exposure process, the sum of the exposure doses of the plurality of drawing lights irradiated to the substrate for each exposure process is performed to draw the predetermined pattern The control unit controls the irradiation unit so as to be approximately equal to the required exposure amount required.

The drawing device of the present invention further includes a stage and a driving mechanism. The stage holds the substrate. The drive mechanism moves the stage with respect to the irradiation portion. As the moving speed of the stage with respect to the irradiating part increases, the exposure amount of the drawn light is adjusted by the control unit controlling the driving mechanism such that the exposure amount of the drawn light to the substrate decreases.

In the drawing apparatus of the present invention, a graph showing the relationship between the irradiation position of the drawing light with respect to the substrate and the exposure amount of the drawing light has a portion formed in a trapezoidal shape. The trapezoidal portion has a central portion and a pair of ends. In the central portion, the exposure amount is constant. The pair of end portions are connected to the central portion. At one end of the pair, the exposure amount is sensed as it is separated from the central portion. The center portion is located between the pair of ends.

In the drawing apparatus of the present invention, the plurality of exposure processes include a first exposure process and a second exposure process. The first exposure amount of the drawing light irradiated to the substrate during the first exposure processing is the same as the second exposure amount of the drawing light irradiated to the substrate during the second exposure processing, or the first exposure amount is the It is different from the second exposure amount.

According to the second aspect of the present invention, the drawing method draws a pattern on the substrate by irradiating the drawing light with the substrate. The drawing method includes a multiple exposure process in which multiple exposure treatments are performed. The multiple exposure process includes a plurality of exposure processes. The exposure process refers to a process of irradiating the drawn light onto a predetermined area of the substrate. Each of the plurality of exposure processes includes a process of irradiating the drawing light in parallel so that a connection region is formed. The connection region represents a region where a part of the irradiation regions of the drawing light irradiated in parallel overlap.

According to the drawing apparatus and drawing method of the present invention, it is possible to alleviate the exposure streaks occurring in the connecting region.

1 is a side view schematically showing a configuration of a drawing device according to an embodiment of the present invention.
2 is a plan view schematically showing the configuration of a drawing device.
3 is a block diagram showing the configuration of a drawing device.
4 is a block diagram showing a procedure in which a drawing device draws a pattern on a substrate.
5 is a schematic view showing a state in which the first exposure process is being performed.
6 is an enlarged view of a part of the first graph.
7 is a schematic view showing a state in which the second exposure process is being performed.
8 is a schematic view showing a predetermined pattern drawn on a substrate.
Fig. 9 (a) is a side view schematically showing a state in which a writing light having an exposure amount of 100% was irradiated onto a substrate. (b) is a plan view showing a substrate after a conventional pattern development.
10 (a) is a side view schematically showing a state in which the first exposure process and the second exposure process are performed on the substrate. (b) is a plan view showing the substrate after pattern development of the present application.
11 is a view showing a first modification of the composite graph.
12 is a view showing a second modification of the composite graph.
13 is a view showing a third modification of the composite graph.
14 is a view showing a fourth modified example of the composite graph.

Embodiments of the present invention will be described with reference to the drawings. In addition, the same reference numerals are assigned to the same or equivalent parts in the drawings, and the description is not repeated.

1 and 2, the drawing device 1 according to an embodiment of the present invention will be described. 1 is a side view schematically showing a configuration of a drawing device 1 according to an embodiment of the present invention. 2 is a plan view schematically showing the configuration of the drawing device 1.

As shown in FIG. 1 and FIG. 2, the drawing device 1 irradiates a substrate W on which a layer of a photosensitive material such as resist is formed, by irradiating drawing light modulated in accordance with predetermined data to create a pattern such as a circuit pattern. Exposure (drawing) is performed. The predetermined data is data representing the same pattern as CAD data. In the present embodiment, a maskless exposure is performed in which a pattern is directly drawn on a photosensitive material by scanning a photosensitive material on the substrate W by drawing light without using a mask.

The substrate W is, for example, a silicon wafer, a resin substrate, or a glass / quartz substrate. The substrate W is, for example, a semiconductor substrate, a printed substrate, a color filter substrate, a glass substrate for flat panel displays, a substrate for magnetic disks, a substrate for optical disks, or a panel for solar cells. The substrate for color filters is provided in, for example, a liquid crystal display device. The glass substrate for flat panel displays is provided in a liquid crystal display device or a plasma display device, for example. 1 and 2, a circular semiconductor substrate is illustrated as the substrate W. In addition, the shape of the board | substrate W is not specifically limited. The substrate W may be formed, for example, in a quadrangular shape.

The drawing device 1 includes a body frame 2. The body frame 2 constitutes the casing of the drawing device 1. Inside the body frame 2, a processing region 3 and a transmission region 4 are formed. The processing region 3 and the transfer region 4 are separated from each other.

The drawing device 1 includes a base 5, a support frame 6, a cassette placing portion 7, a stage 10, a driving mechanism 20, a stage position measuring portion 30, and optical The unit 40, the conveying device 50, and the control unit 60 are further provided.

The base 5, the support frame 6, the stage 10, the driving mechanism 20, the stage position measuring unit 30, and the optical unit 40 are provided in the processing area 3. The conveying device 50 is provided in the delivery area 4. The cassette placing portion 7 is provided outside the main frame 2.

Hereinafter, the configuration of each part of the drawing device 1 will be described.

The base 5 supports the stage 10. The support frame 6 is provided on the base 5. The support frame 6 supports the optical unit 40.

The stage 10 holds the substrate W. The stage 10 has a flat plate shape. On the upper surface of the stage 10, a mounting surface 11 capable of mounting the substrate W is formed. On the mounting surface 11 of the stage 10, a plurality of suction holes (not shown) are formed. When a negative pressure (suction pressure) is formed in the suction hole of the stage 10, the substrate W placed on the mounting surface 11 of the stage 10 is fixed to the stage 10. As a result, the stage 10 holds the substrate W.

The driving mechanism 20 moves the stage 10. The drive mechanism 20 moves the stage 10 along the main scanning direction Y, the sub scanning direction X, and the rotation direction θ. The main scanning direction Y is the + side direction of the Y axis shown in FIGS. 1 and 2. The sub-scanning direction X is the + side direction of the X axis shown in FIGS. 1 and 2. The rotation direction θ is a rotation direction around the Z axis shown in FIGS. 1 and 2. The X axis, the Y axis, and the Z axis are axes perpendicular to each other. In the present embodiment, the + side direction of the Z axis represents the upper side of the vertical direction. In addition, in this embodiment, the mounting surface 11 of the stage 10 is parallel to each of the X axis and the Y axis.

The drive mechanism 20 has a rotating mechanism 21, a support plate 22, a sub-scanning mechanism 23, a base plate 24, and a main scanning mechanism 25. The rotating mechanism 21 rotates the stage 10. The support plate 22 supports the stage 10 via a rotation mechanism 21. The sub-scanning mechanism 23 moves the support plate 22 along the sub-scanning direction X. The base plate 24 supports the support plate 22 via the sub-scanning mechanism 23. The main scanning mechanism 25 moves the base plate 24 along the main scanning direction Y.

The rotation mechanism 21 rotates the stage 10 around the rotation axis A. The rotation axis A passes through the center of the stage 10 and is an axis parallel to the Z axis.

The rotating mechanism 21 includes, for example, a rotating shaft portion 211 and a rotating driving portion 212. The rotating shaft portion 211 is fixed to the rear side of the mounting surface 11 and extends along the Z axis. The rotation drive unit 212 includes, for example, a motor. The rotation drive unit 212 is formed at the lower end of the rotation shaft unit 211 and rotates the rotation shaft unit 211. When the rotation drive unit 212 rotates the rotation shaft portion 211, the stage 10 rotates around the rotation shaft A.

The sub-scanning mechanism 23 has a linear motor 231. The linear motor 231 is composed of a mover and a stator. The mover is mounted on the lower surface of the support plate 22. The stator is laid on the upper surface of the base plate 24.

The base plate 24 is provided with a pair of guide members 232 extending in the sub-scanning direction X. A ball bearing is provided between each guide member 232 and the support plate 22. The ball bearing slides along the guide member 232.

The support plate 22 is supported by a pair of guide members 232 via a ball bearing. When the linear motor 231 operates, the support plate 22 is guided to the guide member 232 and moves along the sub-scanning direction X.

The main scanning mechanism 25 has a linear motor 251. The linear motor 251 is composed of a mover and a stator. The mover is mounted on the lower surface of the base plate 24. The stator is laid on the base 5 of the drawing device 1.

On the base 5, a pair of guide members 252 extending in the main scanning direction Y is provided. An air bearing, for example, is provided between each guide member 252 and the base plate 24. Air is supplied to the air bearing from a utility facility. The base plate 24 floats on the guide member 252 by an air bearing. As a result, the base plate 24 is supported in a non-contact state with respect to the guide member 252.

When the linear motor 251 operates, the base plate 24 is guided to the guide member 252 and moves along the main scanning direction Y. At this time, friction between the base plate 24 and the guide member 252 is avoided.

The stage position measurement unit 30 measures the position of the stage 10. The stage position measuring unit 30 is configured by, for example, an interference type laser measuring device. The stage position measurement unit 30 emits laser light from the outside of the stage 10 toward the stage 10, for example, and receives the laser light reflected by the stage 10. Then, the stage position measuring unit 30 measures the position of the stage 10 from the interference of the laser light emitted toward the stage 10 and the laser light reflected from the stage 10. The position of the stage 10 represents the position of the main scanning direction Y and the position of the rotation direction θ.

The optical unit 40 draws a pattern on the substrate W by irradiating drawing light onto the substrate W held on the stage 10. The pattern is, for example, a general pattern such as Hole, Trench, and Gate.

The optical unit 40 is an example of the irradiation part of the present invention.

The optical unit 40 has a light source unit 401 and a head unit 402. The light source unit 401 is provided on the support frame 6. The head part 402 is accommodated in the inside of the attachment box attached to the support frame 6.

The light source unit 401 functions as a laser light source that emits I-line. The light source unit 401 has a laser driving unit 41, a laser oscillator 42, and an illumination optical system 43.

The laser oscillator 42 receives driving from the laser driving unit 41 and emits a spot beam that is laser light from an output mirror (not shown). The spot beam enters the illumination optical system 43. The illumination optical system 43 generates linear light from the spot beam. The linear light is a line beam having a substantially uniform intensity distribution and a luminous cross section. The line beam enters the head portion 402. Hereinafter, the line beam incident on the head portion 402 may be described as incident light.

Moreover, you may make it the structure which adjusts the amount of light of the incident light by adjusting the aperture to the incident light in the stage before the incident light enters the head part 402.

In the head portion 402, the incident light is spatially modulated according to the pattern data PD.

The pattern data PD is information in which information indicating the irradiation position of the writing light with respect to the substrate W is recorded in units of pixels.

The drawing device 1 acquires information indicating the pattern data PD in advance. The drawing device 1 is obtained, for example, by receiving information representing the pattern data PD from the external terminal device via a network. In addition, the drawing device 1 is obtained, for example, by reading information indicating the pattern data PD from a recording medium connected to the drawing device 1.

Spatially modulating the incident light indicates that the spatial distribution of the incident light is changed. The spatial distribution of incident light indicates, for example, the amplitude of light, the phase of light, and / or polarization. The spatial distribution of the incident light is generated, for example, by rasterizing the design data of the pattern generated using CAD (Computer Aided Desing).

The head portion 402 has a spatial light modulation unit 44, a projection optical system 45, and a mirror 46.

The incident light incident on the head portion 402 enters the spatial light modulation unit 44 at a predetermined angle through the mirror 46.

The spatial light modulating unit 44 has a spatial light modulator 441. The spatial light modulator 441 discriminates the incident light into drawing light and unnecessary light by spatially modulating the incident light. Then, the spatial light modulator 441 emits drawing light for a plurality of pixels along the sub-scanning direction X. The drawing light represents light contributing to the drawing of the pattern. The unnecessary light represents light that does not contribute to the drawing of the pattern.

The spatial light modulator 441 is composed of, for example, a diffraction grating type spatial modulator in which a fixed ribbon and a flexible ribbon, which are light modulation elements, are arranged. The diffraction grating type spatial modulator is, for example, GLV (Grating Light Valve) ("GLV" is a registered trademark). In this embodiment, the maximum exposure width of the GLV can be changed by changing lenses.

The diffraction grating type spatial modulator is a diffraction grating that can change the depth of the grating, and is manufactured using, for example, semiconductor device manufacturing technology.

The spatial light modulator 441 has a plurality of modulation units 442 (see FIG. 5) and a driver circuit unit 443. The plurality of modulation units 442 are arranged along the sub-scanning direction X. The driver circuit unit 443 applies a voltage to each of the plurality of modulation units 442. The driver circuit unit 443 can independently control the voltage applied to each of the plurality of modulation units 442.

The driver circuit unit 443 can switch the state of the modulation unit 442 to either an off state or an on state. The off state represents a state in which no voltage is applied to the modulation unit 442. The ON state represents a state in which voltage is applied to the modulation unit 442.

When the modulation unit 442 is turned off, since the flexible ribbon does not bend, the surface of the modulation unit 442 is flat. When incident light enters the plane of the modulation unit 442, the incident light is specularly reflected without diffraction. By incidentally reflecting the incident light, it becomes a drawing light that is a zero-order kaleidoscope light. When the drawn light exits from the modulation unit 442, it reaches the substrate W.

When the modulation unit 442 is turned on, the flexible ribbon is bent, so that a groove is formed on the surface of the modulation unit 442. When incident light enters the groove of the modulation unit 442, the incident light is gray. The incident light becomes unnecessary light, which is non-zero-order diffracted light, by being grayed out. Unnecessary light does not reach the substrate W when it exits from the modulation unit 442.

Hereinafter, a groove formed on the surface of the modulation unit 442 may be described as a surface groove.

The driver circuit unit 443 can change the depth of the surface groove by changing the voltage applied to the modulation unit 442. By changing the depth of the surface groove, the light amount of the writing light is adjusted.

The control unit 60 controls the driver circuit unit 443 to adjust the emission rate of the drawn light for each modulation unit 442. The emission rate of the drawn light represents the ratio of the amount of emitted light to the amount of incident light (the amount of emitted light / the amount of incident light). The amount of incident light represents the amount of light of incident light incident on the modulation unit 442. The emitted light amount represents the light amount of the drawn light emitted from the modulation unit 442.

When the modulation unit 442 is in the off state, that is, when the surface of the modulation unit 442 is flat, the emission rate of the drawn light is 100%. When a surface groove is formed on the surface of the modulation unit 442, the emission rate decreases. The deeper the surface groove, the smaller the emission rate. The control unit 60 can control the driver circuit unit 443 and change the depth of the surface groove to adjust the emission rate of the drawn light to an arbitrary value between 0% and 100% of the emission rate. .

The drawing light emitted from the modulation unit 442 enters the projection optical system 45.

The projection optical system 45 guides the drawn light among the light incident from the spatial light modulator 441 to the substrate W. The projection optical system 45 has, for example, a blocking plate. The blocking plate is a plate-like member in which a through hole is formed.

The drawing light passes through the through hole. As a result, the drawing light reaches the substrate W. In contrast, unnecessary light does not pass through the through hole and reaches the blocking plate. As a result, unnecessary light is blocked from reaching the substrate W by the blocking plate.

When the drawing light reaches the substrate W, a pattern is drawn on the substrate W. The drawing light emitted from one modulation unit 442 forms one pixel of a pattern drawn on the substrate W.

The projection optical system 45 may further include a zoom lens and / or an objective lens. The zoom lens constitutes a zoom unit that adjusts the width of the drawing light. Adjusting the width of the drawing light indicates expanding the width of the drawing light and / or narrowing the width of the drawing light. The objective lens forms imaging light on the substrate W at a predetermined magnification.

The conveying apparatus 50 carries in the board | substrate W into the processing area 3, and carries out the board | substrate W from the processing area 3. The conveying apparatus 50 has a plurality of hands 51 and a hand drive mechanism 52. The hand 51 carries the substrate W. The hand drive mechanism 52 drives the hand 51.

An unprocessed substrate W is accommodated in the cassette placing portion 7. The conveying apparatus 50 takes out the substrate W from the cassette placing portion 7 and carries it into the processing region 3, and also carries out the processed substrate W from the processing region 3 and draws the cassette ( C).

Next, with reference to FIG. 3, the drawing apparatus 1 is further demonstrated. 3 is a block diagram showing the configuration of the drawing device 1.

As shown in FIG. 3, the drawing device 1 further includes an input unit 70 and a storage unit 80.

The input unit 70 accepts an instruction for the drawing device 1. The user inputs an instruction for drawing a pattern on the substrate W from the input unit 70, for example. The input unit 70 is, for example, an operation key formed on the casing of the drawing device 1, or a terminal such as a personal computer (PC) connected communicatively with the drawing device 1.

The storage unit 80 includes a main memory (for example, a semiconductor memory) such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and an auxiliary memory (for example, a hard disk drive). You may include it further. The main memory device and / or the auxiliary memory device stores various computer programs executed by the control unit 60.

The control unit 60 includes processors such as a central processing unit (CPU) and a micro processing unit (MPU). The control unit 60 controls each element of the drawing device 1. Specifically, the processor of the control unit 60 executes a computer program stored in the storage unit 80, thereby driving mechanism 20, stage position measurement unit 30, optical unit 40, and conveying device The 50, the input unit 70, and the storage unit 80 are controlled.

In the present embodiment, when the exposure amount of the drawn light to the substrate W is adjusted, the control unit 60 does not change the energy of the drawn light, but changes the moving speed of the stage 10. Specifically, the control unit 60 controls the driving mechanism 20 when the exposure amount of the drawn light to the substrate W is reduced, thereby speeding up the movement speed of the stage 10 relative to the optical unit 40. . As a result, since the irradiation time of the writing light to the substrate W is shortened, the exposure amount of the writing light to the substrate W is reduced. In contrast, the control unit 60 controls the driving mechanism 20 when the exposure amount of the drawn light to the substrate W is increased, thereby slowing the moving speed of the stage 10 relative to the optical unit 40. As a result, since the irradiation time of the writing light to the substrate W becomes long, the exposure amount of the writing light to the substrate W increases. The exposure amount is the product of the energy per unit area of the drawn light and the irradiation time of the drawn light.

Next, with reference to Figs. 4 to 8, the procedure in which the drawing device 1 draws a pattern on the substrate W will be described. 4 is a block diagram showing a procedure in which the drawing device 1 draws a pattern on the substrate W. As shown in FIG.

As shown in FIG. 4, in step S10, the input unit 70 accepts an instruction to draw a predetermined pattern Q (see FIG. 8) with respect to a predetermined area W1 of the substrate W. The predetermined pattern Q represents a desired pattern.

In this embodiment, the predetermined area W1 represents the entire surface of the surface of the substrate W. In addition, in the present embodiment, the predetermined pattern Q represents a pattern drawn with drawing light having an exposure amount of 100%.

In this embodiment, the exposure amount is represented by a ratio with respect to the reference exposure amount of 100%. In the present embodiment, the exposure amount of 100% represents, for example, the exposure amount when the drawing light is irradiated for T seconds. T is a real number greater than zero.

The exposure amount is proportional to the irradiation time of the drawing light. Therefore, when drawing light is irradiated for (T / 2) seconds, the exposure amount becomes 50% of the exposure amount.

In the present embodiment, the writing light having an exposure amount of 100% is not irradiated at a time to the predetermined area W1, and multiple exposure processing is performed. The multiple exposure process refers to a process of irradiating multiple drawing lights multiple times.

In the multiple exposure process, the exposure process is performed in duplicate. The exposure process refers to a process of irradiating drawing light on a predetermined area W1 of the substrate W. In the present embodiment, in the multiple exposure process, the first exposure process and the second exposure process are performed.

In step S20, the control unit 60 performs the first exposure process. In the present embodiment, the first pattern Q1 is drawn in the predetermined region W1 by performing the first exposure process. The first pattern Q1 represents a pattern drawn with drawing light having an exposure amount of 50%.

The 1st exposure process shows the exposure process performed 1st among multiple exposure processes.

5 is a schematic view showing a state in which the first exposure process is being performed.

As shown in FIG. 5, the first exposure process is performed on the optical unit 40 while the stage 10 is moved by the driving mechanism 20 while the substrate W is held by the stage 10. By this, it is carried out by drawing light onto the substrate W.

Hereinafter, the first exposure treatment will be specifically described.

First, in the state where the substrate W is held by the stage 10, the drive mechanism 20 moves the stage 10 along the main scanning direction Y. As a result, the substrate W moves in the main scanning direction Y with respect to the optical unit 40. Viewed from the substrate W, as indicated by the arrow AR11, the optical unit 40 traverses the substrate W along the main scanning direction Y.

While the optical unit 40 traverses the substrate W, the optical unit 40 irradiates drawing light on which spatial modulation according to the pattern data PD is formed, toward the substrate W. In this case, the optical unit 40 traverses the substrate W along the main scanning direction Y while irradiating drawing light for a plurality of pixels along the sub scanning direction X.

Hereinafter, the process of irradiating the writing light according to the pattern data PD to the substrate W while the optical unit 40 traverses the substrate W along the main scanning direction Y is described as a main scanning process. There are cases.

When the optical unit 40 performs a main scanning process, an irradiation area G1 along the arrow AR11 is formed on the substrate W. The irradiation area G1 represents an area where the optical unit 40 irradiates drawing light.

When the optical unit 40 performs the main scanning process once, one irradiation area G1 is formed on the substrate W.

When one main scanning process ends, the driving mechanism 20 moves the stage 10 by a predetermined distance along the sub-scanning direction X. As a result, the substrate W moves relative to the optical unit 40 by a predetermined distance along the sub-scanning direction X. When viewed from the substrate W, as indicated by the arrow AR12, the optical unit 40 moves a predetermined distance along the sub-scanning direction X. The predetermined distance is smaller than the dimension of the sub-scanning direction X of the irradiation region G1.

Hereinafter, the case where the optical unit 40 moves by a predetermined distance along the sub-scan direction X may be described as sub-scan processing.

When the sub-scan processing is finished, as shown by arrow AR13, the main scan processing is performed. As a result, an irradiation area G1 along the arrow AR13 is formed on the substrate W. When the main scan processing is finished, as shown by arrow AR14, the sub-scan processing is performed.

In the first exposure process, the main scan process and the sub scan process are performed alternately. As a result, drawing light is irradiated in parallel to the predetermined region W1.

By performing the main scanning process and the sub scanning process alternately, the first pattern Q1 is drawn in the predetermined area W1. When the first pattern Q1 is drawn on a predetermined area W1 of the substrate W, the first exposure process is ended.

The irradiation area G1 will be described.

A plurality of irradiation areas G1 are formed in a predetermined area W1 of the substrate W by alternately performing the main scanning process and the sub-scanning process. Each of the plurality of irradiation areas G1 extends along the main scanning direction Y. The plurality of irradiation areas G1 are arranged in parallel and are arranged along the sub-scanning direction X.

The irradiation area G1 includes a single irradiation area G2 and a connection area G3. The single irradiation area G2 represents an area where the adjacent irradiation areas G1 do not overlap. When the first exposure process is performed, the drawn light is irradiated to the single irradiation region G2.

The connection region G3 represents a region where some of the neighboring irradiation regions G1 overlap. When the first exposure process is performed, the drawn light is irradiated to the connection region G3 in double. The connecting region G3 has a width of 20 μm, for example.

Hereinafter, when the first exposure process is performed, the connection region G3 formed on the substrate W may be described as the first connection region G31.

5 further shows the first graph J1. The first graph J1 will be described with reference to FIG. 5.

As shown in FIG. 5, the first graph J1 is a graph showing the relationship between the exposure amount of the drawn light and the position of the sub-scanning direction X when the first exposure process is performed. The vertical axis of the first graph J1 represents the exposure amount of the writing light during the first exposure process. The horizontal axis of the first graph J1 represents the position of the sub-scanning direction X when the position of the main scanning direction Y is the position Y1. The position Y1 represents a place where the center W2 of the substrate W is located in the main scanning direction Y.

When the first exposure process is performed, in the position Y1, the single irradiation region G2 and the first connection region G31 are alternately arranged along the sub-scanning direction X.

The drawing light of 50% of exposure amount is irradiated to the single irradiation region G2. As a result, the first pattern Q1 is drawn in the single irradiation region G2.

The first graph J1 has a portion that changes in a trapezoidal shape. The trapezoidal portion has a first center portion J11 and a pair of first end portions J12. The first central portion J11 is a portion where the exposure amount is constant at an exposure amount of 50%. Each of the pair of first end portions J12 is connected to the first central portion J11, and as the distance from the first central portion J11 is separated, the exposure amount is sensed. In this embodiment, in each of a pair of 1st end part J12, as the distance from the 1st center part J11 senses the emission rate of the drawing light sensibly, the exposure amount is sensed bodily. The first central portion J11 is positioned between the pair of first ends J12.

Next, with reference to FIG. 5 and FIG. 6, the exposure amount of the imaging light irradiated to the 1st connection area G31 is demonstrated. 6 is a partially enlarged view of the first graph J1.

5 and 6, in the first connection region G31, the exposure amount of the drawing light H1 and the exposure amount of the drawing light H2 depend on the position of the sub-scanning direction X, It varies between 0% and the exposure amount 50%. The drawing light H1 represents one of the two drawing lights irradiated overlaid on the first connection region G31. The drawing light H2 represents the other drawing light among the two drawing lights irradiated overlapping the first connection region G31.

6 shows an arbitrary position (Xα), an exposure amount (α1%), and an exposure amount (α2%). The arbitrary position Xα represents an arbitrary position in the sub-scanning direction X in the first connection region G31. The exposure amount (α1%) represents the exposure amount of the drawing light H1 irradiated to the arbitrary position Xα. The exposure amount (α2%) represents the exposure amount of the drawing light H2 irradiated to the arbitrary position Xα.

The sum of the exposure amount (α1%) and the exposure amount (α2%) is 50% of the exposure amount. As a result, since the drawing light of 50% of exposure amount was irradiated to the 1st connection area G31, it becomes possible to draw the 1st pattern Q1 in the 1st connection area G31.

The first pattern Q1 is drawn in the entire area of the predetermined area W1 by drawing the first pattern Q1 in all the single irradiated areas G2 and all the first connection areas G31.

As shown in FIG. 3, when the 1st pattern Q1 is drawn in the predetermined | prescribed area | region W1, the 1st exposure process shown in step S20 ends. As a result, the process proceeds to step S30.

In step S30, the control unit 60 performs a second exposure process. In the present embodiment, the second pattern Q2 is drawn on the first pattern Q1 of the predetermined area W1 by performing the second exposure process. The second pattern Q2 represents a pattern drawn with drawing light having an exposure amount of 50%.

In the 2nd exposure process, the 2nd exposure process is performed among multiple exposures to the predetermined area | region W1.

7 is a schematic view showing a state in which the second exposure process is being performed.

As shown in Fig. 7, in the second exposure process, the main scan process and the sub scan process are alternately performed. As a result, the second pattern Q2 is drawn in a predetermined area W1 of the substrate W.

When the second pattern Q2 is drawn on the predetermined area W1 of the substrate W, the process ends.

7 further shows the second graph J2. The second graph J2 will be described with reference to FIG. 7.

As shown in FIG. 7, the second graph J2 is a graph showing the relationship between the exposure amount of the drawn light and the position of the sub-scanning direction X when the second exposure process is performed. The vertical axis of the second graph J2 represents the exposure amount of the drawn light during the second exposure process. The horizontal axis of the second graph J2 represents the position of the sub-scanning direction X when the position of the main scanning direction Y is the position Y1.

When the second exposure process is performed, in the position Y1, the single irradiation region G2 and the connection region G3 are alternately arranged along the sub-scanning direction X.

The second graph J2 has a portion that changes in a trapezoidal shape. The trapezoidal portion has a second center portion J21 and a pair of second end portions J22. The second central portion J21 is a portion where the exposure amount is constant at an exposure amount of 50%. Each of the pair of second end portions J22 is connected to the second central portion J21, and as the distance from the second central portion J21 is separated, the exposure amount is sensed. In this embodiment, in each of the pair of 2nd end parts J22, as the distance from the 2nd center part J21 senses the emission rate of the drawn light sensibly, the exposure amount is sensed bodily. The second central portion J21 is positioned between the pair of second end portions J22.

Hereinafter, when the 2nd exposure process is performed, the connection region G3 formed on the board | substrate W may be described as the 2nd connection region G32.

The drawing light of 50% of exposure amount is irradiated to the single irradiation region G2. As a result, the second pattern Q2 is drawn in the single irradiation region G2.

As shown in FIG. 6, in the same manner as in the first connection region G31, the second connection region G32 is irradiated with the drawn light so that the sum of the exposure amounts is 50% of the exposure amount. As a result, the second pattern Q2 is drawn in the second connection region G32.

Next, with reference to FIG. 8, the predetermined pattern Q drawn on the board | substrate W is demonstrated. 8 is a schematic view showing a predetermined pattern Q drawn on the substrate W. As shown in FIG.

As shown in FIG. 8, the first exposure process and the second exposure process are performed, whereby the first connection region G31 and the second connection region G32 are formed in the predetermined region W1 of the substrate W do. The first connection region G31 and the second connection region G32 extend along the main scanning direction Y. The first connection region G31 and the second connection region G32 are alternately arranged along the sub-scanning direction X. The 1st connection area G31 and the 2nd connection area G32 are arrange | positioned in the place which does not overlap with each other. In addition, overlapping means that the Z-axis overlaps in the extending direction. Further, non-overlapping indicates that the Z-axis does not overlap in the extending direction.

8 further shows a composite graph (J). Referring to Fig. 8, the composite graph J will be further described.

As shown in FIG. 8, the composite graph J is a graph showing the relationship between the exposure amount of the drawn light and the position of the sub-scanning direction X for each exposure process. The composite graph J of this embodiment is a graph combining the first graph J1 shown in FIG. 5 and the second graph J2 shown in FIG. 7. The vertical axis of the composite graph J represents the exposure amount of the drawn light during the first exposure treatment and the exposure amount of the drawn light during the second exposure treatment. The horizontal axis of the composite graph J represents the position of the sub-scanning direction X when the position of the main scanning direction Y is the position Y1.

By performing the 1st exposure process and the 2nd exposure process, the drawn light of 50% of exposure amount is irradiated to the predetermined area | region W1 of the board | substrate W. Therefore, the sum of the exposure doses of the drawn light irradiated in double with respect to the predetermined region W1 is 100% of the exposure dose. As a result, since it corresponds to that the drawing light of 100% of exposure amount was irradiated to the predetermined area | region W1, it becomes possible to draw the predetermined pattern Q to the predetermined area | region W1.

Next, with reference to FIGS. 9 (a) and 9 (b), the state of the substrate W when the substrate W is irradiated with drawing light having an exposure amount of 100% will be described. Fig. 9 (a) is a side view schematically showing a state where the substrate W is irradiated with a writing light having an exposure amount of 100%. Fig. 9 (b) is a plan view showing a substrate W after conventional pattern development.

9 (a) and 9 (b), conventionally, when drawing a predetermined pattern Q on the substrate W, drawing light having an exposure amount of 100% was irradiated onto the substrate W. . In short, the exposure process was completed once. As a result, exposure streaks R were generated in the surface layer of the resist of the substrate W after development of the predetermined pattern Q. The exposure stripes R were generated in the connection region G3.

Next, referring to Figs. 10 (a) and 10 (b), the state of the substrate W when the first exposure processing shown in step S20 in Fig. 4 and the second exposure processing shown in step S30 are performed Will be described. 10 (a) is a side view schematically showing a state in which the first exposure process and the second exposure process are performed on the substrate W. As shown in FIG. 10 (b) is a plan view showing the substrate W after pattern development of the present application.

10 (a) and 10 (b), the inventor of the present application performs a predetermined pattern (Q) on the substrate W by causing the drawing device 1 to perform a first exposure process and a second exposure process. Was drawn. In short, the inventor of this application performed a plurality of exposure treatments. As a result, after the development of the predetermined pattern Q, the exposure stripes R occurring in the connection region G3 were alleviated.

Hereinafter, the principle in which the exposure streak R is relaxed will be described. The inventor of the present application has discovered that as the exposure amount of the connection region G3 increases, the exposure streak R increases. The exposure amount of the connection region G3 represents the sum of the exposure doses of the drawn light irradiated overlapping the connection region G3. In the conventional exposure processing shown in Figs. 9A and 9B, the exposure amount of the connection region G3 is 100% of the exposure amount. On the other hand, in the exposure process of the present application shown in Figs. 10A and 10B, the exposure amount of the connection region G3 is 50% of the exposure amount. Therefore, as described herein, the exposure amount of the connection region G3 can be reduced by performing a plurality of exposure treatments on the predetermined region W1. As a result, since the exposure streak R generated in the connection region G3 becomes thin, the exposure streak R is relaxed.

As described above, as described with reference to FIGS. 4 to 10 (b), multiple exposure processing is performed. The multiple exposure process of this embodiment includes the first exposure process shown in step S20 and the second exposure process shown in step S30. The control unit 60 performs multiple exposure processing by controlling the driving mechanism 20 and the optical unit 40. In the first exposure process, the drawn light is irradiated in parallel by the optical unit 40 so that the first connection region G31 is formed. In the second exposure process, the drawn light is irradiated in parallel by the optical unit 40 so that the second connection region G32 is formed. Therefore, by performing a plurality of exposure processes, the exposure amount of the first connection region G31 and the exposure amount of the second connection region G32 can be reduced compared to the case where the exposure treatment is completed at once. As a result, the exposure stripes R can be relaxed.

Moreover, as shown in FIG. 8, the 1st connection area G31 and the 2nd connection area G31 formed for every exposure process are located in the place which does not overlap with each other. Therefore, the exposure streak R can be effectively relaxed.

In the above, embodiment of this invention was described, referring drawings (FIGS. 1-10). However, the present invention is not limited to the above-described embodiments, and can be carried out in various aspects without departing from the gist thereof (for example, (1) to (10)). Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, several components may be deleted from all the components shown in the embodiment. In order to make the drawing easy to understand, each component is schematically represented as a subject, and the number of components shown in the drawings may be different from the actual situation in view of drawing. In addition, each component shown in the above-mentioned embodiment is an example and is not specifically limited, Various changes are possible within the range which does not deviate substantially from the effect of this invention.

(1) As shown in Fig. 8, in the present embodiment, in the first exposure process, the drawn light having an exposure amount of 50% is irradiated, and in the second exposure process, the drawn light with an exposure amount of 50% is also irradiated. That is, in the first exposure process and the second exposure process, the same pattern is drawn. However, the present invention is not limited to this. The sum of the exposure amount of the drawn light irradiated by the first exposure process and the exposure amount of the drawn light irradiated by the second exposure process may be approximately equal to the required exposure amount. The required exposure amount represents the exposure amount required for drawing a predetermined pattern (Q). In this embodiment, the required exposure amount is 100% of exposure amount.

Referring to Fig. 11, a first modified example of the exposure process will be described. 11 is a view showing a first modification (JA) of the synthesis graph (J). As shown in FIG. 11, when the required exposure amount is 100% of exposure amount, for example, the exposure amount of the drawn light irradiated by the first exposure treatment is 30% of the exposure amount, and the exposure amount of the drawn light irradiated by the second exposure treatment is the exposure amount of 70 %. Therefore, the substrate W is irradiated with writing light having an exposure amount of 100% (30% + 70% = 100%). As a result, since the writing light of the exposure amount equivalent to the required exposure amount is irradiated to the substrate W, it becomes possible to draw a predetermined pattern Q on the substrate W.

(2) In the present embodiment, the required exposure amount is 100% of the exposure amount. However, the present invention is not limited to this. The required exposure amount may be greater than 0% of the exposure amount. Further, the required exposure amount may be greater than 100% of the exposure amount.

A second modified example of the exposure process will be described with reference to FIG. 12. It is a figure which shows the 2nd modified example (JB) of the synthesis graph (J). As shown in FIG. 12, when the required exposure amount is 70% of exposure amount, for example, the exposure amount of the drawn light irradiated by the first exposure treatment is set to the exposure amount 35%, and the exposure amount of the drawn light irradiated by the second exposure treatment is the exposure amount 35 %. Therefore, the substrate W is irradiated with drawing light having an exposure amount of 70% (35% + 35% = 70%). As a result, since the writing light of the exposure amount equivalent to the required exposure amount is irradiated to the substrate W, it becomes possible to draw a predetermined pattern Q on the substrate W.

(3) In the present embodiment, the required exposure amount is 100% of the constant exposure amount in all positions of the predetermined area W1. However, the present invention is not limited to this. The required exposure amount may be different (for each pixel) in each of the predetermined areas W1 where drawing light is irradiated.

(4) In this embodiment, when drawing a predetermined pattern Q on the board | substrate W, exposure process is performed twice. Specifically, the first exposure process and the second exposure process are performed. However, the present invention is not limited to this. The exposure treatment may be performed three or more times. For example, exposure treatment may be performed 4 times.

With reference to FIG. 13, the exposure amount of the drawn light in the case where the exposure process is performed 4 times is demonstrated. 13 is a view showing a third modification (JC) of the synthesis graph (J). As shown in FIG. 13, a 1st exposure process, a 2nd exposure process, a 3rd exposure process, and a 4th exposure process may be performed. In this case, if the required exposure amount is 100% of the exposure amount, in each of the first exposure treatment to the fourth exposure treatment, for example, a writing light having an exposure amount of 25% is irradiated. Therefore, the substrate W is irradiated with drawing light having an exposure amount of 100% (25% + 25% + 25% + 25% = 100%). As a result, since the writing light of the exposure amount equivalent to the required exposure amount is irradiated to the substrate W, it becomes possible to draw a predetermined pattern Q on the substrate W.

(5) With reference to FIG. 14, a modified example of the positional relationship between the first connection region G31 and the second connection region G32 will be described. It is a figure which shows the 4th modified example (JD) of the synthesis graph (J).

In this embodiment, the 1st connection area G31 and the 2nd connection area G32 are arrange | positioned in the place which does not overlap with each other (refer FIG. 8). However, the present invention is not limited to this. The position of the connection region G3 formed for each exposure treatment is not particularly limited. As shown in FIG. 14, the 1st connection area G31 and the 2nd connection area G32 may be arrange | positioned at the place overlapping each other. As a result, after the development of the predetermined pattern Q, the exposure stripes R occurring in the connection region G3 can be relaxed.

Hereinafter, a description will be given of a principle capable of alleviating the exposure streaks R even when the first connection region G31 and the second connection region G32 are disposed at overlapping locations. The inventor of the present application has found that when the exposure amount of the connection region G3 exceeds a predetermined threshold, the darkness of the exposure stripes R suddenly increases. That is, when the exposure amount of the connection region G3 is less than a predetermined threshold, the exposure streak R is relaxed. Therefore, by performing a plurality of exposure treatments on the predetermined area W1 as described herein, the exposure amount of the connection area G3 can be made smaller than a predetermined threshold, and therefore the exposure stripes R formed in the connection area G3 ) Can be relaxed. As a result, even in a place where the first connection region G31 and the second connection region G32 overlap each other, the exposure streak R can be relaxed compared to when the exposure process is completed at once.

(6) The optical modulation element of the optical unit 40 is not limited to GLV. The optical modulation element of the optical unit 40 should just have a structure that can change the output rate of the drawn light. The optical modulation element may be, for example, a DMD (Digital Micromirror Device).

(7) In the present embodiment, one optical unit 40 is formed. However, the present invention is not limited to this. Two or more optical units 40 may be formed, for example. When two optical units 40 are formed, for example, one optical unit 40 is responsible for exposing half of the predetermined area W1 of the substrate W, and the other optical unit 40 ) It is responsible for the exposure of the other half of the predetermined area W1.

(8) In the present embodiment, when exposure processing is performed, the substrate W moves. However, the present invention is not limited to this. When the exposure process is performed, the optical unit 40 may move, or both of the substrate W and the optical unit 40 may move. In addition, the substrate W moves indicates that the stage 10 moves while the substrate W is held on the stage 10.

(9) The moving speed of the substrate W when steps S20 and S30 shown in Fig. 4 are performed will be described.

In this embodiment, in each of step S20 and step S30, when the writing light of 50% of exposure amount is irradiated to the predetermined area W1 of the substrate W (see Figs. 5 and 7), the predetermined area W1 With respect to), compared with the case where the drawn light having an exposure amount of 100% is irradiated at once (see Fig. 9 (a)), the energy of the drawn light is the same and the moving speed of the substrate W is doubled. As a result, it can suppress that the time required for exposure processing is prolonged compared with the case where the drawing light of 100% of exposure amount is irradiated to the predetermined area | region W1 at a time. However, the present invention is not limited to this.

In each of step S20 and step S30, when drawing light of 50% of exposure amount is drawn to the predetermined area | region W1 of the board | substrate W, compared with the case of irradiating drawing light of 100% of exposure amount at once, The moving speed of the substrate W may be the same while halving the energy of the drawing light.

(10) In the present embodiment, the pattern drawn on the substrate W is a negative pattern in which the exposed area finally remains as an image pattern by development after exposure processing. However, the present invention is not limited to this. The pattern drawn on the substrate W may be a positive pattern in which unexposed areas remain due to development after exposure processing.

The present invention can be used in the fields of a drawing device and a drawing method.

W; Board
One ; Drawing device
10; stage
20; Drive mechanism
40; Optical unit (irradiation unit)
60; Control
G3; Connection area
W1; A certain area

Claims (9)

A drawing device for drawing a pattern on the substrate by irradiating drawing light to the substrate,
An irradiation unit for irradiating the drawing light;
Control unit for controlling the irradiation unit,
Equipped with,
The control unit controls the irradiation unit so that the irradiation unit performs multiple exposure processing,
The multiple exposure process includes a plurality of exposure processes for irradiating the drawing light with the irradiation part on a predetermined area of the substrate,
Each of the plurality of exposure processes includes a process of irradiating the drawing light in parallel by the irradiation part so that a connection region is formed,
The said connection area | region is a drawing apparatus which shows the area | region which partially overlaps the irradiation area of the said drawing light irradiated in parallel. According to claim 1,
The drawing apparatus in which the said several connection area formed by the said multiple exposure process is located in the place which does not overlap with each other. The method of claim 1 or 2,
In at least two exposure processes among the plurality of exposure processes, the control unit controls the irradiation unit so that the same pattern is drawn on the substrate. The method of claim 1 or 2,
The connection area is an area where a pattern is drawn, a drawing device. The method of claim 1 or 2,
When a predetermined pattern is drawn on the substrate by the multiple exposure process, for each exposure process, the sum of each of the exposure doses of the drawing light irradiated to the substrate is approximately equal to the required exposure amount required to draw the predetermined pattern. , Wherein the control unit controls the irradiation unit. The method of claim 1 or 2,
A stage for holding the substrate,
Driving mechanism for moving the stage with respect to the irradiation portion
It is further provided,
The drawing apparatus adjusts the exposure amount of the said drawing light by controlling the said drive mechanism so that the exposure amount of the said drawing light with respect to the said board | substrate decreases, so that the moving speed of the said stage with respect to the said irradiation part increases. The method of claim 1 or 2,
The graph showing the relationship between the irradiation position of the drawing light with respect to the substrate and the exposure amount of the drawing light has a portion formed in a trapezoidal shape,
The trapezoidal portion has a central portion where the exposure amount is constant, and is connected to the central portion, and has a pair of ends where the exposure amount is sensed as being separated from the central portion,
The drawing device is located between the pair of ends, the central portion. The method of claim 1 or 2,
The plurality of exposure processes include a first exposure process and a second exposure process,
The first exposure amount of the drawing light irradiated to the substrate during the first exposure processing is equal to the second exposure amount of the drawing light irradiated to the substrate during the second exposure processing, or the first exposure amount is the A drawing device different from the second exposure amount. As a drawing method of drawing a pattern on the substrate by irradiating the drawing light to the substrate,
It includes a multiple exposure process for performing multiple exposure treatment,
The multiple exposure process includes a plurality of exposure processes for irradiating the drawn light onto a predetermined area of the substrate,
Each of the plurality of exposure processes includes a process of irradiating the drawing light in parallel so that a connection region is formed,
The said connection area | region represents the area | region which partially overlaps with the irradiation area of the said drawing light irradiated in parallel.

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