KR20200025048A - Coil component - Google Patents

Abstract

According to an aspect of the present invention, a coil component comprises: a body having one surface and the other surface which are opposite to each other along one direction and a plurality of wall surfaces connecting the one surface and other surface; a coil part embedded in the body, and having at least one turn in one direction as an axis; first and second external electrodes arranged on one surface of the body to be spaced apart from each other and individually connected to the coil part; and a shielding layer formed of a cap part on the other surface of the body and a plurality of side wall parts individually arranged on the plurality of wall surfaces of the body, and containing conductive powder and resin. Moreover, each of the plurality of wall surfaces and the cap part are connected by a curved surface.

Description

 Coil Parts {COIL COMPONENT}

The present invention relates to a coil component.

One of the coil components, an inductor, is a representative passive electronic component used in electronic devices, along with a resistor and a capacitor.

As electronic devices become increasingly high performance and small, the number of electronic parts used in electronic devices increases and becomes smaller.

For the reasons described above, there is an increasing demand for removing noise sources such as EMI (Electro Magnetic Interference) of electronic components.

Current common EMI shielding technology is to mount an electronic component on a substrate and then surround the electronic component and the substrate at the same time with a shield can.

Japanese Patent Laid-Open No. 2005-310863 (published Nov. 4, 2005)

It is an object of the present invention to provide a coil component in which leakage flux can be reduced.

In addition, it is to provide a coil component capable of light and small reduction while reducing leakage magnetic flux.

According to an aspect of the present invention, a body having one surface and the other surface facing each other along one direction and a plurality of wall surfaces respectively connecting the one surface and the other surface, embedded in the body and at least one turn around the one direction (axis) A coil part forming a), first and second external electrodes spaced apart from each other on one surface of the body and connected to the coil part, respectively, and a cap part disposed on the other surface of the body and a plurality of wall surfaces of the body, respectively. It provides a coil component comprising a plurality of side wall portions and a shielding layer comprising a conductive powder and a resin, wherein each of the plurality of side wall portions and the cap portion is curved.

According to the present invention, it is possible to reduce the leakage magnetic flux of the coil component.

In addition, the coil component can be made light and thin while reducing the leakage magnetic flux of the coil component.

1 is a perspective view schematically showing a coil component according to a first embodiment of the present invention;
2 is a cross-sectional view taken along line II ′ of FIG. 1.
3 is a cross-sectional view taken along the line II-II ′ of FIG. 1.
4 is a cross-sectional view of the coil component according to the second exemplary embodiment of the present invention, and corresponds to the cross-sectional view taken along line II ′ of FIG. 1.
5 is a cross-sectional view of the coil component according to the third exemplary embodiment of the present invention, and corresponds to the cross-sectional view taken along line II ′ of FIG. 1.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof. And, throughout the specification, "on" means to be located above or below the target portion, and does not necessarily mean to be located above the gravity direction.

In addition, the coupling means not only the case where the physical contact is directly between the components in the contact relationship between the components, but also other components are interposed between the components, the components in the other components Use it as a comprehensive concept until each contact.

Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated.

In the drawing, L direction may be defined as a first direction or a longitudinal direction, W direction as a second direction or a width direction, and T direction as a third direction or a thickness direction.

Hereinafter, a coil component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicate description thereof. Will be omitted.

Various kinds of electronic components are used in the electronic device, and various kinds of coil components may be suitably used for the purpose of noise reduction and the like among the electronic components.

In other words, in electronic devices, coil components are used as power inductors, high frequency inductors, general beads, high frequency beads, and common mode filters. Can be.

(First embodiment)

1 is a perspective view schematically showing a coil component according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1. 3 is a cross-sectional view taken along the line II-II ′ of FIG. 1.

1 to 3, the coil component 1000 according to the first exemplary embodiment of the present invention may include a body 100, a coil part 200, external electrodes 300 and 400, a shielding layer 500, and an interior. The insulating layer IL may be further included, and the cover layer 700 and the insulating layer IF may be further included.

The body 100 forms the appearance of the coil component 1000 according to the present embodiment and embeds the coil part 200 therein.

The body 100 may be formed in the shape of a hexahedron as a whole.

The body 100 includes a first surface and a second surface facing each other in the longitudinal direction L, a third surface and a fourth surface facing each other in the width direction W, and a fifth surface facing the thickness direction T. Cotton and sixth surface. Each of the first to fourth surfaces of the body 100 corresponds to a wall surface of the body 100 connecting the fifth and sixth surfaces of the body 100. Hereinafter, both cross-sections of the body may mean first and second surfaces of the body, and both sides of the body may mean third and fourth surfaces of the body.

The body 100 is, for example, formed so that the coil component 1000 according to the present embodiment in which the external electrodes 300 and 400 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm. It may be, but is not limited thereto.

The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by stacking one or more magnetic composite sheets in which magnetic materials are dispersed in a resin. However, the body 100 may have a structure other than the structure in which the magnetic material is dispersed in the resin. For example, the body 100 may be made of a magnetic material such as ferrite.

The magnetic material may be ferrite or magnetic metal powder.

Examples of the ferrite powder include spinel type ferrites such as Mg-Zn-based, Mn-Zn-based, Mn-Mg-based, Cu-Zn-based, Mg-Mn-Sr-based, and Ni-Zn-based, Ba-Zn-based, and Ba-based. Hexagonal ferrites such as -Mg-based, Ba-Ni-based, Ba-Co-based, Ba-Ni-Co-based, garnet-type ferrites such as Y-based, and Li-based ferrites.

The magnetic metal powder is iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). It may include any one or more selected from the group consisting of. For example, the magnetic metal powder is pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo- Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe- Ni-Cr-based alloy powder, Fe-Cr-Al-based alloy powder may be at least one or more.

The magnetic metal powder may be amorphous or crystalline. For example, the magnetic metal powder may be a Fe-Si-B-Cr based amorphous alloy powder, but is not necessarily limited thereto.

The ferrite and the magnetic metal powder may have an average diameter of about 0.1 μm to 30 μm, respectively, but are not limited thereto.

The body 100 may include two or more kinds of magnetic materials dispersed in a resin. Here, the different kinds of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other by any one of average diameter, composition, crystallinity and shape.

The resin may include epoxy, polyimide, liquid crystal polymer, or the like alone or in combination, but is not limited thereto.

The body 100 includes a core 110 penetrating the coil part 200 to be described later. The core 110 may be formed by filling the through hole of the coil part 200 with the magnetic composite sheet, but is not limited thereto.

The coil unit 200 is embedded in the body 100 to express the characteristics of the coil component. For example, when the coil component 1000 is used as a power inductor, the coil unit 200 may serve to stabilize the power supply of the electronic device by storing an electric field as a magnetic field and maintaining an output voltage.

The coil unit 200 may include a first coil pattern 211, a second coil pattern 212, and a via 220.

The first coil pattern 211, the second coil pattern 212, and the internal insulation layer IL to be described later may be formed in a stacked form along the thickness direction T of the body 100.

Each of the first coil pattern 211 and the second coil pattern 212 may be formed in the shape of a flat spiral. For example, the first coil pattern 211 may form at least one turn on one surface of the internal insulating layer IL with respect to the thickness direction T of the body 100.

The via 220 penetrates through the internal insulation layer IL to electrically connect the first coil pattern 211 and the second coil pattern 212 to the first coil pattern 211 and the second coil pattern 212. Contact each. As a result, the coil unit 200 applied to the present embodiment may be formed as one coil that generates a magnetic field in the thickness direction T of the body 100.

At least one of the first coil pattern 211, the second coil pattern 212, and the via 220 may include at least one conductive layer.

For example, when the second coil pattern 212 and the via 220 are formed by plating, the second coil pattern 212 and the via 220 may each include a seed layer and an electroplating layer of the electroless plating layer. . Here, the electroplating layer may have a single layer structure or a multilayer structure. The electroplating layer of the multilayer structure may be formed in a conformal film structure in which one electroplating layer is covered by another electroplating layer, and the other electroplating layer is laminated only on one surface of any one electroplating layer. It may be formed in a shape. The seed layer of the second coil pattern 212 and the seed layer of the via 220 may be integrally formed so as not to form a boundary therebetween, but is not limited thereto. The electroplating layer of the second coil pattern 212 and the electroplating layer of the via 220 may be integrally formed so as not to form a boundary therebetween, but is not limited thereto.

As another example, when the first coil pattern 211 and the second coil pattern 212 are formed separately, and stacked together on the internal insulating layer IL to form the coil part 200, a via ( 220 may include a low melting point metal layer having a melting point lower than that of the high melting point metal layer and the high melting point metal layer. Here, the low melting point metal layer may be formed of a solder including lead (Pb) and / or tin (Sn). The low melting point metal layer is melted at least in part due to the pressure and temperature at the time of batch deposition, and at least one of the boundary between the low melting point metal layer and the second coil pattern 212 and the boundary between the high melting point metal layer and the low melting point metal layer is an intermetallic compound layer. (Inter Metallic Compound Layer, IMC Layer) may be formed.

For example, the first coil pattern 211 and the second coil pattern 212 may be formed to protrude on the lower surface and the upper surface of the internal insulating layer IL, for example. As another example, the first coil pattern 211 is buried in the lower surface of the internal insulating layer IL so that the lower surface is exposed to the lower surface of the internal insulating layer IL, and the second coil pattern 212 is the internal insulating layer IL. Protruding from the upper surface of the). In this case, a recess is formed in the lower surface of the first coil pattern 211, and the lower surface of the internal insulating layer IL and the lower surface of the first coil pattern 211 may not be located on the same plane. As another example, the first coil pattern 211 is buried in the lower surface of the internal insulating layer IL so that the lower surface is exposed to the lower surface of the internal insulating layer IL, and the second coil pattern 212 is the internal insulating layer IL. Buried in the top surface of the top surface) may be exposed to the top surface of the internal insulating layer IL.

Each of the first coil pattern 211, the second coil pattern 211, and the vias 220 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), and nickel ( It may be formed of a conductive material such as Ni), lead (Pb), titanium (Ti), or an alloy thereof, but is not limited thereto.

The internal insulating layer IL is formed of an insulating material including at least one of a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, and a photosensitive insulating resin, or such an insulating resin such as glass fiber or an inorganic filler. The reinforcing material may be formed of an impregnated insulating material. For example, the internal insulating layer IL may be formed of insulating materials such as prepreg, Ajinomoto build-up film (ABF), FR-4, bisaleimide triazine (BT) resin, and photo imaginable dielectric (PID). However, it is not limited thereto.

Inorganic fillers include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), silicon carbide (SiC), barium sulfate (BaSO ₄ ), talc, mud, mica powder, aluminum hydroxide (AlOH ₃ ), magnesium hydroxide (Mg ( OH) ₂ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO ₃ ), barium titanate (BaTiO ₃ ) and calcium zirconate (CaZrO At least one selected from the group consisting of ₃ ) can be used.

When the internal insulation layer IL is formed of an insulation material including a reinforcing material, the internal insulation layer IL may provide more excellent rigidity. When the internal insulating layer IL is formed of an insulating material that does not contain glass fiber, the internal insulating layer IL is advantageous in reducing the thickness of the entire coil part 200. When the internal insulating layer IL is formed of an insulating material including a photosensitive insulating resin, the number of processes is reduced, which is advantageous in reducing production costs and enables fine hole processing.

The insulating layer IF is formed along the surfaces of the first coil pattern 211, the internal insulating layer IL, and the second coil pattern 212. The insulating film IF is used to protect and insulate the coil patterns 211 and 212 and may include a known insulating material such as paraline. Any insulating material included in the insulating film IF may be used, and there is no particular limitation. The insulating layer IF may be formed by, for example, vapor deposition, but is not limited thereto. The insulating film IF may be formed on both sides of the internal insulating layer IL having the first and second coil patterns 211 and 212 formed thereon. It may be formed.

Although not shown, at least one of the first coil pattern 211 and the second coil pattern 212 may be formed in plural. For example, the coil unit 200 may have a structure in which a plurality of first coil patterns 211 are formed, and another first coil pattern is stacked on a lower surface of one first coil pattern. In this case, an additional insulating layer may be disposed between the plurality of first coil patterns 211, and the plurality of first coil patterns 211 may be connected by connection vias penetrating the additional insulating layer, but is not limited thereto. .

The external electrodes 300 and 400 are disposed on the sixth surface of the body 100, respectively, and are connected to the coil unit 200. The external electrodes 300 and 400 include a first external electrode 300 connected to the first coil pattern 211 and a second external electrode 400 connected to the second coil pattern 212.

In detail, the first external electrode 300 may include a first extension part 320 disposed on the sixth surface of the body 100 and an end portion of the first coil pattern 211 embedded in the body 100. The first connector 310 may be connected to the first extension part 320. The second external electrode 400 includes a second extension part 420 disposed on the sixth surface of the body 100 and an end portion and the second extension part of the second coil pattern 212 embedded in the body 100. And a second connector 410 connecting the 420. The first extension part 320 and the second extension part 420 disposed on the sixth surface of the body 100 are spaced apart from each other so that the first external electrode 300 and the second external electrode 400 do not contact each other. do. According to the present embodiment, the external electrodes 300 and 400 are disposed only on the sixth surface of the body 100 among the surfaces of the body and are not disposed on the remaining surfaces.

The external electrodes 300 and 400 electrically connect the coil component 1000 to the printed circuit board when the coil component 1000 according to the present embodiment is mounted on the printed circuit board. For example, the coil component 1000 according to the present exemplary embodiment may be mounted such that the sixth surface of the body 100 faces the upper surface of the printed circuit board. The external electrode disposed on the sixth surface of the body 100 may be provided. Extension portions 320 and 420 of the 300 and 400 and a connection portion of the printed circuit board may be electrically connected by soldering or the like.

The external electrodes 300 and 400 may include at least one of a conductive resin layer and a plating layer. The conductive resin layer may be formed by paste printing or the like, and may include any one or more conductive metals and thermosetting resins selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag). The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

The connecting portions 310 and 410 may be formed by forming via holes to expose end portions of the coil patterns 211 and 212 on the sixth surface side of the body, and disposing a conductive material in the via holes. In this regard, the connecting parts 310 and 410 may be via-shaped electrodes, but this is merely an example. That is, as long as it is embedded in the body 100 and connects the ends of the extension parts 320 and 420 and the respective coil patterns 211 and 212, it will correspond to the connection part of the present invention.

On the other hand, Figure 1 and the like, but each one of the connecting portion (310, 410) is shown, but this is only an example, bar connection portion 310, 410 each may be formed in a plurality.

The shielding layer may be formed in the body 100 to reduce leakage magnetic flux leaking to the outside from the coil component 1000 according to the present embodiment. The shielding layer 500 includes a cap portion 510 disposed on the other surface of the body 100 and a plurality of side wall portions 521, 522, 523, and 524 disposed on the wall surface of the body 100, respectively. That is, the shielding layer 500 may include the cap 510 disposed on the fifth surface of the body 100, and the first to fourth portions of the body connecting the sixth surface of the body 100 and the fifth surface of the body. It is composed of side walls 521, 522, 523, 524 disposed on the surface and connected to the cap 510.

The cap part 510 and the side wall parts 521, 522, 523, and 524 may be integrally formed. That is, the cap part 510 and the side wall parts 521, 522, 523, and 524 may be formed in the same process so that boundaries thereof may not be formed. The cap portion 510 and the side wall portions 521, 522, 523, 524 are integrally formed by applying a conductive paste containing conductive powder and a resin to the first to fifth surfaces of the body 100 and curing the conductive paste. Can be. For example, after the sixth surface of the body 100 having the extended parts 320 and 420 is faced upward, the cap 100 and the side wall part (by dipping the body 100 to the above-described conductive paste) 521, 522, 523, 524 may be integrally formed.

The conductive powder may include silver (Ag), but is not limited thereto, and may include copper (Cu), aluminum (Al), tin (Sn), gold (Au), nickel (Ni), lead (Pb), or It may include a titanium (Ti) conductive material. The conductive powder may be acicular powder, spherical powder or flake powder, but is not limited thereto. The average diameter of the conductive powder may be D50, but is not limited thereto.

The cap part 510 and the side wall parts 521, 522, 523, and 524 may be connected to a curved surface. That is, the cross section of the connection portion between the cap portion and the side wall portion may be formed in a shape including a curve. Magnetic and electric fields tend to be concentrated in angular forms. That is, the magnetic field and the electric field are easily concentrated at each corner and vertex of the body 100. Therefore, in the present embodiment, the connecting portion of the cap portion 510 and the side wall portions 521, 522, 523, 524 has a curved surface, thereby minimizing angled portions of corners and vertices. This may prevent the magnetic field and the electric field from concentrating on a specific portion of the coil component 1000.

The shielding layer 500 may be formed to a thickness of 10 nm to 100 μm. When the thickness of the shielding layer 500 is less than 10 nm, there is almost no EMI shielding effect. When the thickness of the shielding layer 500 exceeds 100 micrometers, since the total length, width, and thickness of a coil component increase, it is disadvantageous for thinning.

The cover layer 700 is disposed on the shielding layer 500 to cover the shielding layer 500. The cover layer 700 prevents the shielding layer 500 from being electrically connected to other external electronic components or the external electrodes 300 and 400.

The cover layer 700 is a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, acrylic, phenol, epoxy, urethane, melamine or alkyd. It may include at least one of a thermosetting resin, a photosensitive insulating resin, paraline, SiO _x or SiN _x .

The cover layer 700 may be formed by, for example, stacking a cover film on the body 100 on which the shielding layer 500 is formed. As another example, the cover layer 700 may be formed on the first to fifth surfaces of the body 100 by forming an insulating material by vapor deposition such as chemical vapor deposition (CVD).

The cover layer 700 may be formed in a thickness range of 10 nm to 100 μm. If the thickness of the cover layer 700 is less than 10 nm, the insulation characteristics are weak, and external electrodes and shorts may occur. If the thickness of the cover layer 700 is more than 100 μm, the total length, width, and thickness of the coil part may be increased. Increased and disadvantageous to thinning.

The sum of the thicknesses of the shielding layer 500 and the cover layer 700 may be greater than 30 nm and less than or equal to 100 μm. When the sum of the thicknesses of the shielding layer 500 and the cover layer 700 is less than 30 nm, an electrical short problem, a characteristic reduction problem of a coil component such as a Q factor, and the like may occur, and the shielding layer 500 and When the sum of the thicknesses of the cover layers 700 exceeds 100 mu m, the total length, width, and thickness of the coil part increases, which is disadvantageous for thinning.

Although not shown, an insulating layer may be formed between the body 100 and the shielding layer 500. The insulating layer may function as a plating resist in forming the extensions 320 and 420 by plating, but is not limited thereto.

Since the shielding layer 500 of the present invention is disposed on the coil component itself, the shielding layer 500 is mounted on the printed circuit board, and is distinguished from the shield can coupled to the printed circuit board for shielding EMI. For example, unlike the shield can, the shielding layer 500 of the present invention may not consider the connection with the ground layer of the printed circuit board, and is not a structure supported by the printed circuit board.

Since the cover layer 700 of the present invention is disposed on the coil component itself, the cover layer 700 is distinguished from a molding material for molding the coil component and the printed circuit board in the step of mounting the coil component on the printed circuit board. For example, the cover layer 700 of the present invention does not contact the printed circuit board, and unlike the molding material, the cover layer 700 is not supported or fixed by the printed circuit board. In addition, unlike a molding material surrounding a connecting member such as a solder ball connecting the coil component and the printed circuit board, the cover layer 700 of the present invention is not formed in a shape surrounding the connecting member. In addition, the cover layer 700 of the present invention is not a molding material formed by heating an EMC (Epoxy Molding Compound) or the like on a printed circuit board to be cured. It is not necessary to consider the occurrence of warpage of the printed circuit board due to the difference in thermal expansion coefficient between the circuit boards.

In the coil component according to the present exemplary embodiment, the shielding layer 500 is formed on the body 100 itself so as to reduce the leakage magnetic flux. In addition, the angular shape of the shielding layer 500 is minimized to prevent the electric field and the magnetic field from being concentrated in the angular region of the part.

(2nd Example)

4 is a cross-sectional view of the coil component according to the second exemplary embodiment of the present invention, and corresponds to the cross-sectional view taken along line II ′ of FIG. 1.

1 to 4, the cap part 510 is different from the coil part 2000 according to the present embodiment when compared to the coil part 1000 according to the first embodiment of the present invention. Therefore, in describing the present embodiment, only the cap 510 different from the first embodiment of the present invention will be described. The rest of the configuration of this embodiment can be applied to the description in the first embodiment of the present invention as it is.

Referring to FIG. 4, the cap 510 has a thickness T ₁ of the central portion thicker than the thickness T ₂ of the outer portion. This will be described in detail.

Each of the coil patterns 211 and 212 constituting the coil unit 200 according to the present exemplary embodiment has a plurality of coil patterns 211 and 212 extending from the center of the inner insulating layer IL to the outside of the inner insulating layer IL on both sides of the inner insulating layer IL. A turn is formed, and each coil pattern 211 and 212 are stacked in the thickness direction T of the body 100 and connected by the vias 220. As a result, the coil component 2000 according to the present embodiment has the highest magnetic flux density at the center of the longitudinal direction L-width direction W plane of the body 100 perpendicular to the thickness direction T of the body 100. high. Therefore, in the present embodiment, in forming the cap portion 510 disposed on the fifth surface of the body 100 substantially parallel to the longitudinal (L)-width (W) plane of the body 100, the body In consideration of the magnetic flux density distribution in the longitudinal (L) -width (W) plane of (100), the thickness T ₁ of the central portion of the cap portion 510 is formed thicker than the thickness T ₂ of the outer portion.

By doing so, the coil component 3000 according to the present embodiment can reduce the leakage magnetic flux more efficiently in response to the magnetic flux density distribution.

(Third Embodiment)

5 is a cross-sectional view of the coil component according to the third exemplary embodiment of the present invention, which corresponds to the cross-sectional view taken along line II ′ of FIG. 1.

1 to 5, the coil part 3000 according to the present exemplary embodiment may include a cap part 510 and a sidewall part as compared with the coil parts 1000 and 2000 according to the first and second exemplary embodiments of the present invention. 521, 522, 523, 524 are different. Therefore, in describing the present embodiment, only the cap part 510 and the side wall parts 521, 522, 523, and 524 which are different from those of the first and second embodiments of the present invention will be described. The rest of the configuration of this embodiment can be applied to the description in the first and second embodiments of the present invention as it is.

Referring to FIG. 5, the thickness T ₃ of the cap part 510 may be thicker than the thickness T ₄ of the side wall parts 521, 522, 523, and 524.

As described above, the coil unit 200 generates a magnetic field in the thickness direction T of the body 100. As a result, the magnetic flux leaking in the thickness direction T of the body 100 is larger than the magnetic flux leaking in the other direction. Accordingly, the thickness of the cap 510 disposed on the fifth surface of the body 100 perpendicular to the thickness direction T of the body 100 is determined by the side wall portions 521, 522, and 523 disposed on the wall surface of the body 100. By forming thicker than the thickness of 524, the leakage magnetic flux can be reduced more efficiently.

On the other hand, in the above-described embodiments of the present invention, the coil unit is described as a so-called thin-film coil that forms a coil pattern by plating or sputtering, but the scope of the present invention also includes a stacked coil and a vertically disposed coil. The stacked coil means that the conductive paste is applied to each magnetic sheet, and then the plurality of magnetic sheets are laminated and sintered. The vertically arranged coil means that a turn is formed perpendicularly to the lower surface of the coil component whose coil pattern is the mounting surface.

As mentioned above, although an embodiment of the present invention has been described, one of ordinary skill in the art may add, change, or delete components without departing from the spirit of the present invention described in the claims. It will be appreciated that the present invention may be modified and modified in various ways, and this is also within the scope of the present invention.

100: body
110: core
200: coil part
211, 212: coil pattern
220: Via
300, 400: external electrode
310, 410: connection
320, 420: extension part
500: shielding layer
510: cap
521, 522, 523, 524: side wall portion
700: cover layer
IL: internal insulation layer
IF: insulating film
1000, 2000, 3000: coil parts

Claims (8)

A body having one surface and another surface facing each other along one direction, and a plurality of wall surfaces connecting the one surface and the other surface, respectively;
A coil part embedded in the body and forming at least one turn about the one direction;
First and second external electrodes disposed on one surface of the body and spaced apart from each other, and connected to the coil part, respectively; And
A shielding layer comprising a cap portion disposed on the other surface of the body and a plurality of side wall portions disposed on the plurality of wall surfaces of the body, respectively, and including conductive powder and resin;
Including,
The coil component is connected to each of the plurality of side wall portions and the cap portion curved.
The method of claim 1,
The electroconductive powder is a coil component containing silver (Ag).
The method of claim 1,
The thickness of the cap portion,
Coil component thicker at the center of the other surface of the body than at the outer surface of the other surface of the body.
The method of claim 1,
And the cap part and the plurality of side wall parts are integrally formed.
The method of claim 1,
And a thickness of the cap portion is thicker than at least one of the plurality of sidewall portions.
The method of claim 1,
And a cover layer disposed on the shielding layer to cover the shielding layer.
The method of claim 1,
Each of the first and second external electrodes
An extension part disposed on one surface of the body, and
A coil part embedded in the body and including a connection part connecting the extension part and the coil part.
The method of claim 1,
An internal insulation layer embedded in the body; More,
The coil unit
First and second coil patterns respectively formed on both surfaces of the inner insulation layer, each of the first and second coil patterns forming at least one turn about the one direction;
Vias connecting the first and second coil patterns through the internal insulating layer
Coil parts comprising a.

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