KR20200024462A - By-directional electrically conductive module and manufacturing method thereof - Google Patents

Abstract

In one embodiment of the present invention, provided is a bidirectional conductive module electrically connecting an upper device with a lower device, which comprises: an insulating main body formed of a material having insulating properties and having a plurality of through holes penetrating in a vertical direction; a plurality of reinforcing sheets spaced in the vertical direction from the inside of the insulating body, and having support holes at a position corresponding to each support hole so that each through hole can communicate in the vertical direction; and a plurality of conductive pattern units formed in each through hole to form a signal line in the vertical direction to electrically connect the upper device with the lower device. The plurality of reinforcing sheets prevent deformation of the through hole by the force applied in the vertical direction of the through hole when the upper device and the lower device are in contact.

Description

Bidirectional conductive module and manufacturing method thereof {BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a bidirectional conductive module and a method of manufacturing the same, and in detail, even when the upper device and the lower device are repeatedly contacted, the shape of the through hole filled with the conductive pattern part is prevented in the lateral direction, thereby preventing the shape of the upper device and the upper device. The present invention relates to a bidirectional conductive module and a method of manufacturing the same, which can stably achieve connection efficiency to a lower device.

After the semiconductor device is manufactured, a test is performed to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process of manufacturing a semiconductor device, in addition to a final inspection of a semiconductor device.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals, i.e., leads of semiconductor devices are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.

However, the existing Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. The proposed technique to meet the integration of the semiconductor device, the perforated pattern is formed in the vertical direction on the silicon body made of an elastic silicon material, and then filled with conductive powder inside the perforated pattern to form a conductive pattern PCR socket type is widely used.

1 is a cross-sectional view of a conventional semiconductor test apparatus 10 of the PCR socket type.

Referring to FIG. 1, in the conventional PCR socket type semiconductor test socket 10, a perforated pattern is formed in an insulating silicon body 11, and the vertical direction is formed by the conductive powder 12 filled in the perforated pattern. Conductive patterns are formed. As described above, the PCR type semiconductor test socket 10 has an advantage of enabling fine pitch.

However, the PCR type semiconductor test socket 10 has a conductive powder 12 filled in a perforated pattern when the terminal 21 of the semiconductor element 20 contacts the terminal 31 of the test circuit board 30. Since the conductivity is formed by the generated pressure, as shown in the enlarged view of FIG. 1, the conductive powder 12 is caused by the pressure applied when the semiconductor element 20 is in contact with the test circuit board 30. ) Spreads sideways, there is a disadvantage in that the thickness is limited in the vertical direction.

In addition, in the case of the PCR type, there is a problem in that contact defects occur between the semiconductor device and the test circuit board as the conductive powder spreads due to the pressure generated when the semiconductor device contacts the test circuit board.

Korean Laid-Open Patent Publication No. 10-2016-0148097 discloses a PCR device and a method of manufacturing the same.

The present invention is a bidirectional conductive module that can prevent the deformation of the through-hole filled with the conductive pattern portion by the plurality of reinforcing sheet in the lateral direction, even in the repeated contact between the upper device and the lower device and a method of manufacturing the same The purpose is to provide.

In one embodiment of the present invention, the bidirectional conductive module for electrically connecting the upper device and the lower device, is provided with an insulating material, the insulating body having a plurality of through holes penetrated in the vertical direction; A plurality of reinforcing sheets spaced apart in the vertical direction from the inside of the insulating body and having support holes formed at positions corresponding to the respective through holes so that each through hole communicates in the vertical direction; And a plurality of conductive patterns formed in each through hole to form a signal line in the vertical direction to electrically connect the upper device and the lower device, wherein the plurality of reinforcing sheets are formed in the through hole at the contact of the upper device and the lower device. It is preferable to prevent deformation of the through-hole in the lateral direction by the force applied in the vertical direction.

In one embodiment of the present invention, the reinforcing sheet is preferably made of a material having a higher strength than the material of the insulating body.

Here, the reinforcing sheet is preferably made of any one of an insulating material such as polyimide, silicone or urethane, stainless material, or a composite material such as FR4 (Flame Retardant Type 4).

Alternatively, the reinforcing sheet is preferably formed by coating and curing a liquid insulating material on the mesh cloth.

On the other hand, the insulating body is formed by stacking a plurality of main body units are coupled to each reinforcement sheet and formed with a plurality of unit through-holes at a position corresponding to the plurality of support holes stacked up and down, a plurality of units provided in each main unit It is preferable that the through holes communicate with each other up and down to form a plurality of through holes.

For example, the reinforcing sheet is preferably provided not to be exposed to the outside of the main unit.

As another example, the reinforcing sheet is preferably provided to be exposed to one surface of the body unit.

As another example, the reinforcing sheet is made of a conductive material, coupled to the main unit so that the through-holes are located inside the support hole, and is preferably grounded when contacted with the ground terminal of the upper device or the ground terminal of the lower device.

In addition, the reinforcing sheet is preferably provided so that each support hole is not exposed to each through hole.

In addition, the reinforcing sheet is provided with a plurality of cross holes, it is preferable that the plurality of cross holes are spaced apart between the plurality of support holes.

On the other hand, a method of manufacturing a bidirectional conductive module for producing a bidirectional conductive module for electrically connecting the upper device and the lower device, (A) a step of placing a plurality of reinforcing sheet spaced in the module mold; (B) a step of injecting a liquid insulating material into the module mold and cured to form an insulating body in which a plurality of reinforcing sheets are embedded; (C) forming a plurality of through holes through the insulating main body in the stacking direction of the plurality of reinforcing sheets; And (D) forming a plurality of conductive pattern portions formed in each through hole to form signal lines in the vertical direction to electrically connect the upper device and the lower device.

In one embodiment of the present invention, before step (A), the reinforcing sheet further includes a step of forming a plurality of support holes arranged corresponding to the terminals of the upper device, in step (C), the through holes are respectively At a position corresponding to the supporting hole of the insulating body, it is preferable that the insulating body penetrates in the vertical direction.

In one embodiment of the invention, the support hole has a diameter larger than the diameter of the through hole, each through hole is preferably located inside each of the support holes.

In one embodiment of the present invention, in step (C), the through hole is preferably formed so that the reinforcing sheet is not exposed.

In one embodiment of the present invention, in step (C), the plurality of reinforcing sheet is penetrated with the insulating body, it is preferable that a plurality of support holes are formed in a position corresponding to the plurality of through holes.

On the other hand, the manufacturing method of the bidirectional conductive module for producing a bidirectional conductive module for electrically connecting the upper device and the lower device, the step of coupling a reinforcing sheet provided with a plurality of support holes to the body unit made of an insulating material; Forming a plurality of unit through holes through the main body unit at a position corresponding to the plurality of support holes in a vertical direction; Stacking and coupling a plurality of main body units up and down so that a plurality of unit through holes provided in each main unit communicate with each other up and down to form a plurality of through holes; And forming a plurality of conductive patterns formed in each through hole to electrically connect the upper device and the lower device to form signal lines in the vertical direction.

For example, the reinforcing sheet is preferably provided not to be exposed to the outside of the main unit.

As another example, the reinforcing sheet is preferably provided to be exposed to one surface of the body unit.

As another example, the reinforcing sheet is made of a conductive material, coupled to the main unit so that the through-holes are located inside the support hole, and is preferably grounded when contacted with the ground terminal of the upper device or the ground terminal of the lower device.

In this embodiment, the reinforcing sheet is preferably made of a material having a higher strength than the material of the insulating body.

In addition, the reinforcing sheet is preferably made of any one of an insulating material such as polyimide, silicone or urethane, stainless material, or a composite material such as FR4 (Flame Retardant Type 4).

Alternatively, the reinforcing sheet is preferably formed by coating and curing a liquid insulating material on the mesh cloth.

In addition, the reinforcing sheet is preferably provided so that each support hole is not exposed to each through hole.

In addition, the reinforcing sheet is provided with a plurality of cross holes, it is preferable that the plurality of cross holes are spaced apart between the plurality of support holes.

According to the present invention, a plurality of reinforcing sheets support the through-holes of the insulating body in the lateral direction, thereby preventing lateral deformation of the through-holes due to the pressing of the insulating body in the lateral direction by the force applied when the upper device and the lower device are in contact. can do.

Accordingly, the present invention prevents the lateral deformation of the through holes even during repeated contact between the upper device and the lower device, thereby preventing the spread of the plurality of conductive pattern portions in the lateral direction, thereby lowering the conductivity of the plurality of conductive pattern portions. Can be prevented.

In addition, the present invention by preventing the lateral deformation of the through-hole, it is possible to achieve a stable connection efficiency between the upper device and the lower device, it is possible to extend the service life of the bidirectional conductive module.

In addition, the present invention minimizes noise and mutual signal interference in each conductive pattern part, thereby enabling stable signal transmission and realizing high-speed.

1 is a view for explaining a conventional semiconductor test socket of the PCR type.
FIG. 2 schematically illustrates a state diagram in which a bidirectional conductive module according to a first embodiment of the present invention is installed on an upper device and a lower device.
3 is an enlarged view of a portion X of FIG. 2.
Figure 4 schematically shows a plan view according to an example of the reinforcing sheet according to the first embodiment of the present invention.
Figure 5 schematically shows a plan view according to another example of the reinforcing sheet according to the first embodiment of the present invention.
6 to 8 are views for explaining a method of manufacturing a bidirectional conductive module according to a first embodiment of the present invention.
9 is a view for explaining a method of manufacturing a bidirectional conductive module according to a second embodiment of the present invention.
10 illustrates a cross-sectional view of a main body unit according to a third embodiment of the present invention.
FIG. 11 shows a plan view of FIG. 10 (a).
12 is a view for explaining a method of manufacturing a bidirectional conductive module according to a third embodiment of the present invention.
FIG. 13 schematically illustrates a state diagram in which a bidirectional conductive module according to a fourth embodiment of the present invention is installed in an upper device and a lower device.
14 is an enlarged view of a portion Y in FIG. 13.

Hereinafter, with reference to the accompanying drawings, a bidirectional conductive module and a method of manufacturing the same according to a preferred embodiment of the present invention will be described.

First embodiment

● Bidirectional conductive module

Referring to Figures 2 and 3, the bi-directional conductive module of the present invention will be described.

As shown in FIG. 2, the bidirectional conductive module 100 of the present invention is applied to electrically connect the upper device 20 and the lower device 30. For example, when the present invention is applied to a good test of a semiconductor device, the upper device may be a semiconductor device to be tested, and the lower device may be an inspection circuit board. Alternatively, when the present invention is applied to an interposer, the upper device may be a CPU, and the lower device may be a board.

2 and 3, the bidirectional conductive module 100 according to the present invention includes an insulating body 111, a plurality of conductive pattern portions 112, and a plurality of reinforcing sheets 113.

The insulating main body 111 is made of an insulating material. As the insulating material, a material having elasticity such as silicon may be used, but is not necessarily limited thereto, and may be changed within a range obvious to those skilled in the art.

Insulating body 111 is formed with a plurality of through holes 111a penetrating in the vertical direction. The plurality of through holes 111a are arranged at pitch intervals between the terminals 21 of the upper device. A plurality of through holes 111a are filled with a conductive filler. The filler includes conductive particles having conductivity.

The plurality of conductive pattern portions 112 are formed in the respective through holes 111a to form signal lines in the vertical direction. For example, the conductive pattern part 112 is formed by filling fillers in the respective through holes 111a. For example, the liquid silicone and the conductive particles may be formed by filling and curing the filler. Here, the conductive particles may have the form of conductive powder, conductive fiber or conductive wire having conductivity, and plating of a conductive material may be formed on an outer surface to improve conductivity.

As shown in FIG. 3, the plurality of reinforcing sheets 113 are spaced apart in the vertical direction of the insulating body 111. Each reinforcing sheet 113 supports the through-hole 111a in the lateral direction of the insulating body. Here, the lateral direction refers to a direction perpendicular to the vertical direction of the insulating body.

The plurality of reinforcing sheets 113 support the respective through holes 111 a in the lateral direction, and apply the force applied in the vertical direction of the through holes 111 a when the upper device 20 and the lower device 30 come into contact with each other. This can prevent deformation of the through hole 111a in the lateral direction.

As shown in Figure 4, the reinforcing sheet 113 is provided with a plurality of support holes (113a). The plurality of support holes 113a are provided in the reinforcing sheet 113 to correspond to the arrangement of the terminals 21 of the upper device.

In addition, as illustrated in FIG. 5, the reinforcement sheet 113 may further include a plurality of cross holes 118. The plurality of cross holes 118 are spaced apart between the plurality of support holes 113a. The plurality of cross holes 118 are holes penetrating the reinforcing sheet 113 by a laser.

As illustrated in FIGS. 6 and 7, the support hole 113a may have a diameter larger than the diameter of the through hole 111a. In this embodiment, each through hole 111a is provided in the insulating main body 111 so as to be located inside each support hole 113a.

In the present embodiment, the reinforcing sheet 113 is preferably made of a material having a higher strength than the material of the insulating body 111. For example, the reinforcing sheet may be made of any one of an insulating material such as polyimide, silicone or urethane, a stainless material, or a composite material such as Flame Retardant Type 4 (FR4).

Alternatively, the reinforcing sheet may be formed by coating and curing a liquid insulating material on a mesh cloth. The support hole 113a is preferably provided so that the reinforcing sheet 113 is not exposed to each through hole 111a.

The present invention prevents shape deformation in the lateral direction of the through hole 111a in which the conductive pattern portion 112 is filled by the plurality of reinforcing sheets 113 even when repeatedly contacting the upper device and the lower device. The connection efficiency with respect to the upper device 20 and the lower device 30 can be stably achieved.

● Manufacturing method of bidirectional conductive module

Hereinafter, a method of manufacturing a bidirectional conductive module for manufacturing the bidirectional conductive module 100 will be described with reference to FIGS. 6 to 8.

First, a reinforcing sheet 113 having a plurality of support holes 113a is prepared. The plurality of support holes 113a are arranged in the reinforcing sheet 113 in an arrangement corresponding to the arrangement between the terminals 21 of the upper device.

Thereafter, the reinforcing sheet 113 is installed in the module mold 40. At this time, the plurality of reinforcing sheet 113 is spaced apart by the interval maintaining member 41. As shown in FIG. 4, the plurality of reinforcing sheets 113 may include a sheet in which only a plurality of support holes are formed, or a sheet in which a plurality of support holes 113a and a plurality of cross holes 118 are provided. Although it may be used, in the present specification, a reinforcing sheet provided with a plurality of support holes 113a and a plurality of cross holes 118 shown in FIG. 5 will be described as an example.

Spacer holding member 41 may be used as a spacer, but is not necessarily limited thereto and can be variously changed within a range apparent to those skilled in the art. In addition, the number of installation of the reinforcing sheet can be variously changed according to the design requirements, depending on the size and thickness of the bidirectional conductive module, in this embodiment is not specifically limited to the number of installation of the reinforcing sheet.

Thereafter, a liquid insulating material (eg, liquid silicon) is injected into the module mold 40. In this process, the insulating material is injected into the module mold 40, the insulating material is filled in the plurality of support holes 113a and the plurality of cross holes 118 of the reinforcing sheet.

Thereafter, the liquid silicon is cured together with the plurality of reinforcing sheets 113, and an insulating body 111 is provided. The insulating main body 111 is separated from the module mold 40.

As shown in FIG. 7, the insulating main body 111 penetrates up and down to form a plurality of through holes 111a. The plurality of through holes 111a are provided in the insulating body 111 to correspond to the arrangement of the terminals 21 at pitch intervals between the terminals 21 of the upper device. At this time, it is preferable that the plurality of through holes 111a are provided to belong to the respective support holes 113a.

Thereafter, as illustrated in FIG. 8, the conductive powder is filled in the plurality of through holes 111a to provide the plurality of conductive pattern portions 112. The plurality of conductive pattern parts 112 electrically connect the upper device 20 and the lower device 30 when the terminal 21 of the upper device contacts the terminal 31 of the lower device.

In the bidirectional conductive module 100 manufactured by the above method, the plurality of reinforcing sheets 113 support the respective through holes 111a in the lateral direction, so that the upper device 20 and the lower device 30 are separated. Deformation in the lateral direction of the through-hole 111a by the force applied in the vertical direction of the through-hole 111a during repeated contact can be prevented.

In addition, by the plurality of cross holes 118 filled with an insulating material, the transmission of force through the reinforcing sheet 113 is further blocked, so that each conductive pattern portion 112 has a step between adjacent terminals. Even if it contacts the existing terminal, it can contact each terminal stably without contact failure.

Second embodiment

● Manufacturing method of bidirectional conductive module

Hereinafter, a bidirectional conductive module and a manufacturing method thereof according to a second embodiment of the present invention will be described.

9 is a view for explaining another example of the manufacturing method of the bidirectional conductive module. 9 is a case where the reinforcing sheet 213 made of an insulating material is used. The reinforcing sheet may be made of an insulating material such as polyimide, silicone or urethane. Alternatively, the reinforcing sheet may be formed by coating and curing a liquid insulating material (eg, liquid silicon) on a mesh cloth.

As shown in FIG. 9 (a), a module mold 40 having a hollow inside is prepared. Unlike the first embodiment described above, the reinforcing sheet according to the present embodiment is not provided with a supporting hole.

In the module mold 40, the plurality of reinforcing sheets 213 are spaced apart by the space keeping member 41. Spacers may be used as spacers, but are not necessarily limited thereto, and may be variously changed within a range apparent to those skilled in the art.

As shown in FIG. 9B, a liquid insulating material (eg, liquid silicon) is injected into the module mold 40. Thereafter, the liquid silicone is cured together with the plurality of reinforcing sheets 213, and an insulating body 211 is provided. The insulating body 211 is separated from the module mold 40.

As shown in FIG. 9C, the plurality of through holes 211a are formed to penetrate in the vertical direction of the insulating body 211 and the plurality of reinforcing sheets 213. In this example, the plurality of through holes 211a are pitch intervals between the terminals 21 of the upper device, and the insulating body 211 and the plurality of reinforcing sheets 213 penetrate up and down in the stacking direction of the plurality of reinforcing sheets. Is formed. The plurality of through holes 211a may be provided by a mechanical method or a laser method, and various perforation methods within a range apparent to those skilled in the art may be used.

Thereafter, as illustrated in FIG. 9D, the conductive powder is filled in the plurality of through holes 211a to provide the plurality of conductive pattern portions 212.

● Bidirectional conductive module

As shown in FIG. 9 (d), the bidirectional conductive module according to the present exemplary embodiment includes an insulating body 211, a plurality of conductive pattern parts 212, and a plurality of reinforcing sheets 213. The bidirectional conductive module 200 according to another embodiment of the present invention is manufactured by the above method and its cross section is as shown in FIG. 9 (d).

In the same manner as the bidirectional conductive module 100 of the first embodiment described above, the bidirectional conductive module 200 according to the present embodiment is installed between the upper device 20 and the lower device 30, the upper device 20 And the lower device 30 are electrically connected.

In the bidirectional conductive module 200 according to the present exemplary embodiment, a plurality of reinforcing sheets 213 are perforated together with the insulating main body 211 in a process in which the plurality of through holes 211a are formed in the insulating main body 211. The reinforcing sheet 213 is exposed to the through hole 211a, which is different from the first embodiment described above.

Thus, the reinforcing sheet 213 according to the present embodiment preferably has insulation so as not to be energized with the conductive pattern portion 212. Accordingly, the reinforcing sheet 213 is preferably made of an insulating material such as polyimide, silicon, or urethane. Alternatively, the reinforcing sheet 213 may be a one in which a liquid insulating material (eg, liquid silicon) is coated and cured on a mesh cloth.

In the bidirectional conductive module 200, a plurality of reinforcing sheets 213 support the respective through holes 211a in the lateral direction of the insulating main body 211, so that the upper device 20 and the lower device 30 come into contact with each other. Deformation in the lateral direction of the through hole 211a due to the force applied in the up and down direction of the through hole 211a can be prevented.

Therefore, the present invention prevents the shape deformation in the lateral direction of the through hole filled with the conductive pattern portion by a plurality of reinforcing sheets, even when repeatedly contacting the upper device and the lower device, thereby connecting to the upper device and the lower device. The efficiency can be stably achieved.

Third embodiment

● Bidirectional Conductive Module (300)

Hereinafter, the bidirectional conductive module 300 and the manufacturing method thereof according to the third embodiment of the present invention will be described with reference to FIGS. 10 to 12.

As shown in FIG. 12C, the bidirectional conductive module 300 according to the present exemplary embodiment includes an insulating body 311, a plurality of conductive pattern parts 312, and a plurality of reinforcing sheets 313.

Unlike the first embodiment described above, the insulating body 311 according to the present embodiment is formed by stacking a plurality of body units (311-A, 311-B) up and down.

As shown in FIG. 10, the body units 311 -A and 311 -B are coupled to the respective reinforcing sheets 313 and are provided with a plurality of unit through holes 311a1 at positions corresponding to the plurality of support holes 313a. Is formed. As shown in FIG. 12, when the plurality of main body units 311-A and 311-B are stacked, the plurality of unit through holes 311a1 provided in the main body units 311-A and 311-B are disposed. It communicates up and down to form a plurality of through holes 311a.

For example, as shown in FIG. 10A, the reinforcing sheet 313 is preferably provided to be exposed to one surface of the main body unit 311 -A. Or, as another example, as shown in Figure 10 (b), the reinforcing sheet 313 is preferably provided not to be exposed to the outside of the main unit 311-B.

The reinforcing sheet 313 is preferably made of a material having a higher strength than that of the insulating main body 311. The reinforcing sheet 313 is preferably made of any one of an insulating material such as polyimide, silicone or urethane, a stainless material, or a composite material such as Flame Retardant Type 4 (FR4). Alternatively, the reinforcing sheet 313 is preferably formed by coating and curing a liquid insulating material on the mesh cloth. When made of a conductive material, the reinforcing sheet 313 is preferably provided so that each support hole 313a is not exposed to each through hole 311a.

As shown in Figure 10 (b), when the reinforcing sheet 313 is provided so as not to be exposed to the outside of the body unit 311-B, the reinforcing sheet 313 does not contact the upper device and the lower device, What is necessary is just to have higher strength than the material of the unit 311-B.

However, as shown in Figure 10 (a), when the reinforcing sheet 313 is exposed to one surface of the body unit 311-A, the material of the reinforcing sheet 313 is made of any of an insulating material or a conductive material Depending on whether or not, there is a difference in structure and function according to the arrangement of the support hole 313a of the reinforcing sheet 313 and the unit through hole 311a1 of the main body unit 311-A.

For example, when the reinforcing sheet 313 is made of an insulating material, even if the reinforcing sheet 313 is provided to be exposed to one surface of the main body unit 311 -A, even if the reinforcing sheet 313 is in contact with the upper device and the lower device. Not energized

The reinforcing sheet 313 may be coupled to the main body unit 311-A so that the plurality of support holes 313a correspond to the respective unit through holes 311a1, and support the main body unit 311-A laterally. . In this case, the plurality of reinforcing sheets 313 support the through-holes 311a formed by communicating the unit through-holes 311a1 with each other in a lateral direction, so that the upper device 20 and the lower device 30 are in contact with each other. Deformation in the lateral direction of the through hole 311a can be prevented by the force applied in the up and down direction of the through hole 311a.

As another example, when the reinforcing sheet 313 is made of a conductive material, the reinforcing sheet 313 is preferably coupled to the body unit 311-A such that the through hole 311a is positioned inside the support hole 313a. Do. That is, the reinforcing sheet 313 is preferably provided so that each support hole 313a is not exposed to each through hole 311a. This is to prevent the reinforcement sheet 313 from being in contact with the terminals of the upper device and / or the lower device when the bidirectional conductive module 300 is electrically connected to the upper device and the lower device.

● Method of manufacturing the bidirectional conductive module 300

Hereinafter, a method of manufacturing the bidirectional conductive module 300 will be described with reference to FIG. 12.

A main body unit 311-A in which the reinforcing sheet 313 illustrated in FIG. 12A is exposed on one surface is prepared. As shown in FIG. 11, the main body unit 311 -A includes a reinforcing sheet 313 so that each unit through hole 311a1 is positioned inside each support hole 313a of the reinforcing sheet 313. Combined.

For example, in a state where the reinforcing sheet 313 is coupled to one surface of the main body unit 311 -A, the main body unit 311 -A penetrates in a vertical direction at a position corresponding to the plurality of support holes 313a. A plurality of unit through holes 311a1 may be formed. At the edge of the main body unit 311-A, a pillar coupling hole 313c is provided.

As shown in Fig. 12 (a), a mold having a protruding pillar is provided. Each main body unit 311-A has a column coupling hole 313c stacked up and down in a mold through a protruding pillar. In the lamination process, each body unit 311 -A is bonded by an adhesive.

As shown in FIG. 12B, in the plurality of main body units 311 -A stacked in the mold, the plurality of unit through holes 311 a1 communicate with each other up and down to form a plurality of through holes 311 a.

Thereafter, the conductive powder is filled in the plurality of through holes 311a to provide the plurality of conductive pattern portions 312. Finally, after the bidirectional conductive module 300 is separated from the mold, the edge of the bidirectional conductive module 300 having the column coupling hole 313c is cut.

As shown in FIG. 12C, a plurality of conductive pattern parts 312 are formed in each through hole 311a to form signal lines in the vertical direction to electrically connect the upper device and the lower device.

Fourth embodiment

In the bidirectional conductive module 400 according to the present embodiment, the conductive line 414 is further provided in a structure in which the reinforcing sheet made of the conductive material shown in the third embodiment is exposed to the outside of the insulating main body. .

In the bidirectional conductive module 400 according to the present embodiment, the reinforcing sheet 413 is made of a conductive material, and the reinforcing sheet 413 is manufactured to be exposed to one surface of the main body unit.

When the reinforcing sheet 413 is made of a conductive material, the reinforcing sheet 413 is preferably coupled to the main unit so that the through hole 411a is positioned inside the support hole 413a. That is, the reinforcing sheet 413 is preferably provided so that each support hole 413a is not exposed to each through hole 411a.

The plurality of body units are stacked such that any one of the plurality of reinforcing sheets 413 is exposed to the outside of the insulating body 411. The plurality of reinforcing sheets 413 are spaced apart in the vertical direction by the main body units, and are electrically connected to each other by the conductive lines 414.

Here, the conductive line 414 may be formed by penetrating through the insulating body 411 up and down at a portion where the plurality of reinforcing sheet 413 is positioned, via holes, a plurality of reinforcement spaced vertically spaced apart from the viewpoint of those skilled in the art If the coupling method for electrically connecting the sheet 413 can be applied in addition to a variety of methods in addition to the via hole treatment.

As shown in FIGS. 13 and 14, in the bidirectional conductive module 400 having the structure as described above, a plurality of conductive pattern portions 412 are provided on the terminal 21 of the upper device and the terminal 31 of the lower device. Each contacted and exposed reinforcement sheet 413 is positioned in contact with the ground terminal 32 of the lower device. The exposed reinforcing sheet 413 is grounded when contacted with the ground terminal of the lower device, thereby minimizing noise and mutual signal interference in each conductive pattern portion, thereby enabling stable signal transmission, and achieving high-speed. Can be.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

100, 200: bidirectional conductive module
111, 211, 311, 411: insulating body
112, 212, 312, and 412: conductive pattern portion
113, 213, 313, 413: reinforcement sheet
414: challenge line

Claims (26)

In the bidirectional conductive module for electrically connecting the upper device and the lower device,
An insulating body provided with a material having insulating property and having a plurality of through holes penetrated in the vertical direction;
A plurality of reinforcing sheets spaced apart in the vertical direction from the inside of the insulating main body, and supporting holes are formed at positions corresponding to the respective through holes so that the respective through holes communicate in the vertical direction; And
A plurality of conductive pattern portions formed in each of the through-holes to form signal lines in the vertical direction and electrically connect the upper device and the lower device;
And the plurality of reinforcing sheets prevent deformation in the lateral direction of the through-holes by a force applied in the up-down direction of the through-holes when the upper device and the lower device are in contact with each other. The method of claim 1,
The reinforcing sheet is a bidirectional conductive module, characterized in that made of a material having a higher strength than the material of the insulating body. The method of claim 2,
The reinforcing sheet is bidirectional conductive module, characterized in that made of any one of an insulating material, such as polyimide, silicon or urethane, stainless material, or a composite material such as FR4 (Flame Retardant Type 4). The method of claim 2,
The reinforcing sheet is a bidirectional conductive module, characterized in that the liquid insulating material is applied to the mesh cloth and cured. The method of claim 2,
The insulating body is formed by stacking up and down a plurality of body units coupled to each of the reinforcement sheets and having a plurality of unit through holes formed at positions corresponding to the plurality of support holes, respectively provided in the body units. A plurality of unit through-holes communicate with each other up and down to form the plurality of through holes. The method of claim 5, wherein
The reinforcement sheet is a bi-directional conductive module, characterized in that provided not to be exposed to the outside of the main unit. The method of claim 5, wherein
The reinforcement sheet is a bi-directional conductive module, characterized in that provided to be exposed to one surface of the body unit. The method of claim 7, wherein
The reinforcing sheet is made of a conductive material and is coupled to the main unit so that the through hole is located in the support hole.
The plurality of main body unit is a bi-directional conductive module, characterized in that any one of the plurality of reinforcing sheet is laminated so as to be exposed to the outside of the insulating body. The method of claim 8,
The plurality of reinforcing sheets are spaced apart in the vertical direction by each of the main body unit, are electrically connected to each other by a conductive line,
And the exposed reinforcing sheet is grounded when contacted with the ground terminal of the upper device or the ground terminal of the lower device. The method of claim 1,
The reinforcing sheet is a bi-directional conductive module, characterized in that each supporting hole is provided so as not to be exposed to each of the through holes. The method of claim 1,
The reinforcing sheet is provided with a plurality of cross holes,
And the plurality of cross holes are spaced apart between the plurality of support holes. In the manufacturing method of the bidirectional conductive module for manufacturing a bidirectional conductive module for electrically connecting the upper device and the lower device,
(A) placing a plurality of reinforcing sheets spaced apart in the module mold;
(B) a step in which a liquid insulating material is injected into the module mold and cured to form an insulating body in which the plurality of reinforcing sheets are embedded;
(C) forming a plurality of through holes through the insulating body in the stacking direction of the plurality of reinforcing sheets; And
(D) forming a plurality of conductive patterns formed in each of the through holes to electrically connect the upper device and the lower device to form signal lines in the vertical direction. Manufacturing method. The method of claim 12,
Before the step (A), the reinforcing sheet further comprises the step of forming a plurality of support holes arranged to correspond to the terminal of the upper device,
In the step (C), the through hole is a method of manufacturing a bidirectional conductive module, characterized in that formed in the vertical direction through the insulating body at a position corresponding to each of the support hole. The method of claim 13,
The support hole has a diameter larger than the diameter of the through hole,
And each through hole is located inside the respective support hole. The method of claim 13,
In the step (C), the through hole is a manufacturing method of the bidirectional conductive module, characterized in that the reinforcing sheet is formed so as not to be exposed. The method of claim 12,
In the step (C), the plurality of reinforcing sheet is penetrated with the insulating body, a plurality of supporting holes is characterized in that a plurality of support holes are formed in a position corresponding to the plurality of through holes. In the manufacturing method of the bidirectional conductive module for manufacturing a bidirectional conductive module for electrically connecting the upper device and the lower device,
Coupling the reinforcing sheet provided with a plurality of support holes to a main body unit made of an insulating material;
Forming a plurality of unit through holes through the body unit in a vertical direction at a position corresponding to the plurality of support holes;
Stacking and coupling the plurality of main body units up and down so that the plurality of unit through holes provided in each of the main body units communicate vertically to form a plurality of through holes; And
And forming a plurality of conductive pattern portions formed in each of the through holes to electrically connect the upper device and the lower device to form signal lines in the vertical direction. The method of claim 17,
The reinforcing sheet is a manufacturing method of the bidirectional conductive module, characterized in that not provided to the outside of the main body unit. The method of claim 17,
The reinforcing sheet is a manufacturing method of the bidirectional conductive module, characterized in that provided to be exposed to one surface of the body unit. The method of claim 19,
The reinforcing sheet is made of a conductive material and is coupled to the main unit so that the through hole is located in the support hole.
The plurality of main body unit is a manufacturing method of the bidirectional conductive module, characterized in that any one of the plurality of reinforcing sheet is laminated so as to be exposed to the outside of the insulating body. The method of claim 20,
The plurality of reinforcing sheets are spaced apart in the vertical direction by each of the main body unit, are electrically connected to each other by a conductive line,
And the exposed reinforcing sheet is grounded when contacted with the ground terminal of the upper device or the ground terminal of the lower device. The method according to claim 12 or 17,
The reinforcing sheet is a method of manufacturing a bidirectional conductive module, characterized in that made of a material having a higher strength than the material of the insulating body. The method of claim 22,
The reinforcing sheet is a method of manufacturing a bidirectional conductive module, characterized in that made of any one of an insulating material, such as polyimide, silicon or urethane, stainless material, or a composite material such as FR4 (Flame Retardant Type 4). The method of claim 22,
The reinforcing sheet is a method of manufacturing a bidirectional conductive module, characterized in that the liquid insulating material is applied to the mesh cloth and cured formed. The method according to claim 12 or 17,
The reinforcing sheet is a manufacturing method of the bidirectional conductive module, characterized in that each of the support holes are provided so as not to be exposed to each of the through holes. The method according to claim 12 or 17,
The reinforcing sheet is provided with a plurality of cross holes,
And the plurality of cross holes are spaced apart between the plurality of support holes.

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