KR20200009583A - Low-resistance conductive tapes for aluminium material enhancing radio frquency, having excellent resistance to galvanic corrosion and oxidation - Google Patents

Abstract

The present invention relates to a low-resistance conductive tape for an aluminum material having an excellent galvanic corrosion prevention and oxidation prevention effect, which improves and maintains RF performance and, more specifically, to a low-resistance conductive tape which comprises: a conductive fiber layer consisting of conductive fibers; a conductive adhesive layer formed on an upper surface and a lower surface of the conductive fiber layer; and a metal layer formed on one surface of the conductive fiber layer having the conductive adhesive layer and consisting of aluminum sheets. The low-resistance conductive tape is formed of the metal layer consisting of the aluminum sheets to exhibit a galvanic anti-corrosion effect and a moisture-blocking effect for an aluminum material and uses an acrylic adhesive not containing an acid component to have an excellent anti-oxidation effect.

Description

LOW-RESISTANCE CONDUCTIVE TAPES FOR ALUMINIUM MATERIAL ENHANCING RADIO FRQUENCY, HAVING EXCELLENT RESISTANCE TO GALVANIC CORROSION AND OXIDATION

Disclosed is a galvanic anti-corrosion and anti-oxidative effect for improving and maintaining RF performance, and an excellent low resistance conductive tape for aluminum material. More particularly, a metal layer made of an aluminum sheet is formed to provide excellent galvanic corrosion protection for an aluminum material. And it relates to a low-resistance conductive tape for aluminum material exhibiting a moisture barrier effect, an acrylic pressure-sensitive adhesive that does not contain an acid component is used to improve and maintain the RF performance excellent in the antioxidant effect and excellent galvanic corrosion and antioxidant effect.

For IT devices with communication (antenna) functions, metallic cases are mainly used. For example, in the case of mobile phones among IT devices, conductive contact terminals (C-clip, etc.) existing on the front and back of the printed circuit board and IT devices are metallic. When the case is in direct contact, there was a problem that one metal is corroded due to the galvanic phenomenon caused by the metal and the metal in contact.

In order to solve the above problems, efforts have been made to suppress the galvanic phenomenon and maintain the RF performance of the IT device by applying a conductive tape showing conductivity between the conductive contact terminal (C-clip, etc.) and the metallic case of the IT device. have.

On the other hand, the electrically conductive tape is composed of a conductive metal foil made of copper, a conductive pressure-sensitive adhesive and a release paper, the conventional form of the above-described structure, the conventional conductive tape tapes a conductive metal such as copper foil on a release paper coated with a conductive adhesive It is generally configured to be configured so that the surface of the conductive metal foil can be wound without a release paper by treating with a release agent.

In this case, the conductive adhesive refers to an adhesive which has a conductive material suitable for the amount of the metal powder by adding a predetermined amount or more of conductive metal powder to the adhesive material prepared by dissolving a rubber or acrylic resin in an organic solvent.

However, in the case of a conductive tape having a metal layer made of copper as in the related art, when the metal layer made of copper contacts a case such as an IT device made of aluminum, galvanic corrosion occurs due to a potential difference between different metals.

In addition, conventionally, the conductive tape has a problem in that the components constituting the conductive tape are oxidized due to an acid component contained in the conductive adhesive, thereby increasing the resistance value of the conductive tape.

Korea Patent Registration No. 10-0528435 (2005.11.07) Korea Patent Registration No. 10-1679336 (2016.11.18)

Disclosed is a metal layer made of aluminum sheet to exhibit an excellent galvanic corrosion and water blocking effect for the aluminum material, and an acrylic adhesive containing no acid component is used to improve and maintain the galvanic corrosion excellent RF performance It is to provide a low resistance conductive tape for an aluminum material which is excellent in preventing and oxidizing effects.

In addition, the disclosed content is a urethane coating layer is formed to suppress the surface contamination of the conductive tape due to the conductive adhesive, low resistance conductivity for aluminum material excellent galvanic corrosion and oxidation prevention effect to improve and maintain the RF performance improved waterproof performance To provide a tape.

As one embodiment of the present disclosure is a conductive fiber layer made of conductive fibers, a conductive adhesive layer formed on the upper and lower surfaces of the conductive fiber layer and formed on one surface of the conductive fiber layer formed with the conductive adhesive layer, aluminum A low resistance conductive tape for aluminum materials having excellent galvanic anti-corrosion and anti-oxidation effects for improving and maintaining RF performance, comprising a metal layer made of a sheet, has been described.

Preferably, a urethane coating layer exhibiting a waterproof effect between the metal layer and the conductive adhesive layer and exhibiting conductivity by mixing indium tin oxide may be further formed.

More preferably, the urethane coating layer is formed to a thickness of 5 to 10 micrometers,

It may be composed of 100 parts by weight of urethane and 1 to 2 parts by weight of indium tin oxide.

More preferably, the conductive fiber layer is formed to a thickness of 10 to 100 micrometers,

The synthetic fiber may be formed by coating one conductive metal selected from the group consisting of copper, nickel, iron, zinc, lead, gold, and silver.

Even more preferably, the conductive adhesive layer is formed to a thickness of 1 to 20 micrometers,

It can be made by mixing a conductive metal powder to an acrylic pressure-sensitive adhesive that does not contain an acid component.

Still more preferably, the conductive adhesive layer may be made by mixing 15 to 20 parts by weight of the conductive metal powder to 100 parts by weight of the acrylic pressure-sensitive adhesive containing no acid component.

Even more preferably, the conductive metal powder may be made of silver powder and nickel powder.

Even more preferably, the metal layer may be formed to a thickness of 5 to 100 micrometers.

The low-resistance conductive tape for aluminum materials having excellent galvanic corrosion and oxidation prevention effects to improve and maintain the RF performance as described above has excellent galvanic corrosion and moisture blocking effects by forming a metal layer made of nickel plated copper. An acrylic pressure-sensitive adhesive is used that does not contain an acid component and shows excellent antioxidant effect.

In addition, the urethane coating layer is formed to suppress the surface contamination due to the conductive pressure-sensitive adhesive, and exhibits an excellent effect of providing a conductive tape with improved waterproof performance.

1 is an exploded perspective view illustrating a low resistance conductive tape having excellent galvanic corrosion and oxidation prevention effects for improving and maintaining RF performance according to an exemplary embodiment of the present disclosure.
FIG. 2 is an exploded view illustrating a low resistance conductive tape having excellent galvanic and anti-oxidation effects for improving and maintaining RF performance according to another disclosed embodiment.
Figure 3 is a photograph showing the measurement of the antioxidant effect of the conductive tape prepared through Example 1 and Comparative Example 1.
Figure 4 is a photograph showing the salt water resistance of the conductive tape prepared through Example 1 and Comparative Examples 2 to 3 disclosed.
Figure 5 is a graph showing the measurement of the high temperature and high humidity resistance performance of the conductive tape prepared in Example 1 and Comparative Example 3.
6 is a photograph showing a measuring method using the disclosed FLUKE 289.
7 is a photograph showing a disclosed PIM master.

In the following, preferred embodiments of the present invention and the physical properties of each component will be described in detail, which is intended to explain in detail enough to be able to easily carry out the invention by one of ordinary skill in the art, This does not mean that the technical spirit and scope of the present invention is limited.

The low resistance conductive tape for aluminum material having excellent galvanic corrosion and oxidation prevention effects to improve and maintain the disclosed RF performance is formed on the conductive fiber layer 10 made of conductive fibers, and the upper and lower surfaces of the conductive fiber layer 10. The conductive adhesive layer 20 and the conductive adhesive layer 20 are formed on one surface of the conductive fiber layer 10 is formed, and consists of a metal layer 30 made of an aluminum sheet.

The conductive fiber layer 10 is a layer of a low resistance conductive tape for aluminum material excellent in galvanic corrosion and oxidation prevention effect to improve and maintain the disclosed RF performance, is formed to a thickness of 10 to 100 micrometers, It is formed by coating a single conductive metal selected from the group consisting of copper, nickel, iron, zinc, lead, gold, and silver on the fiber, and it is a low galvanic anti-oxidation and anti-oxidation effect for improving and maintaining RF performance. It provides conductivity to the resistive conductive tape and serves to prevent the conductive tape from being deformed by an external force.

When the thickness of the conductive fiber layer 10 is less than 10 micrometers, the conductive tape can be easily deformed and broken by external force. When the thickness of the conductive fiber layer 10 exceeds 100 micrometers, the thickness of the conductive tape is excessively increased. It is not suitable for IT devices that are being miniaturized.

In this case, the synthetic fiber is preferably made of a component such as polyester or polyethylene terephthalate, it can be applied in the form of both woven (Woven) or non-woven (Non Woven), selectively applied according to the application of the conductive tape Preferably, the method of coating the conductive metal on the synthetic fiber is preferably using an electroless plating method.

The conductive adhesive layer 20 is formed with a thickness of 1 to 20 micrometers on the upper and lower surfaces of the conductive fiber layer 10, and is a conductive adhesive formed by mixing a conductive metal powder with an acrylic adhesive containing no acid component. It is formed, and one surface of the conductive fiber layer 10 is adhered to the metal layer 30, the other surface of the conductive fiber layer 10 serves to adhere to the metallic case of the IT device.

The conductive adhesive layer 20 is formed of a conductive adhesive formed by mixing 15 to 20 parts by weight of a conductive metal powder to 100 parts by weight of an acrylic pressure-sensitive adhesive that does not contain an acid component, as described above. When the conductive adhesive layer 20 is formed from the conductive adhesive prepared by mixing the mixture, it is possible to suppress the occurrence of oxidation in the conductive tape due to the acid component remaining in the adhesive.

In addition, when the content of the conductive metal powder is less than 15 parts by weight compared to 100 parts by weight of the acrylic adhesive containing no acid component, the conductivity of the conductive adhesive layer 20 is lowered, and when the content of the metal powder exceeds 20 parts by weight. The electroconductivity of the electroconductive adhesive layer 20 is not greatly improved, and the adhesive force of the electroconductive adhesive layer 20 is reduced.

In this case, the conductive metal powder is preferably made of silver powder and nickel powder having a particle size of 0.1 to 0.3 micrometer, but if the particle size of the conductive metal powder is less than 0.1 micrometer, the particle size is too small to contain the acid component. It may not be evenly mixed with the acrylic pressure-sensitive adhesive may cause agglomeration, and when the particle size of the conductive metal powder exceeds 0.3 micrometers, the adhesive strength of the conductive adhesive layer 20 is lowered.

In addition, the conductive metal powder is preferably used in the form of a spherical and cylindrical at the same time, when using a metal powder consisting of a spherical and cylindrical as described above the gap between the metal powder particles is minimized to the conductive adhesive layer 20 of the conductive Performance can be further improved.

The metal layer 30 is formed with a thickness of 5 to 100 micrometers on one surface of the conductive fiber layer 10 on which the conductive adhesive layer 20 is formed, and is made of an aluminum sheet. It serves to suppress corrosion.

Conventionally, a conductive metal made of copper is applied to one surface of the conductive tape, and copper is easily corroded when exposed to moisture or salt, and especially galvanic due to a potential difference between metals when contacted with a metal made of aluminum. Since corrosion may occur, it is preferable to apply an aluminum sheet of the same material as the aluminum material as the conductive metal in order to prevent the above problem.

If the thickness of the metal layer 30 is less than 5 micrometers, the effect of inhibiting the corrosion of the conductive tape from moisture or salt is insignificant. If the thickness of the metal layer 30 exceeds 100 micrometers, the thickness and weight of the conductive tape It is difficult to apply to the IT equipment which is miniaturized due to excessive increase.

In addition, a urethane coating layer 21 may be further formed between the metal layer 30 and the conductive adhesive layer 20 to show a waterproof effect and exhibit conductivity by mixing indium tin oxide. The urethane coating layer 21 may be further formed. In addition to the above effects, in the process of forming the conductive adhesive layer 20, the conductive adhesive component blocks the leakage of the metal layer 30, and serves to suppress the contamination of the metal layer 30 due to the conductive adhesive.

In addition, the urethane coating layer 21 is formed of a thickness of 5 to 10 micrometers, preferably consisting of 100 parts by weight of urethane and 1 to 2 parts by weight of indium tin oxide, the urethane has a solid content of 30% by weight The water-soluble urethane resin is selected, and the ratio of water-soluble urethane and water is ideally 3: 3 by weight, and the mixture is mixed and stirred with 1 to 2 parts by weight of indium tin oxide (ITO). It is prepared, and the mixture is formed by coating and drying the metal layer on a comma coater or a doctor blade equipment, the moisture contained in the urethane resin during the drying process is removed.

When the urethane coating layer 21 having the thickness is formed, the moisture that may occur due to the temperature change of the metal layer 30 is not transferred to the conductive adhesive layer 20, and thus the physical properties of the conductive adhesive layer 20 The fall of adhesive force can be suppressed, and a conductive adhesive can be blocked so that it may not be exposed to the outer surface of a metal layer.

When the thickness of the urethane coating layer 21 is less than 5 micrometers, the urethane coating layer 21 is easily cracked due to external force and thus cannot exhibit the above effects, and the thickness of the urethane coating layer 21 exceeds 10 micrometers. This is not preferable because the above effect increases the thickness of the conductive tape without significantly improving.

Hereinafter, a description will be given of an example of a method for preparing a low resistance conductive tape for an aluminum material having excellent galvanic corrosion and oxidation prevention effects for improving and maintaining the disclosed RF performance, and the physical properties of the low resistance conductive tape manufactured by the method. Let's do it.

<Example 1>

Nickel-coated polyester nonwoven fabric was prepared for the conductive fiber layer having a thickness of 50 micrometers, 100 parts by weight of the acrylic pressure-sensitive adhesive and the conductive metal powder (silver powder and nickel powder) containing no acid component on the upper and lower surfaces of the conductive fiber layer. 1 to 1 part by weight) 17 parts by weight of the conductive adhesive layer is formed to a thickness of 10 micrometers, and a metal layer made of an aluminum sheet on one surface of the conductive fiber layer on which the conductive adhesive layer is formed to a thickness of 50 micrometers Thus, a low resistance conductive tape for aluminum materials having excellent galvanic corrosion and oxidation prevention effects for improving and maintaining RF performance having a thickness of 110 micrometers was prepared.

Comparative Example 1

100 parts by weight of an acrylic adhesive containing about 6% of an acid component and a conductive metal powder (copper powder) were prepared by using a nickel nonwoven fabric coated with nickel and having a thickness of 50 micrometers. A conductive adhesive layer of 4 parts by weight is formed to a thickness of 10 micrometers, and a metal layer made of an aluminum sheet is formed to a thickness of 50 micrometers on one surface of the conductive fiber layer on which the conductive adhesive layer is formed. The tape was made.

Comparative Example 2

100 parts by weight of an acrylic pressure-sensitive adhesive and a conductive metal powder (copper powder) are prepared from a nickel-coated polyester nonwoven fabric having a thickness of 50 micrometers, and containing about 6% of an acid component on the upper and lower surfaces of the conductive fiber layer. A conductive tape having a thickness of 10 micrometers is formed by forming a conductive adhesive layer consisting of 4 parts by weight, and a metal layer made of copper is formed at a thickness of 50 micrometers on one surface of the conductive fiber layer on which the conductive adhesive layer is formed. Was prepared.

Comparative Example 3

A 100 micrometer thick conductive fiber layer is manufactured from a copper-coated polyester nonwoven fabric, and 100 parts by weight of an acrylic pressure-sensitive adhesive containing about 6% of an acid component on the upper and lower surfaces of the conductive fiber layer and a conductive metal powder (copper powder) A conductive adhesive layer consisting of 4 parts by weight was formed to a thickness of 10 micrometers to prepare a conductive tape having a thickness of 110 micrometers.

It was shown in Figure 3 below by measuring the antioxidant effect of the conductive tape prepared through Example 1 and Comparative Example 1.

(However, the antioxidant effect was attached to the aluminum panel conductive tapes prepared in Example 1 and Comparative Example 1, and measured for 128 hours at a temperature of 85 ℃ and humidity of 85%.)

As shown in FIG. 3 below, the aluminum to which the conductive tape prepared through the disclosed Example 1 was applied was not oxidized, while the aluminum to which the conductive tape prepared through Comparative Example 1 was applied was confirmed that corrosion occurred due to oxidation. have.

In addition, by measuring the salt water resistance of the conductive tape prepared in Example 1 and Comparative Examples 2 to 3 are shown in Table 1 and Figure 4 below.

(However, the salt water resistance was sprayed on the conductive tapes prepared in Examples 1 and Comparative Examples 2 to 3 with a salt concentration of 5% at a temperature of 35 ° C. for 24 hours, and then left at room temperature for 4 hours. A method of observing the change in resistance performance and appearance was used.)

TABLE 1

As shown in Table 1 above and FIG. 4 below, the conductive tape prepared in Example 1 exhibited excellent salt water resistance, while the conductive tape prepared in Comparative Example 2 maintained electrical resistance performance but caused corrosion in appearance. And, the conductive tape produced through Comparative Example 3 can be seen that the electrical resistance performance is lowered, corrosion occurs.

In addition, the high temperature and high humidity resistance performance of the conductive tapes prepared through Example 1 and Comparative Example 3 was measured and shown in FIG. 5 below.

(However, the high temperature and high humidity resistance performance is obtained by attaching the conductive tapes prepared in Example 1 and Comparative Example 3 to panels made of aluminum, respectively, and preparing 50 samples having a width of 2 mm × 2 mm, and then a temperature of 80 ° C. After 90 days of exposure at 80% humidity for 80 days, the measurement was performed under the condition of 100g & Ø0.8 Probe using FLUKE 289 as resistance tester.

The measurement method using the FLUKE 289 is shown in Figure 6 below.)

As shown in Figure 5 below, the conductive tape prepared through the disclosed Example 1 exhibits excellent high temperature and high humidity resistance performance compared to the conductive tape prepared through Comparative Example 3, in particular 90 days at 85 ℃ and 85% humidity It can be seen that even after this, the resistance value is maintained at 1.0 kΩ or less.

In addition, by measuring the RF performance of the conductive tape prepared in Example 1 and Comparative Example 3 are shown in Table 2 below.

{However, the RF performance was used in the PIM master shown in FIG. 7 below, and the conductive tapes prepared in Example 1 and Comparative Example 3 were stacked on each of nine sheets, and then tested at 870 MHz and 893 MHz two-tone. (@ 824MHz) was confirmed, Tx power level is 25 ~ 36dBm, measured at room temperature.}

TABLE 2

As shown in Table 2 above, it can be seen that the conductive tape prepared through the disclosed Example 1 exhibits superior RF performance compared to the conductive tape prepared through Comparative Example 3.

Therefore, the low-resistance conductive tape for aluminum materials having excellent galvanic corrosion and oxidation prevention effects for improving and maintaining the disclosed RF performance has a galvanic corrosion prevention and moisture blocking effect for aluminum materials by forming a metal layer made of an aluminum sheet, It can be seen that an acrylic adhesive containing no acid component is used to exhibit an excellent anti-oxidation effect, and a urethane coating layer is formed to suppress surface contamination due to the conductive adhesive and further improve waterproof performance.

10; Conductive fiber layer
20; Conductive Adhesive Layer
21; Urethane Coating Layer
30; Metal layer

Claims (8)

A conductive fiber layer made of conductive fiber;
A conductive adhesive layer formed on upper and lower surfaces of the conductive fiber layer; And
A low-resistance tape for aluminum materials having excellent galvanic corrosion and oxidation prevention effects, which is formed on one surface of the conductive fiber layer on which the conductive adhesive layer is formed and is made of an aluminum sheet. .
The method according to claim 1,
It is excellent in galvanic corrosion and oxidation prevention effect to improve and maintain the RF performance, characterized in that the waterproofing between the metal layer and the conductive adhesive layer exhibits a waterproofing effect, the indium tin oxide is mixed to form a urethane coating exhibiting conductivity. Low resistance conductive tape for aluminum material.
The method according to claim 2,
The urethane coating layer is formed to a thickness of 5 to 10 micrometers,
A low resistance conductive tape for aluminum materials having excellent galvanic and anti-oxidation effects to improve and maintain RF performance, comprising 100 parts by weight of urethane and 1 to 2 parts by weight of indium tin oxide.
The method according to claim 1,
The conductive fiber layer is formed to a thickness of 10 to 100 micrometers,
It is formed by coating one conductive metal selected from the group consisting of copper, nickel, iron, zinc, lead, gold, and silver on the synthetic fiber, and has excellent galvanic corrosion and antioxidant effects to improve and maintain RF performance. Low resistance conductive tape for aluminum material.
The method according to claim 1,
The conductive adhesive layer is formed to a thickness of 1 to 20 micrometers,
A low-resistance conductive tape for aluminum materials with excellent galvanic corrosion and oxidation prevention effects for improving and maintaining RF performance, characterized by mixing a conductive metal powder with an acrylic pressure-sensitive adhesive.
The method according to claim 5,
The conductive adhesive layer is an aluminum material excellent in galvanic corrosion and oxidation prevention effect to improve and maintain the RF performance, characterized in that by mixing 15 to 20 parts by weight of the conductive metal powder to 100 parts by weight of the acrylic pressure-sensitive adhesive containing no acid component Low resistance conductive tape.
The method according to claim 5 or 6,
The conductive metal powder is made of silver powder and nickel powder, low resistance conductive tape for aluminum material excellent in galvanic corrosion and oxidation prevention effect to improve and maintain the RF performance.
The method according to claim 1,
The metal layer is formed of a thickness of 5 to 100 micrometers low resistance tape for aluminum material excellent galvanic corrosion and oxidation resistance to improve and maintain the RF performance.

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