KR20200004950A - wafer plating system - Google Patents

Abstract

The present invention relates to a wafer plating system and, more specifically, to a wafer plating system which is capable of continuously prewetting, plating, washing, drying, and unloading a wafer to improve process efficiency for wafer plating, employs a dip method, and sprays a process solution by a rotating method of a nozzle instead of vibration of the wafer and/or the nozzle to supply a uniform process solution to the wafer, thereby improving plating quality. The wafer plating system comprises: a loading processing unit to load wafer jigs with wafers loaded thereon; a prewetting processing unit to sequentially receive the wafer jigs from the loading processing unit to perform prewetting on the wafers in a prewetting processing tank; a plating processing unit to sequentially receive the wafers jigs from the prewetting processing unit to perform plating on the wafers in a plating processing tank; a washing processing unit to sequentially receive the wafers jigs from the plating processing unit to perform washing on the wafers in a washing processing tank; a drying processing unit to sequentially receive the wafers jigs from the washing processing unit to perform drying on the wafers in a drying processing tank; an unloading processing unit to sequentially receive the wafers jigs from the drying processing unit to unload the wafer jigs; and a transport processing unit to sequentially transport the wafer jigs from the loading processing unit to the unloading processing unit.

Description

Wafer plating system

TECHNICAL FIELD The present invention relates to a wafer plating system, and in particular, by configuring the loading, prewetting, plating, cleaning, drying and unloading of the wafer to be performed sequentially and continuously, thereby improving process efficiency for wafer plating. It is possible to supply a uniform process solution to the wafer by adopting a dip (DIP) method, and configuring the process solution to be sprayed by rotating the nozzle instead of the vibration of the wafer and / or the nozzle. The present invention relates to a wafer plating system capable of improving plating quality.

In the process of manufacturing a semiconductor chip, the process of etching, evaporation, etc. in a wafer unit is completed and then tested and finally packaged. Packaging means mounting a chip and molding a chip on a substrate on which an outer lead is formed.

The outer lead refers to a terminal that electrically connects the board and the chip, and is classified into wire bonding and flip chip bonding according to the connection form between the outer lead and the chip. do.

Wire bonding connects an electrode pattern of a semiconductor chip to an inner lead electrically connected to an outer lead using a fine wire by placing a chip on a substrate on which leads are formed. That's the way it is.

Flip chip bonding is to make protrusions such as solder balls on an electrode pattern or an inner lead and to be electrically connected when raising a chip on a substrate. Therefore, the use of flip chip bonding saves space as much as wire bonding, so there is an advantage in that a small package can be manufactured.

UBM (Under Bump Metallurgy) is easy to bond and prevent diffusion to chip because it is difficult to form solder or Au bump directly on AL or Cu and electrode of semiconductor chip. The multilayer metal layer is formed between the electrode and the bump, and is composed of three layers: a bonding layer, a diffusion barrier layer, and a solder wetting layer.

The layers constituting the under bump metallurgy (UBM), in particular the solder wetting layer, may be formed through various plating devices and systems. In this regard, Republic of Korea Patent Publication No. 10-1278711 (hereinafter referred to as "prior art document") is a series of automation of the plating process and the cleaning process can improve the productivity (UPH) of the plating process, process equipment A semiconductor wafer plating apparatus and a plating method that can achieve miniaturization of the present invention are proposed.

However, the prior art document corresponds only to a technique capable of only a plating process and a washing process by a series of automated processes, and other related processes should be carried out as separate processes. By the way, with respect to the wafer plating process, processes such as wafer loading, wafer prewetting, drying, and unloading are directly or indirectly involved, and these processes need to be carried out before and after the wafer plating process.

Therefore, there is a need to propose a technique capable of continuously processing not only a plating process for a wafer but also related processes directly or indirectly related thereto in a series of automations. It is necessary to improve the efficiency of the entire production process through this, but the technology related to this situation is not specifically presented.

Republic of Korea Patent Publication No. 10-1278711 (Notification date: June 25, 2013, the name of the invention: semiconductor wafer plating apparatus and plating method using the same)

The present invention was devised to solve the above problems of the prior art, by configuring the wafer loading, prewetting, plating, cleaning, drying and unloading can proceed sequentially and continuously, wafer plating It is possible to improve the process efficiency for the process, and to adopt a dip (DIP) method, the process solution is sprayed through the rotation method of the nozzle instead of the vibration of the wafer and / or nozzle, thereby uniform process solution to the wafer It is an object of the present invention to provide a wafer plating system capable of supplying, thereby improving the plating quality.

In addition, the present invention is arranged so that the spray nozzles for spraying the process solution correspondingly formed along the edge portion of the wafer, while the spraying direction of the spray nozzles is inclined toward the virtual focal point vf and at the same time on the virtual vertical plate surface. It is also configured to be inclined at a constant angle, so that the spraying rotor equipped with the spraying nozzles can be automatically rotated according to the process solution injection, thereby automatically rotating the spraying nozzles without applying a separate rotational power. It is an object of the present invention to provide a wafer plating system capable of uniformly dispensing a process solution.

In addition, the present invention is configured by the plating spray unit for rotationally spraying the process solution toward the wafer in front of the plating treatment tank so that the anode disposed in the rear and the wafer disposed in the front can communicate with each other without being blocked. It is an object of the present invention to provide a wafer plating system that can minimize anode interference and thereby improve plating efficiency.

In addition, the present invention is provided with an air injection hole on the back surface of the wafer jig to be mounted while sealing the back surface of the wafer, dry air is also directed toward the back surface of the wafer through an air injection gun docked to the air injection hole in the drying tank It is an object of the present invention to provide a wafer plating system which can enhance the drying function for the wafer, thereby reducing the defect rate of the wafer and improving the plating quality and production efficiency.

The constituent means of the wafer plating system of the present invention proposed to solve the above problems include a loading processing unit for loading a wafer jig in which a wafer is mounted, and transferring the wafer jig sequentially from the loading processing unit in a wafer plating system. A pre-wetting processing unit which performs pre-wetting on the wafer in the pre-wetting processing tank, a plating processing unit which sequentially receives the wafer jig from the pre-wetting processing unit and performs plating on the wafer in the plating processing tank, and the wafer jig is A cleaning processing unit which is sequentially transferred from the plating processing unit to perform cleaning on the wafer in the cleaning processing tank, a drying processing unit which receives the wafer jig sequentially from the cleaning processing unit and performs drying on the wafer in the drying processing tank, and the wafer jig Remind And a transfer processor configured to sequentially transfer the wafer jig from the loading processor to the unloading processor by sequentially transferring the wafer jig from the drying processor.

Here, the pre-wetting processing unit includes a pre-wetting device, and the pre-wetting device includes a pre-wetting processing tank for receiving and placing the wafer jig, and a pre-wetting toward the wafer disposed opposite to the wafer jig and mounted on the wafer jig. Spraying the process liquid, it characterized in that it comprises a pre-wetting spray unit for injecting the pre-wetting process liquid through a rotating pre-wetting spray nozzle.

The plating treatment unit may include a plating apparatus, and the plating apparatus may spray a plating process liquid toward a plating treatment tank configured to receive and mount the wafer jig, and a wafer disposed opposite to the wafer jig and mounted on the wafer jig. And a plating spray unit configured to spray the plating process liquid through a rotating plating spray nozzle, and the anode unit disposed at a rear side and the wafer jig disposed at a front side thereof face each other. .

In addition, the drying processing unit includes a drying apparatus, the drying apparatus is a drying processing tank for receiving and mounting the wafer jig, the blowing unit for opposed to the wafer jig is disposed opposite the wafer jig equipped with the blowing air blowing unit And a dry strengthening unit disposed opposite to the rear of the wafer jig and spraying dry air to the rear of the wafer mounted on the wafer jig.

According to the wafer plating system of the present invention having the above problems and solving means, the wafer plating because the loading, prewetting, plating, cleaning, drying and unloading of the wafer is configured to proceed sequentially and continuously, The process efficiency can be improved, and since the dip (DIP) method is adopted, the process solution is sprayed through the rotation method of the nozzle instead of the vibration of the wafer and / or the nozzle, so that the process is uniform to the wafer. It is possible to supply a solution, which results in the effect of improving the plating quality.

Further, according to the present invention, the spray nozzles for spraying the process solution are arranged so as to correspond to the edge portion of the wafer, while the spraying direction of the spray nozzles is tilted to face the virtual focal point vf and at the same time the virtual vertical plate. Since it is configured to be inclined at a predetermined angle with respect to the surface, the spraying rotor equipped with the spraying nozzles can be automatically rotated according to the process solution spraying, so that the spraying nozzle can be operated without applying additional rotational power. The advantage of being able to evenly dispense the process solution while rotating automatically.

Moreover, according to this invention, since the plating spray unit which rotationally sprays a process solution toward a wafer in front in a plating process tank is comprised so that the anode arrange | positioned at the back and the wafer arrange | positioned at the front can communicate with each other without being blocked, The advantage is to minimize anode interference to the wafer, thereby improving the plating efficiency.

In addition, according to the present invention, an air injection hole is provided on the back surface of the wafer jig mounted while sealing the back surface of the wafer, and is dried toward the back surface of the wafer through an air injection gun docked to the air injection hole in a drying tank. Since the air can be configured to be injected, the drying function for the wafer can be enhanced, thereby resulting in an effect of reducing the defect rate of the wafer and improving the plating quality and production efficiency.

1 and 2 are schematic diagrams of a wafer plating system according to an embodiment of the present invention.
3 is a perspective view showing a transfer device and a wafer jig constituting a wafer plating system according to an embodiment of the present invention.
4 is a perspective view as viewed from the back of the wafer jig constituting the wafer plating system according to the embodiment of the present invention.
5 is a rear view of the wafer jig constituting the wafer plating system according to the embodiment of the present invention.
FIG. 6 is a cross-sectional view taken along line AA ′ of FIG. 5.
7 is a perspective view of a prewetting device constituting a wafer plating system according to an embodiment of the present invention.
8 is a front view of the prewetting spray unit constituting the wafer plating system according to the embodiment of the present invention.
FIG. 9 is a cross-sectional view of AA ′ shown in FIG. 8.
10 is a plan view of a prewetting spray unit constituting a wafer plating system according to an embodiment of the present invention.
11 is a perspective view of a plating apparatus constituting a wafer plating system according to an embodiment of the present invention.
12 is a front view of a plating spray unit constituting a wafer plating system according to an embodiment of the present invention.
FIG. 13 is a cross-sectional view of AA ′ shown in FIG. 12.
14 is a plan view of a plating spray unit constituting a wafer plating system according to an embodiment of the present invention.
15 is a perspective view of a cleaning apparatus constituting a wafer plating system according to an embodiment of the present invention.
16 is a perspective view showing a transfer device and a drying device constituting a wafer plating system according to an embodiment of the present invention.
17 is a perspective view of a drying apparatus constituting a wafer plating system according to an embodiment of the present invention.
18 is a plan view of a drying apparatus constituting a wafer plating system according to an embodiment of the present invention.
19 is a cross-sectional view taken along line AA ′ of FIG. 18.
20 is a perspective view illustrating a transfer apparatus and an unloading processing unit configuring a wafer plating system according to an exemplary embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of a wafer plating system of the present invention having the above problems, solving means and effects.

In this process, the size or shape of the components shown in the drawings may be exaggerated * for clarity and convenience of description. In addition, the terminology specially defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator.

1 and 2 are overall configuration of a wafer plating system according to an embodiment of the present invention. FIG. 1 shows a wafer plating system 100 comprising two plating treatments 3 and one cleaning treatment 4, and FIG. 2 includes two plating treatments 3 and two cleaning treatments 4. Wafer plating system 100 is shown.

1 and 2, the wafer plating system 100 according to the embodiment of the present invention sequentially and continuously performs a plurality of processes from right to left. In detail, the wafer plating system 100 according to the present invention sequentially and continuously performs a process related to loading, prewetting, plating, cleaning, drying, and unloading of a wafer.

To this end, the wafer plating system 100 according to the embodiment of the present invention is a loading treatment unit 1, prewetting treatment unit 2, plating treatment unit 3, cleaning treatment unit 4, drying treatment unit 5 And an unloading processor 6 and a transfer processor 7.

Specifically, the wafer plating system 100 according to the embodiment of the present invention includes a loading processor 1 for loading a wafer jig 10 mounted with a wafer w, and the wafer jig 10 with the loading processor 1. Receiving the sequential transfer from the pre-wetting processing unit 2 and the pre-wetting processing unit 2 to perform the pre-wetting on the wafer w in the pre-wetting processing tank 21. The plating processing unit 3, which performs plating on the wafer w in the plating processing tank 31, and the wafer jig 10 are sequentially transferred from the plating processing unit 3 to receive the wafer ( The cleaning processing unit 4 for cleaning the w) and the wafer jig 10 are sequentially transferred from the cleaning processing unit 4 to dry the wafer w in the drying processing tank 51. Processing unit 5, the wafer jig 10 to the drying treatment The unloading processor 6 and the wafer jig 10, which are sequentially loaded from the unit 5 and unload the wafer jig 10, are sequentially transferred from the loading processor 1 to the unloading processor 6. It comprises a transfer processing unit (7).

The loading processing unit 1 is loaded by a worker in a state in which the wafer jig 10 on which the wafer w is mounted is loaded on a pallet 19, and maintains an inner space in a sealed state and the transfer processing unit The wafer jig 10 is sequentially clamped by the transfer device 70 constituting (7) so that the wafer jig 10 may be transferred to the prewetting processing unit 2. Accordingly, the loading processing unit 1 may include seating and moving means for seating and moving the pallet 19, alignment means for aligning the pallet 19 on which the wafer jig 10 is loaded, and the like. It can be configured to include.

The wafer jig 10 aligned in the loading processing unit 1 is sequentially transferred to the adjacent prewetting processing unit 2 by the transfer apparatus 70 constituting the transfer processing unit 7. Then, the pre-wetting processing unit 2 performs pre-wetting on the wafer w using the pre-wetting process solution in the pre-wetting processing tank 21. The reason for performing the pre-wetting on the wafer (w) in the pre-wetting processing unit 2 is to improve the uniformity and efficiency of the plating on the wafer (w) in the plating process, which is the next process.

The transfer device 70 constituting the transfer processing unit 7 clamps the wafer jig 10 sequentially and directly seats the transfer on the prewetting processing tank 21. Accordingly, the prewetting processor 2 may sequentially receive the wafer jig 10 from the loading processor 1 to perform a prewetting process for the wafer w in the prewetting treatment tank 21. have.

The prewetting processing unit 2 basically includes a prewetting device 20 including the prewetting treatment tank 21, and may include a plurality of prewetting devices 20. However, since the process time of pre-wetting through the pre-wetting device 20 is considerably shorter than the process time of the plating proceeding in the plating process corresponding to the next step, it is composed of one, time, effort and cost for the system construction. It is desirable to reduce the cost. 1 and 2, the prewetting processing unit 2 is illustrated as including one prewetting device 20.

The wafer jig 10 in the state where the pre-wetting process is performed by the pre-wetting processing unit 2 is sequentially transferred to the adjacent plating processing unit 3 by the transfer device 70 constituting the transfer processing unit 7. . Then, the plating treatment unit 3 performs a plating process on the wafer w using the plating process liquid in the plating treatment tank 31. As described above, the plating process according to the present invention proceeds using a dip (DIP) method.

The transfer device 70 constituting the transfer processing unit 7 sequentially clamps the wafer jig 10 subjected to the pre-wetting process in the pre-wetting processing unit 2 to be directly transferred to the plating processing tank 31. Settle down. Accordingly, the plating processing unit 3 may sequentially transfer the wafer jig 10 from the prewetting processing unit 2 to perform a plating process on the wafer w in the plating processing tank 31.

The plating treatment unit 3 basically includes a plating apparatus 30 including the plating treatment tank 31, and may include a plurality of plating apparatuses 30. Since the process time of the plating through the plating apparatus 30 is considerably longer than the process time of the prewetting and cleaning performed in the prewetting and cleaning processes corresponding to the previous and next steps, the plurality of components increases the process efficiency. It is preferable in order to make it. In FIG. 1 and FIG. 2, the plating treatment part 3 of the two regions is shown as being composed of a total of four plating apparatuses 30 including two plating apparatuses 30, respectively.

The wafer jig 10 in the state where the plating process is performed by the plating processing unit 3 is sequentially transferred to the adjacent cleaning processing unit 4 by the transfer device 70 constituting the transfer processing unit 7. Then, the cleaning processing unit 4 performs the cleaning process on the wafer w using the cleaning process liquid in the cleaning processing tank 41. As described above, the cleaning process according to the present invention proceeds using a dip (DIP) method.

The transfer device 70 constituting the transfer processing unit 7 sequentially clamps the wafer jig 10, which has been subjected to the plating process in the plating processing unit 3, to be directly seated on the cleaning processing tank 41. . Accordingly, the cleaning processing unit 4 may sequentially receive the wafer jig 10 from the plating processing unit 3 and perform the cleaning process on the wafer w in the cleaning processing tank 41.

The cleaning treatment unit 4 basically includes a cleaning device 40 including the cleaning treatment tank 41, and may include a plurality of cleaning devices 40. Since the process time of the cleaning through the cleaning device 30 is considerably shorter than the process time of the plating proceeding in the plating process corresponding to the previous step, it may be configured in plural but smaller than the number of the plating devices 30. It is preferable to increase the efficiency of the system construction and the process efficiency. However, in consideration of the case where the wafer jig 10 having completed the plating process or the wafer jig 10 having an error needs to be stored or buffered for a predetermined time in a series of processes, the cleaning apparatus 40 ) May be configured in the same number of levels as the plating apparatus 30. FIG. 1 shows that the cleaning treatment unit 4 disposed between the plating treatment units 3 of two regions is composed of two cleaning apparatuses 40. In FIG. 2, as in the plating apparatus 30, It is shown that the cleaning processing section 4 of the two regions is composed of a total of four cleaning devices 40, each including two cleaning devices 40.

The wafer jig 10 in the state where the cleaning process is performed by the cleaning processing unit 4 is carried out to the drying processing unit 5 to sequentially perform the next drying process by the transfer device 70 constituting the transfer processing unit 7. Transferred. Then, the drying treatment unit 5 performs a drying process on the wafer w using dry air in the drying treatment tank 51. As such, the drying process according to the present invention proceeds by using an air blowing or blowing method.

The transfer device 70 constituting the transfer processing unit 7 sequentially clamps the wafer jig 10, which has been subjected to the cleaning process in the cleaning processing unit 4, to be directly seated on the drying processing tank 51. . Therefore, the drying processing unit 5 may sequentially transfer the wafer jig 10 from the cleaning processing unit 4 to perform a drying process for the wafer w in the drying processing tank 51.

The drying treatment unit 5 basically includes a drying apparatus 50 including the drying treatment tank 51, and may include a plurality of drying apparatuses 50. However, since the process time of drying through the drying apparatus 50 is shorter than the process time of washing performed in the cleaning process corresponding to the previous step, the system is configured to be smaller than the number of the cleaning apparatus 40. This is desirable in terms of saving time, effort, and cost for deployment. In FIG. 1 and FIG. 2, the drying treatment unit 5 is shown to include one drying apparatus 50.

The wafer jig 10 in the state where the drying process is performed by the drying processing unit 5 may be performed by an unloading processing unit to sequentially perform adjacent unloading processes by the transfer device 70 constituting the transfer processing unit 7. 6) is transferred to. Then, the unloading processor 6 performs a process of unloading the wafer jig 10.

The pallet 70 which constitutes the transfer processing unit 7 sequentially clamps the wafer jig 10 that has been subjected to the drying process in the drying processing unit 5 to be directly located in the unloading processing unit 6. Transfer it to (19). Accordingly, the unloading processor 6 receives the wafer jig 10 sequentially from the dry processor 5 to be loaded on the pallet 19, and then unloaded by an operator.

The wafer jig 10 equipped with the wafer w described above is continuously transferred from the process to the next process through the transfer processing unit 7. That is, the transfer processing unit 7 sequentially transfers the wafer jig 10, in which the wafer w to be processed, is mounted, from the loading processing unit 1 to the unloading processing unit 6. .

Specifically, the transfer processing unit 7 is loaded from the loading processing unit 1 to the prewetting processing unit 2, the prewetting processing unit 2 to the plating processing unit 3, and the plating processing unit 3. The processing unit 4 performs an operation of transferring the waiter jig 10 from the cleaning processing unit 4 to the drying processing unit 5 and from the drying processing unit 5 to the unloading processing unit 6.

Such transfer processing unit 7 is configured to include a transfer device 70 as described above. As shown in FIG. 3, the transfer device 70 is configured to be reciprocated in a horizontal direction, and is configured to be reciprocated in a vertical direction by being coupled to the horizontal transfer unit 71. It is configured to include a vertical transfer unit 73 and a gripper (75) for clamping the wafer jig (10).

The horizontal transfer unit 71 is arranged to horizontally reciprocate between the loading processing unit 1 and the unloading processing unit 6 through a transfer rail and a driving unit constituting the transfer processing unit 7. The horizontal transfer unit 71 has a columnar shape standing in the vertical direction. The vertical transfer unit 73 is coupled to the column-shaped horizontal transfer unit 71, it is arranged to be reciprocated in the vertical direction. In addition, the gripper 75 is coupled to the end of the vertical transfer unit 73 to clamp and unclamp the wafer jig 10.

The transfer device 70 configured as described above performs the operation of transferring the wafer jig 10. Specifically, the transfer device 70 may allow the gripper 75 to approach the upper portion of the wafer unit 10. The vertical transfer unit 73 is lowered so that the gripper 75 is driven to clamp the wafer jig 10. Then, after raising the vertical transfer unit 73 again, the horizontal transfer unit 71 is transferred to be adjacent to the next process unit. Thereafter, the vertical transfer unit 73 may be lowered again to transfer and seat the wafer jig 10 to the next process unit.

The loading processor 1 aligns the wafer, specifically, the wafer jig 10 so that the wafer w to be processed may be introduced and transferred by the transfer device 70. The wafer w to be processed is introduced while mounted in the wafer jig 10. In addition, as illustrated in FIG. 3, the wafer jig 10 is inserted into the loading processing unit 1 in a state in which a plurality of wafer jig 10 are loaded on the pallet 19.

" 형상을 가지고, 내측을 따라 홈이 형성되는 구조를 가진다. 따라서, 상기 웨이퍼 지그(10)는 상기 "

" 형상을 가지는 삽입 장착 프레임(19a)의 내측에 형성되는 홈에 지그 본체 판(11)의 외곽이 끼워진 상태로 안착되어 안정적인 자세를 유지할 수 있다.The pallet 19 has an insertion mounting frame 19a for stably mounting the wafer jig 10 inserted therein. The insert mounting frame 19a is formed on the pallet 19 corresponding to each wafer jig 10. The insert mounting frame 19a is shown in Fig. 3, "

"Shape, and has a structure in which grooves are formed along the inner side. Thus, the wafer jig 10 has the"

It is possible to maintain a stable posture by being seated in the state where the outside of the jig main body plate 11 is fitted in the groove formed inside the insertion mounting frame 19a having a shape.

The wafer jig 10 may maintain a fairly stable posture because an outer portion of the wafer jig 10 is inserted into the insert mounting frame 19a, but it is preferably formed to maintain a more stable posture by minimizing shaking. To this end, the pallet 19 further includes a stand 19b capable of supporting a predetermined portion of the wafer jig 10.

The stand 19b may be formed on the upper surface of the pallet 19, but is formed to be coupled to an upper end of one side of the insertion frame 19a to increase space utilization. The stand 19b supports a predetermined portion of the wafer jig 10 to reinforce the stable posture of the wafer jig 10. To this end, the wafer jig 10 has an extension mounting portion 12 extending horizontally from the upper side. Accordingly, the wafer jig 10 may be mounted in a state of being inserted into the insertion mounting frame 19a and maintained in the stand 19b through the extension holder 12.

As described above, the wafer to be processed is transferred while being mounted on the wafer jig 10. The wafer jig 10 is mounted so that the wafer (w) is firmly and stably mounted, so that only the front surface where the plating is formed is exposed to the outside and the rest is sealed. The wafer jig 10 is detachably mounted.

4 to 6 show the wafer jig 10. Specifically, FIG. 4 is a perspective view of the wafer jig 10 constituting the wafer plating system 100 according to the embodiment of the present invention, FIG. 5 is a rear view of the wafer jig 10, and FIG. It is sectional drawing of AA 'shown in FIG.

4 to 6, the wafer jig 10 to be applied to the present invention is provided with a fitting hole (not shown) for mounting a wafer in a jig body plate 11 of a predetermined shape, and in the fitting hole The wafer is mounted, but the front surface of the wafer w is exposed to the front, and the back surface is sealed to seal the wafer. In order to seal the back surface of the wafer w, the wafer jig 10 includes a sealing plate 15 that can cover the back surface of the wafer w while closing the fitting hole.

That is, the sealing plate 15 covers and seals the back surface of the wafer w while closing the fitting hole. The sealing plate 15 is in close contact with the rear surface of the wafer w by the sealing fixture 16 and maintains the fitting hole in a closed state. The sealing fixture 16 is coupled to the jig body plate 11 adjacent to the fitting hole (not shown), that is, around the sealing plate 15, and covers the back surface of the wafer while closing the fitting hole. It has a structure that can be fixed in close contact with the rim of the closing plate (15) disposed to be. The sealing fixture 16 allows the sealing plate 15 to be in close contact with the rear surface of the wafer w while fixing the sealing plate 15.

Although the airtightness of the wafer is significant even with such a sealed structure, the wafer is mounted in the fitting hole during the prewetting process, the plating process, the cleaning process, etc., for the wafer w through a dip (DIP) method. The process solution may penetrate through a minute gap between the sealing plate 15 and the jig body plate 11.

In order to prevent such a process liquid from penetrating, the wafer jig 10 applied to the present invention is connected to a portion of the sealing plate 15 and the jig body plate 11 that is contacted as shown in FIG. 6. It is provided with the sealing ring 18 interposed. Since the sealing ring 18 is in close contact with the sealing plate 15 toward the front in the state interposed in the contact portion of the sealing plate 15 and the jig body plate 11, the wafer (w) The sealing property or airtightness to the back of) can be increased.

Thus, by adopting and applying the sealing ring 18, the sealing property and airtightness with respect to the back surface of the said wafer w are improved. However, even in this case, the process liquid penetrates through the minute gap between the sealing plate 15 and the jig body plate 11, and the penetrated process liquid is transferred to the wafer by the sealing ring 18. It cannot penetrate to the back of (w) but can still remain in the outer part of the closure ring 18.

The process liquid, which cannot be penetrated to the back surface of the wafer w by the sealing ring 18, but still stays on the outer portion of the sealing ring 18, is allowed to access dry air from the drying treatment unit 5 and It is not easy to contact and it does not dry well. In this way, the process liquid (the process liquid still remaining on the outer portion of the sealing ring 18), which is not dried in the drying processing unit 5, removes the wafer w from the wafer jig 10. In the desorption process, the front surface (processed surface) of the wafer w may be buried or dropped, thereby acting as a disadvantage of increasing the defect rate of the wafer w.

In order to solve such a problem, the wafer jig 10 applied to the present invention is a dry air process performed in the drying processing unit 5, in which dry air still remains on the outer portion of the sealing ring 18. It is provided with an air injection hole 17 to be supplied to the process liquid. The air injection hole 17 may pass through the sealing plate 15 so that the outer portion of the sealing ring 18 (the portion where the process solution stays) may be exposed to the outside through the air injection hole 17. Is formed. As a result, dry air can be supplied to the outer portion of the sealing ring 18 through the air injection hole 17, whereby the process liquid still remaining at the outer portion of the sealing ring 18 It can be dried and removed.

Since the air inlet hole 17 is formed so that the seal ring 18 communicates with the outside, a plurality of air injection holes 17 are spaced apart from each other by a predetermined interval along an edge portion of the seal plate 15. By adopting and applying the air injection hole 17 formed as described above, the process liquid still remaining in the outer portion of the sealing ring 18 can be dried and removed, so that the defect of the wafer due to the remaining process liquid Can be prevented and the defective rate can be reduced.

As described above, the wafer jig 10 configured as described above is clamped and conveyed by the gripper 75 constituting the transfer apparatus 70 described above. The gripper 75 clamps the upper side of the wafer jig 10, to facilitate the clamping operation of the gripper 75, and to prevent the gripper 75 from being released from the clamped state, the upper side of the wafer jig 10. It is provided with a clamping reinforcement hole 13 for reinforcing and reinforcing the firm clamping of the gripper 75.

The wafer jig 10 having the above-described structural features is transferred to the prewetting processing unit 2 which performs the next process, that is, the prewetting process, adjacent to the loading processing unit 1 by the transfer device 70. It is seated. Then, the pre-wetting processing unit 2 performs a pre-wetting process on the wafer mounted on the wafer jig 10 transported and seated by the transfer device 70.

The pre-wetting processing unit 2 may include a pre-wetting apparatus 20 which performs a pre-wetting process by spraying a pre-wetting process solution on a wafer, and may further include a pre-wetting process solution supply unit (not shown). In some cases, the plurality of prewetting devices 20 may be included. 1 and 2 illustrate a prewetting processing unit 2 including one prewetting device 20, and FIG. 7 is a cutaway view of the prewetting device 20 included in the prewetting processing unit 2. Show a perspective view.

As shown in FIG. 7, the pre-wetting device 20 applied to the present invention is disposed opposite to the pre-wetting processing tank 21 and the wafer jig 10 for receiving and mounting the wafer jig 10. Including a pre-wetting process unit for spraying the pre-wetting process liquid toward the wafer mounted on the wafer jig 10, the spraying of the pre-wetting process liquid through the rotating pre-wetting spray nozzle 26 It is composed.

The prewetting treatment tank 21 is a space for performing a prewetting process for a wafer mounted on the wafer jig 10, and accommodates a wafer jig 10 having a wafer to be subjected to the prewetting process. Mount it stably. Accordingly, the prewetting treatment tank 21 includes a first side holder 21b for guiding and mounting both side ends of the wafer jig 10, specifically, the jig main body tube 11.

The first side holder 21b is disposed opposite to each other inner surface of the pre-wetting treatment tank 21, respectively, and is formed in a vertical direction from the upper side to the lower side. Therefore, the wafer jig 10 may be inserted and mounted while being guided to the first side holder 21b from the upper side to the lower side. Therefore, the wafer jig 10 can be easily attached to and detached from the prewetting treatment tank 21 using the transfer device 70.

On the other hand, the pre-wetting treatment tank 21 includes a first guide holder 21a for stably mounting the pre-wetting spray unit 22 disposed to face the wafer jig 10. The first guide holder 21a is also disposed opposite to each other on the inner surface of the pre-wetting treatment tank 21, respectively, is formed in the vertical direction from the upper side to the lower side. Therefore, the prewetting spray unit 22, specifically, the first mounting body 23 may be inserted and guided while being guided to the first guide holder 21a from the upper side to the lower side. Therefore, the pre-wetting spray unit 22 is easily removable and easy to the pre-wetting treatment tank 21, thereby making it easy to maintain and manage.

When the wafer jig 10 is seated and mounted in the prewetting processing tank 21, the prewetting spray unit 22 disposed to face the front surface may move the prewetting process liquid toward the wafer mounted on the wafer jig 10. The prewetting process is performed by spraying. However, the pre-wetting spray unit 22 applied to the present invention sprays the pre-wetting process liquid supplied through the pre-wetting spray nozzle 26, and the pre-wetting spray nozzle 26 is the pre-wetting process liquid. Form to spray at a constant spray angle.

FIG. 8 is a front view of the prewetting spray unit 22 constituting the wafer plating system 100 according to the embodiment of the present invention, FIG. 9 is a cross-sectional view of AA ′ shown in FIG. 8, and FIG. 10 is free. Top view of the wet spray unit.

As shown in FIGS. 8 to 10, the prewetting spray unit 22 applied to the present invention includes a plate-shaped first mounting body 23 and a mounting groove 23a formed in the first mounting body 23. Pre-wetting spray rotating body (25) rotatably mounted on the pre-wetting spray rotating body (25), and pre-wetting distributed through the pre-wetting spray rotating body (25). The first mounting body so that the prewetting spray nozzle 26 for spraying the process liquid at a predetermined angle and the prewetting spray rotating body 25 are fixed to the mounting groove 23a without being detached. The prewetting process solution is formed on the fixed frame 28 for the pre-wetting spray fixed to the 23 and the rear surface of the first mounting body 23 (the opposite side on which the nozzle for the pre-wetting spray is formed) and is supplied from the outside. The prewetting soup It is configured to include a pre-wetting solution injection connector 27 for injecting into the rotating body 25 for the lay.

The first mounting body 23 has a rectangular plate shape and includes a mounting groove 23a for mounting the rotating body 25 for prewetting spray. The first mounting body 23 is inserted and mounted while being guided to the first guide holder 21a formed in the prewetting treatment tank 21. Accordingly, first mounting insertion protrusions 23b protruding from both side ends of the first mounting body 23 can be inserted while sliding in the grooves formed in the first guide holder 21a. The first mounting insertion protrusion 23b is formed to extend from the upper side to the lower side of each of both side ends of the first mounting body 23 so that the first mounting insertion protrusion 23b can be mounted while sliding in the groove of the first guide holder 21a. .

As described above, the first mounting body 23 is provided with a mounting groove 23a for mounting the rotating body 25 for pre-wetting spray, and in some cases, instead of the mounting groove 23a, The mounting hole which is completely penetrated may be formed. Since the circumference | surroundings of the said rotating groove 25 for prewetting sprays are circular shape, the said mounting groove 23a has a circular shape correspondingly.

The pre-wetting spray rotating body 25 is rotatably mounted in the mounting groove 23a. Therefore, a bearing or the like is provided between the mounting groove 23a and the pre-wetting spray rotating body 25 to enable the rotational operation.

The pre-wetting spray rotating body 25 is rotatably mounted in the mounting groove 23a, but forms an inner space alone or an inner space between the first mounting body 23 and the first mounting body 23. Therefore, when the prewetting process liquid is injected through the prewetting solution injection connector 27 connected to the rear surface of the first mounting body 23 and supplied into the prewetting spray rotating body 25, the pre Wetting process liquid may be injected through the nozzle for the pre-wetting spray 26 is coupled to the rotating body 25 for the pre-wetting spray.

The pre-wetting spray nozzles 26 are spaced apart from each other on the pre-wetting spray rotating body 25 and spray the pre-wetting process liquid dispensed and supplied through the inside of the pre-wetting spray rotating body 25 at a predetermined angle. do. Since the rotating body 25 for pre-wetting spray is circular, the pre-wetting spray nozzles 26 spaced apart from and coupled to each other are arranged in a circular shape. The prewetting spray nozzle 26 is preferably detachably mounted to the rotating body 25 for the prewetting spray in terms of maintenance and management.

The pre-wetting spray rotating body 25 can be freely rotated while being mounted in the mounting groove 23a, but needs to be fixed so as not to be detached. To this end, the fixing frame 28 for the pre-wetting spray is coupled to the first mounting body 23 so that the rotating body 25 for the pre-wetting spray is not separated.

On the other hand, the pre-wetting spray nozzle 26 is preferably arranged to increase the injection efficiency of the pre-wetting process liquid and to increase the pre-wetting efficiency. To this end, the pre-wetting spray nozzle 26 is mounted and coupled to the pre-wetting spray rotating body 25 so as to spray the pre-wetting process liquid at a predetermined angle.

First, the prewetting spray nozzles 26 for spraying the prewetting process solution are arranged to correspond in a circle shape along the edge portion of the wafer mounted on the wafer jig 10. Accordingly, the prewetting spray nozzles 26 are formed to be spaced apart from each other along the circumference of the prewetting spray rotating body 25.

In addition, as shown in FIG. 9, the prewetting spray nozzles 26 respectively rotate the prewetting spray rotating body so that the spraying direction (spray line sl) of the prewetting process liquid can face the virtual focal point vf. It is formed to be inclined at 25. The virtual focal point vf may be formed at various positions, but is preferably located on the virtual horizontal plate surface hp for the prewetting spray unit 22 shown in FIG. 8.

As shown in FIG. 8, the virtual horizontal plate surface hp may be defined as a surface obtained by cutting the pre-wetting spray unit 22 viewed from the front in a horizontal direction, and separately from the virtual vertical plate surface vp. As shown in FIG. 8, it may be defined as a surface obtained by cutting the prewetting spray unit 22 viewed from the front in a vertical direction.

Under this definition, the prewetting spray nozzles 26 are formed such that the prewetting spray is formed such that a spray line of the prewetting process liquid is formed in a direction orthogonal to the first mounting body 23 as shown in FIG. 9. Rather than being attached to the rotating body 25, it is preferable to be mounted to the rotating spinning body 25 for the prewetting spray so as to spray the prewetting process liquid with the spray line sl inclined downward, respectively. Most preferably, the injection line sl is mounted on the rotating body 25 for the prewetting spray so as to pass through the virtual focal point vf located on the virtual horizontal plate surface hp.

Meanwhile, as shown in FIG. 10, the prewetting spray nozzles 26 each have a spray angle (injection line sl) of the prewetting process liquid inclined with respect to the virtual vertical plate surface vp ( It is formed to be inclined to the pre-wetting spray rotating body 25 to have θ1).

As such, the prewetting spray nozzles 26 may respectively spray the prewetting process liquid at an inclined spray angle θ1 with respect to the virtual vertical plate surface vp to have a slanted spray line sl. Since it is mounted on the prewetting spray rotating body 25, when the prewetting process liquid is sprayed through the prewetting spraying nozzles 26, the prewetting spray rotating body 25 is automatically operated due to the spray repulsion force. Can rotate.

As a result, as shown in Figs. 9 and 10, the present invention is arranged so that the pre-wetting spray nozzles for spraying the pre-wetting process liquid are formed correspondingly along the edge portion of the wafer, but the spraying direction of the pre-wetting spray nozzle By tilting toward the virtual focal point vf and tilting at a predetermined angle with respect to the virtual vertical plate surface vp, the prewetting in which the nozzles 26 for prewetting sprays are mounted in accordance with the prewetting process liquid injection. The spray rotating body 25 can be automatically rotated, so that the prewetting process liquid can be uniformly sprayed while automatically rotating the nozzles 26 for the prewetting spray without applying a separate rotational power. There is an advantage.

The wafer jig 10 having the wafer subjected to the pre-wetting process in the pre-wetting device 20 having the above-described configuration features is adjacent to the pre-wetting processing unit 2 by the transfer device 70. It is transported and seated in the plating processing part 3 which performs a process, ie, a plating process. Then, the plating processing unit 3 performs a plating process on the wafer mounted on the wafer jig 10 transported and seated by the transfer device 70.

The plating processing unit 3 may include a plating apparatus 30 which sprays the plating process liquid toward the wafer to perform the plating process, and further may further include a plating process solution supply unit (not shown). It may also include a liquid circulation supply unit (not shown). 1 and 2 illustrate two areas of the plating processing unit 3 including four plating apparatuses 30, and FIG. 11 is a cutaway view of the plating apparatus 30 included in the plating processing unit 3. Show a perspective view.

As shown in FIG. 11, the plating apparatus 30 applied to the present invention is disposed opposite to the plating treatment tank 31 and the wafer jig 10, which accommodate and mount the wafer jig 10. The plating process liquid is sprayed toward the wafer mounted on the jig 10, and the plating process liquid is sprayed through the rotating plating spray nozzle 36, and is disposed in front of the anode unit 39 disposed at the rear. It is configured to include a plating spray unit 32 is formed so that the wafer jig 10 is opposed to each other.

The plating treatment tank 31 is a space for performing a plating process on a wafer mounted on the wafer jig 10, and receives and securely mounts the wafer jig 10 on which the wafer to be subjected to the plating process is mounted. do. Therefore, the plating treatment tank 31 has a second side holder 31b for guiding and mounting both side ends of the wafer jig 10, specifically, the jig main body tube 11.

The second side holders 31b are disposed on opposite inner surfaces of the plating treatment tank 31 so as to face each other, and are formed in a vertical direction from an upper side to a lower side. Therefore, the wafer jig 10 may be inserted and mounted while being guided to the second side holder 31b from the upper side to the lower side. Therefore, the wafer jig 10 can be easily attached and detached to the plating treatment tank 31 using the transfer device 70.

On the other hand, the plating treatment tank 31 is provided with a second guide holder 31a for stably mounting the plating spray unit 32 disposed to face the wafer jig 10. The second guide holder 31a is also disposed to face each other on both inner surfaces of the plating treatment tank 31 facing each other, and is formed in a vertical direction from an upper side to a lower side. Therefore, the plating spray unit 32, specifically, the second mounting body 33 may be inserted and guided while being guided to the second guide holder 31a from the upper side to the lower direction. Therefore, the plating spray unit 32 is easily removable and easy to the plating treatment tank 31, thereby making it easy to maintain and manage.

When the wafer jig 10 is seated on the plating processing tank 31, the plating spray unit 32 disposed to face the front surface sprays the plating process liquid toward the wafer mounted on the wafer jig 10. The plating process is performed through. However, the plating spray unit 32 applied to the present invention sprays the plating process liquid supplied through the plating spray nozzle 36, and the plating spray nozzle 36 sprays the plating process liquid at a constant spray angle. Form to spray.

12 is a front view of the plating spray unit 32 constituting the wafer plating system 100 according to the embodiment of the present invention, FIG. 13 is a cross-sectional view of AA ′ shown in FIG. 12, and FIG. 14 is a plating spray. Top view of the unit.

12 to 14, the plating spray unit 32 applied to the present invention includes a plate-shaped second mounting body 33 and a mounting hole 33a formed in the second mounting body 33. A plating process liquid that is rotatably mounted on the plating spray rotating body 35 and the plating spray rotating body 35, and is distributed to and distributed through the plating spray rotating body 35. Plating spray nozzle 36 for spraying to the plating, the plating spray rotating body 35 is fixedly coupled to the second mounting body 33 to be fixed without being separated in a state mounted on the mounting hole (33a) The plating process liquid which is formed on the rear surface of the fixed frame for spraying 38 and the second mounting body 33 (opposite side on which the nozzle for plating spray is formed) and is supplied from the outside is rotated inside the rotating body for plating spray 35. Plating solution note injected into It is configured to include a connector 37.

The second mounting body 33 has a rectangular plate shape and includes a mounting hole 33a for mounting the plating spray rotor 35. The second mounting body 33 is inserted and mounted while being guided to the second guide holder 31a formed in the plating treatment tank 31. Therefore, the second mounting insertion protrusions 33b protruding from both side ends of the second mounting body 33 can be inserted while sliding in the grooves formed in the second guide holder 31a. The second mounting insertion protrusion 33b is formed to be extended from the upper side to the lower side of each of both side ends of the second mounting body 33 so that it can be mounted while sliding in the groove of the second guide holder 31a. .

As described above, the second mounting main body 33 is provided with a mounting hole 33a for mounting the rotating body 35 for plating spraying. In the plating spraying unit 32 according to the present invention, Instead of applying the mounting groove 23a applied in the pre-wetting spray unit 22, the mounting hole 33a is formed to be completely penetrated. Since the periphery of the said plating hole rotating body 35 is circular shape, the said mounting hole 33a has a circular shape correspondingly.

Since the plating apparatus 30 according to the present invention performs plating through a dip (DIP) method, the plating apparatus 30 includes an anode unit 39 made of a metal such as copper and used as an anode electrode. As shown in FIG. 11, the anode unit 39 constituting the plating apparatus 30 is mounted to the plating treatment tank 31, and the wafer jig is disposed with the plating spray unit 32 interposed therebetween. It is arranged opposite to 10. That is, the plating spray unit 32 is disposed between the anode unit 39 and the wafer jig 10. Therefore, the plating spray unit 32 may act as an interference to the anode unit 39 and the wafer jig 10 applied as an electrode for the plating process, which may cause a reduction in plating quality. have.

In order to solve this problem, the plating spray unit 32 applied to the present invention is disposed in front of the anode unit 39 disposed in the rear to eliminate the interference to the anode unit 39. The wafer jig 10 may preferably have a structure that allows the wafer jig 10 to communicate with each other. To this end, the second mounting body 33 has the mounting hole 33a which is formed to be completely penetrated, and the mounting hole 33a is equipped with a circular band-shaped rotating body 35 for plating spraying. do.

The plating spray rotator 35 is also rotatably mounted to the mounting hole 33a. Therefore, a bearing or the like is also provided between the mounting hole 33a and the plating spray rotor 35 so as to enable the rotation operation.

The plating spray rotor 35 is rotatably mounted in the mounting hole 33a, and forms an internal space alone or an internal space between the second mounting body 33 and the second mounting body 33. Therefore, when the plating process liquid is injected through the plating solution injection connector 37 connected to the rear surface of the second mounting body 33 and supplied into the rotating body 35 for the plating spray, the plating process liquid is It may be injected through the plating spray nozzle 36 coupled to the plating spray rotating body 35.

The plating spray nozzles 36 are spaced apart from each other on the plating spray rotating body 35 to spray the plating process liquid dispensed and supplied through the plating spray rotating body 35 at a predetermined angle. Since the plating spray rotating body 35 is in the shape of a strip, the plating spray nozzles 36 spaced apart from and coupled to each other are arranged in a circular shape. The plating spray nozzle 36 is preferably detachably mounted on the plating spray rotating body 35 in terms of maintenance and management. The plating spray nozzle 36 is preferably an eductor nozzle.

The plating spray rotator 35 may be freely rotated in a state of being mounted in the mounting hole 33a, but needs to be fixed so as not to be separated. To this end, the plating spray fixing frame 38 is coupled to the second mounting body 33 so that the plating spray rotating body 35 is not separated.

On the other hand, the plating spray nozzle 36 is preferably disposed to increase the spraying efficiency of the plating process liquid and to increase the plating efficiency. To this end, the plating spray nozzle 36 is mounted and coupled to the plating spray rotating body 35 so as to spray the plating process liquid at a predetermined angle.

First, the plating spray nozzles 36 for spraying the plating process solution are arranged to correspond in a circle shape along the edge portion of the wafer mounted on the wafer jig 10. Therefore, the plating spray nozzles 36 are formed to be spaced apart from each other along the circumference of the plating spray rotor 35.

In addition, as shown in FIG. 13, the plating spray nozzles 36 may respectively rotate the plating spray rotating body 35 so that the spraying direction (the spray line sl) of the plating process liquid may face the virtual focal point vf. It is formed by tilting on the mount. The virtual focal point vf may be formed at various positions, but is preferably located on the virtual horizontal plate surface hp for the plating spray unit 32 shown in FIG.

As shown in FIG. 12, the virtual horizontal plate surface hp may be defined as a surface obtained by cutting the plating spray unit 32 viewed from the front in a horizontal direction, and separately from the virtual vertical plate surface vp. As shown in FIG. 12, the plating spray unit 32 viewed from the front may be defined as a plane cut in the vertical direction.

Under this definition, the plating spray nozzles 36 are rotatable bodies for the plating spray such that a spray line of the plating process liquid is formed in a direction orthogonal to the second mounting body 33 as shown in FIG. 13. Rather than being mounted on the 35, it is preferable to be mounted on the plating spray rotating body 35 so as to spray the plating process liquid with the spray line sl inclined downward, respectively, and each spray line sl. Most preferably, the plating spray rotating body 35 passes through a virtual focal point vf located on the virtual horizontal plate surface hp.

Meanwhile, as shown in FIG. 14, the plating spray nozzles 36 each have a spray angle θ2 in which the spraying direction (spray line sl) of the plating process liquid is inclined with respect to the virtual vertical plate surface vp. It is mounted to be inclined to the plating spray rotating body 35 to have a.

As described above, the plating spray nozzles 36 respectively spray the plating process liquid at the spray angle θ2 inclined with respect to the virtual vertical plate surface vp to have the inclined spray line sl. Since the spraying body 35 is mounted, when the plating process liquid is sprayed through the plating spray nozzles 36, the plating spraying rotor 35 may naturally rotate automatically due to the spray repulsion force.

As a result, as shown in Figs. 13 and 14, the present invention is arranged so that the plating spray nozzles for spraying the plating process liquid are formed correspondingly along the edge portion of the wafer, but the spraying direction of the plating spray nozzle is the virtual focus. The plating spray rotating body 35 to which the plating spray nozzles 36 are mounted in accordance with the spraying of the plating process liquid by being inclined toward (vf) and being inclined at a predetermined angle with respect to the virtual vertical plate surface vp. ) Can be automatically rotated, thereby allowing the plating process liquid to be uniformly sprayed while automatically rotating the plating spray nozzles 36 without applying a separate rotational power.

The wafer jig 10 on which the wafer which has been subjected to the plating process in the plating apparatus 30 having the above-described structural features is mounted in the plating process unit 3 by the transfer apparatus 70, that is, the cleaning process. It is transported and seated in the cleaning processing unit 4 which performs the process. Then, the cleaning processing unit 4 performs a cleaning process on the wafer mounted on the wafer jig 10 transported and seated by the transfer device 70.

The cleaning processing unit 4 includes a cleaning device 40 which applies a QD (Quick Drain and Rinse) cleaning device, and sprays the cleaning process liquid toward the wafer to perform the cleaning process. (Not shown), and may further include a cleaning process liquid circulation supply unit (not shown). 1 and 2 illustrate a cleaning processing unit 4 including a total of two cleaning apparatuses 40, and FIG. 15 shows a cutaway perspective view of the cleaning apparatus 40 included in the cleaning processing unit 4. .

As shown in FIG. 15, the cleaning apparatus 40 applied to the present invention is disposed to face the wafer jig 10 and the cleaning treatment tank 41 for receiving and mounting the wafer jig 10 so as to face the wafer. The cleaning process liquid is sprayed toward the wafer mounted on the jig 10, and the cleaning spray unit 42 is configured to spray the cleaning process liquid through the rotating cleaning spray nozzle.

The cleaning treatment tank 41 is a space for performing a cleaning process on the wafer mounted on the wafer jig 10, and receives and securely mounts the wafer jig 10 on which the wafer to be subjected to the cleaning process is mounted. do. Therefore, the said washing process tank 41 is equipped with the 3rd side holder 41b which guides and mounts the both sides end of the said wafer jig 10, specifically, the jig main body tube 11. As shown in FIG.

The third side holders 41b are disposed on opposite inner surfaces of the cleaning treatment tank 41 so as to face each other, and are formed in a vertical direction from an upper side to a lower side. Therefore, the wafer jig 10 may be inserted and mounted while being guided to the third side holder 41b from the upper side to the lower side. Therefore, the wafer jig 10 can be easily attached and detached to the cleaning treatment tank 41 by using the transfer device 70.

On the other hand, the cleaning treatment tank 41 includes a third guide holder 41a for stably mounting the cleaning spray unit 42 disposed to face the wafer jig 10. The third guide holder 41a is also disposed to face each other on both inner surfaces of the cleaning treatment tank 41 facing each other, and is formed in a vertical direction from an upper side to a lower side. Therefore, the cleaning spray unit 42, specifically, the third mounting body 43 may be inserted and guided while being guided to the third guide holder 41a from the upper side to the lower direction. Therefore, the cleaning spray unit 42 is easily and easily detachable to the cleaning treatment tank 41, thereby making it easy to maintain and manage.

When the wafer jig 10 is seated on the cleaning processing tank 41, the cleaning spray unit 42 disposed to face the front surface sprays the cleaning process liquid toward the wafer mounted on the wafer jig 10. The plating process is performed through. However, the cleaning spray unit 42 applied to the present invention sprays the cleaning process liquid supplied through the cleaning spray nozzle, and the cleaning spray nozzle is formed so as to spray the cleaning process liquid at a constant injection angle. .

Since the configuration and operation of the cleaning spray unit 42 constituting the cleaning device 40 are the same as the configuration and operation of the prewetting spray unit 22 constituting the prewetting device 20 described above, The detailed description is omitted, and the above-described configuration and operation of the prewetting spray unit 22 are applied as it is.

The wafer jig 10 on which the wafer which has been subjected to the cleaning process in the cleaning device 40 having the above-described structural features is mounted in the cleaning process unit 4 by the transfer device 70, that is, a drying process. It is transported to the drying treatment unit 5 to perform the seating. Then, the drying processing unit 5 performs a drying process on the wafer mounted on the wafer jig 10 transported and seated by the transfer device 70.

The drying processing unit 5 may include a drying device 50 that sprays warm dry air toward the wafer to perform a drying process, and further includes a dry air supply unit (not shown), and further includes dry air circulation. It may further include a supply unit (not shown). 1 and 2 illustrate a drying processing unit 5 including one drying device 40, and FIG. 16 is a perspective view showing a transfer device and a drying device constituting a wafer plating system according to an embodiment of the present invention. 17 is a perspective view of the drying apparatus 50, FIG. 18 is a plan view of the drying apparatus, and FIG. 19 is a sectional view of AA ′ shown in FIG. 18.

As shown in FIGS. 16 to 19, the drying apparatus 50 applied to the present invention is disposed opposite to the drying processing tank 51 and the wafer jig 10, which accommodate and mount the wafer jig, so that the wafer is disposed. Blower unit 52 for injecting dry air into the wafer jig 10 equipped with the air, and is disposed opposite to the back of the wafer jig 10 and sprays dry air to the rear surface of the wafer mounted on the wafer jig 10. It comprises a dry strengthening unit 53.

The drying processing tank 51 is a space for performing a drying process on the wafer mounted on the wafer jig 10, and accommodates the wafer jig 10 on which the wafer to be subjected to the drying process is to be mounted, to be stably placed. do. Accordingly, the drying treatment tank 51 includes a fourth side holder 51b for guiding and mounting both side ends of the wafer jig 10, specifically, the jig main body tube 11.

The fourth side holders 51b are disposed on opposite inner surfaces of the drying treatment tank 41 so as to face each other, and are formed in the vertical direction from the top to the bottom. Therefore, the wafer jig 10 may be inserted and mounted while being guided to the fourth side holder 51b from the upper side to the lower side. Therefore, the wafer jig 10 can be easily attached and detached to the drying treatment tank 51 by using the transfer device 70.

In front of the wafer jig 10 mounted on the fourth side holder 51b of the drying tank 41, the blower unit 52 is disposed to face the wafer mounted on the wafer jig 10. Inject dry air. Therefore, the entire surface of the wafer (the surface on which the plating process is performed) may be efficiently dried by the drying air injected from the blowing unit 52.

As described above, the wafer is detachably mounted to the wafer jig 10 and is applied via a sealing ring 18 to increase airtightness to the rear surface of the wafer. However, since the process liquid is still added to the outer portion of the sealing ring 18 and is difficult to remove in the drying process, the air injection hole 17 that can communicate with the sealing ring is provided on the back surface of the wafer jig 10. It adopts the structural characteristic to form.

The drying apparatus 50 includes a drying strengthening unit 53 capable of injecting dry air toward the rear surface of the wafer jig 10. However, since the air injection hole 17 formed in the rear surface of the wafer jig 10 has a small diameter, when the air is simply injected toward the rear surface of the wafer jig 10, the air injection hole 17 may be used. The amount of air reaching the sealing ring 18 through) is inevitably limited. Furthermore, since the number of the air injection holes 17 is limited, it is very difficult to remove the process liquid remaining along the sealing ring 18.

In order to solve this problem, the drying apparatus 50 according to the present invention includes the drying strengthening unit 53, the dry strengthening unit 53 is docked to the air injection hole 17 to inject the air And an air injection gun 56 capable of strongly injecting and drying dry air into the hole 17.

Specifically, the dry strengthening unit 53 is disposed opposite to the rear surface of the wafer jig 10, the air distribution frame 55 is disposed so as to reciprocate to move closer or away from the wafer jig 10, The air injection frame is disposed spaced apart from each other in the air distribution frame 55, and the air injection frame 55 may dock to the air injection hole 17 as the air distribution frame 55 approaches the rear surface of the wafer jig 10. A frame which supports the air injection gun 56 and the air distribution frame 55 disposed corresponding to the hole 17, and reciprocates the air distribution frame 55 according to the driving of the reciprocating driving means (not shown). It comprises a support (57) and an air supply (58) for supplying warm dry air to the air distribution frame (55).

The air distribution frame 55 may be reciprocated in accordance with the driving of the reciprocating drive means while being supported by the frame support 57, and the dry air supplied from the air supply 58 may be supplied to the air injection gun 56. To be dispensed and dispensed. The air distribution frame 55 has a circular pipe shape, and since the air injection guns 56 are spaced apart from the air distribution frame 55, the air injection guns 56 are disposed in a circular shape as a whole. The air injection gun 56 may be disposed to correspond to the air injection hole 17.

The air injection gun 56 is docked in the air injection hole 17 as the air distribution frame 55 approaches the rear surface of the wafer jig 10. In this state, when dry air is supplied from the air supply 58, the dry air may be distributed through the air distribution frame 55 and injected through the respective air injection guns 56, resulting in Dry air may be injected and injected through the air injection holes 17 docked corresponding to the respective air injection guns 56. Then, the dry air injected through the respective air injection holes 17 may move along the sealing ring while being supplied to the sealing ring 18, and remain in the sealing ring 18 through this process. The liquid (especially the cleaning process liquid applied in the previous process) can be efficiently dried and removed.

As described above, according to the present invention, an air injection hole 17 is provided on the back surface of the wafer jig 10 to be mounted while sealing the back surface of the wafer, and docked to the air injection hole 17 in the drying tank 51. Since the dry air can be injected through the air injection gun 56 toward the back of the wafer, it is possible to enhance the drying function for the wafer, thereby reducing the defect rate of the wafer and improving the plating quality and production efficiency. The effect is to be able to improve.

As shown in FIG. 20, the wafer jig 10, in which the wafer which has been subjected to the drying process in the drying apparatus 50 having the above-described structural features, is mounted, is dried by the transfer apparatus 70. ) Is transferred to the unloading processing unit 6 which performs the next process, that is, the unloading process. Then, the unloading processing unit 6 allows the unloading process to proceed with respect to the wafer mounted on the wafer jig 10 transported and seated by the transfer device 70.

That is, the transfer device 70 takes out the wafer jig 10 having the drying process completed from the drying tank 51 and sequentially loads the wafer jig 10 on the pallet 19 disposed in the unloading processing unit 6. Do this. When the wafer jig 10 is completely loaded on the pallet 19, the worker pulls out the pallet 19 from the unloading processor 6 to unload the wafer jig. Of course, the withdrawal of the pallet 19 may be proceeded through the robot.

Meanwhile, as shown in FIG. 16, the drying treatment tank 51 constituting the drying apparatus 50 includes an upper cover 51c covering an upper portion thereof, and the transfer apparatus 70 is provided on the upper cover 51c. As a result, a jig insertion hole 51d for introducing the wafer jig 10 into the drying processing tank 51 or withdrawing it from the drying processing tank 51 is formed.

The jig inlet hole 51d is formed to a size through which only the jig body plate 11 can pass except the extension holder 12. As a result, in the state where the wafer jig 10 is placed in the drying processing tank 51 by the conveying device 70 and is seated, the extended mounting portion 12 of the wafer jig 10 is the upper cover. It is supported in a state seated on 51c. As a result, the wafer jig 10 may maintain a more stable posture in a state in which the wafer jig 10 is seated and mounted in the drying processing tank 51. The extended mounting portion 12 of the wafer jig 10 is mounted on the stand 19b formed on the pallet 19 to maintain a stable posture, and is also mounted on the upper cover during each process. To maintain a stable posture during the process.

An operation description of the upper cover 51c, the jig insertion hole 51d, and the extension mounting portion 12 of the wafer jig 10 described above will be described with reference to FIG. 16 in relation to the drying apparatus 50. However, the same applies to the above-described prewetting device 20, plating device 30, and cleaning device 40.

Although embodiments according to the present invention have been described above, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments of the present invention are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the following claims.

w: wafer sl: injection line
hp virtual horizontal plate surface vp: virtual vertical plate surface
vf: virtual focus 1: loading processing unit
2: prewetting process 3: plating process
4: washing treatment part 5: drying treatment part
6: unloading processing unit 7: transfer processing unit
10: wafer jig 11: jig body plate
12: extension mounting portion 13: clamping reinforcing hole
15: sealing plate 16: sealing fixture
17: air injection hole 18: sealing ring
19: pallet 19a: insert mounting frame
19b: stand 20: prewetting device
21: pre-wetting treatment tank 21a: first guide holder
21b: first side holder 22: pre-wetting spray unit
23: first mounting body 23a: mounting groove
23b: first mounting insertion protrusion 25: rotating body for pre-wetting spray
26: nozzle for pre-wetting spray 27: pre-wetting solution injection connector
28: Fixed frame for prewetting spray
30: plating apparatus 31: plating treatment tank
31a: 2nd guide holder 31b: 2nd side holder
32: plating spray unit 33: second mounting body
33a: mounting hole 33b: second mounting insertion protrusion
35: rotating body for plating spray 36: plating spray nozzle
37: plating solution injection connector 38: fixing frame for plating spray
39: anode unit
40: washing device 41: washing treatment tank
41a: 3rd guide holder 41b: 3rd side holder
42: cleaning spray unit 43: third mounting body
50: drying apparatus 51: drying treatment tank
51b: fourth side holder 51c: top cover
51d: jig insertion hole 52: blowing unit
53: dry strengthening unit 55: air distribution frame
56: air injection gun 57: frame support
58: air supply
70: transfer unit 71: horizontal transfer unit
73: vertical transfer unit 75: gripper
100: Wafer Plating System

Claims (4)

In a wafer plating system,
A loading processor for loading a wafer jig on which a wafer is mounted;
A prewetting processing unit which sequentially receives the wafer jig from the loading processing unit and performs pre-wetting on the wafer in a pre-wetting processing tank;
A plating processing unit which sequentially receives the wafer jig from the prewetting processing unit and performs plating on the wafer in a plating processing tank;
A cleaning processing unit which sequentially receives the wafer jig from the plating processing unit and performs cleaning of the wafer in the cleaning processing tank;
A drying processor configured to sequentially receive the wafer jig from the cleaning processor and to dry the wafer in a drying tank;
An unloading processor that sequentially receives the wafer jig from the drying processor and unloads the wafer jig;
And a transfer processing unit configured to sequentially transfer the wafer jig from the loading processing unit to the unloading processing unit.
The method according to claim 1,
The prewetting processing unit includes a prewetting device,
The pre-wetting apparatus includes a pre-wetting processing tank for receiving and placing the wafer jig, and spraying a pre-wetting process liquid toward the wafer mounted on the wafer jig, which is disposed opposite to the wafer jig, and rotates a nozzle for rotating the pre-wetting spray. Wafer plating system comprising a pre-wetting spray unit for injecting the pre-wetting process liquid through.
The method according to claim 1,
The plating treatment unit includes a plating apparatus,
The plating apparatus includes a plating treatment tank configured to receive and mount the wafer jig, and to inject a plating process liquid toward a wafer mounted on the wafer jig, which is disposed opposite to the wafer jig, and through the rotating spraying nozzle, the plating process. And a plating spray unit configured to inject liquid and allow the anode unit disposed at the rear side to communicate with the wafer jig disposed at the front side.
The method according to claim 1,
The drying treatment unit includes a drying device,
The drying apparatus includes a drying processing tank configured to receive and mount the wafer jig, a blower unit disposed opposite to the wafer jig to inject dry air into a wafer jig on which the wafer is mounted, and disposed to face the rear of the wafer jig, wherein the wafer is disposed opposite to the wafer jig. Wafer plating system comprising a dry strengthening unit for injecting dry air to the back of the wafer mounted on the jig.

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