KR20200004439A - Detection system for tunable / replaceable edge coupling ring - Google Patents

Abstract

The substrate processing system includes a processing chamber. The pedestal is placed in the processing chamber. An edge coupling ring is disposed adjacent the pedestal and around the radially outer edge of the substrate. The actuator is configured to selectively move the edge coupling ring relative to the substrate to change the edge coupling profile of the edge coupling ring. The substrate processing system includes a camera-based detection system that instructs the actuator to adjust the position of the edge coupling ring. The camera is configured to communicate with a controller, which adjusts the position and / or focus of the camera. In response to the edge coupling ring state information from the camera, the controller operates the actuator to move the edge coupling ring vertically. In response to the edge coupling ring position information from the camera, the controller operates the actuator to move the edge coupling ring horizontally.

Description

Detection system for tunable / replaceable edge coupling ring

Cross Reference to Related Applications

This application claims the priority of US Patent Application No. 15 / 609,570, filed May 31, 2017, which is part of US Patent Application No. 14 / 705,430, filed May 6, 2015. This application is in part a continuing application of US Patent Application No. 14 / 598,943, filed January 16, 2015. This application refers to the entirety of these preceding applications by reference.

The present disclosure relates to substrate processing systems, more specifically to edge coupling rings of substrate processing systems, and more particularly to detection systems for edge coupling rings of substrate processing systems. Also more specifically, the present disclosure relates to detection systems for detecting edge coupling rings location and / or state of substrate processing systems.

The description provided herein is for the purpose of generally presenting the context of the present disclosure. The achievements of the inventors named herein to the extent described in this Background section, as well as aspects of the present technology, which may not otherwise be otherwise certified as prior art at the time of application, are expressly or implicitly recognized as prior art to the present disclosure. It doesn't work.

Substrate processing systems may be used to perform etching and / or other processing of substrates such as semiconductor wafers. The substrate may be disposed on a pedestal of the processing chamber of the substrate processing system. For example, during etching in a plasma etcher, a gas mixture comprising one or more precursors is introduced into the processing chamber and the plasma is struck to etch the substrate.

Edge coupling rings were used to adjust the etch rate and / or etch profile of the plasma near the radially outer edge of the substrate. The edge coupling ring is typically located on a pedestal around the radially outer edge of the substrate. The process states at the radially outer edge of the substrate may include the position of the edge coupling ring, the shape or profile of the inner edge of the edge coupling ring, the height of the edge coupling ring relative to the top surface of the substrate, the material of the edge coupling ring, and the like. Can be modified by changing

Changing the edge coupling ring requires the processing chamber to be opened, which is undesirable. In other words, the edge coupling effect of the edge coupling ring cannot be changed without opening the processing chamber. When the edge coupling ring is corroded by the plasma during etching, the edge coupling effect changes. Correcting corrosion of the edge coupling ring requires that the processing chamber be opened to replace the edge coupling ring.

Referring now to FIGS. 1 and 2, the substrate processing system may include a pedestal 20 and an edge coupling ring 30. Edge coupling ring 30 may comprise a single piece or two or more portions. In the example of FIGS. 1 and 2, the edge coupling ring 30 comprises a first annular portion 32 disposed near the radially outer edge of the substrate 33. The second annular portion 34 is located radially inward from the first annular portion below the substrate 33. The third annular portion 36 is disposed below the first annular portion 32. During use, the plasma 42 is directed to the substrate 33 to etch the exposed portions of the substrate 33. The edge coupling ring 30 is configured to assist plasma shaping so that uniform etching of the substrate 33 occurs.

In FIG. 2, after the edge coupling ring 30 is used, the upper surface of the radially inner portion of the edge coupling ring 30 may exhibit corrosion as identified at 48. As a result, the plasma 42 tends to etch at a faster rate at the radially outer edge than the radially inner portions of the substrate 33, as can be seen at 44.

One or more portions of the edge coupling ring may be moved vertically and / or horizontally relative to the substrate or pedestal in the substrate processing system. This movement does not require the processing chamber to be opened and changes the edge coupling effect of the plasma on the substrate during etching or other substrate processing.

Referring now to FIGS. 3-5, the substrate processing system includes a pedestal 20 and an edge coupling ring 60. Edge coupling ring 60 may consist of a single part or two or more parts may be used. In the example of FIGS. 3-5, the edge coupling ring 60 comprises a first annular portion 72 disposed radially outward of the substrate 33. The second annular portion 74 is located radially inward from the first annular portion 72 below the substrate 33. The third annular portion 76 is disposed below the first annular portion 72.

As will be further described below, the actuator 80 may be disposed at various locations to move one or more portions of the edge coupling ring 60 relative to the substrate 33. By way of example only, the actuator 80 in FIG. 3 is disposed between the first annular portion 72 of the edge coupling ring 60 and the third annular portion 76 of the edge coupling ring 60. In some examples, actuator 80 may include a piezoelectric actuator, stepper motor, pneumatic drive, or other suitable actuator. In some examples, one, two, three, or four or more actuators are used. In some examples, the plurality of actuators are uniformly disposed around the edge coupling ring 60. Actuator (s) 80 may be disposed inside or outside the processing chamber.

During use, the plasma 82 is directed to the substrate 33 for etching the exposed portions of the substrate 33. The edge coupling ring 60 is configured to help shape the plasma electric field so that uniform etching of the substrate 33 occurs. As can be seen in 84 and 86 of FIG. 4, one or more portions of the edge coupling ring 60 may be corroded by the plasma 82. As a result of the corrosion, non-uniform etching of the substrate 33 may occur near the radially outer edge of the substrate 33. Normally, the process must be stopped, the processing chamber is opened and the edge coupling ring is replaced.

In FIG. 5, actuator 80 is used to move one or more portions of edge coupling ring 60 to change the position of one or more portions of edge coupling ring 60. For example, the actuator 80 may be used to move the first annular portion 72 of the edge coupling ring 60. In this example, the actuator 80 is in an upward or vertical direction such that the edge 86 of the first annular portion 72 of the edge coupling ring 60 is higher than the radially outer edge of the substrate 33. The first annular portion 72 of the edge coupling ring 60 is moved. As a result, the etching uniformity is improved radially near the outer edge of the substrate 33.

Referring now to FIG. 6, as will be appreciated, the actuator may be disposed in one or more other locations and may move in other directions, such as horizontal, oblique, and the like. Horizontal movement of this portion of the edge coupling ring may be performed to center the edge coupling effect on the substrate. In FIG. 6, the actuator 110 is disposed radially outward of the edge coupling ring 60. In addition, the actuator 110 moves in a horizontal (or side to side) direction as well as in a vertical (or up / down) direction. Horizontal repositioning may be used when etching of the substrates shows a horizontal offset of the edge coupling ring relative to the substrates. The horizontal offset may be corrected without opening the processing chamber. Similarly, tilting of the edge coupling ring may be performed by actuating some of the actuators differently from the other actuators to correct or create asymmetry in the lateral direction.

Instead of positioning the actuator 110 between the annular portions of the edge coupling ring, the actuator 110 may also be attached to the radially outer wall or other structure identified by 114. Alternatively, actuator 110 may be supported from below by a wall or other structure identified by 116.

Referring now to FIGS. 7 and 8, another example of an edge coupling ring 150 and a piezoelectric actuator 154 is shown. In this example, the piezoelectric actuator 154 moves the edge coupling ring 150. The piezoelectric actuator 154 is mounted to the first annular portion 72 and the third annular portion 76 of the edge coupling ring 60. In FIG. 8, the piezoelectric actuator 154 moves the first annular portion 72 of the edge coupling ring 150 to adjust the position of the edge 156 of the first annular portion 72.

Keeping the processing chamber closed can present difficulties in observing the state of the edge coupling ring and in determining when to reposition the ring and when to replace the ring to compensate for corrosion.

In addition, when replacing the edge coupling ring, there may be difficulties in properly positioning and / or aligning the edge coupling ring.

The substrate processing system includes a processing chamber. The processing chamber has a covered opening through which the states of the chamber can be observed, including the state and / or position of the edge coupling ring adjacent the pedestal of the processing chamber and disposed about the radially outer edge of the substrate and And / or can be measured. A detection system for detecting the state and / or position of the edge coupling ring is provided.

In one aspect, the detection system includes a camera having optics suitable for allowing observation of the state of the edge coupling ring without opening the processing chamber.

In one feature, the apparatus includes a laser inferometer for measuring the profile of the edge coupling ring without opening the processing chamber.

Depending on the observed conditions and / or measurements, for example, in response to corrosion of the plasma-facing surface of the edge coupling ring, the actuator does not require the processing chamber to be opened, but the edge couple of the edge coupling ring And selectively move the first portion of the edge coupling ring relative to the substrate to change the ring profile.

In other features, the actuator is configured to move the first portion of the edge coupling ring relative to the second portion of the edge coupling ring.

In other features, the controller is configured to move the edge coupling ring in response to corrosion of the plasma-facing surface of the edge coupling ring. The controller automatically moves the edge coupling ring after the edge coupling ring is exposed to a predetermined number of etch cycles. The controller automatically moves the edge coupling ring after the edge coupling ring is exposed to etching in a predetermined period of time.

In other features, the actuator moves the first portion of the edge coupling ring perpendicular to the substrate. The actuator moves the first portion of the edge coupling ring horizontally with respect to the substrate. The sensor or detector is configured to communicate with the controller and to detect corrosion of the edge coupling ring.

In other features, the detector is a camera mounted outside the processing chamber and aimed at the edge coupling ring through a side view port of the chamber.

In other features, the camera may provide an image or other information of the state and / or location of the edge coupling ring using plasma light, or using external light. In other features, external light may be provided through the same side viewport through which the camera is aimed or through different side viewports.

In other features, the detection system includes a controller to adjust the position and / or focus of the camera. In other features, the controller for moving the actuator also adjusts the position and / or focus of the camera. The camera is configured to communicate with a controller, which adjusts the position and / or focus of the camera. In response to the edge coupling ring state information from the camera, the controller operates the actuator to adjust the position of the edge coupling ring with respect to the substrate. In response to the edge coupling ring state information from the camera, the controller operates the actuator to move the edge coupling ring vertically. In response to the edge coupling ring position information from the camera, the controller operates the actuator to move the edge coupling ring horizontally. In response to the edge coupling ring orientation information from the camera, the controller operates the actuator to move one side of the edge coupling ring relative to another side.

In other features, the robot is configured to communicate with the controller and adjust the position of the sensor. The sensor includes a depth gauge. The sensor includes a laser interferometer. The actuator selectively tilts the edge coupling ring with respect to the substrate. The actuator is located outside of the processing chamber. The rod member connects the actuator to the edge coupling ring through the wall of the processing chamber.

In other features, a seal is disposed between the rod member and the wall of the processing chamber. The controller moves the edge coupling ring to a first position for a first treatment of the substrate using the first edge coupling effect and then to a second position for a second treatment of the substrate using the second edge coupling effect. It is configured to.

The method of adjusting the edge coupling profile of the edge coupling ring in the substrate processing system includes placing the edge coupling ring adjacent to the pedestal in the processing chamber. The edge coupling ring is disposed around the radially outer edge of the substrate. The method includes selectively moving the first portion of the edge coupling ring with respect to the substrate using an actuator to change the edge coupling profile of the edge coupling ring.

In other features, the method includes delivering a process gas and a carrier gas to the processing chamber. The method includes generating a plasma in the processing chamber to etch the substrate. The method includes moving the first portion of the edge coupling ring using an actuator that does not require the processing chamber to be opened. The edge coupling ring further includes a second portion. The actuator is configured to move the first portion of the edge coupling ring relative to the second portion of the edge coupling ring. The actuator is selected from the group consisting of piezoelectric actuators, stepper motor actuators, and pneumatically driven actuators.

In other features, the method includes moving the edge coupling ring in response to corrosion of the plasma-facing surface of the edge coupling ring. The method includes automatically moving the edge coupling ring after the edge coupling ring is exposed to a predetermined number of etching cycles. The method includes automatically moving the edge coupling ring after the edge coupling ring has been exposed to a predetermined period of etching. The method includes moving the first portion of the edge coupling ring perpendicular to the substrate. The method includes moving the first portion of the edge coupling ring horizontally with respect to the substrate.

In other features, the method includes moving the first portion of the edge coupling ring perpendicular to the substrate. The method includes moving the first portion of the edge coupling ring horizontally with respect to the substrate. A sensor or detector is configured to communicate with the controller and to detect corrosion of the edge coupling ring.

In other features, the method includes using the camera to sense corrosion of the edge coupling ring. The method includes adjusting the position of the edge coupling ring using the images from the camera. The method includes operating an actuator to adjust the position of the edge coupling ring relative to the substrate in response to the positional information provided by the camera. The method includes operating the actuator to move the edge coupling ring vertically in response to information provided by the camera in relation to the state of the edge coupling ring. The method includes operating the actuator to move the edge coupling ring horizontally in response to information provided by the camera in relation to the position of the edge coupling ring. The method includes operating an actuator to move one side of the edge coupling ring relative to another side in response to information provided by the camera with respect to the position of the edge coupling ring.

In other features, the method includes using a sensor to sense corrosion of the edge coupling ring. The sensor is selected from the group consisting of a depth gauge and a laser interferometer. The method includes selectively tilting the edge coupling ring relative to the substrate. The actuator is located outside of the processing chamber.

In other features, the method includes moving the edge coupling ring to a first position for a first treatment of the substrate using the first edge coupling effect, followed by a second treatment of the substrate using the second edge coupling effect. To move the edge coupling ring to a second position.

Other areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

The present disclosure will be more fully understood from the detailed description and the accompanying drawings.
1 is a side cross-sectional view of a pedestal and edge coupling ring according to the prior art.
2 is a side cross-sectional view of a pedestal and edge coupling ring according to the prior art after corrosion of the edge coupling ring has occurred.
3 is a side cross-sectional view of one example of a pedestal, an edge coupling ring and an actuator.
4 is a cross-sectional side view of the pedestal, edge coupling ring and actuator of FIG. 3 after corrosion of the edge coupling ring has occurred.
5 is a cross-sectional side view of the pedestal, edge coupling ring and actuator of FIG. 3 after corrosion of the edge coupling ring has occurred and the actuator has been moved.
6 is a side cross-sectional view of another example of a pedestal, an edge coupling ring and an actuator positioned in another position, in accordance with the present disclosure.
7 is a side cross-sectional view of another example of a pedestal, an edge coupling ring, and a piezoelectric actuator, in accordance with the present disclosure.
8 is a cross-sectional side view of the pedestal, edge coupling ring and piezoelectric actuator of FIG. 7 after corrosion has occurred and the piezoelectric actuator has been moved.
9 is a functional block diagram of an example of a substrate processing chamber including a pedestal, an edge coupling ring and an actuator, in accordance with the present disclosure.
10 is a flowchart illustrating example steps of a method for operating an actuator to move an edge coupling ring, in accordance with the present disclosure.
11 is a flowchart illustrating still another example steps of a method for operating an actuator to move an edge coupling ring, in accordance with the present disclosure.
12 is a functional block diagram of an example of a processing chamber including a movable edge coupling ring by actuators disposed external to the processing chamber, in accordance with the present disclosure.
13A and 13B illustrate an example of tilting in the lateral direction of the edge coupling ring, in accordance with the present disclosure.
14 illustrates an example of a method for moving an edge coupling ring during processing of a substrate.
15 is a top view of an example of a pedestal including an edge coupling ring and a lifting ring.
16 is a side cross-sectional view of an example of an edge coupling ring and a lifting ring.
17 is a side cross-sectional view of an example of an edge coupling ring lifted by a lifting ring and an edge coupling ring removed by a robot arm.
18 is a side cross-sectional view of an example of a movable edge coupling ring and a lifting ring.
19 is a side sectional view of the movable edge coupling ring of FIG. 18 in a raised position;
20 is a side cross-sectional view of the edge coupling ring of FIG. 18 lifted by the lifting ring and the edge coupling ring removed by the robot arm.
21 is a side sectional view of an example of a movable edge coupling ring.
FIG. 22 is a side cross-sectional view of the edge coupling ring of FIG. 21 lifted by the actuator and removed by the robot arm.
23 is an example of a method for replacing the edge coupling ring without opening the processing chamber.
24 is an example of a method for moving the edge coupling ring due to corrosion and replacing the edge coupling ring without opening the processing chamber.
25 is an example of a method for raising the edge coupling ring due to corrosion and replacing the edge coupling ring without opening the processing chamber.
26 is a cross-sectional side view of a processing chamber having an example detector mounted outside the chamber.
27 is a cross-sectional side view of a processing chamber having an example detector and illumination device mounted outside the chamber.
28 is a side cross-sectional view of a processing chamber having an edge coupling ring in an etched or corroded state.
29A shows an enlarged side view of the liner, and FIGS. 29C and 29C show examples of placement of a good edge coupling ring and a poor edge coupling ring relative to the liner.
30A-30C show examples of images with different positions and states of the edge coupling ring.
31 is a side sectional view showing an image of an alternative mode of an edge coupling ring using a detector.
32 is an example of a method of inspecting an edge coupling ring to determine alignment of the edge coupling ring on an electrostatic chuck.
33 is an example of a method of inspecting an edge coupling ring to determine the state of the edge coupling ring.
In the drawings, reference numbers may be reused to identify similar and / or identical elements.

Referring now to FIG. 9, an example of a substrate processing chamber 500 for performing etching using an RF plasma is shown. The substrate processing chamber 500 includes a processing chamber 502 that encloses other components of the substrate processing chamber 500 and contains the RF plasma. The substrate processing chamber 500 includes a pedestal 506 that includes an upper electrode 504 and a lower electrode 507. Edge coupling ring 503 is supported by pedestal 506 and is disposed around substrate 508. One or more actuators 505 may be used to move the edge coupling ring 503. During operation, a substrate 508 is disposed on the pedestal 506 between the upper electrode 504 and the lower electrode 507.

By way of example only, the upper electrode 504 may include a showerhead 509 that introduces and distributes process gases. The showerhead 509 may include a stem portion that includes one end connected to the top surface of the processing chamber. The base portion is generally cylindrical and extends radially outward from the opposite end of the step portion at a position spaced apart from the top surface of the processing chamber. The substrate-facing surface or the facing plate of the base portion of the showerhead includes a plurality of holes through which a process gas or purge gas flows. Alternatively, upper electrode 504 may include a conductive plate and process gases may be introduced in another manner. The lower electrode 507 may be disposed on the nonconductive pedestal. Alternatively, pedestal 506 may include an electrostatic chuck that includes a conductive plate that acts as bottom electrode 507.

The RF generation system 510 generates an RF voltage and outputs to one of the upper electrode 504 and the lower electrode 507. The other of the upper electrode 504 and the lower electrode 507 may be DC grounded, AC grounded, or floating. For example only, the RF generation system 510 may include an RF voltage generator 511 that generates an RF voltage, which is fed to the upper electrode 504 or the lower electrode 507 by a matching and distribution network 512. It may be. In other examples, the plasma may be generated inductively or remotely.

Gas delivery system 530 includes one or more gas sources 532-1, 532-2,..., And 532 -N (collectively gas sources 532), where N is an integer greater than zero. to be. Gas sources supply one or more precursors and mixtures thereof. Gas sources may also supply purge gas. Vaporized precursors may also be used. Gas sources 532 include valves 534-1, 534-2, ..., and 534-N (collectively valves 534) and mass flow controllers 536-1, 536-2,... And 536-N) (collectively mass flow controllers 536) to manifold 540. The output of manifold 540 is fed to processing chamber 502. For example only, the output of manifold 540 is fed to showerhead 509.

The heater 542 may be connected to a heater coil (not shown) disposed within the pedestal 506. The heater 542 may be used to control the temperature of the pedestal 506 and the substrate 508. Valve 550 and pump 552 may be used to evacuate reactants from processing chamber 502. The controller 560 may be used to control the components of the substrate processing chamber 500. The controller 560 may also be used to control the actuator 505 to adjust the position of one or more portions of the edge coupling ring 503.

Robot 570 and sensor 572 may be used to measure the corrosion of the edge coupling ring. In some examples, sensor 572 may include a depth gauge. The robot 570 may contact the edge coupling ring to move the depth gauge to measure corrosion. Alternatively, a laser interferometer (with or without robot 570) may be used to measure corrosion without direct contact. The robot 570 may be omitted if the laser interferometer can be positioned on the line of sight directly with respect to the edge coupling ring.

Referring now to FIG. 10, an example of a method 600 for operating an actuator to move an edge coupling ring is shown. At 610, at least a portion of the edge coupling ring is positioned in the first position relative to the substrate. At 614, the substrate processing system is operated. The operation may include etching or other processing of the substrate. At 618, the control determines whether a predetermined period of etching or a predetermined number of etching cycles have occurred. If it did not exceed the predetermined period or number of cycles as determined at 618, control returns to 614.

When the predetermined period or number of cycles expires, control determines at 624 whether the maximum predetermined etching period has expired, the maximum number of etching cycles have occurred, and / or the maximum number of actuator movements has occurred.

If 624 is false, control causes the actuator to move at least a portion of the edge coupling ring. Movement of the edge coupling ring can be performed automatically, manually, or a combination thereof without opening the processing chamber. If 624 is true, control sends or otherwise indicates that the edge coupling ring should be serviced / replaced.

Referring now to FIG. 11, an example of a method 700 for operating an actuator to move an edge coupling ring is shown. At 710, at least a portion of the edge coupling ring is positioned in a first position relative to the substrate. At 714, the substrate processing system is operated. The operation may include etching or other processing of the substrate. At 718, control determines whether a predetermined amount of corrosion of the edge coupling ring has occurred using a sensor such as a depth gauge or a laser interferometer. If 718 is false, control returns to 714.

When a predetermined amount of corrosion occurs, the control determines at 724 whether the maximum amount of corrosion has occurred. When 724 is false, control moves at least a portion of the edge coupling ring using an actuator. Movement of the edge coupling ring can be performed automatically, manually or in combination without opening the processing chamber. If 724 is true, control sends or otherwise indicates that the edge coupling ring should be serviced / replaced.

In addition to the foregoing, the determination of whether the edge coupling ring should be moved after processing may be based on the inspection of the etch patterns of the substrates after processing. The actuator may be used to adjust the edge coupling profile of the edge coupling ring without opening the chamber.

Referring now to FIG. 12, the processing chamber 800 includes an edge coupling ring 60 disposed on the pedestal 20. Edge coupling ring 60 includes one or more portions moveable by one or more actuators 804 disposed outside of processing chamber 800. In this example, portion 72 is movable. The actuators 804 may be connected to the portion 72 of the edge coupling ring 60 by a mechanical linkage 810. For example, mechanical linkage 810 may include a rod member. The mechanical linkage 810 may pass through the hole 811 of the wall 814 of the processing chamber 800. Seal portion 812, such as an "O" ring, may be used. The mechanical linkage 810 may pass through holes 815 of one or more structures, such as the portion 76 of the edge coupling ring 60.

Referring now to FIGS. 13A and 13B, tilting in the lateral direction of the edge coupling ring 830 is shown. Tilting in the lateral direction may be used to correct misalignment in the lateral direction. In FIG. 13A, portions 830-1 and 830-2 of the edge coupling ring 830 on opposite sides of the substrate are disposed in a first arrangement. The portions 830-1 and 830-2 may generally be aligned with the portions 832-1 and 832-2 of the edge coupling ring 830. Actuators 836-1 and 836-2 are disposed between portions 830-1 and 832-1 and between 830-2 and 832-2, respectively.

In FIG. 13B, the actuators 836-1 and 836-2 are edge coupled such that the edge coupling ring 830 moves a second arrangement 850 that is different from the first arrangement 840 shown in FIG. 13A. Move respective portions of the ring 830. As can be seen, the substrates may be inspected after processing and the tilting to the substrate may be adjusted as needed without opening the processing chamber.

Referring now to FIG. 14, a method 900 for moving an edge coupling ring during processing of a substrate is shown. In other words, different processes may be performed on a single substrate in the same processing chamber. The edge coupling effect of the edge coupling ring may be adjusted between a plurality of processes performed on a substrate of the same processing chamber before proceeding to a subsequent substrate. At 910, the substrate is positioned on the pedestal and the position of the edge coupling ring is adjusted if necessary. At 914, processing of the substrate is performed. Processing of the substrate is done as determined at 918, and the substrate is moved from the pedestal at 922. At 924, it is determined whether another substrate should be processed. If 924 is true, the method returns to 910. Otherwise the method ends.

If 918 is false and the substrate requires additional processing, the method determines at 930 whether adjustment of the edge coupling ring is required. If 930 is false, the method returns to 914. If 930 is true, at 934 at least a portion of the edge coupling ring is moved using one or more actuators and the method returns to 914. As can be seen, the edge coupling ring can be adjusted between the processes of the same substrate in the same processing chamber.

Referring now to FIG. 15, edge coupling ring 1014 and lifting ring 1018 are disposed adjacent and around the upper surface of pedestal 1010. Edge coupling ring 1014 includes a radially inner edge disposed adjacent to the substrate during etching as described above. Lifting ring 1018 is disposed below at least a portion of edge coupling ring 1014. The lifting ring 1018 is used to raise the edge coupling ring 1014 over the surface of the pedestal 1010 when removing the edge coupling ring 1014 using a robot arm. Edge coupling ring 1014 can be removed without requiring the processing chamber to be open to atmospheric pressure. In some examples, lifting ring 1018 is between circumferentially spaced ends 1020 to provide clearance for the robot arm to remove edge coupling ring 1014, as will be described below. It may optionally include a portion 1019 open to it.

Referring now to FIGS. 16 and 17, an example of edge coupling ring 1014 and lifting ring 1018 is shown in more detail. In the example shown in FIG. 16, the pedestal may include an electrostatic chuck (ESC), generally identified 1021. ESC 1021 may include one or more stacked plates, such as ESC plates 1022, 1024, 1030, and 1032. ESC plate 1030 may correspond to an intermediate ESC plate and ESC plate 1032 may correspond to an ESC baseplate. In some examples, an O-ring 1026 may be disposed between the ESC plates 1024 and 1030. Although a particular pedestal 1010 is shown, other types of pedestals may be used.

The bottom edge coupling ring 1034 may be disposed below the edge coupling ring 1014 and the lifting ring 1018. The bottom edge coupling ring 1034 may be disposed adjacent to the radially outer side of the ESC plates 1024, 1030 and 1032 and the O-ring 1026.

In some examples, edge coupling ring 1014 may include one or more self-centering features 1040, 1044 and 1046. For example only, self-centering features 1040 and 1044 may be triangle-shaped, female self-centering features, although other shapes may be used. Self-centering feature 1046 may be an inclined surface. Lifting ring 1018 may include one or more self-centering features 1048, 1050, and 1051. For example only, self-centering features 1048 and 1050 may be triangular-shaped, male self-centering features, although other shapes may be used. Self-centering feature 1051 may be an inclined surface having a shape complementary to self-centering feature 1046. The self-centering feature 1048 on the lifting ring 1018 may mate with the self-centering feature 1044 on the edge coupling ring 1014. Self-centering feature 1050 on lifting ring 1018 may mat with self-centering feature 1052 of bottom edge coupling ring 1034.

Lifting ring 1018 further includes a protrusion 1054 extending radially outward. The groove 1056 may be disposed on the bottom-facing surface 1057 of the protrusion 1054. Groove 1056 is configured to be biased by one end of pillar 1060 that is coupled to actuator 1064 and optionally moved vertically by actuator 1064. Actuator 1064 may be controlled by a controller. As can be seen, a single groove, pillar, and actuator are shown, but with the additional grooves, pillars, and actuators circumferentially spaced around the lifting ring 1018 to bias the lifting ring 1018 in an upward direction. It may be arranged in the direction.

In FIG. 17, an edge coupling ring 1014 that is raised in an upward direction by the lifting ring 1018 using the pillar (s) 1060 and the actuator (s) 1064 is shown. Edge coupling ring 1014 can be removed by the robot arm from the processing chamber. More specifically, the robot arm 1102 is connected to the edge coupling ring 1014 by a holder 1104. Holder 1104 may include self-centering feature 1110 mating with self-centering feature 1040 on edge coupling ring 1014. As can be seen, the robot arm 1102 and the holder 1104 may bias the edge coupling ring upward to clear the self-centering feature 1048 on the lifting ring 1018. The robot arm 1102, holder 1104 and edge coupling ring 1014 may then be moved from the processing chamber. The robot arm 1102, the holder 1104 and the new edge coupling ring can be returned and positioned onto the lifting ring 1018. The lifting ring 1018 is then lowered. Reverse action may be used to transfer the new edge coupling ring 1014 to the lifting ring 1018.

Alternatively, instead of lifting the robot arm 1102 and the holder 1104 upward to lift the edge coupling ring 1014 from the lifting ring 1018, the robot arm 1102 and the holder 1104 are raised. Contacted edge coupling ring 1014 can be positioned below. The lifting ring 1018 is then lowered and the edge coupling ring 1014 remains on the robot arm 1102 and the holder 1104. The robot arm 1102, the holder 1104 and the edge coupling ring 1014 can be removed from the processing chamber. Reverse action may be used to deliver a new edge coupling ring 1014 onto the lifting ring 1018.

Referring now to FIGS. 18-20, a movable edge coupling ring 1238 and lifting ring 1018 are shown. In FIG. 18, one or more pillars 1210 are formed by one or more actuators 1214, the bores 1220, 1224 of the ESC baseplate 1032, the bottom edge coupling ring 1034 and the lifting ring 1018, respectively. And 1228). In this example, a middle edge coupling ring 1240 or spacer is disposed between the movable edge coupling ring 1238 and the lifting ring 1018. The middle edge coupling ring 1240 may include self-centering features 1244 and 1246. Corresponding self-centering features 1248 may be provided on the movable edge coupling ring 1238. Self-centering features 1248 mat with self-centering features 1246 on the middle edge coupling ring 1240.

As described in detail above, corrosion of the upward facing surface of the movable edge coupling ring 1238 may occur during use. This may eventually change the profile of the plasma. The movable edge coupling ring 1238 may be selectively moved in the upward direction using the pillars 1210 and actuators 1214 to change the profile of the plasma. In FIG. 19, the movable edge coupling ring 1238 of FIG. 18 is shown in a raised position. The middle edge coupling ring 1240 may remain fixed. As a result, the movable edge coupling ring 1238 may be moved one or more times, after which the edge coupling ring 1238 and the intermediate edge coupling ring 1240 may be replaced.

In FIG. 20, the actuator 1214 is returned to the lowered state and the actuator 1064 is moved to the raised state. Edge coupling ring 1238 and middle edge coupling ring 1240 may be lifted by lifting ring 1018 and movable edge coupling ring 1238 may be removed by robot arm 1102 and holder 1104. have.

As can be seen, the actuators can be disposed in or outside the processing chamber. In some examples, edge coupling rings may be supplied to the chamber via a cassette, load lock, transfer chambers, and the like. Alternatively, the edge coupling rings may be stored outside of the processing chamber but inside of the substrate processing tool.

Referring now to FIGS. 21 and 22, the lifting ring may be omitted in some examples. An edge coupling ring 1310 is disposed on the radially outer edge of the bottom edge coupling ring 1034 and the pedestal. Edge coupling ring 1310 may include one or more self-centering features 1316 and 1320. The edge coupling ring 1310 may further include a groove 1324 for receiving the top surface of the pillar 1210, biased by the actuator 1214. Self-centering feature 1320 may be disposed against a corresponding self-centering feature 1326 of the bottom edge coupling ring 1034. In some examples, self-centering features 1320 and 1326 are inclined planes.

In FIG. 22, the actuator 1214 and the pillar 1210 bias the edge coupling ring 1310 upward to remove the edge coupling ring 1310 or adjust the plasma profile after corrosion has occurred. The robot arm 1102 and the holder 1104 can be moved to a position below the edge coupling ring 1310. Self-centering feature 1316 may be engaged by self-centering feature 1110 on holder 1104 connected to robot arm 1102. Either robot arm 1102 moves in an upward direction to provide a space between groove 1324 and pillar 1210 or pillar 1210 is moved downward by actuator 1214 to provide space for groove 1324. Is moved to.

Referring now to FIG. 23, a method 1400 for replacing the edge coupling ring without opening the processing chamber to atmospheric pressure is shown. At 1404, the method determines whether the edge coupling ring is located on the lifting ring. If 1404 is false, the method uses the robotic arm to move the edge coupling ring into position on the lifting ring at 1408. After the edge coupling ring is located on the lifting ring in the processing chamber, the process is executed at 1408. At 1412, the method uses any of the criteria described above to determine whether the edge coupling ring is worn. If 1412 is false, the method returns to 1408 and the process may be executed again. If the edge coupling ring is determined to be worn at 1412, the edge coupling ring is replaced at 1416 and the method continues at 1408.

Referring now to FIG. 24, the method 1500 adjusts the position of the movable edge coupling ring when it is necessary to offset corrosion and selectively replaces the movable edge coupling ring when it is determined that the movable edge coupling ring is worn. At 1502, the method determines whether a movable edge coupling ring is positioned on the lifting ring. If 1502 is false, the edge coupling ring is moved to a position on the lifting ring at 1504 and the method continues at 1502.

If 1502 is true, the method determines whether the position of the movable edge coupling ring should be adjusted at 1506. If 1506 is true, the method uses the actuator to adjust the position of the movable edge coupling ring and returns to 1506. If 1506 is false, the method executes the process at 1510. At 1512, the method determines whether the movable edge coupling ring is worn. If false, the method returns to 1510.

If 1512 is true, the method determines at 1520 whether the movable edge coupling ring is in the highest (or fully adjusted) position. If 1520 is false, the method uses actuator 1214 to adjust the position of the movable edge coupling ring at 1524 and the method returns to 1510. If 1520 is true, the method replaces the movable edge coupling ring using actuator 1064, lifting ring 1018 and robot arm 1102.

Referring now to FIG. 25, a method 1600 for replacing the edge coupling ring without opening the process chamber to atmospheric pressure is shown. At 1610, the lifting ring and the edge coupling ring are biased upward using the actuator. At 1620, the robot arm and holder are moved under the edge coupling ring. At 1624, the robot arm is moved upward or the lifting ring is moved downward to eliminate self-centering features of the edge coupling ring. At 1628, the robot arm with the edge coupling ring is moved out of the processing chamber. At 1632, the edge coupling ring is detached from the robot arm. At 1636, the replacement edge coupling ring is picked up by the robot arm. At 1638, the edge coupling ring is positioned on the lifting ring and aligned using one or more self-centering features. At 1642, the robot arm is lowered to allow enough space for the self-centering feature and the robot arm is removed from the chamber. At 1646, the lifting ring and the edge coupling ring are lowered into position.

Referring now to FIG. 26, detection features of edge coupling ring state and position will now be described. Part of the present technology focuses on the detector and detection method according to the features of the present invention, which enable a direct measurement of the height and corrosion of the edge coupling ring. Details of various elements of the processing chamber including ESCs, edge coupling rings, controllers, and actuators have been provided previously and have not been repeated here for the sake of simplicity and clarity.

In FIG. 26, the processing chamber 1710 has a window 1715 positioned over the chamber top. Pedestal 1720 of chamber 1710 has an electrostatic chuck (ESC) 1725 mounted on top thereof. Actuator mechanisms 1730 and 1735 that move the edge coupling ring 1740 horizontally and / or vertically as previously described are adjacent to the ESC 1725. One or both of the actuator mechanisms 1730 and 1735 may be installed as described for the preceding figures. Wafer 1750 is positioned on ESC 1725 in edge coupling ring 1740.

Camera 1760 is mounted on attachment mechanism 1765 to view edge coupling ring 1740 through side view port 1770 of chamber 1710. Attachment mechanism 1765 may be a bracket, docking mechanism, or other suitable attachment mechanism that enables proper vertical and / or horizontal movement of camera 1760 relative to side view port 1770, and edge coupling ring 1740. Enable proper focusing of camera 1760 on the appropriate portion of the < RTI ID = 0.0 > In one feature, side view port 1770 includes a shutter 1775 to protect material in the port during wafer processing. In one feature, the shutter 1775 operates using a pneumatic gate valve.

In one feature, as shown, the attachment mechanism 1765 mounts the camera 1760 on the chamber 1710. In another feature, the attachment mechanism 1765 mounts the camera 1760 on the structure next to the chamber 1710.

In some features, a controller (shown in the previous figures) controls the actuation, focusing, and positioning of the camera 1760. In some features, a separate controller 1800 provides one or more of actuation, focusing, and positioning for the camera. In some features, the camera itself provides its own focusing mechanism, but one of the controllers described herein assists the camera's own focusing based on a separate analysis of the provided images.

In other features, camera 1760 is installed to allow viewing through window 1715. In FIG. 26, the camera 1760 is shown focused on the inner edge of the edge coupling ring 1740. Edge coupling ring 1740 is shown in a new state when installed in chamber 1710.

Camera of sufficient resolution (e.g. number of pixels) to enable determination of the state and position of edge coupling ring 1740, and to produce images of a size suitable to provide a direct measurement of ring height and ring corrosion. 1760). In some features, the camera operates in macro (close up) mode, using a macro lens. In other features, the lens may be an optical zoom lens that provides proper magnification. Any combination of pixel number and magnification (macro, optical zoom, or in some features, digital zoom) that enables the generation of sufficient information (eg, an image) to determine ring state and position will be acceptable. In some features, camera 1760 may operate using high dynamic range (HDR) imaging in combination with macro and / or zoom photography.

In one feature, plasma light is sufficiently good so that there is sufficient light in chamber 1710 to illuminate edge coupling ring 1740. In other features, an external lighting source, such as a light emitting diode (LED) source, is provided. In FIG. 27, in addition to the elements shown in FIG. 26, in some features the external lighting device 1780 provides illumination in the chamber 1710. As shown, in one feature, an attachment mechanism 1785 mounts the lighting device 1780 on the chamber 1710. In another feature, the attachment mechanism 1785 mounts the lighting device 1780 to the structure next to the chamber 1710. In one feature, the lighting device 1780 is attached to the camera 1760. According to various features, the attachment may be mechanical or electrical. In some features, an additional side view port 1790 is provided, through which the lighting device 1780 shines light into the chamber 1710. Attachment mechanism 1785 may be a bracket, docking mechanism, or other suitable attachment mechanism that enables proper vertical and / or horizontal movement of camera 1760 relative to side view port 1790. In some features, additional side view port 1790 is on the same side of side view port 1770 and chamber 1710. In other features, additional side view port 1790 may be on a different side of chamber 1710 from side view port 1770. In one feature, side view port 1790 includes a shutter 1795 to protect material in the port during wafer processing. In one feature, the shutter 1795 operates using a pneumatic gate valve. In yet other features, the lighting device 1780 shines light through the same side view port 1770 when the camera 1760 uses when no separate side view port 1790 is needed.

For ease of illustration, the two side view ports 1770, 1790 are individually shown as chamber 1710 is slightly larger in FIG. 27 than in FIG. 26, but in some features the chamber is the same size in both figures. to be. If the plasma light source functions as a light source, no additional side view port 1790 is needed.

In operation, the focus and / or position of the camera 1760 may drift. In one feature, the controller 1800 monitors the focus and position of the camera 1760 and makes appropriate adjustments.

FIG. 28 has all the same elements as FIG. 27 except that the edge coupling ring 1740 ′ is shown as corroded, having an inner radius shorter than the outer radius. As previously described, corrosion or etching occurs as the wafer processing system processes more and more wafers. Also, as previously described, if the camera 1760 provides an image showing that the edge coupling ring is corroded too much to perform the function of controlling the etching at the edge of the corroded wafer, then the controller 560 may properly To move the edge coupling ring 1740 ′ vertically, one or both of the actuators 1730, 1735 are controlled. In one feature, the controllers 560 and 1800 communicate with each other such that the controller 560 operates the appropriate actuator (s) in response to the image data from the controller 1800.

FIG. 29A is an enlarged view of openings 1015 of liner 1012 shown in the top view of FIG. 15. Openings appear on the side of the liner. The liner 1012 acts as a fixed reference, through which the camera can focus to capture images of the position and state of the edge coupling ring.

29B and 29C show images of good placement and poor placement of the edge coupling ring for the openings 1015 of the liner 1012, respectively. In these figures, the edge coupling ring is at the bottom of each of the images. Dark portions in each of the figures are portions of the openings 1015. The consistency of the height of the dark parts indicates the quality of the batch. In one feature, the height of the dark portions is determined by counting the number of vertical dark pixels along the vertical axis at the center of the dark portions. In FIG. 29B, the relative uniformity of the heights of the dark portions and the size of these portions indicate that the edge coupling ring is properly disposed. In FIG. 29C, the inconsistency of the heights of the dark portions and the relatively short height of the dark portions on the right side of the figure indicate that the edge coupling ring is tilted.

30A-30C show raw images of various heights and states of edge coupling ring 1740, taken in the chamber. FIG. 30A shows the state of a new edge coupling ring with heights of 3.0, 3.2, 3.4, 3.6, 3.8, and 4.0 mm as can be seen in the six images placed sideways to form FIG. 30A. . FIG. 30B shows the state of a worn edge coupling ring before recalibration and rise of the ring at the same heights as in FIG. 30A. FIG. 30C shows the state of a worn edge coupling ring of the same heights as in FIGS. 30A and 30B after recalibration and rise of the ring.

In one feature, the original images, such as the images shown in FIGS. 30A-30C, again use the openings 1015 of the liner 1012 of FIG. 15 as a fixed reference for several different ring heights and ring states. For example, it may be used to calibrate the camera of the first example. In one feature, calibration may be performed as follows. Initially, once a new edge coupling ring is installed, images may be taken at several different ring heights, for example to raise and lower the ring using one or more of the actuators. In pixels, measuring different heights of the ring and comparing these measurements with physical measurements enables calibration of a transition edge sensor (TES) to provide a gauge for calibrating the camera. Calibration may be useful to describe whether the camera drift is drift in focus or whether it is drift in focal length (degree of magnification). For example, drift in magnification may result in a changed height measurement due to a change in the relationship between the number of pixels and the μm number.

31 shows an alternative way of directly measuring the corrosion of the edge coupling ring. In FIGS. 26-28, the camera 1760 is trained directly on inside the edge of the edge coupling ring. In this figure, however, the camera may tend to provide an image of the entire top surface of the edge coupling ring, potentially hiding or masking the actual amount of corrosion. This makes it difficult to measure the height of the inner edge of the edge coupling ring because it makes it difficult to differentiate the edge from the rest of the top surface of the ring. The image may appear blurry. It is desirable to clearly show the front edge so as to measure the height of the front edge (in the number of pixels, converted into units of height such as μm) and thus determine the degree of corrosion.

To this end, in FIG. 31, instead of looking directly inside the edge coupling ring, the camera 1760 may take a reflection of the inside of the edge coupling ring. The mirror image can come from the surface of the ESC 1725, or from the surface of the wafer 1750. One or both of the surfaces may have reflective features. Looking in the mirror image, the camera 1760 takes a mirror image 1840 ′ of the edge coupling ring 1840. (The dotted lines show the portion 1845 and the "mirror image" 1845 '.)

By looking at the mirror image of the edge coupling ring instead of looking at the edge coupling ring itself, perspective problems are avoided. The height of the inner edge of the edge coupling ring can be measured directly in some examples to enable a clearer determination of the state of the edge coupling ring.

There may also be restrictions on the detectability of ring corrosion from looking at the mirror image of the edge coupling ring. Since corrosion occurs inside the edge coupling ring, the corrosion reduces the height of the inner edge of the ring relative to the outer edge. The greater the reduction, the greater the degree that the upper surface of the ring effectively tilts. At some point, the degree of "tilting" may be large enough to make it difficult to distinguish the inner edge of the ring in the mirror image, making it difficult to measure the height of the inner edge, and thus difficult to measure the degree of corrosion. Inability to determine the degree of corrosion can trigger adjustment of the ring height using actuators, or even ring replacement too quickly or too slowly. As a result, any of the edge coupling rings are replaced too quickly, wasting the useful life of the rings, or the rings are raised or replaced too slowly, causing variability in the etch profile near the radially outer edge of the wafer. In one feature, raising the angle at which the camera 1760 sees the reflected image can be compensated as corrosion progresses.

32 illustrates a method of seating an edge coupling ring using images from a camera. After the method begins in 1910, the robot installs the edge coupling ring on the ESC in 1920. At 1930, the camera is focused to identify the inner edge of the ring. As discussed above, the camera may be focused on the inner edge of the edge coupling ring or on the mirror of the ring on the ESC or wafer.

At 1940, the camera takes images of the edge coupling ring relative to a fixed reference, such as the lifting ring of FIG. 15. At 1950, images are processed and analyzed to determine whether the ring is vertically aligned, that is, whether there is any tilting on the edge coupling ring (eg, as shown in FIG. 29B). If there is tilting, then at 1955 the controller 560 controls one or more of the actuators to compensate for the tilting, and the method returns to 1940 to acquire more images and checks again whether there is still tilting (at 1950).

If the edge coupling ring is not tilted, using the images obtained in 1960 again, it is determined whether the edge coupling ring is at the correct height. If the ring is not at the correct height, at 1965 the controller 560 controls one or more of the vertical actuators to correct the height, and the method returns to 1940 to acquire more images (at 1960) and the edge coupling ring is Check again whether you are at the correct height. In one feature, if the tilt has already been adjusted, 1950 can be skipped and the method can proceed directly from 1940 to 1960. In another feature, the tilt and height can be measured and adjusted in a single step, using a controller 560 that controls the vertical actuators in a single operation by combining 1950 and 1960 in a single analysis and combining 1955 and 1965 in a single process. Can be.

Once the edge coupling is in proper height and vertical alignment, it is determined in 1970 whether the edge coupling ring is horizontally aligned on the ESC. If not aligned horizontally, at 1975 the controller 560 causes one or more of the horizontal actuators to move the edge coupling ring, as a result of which the method returns to 1940 (at 1970) to acquire more images. Check the ring again to see if it is aligned horizontally. In one feature, if the vertical alignment has already been adjusted, 1950 and 1960 can be skipped and the method can proceed directly from 1940 to 1970.

In the method shown in FIG. 32, vertical alignment and horizontal alignment are not determined in the order shown. The order can be reversed, so that horizontal alignment is adjusted first, followed by vertical alignment. In one aspect, the controller 560 can receive all information regarding the positioning of the edge coupling ring and can control a plurality of actuators at once to align the edge coupling ring. According to this feature, 1950, 1960, and 1970 can be combined in a single analysis, and 1955, 1965, and 1975 can be combined in one process.

33 illustrates a method of adjusting the edge coupling ring using images from a camera. After the method commences in 2010, it is determined in 2020 whether a ring has been installed and a predetermined period has elapsed since wafer processing began. If not, the method returns to 2020 to see if the predetermined period has elapsed.

In one feature, instead of waiting for a predetermined period of time, it is determined whether a predetermined number of processing cycles have occurred at 2020. If not, the method returns to 2020 to check the number of cycles again.

If a predetermined period of time has passed or a predetermined number of processing cycles have occurred, then at 2030 the camera is focused to identify the inner edge of the ring. As discussed above, the camera may be focused on the inner edge of the edge coupling ring or on the mirror of the ring on the ESC or wafer. At 2040, images of the edge coupling ring with respect to the fixed reference after focusing are taken and the height of the inner edge of the ring is measured. If it is determined at 2050 that the inner edge is at least at a predetermined height above the surface of the wafer, then at 2055 it is determined to wait for a predetermined period. In one aspect, instead of waiting for a predetermined period of time, it is determined to wait for a predetermined number of wafer processing cycles. After a predetermined period of time has elapsed or a predetermined number of processing cycles have occurred, the method returns to 2030 when the camera is refocused, and then 2040 where more images are taken, and the determination is repeated at 2050.

If it is determined that the inner edge of the edge coupling ring is not at least a predetermined height above the surface of the wafer, then at 2060 the controller 560 controls the vertical actuators to raise the edge coupling ring. At 2070, it is determined whether a predetermined number of cycles have elapsed after installation of the edge coupling ring. If not, return to 2055 and wait for a predetermined period. In an aspect, at 2055 the method may wait for a predetermined number of cycles.

If at 2070 it is determined that a predetermined number of cycles have elapsed, the edge coupling ring is replaced at 2080. In one aspect, instead of seeing whether a predetermined number of cycles have elapsed, the amount of expansion of the actuator can be measured. If the expansion of the actuator exceeds a predetermined amount, it may be determined that the edge coupling ring should be replaced. In another aspect, instead of any of the preceding alternatives immediately before, it may be determined whether a predetermined time period has passed after installation of the edge coupling ring. If this time period has elapsed, it may be determined that the edge coupling ring should be replaced.

After the edge coupling ring is replaced, the method may end at 2090 or return to the beginning.

The foregoing technology is merely exemplary in nature and is not intended to limit the present disclosure, its application, or uses in any way. The broad teachings of this disclosure can be implemented in various forms. Thus, while the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited as other modifications will become apparent by studying the drawings, specification, and the following claims. As discussed herein, at least one of the phrases A, B, and C should be interpreted to mean logically (A or B or C), using a non-exclusive logical OR, and “at least one A , At least one B, and at least one C ″. It should be understood that one or more steps of the method may be executed in a different order (or simultaneously) without changing the principles of the present disclosure.

In some implementations, the controller can be part of a system that may be part of the examples described above. Such systems may include semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (wafer pedestal, gas flow system, etc.). . These systems may be integrated into electronics for controlling their operation prior to, during and after processing of a semiconductor wafer or substrate. Electronic devices may be referred to as “controllers” that may control various components or subparts of a system or systems. The controller, depending on the processing requirements and / or type of the system, delivers processing gases, temperature settings (eg, heating and / or cooling), pressure settings, vacuum settings, power settings Radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, tools and other transfer tools and / or It may be programmed to control any of the processes disclosed herein, including wafer transfers into and out of loadlocks connected or interfaced with a particular system.

Generally speaking, the controller receives various instructions, issues instructions, controls operations, enables cleaning operations, enables end point measurements, and the like, various integrated circuits, logic, memory, and / or It may be defined as an electronic device having software. Integrated circuits are ones that execute chips and / or program instructions (eg, software) defined as chips in the form of firmware that store program instructions, digital signal processors (DSP), application specific integrated circuit (ASIC), and / or the like. The microprocessors or microcontrollers may be included. The program instructions may be instructions that are delivered to the controller or to the system in the form of various individual settings (or program files) that define operating parameters for executing a particular process on or for the semiconductor wafer. In some embodiments, operating parameters are a process to achieve one or more processing steps during fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer. It may be part of a recipe defined by engineers.

The controller may, in some implementations, be coupled to or part of a computer that can be integrated into the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be all or part of a fab host computer system that may enable remote access of wafer processing or may be in the “cloud”. The computer monitors the current progress of manufacturing operations, examines the history of past manufacturing operations, examines trends or performance metrics from a plurality of manufacturing operations, changes the parameters of the current processing, and processes processing steps that follow the current processing. You can also enable remote access to the system to set up or start a new process. In some examples, a remote computer (eg, a server) can provide process recipes to the system via a network that may include a local network or the Internet. The remote computer may also include a user interface that enables the input or programming of parameters and / or settings to be subsequently passed from the remote computer to the system. In some examples, the controller receives instructions in the form of data, specifying parameters for each of the process steps to be performed during one or more operations. It should be understood that these parameters may be specific to the type of tool to be controlled or interfaced by the controller and the type of process to be performed. Thus, as described above, the controllers may be distributed, for example, by including one or more individual controllers that are networked with each other and cooperate together for a common purpose, eg, for the processes and controls described herein. An example of a distributed controller for these purposes is one or more integrations on a chamber in communication with one or more integrated circuits located remotely (eg, at the platform level or as part of a remote computer) that are combined to control a process on the chamber. Circuits.

Exemplary systems include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin-rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) Chamber or module, chemical vapor deposition (CVD) chamber or module, atomic layer deposition (ALD) chamber or module, atomic layer etch (ALE) chamber or module, ion implantation chamber or module, track chamber or module, and semiconductor It may include any other semiconductor processing systems that may be used or associated in the manufacture and / or manufacture of wafers.

As described above, depending on the process step or steps to be performed by the tool, the controller may, upon transferring the material, move containers of wafers from / to the load ports and / or tool positions within the semiconductor fabrication factory. Communicating with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, main computer, another controller or tools that are used. You may.

Claims (26)

A processing chamber having a first side view port;
A pedestal disposed in the processing chamber;
A liner surrounding the pedestal, the liner having at least one opening;
An edge coupling ring disposed adjacent the pedestal, the edge coupling ring comprising a first portion located outside and around the radially outer edge of the substrate when the substrate is disposed on the pedestal; Edge coupling rings;
The edge coupling ring with respect to a second portion of (i) the substrate and (ii) the radially inwardly located edge coupling ring of the first portion to change the edge coupling profile of the edge coupling ring. An actuator configured to selectively move the first portion of the actuator, wherein the actuator is configured to move the first portion to at least one position where an upper surface of the first portion is above an upper surface of the substrate; Actuators; And
A detector system configured to detect a state of the edge coupling ring, the detector system being:
A camera configured to obtain image data of a plasma-facing surface of the edge coupling ring through the first side viewport; And
And a detector controller configured to receive the image data and determine at least one of a state and a location of the plasma-facing surface of the edge coupling ring. The method of claim 1,
The detector system further comprises an illumination device configured to provide light to the camera to obtain the image data of the edge coupling ring. The method of claim 2,
And the illumination device provides light through the first side viewport. The method of claim 2,
The processing chamber comprises a second viewport, and the illumination device provides light through the second viewport. The method of claim 1,
A gas delivery system configured to deliver process gas and carrier gas to the processing chamber; And
And a plasma generator configured to generate a plasma in the processing chamber to etch the substrate. The method of claim 5,
The plasma generator provides light to the camera to obtain the image data of the edge coupling ring. The method of claim 1,
The actuator moves the edge coupling ring perpendicular to the substrate in response to a condition indicative of corrosion of the plasma-facing surface of the edge coupling ring. The method of claim 1,
And the actuator moves the edge coupling ring horizontally relative to the substrate in response to a condition indicating misalignment of the edge coupling ring. The method of claim 1,
And the actuator moves the first portion of the edge coupling ring perpendicular to the substrate in response to a condition indicating misalignment of the edge coupling ring. The method of claim 1,
And a second controller configured to respond to the first controller to control the actuator to selectively move the first portion of the edge coupling ring. The method of claim 10,
And the second controller is configured to cause replacement of the edge coupling ring in response to determination of sufficient corrosion of the edge coupling ring. The method of claim 1,
The camera is aimed at the edge coupling ring to obtain the image data. The method of claim 1,
An electrostatic chuck (ESC) disposed on the pedestal, wherein the camera is aimed at at least one of the substrate and the ESC to obtain the image data. The method of claim 1,
The image data includes image data of a section of the edge coupling ring for the at least one opening of the liner, and to determine at least one of a state and a position of the edge coupling ring, the first controller Calculates a height between the section of the edge coupling ring and an upper end of the at least one opening. The method of claim 14,
The liner has a plurality of openings; The image data includes image data of the section of the edge coupling ring for the plurality of openings of the liner, and the first controller is configured to correspond to the section of the edge coupling ring and the plurality of openings. Calculate a plurality of heights between the upper ends, and the first controller compares the plurality of heights to determine at least one of the state and the position of the edge coupling ring. The method of claim 1,
And the first controller adjusts the position of the camera in response to detecting the state of the edge coupling ring. A processing chamber having a first side viewport, a pedestal disposed within the processing chamber, a liner surrounding the pedestal, the liner having a plurality of openings, and an edge coupling ring adjacent the pedestal, the radial of the substrate on the pedestal In a substrate processing system comprising the edge coupling ring comprising a first portion located outside and around the outer edge to
A detector system for detecting at least one of a state and a position of the edge coupling ring,
The detector system,
A camera for acquiring image data of the edge coupling ring through the first side viewport; And
A controller that receives the image data and determines at least one of the position and the state of the plasma-facing surface of the edge coupling ring,
The image data includes image data of a section of the edge coupling ring for the plurality of openings of the liner, and the controller is between the section of the edge coupling ring and different upper ends of the plurality of openings. Calculate a plurality of heights of the controller, and the controller compares the plurality of heights to determine one of the state and the position of the edge coupling ring. The method of claim 17,
The substrate processing system further comprises an electrostatic chuck (ESC) disposed on the pedestal, and the camera aims at one of the substrate and the ESC to obtain the image data. A method of determining at least one of a state and a position of an edge coupling ring of a substrate processing system, the method comprising:
Identifying an inner edge of the edge coupling ring;
Obtaining image data of the edge coupling ring with respect to a fixed reference;
Processing the image data to determine whether the edge coupling ring is vertically aligned;
Vertically adjusting the edge coupling ring in response to determining that the edge coupling ring is not vertically aligned;
Determining whether the inner edge of the edge coupling ring is at a predetermined height;
In response to determining that the inner edge of the edge coupling ring is not at the predetermined height, determining whether the edge coupling ring can be adjusted vertically; And
In response to determining that the edge coupling ring can be adjusted vertically, adjusting the edge coupling ring vertically. The method of claim 19,
In response to determining that the edge coupling ring cannot be adjusted vertically, further instructing replacement of the edge coupling ring. The method of claim 19,
Determining whether the edge coupling ring can be adjusted vertically includes determining whether there was a predetermined number of semiconductor processing cycles after installation of the edge coupling ring of the substrate processing system. A method of determining at least one of a state and a position of a coupling ring. The method of claim 19,
Determining whether the edge coupling ring can be adjusted vertically includes determining whether a predetermined amount of time has elapsed after installing the edge coupling ring of the semiconductor processing system. The method of determining at least one of the state and position of. The method of claim 19,
Determining whether the edge coupling ring can be adjusted vertically includes determining whether the edge coupling ring has been vertically raised to the maximum limit at least one of the state and position of the edge coupling ring. How to decide. The method of claim 19,
Vertically adjusting the edge coupling ring includes adjusting a portion of the edge coupling ring vertically relative to another portion of the edge coupling ring. At least one determination method. The method of claim 19,
Determining whether the edge coupling ring is aligned horizontally; And
And in response to determining that the edge coupling ring is not aligned horizontally, adjusting the edge coupling ring horizontally. The method of claim 25,
Horizontally adjusting the edge coupling ring includes moving the edge coupling ring relative to a pedestal of the substrate processing system, wherein the substrate is disposed on the pedestal and A method of determining at least one of the locations.

Images