JP7096271B2 - Detection system for adjustable / replaceable edge coupling ring - Google Patents

Description

[Cross-reference to related applications]
This application relates to US Application Nos. 15 / 609,570 filed on May 31, 2017, which is a partial continuation of US Application Nos. 14/705 and 430 filed on May 6, 2015. Claim priority. This application is a partial continuation of US Application No. 14 / 598,943 filed January 16, 2015. This application incorporates all of these prior applications by reference.

The present disclosure relates to a substrate processing system, more specifically to an edge coupling ring of a substrate processing system, and even more specifically to a detection system for an edge coupling ring of a substrate processing system. More specifically, the present disclosure relates to a detection system for detecting the position and / or state of an edge coupling ring in a substrate processing system.

The background description provided herein is for the purpose of generally presenting the context of this disclosure. The work of the present inventor, as far as it is described in the background art, is expressly or implicitly recognized as prior art to the present disclosure, as in the mode of description which may not be regarded as prior art at the time of filing. Not done.

The substrate processing system may be used to perform etching and / or other processing of substrates such as semiconductor wafers. The substrate may be placed on a pedestal in the processing chamber of the substrate processing system. For example, during etching in a plasma etcher, a gas mixture containing one or more precursors is introduced into the processing chamber and the plasma is directed to etch the substrate.

Edge coupling rings have been used to adjust the etching rate and / or etching profile of the plasma near the radial outer edge of the substrate. The edge coupling ring is usually placed on the pedestal around the radial outer edge of the substrate. The processing state at the radial outer edge of the substrate can be determined by changing the position of the edge coupling ring, the shape or profile of the inner edge of the edge coupling ring, the height of the edge coupling ring with respect to the top surface of the substrate, the material of the edge coupling ring, etc. Can be changed.

In order to change the edge coupling ring, it is necessary to open the processing chamber, which is not desirable. In other words, the edge coupling effect of the edge coupling ring cannot be changed without opening the processing chamber. When the edge coupling ring is eroded by the plasma during etching, the edge coupling effect changes. To correct the erosion of the edge coupling ring, it is necessary to open the processing chamber and replace the edge coupling ring.

As shown herein with reference to FIGS. 1-2, the substrate processing system may include a pedestal 20 and an edge coupling ring 30. The edge coupling ring 30 may include a single piece or a plurality of parts. In the example of FIGS. 1 to 2, the edge coupling ring 30 includes a first annular portion 32 arranged near the radial outer edge of the substrate 33. A second annular portion 34 is arranged radially inside from the first annular portion under the substrate 33. Below the first annular portion 32, a third annular portion 36 is arranged. During use, the plasma 42 is directed at the substrate 33 to etch the exposed portion of the substrate 33. The edge coupling ring 30 is arranged to aid in the formation of the plasma so that uniform etching of the substrate 33 occurs.

In FIG. 2, after the edge coupling ring 30 has been used, the top surface of the radial inner portion of the edge coupling ring 30 may show erosion as identified by 48. As a result, as can be seen at 44, the plasma 42 may tend to etch the radial outer edge of the substrate 33 at a faster rate than the etching of its radial inner portion.

One or more parts of the edge coupling ring may be moved vertically and / or horizontally with respect to the substrate or pedestal in the substrate processing system. This transfer changes the edge coupling effect of the plasma on the substrate during etching or other substrate processing without the need to open the processing chamber.

As shown herein with reference to FIGS. 3-5, the substrate processing system includes a pedestal 20 and an edge coupling ring 60. The edge coupling ring 60 may be made of a single part or multiple parts may be used. In the example of FIGS. 3-5, the edge coupling ring 60 includes a first annular portion 72 located radially outside the substrate 33. A second annular portion 74 is arranged radially inside from the first annular portion 72 under the substrate 33. Below the first annular portion 72, a third annular portion 76 is arranged.

As will be further described below, the actuator 80 may be arranged at various positions in order to move one or more parts of the edge coupling ring 60 relative to the substrate 33. As a mere example, in FIG. 3, the actuator 80 is disposed between the first annular portion 72 of the edge coupling ring 60 and the third annular portion 76 of the edge coupling ring 60. In some examples, the actuator 80 may include a piezoelectric actuator, a stepper motor, a pneumatic drive, or other suitable actuator. In some examples, one, two, three, or four or more actuators are used. In some examples, a large number of actuators are evenly distributed around the edge coupling ring 60. The actuator 80 may be located inside or outside the processing chamber.

During use, plasma 82 is directed at the substrate 33 to etch the exposed portion of the substrate 33. The edge coupling ring 60 is arranged to aid in the formation of the plasma electric field so that uniform etching of the substrate 33 occurs. As can be seen in 84 and 86 of FIG. 4, one or more portions of the edge coupling ring 60 may be eroded by the plasma 82. As a result of erosion, non-uniform etching of the substrate 33 may occur near the radial outer edge of the substrate 33. It is usually necessary to stop the process, open the process chamber and replace the edge coupling ring.

In FIG. 5, the actuator 80 is used to move one or more parts of the edge coupling ring 60 to reposition one or more portions of the edge coupling ring 60. For example, the actuator 80 may be used to move the first annular portion 72 of the edge coupling ring 60. In this example, the actuator 80 moves the first annular portion 72 of the edge coupling ring 60 upward or vertically so that the edge 86 of the first annular portion 72 of the edge coupling ring 60 is in the radial direction of the substrate 33. Try to be higher than the outer edge. As a result, the etching uniformity near the radial outer edge of the substrate 33 is improved.

As can be understood with reference to FIG. 6, the actuator may be placed in one or more other positions and may move in other directions such as horizontal and diagonal. A horizontal movement of part of the edge coupling ring may be performed to center the edge coupling effect on the substrate. In FIG. 6, the actuator 110 is arranged radially outside the edge coupling ring 60. In addition, the actuator 110 moves not only in the vertical (or up / down) direction but also in the horizontal (or left / right) direction. Horizontal rearrangement may be used if the etching of the substrate indicates a horizontal offset of the edge coupling ring with respect to the substrate. The horizontal offset may be modified without opening the processing chamber. Similarly, tilting of the edge coupling ring may be performed by operating some of the actuators differently from other actuators in order to correct or generate left-right asymmetry.

Rather than disposing the actuator 110 between the annular portions of the edge coupling ring, the actuator 110 may also be attached to a radial outer wall or other structure identified by 114. Alternatively, the actuator 110 may be supported from below by a wall or other structure identified by 116.

Here, as shown with reference to FIGS. 7-8, another example of the edge coupling ring 150 and the piezoelectric actuator 154 is shown. In this example, the piezoelectric actuator 154 moves the edge coupling ring 150. The piezoelectric actuator 154 is attached to the first annular portion 72 and the third annular portion 76 of the edge coupling ring 150 . In FIG. 8, the piezoelectric actuator 154 moves the first annular portion 72 of the edge coupling ring 150 in order to adjust the position of the edge 156 of the first annular portion 72.

Keeping the processing chamber closed when observing the condition of the edge coupling ring and, as a result, when adjusting the position of the ring to compensate for erosion and when determining when to replace the ring. Difficulties can arise.

In addition, when replacing the edge coupling ring, it can be difficult to properly position and / or align the edge coupling ring.

The substrate processing system includes a processing chamber. The processing chamber is observed and / or measured in the chamber, including the condition and / or position of the edge coupling ring placed around the radial outer edge of the substrate adjacent to the pedestal in the processing chamber. Has an opening with a cover to obtain. A detection system is provided that detects the state and / or position of the edge coupling ring.

In one feature, the detection system includes a camera equipped with an optical system suitable for allowing observation of the state of the edge coupling ring without opening the processing chamber.

In one feature, the device includes a laser interferometer for measuring the profile of the edge coupling ring without opening the processing chamber.

Depending on the observed state and / or measurement, for example, in response to erosion of the plasma-facing surface of the edge-coupling ring, the actuator changes the edge-coupling profile of the edge-coupling ring without the need to open the processing chamber. It is configured to selectively move the first portion of the edge coupling ring with respect to the substrate.

In another feature, the actuator is configured to move the first portion of the edge coupling ring relative to the second portion of the edge coupling ring.

In another feature, the controller is configured to move the edge coupling ring in response to erosion of the plasma facing surface of the edge coupling ring. The controller automatically moves the edge coupling ring after it has been exposed to a predetermined number of etching cycles. The controller automatically moves the edge coupling ring after the edge coupling ring has been exposed to etching for a predetermined period of time.

In another feature, the actuator moves the first portion of the edge coupling ring perpendicular to the substrate. The actuator moves the first portion of the edge coupling ring horizontally with respect to the substrate. The sensor or detector is configured to communicate with the controller to detect erosion of the edge coupling ring.

In another feature, the detector is a camera mounted outside the processing chamber and is aimed on the edge coupling ring via the side view port of the chamber.

In other features, the camera may use plasma lighting or external lighting to provide an image or other information of the state and / or position of the edge coupling ring. In other features, external lighting may be provided through the same side-view port to which the camera is aimed, or through different side-view ports.

In other features, the detection system includes a controller that adjusts the position and / or focus of the camera. In another feature, the controller that moves the actuator also adjusts the position and focus of the camera. The camera is configured to communicate with the controller, which adjusts the position and / or focus of the camera. In response to the state information of the edge coupling ring from the camera, the controller operates the actuator to adjust the position of the edge coupling ring with respect to the board. In response to the state information of the edge coupling ring from the camera, the controller operates the actuator to move the edge coupling ring in the vertical direction. Depending on the position information of the edge coupling ring from the camera, the controller operates the actuator to move the edge coupling ring horizontally. Depending on the orientation information of the edge coupling ring from the camera, the controller operates the actuator to move one side of the edge coupling ring with respect to the other.

In another feature, the robot is configured to communicate with the controller and adjust the position of the sensor. The sensor includes a depth gauge. The sensor includes a laser interferometer. The actuator selectively tilts the edge coupling ring with respect to the substrate. The actuator is located outside the processing chamber. The rod member connects the actuator to the edge coupling ring through the wall of the processing chamber.

In another feature, the seal is placed between the rod member and the wall of the processing chamber. The controller moves the edge coupling ring to the first position for the first processing of the substrate using the first edge coupling effect, and then uses the second edge coupling effect. It is configured to be moved to a second position for the second processing of the substrate.

A method for adjusting the edge coupling profile of an edge coupling ring in a substrate processing system involves placing the edge coupling ring adjacent to the pedestal in the processing chamber. The edge coupling ring is placed around the radial outer edge of the substrate. The method comprises using an actuator to selectively move a first portion of the edge coupling ring relative to the substrate in order to modify the edge coupling profile of the edge coupling ring.

In another feature, the method comprises supplying process gas and carrier gas to the processing chamber. The method involves generating plasma in the processing chamber to etch the substrate. The method comprises moving the first portion of the edge coupling ring using an actuator without the need to open the processing chamber. The edge coupling ring further comprises a second portion. The actuator is configured to move the first portion of the edge coupling ring relative to the second portion of the edge coupling ring. The actuator is selected from the group consisting of piezoelectric actuators, stepper motor actuators, and pneumatically driven actuators.

In another feature, the method comprises moving the edge coupling ring in response to erosion of the plasma facing surface of the edge coupling ring. The method comprises automatically moving the edge coupling ring after it has been exposed to a predetermined number of etching cycles. The method comprises automatically moving the edge coupling ring after it has been exposed to etching for a predetermined period of time. The method comprises moving the first portion of the edge coupling ring perpendicular to the substrate. The method comprises moving the first portion of the edge coupling ring horizontally with respect to the substrate.

In another feature, the method comprises moving a first portion of the edge coupling ring perpendicular to the substrate. The method comprises moving the first portion of the edge coupling ring horizontally with respect to the substrate. The sensor or detector is configured to communicate with the controller to detect erosion of the edge coupling ring.

In another feature, the method comprises using a camera to detect erosion of the edge coupling ring. The method involves adjusting the position of the edge coupling ring using an image from the camera. The method comprises manipulating the actuator to adjust the position of the edge coupling ring with respect to the substrate according to the position information provided by the camera. The method comprises manipulating the actuator to move the edge coupling ring vertically, depending on the information the camera provides regarding the condition of the edge coupling ring. The method comprises manipulating the actuator to move the edge coupling ring horizontally, depending on the information the camera provides regarding the location of the edge coupling ring. The method comprises manipulating the actuator to move one side of the edge coupling ring relative to the other, depending on the information the camera provides regarding the location of the edge coupling ring.

In another feature, the method comprises using a sensor to detect erosion of the edge coupling ring. The sensor is selected from a group consisting of a depth gauge and a laser interferometer. The method comprises selectively tilting the edge coupling ring with respect to the substrate. The actuator is located outside the processing chamber.

In another feature, the method moves the edge coupling ring to a first position for the first processing of the substrate using the first edge coupling effect and the edge coupling ring to the second edge. It involves moving the substrate to a second position for a second process using the binding effect.

Further areas of applicability of the present disclosure will be apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration and are not intended to limit the scope of the present disclosure.

This disclosure will be more fully understood from the detailed description and the accompanying drawings below.

FIG. 1 is a side sectional view of a pedestal and an edge coupling ring according to the prior art.

FIG. 2 is a side sectional view of a pedestal and an edge coupling ring according to the prior art after erosion of the edge coupling ring has occurred.

FIG. 3 is a side sectional view of an example of a pedestal, an edge coupling ring, and an actuator.

FIG. 4 is a side sectional view of the pedestal, edge coupling ring, and actuator of FIG. 3 after erosion of the edge coupling ring has occurred.

FIG. 5 is a side sectional view of the pedestal, edge coupling ring, and actuator of FIG. 3 after erosion of the edge coupling ring has occurred and the actuator has been moved.

FIG. 6 is a side sectional view of another example of a pedestal, edge coupling ring, and actuator located at different locations according to the present disclosure.

FIG. 7 is a side sectional view of another example of a pedestal, an edge coupling ring, and a piezoelectric actuator according to the present disclosure.

FIG. 8 is a side sectional view of the pedestal, edge coupling ring, and piezoelectric actuator of FIG. 7 after erosion has occurred and the piezoelectric actuator has been moved.

FIG. 9 is a functional block diagram of an example substrate processing chamber including pedestals, edge coupling rings, and actuators according to the present disclosure.

FIG. 10 is a flow chart illustrating an example step of a method for manipulating an actuator to move an edge coupling ring in accordance with the present disclosure.

FIG. 11 is a flow chart illustrating another example step of a method for manipulating an actuator to move an edge coupling ring in accordance with the present disclosure.

FIG. 12 is a functional block diagram of an example of a processing chamber that includes an edge coupling ring that is movable by an actuator located outside the processing chamber according to the present disclosure.

FIG. 13A is a diagram showing an example of a left-right tilt of an edge coupling ring according to the present disclosure. FIG. 13B is a diagram showing an example of a left-right tilt of an edge coupling ring according to the present disclosure.

FIG. 14 is a diagram illustrating an example of a method for moving the edge coupling ring during substrate processing.

FIG. 15 is a plan view of an example pedestal including an edge coupling ring and a lifting ring.

FIG. 16 is a side sectional view of an example of an edge coupling ring and a lifting ring.

FIG. 17 is a side sectional view of an example of an edge coupling ring lifted by a lifting ring and an edge coupling ring removed by a robot arm.

FIG. 18 is a side sectional view of an example of a movable edge coupling ring and a lifting ring.

FIG. 19 is a side sectional view of the movable edge coupling ring of FIG. 18 in the ascending position.

FIG. 20 is a side sectional view of the edge coupling ring of FIG. 18 lifted by the lifting ring and the edge coupling ring removed by the robot arm.

FIG. 21 is a side sectional view of an example of a movable edge coupling ring.

FIG. 22 is a side sectional view of the edge coupling ring of FIG. 21 lifted by the actuator and removed by the robot arm.

FIG. 23 is a diagram illustrating an example of a method for replacing the edge coupling ring without opening the processing chamber.

FIG. 24 is a diagram illustrating an example of a method for moving an edge coupling ring by erosion and replacing the edge coupling ring without opening the processing chamber.

FIG. 25 is a diagram illustrating an example of a method for lifting an edge coupling ring by erosion and replacing the edge coupling ring without opening the processing chamber.

FIG. 26 is a side sectional view of the processing chamber with an example of a detector mounted on the outside of the chamber.

FIG. 27 is a side sectional view of the processing chamber with an example of a detector and lighting device mounted on the outside of the chamber.

FIG. 28 is a side sectional view of the processing chamber with the edge coupling ring etched or eroded.

FIG. 29A is an enlarged side view of the liner. FIG. 29B is a diagram showing an example of a good edge coupling ring arrangement for the liner. FIG. 29C is a diagram showing an example of a defective edge coupling ring arrangement with respect to the liner.

FIG. 30A is a diagram showing an example of images of different positions and states of the edge coupling ring. FIG. 30B is a diagram showing an example of images of different positions and states of the edge coupling ring. FIG. 30C is a diagram showing an example of images of different positions and states of the edge coupling ring.

FIG. 31 is a side sectional view showing an alternative mode of imaging of an edge coupling ring using a detector.

FIG. 32 is a diagram showing an example of a method for inspecting the edge coupling ring to determine that it is aligned on the electrostatic chuck.

FIG. 33 is a diagram showing an example of a method for inspecting an edge coupling ring to determine its state.

Reference numbers may be reused in the drawings to identify similar and / or identical elements.

As shown with reference to FIG. 9, an example of a substrate processing chamber 500 for performing etching using RF plasma is shown. The substrate processing chamber 500 includes a processing chamber 502 that surrounds the other components of the substrate processing chamber 500 and houses the RF plasma. The substrate processing chamber 500 includes an upper electrode 504 and a pedestal 506 including a lower electrode 507. The edge coupling ring 503 is supported by the pedestal 506 and is placed around the substrate 508. One or more actuators 505 may be used to move the edge coupling ring 503. During operation, the substrate 508 is placed on the pedestal 506 between the upper electrode 504 and the lower electrode 507.

As a mere example, the top electrode 504 may include a shower head 509 that introduces and distributes process gas. The shower head 509 may include a stem portion including one end connected to the top surface of the processing chamber. The base portion is approximately cylindrical and extends radially outward from the opposite end of the stem portion, spaced from the top surface of the processing chamber. The surface or face plate of the base portion of the shower head facing the substrate contains multiple holes through which process gas or purge gas flows. Alternatively, the upper electrode 504 may include a conductive plate and the process gas may be introduced in another manner. The lower electrode 507 may be arranged in a non-conductive pedestal. Alternatively, the pedestal 506 may include an electrostatic chuck containing a conductive plate that functions as a lower electrode 507.

The RF generation system 510 generates an RF voltage and outputs it to one of the upper electrode 504 and the lower electrode 507. The other of the upper electrode 504 and the lower electrode 507 may be DC grounded, AC grounded, or floating. As a mere example, the RF generation system 510 may include an RF voltage generator 511 that produces the RF voltage supplied to the upper electrode 504 or the lower electrode 507 by the matching distribution network 512. In another example, the plasma may be inductively or remotely generated.

The gas supply system 530 includes one or more gas sources 532-1, 532-2, ..., And 532-N (collectively gas source 532), where N is an integer greater than zero. be. The gas source provides one or more precursors and mixtures thereof. The gas source may also provide purge gas. Vaporized precursors may also be used. The gas sources 532 are valves 534-1, 534-2, ..., And 534-N (collectively valve 534) and mass flow controllers 536-1, 536-2, ..., And 536-N (collectively). It is connected to the manifold 540 by the mass flow controller 536). The output of the manifold 540 is supplied to the processing chamber 502. As a mere example, the output of the manifold 540 is supplied to the shower head 509.

The heater 542 may be connected to a heater coil (not shown) located on the pedestal 506. The heater 542 may be used to control the temperature of the pedestal 506 and the substrate 508. A valve 550 and a pump 552 may be used to expel the reactants from the processing chamber 502. A controller 560 may be used to control the components of the substrate processing chamber 500. The controller 560 may also be used to control the actuator 505 to adjust the position of one or more portions of the edge coupling ring 503.

A robot 570 and a sensor 572 may be used to measure the erosion of the edge coupling ring. In some examples, the sensor 572 may include a depth gauge. Robot 570 may move the depth gauge in contact with the edge coupling ring to measure erosion. Alternatively, a laser interferometer (with or without robot 570) may be used to measure erosion without direct contact. The robot 570 may be omitted if the laser interferometer can be placed with a direct line of sight to the edge coupling ring.

Here, as shown with reference to FIG. 10, an example of method 600 for manipulating the actuator to move the edge coupling ring is shown. At 610, at least a portion of the edge coupling ring is placed in a first position with respect to the substrate. At 614, the substrate processing system is operated. The operation may include etching the substrate or other processing. At 618, the control determines whether a predetermined etching period or a predetermined number of etching cycles have occurred. As determined in 618, if the predetermined period or number of cycles is not exceeded, control returns to 614.

When the predetermined period or number of cycles is increased, the control controls at 624 whether the predetermined maximum etching period has been increased, the maximum number of etching cycles has occurred, and / or the maximum number of actuator movements #. Is determined.

If 624 is false, the control uses an actuator to move at least a portion of the edge coupling ring. The movement of the edge coupling ring can be performed automatically, manually or in combination without opening the processing chamber. If 624 is true, control sends a message or indicates that the edge coupling ring needs to be repaired / replaced.

Here, as shown with reference to FIG. 11, an example of a method 700 for manipulating the actuator to move the edge coupling ring is shown. At 710, at least a portion of the edge coupling ring is placed in a first position with respect to the substrate. At 714, the substrate processing system is operated. The operation may include etching the substrate or other processing. At 718, the control uses a sensor such as a depth gauge or a laser interferometer to determine if a predetermined amount of erosion of the edge coupling ring has occurred. If 718 is false, control returns to 714.

When a predetermined amount of erosion has occurred, the control determines at 724 whether or not the maximum amount of erosion has occurred. If 724 is false, the control uses an actuator to move at least a portion of the edge coupling ring. The movement of the edge coupling ring can be performed automatically, manually or in combination without opening the processing chamber. If 724 is true, control sends a message or indicates that the edge coupling ring needs to be repaired / replaced.

In addition to the above, the determination of whether or not the edge coupling ring needs to be moved may be based on inspection of the etching pattern of the treated substrate. Actuators may be used to adjust the edge coupling profile of the edge coupling ring without opening the chamber.

As shown herein with reference to FIG. 12, the processing chamber 800 includes an edge coupling ring 60 disposed on the pedestal 20. The edge coupling ring 60 includes one or more portions that are movable by one or more actuators 804 located outside the processing chamber 800. In this example, the portion 72 is movable. Actuator 804 may be connected to portion 72 of the edge coupling ring 60 by a mechanical linkage 810. For example, the mechanical linkage 810 may include a rod member. The mechanical linkage 810 may pass through the hole 811 in the wall 814 of the processing chamber 800. A seal 812 such as an "O" ring may be used. The mechanical linkage 810 may pass through holes 815 in one or more structures, such as portion 76 of the edge coupling ring 60.

The left-right tilt of the edge coupling ring 830 is shown here, as shown with reference to FIGS. 13A and 13B. The left-right tilt may be used to correct the left-right shift. In FIG. 13A, the portions 830-1 and 830-2 of the edge coupling ring 830 on the opposite side of the substrate are arranged in the first arrangement 840. The portions 830-1 and 830-2 may generally be aligned with the portions 832-1 and 832-2 of the edge coupling ring 830. Actuators 836-1 and 836-2 are arranged between portions 830-1 and 832-1 and 830-2 and 832-2, respectively.

In FIG. 13B, actuators 836-1 and 836-2 each move the edge coupling ring 830 to a second arrangement 850 that is different from the first arrangement 840 shown in FIG. 13A. Move the part of. As will be appreciated, the substrate may be inspected after processing and the tilt with respect to the substrate may be adjusted as needed without opening the processing chamber.

As shown with reference to FIG. 14, a method 900 for moving the edge coupling ring during substrate processing is shown. In other words, different processes may be performed on a single substrate in the same processing chamber. The edge coupling effect of the edge coupling ring may be adjusted between multiple processes performed on the substrates in the same processing chamber before proceeding to the next substrate. At 910, the substrate is placed on the pedestal and the position of the edge coupling ring is adjusted as needed. At 914, the processing of the substrate is executed. At 922, the substrate is moved from the pedestal if the processing of the substrate is performed as determined at 918. At 924, the control determines if another substrate needs to be processed. If 924 is true, the method returns to 910. If not, the method ends.

If 918 is false and the substrate requires additional processing, the method determines at 930 whether adjustment of the edge coupling ring is necessary. If 930 is false, the method returns to 914. If 930 is true, at 934, using one or more actuators, at least a portion of the edge coupling ring is moved and the method returns to 914. As will be appreciated, the edge coupling ring can be coordinated between processes of the same substrate in the same processing chamber.

As shown herein with reference to FIG. 15, the edge coupling ring 1014 and the lifting ring 1018 are arranged adjacent to and around the top surface of the pedestal 1010. The edge coupling ring 1014 includes a radial inner edge placed adjacent to the substrate during etching as described above. The lifting ring 1018 is located below at least a portion of the edge coupling ring 1014. The lifting ring 1018 is used to lift the edge coupling ring 1014 onto the surface of the pedestal 1010 when the robot arm is used to remove the edge coupling ring 1014. The edge coupling ring 1014 can be removed without the need to open the processing chamber to atmospheric pressure. In some examples, the lifting ring 1018 is optionally a circumferentially spaced end 1020 to provide clearance for the robotic arm to remove the edge coupling ring 1014, as described below. An opening 1019 may be included in between.

Here, examples of the edge coupling ring 1014 and the lifting ring 1018 are shown in more detail, as shown with reference to FIGS. 16-17. In the example shown in FIG. 16, the pedestal may include an electrostatic chuck (ESC) commonly identified by 1021. ESC1021 may include one or more laminated plates such as ESC plates 1022, 1024, 1030, and 1032. The ESC plate 1030 may correspond to an intermediate ESC plate and the ESC plate 1032 may correspond to an ESC base plate. In some examples, an O-ring 1026 may be placed between the ESC plates 1024 and 1030. Although specific pedestals 1010 are shown, other types of pedestals may be used.

The bottom edge coupling ring 1034 may be located below the edge coupling ring 1014 and the lifting ring 1018. The bottom edge coupling ring 1034 may be adjacent to the ESC plates 1024, 1030 and 1032 and the O-ring 1026 and may be located radially outside of them.

In some examples, the edge coupling ring 1014 may include one or more self-centering mechanisms 1040, 1044, and 1046. As a mere example, the self-centering mechanisms 1040 and 1044 may be triangular female self-centering mechanisms, but other shapes may be used. The self-centering mechanism 1046 may be an inclined surface. The lifting ring 1018 may include one or more self-centering mechanisms 1048, 1050, and 1051. As a mere example, the self-centering mechanisms 1048 and 1050 may be triangular male self-centering mechanisms, but other shapes may be used. The self-centering mechanism 1051 may be an inclined surface having a shape complementary to the self-centering mechanism 1046. The self-centering mechanism 1048 on the lifting ring 1018 may be fitted to the self-centering mechanism 1044 on the edge coupling ring 1014. The self-centering mechanism 1050 on the lifting ring 1018 may be fitted to the self-centering mechanism 1052 of the bottom edge coupling ring 1034.

The lifting ring 1018 further includes a protrusion 1054 extending radially outward. The groove 1056 may be located on the surface 1057 facing the bottom surface of the protrusion 1054. The groove 1056 is configured to be connected to the actuator 1064 and urged by one end of a pillar 1060 that is selectively moved vertically by the actuator 1064. Actuator 1064 may be controlled by a controller. As can be understood, a single groove, pillar, and actuator are shown, but additional grooves, pillars, and actuators are used around the lifting ring 1018 to urge the lifting ring 1018 upwards. They may be arranged in the circumferential direction at intervals.

In FIG. 17, the edge coupling ring 1014 is shown raised upward by the lifting ring 1018 using the pillar 1060 and the actuator 1064. The edge coupling ring 1014 can be removed from the processing chamber by a robot arm. More specifically, the robot arm 1102 is connected to the edge coupling ring 1014 by the holder 1104. The holder 1104 may include a self-centering mechanism 1110 that fits into a self-centering mechanism 1040 on the edge coupling ring 1014. As will be appreciated, the robot arm 1102 and holder 1104 may urge the edge coupling ring upwards to release the self-centering mechanism 1048 on the lifting ring 1018. The robot arm 1102, holder 1104, and edge coupling ring 1014 can then be moved out of the processing chamber. The robot arm 1102, holder 1104, and new edge coupling ring can be returned to and placed in the lifting ring 1018. Next, the lifting ring 1018 is lowered. The reverse operation may be used to supply the new edge coupling ring 1014 to the lifting ring 1018.

Alternatively, instead of lifting the robot arm 1102 and holder 1104 upward to lift the edge coupling ring 1014 from the lifting ring 1018, the robot arm 1102 and holder 1104 come into contact under the raised edge coupling ring 1014. Can be placed. The lifting ring 1018 is then lowered and the edge coupling ring 1014 remains on the robot arm 1102 and holder 1104. The robot arm 1102, holder 1104, and edge coupling ring 1014 can be removed from the processing chamber. The reverse operation may be used to supply the new edge coupling ring 1014 to the lifting ring 1018.

Here, as shown with reference to FIGS. 18-20, the movable edge coupling ring 1238 and the lifting ring 1018 are shown. In FIG. 18, one or more pillars 1210 are moved up and down by one or more actuators 1214 through holes 1220, 1224, and 1228, respectively, of the ESC base plate 1032, the bottom edge coupling ring 1034, and the lifting ring 1018. To. In this example, an intermediate edge coupling ring 1240 or spacer is placed between the movable edge coupling ring 1238 and the lifting ring 1018. The intermediate edge coupling ring 1240 may include self-centering mechanisms 1244, 1246. The corresponding self-centering mechanism 1248 may be provided on the movable edge coupling ring 1238. The self-centering mechanism 1248 fits with the self-centering mechanism 1246 on the intermediate edge coupling ring 1240.

As described in detail above, erosion of the upper facing surface of the movable edge coupling ring 1238 may occur during use. This may change the profile of the plasma. The movable edge coupling ring 1238 may be selectively moved upwards using pillars 1210 and actuators 1214 to change the profile of the plasma. In FIG. 19, the movable edge coupling ring 1238 of FIG. 18 is shown in the ascending position. The intermediate edge coupling ring 1240 may remain stationary. Finally, the movable edge coupling ring 1238 may be moved once or multiple times, after which the edge coupling ring 1238 and the intermediate edge coupling ring 1240 may be replaced.

In FIG. 20, the actuator 1214 is returned to the lowered state, and the actuator 1064 is moved to the raised state. The edge coupling ring 1238 and the intermediate edge coupling ring 1240 may be lifted by the lifting ring 1018, and the movable edge coupling ring 1238 may be removed by the robot arm 1102 and holder 1104.

As will be appreciated, the actuator may be placed in or out of the processing chamber. In some examples, the edge coupling ring may be provided to the chamber via a cassette, load lock, moving chamber, and the like. Alternatively, the edge coupling ring may be housed outside the processing chamber but inside the substrate processing tool.

As shown here with reference to FIGS. 21-22, in some examples the lifting ring may be omitted. The edge coupling ring 1310 is located on the bottom edge coupling ring 1034 and on the radial outer edge of the pedestal. The edge coupling ring 1310 may include one or more self-centering mechanisms 1316, 1320. The edge coupling ring 1310 may further include a groove 1324 for receiving the top surface of the pillar 1210 urged by the actuator 1214. The self-centering mechanism 1320 may be disposed to face the corresponding self-centering mechanism 1326 of the bottom edge coupling ring 1034. In some examples, the self-centering mechanisms 1320, 1326 are inclined surfaces.

In FIG. 22, actuators 1214 and pillars 1210 urge the edge coupling ring 1310 upward to remove the edge coupling ring 1310 or to adjust the plasma profile after erosion has occurred. The robot arm 1102 and holder 1104 may be moved to a position below the edge coupling ring 1310. The self-centering mechanism 1316 may be engaged by the self-centering mechanism 1110 on the holder 1104 connected to the robot arm 1102. The robot arm 1102 is moved upward to provide clearance between the groove 1324 and the pillar 1210, or the pillar 1210 is moved downward by the actuator 1214 to provide clearance for the groove 1324. To.

As shown herein with reference to FIG. 23, a method 1400 for replacing the edge coupling ring without opening the processing chamber to atmospheric pressure is shown. At 1404, the method determines if the edge coupling ring is located on the lifting ring. If 1404 is false, the method uses a robotic arm at 1408 to move the edge coupling ring to a position on the lifting ring. Processing is performed at 1410 after the edge coupling ring is placed on the lifting ring in the processing chamber. At 1412, the method uses any of the above criteria to determine if the edge coupling ring is worn. If 1412 is false, the method returns to 1410 and the process may be run again. If at 1412 it is determined that the edge coupling ring is worn, then at 1416 the edge coupling ring is replaced and the method follows 1410 .

As shown herein with reference to FIG. 24, method 1500 adjusts the position of the movable edge coupling ring, if necessary, to offset due to erosion, and the movable edge coupling ring is worn. If it is determined, the movable edge coupling ring is selectively replaced. At 1502, the method determines if the movable edge coupling ring is located on the lifting ring. If 1502 is false, the edge coupling ring is moved to a position on the lifting ring at 1504 and the method follows 1502.

If 1502 is true, the method determines in 1506 whether the position of the movable edge coupling ring needs to be adjusted. If 1506 is true, the method adjusts the position of the movable edge coupling ring using an actuator and returns to 1506. If 1506 is false, the method performs processing at 1510. At 1512, the method determines if the movable edge coupling ring is worn. If false, the method returns to 1510.

If 1512 is true, the method determines at 1520 whether the movable edge coupling ring is in the best (ie, fully tuned) position. If 1520 is false, the method adjusts the position of the movable edge coupling ring at 1524 using the actuator 1214 and the method returns to 1510. If 1520 is true, the method uses actuator 1064, lifting ring 1018, and robot arm 1102 to replace the movable edge coupling ring.

As shown herein with reference to FIG. 25, a method 1600 for replacing the edge coupling ring without opening the processing chamber to atmospheric pressure is shown. At 1610, the lifting ring and the edge coupling ring are urged upward using an actuator. At 1620, the robot arm and holder are moved under the edge coupling ring. At 1624, the robot arm is moved upwards to release the self-centering mechanism of the edge coupling ring, or the lifting ring is moved downwards. At 1628, the robot arm is moved out of the processing chamber along with the edge coupling ring. At 1632, the edge coupling ring is detached from the robot arm. At 1636, a replacement edge coupling ring is picked up by the robot arm. At 1638, the edge coupling ring is placed on the lifting ring and aligned using one or more self-centering mechanisms. At 1642, the robot arm is lowered and the robot arm is removed from the chamber to allow sufficient clearance for the self-centering mechanism. At 1646, the lifting ring and the edge coupling ring are lowered to position.

Here, as shown with reference to FIG. 26, the characteristics of detecting the state and position of the edge coupling ring are described. This explanatory part focuses on detectors and detection methods according to the characteristics of the present invention and allows direct measurement of edge coupling ring height and erosion. Details of the various elements of the processing chamber, including the ESC, edge coupling ring, controller, and actuator, have been provided earlier and are not repeated here for brevity and clarity.

In FIG. 26, the processing chamber 1710 has a window 1715 located above the top of the chamber. An electrostatic chuck (ESC) 1725 is attached to the pedestal 1720 in the chamber 1710. Adjacent to the ESC1725 are actuator mechanisms 1730, 1735 that move the edge coupling ring 1740 horizontally and / or vertically, as described above. The actuator mechanism 1730, 1735, or both may be installed as described with respect to the previous figure. Wafer 1750 is located on the ESC1725 in the edge coupling ring 1740.

The camera 1760 is mounted to the mounting mechanism 1765 to view the edge coupling ring 1740 via the side view port 1770 in chamber 1710. The mounting mechanism 1765 can be a bracket, docking mechanism, or other suitable mounting mechanism that allows proper vertical and / or horizontal movement of the camera 1760 with respect to the side view port 1770, at the appropriate portion of the edge coupling ring 1740. It may allow for proper focusing of the camera 1760. In one feature, the side view port 1770 includes a shutter 1775 to protect the material in the port during wafer processing. In one feature, the shutter 1775 operates using a pneumatic gate valve.

In one feature, as illustrated, the mounting mechanism 1765 mounts the camera 1760 to the chamber 1710. In another feature, the mounting mechanism 1765 mounts the camera 1760 on the structure next to the chamber 1710.

In some features, the controller (shown in the previous figure) controls the actuation, focusing, and positioning of the camera 1760. In some features, a separate controller 1800 provides one or more of camera activation, focusing, and positioning. In some features, the camera itself provides its own focusing mechanism, but one of the controllers described here complements the focusing of the camera itself based on the individual analysis of the images provided. do.

In another feature, the camera 1760 is installed so that it can be seen through the window 1715. In FIG. 26, the camera 1760 is shown as focused on the inner edge of the edge coupling ring 1740. The edge coupling ring 1740 is depicted in its new state when installed in chamber 1710.

The camera 1760 has sufficient resolution (eg, number of pixels) to allow determination of the state and position of the edge coupling ring 1740 and to generate an image of appropriate size that provides a direct measurement of ring height and ring erosion. Consists of. In some features, the camera uses a macro lens to operate in macro (close-up) mode. In another feature, the lens may be an optical zoom lens that provides the appropriate magnification. Any combination of pixel count and magnification (macro, optical zoom, or, in some features, digital zoom) capable of generating sufficient information (eg, an image) to determine the state and position of the ring is acceptable. In some features, the camera 1760 may operate using high dynamic range (HDR) imaging in combination with macro photography and / or zoom photography.

In one feature, the plasma light is good enough because there is enough light in the chamber 1710 to illuminate the edge coupling ring 1740. In another feature, an external lighting source such as a light emitting diode (LED) light source is provided. In FIG. 27, in addition to the elements depicted in FIG. 26, in some features the external illuminator 1780 provides illumination within the chamber 1710. In one feature, as shown, the mounting mechanism 1785 mounts the illuminator 1780 to the chamber 1710. In another feature, the mounting mechanism 1785 mounts the illuminator 1780 on the structure next to the chamber 1710. In one feature, the illuminator 1780 is attached to the camera 1760. According to various features, the installation is mechanical, electrical, or both. In some features, an additional side view port 1790 is provided through which the illuminator 1780 illuminates the light into the chamber 1710. The mounting mechanism 1785 may be a bracket, docking mechanism, or other suitable mounting mechanism that allows proper vertical and / or horizontal movement of the camera 1760 with respect to the side view port 1790. In some features, the additional side view port 1790 is on the same side surface of the chamber 1710 as the side view port 1770. In another feature, the additional side view port 1790 may be on the side of the chamber 1710, which is different from the side view port 1770. In one feature, the side view port 1790 includes a shutter 1795 to protect the material in the port during wafer processing. In one feature, the shutter 1795 operates using a pneumatic gate valve. In yet another feature, the illuminator 1780 illuminates light through the same side view port 1770 used by the camera 1760, in which case a separate side view port 1790 is not required.

To facilitate illustration of the two side view ports 1770, 1790 individually, the chamber 1710 is shown in FIG. 27 as slightly higher than in FIG. 26, but in some features the chamber is , The size is the same in both figures. If the plasma light acts as a light source, no additional side view port 1790 is needed.

During operation, the focus and / or position of the camera 1760 can drift. In one feature, controller 1800 monitors the focus and position of camera 1760 and makes appropriate adjustments.

FIG. 28 has all of the same elements as in FIG. 27, but the edge coupling ring 1740'is shown to be eroded, with the inner radius being shorter than the outer radius. As mentioned earlier, this erosion or etching occurs as the wafer processing system processes more and more wafers. Also, as mentioned above, if the camera 1760 provides an image showing that the edge coupling ring is too corroded to perform the function of controlling etching at the edges of the wafer, the controller 560 will optionally. One or both actuators 1730, 1735 are controlled to move the edge coupling ring 1740'vertically. In one feature, the controllers 560 and 1800 communicate with each other and the controller 560 operates an appropriate actuator in response to image data from the controller 1800.

29A is an enlarged view of the opening 1015 in the liner 1012 shown in the plan view of FIG. The opening appears in the side view of the liner. The liner 1012 serves as a fixed reference that the camera can focus on to capture an image of the position and state of the edge coupling ring.

29B and 29C show images of good and poor edge coupling ring arrangements for opening 1015 in the liner 1012, respectively. In these figures, the edge coupling ring is at the bottom of each image. The dark part in each figure is a part of the opening 1015. The height consistency of the dark areas indicates the quality of the placement. In one feature, the height of the dark area is determined by counting the number of vertical dark pixels along the vertical axis of the center of the dark area. In FIG. 29B, the relative equivalence of the heights of the dark areas, and the size of those areas, indicate that the edge coupling rings are properly placed. In FIG. 29C, the height mismatch of the dark portion and the relatively short height of the dark portion on the right side of the figure indicate that the edge coupling ring is tilted.

30A-30C show raw images of various heights and states of the edge coupling ring 1740 taken in the chamber. FIG. 30A is of 3.0, 3.2, 3.4, 3.6, 3.8, and 4.0 mm, as seen in the six images arranged side by side to form FIG. 30A. The state of the new edge coupling ring with height is shown. FIG. 30B shows the state of the worn edge coupling ring prior to recalibration and ascent of the ring at the same height as FIG. 30A. FIG. 30C shows the state of the worn edge coupling ring after recalibration and ascent of the ring at the same heights as FIGS. 30A and 30B.

In one feature, the raw image as shown in FIGS. 30A-30C, in the first case, sees several different ring heights and ring states and again sees the opening 1015 in the liner 1012 of FIG. It may be used to calibrate the camera by using it as a fixed reference. In one feature, calibration may be performed as follows. First, when a new edge coupling ring is installed, images may be taken at several different ring heights, for example, using one or more actuators to raise or lower the ring. Measuring various heights of the ring on a pixel-by-pixel basis and comparing those measurements to physical measurements provides a gauge that allows the transition edge sensor (TES) to be calibrated, thereby calibrating the camera. .. Calibration can help to account for camera drift, whether in focus or focal length (magnification). For example, the height measurement value may change because the relationship between the number of pixels and the number of μm changes due to the drift of the magnification.

FIG. 31 shows an alternative method of directly measuring the erosion of the edge coupling ring. In FIGS. 26-28, the camera 1760 is aimed directly onto the inner edge of the edge coupling ring. However, in this figure, the camera may tend to provide an image of the entire top surface of the edge coupling ring, thus potentially hiding or masking the actual amount of erosion. It is difficult to distinguish the edge from the rest of the top surface of the ring, making it difficult to measure the height of the inner edge of the edge coupling ring. The image may appear blurry. It is desirable to have a clear view of the front edge in order to measure its height (in terms of the number of pixels converted into units of height such as μm) and thereby determine the degree of erosion.

For this purpose, in FIG. 31, the camera 1760 can pick up reflections inside the edge coupling ring instead of looking directly inside the edge coupling ring. Reflections can occur from the surface of the ESC1725 or from the surface of the wafer 1750. Either or both surfaces may have reflective properties. Looking at the reflections, the camera 1760 then picks up the reflections 1840'of the edge coupling ring 1840. (The dotted line indicates the eroded portion 1845 and its "reflection" 1845'.)

By looking at the reflections of the edge-coupling ring instead of looking at the ring itself, the perspective problem is avoided. In some cases, the height of the inner edge of the edge-coupling ring may be measured directly to allow a clearer determination of the state of the edge-coupling ring.

Looking at the reflections of the edge-coupling rings can also limit the detectability of ring erosion. Since erosion occurs inside the edge coupling ring, erosion reduces the height of the inner edge of the ring relative to the outer edge. The greater this decrease, the greater the degree to which the top surface of the ring is effectively tilted. At some point, the degree of "tilt" can be so great that it becomes difficult to distinguish the inner edges of the ring of reflection, and as a result, measuring the height of the inner edges, and thus erosion. Makes it difficult to measure the degree of. Failure to determine the extent of erosion can cause premature or too late adjustment of the height of the ring using actuators, or even premature or even late replacement of the ring. As a result, the edge coupling ring is replaced too early, wasting the service life of the ring, or the ring is raised or replaced too late, resulting in variations in the etching profile near the radial outer edge of the wafer. .. In one feature, as the erosion progresses, it can be compensated by increasing the angle at which the camera 1760 sees the reflected image.

FIG. 32 shows a method of mounting an edge coupling ring using an image from a camera. After the method started in 1910, in 1920 the robot mounts an edge coupling ring on the ESC. At 1930, the camera is focused to identify the inner edge of the ring. As mentioned above, the camera can be focused on either the inner edge of the edge coupling ring, or the reflection of the ring on the ESC or wafer.

At 1940, the camera captures an image of the edge coupling ring relative to a fixed reference such as the lifting ring of FIG. At 1950, the image is processed and analyzed to determine if the rings are vertically aligned, i.e., if the edge coupling ring is tilted (eg, as shown in FIG. 29B). .. If there is a tilt, at 1955, the controller 560 controls one or more of the actuators to compensate for the tilt, the method returns to 1940, and further images are acquired to determine if there is still tilt. Check again (at 1950).

If the edge coupling ring is not tilted, at 1960, the acquired image is reused to determine if the edge coupling ring is at the correct height. If the ring is not at the correct height, in 1965 the controller 560 controls one or more of the vertical actuators to correct the height, the method returns to 1940, further image acquisition and edge coupling. Check again (at 1960) if the ring is at the correct height. In one feature, if the tilt has already been adjusted, the 1950 can be skipped and the method can go directly from 1940 to 1960. In another feature, tilt and height are increased by combining 1950 and 1960 into a single analysis, 1955 and 1965 into a single process, and controller 560 controlling the vertical actuator in a single action. , Can be measured and adjusted in a single step.

If the edge bond is at an appropriate height and is vertically aligned, in 1970 it is determined whether the edge bond ring is horizontally aligned on the ESC. If not aligned horizontally, in 1975, controller 560 moves the edge coupling ring to one or more of the horizontal actuators, after which the method returns to 1940 to acquire further images and edges. Check again (in 1960) if the coupling rings are aligned horizontally. In one feature, if the vertical alignment has already been adjusted, 1950 and 1960 can be skipped and the method can proceed directly from 1940 to 1970.

In the method shown in FIG. 32, vertical alignment and horizontal alignment need not be determined in the indicated sequence. The sequence can be reversed, first adjusting the horizontal alignment and then adjusting the vertical alignment. In one feature, the controller 560 can receive all of the information regarding the positioning of the edge coupling ring and immediately control a large number of actuators to align the edge coupling ring. According to this feature, 1950, 1960, and 1970 can be combined into a single analysis, and 1955, 1965, and 1975 can be combined into one process.

FIG. 33 shows how to adjust the edge coupling ring using images from the camera. After the method is started in 2010, it is determined in 2020 whether a predetermined period has elapsed since the ring was installed and the wafer processing was started. If not determined to have passed, the method returns to 2020 to see if a predetermined period has passed.

In one feature, in 2020, instead of waiting for a predetermined period, it is determined whether or not a predetermined number of processing cycles have occurred. If not determined to have occurred, the method returns to 2020 to check the number of cycles again.

At 2030, the camera is focused to identify the inner edge of the ring if a predetermined period of time has elapsed or a predetermined number of processing cycles have occurred. As mentioned above, the camera can be focused on either the inner edge of the edge coupling ring or the reflection of the ring on the ESC or wafer. At 2040, a focal image of the edge coupling ring relative to the fixation reference is imaged and the height of the inner edge of the ring is measured. If at 2050 it is determined that its inner edge is at least at a predetermined height on the surface of the wafer, at 2055 it is determined to wait for a predetermined period of time. In one feature, instead of waiting for a predetermined period, it is determined to wait for a predetermined number of wafer processing cycles. After a predetermined period of time or a predetermined number of cycles have occurred, the method returns to 2030, where the camera is refocused, then back to 2040, where more images are taken, and the decision at 2050 is repeated. Is done.

If it is determined that the inner edge of the edge coupling ring is not at least a predetermined height on the surface of the wafer, at 2060 the controller 560 controls the vertical actuator to raise the edge coupling ring. At 2070, it is determined whether or not there have been a predetermined number of cycles since the edge coupling ring was installed. If it is not determined that there have been a predetermined number of cycles, the method returns to 2055 and waits for a predetermined period of time. In one feature, the method can wait a predetermined number of cycles at 2055.

If it is determined in 2070 that a predetermined number of cycles have elapsed, then in 2080 the edge coupling ring is replaced. In one feature, instead of ascertaining whether a predetermined number of cycles have passed, the amount of actuator elongation can be measured. If the actuator elongation exceeds a predetermined amount, it may be determined that the edge coupling ring needs to be replaced. In another feature, it may be determined whether a predetermined period of time has passed since the installation of the edge coupling ring, rather than one of the previous options. After such a period, it may be determined that the edge coupling ring needs to be replaced.

After the edge coupling ring has been replaced, the method can be terminated at 2090 or returned to begin.

The above description is merely exemplary in nature and is by no means intended to limit disclosure, application, or use. The broad teachings of the present disclosure can be carried out in various forms. Accordingly, the present disclosure includes certain examples, but the true scope of the present disclosure is so limited as the drawings, the specification, and the appended claims reveal other amendments. Should not be. As used herein, the phrase A, B, and at least one of C should be construed to mean logic (A or B or C) that uses a non-exclusive logical OR. And should not be construed to mean "at least one of A, at least one of B, and at least one of C". It should be understood that one or more steps within the method may be performed in different order (or simultaneously) without altering the principles of the present disclosure.

In some implementations, the controller is part of the system, which may be part of the above example. Such systems include one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). Can be equipped with semiconductor processing equipment including. These systems may be integrated with electronic devices to control pre-processing, in-processing, and post-processing operations of semiconductor wafers or substrates. The electronic device is called a "controller" and may control various components or subparts of one or more systems. The controller can supply processing gas, temperature settings (eg heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, depending on the processing requirements and / or system type. RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position and operation settings, moving wafers to and from tools and other moving tools, and / or loading connected or interfaced to a particular system. It may be programmed to control any of the processes disclosed herein, including locking.

In general, a controller receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc., various integrated circuits, logic, memory, and / or , May be defined as an electronic device with software. Integrated circuits are chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors, or programs. It may include a microcontroller that executes instructions (eg, software). Program instructions are instructions that are communicated to the controller in the form of various individual settings (or program files) that define operating parameters on or for semiconductor wafers or to perform specific operations on the system. It may be there. In some embodiments, the operating parameters are one or more during the manufacture of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies. May be part of a recipe defined by a processing engineer to accomplish the processing steps of.

The controller, in some implementations, may be part of a computer that is integrated with the system, coupled to the system, or otherwise networked to the system, or a combination thereof. May be combined with this computer. For example, the controller may be in the "cloud" or in whole or in part of the fab host computer system, which may allow remote access to wafer processing. The computer has remote access to the system to change the parameters of the current process, to set the process steps that follow the current process, or to start a new process, but the current progress of the manufacturing operation. Allows you to monitor the history of past manufacturing operations and to determine trends or performance indicators from multiple manufacturing operations. In some examples, a remote computer (eg, a server) can provide processing recipes to the system over a local network or a network that may include the Internet. The remote computer may include a user interface that allows input or programming of parameters and / or settings communicated from the remote computer to the system. In some examples, the controller receives an instruction in the form of data, which specifies the parameters of each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool the controller is configured to interface with or control. Thus, as described above, the controllers are both networked and distributed, such as by including one or more discrete controllers operating towards a common purpose, such as the processes and controls described herein. It's okay. Examples of distributed controllers for such purposes communicate with one or more remotely located integrated circuits combined (at the platform level or as part of a remote computer) to control processing in the chamber. One or more integrated circuits on the chamber.

Exemplary systems include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, clean chambers or modules, bevel edge etching chambers or modules, physical deposition (PVD). Manufacture of chambers or modules, chemical deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion injection chambers or modules, track chambers or modules, and semiconductor wafers. And / or may include any other semiconductor processing system that may be associated with or used in manufacturing.

As mentioned above, depending on one or more processing steps to be performed by the tool, the controller may have other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighbors. Of the tools used in material transfer that bring a container of wafers to and from the tool, factory-wide tool, main computer, another controller, or tool location and / or load port within a semiconductor manufacturing plant. You may communicate with one or more of them.
The present invention can also be realized, for example, in the following aspects.
Application example 1:
It is a board processing system
A processing chamber with a first observation port and
With the pedestal placed in the processing chamber,
A liner that surrounds the pedestal and has at least one opening.
An edge coupling ring arranged adjacent to the pedestal, the edge coupling including a first portion located outside and around the radial outer edge of the substrate when the substrate is disposed on the pedestal. With the ring
In order to change the edge coupling profile of the edge coupling ring, the first portion of the edge coupling ring is placed inside (i) the substrate and (ii) radially inside the first portion. An actuator configured to selectively move relative to a second portion of the edge coupling ring, said first to at least one position where the top surface of the first portion is above the top surface of the substrate. An actuator configured to move part 1 and
The detector system comprises a detector system configured to detect the state of the edge coupling ring.
A camera configured to acquire image data of the plasma-facing surface of the edge-coupled ring via the first observation port.
A substrate processing system comprising a first controller configured to receive the image data and determine at least one of the states and positions of the plasma facing surface of the edge coupling ring.
Application example 2:
The detector system further comprises a lighting device configured to provide light for the camera to acquire the image data of the edge coupling ring, the substrate processing system of Application Example 1.
Application example 3:
The lighting device is a substrate processing system of Application Example 2 in which light is provided through the first observation port.
Application example 4:
The substrate processing system of Application Example 2, wherein the processing chamber comprises a second observation port and the illuminator provides light through the second observation port.
Application example 5:
A gas supply system configured to supply the processing gas and carrier gas to the processing chamber, and
The substrate processing system of Application Example 1, further comprising a plasma generator configured to generate plasma in the processing chamber for etching the substrate.
Application example 6:
The substrate processing system of Application Example 5, wherein the plasma generator provides light for the camera to acquire the image data of the edge coupling ring.
Application example 7:
The substrate processing system of Application Example 1, wherein the actuator moves the edge coupling ring in a direction perpendicular to the substrate depending on a state indicating erosion of the surface of the edge coupling ring facing the plasma.
Application example 8:
The substrate processing system of Application Example 1 in which the actuator moves the edge coupling ring in the horizontal direction with respect to the substrate according to a state indicating a deviation of the edge coupling ring.
Application example 9:
The substrate processing system of Application Example 1, wherein the actuator moves the first portion of the edge coupling ring in a direction perpendicular to the substrate according to a state indicating a deviation of the edge coupling ring.
Application example 10:
An application further comprising a second controller configured to respond to the first controller so as to control the actuator to selectively move the first portion of the edge coupling ring. 1 board processing system.
Application example 11:
The second controller is the substrate processing system of Application Example 10, configured to enable replacement of the edge coupling ring in response to a determination of sufficient erosion of the edge coupling ring.
Application example 12:
The substrate processing system of Application Example 1, wherein the camera is aimed on the edge coupling ring in order to acquire the image data.
Application example 13:
The first application, further comprising an electrostatic chuck (ESC) disposed on the pedestal, wherein the camera is aimed at at least one of the substrate and the ESC to acquire the image data. Board processing system.
Application example 14:
The image data includes image data of a cross section of the edge coupling ring with respect to the at least one opening in the liner, and the first controller determines at least one of the states and positions of the edge coupling ring. The substrate processing system of Application Example 1 for calculating the height between the cross section of the edge coupling ring and the upper end of the at least one opening.
Application example 15:
The liner has a plurality of openings, the image data includes image data of the cross section of the edge coupling ring with respect to the plurality of openings in the liner, and the first controller is of the edge coupling ring. The plurality of heights between the cross section and the corresponding upper ends of the plurality of openings are calculated, and the first controller obtains at least one of the state and the position of the edge coupling ring. The substrate processing system of Application Example 14, which compares the plurality of heights to determine.
Application example 16:
The first controller is a substrate processing system according to Application Example 1, which adjusts the position of the camera according to the detection of the state of the edge coupling ring.
Application example 17:
A processing chamber having a first observation port, a pedestal arranged in the processing chamber, a liner surrounding the pedestal and having a plurality of openings, and an edge coupling arranged adjacent to the pedestal. In a substrate processing system comprising a ring, an edge coupling ring comprising a first portion arranged around and outside the radial outer edge of the substrate on the pedestal.
A detector system for detecting one or more of the states and positions of the edge coupling ring.
A camera that acquires image data of the edge coupling ring via the first observation port, and a camera.
It comprises a controller that receives the image data and determines at least one of said position and state and said position of the surface of the edge coupling ring facing the plasma.
The image data includes image data of a cross section of the edge coupling ring with respect to the plurality of openings in the liner, and the controller is provided between the cross section of the edge coupling ring and different upper ends of the plurality of openings. A detector system that calculates a plurality of heights of the controller and compares the plurality of heights in order to determine at least one of the state and the position of the edge coupling ring.
Application example 18:
The substrate processing system further comprises an electrostatic chuck (ESC) placed on the pedestal, the camera is aimed at the substrate and one of the ESCs to acquire the image data. , The detector system of application example 17.
Application example 19:
A method for determining at least one of the states and positions of an edge coupling ring in a substrate processing system.
Identifying the inner edge of the edge coupling ring
Acquiring the image data of the edge coupling ring with respect to the fixed reference,
Processing the image data to determine if the edge coupling rings are vertically aligned and
In response to the determination that the edge coupling rings are not aligned vertically, the edge coupling rings are adjusted in the vertical direction.
Determining whether or not the inner edge of the edge coupling ring is at a predetermined height.
In response to the determination that the inner edge of the edge coupling ring is not at the predetermined height, determining whether the edge coupling ring is vertically adjustable.
A method comprising adjusting the edge coupling ring vertically in response to a determination that the edge coupling ring is vertically adjustable.
Application example 20:
The method of Application Example 19, further comprising instructing the replacement of the edge coupling ring in response to a determination that the edge coupling ring is not vertically adjustable.
Application example 21:
Determining whether or not the edge coupling ring is vertically adjustable is determining whether or not there have been a predetermined number of semiconductor processing cycles from the installation of the edge coupling ring in the substrate processing system. The method of application example 19, including.
Application example 22:
Determining whether or not the edge coupling ring can be adjusted in the vertical direction means determining whether or not a predetermined time length has elapsed from the installation of the edge coupling ring in the semiconductor processing system. The method of application example 19, including.
Application example 23:
The method of Application Example 19, wherein determining whether the edge coupling ring is vertically adjustable comprises determining whether the edge coupling ring has been raised vertically to its upper limit.
Application example 24:
The method of Application Example 19, wherein adjusting the edge coupling ring vertically comprises adjusting one part of the edge coupling ring perpendicularly to another portion of the edge coupling ring.
Application example 25:
Determining whether the edge coupling rings are aligned horizontally and
The method of Application Example 19, further comprising adjusting the edge coupling ring horizontally in response to a determination that the edge coupling ring is not aligned horizontally.
Application example 26:
The method of Application 25, wherein adjusting the edge coupling ring horizontally comprises moving the edge coupling ring relative to a pedestal in the substrate processing system, wherein the substrate is placed on the pedestal.

Claims (26)

It is a board processing system
A processing chamber with a first observation port and
With the pedestal placed in the processing chamber,
A liner that surrounds the pedestal and has at least one opening.
An edge coupling ring arranged adjacent to the pedestal, the edge coupling including a first portion located outside and around the radial outer edge of the substrate when the substrate is disposed on the pedestal. With the ring
In order to change the edge coupling profile of the edge coupling ring, the first portion of the edge coupling ring is placed inside (i) the substrate and (ii) radially inside the first portion. An actuator configured to selectively move relative to a second portion of the edge coupling ring, said first to at least one position where the top surface of the first portion is above the top surface of the substrate. An actuator configured to move part 1 and
The detector system comprises a detector system configured to detect the state of the edge coupling ring.
A camera configured to acquire image data of the plasma-facing surface of the edge-coupled ring via the first observation port.
A substrate processing system comprising a first controller configured to receive the image data and determine at least one of the states and positions of the plasma facing surface of the edge coupling ring. The substrate processing system of claim 1, wherein the detector system further comprises a lighting device configured to provide light for the camera to acquire the image data of the edge coupling ring. .. The substrate processing system according to claim 2, wherein the illuminating device provides light through the first observation port. The substrate processing system of claim 2, wherein the processing chamber comprises a second observation port and the illuminator provides light through the second observation port. A gas supply system configured to supply the processing gas and carrier gas to the processing chamber, and
The substrate processing system of claim 1 , further comprising a plasma generator configured to generate plasma in the processing chamber for etching the substrate. The substrate processing system of claim 5, wherein the plasma generator provides light for the camera to acquire the image data of the edge coupling ring. The substrate processing system according to claim 1, wherein the actuator moves the edge coupling ring in a direction perpendicular to the substrate depending on a state indicating erosion of the surface of the edge coupling ring facing the plasma. .. The substrate processing system according to claim 1, wherein the actuator moves the edge coupling ring in a horizontal direction with respect to the substrate according to a state indicating a deviation of the edge coupling ring. The substrate processing system according to claim 1, wherein the actuator moves the first portion of the edge coupling ring in a direction perpendicular to the substrate according to a state indicating a deviation of the edge coupling ring. Claimed further comprising a second controller configured to respond to the first controller so as to control the actuator to selectively move the first portion of the edge coupling ring. The substrate processing system according to 1. The substrate processing system according to claim 10, wherein the second controller is configured to enable replacement of the edge coupling ring in response to a determination of sufficient erosion of the edge coupling ring. The substrate processing system according to claim 1, wherein the camera is aimed on the edge coupling ring in order to acquire the image data. 1 according to claim 1, further comprising an electrostatic chuck (ESC) disposed on the pedestal, wherein the camera is aimed at at least one of the substrate and the ESC to acquire the image data. The substrate processing system described. The image data includes image data of a cross section of the edge coupling ring with respect to the at least one opening in the liner, and the first controller determines at least one of the states and positions of the edge coupling ring. The substrate processing system of claim 1, wherein the height between the cross section of the edge coupling ring and the upper end of the at least one opening is calculated. The liner has a plurality of openings, the image data includes image data of the cross section of the edge coupling ring with respect to the plurality of openings in the liner, and the first controller is of the edge coupling ring. The plurality of heights between the cross section and the corresponding upper ends of the plurality of openings are calculated, and the first controller obtains at least one of the state and the position of the edge coupling ring. The substrate processing system according to claim 14, wherein the plurality of heights are compared to determine. The substrate processing system according to claim 1, wherein the first controller adjusts the position of the camera according to the detection of the state of the edge coupling ring. A processing chamber having a first observation port, a pedestal arranged in the processing chamber, a liner surrounding the pedestal and having a plurality of openings, and an edge coupling arranged adjacent to the pedestal. In a substrate processing system comprising a ring comprising a first portion located outside and around the radial outer edge of the substrate on the pedestal, the state of the edge coupling ring and the state of the edge coupling ring. A detector system for detecting one or more of positions, said detector system.
A camera that acquires image data of the edge coupling ring via the first observation port, and a camera.
It comprises a controller that receives the image data and determines at least one of said position and state and said position of the surface of the edge coupling ring facing the plasma.
The image data includes image data of a cross section of the edge coupling ring with respect to the plurality of openings in the liner, and the controller is provided between the cross section of the edge coupling ring and different upper ends of the plurality of openings. A detector system that calculates a plurality of heights of the controller and compares the plurality of heights in order to determine at least one of the state and the position of the edge coupling ring. The substrate processing system further comprises an electrostatic chuck (ESC) placed on the pedestal, the camera is aimed at the substrate and one of the ESCs to acquire the image data. , The detector system according to claim 17. A method for determining at least one of the states and positions of an edge coupling ring in a substrate processing system.
Identifying the inner edge of the edge coupling ring
Acquiring the image data of the edge coupling ring with respect to the fixed reference,
Processing the image data to determine if the edge coupling rings are vertically aligned and
In response to the determination that the edge coupling rings are not aligned vertically, the edge coupling rings are adjusted in the vertical direction.
Determining whether or not the inner edge of the edge coupling ring is at a predetermined height.
In response to the determination that the inner edge of the edge coupling ring is not at the predetermined height, determining whether the edge coupling ring is vertically adjustable.
A method comprising vertically adjusting the edge coupling ring in response to a determination that the edge coupling ring is vertically adjustable. 19. The method of claim 19 , further comprising instructing the replacement of the edge coupling ring in response to a determination that the edge coupling ring is not vertically adjustable. Determining whether or not the edge coupling ring is vertically adjustable is determining whether or not there have been a predetermined number of semiconductor processing cycles from the installation of the edge coupling ring in the substrate processing system. 19. The method of claim 19. Determining whether or not the edge coupling ring can be adjusted in the vertical direction means determining whether or not a predetermined time length has elapsed from the installation of the edge coupling ring in the substrate processing system. 19. The method of claim 19. 19. The method of claim 19, wherein determining whether the edge coupling ring is vertically adjustable comprises determining whether the edge coupling ring has been raised vertically to its upper limit. .. 19. The method of claim 19, wherein adjusting the edge coupling ring vertically comprises adjusting one portion of the edge coupling ring perpendicular to another portion of the edge coupling ring. Determining whether the edge coupling rings are aligned horizontally and
19. The method of claim 19 , further comprising adjusting the edge coupling rings horizontally in response to a determination that the edge coupling rings are not aligned horizontally. 25. The aspect of claim 25, wherein adjusting the edge coupling ring horizontally comprises moving the edge coupling ring relative to a pedestal in the substrate processing system, wherein the substrate is placed on the pedestal. Method.

Images