KR20230066483A - Detection system for tunable/replaceable edge coupling ring - Google Patents

Abstract

A substrate processing system includes a processing chamber. A pedestal is placed within the processing chamber. An edge coupling ring is disposed adjacent the pedestal and around a radially outer edge of the substrate. An actuator is configured to selectively move the edge coupling ring relative to the substrate to change an edge coupling profile of the edge coupling ring. The substrate processing system includes a camera-based detection system that instructs an actuator to adjust the position of the edge coupling ring. The camera is configured to communicate with a controller, and the controller adjusts the position and/or focus of the camera. In response to the edge coupling ring state information from the camera, the controller operates an actuator to move the edge coupling ring vertically. In response to the edge coupling ring position information from the camera, the controller operates an actuator to move the edge coupling ring horizontally.

Description

DETECTION SYSTEM FOR TUNABLE/REPLACEABLE EDGE COUPLING RING}

Cross reference to related applications

This application claims priority from U.S. Patent Application No. 15/609,570, filed May 31, 2017, which is a continuation-in-part of U.S. Patent Application No. 14/705,430, filed May 6, 2015. This application is, in turn, a continuation-in-part of U.S. Patent Application Serial No. 14/598,943, filed on January 16, 2015. This application incorporates by reference all of these prior applications.

The present disclosure relates to substrate processing systems, more specifically edge coupling rings of substrate processing systems, and more specifically to detection systems for edge coupling rings of substrate processing systems. Also more specifically, the present disclosure relates to detection systems for detecting the position and/or state of edge coupling rings of substrate processing systems.

The background description provided herein is intended to give a general context for the present disclosure. The work of the inventors named herein to the extent described in this Background Section, as well as aspects of the present technology that may not otherwise be identified as prior art at the time of filing, are expressly or implicitly acknowledged as prior art to the present disclosure. It doesn't work.

Substrate processing systems may be used to perform etching and/or other processing of substrates such as semiconductor wafers. A substrate may be placed on a pedestal of a processing chamber of a substrate processing system. For example, during etching in a plasma etcher, a gas mixture containing one or more precursors is introduced into a processing chamber and a plasma is struck to etch the substrate.

Edge coupling rings have been used to adjust the etch rate and/or etch profile of the plasma near the radially outer edge of the substrate. The edge coupling ring is typically positioned on a pedestal around the radially outer edge of the substrate. The process conditions at the radially outer edge of the substrate depend on the location of the edge coupling ring, the shape or profile of the inner edge of the edge coupling ring, the height of the edge coupling ring relative to the upper surface of the substrate, the material of the edge coupling ring, and the like. can be modified by changing

Changing the edge coupling ring requires the processing chamber to be opened, which is not desirable. In other words, the edge coupling effect of the edge coupling ring cannot be changed without opening the processing chamber. When the edge coupling ring is eroded by the plasma during etching, the edge coupling effect changes. Correcting corrosion of the edge coupling ring requires the processing chamber to be opened to replace the edge coupling ring.

Referring now to FIGS. 1 and 2 , a substrate processing system may include a pedestal 20 and an edge coupling ring 30 . Edge coupling ring 30 may include a single piece or two or more parts. In the example of FIGS. 1 and 2 , the edge coupling ring 30 includes a first annular portion 32 disposed proximate a radially outer edge of the substrate 33 . A second annular portion 34 is located radially inwardly from the first annular portion below the substrate 33 . A third annular portion 36 is disposed below the first annular portion 32 . During use, a plasma 42 is directed to the substrate 33 to etch exposed portions of the substrate 33 . The edge coupling ring 30 is configured to assist plasma shaping so that uniform etching of the substrate 33 occurs.

In FIG. 2 , after the edge coupling ring 30 has been used, the upper surface of the radially inner portion of the edge coupling ring 30 may exhibit corrosion as identified at 48 . As a result, the plasma 42 tends to etch at a faster rate at the radially outer edge than the radially inner portions of the substrate 33 , as can be seen at 44 .

One or more portions of the edge coupling ring may be moved vertically and/or horizontally relative to a substrate or pedestal in a substrate processing system. This movement changes the edge coupling effect of the plasma to the substrate during etching or other substrate processing without requiring the processing chamber to be open.

Referring now to FIGS. 3-5 , a substrate processing system includes a pedestal 20 and an edge coupling ring 60 . Edge coupling ring 60 may consist of a single piece or two or more pieces may be used. In the example of FIGS. 3 to 5 , the edge coupling ring 60 includes a first annular portion 72 disposed radially outward of the substrate 33 . A second annular portion 74 is positioned radially inwardly from the first annular portion 72 below the substrate 33 . A third annular portion 76 is disposed below the first annular portion 72 .

Actuator 80 may be positioned at various locations to move one or more portions of edge coupling ring 60 relative to substrate 33 as will be described further below. For example only, in FIG. 3 the actuator 80 is disposed between the first annular portion 72 of the edge coupling ring 60 and the third annular portion 76 of the edge coupling ring 60 . In some examples, actuator 80 may include a piezoelectric actuator, stepper motor, pneumatic drive, or other suitable actuator. In some examples, 1, 2, 3, or 4 or more actuators are used. In some examples, the plurality of actuators are evenly distributed around the edge coupling ring 60 . Actuator(s) 80 may be disposed inside or outside the processing chamber.

During use, plasma 82 is directed to substrate 33 to etch exposed portions of substrate 33 . Edge coupling ring 60 is configured to help shape the plasma electric field so that uniform etching of substrate 33 occurs. As can be seen at 84 and 86 in FIG. 4 , one or more portions of edge coupling ring 60 may be eroded by plasma 82 . As a result of corrosion, non-uniform etching of the substrate 33 may occur near the radially outer edge of the substrate 33 . Usually, the process must be stopped, the processing chamber is opened and the edge coupling ring is replaced.

In FIG. 5 , actuator 80 is used to move one or more parts of edge coupling ring 60 to change the position of one or more parts of edge coupling ring 60 . For example, actuator 80 may be used to move first annular portion 72 of edge coupling ring 60 . In this example, the actuator 80 moves in an upward or vertical direction so that the edge 86 of the first annular portion 72 of the edge coupling ring 60 is higher relative to the radially outer edge of the substrate 33. The first annular part 72 of the edge coupling ring 60 is moved. As a result, the etching uniformity in the vicinity of the radially outer edge of the substrate 33 is improved.

Referring now to FIG. 6 , as will be appreciated, the actuator may be placed in one or more different positions and may move in other directions such as horizontally, obliquely, etc. A horizontal movement of this part of the edge coupling ring may be performed to center the edge coupling effect to the substrate. In FIG. 6 , an actuator 110 is disposed radially outward of the edge coupling ring 60 . In addition to this, the actuator 110 moves in a horizontal (or side to side) direction as well as a vertical (or up/down) direction. Horizontal repositioning may be used when the etching of the substrates shows a horizontal offset of the edge coupling ring relative to the substrates. Horizontal offset may be corrected without opening the processing chamber. Similarly, tilting of the edge coupling ring may be performed by actuating some of the actuators differently than others to correct or create lateral asymmetry.

Instead of positioning the actuator 110 between the annular portions of the edge coupling ring, the actuator 110 may also be radially attached to an outer wall or other structure, identified as 114 . Alternatively, actuator 110 may be supported from below by a wall or other structure identified as 116 .

Referring now to FIGS. 7 and 8 , another example of an edge coupling ring 150 and piezoelectric actuator 154 is shown. In this example, a piezoelectric actuator 154 moves the edge coupling ring 150 . A piezoelectric actuator 154 is mounted to the first annular portion 72 and the third annular portion 76 of the edge coupling ring 150 . In FIG. 8 , a piezoelectric actuator 154 moves the first annular portion 72 of the edge coupling ring 150 to adjust the position of the edge 156 of the first annular portion 72 .

Keeping the processing chamber closed can present difficulties in observing the condition of the edge coupling ring and determining when to reposition and replace the ring to compensate for corrosion.

Additionally, when replacing an edge coupling ring, there may be difficulties in properly positioning and/or aligning the edge coupling ring.

A substrate processing system includes a processing chamber. The processing chamber has a covered opening through which conditions of the chamber may be observed, including the condition and/or position of an edge coupling ring disposed adjacent to the pedestal of the processing chamber and around a radially outer edge of the substrate; and/or can be measured. A detection system for detecting the position and/or state of an edge coupling ring is provided.

In one feature, the detection system includes a camera with suitable optics to allow observation of the state of the edge coupling ring without opening the processing chamber.

In one feature, the apparatus includes a laser inferometer to measure the profile of the edge coupling ring without opening the processing chamber.

Depending on observed conditions and/or measured values, for example, in response to erosion of the plasma-facing surface of the edge coupling ring, the actuator may move the edge coupling of the edge coupling ring without requiring the processing chamber to be opened. configured to selectively move a first portion of the edge coupling ring relative to the substrate to change the ring profile.

In other features, the actuator is configured to move a first portion of the edge coupling ring relative to a second portion of the edge coupling ring.

In other features, the controller is configured to move the edge coupling ring in response to erosion of the plasma-facing surface of the edge coupling ring. The controller automatically moves the edge coupling ring after it has been exposed to a predetermined number of etch cycles. The controller automatically moves the edge coupling ring after the edge coupling ring has been exposed to the predetermined period of etching.

In other features, the actuator moves the first portion of the edge coupling ring perpendicular to the substrate. An actuator horizontally moves a first portion of the edge coupling ring relative to the substrate. A sensor or detector is configured to communicate with the controller and detect corrosion of the edge coupling ring.

In other features, the detector is a camera mounted outside the processing chamber and sighted on an edge coupling ring through a side view port of the chamber.

In other features, the camera may use plasma light, or use external light to provide an image or other information of the state and/or position of the edge coupling ring. In other features, the external light may be provided through the same side viewport through which the camera is aimed, or may be provided through a different side viewport.

In other features, the detection system includes a controller that adjusts the position and/or focus of the camera. In other features, the controller that moves the actuator also adjusts the position and/or focus of the camera. The camera is configured to communicate with a controller, and the controller adjusts the position and/or focus of the camera. In response to the edge coupling ring state information from the camera, the controller operates an actuator to adjust the position of the edge coupling ring relative to the substrate. In response to the edge coupling ring state information from the camera, the controller operates an actuator to move the edge coupling ring vertically. In response to the edge coupling ring position information from the camera, the controller operates an actuator to move the edge coupling ring horizontally. In response to edge coupling ring orientation information from the camera, the controller operates an actuator to move one side of the edge coupling ring relative to another side.

In other features, the robot is configured to communicate with the controller and adjust the position of the sensor. The sensor includes a depth gauge. The sensor includes a laser interferometer. An actuator selectively tilts the edge coupling ring relative to the substrate. The actuator is located outside of the processing chamber. A rod member connects the actuator through the wall of the processing chamber to the edge coupling ring.

In other features, a seal is disposed between the rod member and the wall of the processing chamber. wherein the controller moves the edge coupling ring to a first position for a first treatment of the substrate with a first edge coupling effect and then to a second position for a second treatment of the substrate with a second edge coupling effect; is composed of

A method of adjusting an edge coupling profile of an edge coupling ring in a substrate processing system includes placing the edge coupling ring adjacent to a pedestal in a processing chamber. An edge coupling ring is disposed around a radially outer edge of the substrate. The method includes selectively moving a first portion of an edge coupling ring relative to a substrate using an actuator to change an edge coupling profile of the edge coupling ring.

In other features, the method includes delivering a process gas and a carrier gas to the processing chamber. The method includes generating a plasma within a processing chamber to etch a substrate. The method includes moving a first portion of the edge coupling ring using an actuator that does not require the processing chamber to be open. The edge coupling ring further includes a second portion. The actuator is configured to move a first portion of the edge coupling ring relative to a second portion of the edge coupling ring. The actuator is selected from the group consisting of piezoelectric actuators, stepper motor actuators, and pneumatically driven actuators.

In other features, the method includes moving the edge coupling ring in response to erosion of the plasma-facing surface of the edge coupling ring. The method includes automatically moving the edge coupling ring after the edge coupling ring has been exposed to a predetermined number of etch cycles. The method includes automatically moving the edge coupling ring after the edge coupling ring has been exposed to etching for a predetermined period of time. The method includes moving a first portion of the edge coupling ring perpendicularly relative to the substrate. The method includes moving a first portion of an edge coupling ring horizontally relative to a substrate.

In other features, the method includes moving the first portion of the edge coupling ring perpendicularly relative to the substrate. The method includes moving a first portion of an edge coupling ring horizontally relative to a substrate. A sensor or detector is configured to communicate with the controller and detect corrosion of the edge coupling ring.

In other features, the method includes using a camera to sense corrosion of the edge coupling ring. The method includes adjusting the position of the edge coupling ring using images from the camera. The method includes operating an actuator to adjust a position of an edge coupling ring relative to a substrate in response to positional information provided by the camera. The method includes operating an actuator to move the edge coupling ring vertically in response to information provided by the camera regarding a state of the edge coupling ring. The method includes operating an actuator to move the edge coupling ring horizontally in response to information provided by the camera regarding a position of the edge coupling ring. The method includes operating an actuator to move one side of the edge coupling ring relative to another side in response to information provided by the camera regarding the position of the edge coupling ring.

In other features, the method includes using a sensor to sense corrosion of the edge coupling ring. The sensor is selected from the group consisting of a depth gauge and a laser interferometer. The method includes selectively tilting an edge coupling ring relative to a substrate. The actuator is located outside of the processing chamber.

In other features, the method includes moving an edge coupling ring to a first position for a first treatment of the substrate with a first edge coupling effect followed by a second treatment of the substrate with a second edge coupling effect. and move the edge coupling ring to the second position for the second position.

Other areas of application of the present disclosure will become apparent from the detailed description, claims and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

The present disclosure will be more fully understood from the detailed description and accompanying drawings.
1 is a cross-sectional side view of a pedestal and edge coupling ring according to the prior art.
2 is a cross-sectional side view of a prior art pedestal and edge coupling ring after corrosion of the edge coupling ring has occurred.
3 is a cross-sectional side view of an example of a pedestal, edge coupling ring and actuator.
Figure 4 is a cross-sectional side view of the pedestal, edge coupling ring and actuator of Figure 3 after corrosion of the edge coupling ring has occurred.
Figure 5 is a cross-sectional side view of the pedestal, edge coupling ring and actuator of Figure 3 after corrosion of the edge coupling ring has occurred and the actuator has been moved;
6 is a cross-sectional side view of yet another example of a pedestal, edge coupling ring and actuator positioned in another position, in accordance with the present disclosure.
7 is a cross-sectional side view of another example of a pedestal, edge coupling ring and piezoelectric actuator in accordance with the present disclosure.
8 is a cross-sectional side view of the pedestal, edge coupling ring and piezoelectric actuator of FIG. 7 after corrosion has occurred and the piezoelectric actuator has been moved.
9 is a functional block diagram of one example of a substrate processing chamber including a pedestal, edge coupling ring and actuators in accordance with the present disclosure.
10 is a flowchart illustrating one example steps of a method for operating an actuator to move an edge coupling ring in accordance with the present disclosure.
11 is a flowchart illustrating steps of another example of a method for operating an actuator to move an edge coupling ring in accordance with the present disclosure.
12 is a functional block diagram of one example of a processing chamber including a movable edge coupling ring with actuators disposed external to the processing chamber, in accordance with the present disclosure.
13A and 13B illustrate an example of tilting an edge coupling ring in a lateral direction according to the present disclosure.
14 illustrates an example of a method for moving an edge coupling ring during processing of a substrate.
15 is a plan view of an example of a pedestal including an edge coupling ring and a lifting ring.
16 is a cross-sectional side view of an example of an edge coupling ring and lifting ring.
17 is a cross-sectional side view of an example of an edge coupling ring being lifted by a lifting ring and an edge coupling ring being removed by a robot arm.
18 is a cross-sectional side view of an example of a movable edge coupling ring and lifting ring.
19 is a cross-sectional side view of the movable edge coupling ring of FIG. 18 in an elevated position;
20 is a cross-sectional side view of the edge coupling ring of FIG. 18 being lifted by the lifting ring and being removed by the robot arm.
21 is a cross-sectional side view of an example of a movable edge coupling ring.
Figure 22 is a cross-sectional side view of the edge coupling ring of Figure 21 being lifted by an actuator and removed by a robotic arm.
23 is an example of a method for replacing an edge coupling ring without opening the processing chamber.
24 is an example of a method for replacing an edge coupling ring without opening the processing chamber and moving the edge coupling ring due to corrosion.
25 is an example of a method for replacing an edge coupling ring without lifting the edge coupling ring due to corrosion and opening the processing chamber.
26 is a cross-sectional side view of a processing chamber with an example detector mounted external to the chamber.
27 is a cross-sectional side view of a processing chamber with an example detector and illumination device mounted external to the chamber.
28 is a cross-sectional side view of a processing chamber with an etched or corroded edge coupling ring.
29A shows an enlarged side view of the liner, and FIGS. 29C and 29C show examples of good and poor edge coupling ring placement relative to the liner.
30A-30C show examples of images with different positions and states of the edge coupling ring.
31 is a cross-sectional side view showing an image of an alternative mode of an edge coupling ring using a detector.
32 is an example of a method of inspecting an edge coupling ring to determine the alignment of the edge coupling ring on an electrostatic chuck.
33 is an example of a method of inspecting an edge coupling ring to determine its state.
In the drawings, reference numbers may be reused to identify similar and/or identical elements.

Referring now to FIG. 9 , an example of a substrate processing chamber 500 for performing etching using RF plasma is shown. The substrate processing chamber 500 includes a processing chamber 502 that surrounds the other components of the substrate processing chamber 500 and contains an RF plasma. The substrate processing chamber 500 includes a pedestal 506 that includes an upper electrode 504 and a lower electrode 507 . An edge coupling ring 503 is supported by the pedestal 506 and placed around the substrate 508 . One or more actuators 505 may be used to move the edge coupling ring 503 . During operation, a substrate 508 is placed on the pedestal 506 between the upper electrode 504 and the lower electrode 507 .

For example only, the upper electrode 504 may include a showerhead 509 that introduces and distributes process gases. The showerhead 509 may include a stem portion including one end connected to a top surface of the processing chamber. The base portion is generally cylindrical and extends radially outward from the opposite end of the step portion at a location spaced from the top surface of the processing chamber. The substrate-facing surface or facing plate of the base portion of the showerhead includes a plurality of holes through which process gas or purge gas flows. Alternatively, the upper electrode 504 may include a conductive plate and process gases may be introduced in another manner. The lower electrode 507 may be disposed on a non-conductive pedestal. Alternatively, pedestal 506 may include an electrostatic chuck that includes a conductive plate that acts as a lower electrode 507 .

RF generation system 510 generates and outputs an RF voltage to one of upper electrode 504 and lower electrode 507 . The other of the upper electrode 504 and the lower electrode 507 may be DC grounded, AC grounded, or floating. For example only, the RF generation system 510 will include an RF voltage generator 511 that generates an RF voltage that is fed to either the upper electrode 504 or the lower electrode 507 by the matching and distribution network 512. may be In other examples, the plasma may be generated inductively or remotely.

Gas delivery system 530 includes one or more gas sources 532-1, 532-2, ..., and 532-N (collectively gas sources 532), where N is an integer greater than zero. am. Gas sources supply one or more precursors and mixtures thereof. Gas sources may also supply purge gas. Vaporized precursors may also be used. Gas sources 532 are valves 534-1, 534-2, ..., and 534-N (collectively valves 534) and mass flow controllers 536-1, 536-2, ... , and 536-N) (collectively the mass flow controllers 536) are connected to the manifold 540. The output of manifold 540 is fed into processing chamber 502 . For example only, the output of manifold 540 is fed to showerhead 509 .

A heater 542 may be connected to a heater coil (not shown) disposed within the pedestal 506 . A heater 542 may be used to control the temperature of the pedestal 506 and substrate 508 . A valve 550 and pump 552 may be used to evacuate the reactants from the processing chamber 502 . A controller 560 may be used to control components of the substrate processing chamber 500 . Controller 560 may also be used to control actuator 505 to adjust the position of one or more portions of edge coupling ring 503 .

A robot 570 and sensor 572 may be used to measure corrosion of the edge coupling ring. In some examples, sensor 572 may include a depth gauge. Robot 570 may move the depth gauge in contact with the edge coupling ring to measure corrosion. Alternatively, a laser interferometer (with or without robot 570) may be used to measure corrosion without direct contact. If the laser interferometer can be positioned in the line of sight directly relative to the edge coupling ring, the robot 570 may be omitted.

Referring now to FIG. 10 , an example of a method 600 for operating an actuator to move an edge coupling ring is shown. At 610, at least a portion of the edge coupling ring is positioned relative to the substrate in a first position. At 614, the substrate processing system is operated. The operation may include etching or other processing of the substrate. At 618, control determines whether a predetermined period of etching or a predetermined number of etching cycles has occurred. If, as determined at 618, the predetermined period or number of cycles has not been exceeded, control returns to 614.

When the predetermined period or number of cycles have expired, control determines at 624 whether the maximum predetermined etch period has expired, a maximum number of etch cycles have occurred and/or a maximum number of actuator movements have occurred.

If 624 is false, the control moves at least a portion of the edge coupling ring using the actuator. Movement of the edge coupling ring may be performed automatically, manually, or a combination thereof without opening the processing chamber. If 624 is true, the control sends a message or otherwise indicates that the edge coupling ring is to be serviced/replaced.

Referring now to FIG. 11 , an example of a method 700 for operating an actuator to move an edge coupling ring is shown. At 710, at least a portion of the edge coupling ring is positioned relative to the substrate in a first position. At 714, the substrate processing system is operated. The operation may include etching or other processing of the substrate. At 718, control determines whether a predetermined amount of corrosion of the edge coupling ring has occurred, using a sensor such as a depth gauge or laser interferometer. If 718 is false, control returns to 714.

When a predetermined amount of corrosion occurs, control determines at 724 whether the maximum amount of corrosion has occurred. When 724 is FALSE, the control moves at least a portion of the edge coupling ring using an actuator. Movement of the edge coupling ring may be performed automatically without opening the processing chamber, or manually or a combination thereof. If 724 is true, the control sends a message or otherwise indicates that the edge coupling ring is to be serviced/replaced.

In addition to the foregoing, the determination of whether the edge coupling ring should be moved after processing may be based on inspection of the etch patterns of the substrates after processing. An actuator may be used to adjust the edge coupling profile of the edge coupling ring without opening the chamber.

Referring now to FIG. 12 , a processing chamber 800 includes an edge coupling ring 60 disposed on a pedestal 20 . Edge coupling ring 60 includes one or more portions that are movable by one or more actuators 804 disposed outside of processing chamber 800 . In this example, portion 72 is movable. Actuators 804 may be connected to portion 72 of edge coupling ring 60 by mechanical linkage 810 . For example, mechanical linkage 810 may include a rod member. The mechanical linkage 810 may pass through a hole 811 in the wall 814 of the processing chamber 800 . A seal 812 such as an "O" ring may be used. Mechanical linkage 810 may pass through holes 815 of one or more structures, such as portion 76 of edge coupling ring 60 .

Referring now to FIGS. 13A and 13B , tilting of the edge coupling ring 830 in a lateral direction is shown. Lateral tilting may also be used to correct for lateral misalignment. In FIG. 13A , portions 830 - 1 and 830 - 2 of the edge coupling ring 830 on opposite sides of the substrate are arranged in a first arrangement. Portions 830 - 1 and 830 - 2 may be generally aligned with portions 832 - 1 and 832 - 2 of edge coupling ring 830 . Actuators 836-1 and 836-2 are disposed between portions 830-1 and 832-1 and between 830-2 and 832-2, respectively.

In FIG. 13B , actuators 836-1 and 836-2 are edge coupling so that edge coupling ring 830 moves a second arrangement 850 that differs from the first arrangement 840 shown in FIG. 13A. Move the respective parts of the ring 830. As can be seen, substrates may be inspected after processing and tilting of the substrate may be adjusted as needed without opening the processing chamber.

Referring now to FIG. 14 , a method 900 for moving an edge coupling ring during processing of a substrate is shown. In other words, different processes may be performed on a single substrate in the same processing chamber. The edge coupling effect of the edge coupling ring may be adjusted between multiple processes performed on a substrate in the same processing chamber before proceeding to a subsequent substrate. At 910, the substrate is positioned on the pedestal and the position of the edge coupling ring is adjusted if necessary. At 914, processing of the substrate is performed. Processing of the substrate takes place as determined at 918 and the substrate is moved from the pedestal at 922 . At 924, it is determined whether another substrate is to be processed. If 924 is true, the method returns to 910. otherwise, the method ends.

If 918 is false and the substrate requires additional processing, the method determines at 930 whether adjustment of the edge coupling ring is required. If 930 is false, the method returns to 914. If 930 is true, at 934 at least a portion of the edge coupling ring is moved using one or more actuators and the method returns to 914 . As can be seen, the edge coupling ring can be adjusted between treatments of the same substrate in the same processing chamber.

Referring now to FIG. 15 , an edge coupling ring 1014 and a lifting ring 1018 are disposed adjacent to and around the upper surface of the pedestal 1010 . Edge coupling ring 1014 includes a radially inner edge disposed adjacent to the substrate during etching as described above. A lifting ring 1018 is disposed under at least a portion of the edge coupling ring 1014 . Lifting ring 1018 is used to lift edge coupling ring 1014 above the surface of pedestal 1010 when removing edge coupling ring 1014 using a robotic arm. Edge coupling ring 1014 can be removed without requiring the processing chamber to be open to atmospheric pressure. In some examples, lifting ring 1018 is provided between circumferentially spaced ends 1020 to provide clearance for a robotic arm to remove edge coupling ring 1014, as will be described below. may optionally include a portion 1019 open to.

Referring now to FIGS. 16 and 17 , an example of an edge coupling ring 1014 and a lifting ring 1018 are shown in more detail. In the example shown in FIG. 16 , the pedestal may include an electrostatic chuck (ESC), generally identified as 1021 . ESC 1021 may include one or more stacked plates such as ESC plates 1022 , 1024 , 1030 and 1032 . ESC plate 1030 may correspond to the middle ESC plate and ESC plate 1032 may correspond to the ESC baseplate. In some examples, an O-ring 1026 may be disposed between ESC plates 1024 and 1030 . Although a particular pedestal 1010 is shown, other types of pedestals may be used.

A bottom edge coupling ring 1034 may be disposed below the edge coupling ring 1014 and lifting ring 1018 . A bottom edge coupling ring 1034 may be disposed radially outside of ESC plates 1024 , 1030 and 1032 and O-ring 1026 .

In some examples, edge coupling ring 1014 may include one or more self-centering features 1040 , 1044 and 1046 . For example only, self-centering features 1040 and 1044 may be triangular-shaped, female self-centering features, although other shapes may be used. Self-centering feature 1046 may be an inclined surface. Lifting ring 1018 may include one or more self-centering features 1048 , 1050 and 1051 . For example only, self-centering features 1048 and 1050 may be triangular-shaped, male self-centering features, although other shapes may be used. Self-centering feature 1051 may be an inclined surface having a shape complementary to self-centering feature 1046 . Self-centering feature 1048 on lifting ring 1018 may mate with self-centering feature 1044 on edge coupling ring 1014 . Self-centering feature 1050 on lifting ring 1018 may mate with self-centering feature 1052 of bottom edge coupling ring 1034 .

Lifting ring 1018 further includes protrusions 1054 extending radially outward. Groove 1056 may be disposed on bottom-facing surface 1057 of protrusion 1054 . Groove 1056 is configured to be biased by one end of a pillar 1060 connected to actuator 1064 and optionally moved vertically by actuator 1064 . Actuator 1064 may be controlled by a controller. As can be seen, while a single groove, pillar and actuator is shown, additional grooves, pillars and actuators are circumferentially spaced around the lifting ring 1018 in spaced relation to bias the lifting ring 1018 in an upward direction. It can also be arranged in a direction.

In FIG. 17 , an edge coupling ring 1014 raised in an upward direction by a lifting ring 1018 using pillar(s) 1060 and actuator(s) 1064 is shown. Edge coupling ring 1014 can be removed by a robotic arm from the processing chamber. More specifically, robot arm 1102 is connected to edge coupling ring 1014 by holder 1104 . The holder 1104 may include a self-centering feature 1110 that mates with a self-centering feature 1040 on the edge coupling ring 1014 . As can be seen, the robot arm 1102 and holder 1104 may bias the edge coupling ring upward to clear the self-centering feature 1048 on the lifting ring 1018 . Robot arm 1102, holder 1104 and edge coupling ring 1014 may then be moved out of the processing chamber. Robot arm 1102 , holder 1104 and new edge coupling ring can be returned and positioned onto lifting ring 1018 . The lifting ring 1018 is then lowered. A reverse action may be used to transfer the new edge coupling ring 1014 to the lifting ring 1018 .

Alternatively, instead of lifting the robot arm 1102 and holder 1104 upward to lift the edge coupling ring 1014 from the lifting ring 1018, the robot arm 1102 and holder 1104 are raised can be positioned below in contact with the edge coupling ring 1014. The lifting ring 1018 is then lowered and the edge coupling ring 1014 remains on the robot arm 1102 and holder 1104 . Robot arm 1102, holder 1104 and edge coupling ring 1014 can be removed from the processing chamber. A reverse action may be used to transfer the new edge coupling ring 1014 onto the lifting ring 1018 .

Referring now to FIGS. 18-20 , a movable edge coupling ring 1238 and lifting ring 1018 are shown. In FIG. 18 , one or more pillars 1210 are positioned in bores 1220, 1224 of ESC baseplate 1032, bottom edge coupling ring 1034, and lifting ring 1018 by one or more actuators 1214, respectively. and 1228) are moved up and down. In this example, a middle edge coupling ring 1240 or spacer is placed between the movable edge coupling ring 1238 and the lifting ring 1018 . Middle edge coupling ring 1240 may include self-centering features 1244 and 1246 . Corresponding self-centering features 1248 may be provided on the movable edge coupling ring 1238 . Self-centering features 1248 mate with self-centering features 1246 on the middle edge coupling ring 1240 .

As detailed above, corrosion of the upward facing surface of the movable edge coupling ring 1238 may occur during use. This, in turn, may change the profile of the plasma. The movable edge coupling ring 1238 may be selectively moved in an upward direction using pillars 1210 and actuators 1214 to change the profile of the plasma. In FIG. 19 , the movable edge coupling ring 1238 of FIG. 18 is shown in an elevated position. The middle edge coupling ring 1240 may remain fixed. Eventually, the movable edge coupling ring 1238 may be moved one or more times and then the edge coupling ring 1238 and middle edge coupling ring 1240 may be replaced.

20, actuator 1214 returns to a lowered state and actuator 1064 is moved to a raised state. Edge coupling ring 1238 and middle edge coupling ring 1240 may be lifted by lifting ring 1018 and movable edge coupling ring 1238 may be removed by robot arm 1102 and holder 1104. there is.

As can be seen, the actuators may be disposed within the processing chamber or external to the processing chamber. In some examples, edge coupling rings may be supplied to the chamber via a cassette, loadlock, transfer chambers, or the like. Alternatively, the edge coupling rings may be stored external to the processing chamber but internal to the substrate processing tool.

Referring now to FIGS. 21 and 22 , the lifting ring may be omitted in some examples. An edge coupling ring 1310 is disposed on the bottom edge coupling ring 1034 and the radially outer edge of the pedestal. Edge coupling ring 1310 may include one or more self-centering features 1316 and 1320 . Edge coupling ring 1310 may further include a groove 1324 for receiving a top surface of pillar 1210 , biased by actuator 1214 . Self-centering feature 1320 may be disposed against corresponding self-centering feature 1326 of bottom edge coupling ring 1034 . In some examples, self-centering features 1320 and 1326 are inclined planes.

In FIG. 22 , actuators 1214 and pillars 1210 upwardly bias edge coupling ring 1310 to adjust the plasma profile or remove edge coupling ring 1310 after corrosion has occurred. Robot arm 1102 and holder 1104 can be moved into position below edge coupling ring 1310 . Self-centering feature 1316 may be engaged by self-centering feature 1110 on holder 1104 connected to robotic arm 1102 . Either the robot arm 1102 moves in an upward direction to provide space between the groove 1324 and the pillar 1210 or the pillar 1210 is moved downward by the actuator 1214 to provide space for the groove 1324. is moved to

Referring now to FIG. 23 , a method 1400 for replacing an edge coupling ring without opening the processing chamber to atmospheric pressure is shown. At 1404, the method determines whether the edge coupling ring is positioned on the lifting ring. If 1404 is false, the method uses a robotic arm at 1408 to move the edge coupling ring into position on the lifting ring. After the edge coupling ring is placed on the lifting ring in the processing chamber, the process at 1410 is executed. At 1412, the method determines whether the edge coupling ring is worn using any of the criteria described above. If 1412 is false, the method returns to 1410 and the process may run again. If it is determined that the edge coupling ring is worn at 1412 , the edge coupling ring is replaced at 1416 and the method continues at 1410 .

Referring now to FIG. 24 , a method 1500 adjusts the position of the movable edge coupling ring when corrosion needs to be offset and optionally replaces the movable edge coupling ring when it is determined that the movable edge coupling ring is worn. At 1502, the method determines whether the movable edge coupling ring has been positioned on the lifting ring. If 1502 is false, the edge coupling ring is moved into position on the lifting ring at 1504 and the method continues at 1502 .

If 1502 is true, the method determines if the position of the movable edge coupling ring should be adjusted at 1506. If 1506 is true, the method uses the actuator to adjust the position of the movable edge coupling ring and returns to 1506. If 1506 is false, the method runs the process at 1510. At 1512, the method determines whether the movable edge coupling ring is worn. If false, the method returns to 1510.

If 1512 is true, the method determines at 1520 whether the movable edge coupling ring is in its highest (or fully adjusted) position. If 1520 is false, the method adjusts the position of the movable edge coupling ring using the actuator 1214 at 1524 and the method returns to 1510. If 1520 is true, the method uses actuator 1064 , lifting ring 1018 and robotic arm 1102 to replace the movable edge coupling ring.

Referring now to FIG. 25 , a method 1600 for replacing an edge coupling ring without opening the process chamber to atmospheric pressure is shown. At 1610, the lifting ring and edge coupling ring are biased upward using actuators. At 1620, the robot arm and holder are moved under the edge coupling ring. At 1624, the robot arm is moved upward or the lifting ring is moved downward to eliminate the self-centering features of the edge coupling ring. At 1628, the robotic arm along with the edge coupling ring is moved out of the processing chamber. At 1632, the edge coupling ring is detached from the robot arm. At 1636, the replacement edge coupling ring is picked up by the robotic arm. At 1638, an edge coupling ring is positioned on the lifting ring and aligned using one or more self-centering features. At 1642, the robot arm is lowered to allow enough space for the self-centering feature and the robot arm is removed from the chamber. At 1646, the lifting ring and edge coupling ring are lowered into position.

Referring now to FIG. 26 , features for detecting edge coupling ring state and position will now be described. Part of the present technology focuses on a detector and detection method according to features of the present invention that enable direct measurement of the height and erosion of an edge coupling ring. Details of various elements of the processing chamber, including the ESC, edge coupling ring, controller, and actuators, have been previously provided and are not repeated here for brevity and clarity.

In FIG. 26 , processing chamber 1710 has a window 1715 positioned above the top of the chamber. A pedestal 1720 of chamber 1710 has an electrostatic chuck (ESC) 1725 mounted on top thereof. Adjacent to ESC 1725 are actuator mechanisms 1730 and 1735 that move edge coupling ring 1740 horizontally and/or vertically as previously described. One or both of actuator mechanisms 1730 and 1735 may be installed as described with respect to the preceding figures. Wafer 1750 is positioned on ESC 1725 in edge coupling ring 1740 .

A camera 1760 is mounted on attachment mechanism 1765 to view edge coupling ring 1740 through side view port 1770 of chamber 1710 . Attachment mechanism 1765 may be a bracket, docking mechanism, or other suitable attachment mechanism that enables suitable vertical and/or horizontal movement of camera 1760 relative to side view port 1770, and an edge coupling ring 1740 ) to enable proper focusing of the camera 1760 on the appropriate part of . In one feature, the side view port 1770 includes a shutter 1775 to protect material in the port during wafer processing. In one feature, the shutter 1775 operates using a pneumatic gate valve.

In one feature, as shown, attachment mechanism 1765 mounts camera 1760 on chamber 1710 . In another feature, attachment mechanism 1765 mounts camera 1760 on a structure next to chamber 1710.

In some features, a controller (shown in previous figures) controls the actuation, focusing and positioning of camera 1760. In some features, a separate controller 1800 provides one or more of actuation, focusing, and positioning for the camera. In some features, the camera itself provides its own focusing mechanism, but one of the controllers described herein assists the camera's own focusing based on an individual analysis of the images provided.

In other features, a camera 1760 is installed to allow viewing through window 1715. In FIG. 26 , camera 1760 is shown focused on the inner edge of edge coupling ring 1740 . Edge coupling ring 1740 is shown as new when installed in chamber 1710 .

A camera of sufficient resolution (e.g., number of pixels) to enable determination of the position and state of the edge coupling ring 1740, and to produce images of a suitable size to provide a direct measurement of ring height and ring erosion ( 1760). In some features, the camera operates in macro (close up) mode, using a macro lens. In other features, the lens may be an optical zoom lens that provides suitable magnification. Any combination of pixel number and magnification (macro, optical zoom or, in some features, digital zoom) that enables generation of enough information (eg, an image) to determine ring state and position would be acceptable. In some features, camera 1760 may operate using high dynamic range (HDR) imaging in combination with macro and/or zoom photography.

In one feature, the plasma light is sufficiently good such that there is sufficient light in the chamber 1710 to illuminate the edge coupling ring 1740. In other features, an external illumination source, such as a light emitting diode (LED) source, is provided. In FIG. 27 , in addition to the elements shown in FIG. 26 , in some features an external lighting device 1780 provides illumination within the chamber 1710 . As shown, in one feature, an attachment mechanism 1785 mounts the lighting device 1780 onto the chamber 1710 . In another feature, an attachment mechanism 1785 mounts the lighting device 1780 to a structure next to the chamber 1710. In one feature, the lighting device 1780 is attached to the camera 1760. Depending on various characteristics, the attachment is either mechanical or electrical or both. In some features, an additional side view port 1790 is provided through which the lighting device 1780 shines light into the chamber 1710 . Attachment mechanism 1785 may be a bracket, docking mechanism, or other suitable attachment mechanism that enables suitable vertical and/or horizontal movement of camera 1760 relative to side view port 1790 . In some features, additional side view port 1790 is on the same side of chamber 1710 as side view port 1770 . In other features, an additional side view port 1790 may be on a different side of chamber 1710 from side view port 1770 . In one feature, the side view port 1790 includes a shutter 1795 to protect material in the port during wafer processing. In one feature, shutter 1795 operates using a pneumatic gate valve. In still other features, lighting device 1780 shines light through the same side view port 1770 when camera 1760 is in use, if a separate side view port 1790 is not needed.

For ease of illustration, the two side view ports 1770 and 1790 individually chamber 1710 is shown slightly larger in FIG. 27 than in FIG. 26, although in some features the chamber is the same size in both figures. am. If the plasma light source serves as the light source, an additional side view port 1790 is not needed.

In operation, the focus and/or position of camera 1760 can drift. In one feature, controller 1800 monitors the focus and position of camera 1760 and makes appropriate adjustments.

FIG. 28 has all the same elements as FIG. 27 except that the edge coupling ring 1740', which has a shorter inner radius than the outer radius, is shown eroded. As previously described, erosion or etching occurs as the wafer processing system processes more and more wafers. Also, as previously described, if camera 1760 provides an image showing that the edge coupling ring is corroded too much to perform its function of controlling etching at the edge of the etched wafer, controller 560 appropriately Control one or both of actuators 1730 and 1735 to move edge coupling ring 1740' vertically. In one feature, controllers 560 and 1800 communicate with each other such that controller 560 operates the appropriate actuator(s) in response to image data from controller 1800.

FIG. 29A is an enlarged view of openings 1015 of liner 1012 shown in plan view of FIG. 15 . Openings appear on the side of the liner. The liner 1012 acts as a fixed reference, upon which the camera can focus to take images of the position and condition of the edge coupling ring.

29B and 29C show images of good and poor placement of the edge coupling ring relative to the openings 1015 of the liner 1012, respectively. In these figures, an edge coupling ring is at the bottom of each image. Dark parts in each figure are parts of the openings 1015 . The consistency of the height of the dark areas indicates the quality of the batch. In one feature, the height of the dark portions is determined by counting the number of vertical dark pixels along a vertical axis at the center of the dark portions. In Fig. 29B, the heights of the dark areas and the relative evenness of the sizes of these areas indicate that the edge coupling ring is properly positioned. In FIG. 29C, the inconsistency of the heights of the shadows and the relatively short heights of the shadows on the right side of the figure indicate that the edge coupling ring is tilted.

30A-30C show raw images of various heights and conditions of the edge coupling ring 1740, taken in the chamber. FIG. 30A shows the condition of a new edge coupling ring with heights of 3.0, 3.2, 3.4, 3.6, 3.8, and 4.0 mm as can be seen in the six images placed sideways to form FIG. 30A. . FIG. 30b shows the condition of a worn edge coupling ring before recalibration and lifting of the ring at the same heights as in FIG. 30a. FIG. 30C shows the condition of a worn edge coupling ring of the same heights as in FIGS. 30A and 30B after recalibration and elevation of the ring.

In one feature, raw images, such as those shown in FIGS. 30A-30C , again use the openings 1015 of the liner 1012 of FIG. 15 as a fixed reference to measure several different ring heights and ring conditions. As you can see, it may be used to calibrate the camera of the first example. In one feature, calibration may be performed as follows. Initially, once a new edge coupling ring is installed, images may be taken at several different ring heights, for example to raise and lower the ring using one or more of the actuators. In pixels, measuring different heights of the ring and comparing these measurements to physical measurements enables calibration of the transition edge sensor (TES), providing a gauge for calibrating the camera. Calibration can be useful to account for whether camera drift is drift in focus, or drift in focal length (degree of magnification). For example, a drift in magnification can result in a changed height measurement due to a change in the relationship between the number of pixels and the number of microns.

31 shows an alternative way to directly measure the corrosion of an edge coupling ring. 26-28, camera 1760 is trained directly on inside the edge of the edge coupling ring. However, in this view, the camera may tend to provide an image of the entire top surface of the edge coupling ring, potentially hiding or masking the actual amount of corrosion. This makes it difficult to measure the height of the inner edge of the edge coupling ring because it makes it difficult to differentiate the edge from the rest of the top surface of the ring. Images may appear blurry. To measure the height (in number of pixels, converted to units of height, such as μm) of the front edge and determine the degree of erosion accordingly, it is desirable to show the front edge clearly.

To that end, in FIG. 31 , instead of looking directly from the inside of the edge coupling ring, camera 1760 can take a reflection of the inside of the edge coupling ring. The mirror image can be from the surface of ESC 1725 or from the surface of wafer 1750 . One or both of the surfaces may have reflective characteristics. Looking in the mirror, camera 1760 takes a mirror image 1840' of edge coupling ring 1840. (Dotted lines show corroded portion 1845 and "mirror image" 1845'.)

By looking at the mirror image of the edge coupling ring instead of looking at the edge coupling ring itself, perspective problems are avoided. The height of the inner edge of the edge coupling ring can be measured directly, in some examples, to enable a more unambiguous determination of the condition of the edge coupling ring.

Even from looking in the mirror image of the edge coupling ring there may be limits to the detectability of ring erosion. Since the corrosion occurs on the inside of the edge coupling ring, the corrosion reduces the height of the inner edge of the ring relative to the outer edge. The greater the reduction, the greater the effective tilting of the upper surface of the ring. At some point, the degree of "tilting" can be so great that it is difficult to distinguish the inner edge of the ring on a mirror image, making it difficult to measure the height of the inner edge, and thus the degree of corrosion. The inability to determine the degree of corrosion may trigger adjustment of the ring height using actuators, or even ring replacement too quickly or too slowly. As a result, either the edge coupling rings are replaced too soon, wasting the useful life of the rings, or the rings are raised or replaced too slowly, causing variability in the etch profile near the radially outer edge of the wafer. In one feature, increasing the angle at which the camera 1760 views the reflected image can be compensated for as erosion progresses.

32 shows a method for seating an edge coupling ring using images from a camera. After the method starts at 1910, at 1920 the robot installs the edge coupling ring onto the ESC. At 1930, the camera is focused to identify the inner edge of the ring. As discussed above, the camera can be focused on the inner edge of the edge coupling ring, or on the mirror image of the ring on the ESC or wafer.

At 1940, the camera takes images of the edge coupling ring relative to a fixed reference, such as the lifting ring of FIG. 15. At 1950, the images are processed and analyzed to determine whether the ring is vertically aligned, i.e., whether there is any tilting in the edge coupling ring (eg, as shown in FIG. 29B). If there is tilting, at 1955 the controller 560 controls one or more of the actuators to compensate for the tilting, and the method returns to 1940 to acquire more images (at 1950) and again checks whether there is still tilting.

If the edge coupling ring is not tilted, again using the images acquired at 1960, it is determined whether the edge coupling ring is at the correct height. If the ring is not at the correct height, at 1965 the controller 560 controls one or more of the vertical actuators to correct the height, and the method returns to 1940 to acquire more images (at 1960) and the edge coupling ring is Check again whether it is at the correct height. In one feature, if tilting has already been adjusted, 1950 may be skipped and the method may proceed directly from 1940 to 1960. In another feature, the tilt and height can be measured and adjusted in a single step, using a controller 560 that controls the vertical actuators in a single action, by combining 1950 and 1960 into a single analysis, and 1955 and 1965 into a single process. can

Once the edge coupling is at the proper height and vertical alignment, at 1970 it is determined whether the edge coupling ring is horizontally aligned on the ESC. If not, at 1975 the controller 560 causes one or more of the horizontal actuators to move the edge coupling ring, as a result the method returns to 1940 to acquire more images (at 1970) and the edge couple Ring Check again whether the rings are aligned horizontally. In one feature, if vertical alignment has already been adjusted, 1950 and 1960 may be skipped and the method may proceed directly from 1940 to 1970.

In the method shown in Fig. 32, vertical alignment and horizontal alignment are not determined in the order shown. The order can be reversed so that the horizontal alignment is adjusted first, followed by the vertical alignment. In one feature, controller 560 can receive all information regarding the positioning of the edge coupling ring and can control a plurality of actuators at once to align the edge coupling ring. According to this feature, 1950, 1960, and 1970 can be combined into a single analysis, and 1955, 1965, and 1975 can be combined into one process.

33 shows how to adjust the edge coupling ring using images from the camera. After the method starts in 2010, it is determined in 2020 whether a predetermined period of time has elapsed since the ring is installed and wafer processing begins. If not, the method returns to 2020 to see if the predetermined period of time has elapsed.

In one feature, instead of waiting a predetermined period of time, it is determined whether a predetermined number of processing cycles have occurred at 2020. If not, the method returns to 2020 to check the number of cycles again.

If a predetermined period of time has elapsed or a predetermined number of processing cycles have occurred, at 2030 the camera is focused to identify the inner edge of the ring. As discussed above, the camera can be focused on the inner edge of the edge coupling ring, or on the mirror image of the ring on the ESC or wafer. At 2040, after focusing, images of the edge coupling ring relative to a fixed reference are taken, and the height of the inner edge of the ring is measured. At 2050, if it is determined that the inner edge is at least a predetermined height above the surface of the wafer, at 2055 a decision is made to wait a predetermined period of time. In one feature, instead of waiting a predetermined period of time, a decision is made to wait a predetermined number of wafer processing cycles. After a predetermined period of time has elapsed or a predetermined number of processing cycles have occurred, the method returns to 2030 where the camera is refocused and then more images are taken 2040 where the decision is repeated at 2050.

If it is determined that the inner edge of the edge coupling ring is not at least a predetermined height above the surface of the wafer, then at 2060 the controller 560 controls the vertical actuators to raise the edge coupling ring. At 2070, it is determined whether a predetermined number of cycles have elapsed since installation of the edge coupling ring. If not, return to 2055 and wait for a predetermined period. In one aspect, at 2055 the method may wait a predetermined number of cycles.

If it is determined at 2070 that a predetermined number of cycles have elapsed, at 2080 the edge coupling ring is replaced. In one feature, instead of seeing whether a predetermined number of cycles have elapsed, the amount of extension of the actuator can be measured. If the extension of the actuator exceeds a predetermined amount, it may be determined that the edge coupling ring should be replaced. In another feature, instead of any of the immediately preceding alternatives, it may be determined whether a predetermined period of time has elapsed since installation of the edge coupling ring. If this period of time has elapsed, it may be determined that the edge coupling ring should be replaced.

After the edge coupling ring is replaced, the method may end at 2090 or may return to the beginning.

The foregoing description is merely illustrative in nature and is not intended to limit the present disclosure, its applications, or uses in any way. The broad teachings of this disclosure may be embodied in a variety of forms. Thus, although this disclosure includes specific examples, the true scope of this disclosure should not be so limited as other modifications will become apparent from a study of the drawings, specification, and claims below. As discussed herein, at least one of the phrases A, B, and C should be interpreted to mean logically (A or B or C), using a non-exclusive logical OR, and "at least one A , at least one B, and at least one C". It should be understood that one or more steps of a method may be performed in a different order (or concurrently) without altering the principles of the present disclosure.

In some implementations, the controller can be part of a system that may be part of the examples described above. Such systems can include semiconductor processing equipment, including a processing tool or tools, a chamber or chambers, a platform or platforms for processing, and/or certain processing components (wafer pedestal, gas flow system, etc.) . These systems may be integrated with electronics for controlling their operation before, during and after processing of a semiconductor wafer or substrate. Electronic devices may be referred to as “controllers” that may control various components or sub-portions of a system or systems. The controller controls delivery of processing gases, temperature settings (eg, heating and/or cooling), pressure settings, vacuum settings, power settings, depending on the processing requirements and/or type of system. , radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid transfer settings, position and motion settings, tools and other transfer tools, and/or It may be programmed to control any of the processes disclosed herein, including transfers of wafers into and out of loadlocks coupled to or interfaced with a particular system.

Generally speaking, a controller receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, and/or various integrated circuits, logic, memory, and/or It can also be defined as an electronic device with software. Integrated circuits are chips in the form of firmware that store program instructions, chips defined as digital signal processors (DSPs), application specific integrated circuits (ASICs) and/or one that executes program instructions (eg, software). It may include the above microprocessors or microcontrollers. Program instructions may be instructions passed to a controller or system in the form of various individual settings (or program files) that specify operating parameters for executing a specific process on or on a semiconductor wafer. In some embodiments, operating parameters are set to achieve one or more processing steps during fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or dies of a wafer. It may be part of a recipe prescribed by engineers.

A controller, in some implementations, may be part of or coupled to a computer, which may be integrated into, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be all or part of a fab host computer system that may enable remote access of wafer processing or may be in the "cloud." The computer monitors the current progress of manufacturing operations, examines the history of past manufacturing operations, examines trends or performance metrics from multiple manufacturing operations, changes parameters of current processing, and executes processing steps following current processing. You can also enable remote access to the system to set up, or start new processes. In some examples, a remote computer (eg, server) can provide process recipes to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and/or settings that are then transferred from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each of the process steps to be performed during one or more operations. It should be understood that these parameters may be specific to the type of tool the controller is configured to control or interface with and the type of process to be performed. Thus, as described above, a controller may be distributed, for example by including one or more separate controllers that are networked together and cooperate together for a common purpose, for example, for the processes and controls described herein. An example of a distributed controller for these purposes is one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (e.g., at platform level or as part of a remote computer) that are combined to control a process on the chamber. can be circuits.

Exemplary systems, without limitation, include plasma etch chambers or modules, deposition chambers or modules, spin-rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chamber or module, chemical vapor deposition (CVD) chamber or module, atomic layer deposition (ALD) chamber or module, atomic layer etch (ALE) chamber or module, ion implantation chamber or module, track chamber or module, and semiconductor and any other semiconductor processing systems that may be used in or associated with the fabrication and/or fabrication of wafers.

As described above, depending on the process step or steps to be performed by the tool, the controller may, upon material transfer moving containers of wafers from/to load ports and/or tool positions within the semiconductor fabrication plant, Communicate with one or more of the following: other tool circuits or modules, other tool components, cluster tools, other tool interfaces, neighboring tools, neighboring tools, tools located throughout the plant, main computer, another controller or tools being used. You may.

Claims (12)

A detector system configured to detect a condition of an edge coupling ring disposed about a substrate support within a substrate processing chamber, comprising:
A camera configured to acquire image data of a plasma-facing surface of an edge coupling ring through a first view port of a substrate processing chamber, the image data relative to a reference structure within the substrate processing chamber. the camera, indicating a position of the plasma-facing surface of ; and
It includes a first controller, wherein the first controller,
control an actuator to selectively move the edge coupling ring relative to a substrate support;
receiving the image data from the camera; and
and determining at least one of a state and the position of the plasma-facing surface of the edge coupling ring based on the image data. According to claim 1,
wherein the reference structure is a liner surrounding the substrate support. According to claim 2,
wherein the image data comprises image data of a section of the edge coupling ring relative to the at least one opening of the liner, and determines at least one of the condition and the position of the plasma-facing surface of the edge coupling ring. wherein the first controller is configured to calculate a height between the section of the edge coupling ring and an upper end of the at least one opening. According to claim 2,
wherein the liner has a plurality of openings and the image data indicates the position of the plasma-facing surface of the edge coupling ring relative to the plurality of openings. According to claim 4,
The first controller (i) calculates a plurality of heights between the section of the plasma-facing surface of the edge coupling ring and the upper ends of each of the plurality of openings, and (ii) calculates a plurality of heights of the edge coupling ring. and compare the plurality of heights to determine at least one of the position and the state of the plasma-facing surface. According to claim 1,
and an illumination device configured to provide light to the camera to acquire the image data of the edge coupling ring. According to claim 6,
and the illumination device provides light through the first viewport. According to claim 7,
wherein the illumination device is arranged to provide light through a second viewport of the substrate processing chamber. According to claim 1,
wherein the first controller is configured to control the actuator to move the edge coupling ring perpendicularly relative to the substrate support in response to a condition indicative of erosion of the plasma-facing surface of the edge coupling ring. . According to claim 1,
wherein the first controller is configured to control the actuator to move the edge coupling ring horizontally with respect to the substrate in response to a condition indicative of a misalignment of the edge coupling ring. According to claim 1,
wherein the first controller is configured to adjust the position of the camera in response to detecting a state of the edge coupling ring. comprising a detector system according to claim 1; and
the substrate processing chamber;
the substrate support;
a liner surrounding the substrate support, the liner having at least one opening; and
The substrate processing system of claim 1 , further comprising the edge coupling ring.

Images