KR20190142896A - Apparatus and method for manufacturing bus bar - Google Patents

Abstract

The present invention provides a bus bar manufacturing device and a bus bar manufacturing method. The bus bar manufacturing device comprises: a housing; a lower fixed plate arranged in the housing; a lower mold clamped on the lower fixed plate; an upper fixed plate arranged in the housing to be vertically movable in order to be coupled with the lower fixed plate; an upper mold clamped on the upper fixed plate; a vacuum chamber arranged in the housing to vacuum the inside of the coupled lower fixed plate and the coupled upper fixed plate; a temperature adjusting chamber providing heat to the lower fixed plate or the upper fixed plate; and a bus bar manufactured to be arranged between the upper mold and the lower mold.

Description

Manufacturing apparatus and manufacturing method for busbars {APPARATUS AND METHOD FOR MANUFACTURING BUS BAR}

The present invention relates to a busbar manufacturing apparatus and a manufacturing method for manufacturing a busbar having an improved structure.

Bus bar (Bus bar) is a medium for transmitting electrical energy, and has the advantage of delivering a large amount of electrical energy in the same volume compared to the existing means of transmitting electrical energy such as cables.

Such busbars are used in, for example, power module busbars of vehicles, busbars of frequency converter modules of wind power generation, busbars of explosion-proof frequency converter modules, and the like.

On the other hand, the busbar is made of copper (Cu) excellent in conductivity, but the busbar made of copper has a problem that can easily be corroded by the external environment due to the nature of the material.

In order to solve this problem, one of the conventional methods is filling a molding agent such as epoxy or urethane around the N-pole bus bar and the P-pole bus bar.

However, this method is cumbersome to fill a separate insulation between the N-pole bus bar and the P-pole bus bar, and in the case of a capacitor, the reliability of the performance is increased by the inductance increase and heat generated by the surge voltage. Can be reduced.

Another conventional method is to coat an insulating coating on a processed copper plate, and to arrange an insulating plate between the N-pole bus bar and the P-pole bus bar manufactured by performing a thermosetting drying operation, and the outer side of the N-pole bus bar and the P-pole bus bar, respectively. Is assembled.

However, this method increases manufacturing time and slows down productivity due to the multi-step process such as environmental problems caused by the scattering of the insulating paint, spraying the insulation road, and manufacturing separate insulating plates and placing them between the busbars. There is a problem that must be expensive.

The present invention has been made to solve the above problems, the object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a busbar that can manufacture an integrated busbar that can have excellent performance while the manufacturing process is shortened. have.

The present invention to achieve the above object, the housing; A lower fixing plate disposed in the housing; A lower mold clamped to the lower fixing plate; An upper fixing plate disposed in the housing so that the lower fixing plate is coupled to the lower fixing plate; An upper mold clamped to the upper fixing plate; A vacuum chamber disposed in the housing and configured to vacuum the inside of the lower fixing plate and the upper fixing plate; A temperature control chamber providing heat to the lower fixing plate or the upper fixing plate; And a bus bar disposed between the upper mold and the lower mold to be manufactured.

In addition, the lower mold may be formed of a first settling region in which the busbar is placed, and a first coupling region which forms an outer surface of the first settled region and is coupled to the upper mold.

In addition, the upper mold may be formed of a second settling region in which the busbar is placed, and a second joining region which forms an outer surface of the second settling region and is coupled to the lower mold.

The first settling region may include at least one or more setting pins protruding upward and inserted into the through-holes of the busbars to fix the busbars, and the second settling regions may be located at positions corresponding to the setting pins. It may include a setting groove formed to be inserted into the setting pin.

The first coupling region may include at least one guide pin protruding upward, and the second coupling region may include a guide groove formed to insert the guide pin at a position corresponding to the guide pin. .

In addition, when the lower mold and the upper mold are combined, the first settling region and the second settled region form a sealed space, and the upper mold has a communication hole communicating with the vacuum chamber to make the sealed space in a vacuum state. At least one may be formed.

In addition, the busbar, the first plate is made of a conductive metal; A second plate disposed on a lower side of the first plate and made of a conductive metal; A first film disposed between the upper mold and the upper surface of the first plate; A second film disposed between the first plate and the second plate; And a third film disposed between the lower mold and the lower side of the second plate, wherein the first to third films may be deposited by heat fusion to the first plate and the second plate.

In addition, the first plate and the second plate may be made of copper (Cu).

The apparatus may further include a fourth film disposed between the second film and the second plate, and the fourth film may be deposited by thermally fusion to the second film and the second plate.

In addition, the first to third films may be prepared as a thermally conductive plastic.

On the other hand, the present invention, a plate manufacturing step of manufacturing a first plate and a second plate of a conductive metal to form an N pole and a P pole; The first film disposed on the upper side of the first plate, the second film disposed between the first plate and the second plate, and the third film disposed on the lower side of the second plate are thermally conductive plastics. To produce a film manufacturing step; And a heat fusion step of sequentially laminating and thermally fusion the third film, the second plate, the second film, the first plate, and the first film in the busbar manufacturing apparatus. .

In addition, the heat fusion step, the mold placement step of placing the lower mold and the upper mold on the lower fixing plate by separating the lower fixing plate and the upper fixing plate of the busbar manufacturing apparatus; A clamping step of moving the upper fixing plate in the direction of the lower fixing plate, the lower fixing plate clamping the lower mold, and the upper fixing plate clamping the upper mold; A material disposing step of separating the upper fixing plate from which the upper mold is clamped from the lower fixing plate, and sequentially laminating the third film, the second plate, the second film, the first plate, and the first film on the lower mold; And a heat fusion step of manufacturing the busbar by pressing the lower mold and the upper mold by moving the upper fixing plate to the lower fixing plate and applying heat to the combined lower mold or the upper mold.

In addition, the heat fusion step may be formed in a vacuum state of the inner space formed by the lower mold and the upper mold.

The present invention is a busbar manufacturing apparatus and method for manufacturing a single busbar by heat-sealing the first to fourth films made of thermally conductive plastic on the first plate and the second plate forming the N pole and the P pole. By providing a, there is no need to arrange or assemble a separate insulator for insulating between the first plate and the second plate, it is possible to reduce the weight, shorten the manufacturing time, productivity is increased to realize the overall cost.

1 is a schematic perspective view of a busbar manufacturing apparatus according to an embodiment of the present invention.
Figure 2 is a perspective view of the upper mold, busbar and lower mold shown in FIG.
3 is a view of the lower mold shown in FIG. 2 from a different angle;
Figure 4 is a view showing a state in which the busbar is placed on the lower mold.
5 is an enlarged view of the busbar shown in FIGS. 1 and 2.
6 is a top side view of the completed busbar.
7 is a flowchart of a busbar manufacturing method according to an embodiment of the present invention.
FIG. 8 is a flowchart illustrating the thermal fusion step of FIG. 7.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Unless otherwise defined, all terms in the specification are the same as the general meaning of terms understood by those skilled in the art, and if the terms used herein conflict with the general meaning of the terms, the terms used in the present specification shall be followed.

However, the invention to be described below is not intended to limit the scope of the present invention, but to describe the embodiments of the present invention, the same reference numerals throughout the specification represent the same components.

1 is a schematic perspective view of a busbar manufacturing apparatus according to an embodiment of the present invention, Figure 2 is a perspective view of the upper mold, the busbar and the lower mold shown in Figure 1, Figure 3 is a different angle of the lower mold shown in FIG. View from the view. 4 is a view showing a state in which the busbar is placed in the lower mold, Figure 5 is an enlarged view of the busbar shown in Figures 1 and 2, Figure 6 is a top side view of the completed busbar.

1 to 6, the busbar 100 according to the present invention includes a first plate 110, a second plate 120, a first film 130, a second film 140, and a third film. 150, and may further include a fourth film 160.

Specifically, the first plate 110 may be made of a conductive metal, and may be implemented as the N pole of the bus bar 100.

The second plate 120 may be disposed on the lower side of the first plate 110 and may be made of a conductive metal, and may be implemented as a P pole of the bus bar 100.

The first plate 110 and / or the second plate 120 may be made of copper (Cu) having excellent conductivity.

The first film 130 is disposed between the upper mold 250 and the upper surface of the first plate 110 to be described later, the second film 140 is the first plate 110 and the second plate. It is disposed between the 120, the third film 150 may be disposed between the lower mold 230 to be described later and the lower side of the second plate 120.

In addition, a fourth film 160 may be further included for effective insulation between the first plate 110 and the second plate 120, and the fourth film 160 may include the second film 140. And the second plate 120, or between the second film 140 and the first plate 110.

Here, the first film 130, the second film 140, the third film 150 and / or the fourth film 160 is heat-sealed to the first plate 110 and the second plate 120. By being deposited, it can be manufactured as a single busbar 100 that does not require separate assembly.

In addition, the first film 130, the second film 140, the third film 150 and / or the fourth film 160 may be made of a thermally conductive plastic.

The thermally conductive plastic is a plastic having a heat transfer rate increased by 5 to 100 times compared to a conventional plastic, and may have insulation performance and heat transfer performance similar to that of metal.

Therefore, the busbar 100 according to the embodiment of the present invention can reduce the weight, and can quickly remove the hot spots (hot spots) to lower the temperature to improve the durability of the busbar 100, the conventional As a single busbar 100 that does not require the assembly of a separate insulating material or spraying the insulating paint, labor costs can be reduced and can respond to environmental regulations.

The busbar manufacturing apparatus 200 for manufacturing the busbar 100 is as follows.

Bus bar manufacturing apparatus 200 according to an embodiment of the present invention, the housing 210, the lower fixing plate 220, the lower mold 230, the upper fixing plate 240, the upper mold 250, the vacuum chamber 260, The temperature control chamber 270 may be included, and the control panel 280 may be included.

The housing 210 may form an appearance of the busbar manufacturing apparatus 200, and an opening may be formed to put components of the busbar 100 to be manufactured or to pull out the manufactured busbar 100. have.

The lower fixing plate 220 may be disposed in the housing 210, and may be disposed to be movable up and down in the housing 210.

In addition, the lower fixing plate 220 may clamp the lower mold 230 to be described later.

At least one first clamping hole 231 may be formed at a lower side of the lower mold 230 so as to be clamped to the lower fixing plate 220.

In addition, the lower mold 230 has an upper side forming a first settled region 232 on which the bus bar 100 is placed, and an outer surface of the first settled region 232 and the upper mold 250. It may be formed as a first coupling region 233 coupled with.

In addition, the lower mold 230 is disposed to protrude upward in the first settled region 232 is inserted into the through hole of the bus bar 100 by at least one or more setting pins to fix the bus bar 100 234 may include.

The setting pin 234 may be detachably disposed so that the setting pin 234 may be disposed in another area of the first settling area 232 according to the position of the through hole of the bus bar 100.

In addition, the first coupling region 233 may include at least one guide pin 235 protruding upward.

The upper fixing plate 240 may be disposed in the housing 210, and may be disposed to be movable up and down in the housing 210 to be coupled to the lower fixing plate 220.

At least one second clamping hole 251 may be formed on the upper surface of the upper mold 250 so that the upper mold 250 may be clamped to the upper fixing plate 240.

In addition, a lower side surface of the upper mold 250 forms a second settlement region 252 in which the bus bar 100 is placed, and an outer surface of the second settlement region 252 and the lower mold 230. It may be formed as a second coupling region 253 coupled to.

Here, the second settling region 252 may include a setting groove 254 formed to insert the setting pin 234 at a position corresponding to the setting pin 234, thereby the bus bar 100 At the time of thermal fusion of) can be precisely aligned between the components of the busbar (100).

The second coupling region 253 may include a guide groove 255 formed to insert the guide pin 235 at a position corresponding to the guide pin 235.

In addition, the guide groove 255 may be provided with a guide packing 256 of an elastic material to ensure a firm coupling and sealing force of the guide pin.

In order to further improve thermal fusion, when the lower mold 230 and the upper mold 250 are combined, the first settled region 232 and the second settled region 252 may form a closed space. At least one communication hole 257 may be formed in the upper mold 250 to communicate with the vacuum chamber 260 which will be described later to make the sealed space into a vacuum state.

The vacuum chamber 260 may be disposed in the housing 210 to make a vacuum inside the lower fixing plate 220 and the upper fixing plate 240.

To this end, the vacuum chamber 260 may be disposed to be moved up and down in the housing 210 to communicate with the upper mold 250.

The temperature control chamber 270 may provide heat to the lower fixing plate 220 or the upper fixing plate 240, which is disposed separately on the side of the housing 210, and the lower fixing plate 220 or the upper fixing plate. 240 may be connected.

The control panel 280 may be disposed in the housing 210 or may be disposed on a side surface thereof. The control panel 280 may move up and down of the lower fixing plate 220, and move up and down of the upper fixing plate 240 and the vacuum. The up and down movement of the chamber 260 and the temperature control of the temperature control chamber 270 may be controlled.

Referring to the time series of manufacturing the busbar 100 by the busbar manufacturing apparatus 200 according to the embodiment of the present invention as follows.

7 is a flowchart of a method for manufacturing a bus bar 100 according to an exemplary embodiment of the present invention, and FIG. 8 is a flowchart illustrating the thermal fusion step of FIG. 7.

First, in order to form the N pole and the P pole, the first plate 110 and the second plate 120 are manufactured in a shape according to the request of the purchaser, respectively, with a conductive metal (S100).

Here, the first plate 110 and the second plate 120 may process the copper plate by a waterjet method.

In addition, the first film 130 disposed on the upper surface of the first plate 110, the second film 140 disposed between the first plate 110 and the second plate 120, The third film 150 disposed on the lower side surface of the second plate 120 is manufactured using thermally conductive plastic (S200).

The relationships between the steps S100 and S200 are irrelevant.

Thereafter, the third film 150, the second plate 120, the second film 140, the first plate 110, and the first film 130 are sequentially disposed on the busbar manufacturing apparatus 200. Laminated and heat-sealed (S300).

Specifically, to explain the step S300, once, the lower fixing plate 220 and the upper fixing plate 240 of the busbar manufacturing apparatus 200 by separating the lower mold 230 and the upper mold (to the lower fixing plate 220) 250 is disposed (S310).

Thereafter, after moving the upper fixing plate 240 toward the lower fixing plate 220, the lower fixing plate 220 clamps the lower mold 230, and the upper fixing plate 240 is the upper mold ( Clamping 250) (S320).

Thereafter, the upper fixing plate 240 in which the upper mold 250 is clamped is spaced apart from the lower fixing plate 220, and the third film 150 and the second plate 120 are disposed on the lower mold 230. In operation S330, the second film 140, the first plate 110, and the first film 130 are sequentially stacked.

Here, the fourth film 160 may be further laminated between the second film 140 and the first plate 110 or between the second film 140 and the second plate 120.

Thereafter, by moving the upper fixing plate 240 is coupled to the lower fixing plate 220 to press the lower mold 230 and the upper mold 250, the combined lower mold 230 or upper mold 250 By applying heat to the bus bar 100 can be manufactured (S340).

Here, the step S340 by moving the vacuum chamber 260 to the lower side to communicate with the upper mold 250 to form the inner space formed by the lower mold 230 and the upper mold 250 in a vacuum state to heat Fusion can be achieved.

In short, the busbar manufacturing apparatus 200 according to the embodiment of the present invention and the busbar 100 according to the manufacturing method do not require a process of assembling a separate insulating material or a process of spraying the insulating paint and drying the thermally conductive plastic. By implementing a single bus bar 100 by heat-sealing the film manufactured in the light weight, increase in durability, reduced labor costs, increased productivity, and there is an advantage that can lower the product cost.

As described above, it will be understood by those skilled in the art that various changes and modifications can be made without departing from the technical spirit of the present invention, and the technical scope of the present invention is not limited to the contents described in the embodiments, but the claims It shall be determined by the scope and the range equivalent thereto.

100: busbar 110: first plate
120: second plate 130: first film
140: second film 150: third film
160: fourth film 200: manufacturing apparatus
210: housing 220: lower fixing plate
230: lower mold 231: first clamping hole
232: first settling region 233: first coupling region
234: setting pin 235: guide pin
240: upper fixing plate 250: upper mold
251: second clamping hole 252: second settling area
253: second coupling region 254: setting groove
255: guide groove 256: guide packing
260: vacuum chamber 270: temperature control chamber
280: control panel

Claims (13)

housing;
A lower fixing plate disposed in the housing;
A lower mold clamped to the lower fixing plate;
An upper fixing plate disposed in the housing so as to be coupled to the lower fixing plate so as to be movable upward and downward;
An upper mold clamped to the upper fixing plate;
A vacuum chamber disposed in the housing and configured to vacuum the inside of the lower fixing plate and the upper fixing plate;
A temperature control chamber providing heat to the lower fixing plate or the upper fixing plate; And
And a bus bar disposed between the upper mold and the lower mold to be manufactured.
The method of claim 1,
The lower mold is a bus bar manufacturing apparatus which is formed of a first settling region in which the busbar is placed, and a first coupling region which forms an outer surface of the first settled region and is coupled to the upper mold.
The method of claim 2,
The upper mold is a bus bar manufacturing apparatus is formed of a second settling area in which the busbar is placed, and a second coupling area which forms an outer surface of the second settling area and is coupled to the lower mold.
The method of claim 3,
The first settling region includes at least one or more setting pins protruding upward to be inserted into the through holes of the bus bars to fix the bus bars.
Bus bar manufacturing apparatus comprising a setting groove formed in the second set-up area so that the setting pin is inserted in a position corresponding to the setting pin.
The method of claim 3,
The first coupling region includes at least one guide pin protruding upwards,
Bus bar manufacturing apparatus including a guide groove formed in the second coupling region to be inserted into the guide pin in a position corresponding to the guide pin.
The method of claim 3,
When the lower mold and the upper mold are combined, the first and second settling regions form a closed space.
Bus bar manufacturing apparatus is formed in the upper mold at least one communication hole is formed in communication with the vacuum chamber to make the sealed space in a vacuum state.
The method of claim 1,
The busbar,
A first plate made of a conductive metal;
A second plate disposed on a lower side of the first plate and made of a conductive metal;
A first film disposed between the upper mold and the upper surface of the first plate;
A second film disposed between the first plate and the second plate; And
And a third film disposed between the lower mold and the lower side of the second plate.
The first film to the third film is a bus bar manufacturing apparatus which is deposited by heat-sealing the first plate and the second plate.
The method of claim 7, wherein
The first plate and the second plate is a bus bar manufacturing apparatus manufactured by copper (Cu).
The method of claim 7, wherein
And a fourth film disposed between the second film and the second plate, wherein the fourth film is thermally fused to the second film and the second plate and deposited.
The method of claim 7, wherein
The first film to the third film bus bar manufacturing apparatus is made of a thermally conductive plastic.
A plate manufacturing step of manufacturing a first plate and a second plate from a conductive metal to form an N pole and a P pole;
The first film disposed on the upper side of the first plate, the second film disposed between the first plate and the second plate, and the third film disposed on the lower side of the second plate are thermally conductive plastics. To produce a film manufacturing step; And
And a heat fusion step of sequentially laminating and thermally fusion the third film, the second plate, the second film, the first plate, and the first film on the busbar manufacturing apparatus.
The method of claim 11,
The thermal fusion step,
A mold placement step of placing a lower mold and an upper mold on the lower fixing plate by separating the lower fixing plate and the upper fixing plate of the busbar manufacturing apparatus;
A clamping step of moving the upper fixing plate in the direction of the lower fixing plate, the lower fixing plate clamping the lower mold, and the upper fixing plate clamping the upper mold;
A material disposing step of separating the upper fixing plate from which the upper mold is clamped from the lower fixing plate, and sequentially laminating the third film, the second plate, the second film, the first plate, and the first film on the lower mold; And
And a heat fusion step of manufacturing the busbar by pressing the lower mold and the upper mold by moving the upper fixing plate to the lower fixing plate, and applying heat to the combined lower mold or the upper mold.
The method of claim 12,
The heat fusion step is a bus bar manufacturing method, characterized in that for forming the inner space formed in the lower mold and the upper mold in a vacuum state.

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