KR20190136935A - Substrate holding apparatus, exposure apparatus, and method of manufacturing article - Google Patents

Abstract

The present invention relates to a substrate holding supporting apparatus capable of reducing exposure unevenness and to an exposure apparatus. The substrate holding supporting apparatus comprises: a support (521) having a gap; a reflection member (523) provided in the gap and reflecting the light which permeates a substrate (510) to a substrate side, wherein the reflection member (523) is disposed inclined with respect to the support (521).

Description

Substrate holding apparatus, exposure apparatus, and manufacturing method of article {SUBSTRATE HOLDING APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING ARTICLE}

The present invention relates to a substrate holding apparatus, an exposure apparatus, and a method of manufacturing an article.

When manufacturing devices, such as a semiconductor element and a liquid crystal display element using photolithography technique, the exposure apparatus which projects the pattern of a mask to a board | substrate with a projection optical system, and transfers a pattern is used.

The manufacturing process of a device includes the process of apply | coating a resist to a board | substrate, the process of transferring a pattern by exposure to a board | substrate, the process of developing the board | substrate with which the pattern was transferred, etc. Generally, the process of apply | coating a resist to a board | substrate and the process of developing the board | substrate with which the pattern was transferred are performed with a coater developer etc. different from the exposure apparatus which transfers a pattern by exposure with respect to a board | substrate.

Thus, in the manufacturing process of a device, a device is manufactured, conveying a board | substrate between different apparatuses. Each apparatus is provided with a board | substrate holding mechanism for holding a board | substrate by adsorption | suction etc., and for delivering a board | substrate, and a board | substrate holding mechanism is a board | substrate, such as the base holding a board | substrate, and the lift pin which raises and lowers a board | substrate. It is common to include a lifting mechanism.

Here, a gap arises between the base provided in the lower part of a board | substrate, and a board | substrate lifting mechanism. Therefore, the board | substrate has the area | region in which the base | base and the board | substrate elevating mechanism are arrange | positioned under it, and the area | region in which they are not arrange | positioned.

Nowadays, it is also common to manufacture a device using a transparent substrate through which exposure light passes, and when exposing to a transparent substrate, the exposure light transmitted through the substrate is reflected by the base and the substrate lifting mechanism, and the reflected light The resist apply | coated on this board | substrate is photosensitive. The resist is exposed by the reflected light, so that an exposure unevenness occurs on the substrate.

As a method for reducing the above-mentioned exposure nonuniformity, Chinese Patent Application Laid-Open No. 105045048 discloses a configuration for limiting reflection of exposure light by providing an antireflection member in a gap under the substrate. In the specification of Chinese Patent Application Publication No. 105045048, the problem is that the exposure light incident on the gap between the lower part of the substrate reduces the resist on the substrate as reflected light, and the exposure amount becomes excessive in the area on the substrate located above the gap. Doing. In order to reduce the exposure amount in the area | region on the board | substrate located above the said gap, in the board | substrate holding apparatus in the specification of Unexamined-Japanese-Patent No.105045048, the antireflection member is arrange | positioned at the said gap.

On the other hand, the inventors of the present application have found that the exposure light incident on the gap under the substrate proceeds to the bottom of the substrate holding apparatus and is attenuated, and most of them do not reach the resist on the substrate.

The board | substrate holding apparatus of this invention which solves the said subject is a board | substrate holding | maintenance containing the base which hold | maintains a board | substrate, and has a clearance gap, and the reflection member provided in the said gap, and reflecting the light which permeate | transmitted the said board | substrate side to the said board | substrate side. It is an apparatus, The said reflection member is arrange | positioned inclined with respect to the said base, It is characterized by the above-mentioned.

Other features of the present invention will become apparent from the following specific embodiments (referenced to the accompanying drawings).

1 is a schematic view of an exposure apparatus.
2 is a schematic view of a substrate holding mechanism.
3 is a diagram illustrating a first embodiment of the base constituting the substrate holding mechanism.
4 is a view showing a second embodiment of the base constituting the substrate holding mechanism.
5 is a view showing a third embodiment of the base constituting the substrate holding mechanism.
6 is a schematic diagram showing a mechanism for generating exposure unevenness.
It is a figure which shows the relationship between the wavelength of light and a transmittance | permeability in the photosensitive material.
It is a figure which shows the structure for reducing exposure nonuniformity.
9 is a schematic diagram showing a mechanism for reducing exposure unevenness.
10 is a diagram illustrating a method of determining the inclination angle of the reflection member with respect to the base.
It is a figure which shows the detail of a board | substrate holding mechanism.
It is a figure which shows the structure of the reflection member in a modification.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described with reference to an accompanying drawing. The substrate holding apparatus of the present invention is preferable for holding a transparent substrate such as a sapphire substrate or a glass substrate. The sapphire substrate is used as a substrate such as an LED (Light Emitting Diode) element. Glass substrates are used as substrates, such as a liquid crystal panel.

1 is a schematic diagram showing the configuration of an exposure apparatus 1 as one side of the present embodiment. The exposure apparatus 1 is used to form a pattern on a substrate. The exposure apparatus 1 includes a light source device 100 including a light source 110, an illumination optical system 200 for illuminating the master plate 310, and a master stage 300 for holding the master plate 310. Moreover, the exposure apparatus 1 includes the projection optical system 400 which projects the image of the pattern of the original plate 310 onto the substrate 510 held on the substrate stage 500 (substrate holding device). do.

As the light source 110, a high pressure mercury lamp, an excimer laser, or the like is used. In addition, as general exposure light, g-rays (wavelength of about 436 nm) or near ultraviolet light having a wavelength region of 100 nm to 400 nm are used. For example, the g- and i-rays of ultra-high pressure mercury lamp (wavelength about 365 nm), KrF excimer laser light (wavelength about 248 nm), ArF excimer laser light (wavelength about 193 nm), F2 laser light (wavelength about 157 nm) ) Is used.

The light irradiated from the light source 110 is guided to the disc 310 through the optical system 210 included in the illumination optical system 200. The projection optical system 400 includes the optical system 410 and the aperture stop 420, and projects the pattern of the original plate 310 onto the substrate 510 at a predetermined projection magnification. A photosensitive material (resist) having sensitivity to light having a specific wavelength is applied to the substrate 510. When the image of the pattern of the original plate 310 is projected onto the resist, a latent image pattern is formed on the resist.

The board | substrate 510 is hold | maintained by the board | substrate holding mechanism 500 as a board | substrate holding apparatus. The substrate holding mechanism 500 holds the substrate 510 by vacuum adsorption or electrostatic adsorption using an adsorption pad (not shown). The detailed structure of the board | substrate holding mechanism 500 is mentioned later.

The exposure apparatus 1 is a scanning exposure apparatus (scanner) which transfers the pattern of the original plate 310 to the substrate 510 while synchronously scanning the original plate 310 and the substrate 510 in the scanning direction. )to be. Hereinafter, the non-scanning direction which is perpendicular to the Y-axis direction, the Z-axis direction, and the Y-axis direction in the scanning direction of the substrate 510 in a plane perpendicular to the Z-axis direction and the Z-axis direction in the vertical direction is the X-axis direction. It is done.

The amount of light (exposure amount) projected onto the substrate 510 by the projection optical system 400 is an important factor for determining the line width of the pattern, and by exposing the resist on the substrate 510 at an appropriate exposure amount, a pattern with high precision can be obtained. It becomes possible to form.

For example, when repeatedly forming the same pattern in the pattern formation area on the board | substrate 510, it is preferable to perform exposure so that exposure nonuniformity may not generate | occur | produce in the whole area | region of a pattern formation area. By studying the configuration of the illumination optical system 200 and the projection optical system 400, it is possible to reduce the variation in the exposure amount projected on the substrate 510, but the so-called flare light is irradiated to the resist on the substrate 510 to thereby resist Unevenness may occur in the amount of light incident on the.

Here, among the light transmitted through the original plate 310, the light irradiated to the resist on the substrate 510 through the opening of the optical system 410 and the aperture stop 420 included in the projection optical system 400 is normalized. In this case, light other than the normal light is flare light.

(About outbreak of exposure unevenness)

Subsequently, the cause of exposure unevenness in the exposure apparatus will be described with reference to FIGS. 2 to 6. 2A shows a state where the substrate 510 is held by the substrate holding mechanism 500. 2B illustrates a state in which the substrate 510 is lifted in the Z-axis direction by the substrate lifting mechanism 522. The board | substrate 510 is conveyed by the board | substrate conveying apparatuses, such as a conveyance robot which is not shown in the state isolate | separated from the board | substrate holding mechanism 500 by the board | substrate elevating mechanism 522. As shown in FIG.

In FIG. 2A, the substrate holding mechanism 500 vacuum-adsorbs the substrate 510 using a suction pad (not shown) positioned between the base 521 and the substrate 510. The suction pad is provided on the upper surface of the base 521. In addition, the holding method of the board | substrate 510 is not limited to vacuum adsorption, For example, it is good also as a structure which holds the board | substrate 510 by electrostatic adsorption. When exposing the substrate 510, the substrate 510 is held by the base 521, as shown in FIG. 2A.

The substrate lifting mechanism 522 is movable in the Z-axis direction, and when the substrate 510 is separated from the base 521, as shown in FIG. 2B, the substrate lifting mechanism 522 is Z-axis. Direction, and lifts the substrate 510 upward in the Z-axis direction.

The board | substrate elevating mechanism 522 contains the lifting part 522B which moves up and down in a Z-axis direction, and the contact part 522C which contacts the board | substrate 510, and makes the upper surface of the contact part 522C the upper surface 522A. . Since the contact portion 522C is in contact with the substrate 510, the material of the contact portion 522C is determined in consideration of the fact that scratches are hardly generated on the substrate 510 and that it is difficult to wear due to the contact of the substrate 510. . The contact portion 522C is generally made of a resin material or the like.

Here, as shown in FIG. 2A, in a state where the substrate 510 is held by the base 521, a minute gap is provided between the substrate 510 and the substrate lifting mechanism 522. . Thereby, the risk that the board | substrate 510 interferes with the board | substrate elevating mechanism 522, and the position of the board | substrate 510 changes in the Z-axis direction can be reduced.

Next, the arrangement relationship between the base 521 and the substrate lifting mechanism 522 will be described with reference to FIGS. 3 to 5. 3 shows an example in which a base 521 constituting the substrate holding mechanism 500 is divided into a plurality of (8) substrate holding portions in the XY plane, and a gap is provided between the substrate holding portions. The board | substrate holding parts 521a, 521b, 521c, and 521d are arrange | positioned at the plus side of a Y-axis direction, and the board | substrate lifting part 522a, 522b, 522c is provided in these clearance gaps. In addition, the board | substrate holding parts 521e, 521f, 521g, and 521h are arrange | positioned at the negative side of a Y-axis direction, and the board | substrate lifting part 522d, 522e, 522f is provided in these clearance gaps. 3 shows an example in which a lift bar is disposed as the substrate lifting unit.

In FIG. 4, the base 521 is divided into substrate holding portions 521a ', 521b', 521c ', and 521d'. Substrate lifting portions 522a ', 522b', 522c ', and 522d' are provided in each of the substrate holding portions. Further, the substrate lifting portion 522e 'is provided in the gap between the substrate holding portions 521a' and 521b ', and the substrate lifting portion 522f' is provided in the gap between the substrate holding portions 521c 'and 521d'. have. Each board | substrate lifting part in FIG. 4 is comprised by the lift bar.

In FIG. 5, the base 521 is divided into substrate holding portions 521a ", 521b", 521c ", 521d", 521e ", and 521f". Through board | substrates are provided in each board | substrate holding part, and the lift pin 522 as a board | substrate lifting mechanism which moves the inside of a through hole to a Z-axis direction is provided.

Thus, the board | substrate elevating mechanism 522 may be a lift bar type shown in FIG. 3 or FIG. 4, and may be a lift pin type shown in FIG. Anyway, the board | substrate lifting part which comprises the board | substrate lifting mechanism 522 is arrange | positioned at the clearance gap provided in the base 521. And as demonstrated using FIG. 3 thru | or 5, a clearance gap is provided between board | substrate holding parts, or between a board | substrate holding part and a board | substrate lifting part, and the exposure light which passes through this gap becomes a cause of exposure nonuniformity.

6, the mechanism by which exposure nonuniformity generate | occur | produces is demonstrated. FIG. 6 shows a state in which exposure light is irradiated onto the resist 511 applied on the substrate 510. The light ray 10 incident on the resist 511 from the space above the base 521 passes through the resist 511 and the substrate 510 and is reflected on the upper surface 521A of the base 521. The light ray 12 incident on the resist 511 from the space above the substrate raising and lowering mechanism 522 passes through the resist 511 and the substrate 510 and is reflected on the upper portion of the substrate raising and lowering mechanism 522. On the other hand, the light rays 11 incident on the resist 511 from the upper portion of the gap between the base 521 and the substrate lifting mechanism 522 pass through the resist 511 and the substrate 510.

Here, part of the exposure light incident on the resist 511 is absorbed by the resist 511. Depending on the wavelength of the exposure light and the optical characteristics of the resist 511, the light absorption and transmittance are different. The transmittance | permeability of exposure light with respect to a resist is calculated | required as follows.

First, assuming that the light propagates in the Z direction as a one-dimensional plane wave, the amplitude E (Z, t) of the plane wave at time t is

Is displayed. k is the wave number and ω is the frequency. When the complex refractive index N is used, the frequency ω is

The amplitude E (Z, t) can be expressed as follows.

Moreover, from ω = 2πc / λ

Becomes

In addition, since the energy I (Z, t) of light is obtained from the power of the norm of the power of amplitude E (Z, t) or the power of the norm of amplitude E (Z, t),

Is displayed.

Here, when the light transmittance T is calculated,

Becomes

The light transmitted through the resist 511 along the transmittance T calculated in this manner passes through the substrate 510 and reaches the base 521 or the upper portion of the substrate lifting mechanism 522. FIG. 7 is a diagram showing the relationship between the wavelength of light and the transmittance in a specific resist. FIG. In the exposure apparatus using a mercury lamp, i line | wire (wavelength about 365 nm), h line | wire (wavelength about 405 nm), g line | wire (wavelength about 436 nm), etc. are used as exposure light. In FIG. 7, the transmittance with respect to the i-line is indicated by Ti, the transmittance with respect to the h-line, and the transmittance with respect to the Th, g-line is represented by Tg. It can be seen that the values of the transmittances differ for each wavelength.

Light reaching the upper part of the base 521 and the substrate lifting mechanism 522 is reflected by the specular reflection and the diffuse reflection on the reflection surface. The specular reflection is a reflection whose reflection angle is determined by the angle of light incident on the reflection surface. In general, the incident angle and the reflection angle of the light become equal. Diffuse reflection is reflection which does not depend on the angle of incidence of the light incident on the reflection surface, and the intensity of light reflected at the angle θ from the line of the reflection surface depends on cosθ. Diffuse reflection is also referred to as lanva art reflection.

The light reflected or diffusely reflected from the upper surface of the base 521 or the substrate lifting mechanism 522 may enter the resist 511 as flare light after passing through the substrate 510. On the other hand, the light shown as the light beam 11 in FIG. 6 enters the gap between the base 521 and the substrate lifting mechanism 522, and most of the light is attenuated without again entering the resist 511.

As described above, an area on which the flare light is generated and an area on which the flare light is hardly generated are generated on the substrate 510. As described above, the flare light is generated in accordance with the upper surface reflection characteristics of the base 521 and the substrate lifting mechanism 522, and it is difficult to sufficiently reduce the flare light. Since light quantity of flare light which injects into the resist 511 differs according to each area | region on the board | substrate 510, exposure nonuniformity arises as a result.

(About reduction method of exposure nonuniformity)

Next, the method to reduce exposure nonuniformity is demonstrated using FIG. 8 and FIG. In FIG. 8, the above-described exposure nonuniformity was reduced by providing the reflective member 523 at an interval between the base 521 and the substrate lifting mechanism 522 with respect to the upper surface of the base 521. In addition, since the structure other than the reflective member 523 in FIG. 8 is the same as the structure shown in FIG. 2, description is abbreviate | omitted. The reflective member 523 is comprised of resin materials, such as acrylic and Teflon (registered trademark), and metal materials, such as aluminum. Moreover, the member which gave the metal material the surface treatment, such as plating, may be sufficient. The reflective member 523 is disposed in an area below the contact portion 522C of the substrate lifting mechanism 522.

Next, the mechanism by which exposure nonuniformity is reduced using FIG. 9 is demonstrated. Since the optical paths of the light beam 10 and the light beam 12 are as shown in FIG. 6, description is abbreviate | omitted here. The light ray 11 penetrates the resist 511 and the board | substrate 510, reaches | attains the upper surface 523A of the reflective member 523, and is reflected by the upper surface 523A to the board | substrate side.

As described above, the light rays are reflected on the upper surface 523A of the reflective member 523 by the specular reflection and the diffuse reflection. The behavior of the light rays 41 specularly reflected by the upper surface 523A and the light rays 42 diffusely reflected by the upper surface 523A is determined by the specular reflectance and the diffuse reflectance of the upper surface 523A, respectively.

Here, the specular reflectance tends to cause a large variation due to a manufacturing error of the reflective member 523 or the like. When the specular reflectance of the upper surface 523A of the reflective member 523 deviates from a desired value, there exists a possibility that the effect of reducing exposure nonuniformity mentioned later may not fully be acquired. On the other hand, since the diffuse reflectance has a small variation due to manufacturing error or the like compared to the specular reflectance, the effect of reducing the exposure unevenness can be easily obtained by reducing the exposure unevenness by the light diffused and reflected by the upper surface 523A.

Therefore, in the present invention, by providing the reflecting member 523 inclined with respect to the upper surface of the base 521, the light that is specularly reflected on the upper surface 523A of the reflecting member 523 is resist 511 on the substrate 510. ), Making it difficult to reach. That is, in the present invention, exposure unevenness is mainly reduced by light diffused and reflected on the upper surface 523A of the reflective member 523.

As shown in FIG. 9, the light rays 41 specularly reflected on the upper surface 523A of the reflective member 523 are inclined with respect to the upper surface of the base 521 such that the light rays 41 reach the side surfaces of the base 521. 523 is disposed. The light rays 41 reaching the side of the base 521 are attenuated, and most of them do not reach the resist 11. On the other hand, the light rays 42 which are part of the light diffused and reflected on the upper surface 523A of the reflecting member 523 pass through the gap between the base 521 and the substrate elevating mechanism 522 and transmit the substrate 510. After that, the resist 511 is reached.

As described above, the inclination angle of the reflective member 523 with respect to the upper surface of the base 521 is such that the light beams 41 reflected by the upper surface 523A of the reflective member 523 reach the side surface of the base 521. Is set to.

Next, the method of determining the inclination angle θ of the reflective member 523 with respect to the upper surface of the base 521 will be described with reference to FIG. 10. Here, the gap between the base 521 provided with the reflective member 523 and the substrate lifting mechanism 522 is W, and the center of the top surface 523A of the reflective member 523 and the top surface 521A of the base 521 are provided. The distance in the vertical direction is d, and the inclination angle of the reflective member 523 with respect to the upper surface 521A of the base 521 is denoted by θ.

The light rays 21 incident perpendicularly to the center of the upper surface 523A are specularly reflected at a reflection angle of 2θ. Here, the conditions under which the light beams 41 reflected on the upper surface 523A of the reflective member 523 reach the side surface of the base 521 are represented by the following conditional expressions.

W <d × | tan2θ |

In other words,

or

It is sufficient to set the inclination angle θ of the reflective member 523 with respect to the upper surface 521A of the base 521 so as to satisfy.

As described above, in the gap between the base 521 and the substrate lifting mechanism 522, the resist 511 positioned above the gap is provided by inclining the reflective member 523 with respect to the upper surface of the base 521. Flare light is also incident on. In addition, by appropriately setting the inclination angle θ of the reflective member 523 with respect to the base 521, it is possible to accurately estimate the amount of light of the flare light incident on the resist 511.

In addition, depending on the amount of flare light to be incident on the resist 511 located above the gap between the base 521 and the substrate elevating mechanism 522, the material of the reflecting member 523 or the reflecting member in the vertical direction. It is desirable to determine the position of 523. As a result, the amount of light reflected by the base 521 and reaching the first resist region above the base 521 and by the reflective member 523 reaches the second resist region above the reflective member 523. The difference in the amount of light to be made becomes small. The amount of light that is reflected by the substrate elevating mechanism 522 to reach the third resist region above the substrate elevating mechanism 522 and the second of the upper portion of the reflecting member 523 that is reflected by the reflective member 523 The difference in the amount of light reaching the resist region is small.

As a result, the light quantity distribution of the flare light irradiated to the resist 511 can be made uniform to some extent. In addition, a 1st resist region is a region illustrated by 511A in FIG. 8, a 2nd resist region is a region illustrated by 511B in FIG. 8, and a 3rd resist region is illustrated by 511C in FIG. Area.

(About position adjustment of the reflecting member)

As mentioned above, in order to reduce exposure nonuniformity effectively, it is preferable to provide the position adjustment mechanism which adjusts the position of the reflection member 523 in the Z-axis direction. The reflectances of the base 521, the substrate lifting mechanism 522, and the reflecting member 523 are mainly determined by the physical property values of the material, but variations in reflectance may occur due to manufacturing errors or the like. The reflectance may also vary depending on the characteristics of the resist, the wavelength of the exposure light, and the process during exposure. By driving the reflective member 523 in the Z-axis direction, the exposure unevenness that may be caused by these fluctuations in the reflectance can be reduced.

The detail of the board | substrate holding apparatus containing a position adjustment mechanism is demonstrated using FIG. FIG. 11: is a figure for demonstrating the structure of the position adjustment mechanism 524 etc. of the reflective member 523 by extracting a part of FIG. As shown in FIG. 11, the reflective member 523 is disposed away from the base 521 and the substrate lifting mechanism 522. The reflective member 523 is driven by the position adjusting mechanism 524 and is movable in the Z axis direction.

The base 521 and the position adjustment mechanism 524 are attached to the upper part of the ceiling plate 525 on the movable stage (not shown) which can move to an X-axis direction and a Y-axis direction. The elevating portion 522B constituting the substrate elevating mechanism 522 penetrates the top plate 525, and the elevating portion 522B is driven along the guide 526 in the Z-axis direction by an actuator (not shown). The position adjusting mechanism 524 is driven in the Z-axis direction by an actuator (not shown) provided in the top plate 525.

(Variation)

In the above-described embodiment, an example in which the reflective member 523 is provided by tilting the upper surface of the base 521 in the gap between the base 521 and the substrate lifting mechanism 522 has been described. As a structure for obtaining the effect similar to the said Example, as shown in FIG. 12, the structure which makes the upper surface of the reflective member 524 into the saw tooth shape provided with the inclined part 524A continuously.

As shown in FIGS. 12A and 12B, the same effect as that of FIG. 8 can be obtained by making the upper surface of the reflective member 524 into a sawtooth shape. The specific shape of the upper surface of the reflective member 524 is determined as follows.

Here, the gap between the base 521 provided with the reflective member 524 and the substrate lifting mechanism 522 is W, and the distance in the vertical direction of the center of the inclined portion 524A and the top surface 521A of the base 521 is determined. d, the inclination angle of the inclined portion 524A with respect to the base 521 is called θ.

The light beam 21 incident perpendicularly to the inclined portion 524A is specularly reflected at a reflection angle of 2θ. Here, the conditions under which the light beams 41 reflected by the inclined portion 524A reach the side surfaces of the base 521 are represented by the following conditional expressions.

W <d × | tan2θ |

In other words,

or

It is sufficient to set the inclination angle θ of the inclined portion 524A with respect to the upper surface 521A of the base 521 so as to satisfy.

Moreover, in the above-mentioned embodiment, although the Example which arrange | positioned the reflective member 523 in the clearance gap between the base 521 and the board | substrate elevating mechanism 522 was demonstrated, as shown in FIGS. It is good also as a structure which arrange | positions the reflection member 523 in the clearance gap between holding | maintenance parts. It is because even if the board | substrate lifting mechanism 522 is not arrange | positioned between board | substrate holding parts, if a clearance gap exists between board | substrate holding parts, the problem similar to the subject demonstrated so far may arise.

In addition, although the example which applied the board | substrate holding apparatus to the scanner as the exposure apparatus 1 was demonstrated so far, In addition, for example, the pattern of the original plate 310 is projected on the board | substrate 510 by fixing the original plate 310, for example. The board | substrate holding apparatus of this invention is applicable also to the stepper mentioned above.

(Production method of the article)

Next, the manufacturing method of the article (semiconductor integrated circuit element, liquid crystal display element, etc.) using the exposure apparatus mentioned above is demonstrated. As a manufacturing method of an article, the process of irradiating exposure light to the board | substrate hold | maintained using the board | substrate holding apparatus which concerns on this invention, and forming a pattern, and the process of processing (developing, etching etc.) the board | substrate with a pattern formed This is done. By using the board | substrate holding apparatus which concerns on this invention, exposure nonuniformity can be reduced effectively, As a result, the pattern formation precision on a board | substrate can be improved.

The process for producing genuine goods is advantageous over at least one of the performance, quality, productivity and production cost of the article, as compared to the prior art. Or the above-mentioned exposure apparatus can provide articles, such as a high quality device (semiconductor integrated circuit element, a liquid crystal display element, etc.).

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these embodiment, Of course, Various deformation | transformation and a change are possible within the range of the summary.

510: substrate
521: expectation
523: reflective member

Claims (20)

Holding the substrate and having a gap,
A substrate holding apparatus provided in the gap and including a reflection member reflecting light transmitted through the substrate to the substrate side;
The said reflective member is arrange | positioned inclined with respect to the said base, The board | substrate holding apparatus characterized by the above-mentioned. The method of claim 1,
When the interval between the gaps provided with the reflecting members is W, the distance in the vertical direction between the center of the upper surface of the reflecting member and the upper surface of the base is d, and the inclination angle of the reflecting member with respect to the upper surface of the base is?
W <d × | tan2θ |
A substrate holding apparatus characterized by satisfying a conditional expression. Holding the substrate and having a gap,
A substrate holding apparatus provided in the gap and including a reflection member reflecting light transmitted through the substrate to the substrate side;
The upper surface of the said reflection member is saw-toothed shape in which the inclined part was provided continuously, The substrate holding apparatus characterized by the above-mentioned. The method of claim 3,
When the interval between the gaps provided with the reflecting members is W, the distance in the vertical direction between the center of the upper surface of the inclined portion and the upper surface of the base is d, and the inclination angle of the inclined portion with respect to the upper surface of the base is θ,
W <d × | tan2θ |
A substrate holding apparatus characterized by satisfying a conditional expression. The method of claim 1,
A resist is coated on the substrate,
The reflecting member such that a difference between the amount of light reflected by the base and reaching the first resist region above the base and the amount of light reflected by the reflecting member and reaching the second resist area above the reflecting member becomes small; The substrate holding apparatus characterized by the above-mentioned. The method of claim 3,
A resist is coated on the substrate,
The reflecting member such that a difference between the amount of light reflected by the base and reaching the first resist region above the base and the amount of light reflected by the reflecting member and reaching the second resist area above the reflecting member becomes small; The substrate holding apparatus characterized by the above-mentioned. The method of claim 1,
And the reflecting member is movable in the vertical direction. The method of claim 3,
And the reflecting member is movable in the vertical direction. The method of claim 7, wherein
And a adjusting mechanism for moving the reflective member in the vertical direction. The method of claim 8,
And a adjusting mechanism for moving the reflective member in the vertical direction. The method of claim 1,
A through hole is provided in the base, and the reflective member is provided inside the through hole. The method of claim 3,
A through hole is provided in the base, and the reflective member is provided inside the through hole. The method of claim 1,
Further having a lifting mechanism for lifting the substrate in the vertical direction,
The said reflective member is provided in the clearance gap between the said base and the said lifting mechanism, The board | substrate holding apparatus characterized by the above-mentioned. The method of claim 3,
Further having a lifting mechanism for lifting the substrate in the vertical direction,
The said reflective member is provided in the clearance gap between the said base and the said lifting mechanism, The board | substrate holding apparatus characterized by the above-mentioned. The method of claim 13,
A resist is coated on the substrate,
So that the difference between the amount of light reflected by the reflective member and reaching the second resist area above the reflective member and the amount of light reflected by the lifting mechanism and reaching the third resist area above the lifting mechanism is reduced; A reflection holding member is provided, characterized in that the substrate holding device. The method of claim 14,
A resist is coated on the substrate,
So that the difference between the amount of light reflected by the reflective member and reaching the second resist area above the reflective member and the amount of light reflected by the lifting mechanism and reaching the third resist area above the lifting mechanism is reduced; A reflection holding member is provided, characterized in that the substrate holding device. The method of claim 1,
The base includes a plurality of substrate holding portions for holding the substrate,
The reflection holding member is provided in a gap between the plurality of substrate holding portions. The method of claim 3,
The base includes a plurality of substrate holding portions for holding the substrate,
The reflection holding member is provided in a gap between the plurality of substrate holding portions. It is an exposure apparatus which transfers the pattern of an original board to a board | substrate using exposure light,
Transferring the pattern of the said original board with respect to the said transparent substrate in the state holding the transparent substrate which has the characteristic which permeate | transmits exposure light with the board | substrate holding apparatus as described in any one of Claims 1-18. Exposure apparatus made into. Exposing the substrate using the exposure apparatus according to claim 19;
And developing the substrate exposed in the step.

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