KR20190135726A - Apparatus and method for optically inspecting an object - Google Patents

Abstract

According to various embodiments of the present invention, an apparatus for testing a subject optically includes: a multi-wavelength light source part emitting multi-wavelength light to a subject; a spectrum image obtaining part obtaining a spectrum image of the light reflected or scattered from the subject; an image processor processing a specific subject as a visualization image by distinguishing a spectrum according to the position of the subject from the obtained spectrum image; and a testing part testing a result of the application of the specific subject based on the processed visualization image. Based on information of a spectrum reflected or scattered from objects having different materials, components, or surface characteristics such as a specific subject (e.g., adhesives) and an adhesion target (e.g., equipment components and electronic components), the specific subject and the adhesion target are imaged separately and the specific subject is visualized, so a result can be accurately tested in regard to the position, distribution or shape of the application of the specific subject. Other embodiments are possible.

Description

Apparatus and method for optically inspecting an object}

Various embodiments of the present invention relate to apparatus and methods for optically inspecting a particular object (eg, an adhesive).

In general, electronic devices such as smartphones integrate various electronic and mechanical components, including printed circuit boards (eg, printed circuit board (PCB), printed board assembly (PBA) or flexible printed circuit board (FPCB)). can do.

The various components may differ in material. Parts with different materials can be glued together using automated dispensing equipment.

The dispensing equipment can apply a certain adhesive to the adhered position of the various parts, and can adhere parts with different materials. In this case, an inspection process for determining whether the desired amount of adhesive is properly applied to the to-be-attached position may be performed.

The inspection process may examine whether the adhesive is applied more or less than a fixed amount at the adhered position or at a position other than the adhered position.

If there is an error in the application of the adhesive, there is a problem in the adhesive force between the parts of the different materials, it may cause the drop impact failure, waterproof failure or malfunction of the electronic device.

Various embodiments of the present invention optically determine the results of whether a particular object (such as an adhesive) is properly applied to the adhered position of the adherend (such as a mechanical component (such as a bracket, a frame, a PCB) and an electronic component). An apparatus and method for testing can be provided.

Various embodiments of the present invention are directed to visualizing a particular object (e.g., an adhesive) applied on the deposits after the dispensing process, but before the adherents of different materials are bonded, for example, the location of the application of the adhesive, It is possible to provide an apparatus and method capable of optically inspecting the results for distribution, shape, and the like.

Optical inspection apparatus according to various embodiments of the present invention, the multi-wavelength light source unit for irradiating the multi-wavelength light to the target object; A spectroscopic image acquisition unit for acquiring a spectral image of light reflected or scattered from the target object; An image processor classifying a spectrum according to a position of the target object from the acquired spectrum image and processing a specific object as a visualized image; And an inspection unit for inspecting an application result of the specific object based on the processed visualized image.

An optical inspection method according to various embodiments of the present disclosure may include: irradiating a predetermined multi-wavelength light onto a target object; Obtaining a spectral image of light reflected or scattered from the target object; Dividing a spectrum according to the position of the target object from the acquired spectral image and processing a specific object as a visualized image; And based on the processed visualized image, it may include a process of examining the application result of the specific object.

According to various embodiments of the invention, reflections from objects of different materials, components, or surface properties, such as certain objects (such as adhesives) and adherends (such as mechanical components and electronic components such as brackets, frames, or PCBs) Alternatively, based on the scattered spectral information, the specific object and the adherend are separated and imaged, and the specific object is visualized, thereby accurately inspecting the result of the position, distribution, or shape of the application of the specific object (eg, adhesive). .

1 is a block diagram illustrating a camera module, in accordance with various embodiments.
2 is a block diagram schematically illustrating an optical inspection apparatus according to various embodiments of the present disclosure.
3 is a diagram illustrating an image visualized through an optical inspection apparatus according to various embodiments of the present disclosure.
4 is a flowchart illustrating an optical inspection method according to various embodiments of the present disclosure.
5 is a diagram for describing an image acquired through a general camera.
FIG. 6 is a diagram for describing wavelength spectrum information of each position of a target object according to various embodiments of the present disclosure; FIG.
7 is a diagram for describing a visualized image of a target object according to various embodiments of the present disclosure.

It is to be understood that the various embodiments of the present document and the terminology used herein are not intended to limit the techniques described in this document to specific embodiments, but include various changes, equivalents, and / or alternatives to the embodiments.

In connection with the description of the drawings disclosed in the present invention, like reference numerals refer to like elements. Singular expressions may include plural expressions unless the context clearly indicates otherwise.

1 is a block diagram 101 illustrating a camera module 100, in accordance with various embodiments.

Referring to FIG. 1, a camera module 100 that may be applied to various embodiments of the present invention may include a lens assembly 110, a flash 120, an image sensor 130, an image stabilizer 140, and a memory 150 ( For example, the buffer memory), or the image signal processor 160.

The lens assembly 110 may collect light emitted from a subject that is a target of image capturing. The lens assembly 110 may include one or more lenses. According to an embodiment, the camera module 100 may include a plurality of lens assemblies 110. In this case, the camera module 100 may form, for example, a dual camera, a 360 degree camera, or a spherical camera. Some of the plurality of lens assemblies 110 have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly is a different lens assembly. It may have one or more lens properties different from the lens properties of. The lens assembly 110 may include, for example, a wide angle lens or a telephoto lens.

The flash 120 may emit light used to enhance the light emitted or reflected from the subject. According to an embodiment, the flash 120 may include one or more light emitting diodes (eg, red-green-blue (RGB) LEDs, white LEDs, infrared LEDs, or ultraviolet LEDs), or xenon lamps.

The image sensor 130 may acquire an image corresponding to the subject by converting the light emitted or reflected from the subject and transmitted through the lens assembly 110 into an electrical signal. According to one embodiment, the image sensor 130 is the same as one image sensor selected from among image sensors having different properties, such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor. A plurality of image sensors having a property, or a plurality of image sensors having another property. Each image sensor included in the image sensor 130 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 140 moves the at least one lens or image sensor 130 included in the lens assembly 110 in a specific direction in response to the movement of the camera module 100, or changes the operating characteristics of the image sensor 130. Control (eg, read-out timing adjustment, etc.). This allows to compensate for at least some of the negative effects of the movement on the image taken. According to an embodiment, the image stabilizer 140 may detect movement of the camera module 100 using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 100. Can be. According to one embodiment, the image stabilizer 140 may be implemented with, for example, an optical image stabilizer.

The memory 150 may at least temporarily store at least a portion of the image acquired through the image sensor 130 for the next image processing task. For example, if the image acquisition according to the shutter is delayed or a plurality of images are obtained at high speed, the obtained original image (eg, Bayer-patterned image or high resolution image) is stored in the memory 150. Corresponding copy images (eg, low resolution images) may be previewed via the display. Thereafter, if a specified condition is satisfied (eg, a user input or a system command), at least a part of the original image stored in the memory 150 may be acquired and processed by, for example, the image signal processor 160.

 The image signal processor 160 may perform one or more image processes on the image acquired through the image sensor 130 or the image stored in the memory 150. The one or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring) blurring, sharpening, or softening In addition or alternatively, the image signal processor 160 may include at least one of components included in the camera module 100 (eg, an image sensor). Control (eg, exposure time control, readout timing control, etc.), etc. The image processed by the image signal processor 160 is stored back in the memory 150 for further processing. Or as an external component of the camera module 100.

Hereinafter, an apparatus and method for optically inspecting an object (eg, an adhesive) according to various embodiments of the present invention are described with reference to the accompanying drawings.

2 is a block diagram schematically illustrating an optical inspection apparatus according to various embodiments of the present disclosure.

2, the optical inspection apparatus 200 according to various embodiments of the present disclosure may include a multi-wavelength light source 210, a spectroscopic image acquirer 220, an image processor 230, an inspection unit 240, and a display ( 250).

The multi-wavelength light source unit 210 may irradiate the target object with multi-wavelength light having a predetermined wavelength and width. For example, the object may include a particular object, such as adhesive 203, and an adherend, such as instrument component 201 and electronic component 205, and the like. According to one embodiment, the instrument component 201 may include at least one of a bracket, a frame, or a PCB.

According to one embodiment, the adhesive 203 and the adherend (e.g., the instrument part 201 and the electronic part 205) have different reflection characteristics of the spectrum with respect to light so that image discrimination and detection characteristics are clear. Can be. The adhesive 203 may include a pigment or a fluorescent dye so that a reflection or emission spectrum may be differently detected with respect to visible light or invisible light (eg, ultraviolet light or infrared light) of 300 nm to 1300 nm. The adherend (eg, the instrument component 201 and the electronic component 205) may include at least one of metal, plastic, or a predetermined surface treatment such that the adhesive 203 and the light spectral characteristics are different. The multi-wavelength light may include at least one of visible light, ultraviolet light, or infrared light. The multi-wavelength light source unit 210 may include at least one of a fluorescent lamp, at least one light emitting device (LED), or at least one laser device.

The spectroscopic image acquisition unit 220 may acquire a spectral image of light reflected or scattered from the target object.

According to an embodiment, the spectroscopic image acquisition unit 220 may include a spectroscopic element 221 and a camera 225.

According to various embodiments, the spectroscopic element 221 may obtain a spectral image of the target object by adjusting the wavelength of light from the target object to the camera 225. The spectroscopic element 221 may include at least one optical filter for separating light reflected or scattered from the target object according to a wavelength, at least one passive spectroscopic element for spatially separating wavelengths of light reflected or scattered from the target object, Or at least one active spectroscopic element for stimulating and separating the wavelength of light reflected or scattered from the target object in a timely manner.

According to an embodiment, the optical filter may include a band pass filter, a short pass filter, a long pass filter, a dichroic filter, and a rotational variable (Versachrome) filter. Or may include at least one of a linear variable filter. According to one embodiment, the passive spectroscopic device may comprise a prism or grating. According to an embodiment, the active spectroscopic device may include a liquid crystal tunable filter or a fabric parot interferometer.

According to various embodiments, the camera 225 (eg, the camera module 100 of FIG. 1) may be arranged to photograph an object such as the instrument component 201, the adhesive 203, and the electronic component 205. . The camera 225 may include a lens 222 (eg, the lens assembly 110 of FIG. 1) and an image sensor 224 (eg, the image sensor 130 of FIG. 1). The lens 222 converges light reflected or scattered from the object, and the converged light may be imaged through the image sensor 224. The lens 222 is behind the spectroscopic element 221 or It can be placed in the front. The camera 225 may be a vision camera.

According to an embodiment, the image sensor 224 may acquire a spatial image corresponding to the target object by converting light reflected or scattered from the target object and transmitted through the lens 222 into an electrical signal. have. The image sensor 224 may include, for example, a line sensor or a 2D sensor. In example embodiments, the line sensor may include at least one of a line coupled coupled device (CCD), a complementary metal oxide semiconductor (CMOS), indium gallium arsenide (InGaAs), amorphous silicon, or a microbolometer. can do. In example embodiments, the 2D sensor may include at least one of a 2D CCD, a CMOS, indium gallium arsenide (InGaAs), amorphous silicon, or a microbolometer.

The image processor 230 (for example, the image signal processor 160 of FIG. 1) may determine whether the wavelength information for each location is the adhesive 203 or other deposits from the spectrum image acquired using the spectroscopic image acquisition unit 220. For example, it may be processed separately from the mechanical component 201 or the electronic component 205. The image processor 230 may include a predetermined spectrum (eg, the instrument part 201 and the adhesive 203) in which the spectrum obtained using the spectroscopic image acquisition unit 220 is stored in the memory (eg, the memory 150 of FIG. 1). Alternatively, it may be determined whether the image is matched with a spectrum corresponding to the electronic component 205 in units of pixels of the image, and the degree of matching may be displayed by displaying brightness or color. According to an embodiment, the image processor 230 may visualize only a specific object such as the adhesive 203 as an image.

According to an embodiment, the image processor 230 may selectively switch the optical filter included in the spectroscopic element 221, rotate the angle, move the position, or selectively select light scattered by the passive spectroscopic element. Or by controlling the electrical stimulation of the active spectroscopy element, it can be controlled to determine the wavelength of light that can be acquired by the camera 225.

The inspection unit 240 may analyze at least one of position, distribution, or shape information of a specific object such as the adhesive 203 from the image processed by the image processor 230, and inspect the applied result. For example, the inspection unit 240 determines whether the adhesive 203 is applied in place or the adhesive 203 is applied in a quantitative manner, and the adhesive 203 and the adherend (eg, the instrument part 201 or Factors that may affect the adhesion results between the electronic components 205 may be examined.

According to an embodiment, the inspection unit 240 analyzes an application image of the adhesive 203 and compares the analyzed data with preset reference data so that the adhesive 203 when the analyzed data exceeds the reference data. The application state of can be judged as defective.

According to an embodiment, the inspection unit 240 may include a visualization unit 242 and an analysis unit 244. The visualization unit 242 may visualize a component of a specific object such as the adhesive 203 from the spectral image transmitted from the image processor 230. The analyzer 244 may inspect the application state of the adhesive 203 from the image detected by the image processor 230. According to an embodiment, the inspection unit 240 may inspect an application state such as at least one of the position, distribution, breakage, shape, and width of the adhesive 203.

The display 250 may display a target object such as the instrument component 201, the adhesive 203, and the electronic component 205 photographed by the camera 225. The display 250 may display an image of a specific object such as the adhesive 203 visualized through the image processor 230. The display 250 may display location-specific spectral information obtained from a target object such as the instrument part 201, the adhesive 203, and the electronic part 205. The display 250 may display a result of applying the adhesive 203 inspected using the inspector 240.

3 is a diagram illustrating an image visualized through an optical inspection apparatus according to various embodiments of the present disclosure.

Using the optical inspection apparatus 200 according to various embodiments of the present invention, the instrument component 201, the adhesive 203, and the electronic component 205 shown in FIG. 2 are mutually different, as shown in FIG. 3. Different wavelength signals and visualized images (eg, different colors) can be detected.

According to an embodiment, the image visualized based on the positional spectrum information acquired using the optical inspection apparatus 200 may be displayed on the display 250.

4 is a flowchart illustrating an optical inspection method according to various embodiments of the present disclosure.

The processes described with reference to FIG. 4 may be performed by the components described in the optical inspection apparatus 200 of FIG. 2, for example.

In operation 410, the multi-wavelength light source unit 210 may irradiate a predetermined multi-wavelength light onto a target object (eg, the mechanical component 201, the adhesive 203, or the electronic component 205).

In operation 420, the spectroscopic image acquisition unit 220 may acquire a spectral image of light reflected or scattered from the target object.

In operation 430, the image processor 230 distinguishes the adhesive 203 or the adherend (for example, the instrument component 201 or the electronic component 205) from the spectral image acquired using the spectroscopic image acquisition unit 220. For example, only the adhesive 203 may be processed as a visualized image.

According to one embodiment, the wavelength spectrum of the light reflected or scattered on the surface of the object may be different according to the material, the component and the surface treatment characteristics of the object.

5 is a diagram for describing an image acquired through a general camera. Referring to FIG. 5, although the instrument component 201, the adhesive 203, and the electronic component 205 are made of different materials, a general camera image may be used to make the instrument component 201 and the adhesive 203 have the same brightness and color. Since it is indicated by, it may be impossible to distinguish the adhesive 203 or to inspect the application result of the adhesive 203.

FIG. 6 is a diagram for describing wavelength spectrum information of each position of a target object according to various embodiments of the present disclosure; FIG. Referring to FIG. 6, wavelength spectral information for each position of the instrument component 201, the adhesive 203, and the electronic component 205 may be different from each other. According to one embodiment, the image processor 230 is based on the spectral information for each position of the instrument component 201, the adhesive 203 and the electronic component 205, the memory (eg, the memory 150 of FIG. 1). ) And the reflection spectrum of the adhesive 203 stored therein.

7 is a diagram for describing a visualized image of a target object according to various embodiments of the present disclosure. Referring to FIG. 7, the image processor 230 may generate a visualized image in which only the adhesive 203 which is a specific object is highlighted (eg, brightness or color) according to the matching.

In operation 440, the inspector 240 analyzes at least one of position, distribution, or shape information of the adhesive 203 from the visualized image of the adhesive 203 generated by the image processor 230, and inspects the applied result. can do.

In operation 450, the display 250 may display a result of applying the inspected adhesive 203 using the inspector 240.

Although the present invention has been described above according to various embodiments of the present invention, the present invention may be modified and modified without departing from the technical spirit of the present invention by those skilled in the art. Of course.

200: optical inspection device 201: instrument parts
203: adhesive 205: electronic components
210: multi-wavelength light source 220: spectroscopic image acquisition unit
221: spectroscopic element 222: lens
225: camera 230: image processor
240: inspection unit 250: display

Claims (20)

In the device for optically inspecting the object,
A multi-wavelength light source unit for irradiating the multi-wavelength light onto the target object;
A spectroscopic image acquisition unit for acquiring a spectral image of light reflected or scattered from the target object;
An image processor classifying a spectrum according to a position of the target object from the acquired spectrum image and processing a specific object as a visualized image; And
And an inspection unit configured to inspect an application result of the specific object based on the processed visualized image. The method of claim 1,
And the object includes at least one of an instrument part, an adhesive, and various electronic products, and the specific object is the adhesive. The method of claim 1,
The multi-wavelength light includes at least one of visible light, ultraviolet light or infrared light. The method of claim 1,
The multi-wavelength light source unit includes at least one of a fluorescent lamp, at least one light emitting device (LED), or at least one laser device. The method of claim 1,
The spectroscopic image acquisition unit,
A spectroscopic element configured to obtain a spectral image of the target object by adjusting a wavelength of light reflected or scattered from the target object;
A camera photographing the object; And
And a lens for converging light reflected or scattered from the target object. The method of claim 5,
The camera includes an image sensor for imaging the target object photographed using the camera, based on the light converged through the lens. The method of claim 5,
The spectroscopic element is
At least one optical filter separating light reflected or scattered from the target object according to a wavelength;
At least one passive spectroscopic element for spatially separating wavelengths of light reflected or scattered from the object, or
And at least one of at least one active spectroscopy element for stimulating and separating the wavelength of light reflected or scattered from the target object in a timely manner. The method of claim 7, wherein
The optical filter may include a band pass filter, a shot pass filter, a long pass filter, a dichroic filter, a rotational variable (Versachrome) filter, and a linear variable. ) Optical inspection device comprising at least one of the filters. The method of claim 7, wherein
The passive spectroscopic element includes a prism or grating. The method of claim 7, wherein
The active spectroscopic device includes a liquid crystal tunable filter or a fabric parot interferometer. The method of claim 6,
And the image sensor comprises a line sensor or a 2D sensor. The method of claim 11,
The line sensor includes at least one of a line coupled coupled device (CCD), a complementary metal oxide semiconductor (CMOS), indium gallium arsenide (InGaAs), amorphous silicon, or a microbolometer. The method of claim 11,
The 2D sensor includes at least one of a 2D CCD, CMOS, InGaAs, amorphous Si, or microbolometer. The method of claim 1,
The inspection unit,
A visualization unit that visualizes the specific object from an image transmitted from the image processor; And
And an analyzer configured to analyze an application state of the specific object from an image transmitted from the image processor. The method of claim 1,
And a display for displaying the application result of the specific object inspected using the inspection unit. The method of claim 2,
And said instrument parts, adhesives and various electronics differ in the reflectivity of the spectrum with respect to light. The method of claim 2,
The adhesive comprises a pigment or a fluorescent dye. The method of claim 1,
And the image processor is configured to determine, on a pixel-by-pixel basis, whether the acquired spectral image matches a spectral image of the target object stored in a memory. In the method for optically inspecting the object,
Irradiating a predetermined multi-wavelength light onto the target object;
Obtaining a spectral image of light reflected or scattered from the target object;
Dividing a spectrum according to the position of the target object from the acquired spectral image and processing a specific object as a visualized image; And
And based on the processed visualized image, inspecting an application result of the specific object. The method of claim 19,
And displaying the application result of the inspected specific object.

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