KR20190129441A - A surface-emitting laser packgae and optical module including the same - Google Patents

Abstract

The present invention relates to a surface emitting light emitting laser package, which has excellent reliability and stability and can protect devices disposed inside from external impacts, and an optical module including the same. The surface emitting light emitting laser package according to an embodiment of the present invention can comprise: a body including a cavity; a surface emitting light emitting laser device disposed inside the cavity; a light receiving device disposed in the cavity to be spaced apart from the surface emitting light emitting laser device, and detecting light emitted from the surface emitting light emitting laser device; and a diffusion part disposed on the body and including a transmission part and a reflection part. The transmission part can be disposed on the surface emitting light emitting laser device, and the reflection part can be disposed on the light receiving device. The second width of the reflection part is narrower than the first width of the transmission part, and the reflection part cannot overlap the divergence angle of the surface emitting light emitting laser device.

Description

Surface-emitting light emitting laser package and optical module including same {A SURFACE-EMITTING LASER PACKGAE AND OPTICAL MODULE INCLUDING THE SAME}

The embodiment relates to a semiconductor device, and more particularly, to a semiconductor light emitting device, a semiconductor light source device, a semiconductor optical device, a semiconductor light source chip, a light emitting device, a light emitting device package, and an optical module, an optical transmission / reception module, an autofocus device including the same, Relates to an optical assembly. The semiconductor light emitting device may include a vertical-cavity surface emitting laser (VCSEL) or a surface emitting laser device or a VCSEL.

Semiconductor devices including compounds such as GaAs, AlGaAs, GaN, and AlGaN are widely used in light emitting devices, light receiving devices, and various diodes because they have broad band gap energy and easy control of band gap energy.

Particularly, light emitting devices such as light emitting diodes and laser diodes using semiconductors of Group 3-5 or Group 2-6 compound semiconductors have been developed through the development of thin film growth technology and device materials. Various colors such as blue and ultraviolet light can be realized, and efficient white light can be realized by using fluorescent materials or combining colors, and low power consumption, semi-permanent life, and quick response compared to conventional light sources such as fluorescent and incandescent lamps. It has the advantages of speed, safety and environmental friendliness.

In addition, when a light-receiving device such as a photodetector or a solar cell is also manufactured using a group 3-5 or 2-6 compound semiconductor material of a semiconductor, the development of device materials absorbs light in various wavelength ranges to generate a photocurrent. As a result, light in various wavelengths can be used from gamma rays to radio wavelengths. It also has the advantages of fast response speed, safety, environmental friendliness and easy control of device materials, making it easy to use in power control or microwave circuits or communication modules.

Therefore, a white light emitting device which can replace a LED backlight, a fluorescent lamp or an incandescent bulb that replaces a cold cathode tube (CCFL) constituting a backlight of a transmission module of an optical communication means and a liquid crystal display (LCD) display device. Applications are expanding to diode lighting devices, automotive headlights and traffic lights, and sensors to detect gas or fire. In addition, applications can be extended to high frequency application circuits, other power control devices, and communication modules.

Meanwhile, among conventional semiconductor light source device technologies, there is a vertical-cavity surface emitting laser (VCSEL), which is an optical module, an optical transmission / reception module, an optical communication, an optical parallel processing, an optical connection, an auto focusing device, or the like. It is used.

Also, in the related art, the vertical resonance surface emitting laser is used as a high-power VCSEL package structure for a vehicle or a mobile device.

Meanwhile, in the prior art, a high output VCSEL package structure employs a diffuser to form a constant divergence angle. When the diffuser is separated by an impact during use in a vehicle or a mobile, the laser of the VCSEL ( If the laser is irradiated directly on the human eye, there is a risk that the person may become blind. Accordingly, there is a need for a study on a semiconductor device package that can be applied to a vehicle or an application field such as a person's movement, and can prevent a strong laser from being directly incident on a person.

In addition, in the prior art, as semiconductor devices are diversified in application fields, high power and high voltage driving are required, and miniaturization of semiconductor device packages is strongly required for miniaturization of products.

In addition, the divergence angle (divergence angle) can be measured by the method of measuring the radiance and irradiance.

One of the technical problems of the embodiment is to provide a surface emitting light emitting laser package and an optical module excellent in reliability and stability and capable of safely protecting a device disposed therein from external impact.

In addition, one of the technical problems of the embodiment is to provide a compact surface emitting light emitting laser package and an optical module capable of high power and high voltage driving.

The technical problem of the embodiments is not limited to the contents described in this section, but also includes those that can be grasped from the entire description of the invention.

The surface-emitting light emitting laser package according to the embodiment includes a body 210 including a cavity (C); A surface emitting laser device 230 disposed inside the cavity C; A light receiving device 240 disposed in the cavity C and spaced apart from the surface emitting light emitting laser device 230 to sense light emitted from the surface emitting light emitting laser device 230; And diffusion parts 250 and 260 disposed on the body 210 to include a transmission part 250 and a reflection part 260, wherein the transmission part 250 is disposed on the surface emission laser device 230. Can be placed in.

The reflector 260 may be disposed on the light receiving element 240. The second width W20 of the reflector 260 may be narrower than the first width W10 of the transmission part 250. The reflector 260 may not overlap with the divergence angle of the surface emitting laser element 230.

In an embodiment, the second width W20 of the reflective part 260 may be narrower than the first width W10 of the transmissive part 250.

The first width W10 of the transmission part 250 may be wider than the divergence angle of the surface emission laser device 230.

The reflector 260 may not overlap with the divergence angle of the surface emitting laser element 230.

An embodiment includes a first electrode part 221 in which the surface emitting light emitting laser device is disposed; A second electrode part 222 on which the light receiving element 240 is disposed; A third electrode part 223 electrically connected to the surface emission laser device and a first wire W1; And a fourth electrode part 224 electrically connected to the light receiving element 240 by the second wire W2.

In an embodiment, the first separation distance D1 from the top surface of the surface emitting laser device 230 to the transmission part 250 is equal to 2 of the third horizontal width W30 of the surface emitting light emitting laser device 230. It may range from / 75 to 1/5.

The first horizontal width W10 of the transmission part 250 may be in a range of 18/15 to 6 times of the third horizontal width W30 of the surface emission laser device 230.

The second horizontal width W20 of the reflector 260 may range from 16/15 times to 4 times the horizontal width of the light receiving device 240.

The thickness T3 of the reflection part 262 may be thinner than the thickness T1 of the transmission part 250.

The thickness T3 of the reflector 262 may be in a range of 1/10 to 1/2 of the thickness T1 of the transmission part 250.

The thickness T3 of the reflector 262 may be in a range of 1/75 to 1 times the third horizontal width W30 of the surface emission laser device 230.

In addition, another embodiment surface-emitting light emitting laser package includes a body 210 including a cavity (C); A fifth electrode part 225 and a sixth electrode part 226 disposed to be spaced apart from each other in the cavity C;

A surface emission laser device 230 disposed on the fifth electrode part 225 and electrically connected to the sixth electrode part 226 by a third wire W3; A second light receiving space spaced apart from the surface emitting light emitting laser element 230 in the cavity C and disposed on the sixth electrode part 226 to sense light emitted from the surface emitting light emitting laser element 230; Element 232; And diffusion parts 252 and 263 disposed on the body 210 and including a second transmission part 252 and a third reflection part 263. The second transmission part 252 is disposed on the surface emission laser device 230, and the third reflection part 263 is disposed on the second light reception device 232. The reflector 263 may not overlap the divergence angle of the surface emitting laser device 230.

 The optical module according to the embodiment may include the surface emitting light emitting laser package.

According to the embodiment there is a technical effect that can provide a surface emitting light emitting laser package and an optical module excellent in reliability and stability.

In addition, according to the embodiment, it is possible to provide a compact surface emitting light emitting laser package and an optical module capable of high power and high voltage driving.

The technical effects of the embodiments are not limited to the contents described in this section, but include those that can be grasped from the entire description of the invention.

1 is a plan view of a surface-emitting light emitting laser package according to the first embodiment.
FIG. 2 is a plan view in which the diffuser and the reflector are omitted in the surface emission laser package according to the first embodiment shown in FIG. 1; FIG.
3A is a cross-sectional view taken along line A1-A1 'of the surface emitting light emitting laser package 200 according to the first embodiment shown in FIGS.
3B is a cross-sectional view taken along line A2-A2 'of the surface emitting light emitting laser package 200 according to the first embodiment shown in FIGS.
4 is a plan view in which the light emitting device and the light receiving device are omitted in the surface emitting light emitting laser package according to the first embodiment shown in FIG.
5A is a cross-sectional view taken along line A3-A3 'of the surface emitting light emitting laser package according to the first embodiment shown in FIG.
5B is a cross-sectional view taken along line A4-A4 'of the surface emitting light emitting laser package according to the first embodiment shown in FIG.
6 is a plan view of a surface emitting light emitting laser device in a surface emitting light emitting laser package according to an embodiment;
7 is a partially enlarged view of a region B of the surface emitting light emitting laser device in the surface emitting light emitting laser package according to the embodiment shown in FIG.
8 is a cross-sectional view taken along line A5-A5 'of the first emitter of the surface emitting light emitting laser device of the surface emitting light emitting laser package according to the embodiment shown in FIG.
FIG. 9A is a detailed cross-sectional view of the surface-emitting light emitting laser package according to the first embodiment shown in FIG. 3A, in which the first wire is omitted.
FIG. 9B is a view in which the thickness of the reflecting portion is thinner than the thickness of the transmitting portion in the surface emitting light emitting laser package according to the first embodiment shown in FIG. 9A;
10A is a plan view of a surface emitting light emitting laser package according to a second embodiment;
FIG. 10B is a view illustrating a second transmission portion and a third reflection portion in the surface emission laser package according to the second embodiment of FIG. 10A; FIG.
11 is a perspective view of a mobile terminal to which an optical module including a surface emitting light emitting laser package according to an embodiment is applied.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiments, when described as being formed on the "on or under" of each element, the on or under is It includes both the two elements are in direct contact with each other, or one or more other elements are formed indirectly between the two elements. In addition, when expressed as "on" or "under", it may include the meaning of the downward direction as well as the upward direction based on one element.

(First embodiment)

1 is a plan view of a surface emitting light emitting laser package 200 according to a first embodiment, and FIG. 2 is a transmissive part 250 and a reflecting part 260 in the surface emitting light emitting laser package according to the first embodiment shown in FIG. 1. ) Are omitted. The transmission part 250 and the reflection part 260 may be referred to as a diffusion part, but are not limited thereto.

First, referring to FIG. 1, the surface emission laser package 200 according to the first embodiment may include a body 210, a transmission part 250, and a reflection part 260. In the drawings of the embodiment, the ground may be defined by the x-axis and the y-axis, and the normal direction perpendicular to the ground (xy plane) may be the z-axis. In an embodiment, the body 210 may have a horizontal width in the x-axis direction greater than a horizontal width in the y-axis direction on the ground, but is not limited thereto. An index mark M1 is formed on the body 210 so that the positions of the transmission part 250 and the reflection part 260 can be easily confirmed. Section lines A1-A1 'and A2-A2' in FIGS. 1 and 2 will be described with reference to FIGS. 3A and 3B. The body 210 may be referred to as a substrate, but is not limited thereto.

1 and 2, the surface emitting light emitting laser package 200 according to the first embodiment includes a body 210 including a cavity C, and a surface emitting light emitting device disposed in the cavity C. Referring to FIGS. 230, spaced apart from the surface emitting laser device 230 in the cavity C, and a light receiving device 240 for detecting light emitted from the surface emitting light emitting device 230, and It may include a transmissive portion 250 disposed on the body 210 on the surface emitting light emitting laser element 230, and a reflecting portion 260 disposed on the light receiving element 240. The transmission part 250 and the reflection part 260 may be referred to as diffusion parts.

Referring to FIG. 2, the surface-emitting light emitting laser device 230 may include a light emitting part 100 and a pad part 235.

In addition, the embodiment may include a single or a plurality of electrode parts disposed on the bottom of the cavity (C) between the surface emitting light emitting laser device 230 and the light receiving device 240.

For example, the embodiment is electrically connected by a first electrode portion 221 on which the surface emitting light emitting laser element 230 is disposed, and by the surface emitting light emitting laser element 230 and the first wire W1. The third electrode part 223, the second electrode part 222 on which the light receiving element 240 is disposed, and the fourth electrode part electrically connected by the light receiving element 240 and the second wire W2 ( 224). The second electrode part 222 may extend from the first electrode part 221 to be integrally formed, but is not limited thereto.

According to the embodiment, the laser emitted from the surface emitting laser device 230 is diffused through the transmission unit 250 and the light receiving device 240 detects the light reflected from the inside of the package to change the amount of light detected. It is possible to precisely control whether the transmission portion 250 is detached by measuring the.

In this embodiment, the transmission unit 250 is disposed in the beam divergence range of the beam in the surface emission laser device 230, and the reflection unit 260 is disposed in the other areas to reflect and totally reflect inside the package. The light may be reflected inside without passing through the reflector 260, and conversely, light incident from the outside of the package into the package may not be incident into the inside by reflecting the light through the reflector 260. This embodiment has a technical effect that can provide a surface emitting light emitting laser package and an optical assembly excellent in reliability and stability by significantly improving the light sensing performance in the light receiving device 240.

Next, the surface emission laser package 200 according to the first embodiment will be described in more detail with reference to FIGS. 3A and 3B.

3A is a cross-sectional view taken along line A1-A1 'of the surface emitting light emitting laser package 200 according to the first embodiment shown in FIGS. 1 and 2, and FIG. 3B is a first embodiment shown in FIGS. A cross-sectional view taken along line A2-A2 'of the surface emitting light emitting laser package 200 according to an example.

3A and 3B, the surface emitting light emitting laser package 200 according to the first embodiment includes a body 210 including a cavity C, and a surface emitting light emitting laser disposed in the cavity C. An element 230, a light receiving element 240 disposed in the cavity C and spaced apart from the surface emitting light emitting laser element 230, and configured to sense light emitted from the surface emitting light emitting laser element 230; The surface emission light emitting laser device 230 may include a transmissive part 250 disposed on the body 210 and a reflective part 260 disposed on the light receiving element 240.

In an embodiment, the body 210 may be formed of a single layer or a plurality of layers. For example, the body 210 may be formed of a single layer substrate, or may include a first substrate 211, a second substrate 212, and a third substrate 213 as shown.

The body 210 may include a material having high thermal conductivity. Accordingly, the body 210 may be provided with a material having a good heat dissipation property so as to efficiently discharge the heat generated by the surface emission laser device 230 to the outside. For example, the body 210 may include a ceramic material. The body 210 may include a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) that is co-fired.

In addition, the body 210 may include a metal compound. The body 210 may include a metal oxide having a thermal conductivity of 140 W / mK or more. For example, the body 210 may include aluminum nitride (AlN) or alumina (Al ₂ O ₃ ).

In addition, the body 210 may include a resin-based insulating material. The body 210 may be provided of a silicone resin, an epoxy resin, a thermosetting resin including a plastic material, or a high heat resistant material.

In addition, the body 210 may include a conductive material. For example, when the body 210 is made of a conductive material, such as a metal, an insulating layer (not shown) for electrical insulation between the body 210 and the surface emitting light emitting laser device 230 is provided. Can be.

Accordingly, according to the embodiment, there is a technical effect of providing a surface emitting light emitting laser package and an optical module capable of driving high power and high voltage but having excellent heat dissipation characteristics.

The first substrate 211, the second substrate 212, and the third substrate 213 may all include the same material or at least one different material of the body 210.

Next, in an embodiment, a single or a plurality of electrode parts may be disposed on the body 210. For example, referring to FIG. 2, in the embodiment, the body 210 has a first electrode portion 221, a second electrode portion 222, a third electrode portion 223, and a fourth electrode portion 224. Can be arranged.

For example, the embodiment is electrically connected by a first electrode portion 221 on which the surface emitting light emitting laser element 230 is disposed, and by the surface emitting light emitting laser element 230 and the first wire W1. The third electrode part 223, the second electrode part 222 on which the light receiving element 240 is disposed, and the fourth electrode part electrically connected by the light receiving element 240 and the second wire W2 ( 224) (see FIG. 2).

The first electrode portion 221 to the fourth electrode portion 224 may be formed of a conductive metal material. For example, the first electrode portion 221 to the fourth electrode portion 224 are Cu, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf It may be formed in a single layer or multiple layers using an alloy of at least one or two or more of them.

Referring again to FIGS. 3A and 3B, the first electrode part 221 may include a first upper electrode 221 a disposed on the body 210 and a first lower electrode disposed below the body 210. 221b. A surface emitting light emitting laser device 230 may be disposed on the first upper electrode 221a. The first lower electrode 221b may be formed larger than the first upper electrode 221a to improve electrical conductivity and heat dissipation efficiency.

In addition, the second electrode unit 222 may include a second upper electrode 222a disposed on the body 210 and a second lower electrode 222b disposed below the body 210. The light receiving device 240 may be disposed on the second upper electrode 222a. The second lower electrode 222b may be formed larger than the second upper electrode 222a to improve conductivity and heat radiation efficiency.

In addition, the third electrode unit 223 may include a third upper electrode 223a disposed on the body 210 and a third lower electrode 223b disposed below the body 210. The third upper electrode 223a may be electrically connected to the surface emission laser device 230 by a first wire W1.

According to the embodiment, the third electrode portion 223 is disposed between the first electrode portion 221 and the second electrode portion 222, the surface emission light emitting laser device on the first electrode portion 221 The light emitting device 240 is disposed on the second electrode part 222 so as to be spaced apart from the surface emitting light emitting laser device 230, and thus the beam of the surface emitting light emitting laser device 230 is emitted. By providing a wide beam divergence range and minimizing the area occupied by the light receiving element inside the package, a highly sensitive light sensing function can be performed and a compact surface emitting laser package and an optical module can be provided.

Next, the features of the electrode unit in the embodiment will be described in more detail with reference to FIGS. 4 to 5B.

4 is a plan view in which the surface emitting light emitting laser device 230 and the light receiving device 240 are omitted in the surface emitting light emitting laser package according to the first embodiment shown in FIG. 3, and FIG. 5A is a first view shown in FIG. 4. FIG. 5B is a cross-sectional view taken along line A3-A3 'of the surface emitting light emitting laser package according to the embodiment, and FIG. 5B is a cross-sectional view taken along line A4-A4' of the surface emitting light emitting package according to the first embodiment shown in FIG.

5A and 5B, the first electrode unit 221 may include a first upper electrode 221a disposed on the body 210 and a first lower electrode disposed below the body 210. 221b) and a first connection electrode 221c electrically connecting the first upper electrode 221a and the first lower electrode 221b to each other. The first connection electrode 221c may be a via electrode, but is not limited thereto.

The first upper electrode 221a may be electrically connected to the surface emission laser device 230. For example, the surface emission laser device 230 may be disposed on the first upper electrode 221a.

Next, referring to FIG. 5A, the second electrode part 222 may include a second upper electrode 222a disposed on the body 210 and a second lower electrode 222b disposed below the body 210. It may include. Referring to FIG. 4, the second electrode part 222 may be integrally formed to extend from the first electrode part 221, but is not limited thereto.

When the second electrode part 222 is integrally formed to extend from the first electrode part 221, the second upper electrode 222a and the second lower electrode 222b of the second electrode part 222 are formed. It may be electrically connected by the first connection electrode 221c of the first electrode unit 221.

In this case, the second upper electrode 222a may be electrically connected to the light receiving element 240. For example, the light receiving device 240 may be disposed on the second upper electrode 222a.

Next, the third electrode part 223 includes a third upper electrode 223a disposed on the body 210, a third lower electrode 223b disposed below the body 210, and the third upper electrode. The third connection electrode 223c may be electrically connected to the second and second lower electrodes 223a and 223b. The third upper electrode 223a may be electrically connected to the surface emission laser device 230 through the first wire W1. The third connection electrode 223c may be a via electrode.

2 and 4, the surface emitting light emitting laser device 230 is disposed on the first electrode part 221, and the light receiving device 240 is spaced apart from the surface emitting light emitting laser device 230 so as to separate the second electrode. By being disposed on the part 222, it is possible to secure a wide range of beam divergence of the beam of the surface emitting light emitting laser device 230, and to minimize the area occupied by the light receiving device in the package, thereby performing a high sensitivity light sensing function. It is possible to provide a compact surface emitting laser package and an optical assembly.

Next, referring to FIGS. 2 and 4, the fourth electrode part 224 is a fourth upper electrode 224a disposed on the body 210 and a fourth lower electrode disposed below the body 210. (Not shown), a fourth connection electrode 224c may be electrically connected to the fourth upper electrode 224a and the fourth lower electrode. The fourth upper electrode 224a may be electrically connected to the light receiving device 240 through the second wire W2 (see FIG. 2). The fourth connection electrode 224c may be a via electrode.

Meanwhile, referring to FIGS. 5A and 5B, the cavity C may be disposed in the body 210 of the embodiment, and a single or a plurality of cavities may be disposed. For example, the body 210 of the embodiment may include a first cavity C1 positioned on the second substrate 212 and a second cavity C2 positioned on the third substrate 213. The horizontal width of the second cavity C2 may be larger than the horizontal width of the first cavity C1.

Referring to FIG. 3A, the surface emitting light emitting laser device 230 and the light receiving device 240 may be disposed in the first cavity C1, and the transmitting part 250 and the reflecting part 260 may be disposed in the second cavity C2. ) May be arranged.

Next, with reference to FIGS. 6 to 8, the surface-emitting light emitting laser device 230 in the surface-emitting light emitting laser package according to the embodiment will be described.

6 is a plan view of the surface emitting light emitting laser device 230 in the surface emitting light emitting laser package according to the embodiment, and FIG. 7 is the surface emitting light emitting laser device in the surface emitting light emitting laser package according to the embodiment shown in FIG. A partial enlarged view of area B of 230.

6 to 8, the surface emission laser device 230 according to the embodiment is illustrated for a vertical-cavity surface emitting laser (VCSEL), but is not limited thereto.

Referring to FIG. 6, the surface-emitting light emitting laser device 230 of the surface-emitting light emitting laser package according to the embodiment may include a light emitting part 100 and a pad part 235. 6 and 7, a plurality of light emitting emitters E1, E2, and E3 may be disposed in the light emitting unit 100.

8 is a cross-sectional view taken along line A5-A5 'of the first emitter E1 of the surface emitting light emitting laser element 230 of the surface emitting light emitting laser package according to the embodiment shown in FIG.

Referring to FIG. 8, in the embodiment, the first emitter E1 of the surface emitting laser device may include the first electrode 115, the support substrate 110, the first reflective layer 120, the cavity region 130, and the aperture. One or more of the aperture 141, the insulating region 142, the second reflective layer 150, the second contact electrode 155, the second electrode 180, and the passivation layer 170 may be included.

In an embodiment, the support substrate 110 may have excellent heat dissipation and may be a conductive substrate or a non-conductive substrate. For example, the support substrate 110 may include copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W), and carrier wafers (eg, Si, Ge, AlN). , GaAs, ZnO, SiC, etc.) may be provided at least one selected from conductive materials, but is not limited thereto.

In an embodiment, the first electrode 115 may be disposed under the support substrate 110, and the first electrode 115 may be disposed in a single layer or multiple layers with a conductive material.

The first reflective layer 120 may be provided as at least one of a compound semiconductor of Group 3-Group 5 or Group 2-Group 6 doped with a first conductivity type dopant. The second reflective layer 150 may be provided as at least one of a compound semiconductor of Group 3-Group 5 or Group 2-Group 6 doped with a second conductivity type dopant.

For example, the first semiconductor layer 120 and the second reflective layer 150 may be one of a group including GaAs, GaAl, InP, InAs, and GaP. The first semiconductor layer 120 and the second reflective layer 150 may be, for example, a semiconductor having a composition formula of Al x Ga 1-x As (0 <x <1) / AlyGa 1-y As (0 <y <1) (y <x). It may be provided as a material.

The cavity region 130 is disposed between the first reflective layer 120 and the second reflective layer 150, and has a predetermined active layer (not shown) and a first cavity (not shown) disposed below the active layer. It may include a second cavity (not shown) disposed above the active layer. The cavity area 130 of the embodiment may include both the first cavity and the second cavity, or only one of them.

In an embodiment, the insulating region 142 is disposed on the cavity region 130, and the aperture 141 defined by the insulating region 142 may be located.

The insulating region 142 may be formed of an insulating layer, for example, aluminum oxide, to serve as a current insulating region, and an aperture 141 may be disposed in the central region. For example, an insulating region 142 may be formed as the edge is changed to Al ₂ O ₃ by reacting with H ₂ O in a predetermined AlGaAs layer, and the center region which does not react with H ₂ O is made of AlGaAs. It may be the aperture 141.

The surface emission laser device according to the embodiment may be mesa-etched from the second reflective layer 150 to the insulating region 142 and the cavity region 130 in the region around the aperture 141. In addition, mesa may be etched up to a part of the first reflective layer 120.

The second contact electrode 155 may be disposed on the second reflective layer 150, and the region in which the second reflective layer 150 is exposed in the region between the second contact electrodes 155 is the insulating region 142 described above. It may correspond to the aperture 141 of the central region of the. The contact electrode 155 may improve contact characteristics between the second reflective layer 150 and the second electrode 180.

The passivation layer 170 may be disposed on the side and top surfaces of the mesa-etched light emitting structure and the top surface of the first reflective layer 120. The passivation layer 170 may be made of an insulating material, for example, nitride or oxide.

The second electrode 180 may be in electrical contact with the exposed second contact electrode 155 and disposed to extend above the passivation layer 170 to receive current from the pad unit 235. The second electrode 180 may be made of a conductive material. For example, the second electrode 180 may include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). It may be formed into a structure.

Referring back to FIG. 3A, the light receiving device 240 used in the surface emitting light emitting laser package according to the embodiment may be a photodetector for a monitor, and a reverse bias voltage may be applied to receive incident light. The second upper electrode 222a electrically connected to the light receiving element 240 may include a plurality of separated electrodes, which may be configured to apply an external power source to the light receiving element 240 or to detect electricity from the light receiving element 240. You can pass the signal to the outside.

Next, the technical features of the light emitting device package according to the embodiment will be described in more detail with reference to FIG. 9A. FIG. 9A is a detailed cross-sectional view of the surface emitting light emitting laser package 200 according to the first embodiment shown in FIG. 3A, and the first wire W1 is omitted.

The surface emitting light emitting laser package 200 according to the first embodiment of the present invention is a transmissive part 250 disposed on the body 210 on the surface emitting light emitting laser element 230 and a reflection disposed on the light receiving element 240. It may include a portion 260.

According to the embodiment, the laser emitted from the surface emitting laser device 230 is diffused through the transmission unit 250, and the light receiving device 240 detects the light reflected from the package and changes the amount of light detected. It is possible to precisely control whether the transmission portion 250 is detached by measuring the.

The transmission part 250 is disposed in a beam divergence range of the beam in the surface emitting light emitting laser device 230, and the reflecting part 260 is disposed on the light receiving device 240 to be reflected and totally reflected inside the package. Since the light is reflected inside the light through the reflecting unit 260 and not transmitted to the outside, the light sensing performance of the light receiving device 240 may be significantly improved. On the contrary, the light incident from the outside of the package into the package may be reflected. By reflecting through the light source 260, the light sensing performance of the light receiving device 240 may be remarkably improved since the light is not incident to the inside.

The transmission part 250 and the reflection part 260 may be separated from the body 210 in an extreme environment such as a long time use or vibration of the surface emitting light emitting laser package, and the transmission part 250 or the reflection When the unit 260 is separated, the strong laser emitted from the surface emission laser device 230 may be irradiated directly to the outside without passing through the transmission unit 250 to damage the eyesight of the user or the like.

In this embodiment, the transmission part 250 and the reflection part 260 may be disposed in the second cavity C2 (see FIG. 5A), and the adhesive layer 270 is disposed on the exposed second substrate 212. The coupling force between the transmission part 250 and the reflection part 260 and the second substrate 212 may be improved.

The adhesive layer 270 may include an organic material. For example, the adhesive layer 270 may include an epoxy-based resin or a silicone-based resin, and may improve the bonding force between the transmissive part 250, the reflecting part 260, and the second substrate 212 by the surface emitting light emitting laser. It is possible to provide a stable surface emitting laser package that can be injured by a strong light emitted from the device 230.

In an exemplary embodiment, the transmission part 250 may function to extend a beam divergence angle of light emitted from the surface emission laser device 230. To this end, the transmission part 250 may include a micro lens, an uneven pattern.

In addition, the transmission part 250 may include an anti-reflective function. For example, the transmission part 250 may include an antireflective layer (not shown) disposed on one surface of the surface emitting light emitting laser device 230. For example, the transmission part 250 may include an antireflection layer disposed on a lower surface facing the surface emission laser device 230. Through this, the anti-reflective layer may improve light loss due to reflection by preventing and transmitting the light incident from the surface emission laser device 230 on the surface of the transmission part 250.

The anti-reflective layer may be formed of, for example, an anti-reflective coating film and attached to the surface of the transmission part 250. In addition, the antireflection layer may be formed on the surface of the transmission part 250 by spin coating or spray coating. For example, the antireflective layer may be formed as a single layer or multiple layers including at least one of a group containing TiO ₂ , SiO ₂ , Al ₂ O ₃ , Ta ₂ O ₃ , ZrO ₂ , MgF ₂ .

Referring to FIG. 1, the first width in the x-axis direction of the body 210 may be larger than the second width in the y-axis direction, through which the transmission part 250 and the reflection part 260 may be moved in the x-axis direction. Arrangement can improve the light diffusivity and ensure reliability. For example, the first width in the x-axis direction of the body 210 may be about 3.0 mm to 5.0 mm, and the second width in the y-axis direction may be about 2.0 mm to 3.0 mm, but is not limited thereto. .

Referring back to FIG. 9A, the thickness T20 of the z-axis direction of the body 210 may be secured to about 1.0 mm to 2.0 mm to implement a highly reliable and compact light emitting device package.

In this case, the third horizontal width W30 in the y-axis direction of the surface emission laser device 230 may be about 500 μm to 1,500 μm. The horizontal width in the x-axis direction of the surface emission laser device 230 may also be the same as the third horizontal width W30 in the y-axis direction, but is not limited thereto.

In the embodiment, since the light output is determined according to the number of emitters of the surface emitting laser device chip, the size of the surface emitting laser device may be different according to a product. For example, at a mobile level, since radiant power requires about 1W to 2W of performance, the size of the surface emitting laser device may be about 500x500 μm to 1,500x1500 μm.

For example, in the embodiment, the third horizontal width W30 of the surface emitting laser device 230 may be 500 μm to 1,500 μm, but is not limited thereto.

Next, the first separation distance D1 from the upper surface of the surface emitting light emitting laser element 230 to the transmission part 250 is about the third horizontal width W30 of the surface emitting light emitting laser element 230. It may range from 2/75 to about 1/5. For example, in an exemplary embodiment, the first separation distance D1 from the upper surface of the surface emission laser device 230 to the transmission part 250 may be about 40 μm to 100 μm.

For example, the first separation distance D1 from the top surface of the surface emitting light emitting laser device 230 to the transmission part 250 is about the third horizontal width W30 of the surface emitting light emitting laser device 230. 2/75 or more, for example, considering the first wire W1 process, a minimum distance of about 40 μm or more may be secured. In addition, the first separation distance D1 from the upper surface of the surface emitting light emitting laser element 230 to the transmission part 250 is about 1/5 or less of the third horizontal width W30 of the surface emitting light emitting laser element 230. For example, a compact light emitting device package can be provided by being about 100 μm or less.

Further, in the embodiment, the thickness T1 of the transmission part 250 is about in consideration of the beam divergence angle Θ at the surface emission light emitting laser element 230 and the divergence angle Θ2 at the transmission part 250. 200 μm to about 1,000 μm.

The thickness T1 of the transmission part 250 may be controlled to about 200 μm or more to secure a sufficient divergence range of the laser, and when the thickness T1 of the transmission part 250 is less than 200 μm, it may be damaged during the manufacturing process or actual use. There is concern. In addition, it is possible to implement a compact surface emitting light emitting laser package by designing the thickness T1 of the transmitting part 250 to 1,000 μm or less.

In an exemplary embodiment, the beam divergence angle Θ of the surface emission laser device 230 may be designed to be greater than or equal to 0 °. For example, light is emitted from the surface emission laser device 230. If two apertures are formed, the beam divergence angle (Θ may be close to 0 °).

In addition, the range of the divergence angle Θ2 of the transmission part 250 in the embodiment may be greater than 0 ° to 160 ° in consideration of the product.

In an embodiment, the measurement of the divergence angle may be performed as a radiance measurement or an irradiance measurement, but is not limited thereto.

Next, the embodiment may include a reflector 260 disposed on the light receiving element 240. Through this, in the embodiment, the transmissive part 250 is disposed in the beam divergence range of the beam in the surface emission laser device 230, and the reflecting part 260 is disposed in the other area, thereby reflecting and total reflection inside the package. The light may be reflected inside without passing through the reflector 260, and conversely, the light incident from the outside of the package into the package may not be incident into the inside by reflecting the light through the reflector 260. Accordingly, the embodiment has a technical effect of providing a surface emitting light emitting laser package and an optical assembly excellent in reliability and stability by significantly improving the light sensing performance in the light receiving device 240.

Unlike the transmissive part 250, the reflective part 260 may block internal / external reflection of light inside / outside the package, and may be formed of a resin layer including Al, Ag powder, or an alloy powder thereof. have.

In the embodiment, when the range of the first width W10 of the transmission part 250 is set to match the divergence angle of the aperture of the surface emitting laser element 230 and the beam, The incident rate of the exiting light through the transmission part 250 may be controlled to about 100%, and the incident rate of the exiting light into the reflecting part 260 may be controlled to about 0%.

9B is a cross-sectional view of another embodiment of the surface emitting light emitting laser package according to the first embodiment shown in FIG. 9A.

In an exemplary embodiment, the thickness T3 of the second reflector 262 may be thinner than the thickness T1 of the transmissive part 250. This ensures the divergence angle that can be emitted from the transmissive part 250 as wide as possible, while the light reflected from the second reflector 262 in the package is reflected to the light receiving element 240 to maximize the reliability of the light sensing performance. There is a technical effect that can provide excellent surface emitting laser package and optical assembly.

In an exemplary embodiment, the thickness T3 of the second reflector 262 may be in a range of 1/10 to 1/2 of the thickness T1 of the transmission part 250. The thickness T3 of the second reflector 262 may be secured to 1/10 or more of the thickness T1 of the transmissive part 250, thereby performing a function as a reflector.

In particular, since the thickness T3 of the second reflecting portion 262 is formed to be 1/2 or less of the thickness T1 of the transmitting portion 250, the ratio of the light that can be transmitted above the second reflecting portion 262 is determined. Increase the light output.

For example, the thickness T3 of the second reflector 262 may be set to about 20 μm to about 500 μm. The thickness T3 of the second reflector 262 may be secured to 1/10 or more, for example, about 20 μm or more of the thickness T1 of the transmission part 250, thereby serving as a reflector. In addition, the thickness T3 of the second reflecting portion 262 is disposed to be 1/2 or less, for example, 500 μm or less of the thickness T1 of the transmitting portion 250, so as to be above the second reflecting portion 262. The light output can be improved by increasing the ratio of light that can be transmitted.

Referring to FIG. 9A again, the first horizontal width W10 of the transmissive part 250 is larger than the second horizontal width W20 of the reflective part 260, thereby being reflected and received by the light receiving element 240. You can increase the amount of light.

The reflector 260 may overlap the light receiving device 240 vertically, but may not overlap the third electrode part 223 or the surface emitting light emitting laser device 230.

For example, since the first horizontal width W10 of the transmission part 250 is formed larger than the second horizontal width W20 of the reflection part 260, the light totally reflected on the upper surface of the transmission part 250 may also be used. By increasing the possibility of reaching the light receiving device 240, it is possible to provide a surface emitting light emitting laser package and an optical assembly having excellent reliability of light sensing performance.

In an exemplary embodiment, the first horizontal width W10 of the transmission part 250 may range from 18/15 times to 6 times of the third horizontal width W30 of the surface emission laser device 230. For example, the first horizontal width W10 of the transmission part 250 may be about 1,800㎛ to 3,000㎛. In this case, the third horizontal width W30 of the surface emission laser device 230 may be 500 μm to 1,500 μm, but is not limited thereto.

In an exemplary embodiment, the first horizontal width W10 of the transmission part 250 is formed to be 18/15 times or more, for example, about 1,800 μm or more of the third horizontal width W30 of the surface emission laser device 230. As a result, it may be secured to be wider than the divergence angle of the surface emission laser device 230.

In addition, in the exemplary embodiment, the first horizontal width W10 of the transmission part 250 is formed to be 6 times or less, for example, about 3,000 μm or less of the third horizontal width W30 of the surface emission laser device 230. By measuring the degree of change in the amount of light detected by securing the area of the reflector 260 to allow the light receiving device 240 to detect the light emitted from the surface emitting light emitting laser device 230 reflected inside the package Whether or not the transmission unit 250 is detached can be controlled more precisely.

In addition, in the embodiment, the second horizontal width W20 of the reflector 260 may be in the range of 16/15 times to 4 times the horizontal width of the light receiving element 240. For example, the second horizontal width W20 of the reflector 260 may be about 1,600 μm to 2,000 μm, and the horizontal width of the light receiving device 240 may be about 500 μm to 1,500 μm, but the present invention is not limited thereto. It doesn't happen.

Accordingly, the horizontal width of the diffusion part including the transmission part 250 and the reflection part 260 may be about 3,400 μm to 5,000 μm, but is not limited thereto.

For example, in the exemplary embodiment, the second horizontal width W20 of the reflector 260 is formed to be 16/15 times or more, for example, about 1,600 μm or more of the horizontal width of the light receiving element 240. By securing the area of 260 to allow the light receiving element 240 to detect the light reflected from the inside of the package, it is possible to more precisely control the detachment of the transmission unit 250 by measuring the degree of change in the amount of detected light. Can be.

In addition, in the embodiment, the second horizontal width W20 of the reflector 260 is formed to be 4 times or less, for example, about 2,000 μm or less of the horizontal width of the light receiving element 240, so that the reflector 260 is formed. The surface emitting laser device 230 may not overlap with a divergence angle.

Referring back to FIG. 9B, the thickness T3 of the second reflecting portion 262 may be set in a range of about 1/75 to about 1 times the third horizontal width W30 of the surface emission laser device 230. Can be. The thickness T3 of the second reflector 262 may be formed to be about 1/75 or more of the third horizontal width W30 of the surface emission laser device 230 to function as a reflector and to be transmitted. The ratio of the laser can be improved.

In addition, the thickness T3 of the second reflector 262 is formed to be about 1 times or less than the third horizontal width W30 of the surface emission laser device 230 to function as a reflector and a second reflector. The thickness of 262 can be controlled to be thin to improve the light output.

For example, the thickness T3 of the second reflector 262 may be set to about 20 μm to about 500 μm. For example, the thickness T3 of the second reflector 262 may be about 1/75 or more, for example, about 20 μm or more of the third horizontal width W30 of the surface emission laser device 230. It can be formed to function as a reflector and to improve the ratio of the laser can be transmitted.

In addition, the thickness T3 of the second reflector 262 is formed to be about 1 times or less, for example, about 500 μm of the third horizontal width W30 of the surface emission laser device 230, thereby reflecting the function of the reflector. And lightly control the thickness of the second reflector 262 to improve the light output.

(2nd Example)

FIG. 10A is a plan view of the surface emitting light emitting laser package 202 according to the second embodiment, and FIG. 10B is a second transmission portion 252 in the surface emitting light emitting laser package 202 according to the second embodiment shown in FIG. 10A. And the third reflector 263 are omitted.

The second embodiment may employ the technical features of the first embodiment, and will be described below with reference to the main features of the second embodiment.

10A and 10B, the surface emitting light emitting laser package 202 according to the second embodiment may include a body 210 including a cavity C, and a fifth spaced apart from each other in the cavity C. Surface emission disposed on the electrode part 225, the sixth electrode part 226, and the fifth electrode part 225 and electrically connected by the sixth electrode part 226 and the third wire W3. The light emitting laser device 230 and the cavity C are spaced apart from the surface emitting light emitting laser device 230 and disposed on the sixth electrode part 226 to emit light from the surface emitting light emitting laser device 230. On the second light receiving element 232 for detecting the light, the second transmission portion 252 and the second light receiving element 232 disposed on the body 210 on the surface emitting light emitting laser element 230 It may include a third reflector 263 disposed. The second transmission part 252 and the third reflection part 263 may be referred to as diffusion parts.

The second light receiving element 232 may be electrically connected to the fifth electrode part 225 by a fourth wire W4 to apply a reverse bias voltage.

According to the second embodiment, the second light receiving element 232 is disposed on the sixth electrode part 226 electrically connected to the surface emitting light emitting laser element 230 to detect the light in the second light receiving element 232. The third reflector 263 is disposed on the second light receiving element 232 to provide a high performance light sensing performance and to provide a compact surface emitting laser package and an optical module. have.

Also, referring to FIG. 10A, in the second embodiment, the first horizontal width W10 of the second transmission portion 252 in the first axial direction is equal to that of the third reflection portion 263 in the first axial direction. It is formed larger than the second horizontal width (W20) can increase the amount of light received by the second light receiving element (232).

For example, the first horizontal width W10 of the second transmission portion 252 is formed larger than the second horizontal width W20 of the third reflection portion 263, so that the upper side of the second transmission portion 252 is higher. It is possible to provide a surface emitting light emitting laser package and an optical assembly having excellent reliability of light sensing performance by increasing the likelihood that light totally reflected from the surface reaches the second light receiving device 232.

In addition, as shown in FIG. 9B, in the second embodiment, the thickness of the third reflector 263 may be thinner than the thickness of the second transmissive part 252. This ensures the divergence angle that can be emitted from the second transmission unit 252 as wide as possible, while the light reflected by the third reflection unit 263 reflected inside the package to the second light receiving element 232 as possible to detect the light There is a technical effect that can provide a surface emitting light emitting laser package and an optical assembly with excellent reliability of performance.

According to the embodiment there is a technical effect that can provide a surface emitting light emitting laser package and an optical module excellent in reliability and stability.

In addition, according to the embodiment, it is possible to provide a compact surface emitting light emitting laser package and an optical module capable of high power and high voltage driving.

As described above, the surface emitting laser package according to the embodiment may include a vertical cavity surface emitting laser semiconductor device (VCSEL).

The vertical cavity surface emitting laser semiconductor device can convert an electrical signal into an optical signal. In the vertical cavity surface emitting laser semiconductor device, unlike a general side emitting laser LD, a circular laser beam may be emitted vertically from the substrate surface. Accordingly, the vertical cavity surface emitting laser semiconductor device has an advantage in that it is easy to connect to a light receiving device or an optical fiber and the two-dimensional array can be easily processed in parallel. In addition, the vertical cavity surface-emitting laser semiconductor device has the advantages of high density integration due to the miniaturization of the device, small power consumption, simple manufacturing process, and good heat resistance.

Applications of vertical cavity surface emitting laser semiconductor devices include digital printers, laser printers, laser mice, DVI, HDMI, high-speed PCBs, and home networks. In addition, the vertical cavity surface emitting laser semiconductor device may be applied to automotive applications such as multimedia networks and safety sensors in automobiles. In addition, the vertical cavity surface emitting laser semiconductor device may be applied to information communication fields such as Gigabit Ethernet, SAN, SONET, and VSR. In addition, the vertical cavity surface emitting laser semiconductor device may be applied to sensor fields such as encoders and gas sensors. In addition, the vertical cavity surface emitting laser semiconductor device can be applied to medical and biotechnology such as blood glucose meter, laser for skin care.

On the other hand, the surface emitting light emitting laser package according to the embodiment described above may be applied to a proximity sensor, an auto focusing device, and the like. The auto focus device may be variously applied to a mobile terminal, a camera, a vehicle sensor, and an optical communication device. The auto focus apparatus may be applied to various fields for multi-position detection for detecting the position of a subject.

(Optical assembly)

11 is a perspective view of a light assembly including a surface emitting light emitting laser package according to an embodiment, for example, a mobile terminal 1500 to which an autofocus device is applied.

As illustrated in FIG. 11, the mobile terminal 1500 of the embodiment may include a camera module 1520, a flash module 1530, and an auto focusing device 1510 provided at a rear surface thereof. Here, the auto focus device 1510 may include one of the surface emitting light emitting laser packages according to the embodiment described with reference to FIGS. 1 to 10B as a light emitting unit.

The flash module 1530 may include a light emitting device that emits light therein. The flash module 1530 may be operated by camera operation of a mobile terminal or control of a user.

The camera module 1520 may include an image capturing function and an auto focus function. For example, the camera module 1520 may include an auto focus function using an image.

The auto focus device 1510 may include an auto focus function using a laser. The auto focus device 1510 may be mainly used in a condition in which the auto focus function using the image of the camera module 1520 is degraded, for example, in a proximity or dark environment of 10 m or less. The auto focus device 1510 may include a light emitting unit including a vertical cavity surface emitting laser (VCSEL) semiconductor device, and a light receiving unit converting light energy such as a photodiode into electrical energy.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to this combination and modification are included in the scope of the embodiments.

Although the above description has been made with reference to the embodiments, these are merely examples and are not intended to limit the embodiments, and those of ordinary skill in the art to which the embodiments pertain may have various examples that are not illustrated above without departing from the essential characteristics of the embodiments. It will be appreciated that eggplant modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the embodiments set forth in the appended claims.

Body 210, surface emitting light emitting laser element 230, light receiving element 240, transmission portion 250, reflecting portion 260,
The first electrode part 221, the second electrode part 222, the third electrode part 223, and the fourth electrode part 224.

Claims (12)

A body including a cavity;
A surface emitting light emitting laser element disposed in the cavity;
A light receiving device disposed in the cavity and spaced apart from the surface emitting light emitting laser device, and configured to sense light emitted from the surface emitting light emitting laser device; And
A diffusion part disposed on the body and including a transmission part and a reflection part,
The transmission portion is disposed on the surface emitting light emitting laser element,
The reflector is disposed on the light receiving element,
The second width of the reflecting portion is narrower than the first width of the transmitting portion,
And the reflecting portion does not overlap a divergence angle of the surface emitting laser device. According to claim 1,
A first electrode part on which the surface emission laser device is disposed;
A second electrode part on which the light receiving element is disposed;
A third electrode part electrically connected to the surface emitting laser element by a first wire; And
And a fourth electrode part electrically connected by the light receiving element and the second wire. According to claim 1,
And a first separation distance from an upper surface of the surface emitting light emitting laser device to the transmission portion is in a range of 2/75 to 1/5 of a third horizontal width of the surface emitting light emitting laser device. According to claim 1,
The first horizontal width of the transmission portion
And a surface emitting light emitting laser package in a range of 18/15 to 6 times the third horizontal width of the surface emitting light emitting laser device. According to claim 1,
The second horizontal width of the reflector
And a surface emitting light emitting laser package ranging from 16/15 times to 4 times the horizontal width of the light receiving element. According to claim 1,
The surface emission light emitting laser package of which the thickness of the reflecting portion is thinner than the thickness of the transmitting portion. The method of claim 6,
The thickness of the reflector,
The surface-emitting light emitting laser package of 1/10 to 1/2 of the thickness of the transmission portion. The method of claim 6,
The thickness of the reflector,
The surface-emitting light emitting laser package of 1/75 to 1 times the third horizontal width of the surface-emitting light emitting laser device. A body including a cavity;
A fifth electrode part and a sixth electrode part spaced apart from each other in the cavity;
A surface emission laser device disposed on the fifth electrode part and electrically connected to the sixth electrode part by a third wire;
A second light receiving element spaced apart from the surface emitting light emitting laser element in the cavity and disposed on the sixth electrode part to sense light emitted from the surface emitting light emitting laser element; And
A diffusion part disposed on the body and including a second transmission part and a third reflection part; Include,
The second transmission portion is disposed on the surface emitting light emitting device,
The third reflector is disposed on the second light receiving element,
And the third reflecting portion does not overlap a divergence angle of the surface emitting laser device. The method of claim 9,
The first horizontal width of the second transmission portion in the first axial direction is
And a surface emitting light emitting laser package larger than a second horizontal width of the third reflecting portion in the first axial direction. The method of claim 9,
And a thickness of the third reflecting portion is thinner than a thickness of the second transmitting portion. An optical module comprising the surface emitting light emitting laser package according to any one of claims 1 to 11.

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