KR20190128831A - Vertical-cavity surface-emitting laser package and automatic focusing device - Google Patents

Abstract

The present invention relates to a surface light emitting laser package having a new structure without wires, and an autofocusing device. The surface light emitting laser package comprises: a surface light emitting laser device disposed on a substrate; a housing disposed on the substrate and surrounding the surface light emitting laser device to have a step; a diffusion part disposed in the step of the housing; a conductive line disposed between the diffusion part and a surface light emitting laser and between the diffusion part and the step; a connection hole formed in one side of the step; and a connection wiring disposed in the connection hole and electrically connected to the conductive line. The conductive line includes at least two connection pads disposed between the diffusion part and the surface light emitting laser and between the diffusion part and the step, and at least two connection lines disposed between the diffusion part and the surface light emitting laser and between the diffusion part and the step, and having a width smaller than that of the connection pad and electrically connected to the connection pad.

Description

Surface-emitting laser package and automatic focusing device

Embodiments relate to surface emitting laser packages and autofocus devices.

A semiconductor device including a compound such as GaN, AlGaN, etc. has many advantages, such as having a wide and easy-to-adjust band gap energy, and can be used in various ways as a light emitting device, a light receiving device, and various diodes.

In particular, surface light emitting laser packages using semiconductors of Group 3-5 or Group 2-6 compound semiconductor materials may be employed in optical communications, sensors, auto focus devices, proximity sensors, auto focus devices.

In the surface light emitting laser package, the surface light emitting laser package is electrically connected using a wire. Since the wire is thin, there is a problem that the wire is electrically disconnected by physical force such as an external impact.

The embodiment aims to solve the above and other problems.

Another object of the embodiment is to provide a surface light emitting laser package and an autofocusing apparatus having a novel structure.

It is yet another object of the embodiment to provide a surface light emitting laser package and an autofocusing device with the wire removed.

Still another object of the embodiment is to provide a surface light emitting laser package and an autofocusing device capable of easily detecting the detachment of the diffusion part.

Still another object of the embodiment is to provide a surface light emitting laser package and an autofocusing device capable of preventing electrical disconnection between the surface light emitting laser element and the substrate.

According to an aspect of the embodiment to achieve the above or another object, the surface light emitting laser package, the substrate; A surface light emitting laser element disposed on the substrate; A housing disposed on the substrate and surrounding the surface light emitting laser element and having a step; A diffusion part disposed at the step of the housing; A conductive line disposed between the diffuser and the surface light emitting laser and between the diffuser and the step; A connection hole formed at one side of the step; And a connection wiring disposed in the connection hole and electrically connected to the conductive line. The conductive line may include at least two connection pads disposed between the diffuser and the surface light emitting laser and between the diffuser and the step; And at least two connection lines disposed between the diffuser and the surface light emitting laser and between the diffuser and the step and having a width smaller than that of the connection pad and electrically connected to the connection pad.

According to yet another aspect of an embodiment, an autofocus device comprises: the surface light emitting laser package; And a light receiving unit receiving the reflected light of the light emitted from the surface light emitting laser package.

The effects of the surface light emitting laser package and the autofocusing apparatus according to the embodiment are as follows.

According to at least one of the embodiments, there is an advantage that the scratch, crack, detachment or detachment of the diffuser can be easily detected through the disconnection of the connection pad or the connection line by the connection pad and the connection line disposed under the diffuser. . When the defect of the diffusion unit is detected as described above, the driving of the surface light emitting laser device may stop the strong laser beam from being irradiated to the user's eyes.

According to at least one of the embodiments, a connection line having a width smaller than that of the connection pad or a surface corresponding to the surface light emitting laser device is disposed at a portion of the connection pad and the connection line disposed below the diffusion unit corresponding to the surface light emitting laser device. The connection line is not disposed at the portion, thereby minimizing interference with the progress of the laser beam from the surface light emitting laser element to the diffusion portion, thereby preventing the light diffusion defect or the light output degradation of the laser beam.

According to at least one of the embodiments, each bump is wrapped by an adhesive portion and each bump is attached to the connection pad and the surface light emitting laser element, thereby preventing electrical disconnection between the connection pad and the surface light emitting laser element. There is an advantage.

According to at least one of the embodiments, since the surface light emitting laser device and the substrate are electrically connected to each other by a conductive line and a bump disposed between the surface light emitting laser device and the substrate, there is an advantage that a separate wire is not required.

According to at least one of the embodiments, a plurality of conductive lines are disposed under the diffusion part, and thus the detachment of the diffusion part can be easily detected through disconnection of the plurality of conductive lines.

According to at least one of the embodiments, the diffusion portion is adhered to the surface light emitting laser element or the housing by the adhesive portion, so that the adhesion of the diffusion portion can be strengthened to prevent detachment of the diffusion portion.

According to at least one of the embodiments, since the adhesive portion is disposed in all the spaces in the opening of the housing including the periphery of the surface light emitting laser element, the detachment of the diffusion portion 140 may be blocked at the source.

Further scope of the applicability of the embodiments will become apparent from the detailed description below. However, various changes and modifications within the spirit and scope of the embodiments can be clearly understood by those skilled in the art, and therefore, specific embodiments, such as the detailed description and the preferred embodiments, are to be understood as given by way of example only.

1 is a cross-sectional view of a surface light emitting laser package according to the first embodiment.
2 is a plan view of a surface light emitting laser package according to the first embodiment.
3 is a cross-sectional view showing a surface light emitting laser device.
4 is a top perspective view of the housing;
5 shows a connection pad and a connection line.
6 is a cross-sectional view of the surface light emitting laser package according to the second embodiment.
7 is a cross-sectional view of a surface light emitting laser package according to the third embodiment.
8 is a plan view of a surface light emitting laser package according to a third embodiment.
9 is a sectional view of a surface light emitting laser package according to the fourth embodiment.
10 is a perspective view of a mobile terminal to which an autofocusing apparatus including a surface light emitting laser package according to an embodiment is applied.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments disclosed herein will be described in detail with reference to the accompanying drawings, and the same or similar components will be given the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted. The suffixes "module" and "unit" for components used in the following description are given or used in consideration of ease of specification, and do not have distinct meanings or roles from each other. In addition, in describing the embodiments disclosed herein, when it is determined that the detailed description of the related known technology may obscure the gist of the embodiments disclosed herein, the detailed description thereof will be omitted. In addition, the accompanying drawings are intended to facilitate understanding of the embodiments disclosed herein, but are not limited to the technical spirit disclosed herein by the accompanying drawings, all changes included in the spirit and scope of the embodiments, It should be understood to include equivalents and substitutes.

<First Embodiment>

1 is a cross-sectional view of a surface light emitting laser package according to a first embodiment, FIG. 2 is a plan view of a surface light emitting laser package according to a first embodiment, and FIG. 3 is a cross-sectional view showing a surface light emitting laser device. 4 is a top perspective view of the housing;

1 to 4, the surface light emitting laser package 100 according to the first embodiment may provide a substrate 110. For example, the substrate 110 may include a printed circuit board. The substrate 110 may be a rigid type printed circuit board having no bending property or a flexible type printed circuit board having excellent bending property. The substrate 110 may provide driving power to the surface light emitting laser device 200. The substrate 110 may include at least one signal line to be electrically connected to the surface light emitting laser device 200. Power may be supplied to the surface light emitting laser device 200 through the signal line of the substrate 110.

The surface light emitting laser package 100 according to the first embodiment may provide the surface light emitting laser device 200.

The surface light emitting laser device 200 may be disposed on the substrate 110. The surface light emitting laser device 200 may be attached onto the substrate 110 using, for example, an adhesive member. The adhesive member may be made of a conductive material such as silver (Ag) paste material, but is not limited thereto. The surface light emitting laser device 200 may be electrically connected to the substrate 110. For example, the first electrode of the surface light emitting laser device 200 may be electrically connected to a first signal line (not shown) of the substrate 110 through an adhesive member.

2 and 3, the surface light emitting laser device 200 includes a first electrode 215, a substrate 210, a first reflective layer 220, a cavity region 230, and an aperture 241. One or more of the insulating region 242, the second reflective layer 250, the second electrode 280, the passivation layer 270, and the pad electrode 290 may be included.

The cavity region 230 may include an active layer (not shown) and a cavity (not shown), which will be described below. The insulating region 242 includes a first insulating region 242a disposed in the first emitter E1, a second insulating region 242b and a third emitter E3 disposed in the second emitter E2. It may include a third insulating region 242c disposed in, but is not limited thereto.

Hereinafter, the surface light emitting laser device 200 will be described in more detail.

<Substrate, first electrode>

In an embodiment the substrate 210 may be a conductive substrate or a non-conductive substrate. In the case of using a conductive substrate, a metal having excellent electrical conductivity may be used, and since the heat generated when operating the surface light emitting laser device 200 should be sufficiently dissipated, a GaAs substrate having a high thermal conductivity, a metal substrate, or silicon ( Si) substrate etc. can be used.

In the case of using a non-conductive substrate, an AlN substrate, a sapphire (Al 2 O 3) substrate, or a ceramic substrate may be used.

In an embodiment, the first electrode 215 may be disposed below the substrate 210, and the first electrode 215 may be disposed in a single layer or multiple layers with a conductive material. For example, the first electrode 215 may be a metal and include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). As a single layer or a multi-layer structure can be formed to improve the electrical characteristics to increase the light output.

<1st reflective layer>

The first reflective layer 220 may be disposed on the substrate 210.

The first reflective layer 220 may be doped with a first conductivity type dopant. For example, the first conductivity type dopant may include an n type dopant such as Si, Ge, Sn, Se, Te, or the like.

In addition, the first reflective layer 220 may include a gallium-based compound, for example, AlGaAs, but is not limited thereto. The first reflective layer 220 may be a distributed bragg reflector (DBR). For example, the first reflective layer 220 may have a structure in which a first layer and a second layer made of materials having different refractive indices are alternately stacked at least once.

The first layer and the second layer may include AlGaAs, and in detail, may be formed of a semiconductor material having a compositional formula of Al x Ga (1-x) As (0 <x <1). Herein, when Al in the first layer or the second layer increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase.

In addition, the thickness of each of the first and second layers may be λ / 4n, λ may be a wavelength of light generated in the cavity region 230, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength. . Here, λ may be 650 to 980 nm, n may be the refractive index of each layer. The first reflective layer 220 having such a structure may have a reflectance of 99.999% for light in a wavelength region of about 940 nm.

The thickness of the first layer and the second layer may be determined according to respective refractive indices and the wavelength λ of the light emitted from the cavity region 230.

<Cavity area, insulation area, aperture>

In an embodiment, the cavity region 230, the insulating region 242, and the aperture 241 may be disposed on the first reflective layer 220. In detail, the cavity region 230 may be disposed on the first reflective layer 220, and the insulating region 242 and the aperture 241 may be disposed on the cavity region 230.

The cavity region 230 may include an active layer (not shown), a first cavity (not shown) disposed under the active layer, and a second cavity (not shown) disposed above. The cavity area 230 of the embodiment may include both the first cavity and the second cavity, or may include only one of them.

The cavity region 230 may be disposed between the first reflective layer 220 and the second reflective layer 250. In an embodiment, an active layer may be disposed in the cavity region 230, and the active layer may include a single well structure, a multi well structure, a single quantum well structure, a multi quantum well structure, a quantum dot structure, or the like. It may include any one of the quantum wire structure.

The active layer may be formed using a pair structure of a well layer and a barrier layer, for example, AlGaInP / GaInP, AlGaAs / AlGaAs, AlGaAs / GaAs, GaAs / InGaAs, using a compound semiconductor material of a group III-V element. It doesn't work. The well layer may be formed of a material having an energy band gap smaller than the energy band gap of the barrier layer.

The first cavity and the second cavity may be formed of an AlyGa (1-y) As (0 <y <1) material, but are not limited thereto.

In an embodiment, the insulating region 242 and the aperture 241 may be disposed on the cavity region 230.

For example, the first emitter E1 includes a first insulating region 242a and a first aperture 241a, and the second emitter E2 includes a second insulating region 242b and a second upper. It may include a location 241b. In addition, the third emitter E3 includes a third insulating region 242c and a third aperture 241c, and the fourth emitter E4 includes a fourth insulating region (not shown) and a fourth aperture. (Not shown).

The insulating region 242 is an insulating layer made of an insulating material, for example, aluminum oxide, and may serve as a current blocking layer. Each of the apertures 241a, 241b, and 241c positioned in the central region of each insulating region may be a non-insulating layer, that is, a conductive layer.

The insulating region 242 may surround the aperture 241. The size of the aperture 241 may be adjusted by the insulating region 242. For example, as the area of the insulating region 242 occupied on the cavity region 230 becomes larger, the area of the aperture 241 may be smaller.

For example, the first aperture 241a may be defined by the first insulation region 242a, and for example, the second aperture 241b may be defined by the second insulation region 242b. have. In addition, the third aperture 241c may be defined by the third insulating region 242c, and the fourth aperture may be defined by the fourth insulating region. In detail, each insulating region 242 may include aluminum gallium arsenide. For example, the insulating region 242 may form an insulating region 242 as AlGaAs reacts with H 2 O and its edge is changed to aluminum oxide (Al 2 O 3), and the center region that does not react with H 2 O may be formed of AlGaAs. An aperture can be formed.

According to the embodiment, the laser beam emitted from the cavity region 230 through the apertures 241a, 241b, and 241c may be emitted toward the upper region, and the upper portion is compared with the insulating regions 242a, 242b, and 242c. The light transmittance of the features 241a, 241b, and 241c may be excellent.

<Second reflective layer>

The second reflective layer 250 may be disposed on the cavity region 230.

The second reflective layer 250 may include a gallium-based compound, for example, AlGaAs, and the second reflective layer 250 may be doped with a second conductive dopant. For example, the second conductivity type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like. Meanwhile, the first reflective layer 220 may be doped with a p-type dopant, and the second reflective layer 250 may be doped with an n-type dopant.

The second reflective layer 250 may be a distributed Bragg reflector (DBR). For example, the second reflective layer 250 may have a structure in which a first layer (not shown) and a second layer (not shown) made of materials having different refractive indices are alternately stacked at least once.

The first layer and the second layer may include AlGaAs, and in detail, may be formed of a semiconductor material having a compositional formula of Al x Ga (1-x) As (0 <x <1). Herein, when Al increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase. In addition, the thickness of each of the first layer and the second layer is λ / 4n, λ may be a wavelength of light emitted from the active layer, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength.

The second reflective layer 250 having such a structure may have a reflectance of 99.9% with respect to light in a wavelength region of 940 nm.

The second reflective layer 250 may be formed by alternately stacking the third and fourth layers, and the number of pairs of the first layer and the second layer in the first reflective layer 220 is the second reflective layer 250. ) May be greater than the number of pairs of the third layer and the fourth layer, and as described above, the reflectance of the first reflecting layer 220 may be greater than 99.9% of reflectance of the second reflecting layer 250 by 99.999%. have. For example, the number of pairs of the first layer and the second layer in the first reflective layer 220 may be 20 to 50 times, and the number of pairs of the third layer and the fourth layer in the second reflective layer 250 may be 10 times. To 30 times.

Passivation layer, second electrode

The passivation layer 270 is disposed on the side and top surfaces of the emitters E1, E2, E3, and E4 and the top surface of the first reflective layer 220 exposed between the emitters E1, E2, E3, and E4. Can be. The passivation layer 270 is disposed on the side of each of the emitters E1, E2, E3, and E4 separated in units of segments to protect and insulate the emitters E1, E2, E3, and E4. have. The passivation layer 270 may be made of an insulating material, for example, nitride or oxide.

The second electrode 280 may be disposed to be electrically connected to the second reflective layer 250. That is, the second electrode 280 extends from the pad electrode 290 and contacts a portion of the second reflective layer 250 via the passivation layer 270 surrounding each of the emitters E1, E2, E3, and E4. Can be. The second electrode 280 may be disposed on the passivation layer 270.

The second electrode 280 may be made of a conductive material, for example, may be a metal. For example, the second electrode 280 may include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). It can be formed as.

Referring back to FIG. 1, the surface light emitting laser package 100 according to the first embodiment may provide a housing 120. For example, the housing 120 may be disposed on the substrate 110.

Specifically, the housing 120 may surround the surface light emitting laser device 200. The surface light emitting laser device 200 may be disposed to be spaced apart from the inner surface of the housing 120. The housing 120 may be attached to the substrate 110 using, for example, an adhesive member.

The housing 120 can have an opening 105. An upper surface of the substrate 110 may be exposed by the opening 105 of the housing 120, and the surface light emitting laser device 200 may be disposed on the exposed surface of the substrate 110.

The housing 120 may have a step 180. The step 180 may be formed at an upper portion of the housing 120. The step 180 may be connected to the opening 105 at the top of the housing 120. The step 180 of the housing 120 may have a bottom surface 117, as shown in FIG. 4.

A plurality of connection wires 111 may be disposed on one side of the housing 120. That is, a plurality of connection wirings 111 may be disposed in the connection holes 121 of the housing 120.

The connection wiring 111 may be disposed in the connection hole 121 of the housing 120. The connection hole 121 may be formed to penetrate from the top surface of the housing 120 corresponding to the step 180 to the bottom surface. The inner diameter of each of the connection holes 121 may be the same as the outer diameter of each of the connection wires 111.

The top surface of each of the connection wires 111 may be exposed to the bottom surface 117 of the step 180 of the housing 120. That is, the upper surface of each of the connection wires 111 may be located on the same surface as the bottom surface 117 of the step 180 of the housing 120. The lower surface of each of the connection wires 111 may be exposed to the lower surface of the housing 120. That is, the bottom surface of each of the connection wires 111 may be positioned on the same surface as the bottom surface of the housing 120. A lower surface of each of the connection lines 111 may be electrically connected to a second signal line (not shown) of the substrate 110.

The surface light emitting laser package 100 according to the first embodiment may provide the diffuser 140.

The diffusion unit 140 may be disposed on the surface light emitting laser device 200. The diffusion unit 140 may be spaced apart from the surface light emitting laser device 200.

The diffusion unit 140 may be made of a transparent insulating material. For example, the diffusion part 140 may be glass or a polymer resin. For example, the diffusion part 140 may include a body made of glass and a diffusion pattern disposed on one side of the body and made of a polymer resin, but is not limited thereto.

The diffusion unit 140 may extend the angle of view of the laser beam emitted from the surface light emitting laser device 200.

The diffusion unit 140 may include an anti-reflective function. For example, the diffuser 140 may include an antireflection layer disposed on one surface of the diffuser 140 facing the surface light emitting laser device 200. The antireflective layer may be formed separately from the diffusion part 140. The diffusion unit 140 may include an antireflection layer disposed on a bottom surface of the diffuser 140 facing the surface light emitting laser device 200. The anti-reflective layer may prevent the laser beam incident from the surface light emitting laser device 200 from being reflected from the surface of the diffuser 140 and transmit the light into the diffuser 140 to improve light loss due to reflection.

The antireflective layer may be formed of, for example, an antireflective coating film and attached to the surface of the diffusion part 140. The antireflective layer may be formed on the surface of the diffusion part 140 by spin coating or spray coating. As an example, the antireflective layer may be formed of a single layer or multiple layers including at least one of a group comprising TiO 2, SiO 2, Al 2 O 3, Ta 2 O 3, ZrO 2, MgF 2.

The surface light emitting laser package 100 according to the first embodiment may provide a conductive line. The conductive line may be disposed under the diffusion part 140. For example, the conductive line may be disposed on the bottom surface of the diffusion unit 140. The conductive line may be formed on the lower surface of the diffusion part 140 by, for example, a sputtering process and an etching process, but is not limited thereto.

As shown in FIG. 2, the conductive line may include a plurality of connection pads 131 to 134 and connection lines 135 and 136 electrically connecting the pads.

Although the first connection pad 131 is not shown to be connected to the connection line in the drawing, in the embodiment, all of the plurality of connection pads 131 to 134 may be connected by the connection lines 135 and 136 or a plurality of connection pads. Some connection pads 131 to 134 may not be connected by a connection line.

The plurality of connection pads 131 to 134 may be spaced apart from each other. For example, the first connection pad 131 is disposed in the first region of the lower surface of the diffusion unit 140, the second connection pad 132 is disposed in the second region of the lower surface of the diffusion unit 140, and the third The connection pad 133 may be disposed in the third region of the lower surface of the diffusion unit 140, and the fourth connection pad 134 may be disposed in the fourth region of the lower surface of the diffusion unit 140. The first region of the lower surface of the diffusion unit 140 may be disposed between the second region of the lower surface of the diffusion unit 140 and the third region of the lower surface of the diffusion unit 140. The third region may be disposed between the first region of the bottom surface of the diffusion unit 140 and the fourth region of the bottom surface of the diffusion unit 140. The first region of the lower surface of the diffusion unit 140 may correspond to the first region of the upper surface of the surface light emitting laser device 200. The second area of the bottom surface of the diffusion part 140 may correspond to the connection hole 121 of the housing 120. The connection wiring 111 may be disposed in the connection hole 121 of the housing 120. The third region of the bottom surface of the diffusion unit 140 may correspond to the second region of the top surface of the surface light emitting laser device 200. The fourth region of the bottom surface of the diffusion part 140 may correspond to the other side of the connection hole 121 of the housing 120.

Each of the first to fourth connection pads 131 to 134 may have a different length. For example, the length of each of the first and third connection pads 131 and 133 may be smaller than the length of each of the second and fourth connection pads 132 and 134. The length of each of the first and second connection pads 132 may be smaller than the width or length of the surface light emitting laser device 200. For example, the length of each of the first and second connection pads 131 and 132 may be equal to or greater than the length of the second electrode of the surface light emitting laser device 200. The length of each of the second and fourth connection pads 132 and 134 may be greater than the width or length of the surface light emitting laser device 200. The length of each of the second and fourth connection pads 132 and 134 may be smaller than the length of the step 180 formed at one side of the housing 120.

The second connection pad 132 may be disposed to correspond to the connection hole 121 of the housing 120 adjacent to the first side of the surface light emitting laser device 200. The fourth connection pad 134 may be disposed to correspond to the other side of the connection hole 121 of the housing 120 adjacent to the second side opposite to the first side of the surface light emitting laser device 200.

The first connection line 135 is a member that electrically connects the second connection pad 132 and the fourth connection pad 134. The first connection line 135 is formed between the second connection pad 132 and the fourth connection pad 134. It may be arranged in the form. For example, the first connection line 135 may be disposed along the periphery of the surface light emitting laser device 200 at the bottom surface of the diffusion unit 140. For example, the first connection line 135 is disposed so as not to overlap the surface light emitting laser device 200 at the bottom surface of the diffuser 140, so as not to obstruct the path of the laser beam from the surface light emitting laser device 200. You may not.

The second connection line 136 is a member that electrically connects the third connection pad 133 and the fourth connection pad 134, and there is no connection between the third connection pad 133 and the fourth connection pad 134. It may be arranged in the form.

The first connection pad 131 may be electrically connected to the second connection pad 132 using a connection line. The first connection pad 131 may be electrically connected to the third connection pad 133 by using a connection line. The first connection pad 131 may be electrically connected to the fourth connection pad 134 using a connection line.

At least one connection pad of the first connection pad 131 and the third connection pad 133 may be connected to the second connection pad 132. The first connection pad 131 may be electrically connected to the second connection pad 132, and the third connection pad 133 may not be electrically connected to any connection pad. The fourth connection pad 134 may not be electrically connected to any connection pad.

The third connection pad 133 may be electrically connected to the second connection pad 132 using a connection line.

The width of the connection line may be smaller than the width of the connection pad. For example, the width of the connection pad may be equal to or greater than the diameter of the bumps 151, 153, 155, 157 described later, for example. For example, the width of each connection line may be 3% to 10% of the width of each connection pad. When the width of each of the connection lines is less than or equal to 3% of the width of the connection pads, the resistance component becomes large so that current does not flow easily. When the width of each of the connection lines is 10% or more of the width of each of the connection pads, it may hinder the progress of the laser beam of the surface light emitting laser device 200. As such, the connection pads requiring electrical contact with the bumps 151, 153, 155, and 157 are relatively wider, and the connection lines that do not require electrical contact with the bumps 151, 153, 155, and 157 are wider. Remarkably small, the interference with the progress of the laser beam from the surface light emitting laser device 200 to the diffusion unit 140 can be minimized to prevent poor light diffusion of the laser beam or a decrease in light output.

According to the first embodiment, the scratches, cracks, detachment or detachment of the diffusion unit 140 are easily sensed through disconnection of the connection pad or the connection line by the connection pad and the connection line disposed below the diffusion unit 140. can do. When the defect of the diffuser 140 is detected as described above, the driving of the surface light emitting laser device 200 may be prevented from irradiating a strong laser beam to the eyes of the user who stops the door.

 The conductive line may include a conductive material. For example, the conductive line is a transparent conductive material, and may be ITO or TCO. For example, the conductive line is an opaque conductive material, and may be aluminium (Al), copper (Cu), gold (Au), chromium (Cr), tungsten (W), or an alloy thereof.

As shown in FIG. 5, the plurality of connection pads and the plurality of connection lines may be arranged in various forms.

As shown in FIG. 5A, the second connection pads spaced apart from the first connection pads 131 and the first connection pads 131 disposed on the bottom surface of the diffusion unit 140 and not electrically connected to each other are arranged in a zigzag form. 132 may include. That is, the first connection pad 131 and the second connection pad 132 are not connected by the connection line. The first connection pad 131 may correspond to at least one region of the top surface of the surface light emitting laser device 200.

Although the first connection pad 131 and the second connection pad 132 are not electrically connected in the drawing, the first connection pad 131 and the second connection pad 132 may be electrically connected to each other.

When the first connection pad 131 is not electrically connected to the second connection pad 132, the second connection pad 132 is electrically connected to the second signal line of the substrate 110 via the connection wiring 111. Will not be connected. In this case, the first connection pad 131 and the first bump 151 may not serve as an electrode but may serve as a pillar supporting the diffusion part 140. If the first connection pad 131 is electrically connected to the second connection pad 132, the first connection pad 131 and the first bump 151 may be formed of the surface light emitting laser device 200 and the substrate 110. It may serve as a pillar supporting the diffusion part 140 as well as an electrode connecting the second signal line.

In FIG. 5A, a connection line may be omitted. Alternatively, in FIG. 5A, the second connection pad 132 corresponding to the connection wiring 111 disposed on the step 180 of the housing 120 among the shapes of the second connection pads 132 may be formed in the form of a pad. The other second connection pad 132 may be formed as a line having a width smaller than that of the pad.

In FIG. 5B, the arrangement of the first to fourth connection pads 131 to 134 is the same as that of FIG. 2. However, the arrangement of the connection lines 135 and 136 in FIG. 5B is different from that of FIG. 2. Although the first connection pad 131 is not electrically connected to other connection pads or connection lines in the drawing, the first connection pad 131 may be electrically connected to other connection pads or connection lines.

As illustrated in FIG. 5C, each of the first to fourth connection pads may be formed of a plurality of pads spaced apart from each other. Although the first connection pad 131 is not electrically connected to other connection pads or connection lines in the drawing, the first connection pad 131 may be electrically connected to other connection pads or connection lines.

The surface light emitting laser package 100 according to the first embodiment may provide a plurality of bumps 151, 153, 155, and 157.

The plurality of first bumps 151 may be disposed between the first connection pad 131 and the surface light emitting laser device 200. In detail, the first bump 151 may be disposed between the first connection pad 131 and one region of the top surface of the surface light emitting laser device 200. The first bump 151 may be in electrical contact with the second electrode of the surface light emitting laser device 200. The second bump 153 may be disposed between the second connection pad 132 and the housing 120. In detail, the second bump 153 may be disposed between the second connection pad 132 and the connection hole 121 region of the housing 120.

If the first connection pad 131 and the second connection pad 132 are electrically connected by a connection line, the surface light emitting laser device 200 may include a first bump 151 and a first connection pad 131. The second connection line 132 may be connected to the second signal line of the substrate 110 through a connection line 111 disposed in an area of the second connection pad 132, the second bump 153, and the connection hole 121 of the housing 120. . Since the surface light emitting laser device 200 is electrically connected to the second signal line of the substrate 110, the first signal line of the substrate 110? The surface light emitting laser device 200, the first bump 151, the first connection pad 131, the second connection pad 132, the second bump 153, the connection wiring 111, and the substrate 110 may be formed. An electrical passage formed of the second signal line may be formed. Therefore, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110.

The plurality of third bumps 155 may be disposed between the third connection pad 133 and the surface light emitting laser device 200. In detail, the third bump 155 may be disposed between the third connection pad 133 and the other region of the upper surface of the surface light emitting laser device 200. The third bump 155 may be in electrical contact with the second electrode of the surface light emitting laser device 200. The fourth bump 157 may be disposed between the fourth connection pad 134 and the housing 120. In detail, the fourth bump 157 may be disposed between the fourth connection pad 134 and the other region of the connection hole 121 of the housing 120. As shown in FIG. 2, the third connection pad 133 and the fourth connection pad 134 are electrically connected by the second connection line 136, and the second connection pad 132 and the third connection pad are connected to each other. 133 may be electrically connected by the first connection line 135. Accordingly, the first signal line of the substrate 110? Surface light emitting laser device 200, third bump 155, third connection pad 133, second connection line 136, fourth connection pad 134? An electrical passage including the first connection line 135, the second connection pad 132, the second bump 153, the connection wiring 111, and the second signal line of the substrate 110 may be formed. Therefore, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110.

The first to fourth bumps may be made of a metal material. For example, the first to fourth bumps 151, 153, 155, and 157 may be made of gold (Au) or aluminum (Al), but are not limited thereto.

The first to fourth bumps 151, 153, 155, and 157 described above may be referred to as dots.

The surface light emitting laser package 100 according to the first embodiment may provide adhesive parts 161 and 163. The adhesive parts 161 and 163 may include a first adhesive part 161 and a second adhesive part 163.

The first and second adhesive parts 161 and 163 may be made of a material having excellent adhesiveness and heat dissipation characteristics. For example, the first and second adhesive parts 161 and 163 may include a resin-based insulating material. For example, the first and second adhesive parts 161 and 163 may be made of a silicone resin, an epoxy resin, a thermosetting resin including a plastic material, or a high heat resistant material.

The first and second adhesive parts 161 and 163 may be made of a material having excellent conductivity. For example, the first and second adhesive parts 161 and 163 may be silver pastes, but are not limited thereto.

The first adhesive part 161 may surround the first bump 151 positioned between the first connection pad 131 and the surface light emitting laser device 200. The second adhesive part 163 may surround the third bump 155 positioned between the third connection pad 133 and the surface light emitting laser device 200.

Although not shown, the adhesive parts 161 and 163 surround the second bump 153 positioned between the second connection pad 132 and the connection hole 121 region of the housing 120 or the fourth connection pad 134. And the fourth bump 157 positioned between the other region of the connection hole 121 of the housing 120.

According to the first embodiment, the second adhesive part 163 surrounds the third bump 155 and attaches the third connection pad 133 and the second electrode 280 of the surface light emitting laser device 200 to each other. Electrical disconnection between the third connection pad 133 and the second electrode 280 of the surface light emitting laser device 200 may be prevented by the third bump 155.

According to the first embodiment, no wire is required for the surface light emitting laser element 200. That is, the surface light emitting laser device 200 and the substrate 110 may be electrically connected to each other by bumps and conductive lines 131 to 136 disposed between the surface light emitting laser device 200 and the substrate 110. Accordingly, in the first embodiment, defects due to disconnection of the wire can be prevented conventionally.

According to the first embodiment, the first to fourth connection pads 131 to 134 and the first and second connection lines 135 and 136 are provided in the diffusion part 140, thereby providing the first to fourth connection pads. Desorption of the diffusion unit 140 can be easily detected through disconnection of the first and second connecting lines 135 and 136 and 131 to 134. For example, when one of the first to fourth connection pads 131 to 134 and one of the first and second connection lines 135 and 136 is disconnected, an electrical connection between the substrate 110 and the surface light emitting laser device 200 is performed. Since the passage is blocked, the laser beam is not emitted from the surface light emitting laser device 200, and the detachment of the diffuser 140 can be detected through the emission of the laser beam.

According to the first embodiment, the diffusion part 140 is adhered to the surface light emitting laser element 200 or the housing 120 by the adhesion parts 161 and 163, thereby increasing the adhesion of the diffusion part 140 to thereby diffuse the diffusion part 140. Desorption of the 140 can be prevented.

Second Embodiment

6 is a cross-sectional view of the surface light emitting laser package according to the second embodiment.

The second embodiment is the same as the first embodiment except for the adhesive portion 160. In the description of the second embodiment, the same reference numerals are assigned to components having the same functions, shapes, and / or structures as the first embodiment, and detailed descriptions thereof are omitted. The description omitted in the second embodiment can be easily understood from the description of the first embodiment.

Referring to FIG. 6, the surface light emitting laser package 100A according to the second embodiment may provide an adhesive part 160.

The adhesion part 160 may be disposed between one region of the diffusion portion 140 and one region of the surface light emitting laser device 200, between one region of the diffusion portion 140 and one region of the substrate 110 and the diffusion portion 140. It may be disposed in a region between one side of the region and one region of the surface light emitting laser device 200 and one region of the substrate 110.

Between the other region of the diffusion portion 140 of the bonding portion 160 and the other region of the surface light emitting laser element 200, between the other region of the diffusion portion 140 and the other region of the substrate 110 and the diffusion portion 140. It may be disposed in the region between the other region and the other region of the surface light emitting laser device 200 and the other region of the substrate 110.

The adhesive part 160 is disposed in the spatial region between the surface light emitting laser element 200 and the inner surface of the housing 120 and between the diffuser 140 and the inner surface of the housing 120 in the opening 105 of the housing 120. Can be.

The adhesive part 160 may be disposed between the surface light emitting laser device 200 and the diffusion part 140 corresponding to the first connection pad 131 and the third connection pad 133.

According to the second embodiment, the adhesive part 160 is disposed in all the spaces in the opening 105 of the housing 120 including the circumference of the surface light emitting laser element 200, whereby the diffusion part 140 is formed by the adhesive part 160. In addition, since the housing 120 is also bonded, the detachment of the diffusion unit 140 may be blocked at the source.

Third Embodiment

7 is a cross-sectional view of the surface light emitting laser package according to the third embodiment, and FIG. 8 is a plan view of the surface light emitting laser package according to the third embodiment.

In the description of the third embodiment, the same reference numerals are assigned to components having the same functions, shapes, and / or structures as the first and second embodiments, and the detailed description is omitted. The description omitted in the third embodiment can be easily understood from the description of the first and second embodiments.

7 and 8, the surface light emitting laser package 100B according to the third embodiment may include a substrate 110, a surface light emitting laser device 200 disposed on the substrate 110, and a surface light emitting laser. The housing 120 surrounding the device 200 may include a diffusion unit 140 disposed on the surface light emitting laser device 200.

The housing 120 may have an opening 105 penetrating up and down. The housing 120 may have a first step 180 formed at an upper side thereof and connected to the opening 105. The housing 120 may have a second step 182 formed at a position lower than at least an upper surface of the first step 180. The first step 180 may be formed along the inside of the housing 120. The second step 182 is formed adjacent to the connection hole 121, but may or may not be formed along the inner side of the housing 120. The bottom surface of the second step 182 may extend from the bottom surface of the first step 180 toward the center of the housing 120.

The housing 120 may include a first connection hole 121 and a second connection hole 122. The second connection hole 122 may be formed to penetrate up and down the housing 120 corresponding to the other side of the first connection hole 121.

The first connection hole 121 may include a vertical connection hole 121a formed along the vertical direction and a horizontal connection hole 121b connected to the vertical connection hole 121a and formed along the horizontal direction. The vertical connection hole 121a is formed vertically at the upper side of the first step 180, and the horizontal connection hole 121b is connected to the vertical connection hole 121a to be exposed to the side of the second step 182. It can be formed along. The horizontal connection hole 121b may be connected to an upper side of the second step 182.

Instead of the vertical connection holes 121a and the horizontal connection holes 121b, round connection holes may be formed. One side of the round connection hole may be exposed to the inner surface of the housing 120, and the other side of the round connection hole may be exposed to the upper side of the first step 180 of the housing 120.

The first connection wire 111 may be disposed in the first connection hole 121. The cross section of the first connection line 111 may be circular, rectangular, or other shapes. In detail, the first connection wiring 111 may include a vertical connection wiring 111a disposed in the vertical connection hole 121a and a horizontal connection wiring 111b disposed in the horizontal connection hole 121b. One side of the vertical connection line 111a may be exposed on the bottom surface of the first step 180. One side of the horizontal connection line 111b may be in contact with the vertical connection line 111a and the other side of the horizontal connection line 111b may be disposed on the bottom surface of the second step 182. In this case, the upper surface of the horizontal connection wiring 111b and the upper surface of the surface light emitting laser device 200 may be positioned on the same line. That is, the upper surface of the horizontal connection wiring 111b and the upper surface of the surface light emitting laser device 200 may have the same position. Alternatively, the upper surface of the horizontal connection wiring 111b may be lower than the upper surface of the surface light emitting laser device 200. Accordingly, the wire 190 may electrically connect the surface light emitting laser device 200 and the horizontal connection wiring 111b.

As illustrated in FIG. 8, the horizontal connection wiring 111b may be disposed to extend in the longitudinal direction of the first connection pad 137. Accordingly, the plurality of wires 190 may be easily bonded to different regions of the horizontal connection wiring 111b.

The second electrode of the surface light emitting laser device 200 and the horizontal connection wiring 111b may be electrically connected by using the plurality of wires 190. Specifically, one side of the wire 190 is electrically connected to the second electrode of the surface light emitting laser element 200, and the other side of the wire 190 is one of the upper surface of the horizontal connection line 111b of the first connection line. It may be electrically connected to the area.

The second connection wiring 113 may be disposed in the second connection hole 122.

A conductive line including a first connection pad 137, a second connection pad 138, and a connection line 139 may be disposed on the bottom surface of the diffusion unit 140. The first connection pad 137 and the second connection pad 138 may be electrically connected by the connection line.

The first connection pad 137 may be the same as the second connection pad 132 shown in FIG. 1, and the second connection pad 138 may be the same as the fourth connection pad 134 shown in FIG. 1. In the third embodiment, since the surface light emitting laser device 200 is not electrically connected to any connection pad, the first connection pad 131 and the third connection pad 133 shown in FIG. 1 may be omitted. have.

The connection line 139 may be arranged in a zigzag form between the first connection pad 137 and the second connection pad 138, but may be arranged in any form. In the drawing, although the connection line is illustrated so as not to overlap the surface light emitting laser device 200, the connection line may be arranged to overlap the surface light emitting laser device 200.

The first bump 156 is disposed between the first connection pad 137 and the first connection wire 111, and the first connection pad 137 and the first connection wire 111 are formed by the first bump 156. This can be electrically connected. Specifically, one side of the first bump 156 is in contact with the bottom surface of the first connection pad 137, the other side of the first bump 156 is the top surface of the vertical connection wiring 111a of the first connection wiring 111. Can be contacted with.

The second bump 158 is disposed between the second connection pad 138 and the second connection wiring 113, and the second connection pad 138 and the second connection wiring 113 are formed by the second bump 158. This can be electrically connected. Specifically, one side of the second bump 158 may be in contact with the bottom surface of the second connection pad 138, and the other side of the second bump 158 may be in contact with the top surface of the second connection wiring 113.

The lower surface of the surface light emitting laser device 200, that is, the first electrode may be electrically connected to the first signal line of the substrate 110. The lower surface of the second connection line 113 may be electrically connected to the second signal line of the substrate 110. Accordingly, the first signal line of the substrate 110? Surface light emitting laser device 200, wire 190, first connection wiring 111, first bump 156, first connection pad 137, connection line, second connection pad 138, second An electrical passage formed of the bump 158, the second connection wiring 113, and the second signal line of the substrate 110 may be formed. Therefore, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110.

Although not shown, an adhesive part may be disposed around the first bump 156 and around the second bump 158.

Fourth Example

9 is a sectional view of a surface light emitting laser package according to the fourth embodiment.

The fourth embodiment is the same as the third embodiment except for the adhesive portion 160. In the description of the fourth embodiment, the same reference numerals are assigned to components having the same functions, shapes, and / or structures as the third embodiment, and detailed descriptions thereof are omitted. The description omitted in the fourth embodiment can be easily understood from the description of the fourth embodiment.

Referring to FIG. 9, the surface light emitting laser package 100C according to the fourth embodiment may provide an adhesive part 160.

The adhesive part 160 may be disposed in the opening 105 of the housing 120. The adhesive part 160 may be disposed between the surface light emitting laser device 200 and the diffusion part 140. The adhesive part 160 may be disposed around the surface light emitting laser device 200. The adhesive part 160 may be disposed on the first step 180 and the second step 182 of the housing 120. The adhesive part 160 may be disposed between the first connection pad 137 and the second connection pad 138. The adhesive part 160 may be disposed around the first bump 156 and around the second bump 158.

According to the fourth embodiment, the adhesive part 160 is disposed in all the spaces in the opening 105 of the housing 120 including the circumference of the surface light emitting laser element 200, whereby the diffusion part 140 is formed by the adhesive part 160. As well as the housing 120 is also bonded, detachment of the diffusion unit 140 and the housing 120 can be blocked at the source.

On the other hand, the surface light emitting laser package (100, 100A, 100B, 100C) according to the embodiment described above may be applied to a proximity sensor, an auto focus device, and the like. For example, the autofocus apparatus according to the embodiment may include a light emitting unit for emitting light and a light receiving unit for receiving light. As an example of the light emitting unit, at least one of the surface light emitting laser packages 100, 100A, 100B, and 100C according to the first to fourth embodiments described with reference to FIGS. 1 to 9 may be applied. As an example of the light receiving portion, a photodiode may be applied. The light receiver may receive light reflected from an object from the light emitted from the light emitter.

The auto focus device may be variously applied to a mobile terminal, a camera, a vehicle sensor, and an optical communication device. The auto focus device may be applied to various fields for multi-position detection for detecting the position of the subject.

10 is a perspective view of a mobile terminal to which an autofocusing apparatus including a surface light emitting laser package according to an embodiment is applied.

As shown in FIG. 10, the mobile terminal 1500 of the embodiment may include a camera module 1520, a flash module 1530, and an auto focusing device 1510 provided at a rear surface thereof. Here, the auto focus apparatus 1510 may include one of the surface light emitting laser packages 100, 100A, 100B, and 100C according to the first to fourth embodiments described with reference to FIGS. 1 to 9 as a light emitting unit. Can be.

The flash module 1530 may include a light emitting device that emits light therein. The flash module 1530 may be operated by camera operation of a mobile terminal or control of a user. The camera module 1520 may include an image capturing function and an auto focus function. For example, the camera module 1520 may include an auto focus function using an image.

The auto focus device 1510 may include an auto focus function using a laser. The auto focus device 1510 may be mainly used in a condition in which the auto focus function using the image of the camera module 1520 is degraded, for example, in a proximity or dark environment of 10 m or less. The auto focus device 1510 may include a light emitting unit including a surface light emitting laser package, and a light receiving unit converting light energy such as a photodiode into electrical energy. The light receiver may receive light reflected from the surface light emitting laser package.

The above detailed description should not be construed as limiting in all respects but should be considered as illustrative. The scope of the embodiments should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the embodiments are included in the scope of the embodiments.

100: surface light emitting laser package
105: opening
110: substrate
111, 113: connection wiring
111a: vertical connection wiring
111b: horizontal connection wiring
117: floor surface
120: housing
121, 122: connecting hole
121a: vertical connection hole
121b: horizontal connection hole
131, 132, 133, 134, 137, 138: connection pad
135, 136, 139: connection line
140: diffusion part
151, 153, 155, 156, 157, 158: bump
160, 161, 163: adhesive
180, 182: step
190: wire
200: surface light emitting laser device

Claims (10)

Board;
A surface light emitting laser element disposed on the substrate;
A housing disposed on the substrate and surrounding the surface light emitting laser element and having a step;
A diffusion part disposed at the step of the housing;
A conductive line disposed between the diffuser and the surface light emitting laser and between the diffuser and the step;
A connection hole formed at one side of the step; And
And a connection wiring disposed in the connection hole and electrically connected to the conductive line.
The conductive line,
At least two connection pads disposed between the diffuser and the surface light emitting laser and between the diffuser and the step; And
Surface light including at least two connection lines disposed between the diffuser and the surface light emitting laser and between the diffuser and the step and having a width smaller than that of the connection pad and electrically connected to the connection pad Emission laser package. The method of claim 1,
The connection hole is a surface light emitting laser package including a plurality of connection holes. The method of claim 1,
The conductive line,
Surface light emitting laser package disposed in the form of a line below the diffusion. The method of claim 1,
The at least two connection pads,
A first connection pad overlapping one side of the surface light emitting laser element; And
And a second connection pad overlapping one side of the step of the housing. The method of claim 4, wherein
The width of each of the connection line is a surface light emitting laser package of 3% to 10% of the width of each of the connection pad. The method of claim 4, wherein
And a plurality of bumps electrically connecting the conductive line to the surface light emitting laser device and the connection wiring. The method of claim 6,
The plurality of bumps,
A plurality of first bumps disposed between the first connection pad and one side of the surface light emitting laser device; And
A plurality of second bumps disposed between the second connection pad and one side of the step,
The plurality of second bumps are surface light emitting laser package connected to the connection wiring. The method of claim 7, wherein
The at least two connection pads,
A third connection pad overlapping the other side of the surface light emitting laser element; And
And a fourth connection pad overlapping the other side of the step of the housing. The method of claim 8,
The plurality of bumps,
A plurality of third bumps disposed between the third connection pad and the other side of the surface light emitting laser device; And
And a plurality of second bumps disposed between the fourth connection pad and the other side of the step. The surface light emitting laser package according to any one of claims 1 to 9; And
And a light receiving part receiving the reflected light of the light emitted from the surface light emitting laser package.

Images