KR102464035B1 - Vertical-cavity surface-emitting laser package and automatic focusing device - Google Patents

Abstract

A surface light-emitting laser package includes a surface light-emitting laser device disposed on a substrate, a housing disposed on the substrate and surrounding the surface light-emitting laser device and having a step, a diffusion unit disposed at the step of the housing, a diffusion unit; and a conductive line disposed between the surface light-emitting laser and between the diffusion unit and the step, a connection hole formed on one side of the step, and a connection wire disposed in the connection hole and electrically connected to the conductive line.
The conductive line includes at least two connection pads disposed between the diffusion portion and the surface light-emitting laser and between the diffusion portion and the step, and between the diffusion portion and the surface light-emitting laser and between the diffusion portion and the step, the width of the connection pad and at least two or more connection lines having a smaller width and electrically connected to the connection pad.

Description

TECHNICAL FIELD [0002] Vertical-cavity surface-emitting laser package and automatic focusing device.

The embodiment relates to a surface light emitting laser package and an autofocus device.

A semiconductor device containing a compound such as GaN or AlGaN has many advantages, such as having a wide and easily adjustable band gap energy, and thus can be used in various ways as a light emitting device, a light receiving device, and various diodes.

In particular, a surface light emitting laser package using a semiconductor group 3-5 or group 2-6 compound semiconductor material may be employed in optical communication, a sensor, an auto-focusing device, a proximity sensor, and an auto-focusing device.

In the surface light emitting laser package, the surface light emitting laser package is electrically connected using a wire. Because the wire is thin, there is a problem of being electrically disconnected by a physical force such as an external shock.

The embodiments aim to solve the above and other problems.

Another object of the embodiment is to provide a surface light emitting laser package and an autofocus device having a novel structure.

Another object of the embodiment is to provide a surface light-emitting laser package and an autofocus device in which the wire is removed.

Another object of the embodiment is to provide a surface light-emitting laser package and an auto-focusing device that can easily detect the detachment of the diffusion unit.

Another object of the embodiment is to provide a surface light-emitting laser package and an autofocus device capable of preventing electrical disconnection between the surface light-emitting laser device and the substrate.

According to one aspect of the embodiment to achieve the above or other object, the surface light emitting laser package, a substrate; a surface light emitting laser device disposed on the substrate; a housing disposed on the substrate, the housing surrounding the surface light emitting laser device and having a step difference; a diffusion part disposed on the step of the housing; a conductive line disposed between the diffusion portion and the surface light-emitting laser and between the diffusion portion and the step; a connection hole formed at one side of the step; and a connection wire disposed in the connection hole and electrically connected to the conductive line. The conductive line may include at least two connection pads disposed between the diffusion portion and the surface light emitting laser and between the diffusion portion and the step; and at least two or more connection lines disposed between the diffusion unit and the surface light emitting laser and between the diffusion unit and the step, the width being smaller than the width of the connection pad and electrically connected to the connection pad.

According to another aspect of the embodiment, the auto focus device, the surface light-emitting laser package; and a light receiving unit receiving the reflected light of the light emitted from the surface light emitting laser package.

The effect of the surface light-emitting laser package and the auto-focusing device according to the embodiment will be described as follows.

According to at least one of the embodiments, there is an advantage that a scratch, break, detachment, or detachment of the diffusion portion can be easily detected through disconnection of the connection pad or the connection line by the connection pad and the connection line disposed under the diffusion portion. . When a defect in the diffusion unit is detected as described above, the driving of the surface light emitting laser element is stopped, and irradiation of a strong laser beam to the user's eyes may be blocked.

According to at least one of the embodiments, a connection line having a width smaller than that of the connection pad is disposed in a portion corresponding to the surface light-emitting laser device among the connection pad and the connection line disposed under the diffusion unit or corresponding to the surface light-emitting laser device. There is an advantage in that it is possible to prevent a light diffusion defect or a decrease in light output of the laser beam by minimizing the interference with the progress of the laser beam from the surface light emitting laser device to the diffusion part by not disposing the connection line in the portion.

According to at least one of the embodiments, each bump is wrapped by an adhesive part and the connection pad and the surface light-emitting laser element are attached by each bump, thereby preventing electrical disconnection between the connection pad and the surface light-emitting laser element. There is an advantage that

According to at least one of the embodiments, since the surface light-emitting laser device and the substrate are electrically connected by the conductive line and the bump disposed between the surface light-emitting laser device and the substrate, there is an advantage that a separate wire is not required.

According to at least one of the embodiments, a plurality of conductive lines are disposed under the diffusion part, and there is an advantage that detachment of the diffusion part can be easily detected through whether the plurality of conductive lines are disconnected.

According to at least one of the embodiments, there is an advantage that the diffusion portion is adhered to the surface light emitting laser device or the housing by the adhesive portion, whereby the adhesion of the diffusion portion is strengthened and detachment of the diffusion portion can be prevented.

According to at least one of the embodiments, since the adhesive part is disposed in all spaces in the opening of the housing including the circumference of the surface light emitting laser element, detachment of the diffusion part 140 may be fundamentally blocked.

Further scope of applicability of embodiments will become apparent from the following detailed description. However, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only, since various changes and modifications within the spirit and scope of the embodiments may be clearly understood by those skilled in the art.

1 is a cross-sectional view of a surface light emitting laser package according to a first embodiment.
2 is a plan view of the surface light emitting laser package according to the first embodiment.
3 is a cross-sectional view showing a surface light-emitting laser device.
4 is a plan perspective view showing the housing.
5 shows a connection pad and a connection line.
6 is a cross-sectional view of a surface light emitting laser package according to a second embodiment.
7 is a cross-sectional view of a surface light emitting laser package according to the third embodiment.
8 is a plan view of a surface light emitting laser package according to a third embodiment.
9 is a cross-sectional view of a surface light emitting laser package according to a fourth embodiment.
10 is a perspective view of a mobile terminal to which an auto-focus device including a surface light-emitting laser package according to an embodiment is applied.

Hereinafter, the embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numbers regardless of reference numerals, and redundant description thereof will be omitted. The suffixes "module" and "part" for components used in the following description are given or mixed in consideration of only the ease of writing the specification, and do not have distinct meanings or roles by themselves. In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical spirit disclosed herein is not limited by the accompanying drawings, and all changes included in the spirit and scope of the embodiments; It should be understood to include equivalents and substitutes.

<First embodiment>

1 is a cross-sectional view of a surface light-emitting laser package according to a first embodiment, FIG. 2 is a plan view of a surface light-emitting laser package according to the first embodiment, and FIG. 3 is a cross-sectional view showing a surface light-emitting laser device, 4 is a plan perspective view showing the housing.

1 to 4 , the surface light emitting laser package 100 according to the first embodiment may provide a substrate 110 . For example, the substrate 110 may include a printed circuit board. The substrate 110 may be a rigid type printed circuit board having no bending characteristics or a flexible type printed circuit board having excellent bending characteristics. The substrate 110 may provide driving power to the surface light emitting laser device 200 . The substrate 110 may include at least one signal line for being electrically connected to the surface light emitting laser device 200 . Power may be supplied to the surface light emitting laser device 200 through a signal line of the substrate 110 .

The surface light-emitting laser package 100 according to the first embodiment may provide the surface light-emitting laser device 200 .

The surface light emitting laser device 200 may be disposed on the substrate 110 . The surface light emitting laser device 200 may be attached to the substrate 110 using, for example, an adhesive member. The adhesive member may be made of a conductive material, for example, a silver (Ag) paste material, but is not limited thereto. The surface light emitting laser device 200 may be electrically connected to the substrate 110 . For example, the first electrode of the surface light emitting laser device 200 may be electrically connected to a first signal line (not shown) of the substrate 110 through an adhesive member.

2 and 3 , the surface light emitting laser device 200 includes a first electrode 215 , a substrate 210 , a first reflective layer 220 , a cavity region 230 , and an aperture 241 . , an insulating region 242 , a second reflective layer 250 , a second electrode 280 , a passivation layer 270 , and a pad electrode 290 .

The cavity region 230 may include an active layer (not shown) and a cavity (not shown), which will be described in detail below. The insulating region 242 includes a first insulating region 242a disposed on the first emitter E1 , a second insulating region 242b and a third emitter E3 disposed on the second emitter E2 . It may include a third insulating region 242c disposed in the , but is not limited thereto.

Hereinafter, the surface light emitting laser device 200 will be described in more detail.

<Substrate, First Electrode>

In an embodiment, the substrate 210 may be a conductive substrate or a non-conductive substrate. When a conductive substrate is used, a metal having excellent electrical conductivity can be used, and heat generated when the surface light-emitting laser device 200 is operated must be sufficiently dissipated. Si) substrate or the like can be used.

When using a non-conductive substrate, an AlN substrate, a sapphire (Al2O3) substrate, or a ceramic-based substrate may be used.

In an embodiment, the first electrode 215 may be disposed under the substrate 210 , and the first electrode 215 may be disposed as a single layer or multiple layers of a conductive material. For example, the first electrode 215 may be a metal, and includes at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). Thus, it is formed in a single-layer or multi-layer structure to improve electrical characteristics, thereby increasing light output.

<First Reflecting Layer>

A first reflective layer 220 may be disposed on the substrate 210 .

The first reflective layer 220 may be doped with a first conductivity-type dopant. For example, the first conductivity-type dopant may include an n-type dopant such as Si, Ge, Sn, Se, Te, or the like.

In addition, the first reflective layer 220 may include a gallium-based compound, for example, AlGaAs, but is not limited thereto. The first reflective layer 220 may be a distributed Bragg reflector (DBR). For example, the first reflective layer 220 may have a structure in which first and second layers made of materials having different refractive indices are alternately stacked at least once or more.

The first layer and the second layer may include AlGaAs, and specifically, may be formed of a semiconductor material having a composition formula of AlxGa(1-x)As (0<x<1). Here, when Al in the first layer or the second layer increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase.

In addition, the thickness of each of the first layer and the second layer is λ/4n, λ may be the wavelength of light generated in the cavity region 230, and n may be the refractive index of each layer with respect to the above-described wavelength of light. . Here, λ may be 650 to 980 nm, and n may be a refractive index of each layer. The first reflective layer 220 having such a structure may have a reflectance of 99.999% with respect to light in a wavelength region of about 940 nm.

The thickness of the first layer and the second layer may be determined according to each refractive index and the wavelength λ of light emitted from the cavity region 230 .

<Cavity area, insulation area, aperture>

In an embodiment, a cavity region 230 , an insulating region 242 , and an aperture 241 may be disposed on the first reflective layer 220 . Specifically, the cavity region 230 may be disposed on the first reflective layer 220 , and the insulating region 242 and the aperture 241 may be disposed on the cavity region 230 .

The cavity region 230 may include an active layer (not shown), a first cavity (not shown) disposed below the active layer, and a second cavity (not shown) disposed above the active layer. The cavity region 230 of the embodiment may include both the first cavity and the second cavity, or may include only one of the two.

The cavity region 230 may be disposed between the first reflective layer 220 and the second reflective layer 250 . An active layer may be disposed in the cavity region 230 of the embodiment, and the active layer may have a double-hetero structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, or It may include any one of the quantum wire structures.

The active layer may be formed in a pair structure such as a well layer and a barrier layer, for example, AlGaInP/GaInP, AlGaAs/AlGaAs, AlGaAs/GaAs, GaAs/InGaAs, etc. using a compound semiconductor material of group III-V element, but is limited thereto. it doesn't happen The well layer may be formed of a material having an energy band gap smaller than that of the barrier layer.

The first cavity and the second cavity may be formed of an AlyGa(1-y)As (0<y<1) material, but is not limited thereto.

In the embodiment, an insulating region 242 and an aperture 241 may be disposed on the cavity region 230 .

For example, the first emitter E1 includes a first insulating region 242a and a first aperture 241a, and the second emitter E2 includes a second insulating region 242b and a second upper portion. It may include a wife 241b. In addition, the third emitter E3 includes a third insulating region 242c and a third aperture 241c, and the fourth emitter E4 includes a fourth insulating region (not shown) and a fourth aperture. (not shown) may be included.

The insulating region 242 is an insulating layer made of an insulating material, for example, aluminum oxide, and may act as a current blocking layer. Each of the apertures 241a, 241b, and 241c positioned in the central region of each insulating region may be a non-insulating layer, that is, a conductive layer.

The insulating region 242 may surround the aperture 241 . The size of the aperture 241 may be adjusted by the insulating region 242 . For example, as the area of the insulating region 242 occupied on the cavity region 230 increases, the area of the aperture 241 may decrease.

For example, the first aperture 241a may be defined by the first insulating region 242a, and for example, the second aperture 241b may be defined by the second insulating region 242b. have. Also, the third aperture 241c may be defined by the third insulating region 242c, and the fourth aperture may be defined by the fourth insulating region. Specifically, each insulating region 242 may include aluminum gallium arsenide. For example, the insulating region 242 may be formed as AlGaAs reacts with H2O to change the edge to aluminum oxide (Al2O3), and the central region that does not react with H2O is made of AlGaAs. An aperture may be formed.

According to the embodiment, the laser beam emitted from the cavity region 230 through each of the apertures 241a, 241b, and 241c may be emitted toward the upper region, and the upper region compared to the insulating regions 242a, 242b, and 242c. The light transmittance of the chambers 241a, 241b, and 241c may be excellent.

<Second Reflecting Layer>

The second reflective layer 250 may be disposed on the cavity region 230 .

The second reflective layer 250 may include a gallium-based compound, for example, AlGaAs, and the second reflective layer 250 may be doped with a second conductivity type dopant. For example, the second conductivity-type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like. Meanwhile, the first reflective layer 220 may be doped with a p-type dopant, and the second reflective layer 250 may be doped with an n-type dopant.

The second reflective layer 250 may be a distributed Bragg reflector (DBR). For example, the second reflective layer 250 may have a structure in which a first layer (not shown) and a second layer (not shown) made of materials having different refractive indices are alternately stacked at least once or more.

The first layer and the second layer may include AlGaAs, and specifically, may be formed of a semiconductor material having a composition formula of AlxGa(1-x)As (0<x<1). Here, when Al increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase. In addition, the thickness of each of the first layer and the second layer is λ/4n, λ may be a wavelength of light emitted from the active layer, and n may be a refractive index of each layer with respect to light of the above-described wavelength.

The second reflective layer 250 having such a structure may have a reflectance of 99.9% with respect to light in a wavelength region of 940 nm.

The second reflective layer 250 may be formed by alternately stacking third and fourth layers, and the number of pairs of the first and second layers in the first reflective layer 220 is the second reflective layer 250 . ) may be greater than the number of pairs of the third layer and the fourth layer in the above, wherein the reflectance of the first reflective layer 220 is about 99.999%, which is greater than the reflectance of the second reflective layer 250, 99.9%. have. For example, the number of pairs of the first layer and the second layer in the first reflective layer 220 may be 20 to 50, and the number of pairs of the third layer and the fourth layer in the second reflective layer 250 is 10. to 30 times.

<Passivation layer, second electrode>

A passivation layer 270 is disposed on the side and top surfaces of the emitters E1, E2, E3, and E4, and on the upper surface of the first reflective layer 220 exposed between the emitters E1, E2, E3, and E4. can be The passivation layer 270 is disposed on the side of each emitter E1, E2, E3, and E4 separated in segments to protect and insulate each emitter E1, E2, E3, and E4. have. The passivation layer 270 may be formed of an insulating material, for example, nitride or oxide.

The second electrode 280 may be disposed to be electrically connected to the second reflective layer 250 . That is, the second electrode 280 extends from the pad electrode 290 and contacts a portion of the second reflective layer 250 via the passivation layer 270 surrounding each emitter E1 , E2 , E3 , and E4 . can be The second electrode 280 may be disposed on the passivation layer 270 .

The second electrode 280 may be made of a conductive material, for example, a metal. For example, the second electrode 280 may include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au) to have a single-layer or multi-layer structure. can be formed with

Referring back to FIG. 1 , the surface light emitting laser package 100 according to the first embodiment may provide a housing 120 . For example, the housing 120 may be disposed on the substrate 110 .

Specifically, the housing 120 may surround the surface light-emitting laser device 200 . The surface light emitting laser device 200 may be disposed to be spaced apart from the inner surface of the housing 120 . The housing 120 may be attached to the substrate 110 using, for example, an adhesive member.

The housing 120 may have an opening 105 . The upper surface of the substrate 110 may be exposed by the opening 105 of the housing 120 , and the surface light emitting laser device 200 may be disposed on the exposed upper surface of the substrate 110 .

The housing 120 may have a step 180 . The step 180 may be formed on the upper portion of the housing 120 . The step 180 may be connected to the opening 105 in the upper portion of the housing 120 . The step 180 of the housing 120 may have a bottom surface 117 as shown in FIG. 4 .

A plurality of connecting wires 111 may be disposed on one side of the housing 120 . That is, a plurality of connection wires 111 may be disposed in the connection hole 121 of the housing 120 .

The connection wiring 111 may be disposed in the connection hole 121 of the housing 120 . The connection hole 121 may be formed to penetrate from the upper surface to the lower surface of the housing 120 corresponding to the step 180 . An inner diameter of each of the connection holes 121 may be the same as an outer diameter of each of the connection wires 111 .

A top surface of each of the connection wires 111 may be exposed to the bottom surface 117 of the step 180 of the housing 120 . That is, the upper surface of each of the connecting wires 111 may be located on the same surface as the bottom surface 117 of the step 180 of the housing 120 . A lower surface of each of the connecting wires 111 may be exposed on a lower surface of the housing 120 . That is, a lower surface of each of the connecting wires 111 may be positioned on the same surface as a lower surface of the housing 120 . A lower surface of each of the connection wirings 111 may be electrically connected to a second signal line (not shown) of the substrate 110 .

The surface light emitting laser package 100 according to the first embodiment may provide the diffusion unit 140 .

The diffusion unit 140 may be disposed on the surface light emitting laser device 200 . The diffusion unit 140 may be disposed to be spaced apart from the surface light emitting laser device 200 .

The diffusion unit 140 may be made of a transparent insulating material. For example, the diffusion unit 140 may be made of glass or polymer resin. For example, the diffusion unit 140 may include a body made of glass and a diffusion pattern disposed on one side of the body and made of a polymer resin, but is not limited thereto.

The diffusion unit 140 may expand the angle of view of the laser beam emitted from the surface light emitting laser device 200 .

The diffusion unit 140 may include an anti-reflective function. For example, the diffusion unit 140 may include an anti-reflection layer disposed on one surface opposite to the surface light-emitting laser device 200 . The anti-reflection layer may be formed separately from the diffusion unit 140 . The diffusion unit 140 may include an anti-reflection layer disposed on a lower surface facing the surface light-emitting laser device 200 . The anti-reflection layer prevents the laser beam incident from the surface light-emitting laser device 200 from being reflected on the surface of the diffusion unit 140 and transmits it into the diffusion unit 140 , thereby improving light loss due to reflection.

The anti-reflection layer may be formed of, for example, an anti-reflection coating film and attached to the surface of the diffusion unit 140 . The anti-reflection layer may be formed on the surface of the diffusion unit 140 through spin coating or spray coating. For example, the anti-reflection layer may be formed as a single layer or a multi-layer including at least one selected from the group consisting of TiO2, SiO2, Al2O3, Ta2O3, ZrO2, and MgF2.

The surface light emitting laser package 100 according to the first embodiment may provide a conductive line. The conductive line may be disposed under the diffusion unit 140 . For example, the conductive line may be disposed on the lower surface of the diffusion unit 140 . The conductive line may be formed on the lower surface of the diffusion unit 140 by, for example, a sputtering process and an etching process, but is not limited thereto.

As shown in FIG. 2 , the conductive line may include a plurality of connection pads 131 to 134 and connection lines 135 and 136 electrically connecting the pads.

Although the drawing shows that the first connection pad 131 is not connected to the connection line, in the embodiment, all of the plurality of connection pads 131 to 134 may be connected by the connection lines 135 and 136 or the plurality of connection pads. Some of the connection pads in (131 to 134) may not be connected by the connection line.

The plurality of connection pads 131 to 134 may be spaced apart from each other. For example, the first connection pad 131 is disposed in a first area of the lower surface of the diffusion unit 140 , and the second connection pad 132 is disposed in a second area of the lower surface of the diffusion unit 140 , and the third The connection pad 133 may be disposed in a third area of the lower surface of the diffusion unit 140 , and the fourth connection pad 134 may be disposed in a fourth area of the lower surface of the diffusion unit 140 . The first area of the lower surface of the diffusion unit 140 may be disposed between the second area of the lower surface of the diffusion unit 140 and the third area of the lower surface of the diffusion unit 140 . The third region may be disposed between the first region of the lower surface of the diffusion unit 140 and the fourth region of the lower surface of the diffusion unit 140 . The first region of the lower surface of the diffusion unit 140 may correspond to the first region of the upper surface of the surface light emitting laser device 200 . The second region of the lower surface of the diffusion unit 140 may correspond to the connection hole 121 of the housing 120 . A connection wire 111 may be disposed in the connection hole 121 of the housing 120 . The third region of the lower surface of the diffusion unit 140 may correspond to the second region of the upper surface of the surface light emitting laser device 200 . The fourth region of the lower surface of the diffusion unit 140 may correspond to the other side of the connection hole 121 of the housing 120 .

Each of the first to fourth connection pads 131 to 134 may have different lengths. For example, a length of each of the first and third connection pads 131 and 133 may be smaller than a length of each of the second and fourth connection pads 132 and 134 . A length of each of the first and second connection pads 132 may be smaller than a horizontal width or a vertical width of the surface light emitting laser device 200 . For example, the length of each of the first and second connection pads 131 and 132 may be equal to or greater than the length of the second electrode of the surface light emitting laser device 200 . A length of each of the second and fourth connection pads 132 and 134 may be greater than a horizontal width or a vertical width of the surface light emitting laser device 200 . A length of each of the second and fourth connection pads 132 and 134 may be smaller than a length of the step 180 formed on one side of the housing 120 .

The second connection pad 132 may be disposed to correspond to the connection hole 121 of the housing 120 adjacent to the first side of the surface light emitting laser device 200 . The fourth connection pad 134 may be disposed to correspond to the other side of the connection hole 121 of the housing 120 adjacent to the second side opposite to the first side of the surface light-emitting laser device 200 .

The first connection line 135 is a member that electrically connects the second connection pad 132 and the fourth connection pad 134 , and is formed between the second connection pad 132 and the fourth connection pad 134 . It is free even if it is placed in the form. For example, the first connection line 135 may be disposed along the periphery of the surface light emitting laser device 200 on the lower surface of the diffusion unit 140 . For example, the first connection line 135 is disposed so as not to overlap the surface light-emitting laser device 200 on the lower surface of the diffusion unit 140 , so as not to obstruct the path of the laser beam from the surface light-emitting laser device 200 . it may not be

The second connection line 136 is a member that electrically connects the third connection pad 133 and the fourth connection pad 134 , and is formed between the third connection pad 133 and the fourth connection pad 134 . It is free even if it is placed in the form.

The first connection pad 131 may be electrically connected to the second connection pad 132 using a connection line. The first connection pad 131 may be electrically connected to the third connection pad 133 using a connection line. The first connection pad 131 may be electrically connected to the fourth connection pad 134 using a connection line.

At least one of the first connection pad 131 and the third connection pad 133 may be connected to the second connection pad 132 . The first connection pad 131 may be electrically connected to the second connection pad 132 , and the third connection pad 133 may not be electrically connected to any connection pad. The fourth connection pad 134 may not be electrically connected to any connection pad.

The third connection pad 133 may be electrically connected to the second connection pad 132 using a connection line.

The width of the connection line may be smaller than the width of the connection pad. For example, the width of the connection pad may be equal to or greater than the diameter of the bumps 151 , 153 , 155 and 157 described later. For example, the width of each connection line may be 3% to 10% of the width of each connection pad. When the width of each connection line is less than 3% of the width of the connection pad, the resistance component becomes large and the current hardly flows. When the width of each connection line is 10% or more of the width of each connection pad, the progress of the laser beam of the surface light emitting laser device 200 may be hindered. As described above, the connection pads requiring electrical contact with the bumps 151 , 153 , 155 and 157 have relatively large widths, and the connection lines that do not require electrical contact with the bumps 151 , 153 , 155 and 157 have a width. is significantly smaller, thereby minimizing interference with the progress of the laser beam from the surface light emitting laser device 200 to the diffusion unit 140, thereby preventing light diffusion failure or light output reduction of the laser beam.

According to the first embodiment, a scratch, break, detachment or detachment of the diffusion unit 140 is easily detected through the disconnection of the connection pad or the connection line by the connection pad and the connection line disposed under the diffusion unit 140 . can do. As such, when a defect of the diffusion unit 140 is detected, the driving of the surface light-emitting laser device 200 is stopped, and irradiation of a strong laser beam to the user's eyes may be blocked.

The conductive line may include a conductive material. For example, the conductive line is a transparent conductive material, and may be ITO or TCO. For example, the conductive line is an opaque conductive material, and may be aluminum (Al), copper (Cu), gold (Au), chromium (Cr), tungsten (W), or an alloy thereof.

As shown in FIG. 5 , the plurality of connection pads and the plurality of connection lines may be arranged in various shapes.

As shown in FIG. 5A , the first connection pad 131 disposed on the lower surface of the diffusion unit 140 and the second connection pad spaced apart from the first connection pad 131 and not electrically connected are disposed in a zigzag shape. (132). That is, the first connection pad 131 and the second connection pad 132 are not connected by a connection line. The first connection pad 131 may correspond to at least one region of the upper surface of the surface light emitting laser device 200 .

Although the first connection pad 131 and the second connection pad 132 are not electrically connected in the drawing, the first connection pad 131 and the second connection pad 132 may be electrically connected.

When the first connection pad 131 is not electrically connected to the second connection pad 132 , the second connection pad 132 is electrically connected to the second signal line of the substrate 110 via the connection wiring 111 . will not be connected to In this case, the first connection pad 131 and the first bump 151 may not function as an electrode, but may serve as a pillar supporting the diffusion unit 140 . If the first connection pad 131 is electrically connected to the second connection pad 132 , the first connection pad 131 and the first bump 151 are formed between the surface light emitting laser device 200 and the substrate 110 . ) may serve not only as an electrode for connecting the second signal line but also as a pillar supporting the diffusion unit 140 .

A connection line may be omitted in FIG. 5A . Alternatively, among the shapes of the second connection pad 132 in FIG. 5A , for example, the second connection pad 132 corresponding to the connection wiring 111 disposed on the step 180 of the housing 120 is formed in the form of a pad, and other The other second connection pad 132 may be formed as a line having a width smaller than that of the pad.

In FIG. 5B , the arrangement of the first to fourth connection pads 131 to 134 is the same as that of FIG. 2 . However, in FIG. 5B , the arrangement of the connection lines 135 and 136 is different from FIG. 2 . Although the first connection pad 131 is not electrically connected to another connection pad or connection line in the drawing, the first connection pad 131 may be electrically connected to another connection pad or connection line.

As shown in FIG. 5C , each of the first to fourth connection pads may include a plurality of pads spaced apart from each other. Although the first connection pad 131 is not electrically connected to another connection pad or connection line in the drawing, the first connection pad 131 may be electrically connected to another connection pad or connection line.

The surface light emitting laser package 100 according to the first embodiment may provide a plurality of bumps 151 , 153 , 155 , and 157 .

The plurality of first bumps 151 may be disposed between the first connection pad 131 and the surface light emitting laser device 200 . Specifically, the first bump 151 may be disposed between the first connection pad 131 and one region of the upper surface of the surface light emitting laser device 200 . The first bump 151 may be in electrical contact with the second electrode of the surface light emitting laser device 200 . The second bump 153 may be disposed between the second connection pad 132 and the housing 120 . Specifically, the second bump 153 may be disposed between the second connection pad 132 and the area of the connection hole 121 of the housing 120 .

If the first connection pad 131 and the second connection pad 132 are electrically connected by a connection line, the surface light emitting laser device 200 has a first bump 151 and a first connection pad 131 . , the second connection pad 132 , the second bump 153 , and the second signal line of the substrate 110 through the connection wiring 111 disposed in the region of the connection hole 121 of the housing 120 . . Since the surface light emitting laser device 200 is electrically connected to the second signal line of the substrate 110 , the first signal line of the substrate 110 ? Surface light emitting laser device 200 - first bump 151 - first connection pad 131 - second connection pad 132 - second bump 153 - connection wiring 111 - substrate 110 An electrical path composed of the second signal line may be formed. Accordingly, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110 .

The plurality of third bumps 155 may be disposed between the third connection pad 133 and the surface light emitting laser device 200 . Specifically, the third bump 155 may be disposed between the third connection pad 133 and the other region of the upper surface of the surface light emitting laser device 200 . The third bump 155 may be in electrical contact with the second electrode of the surface light emitting laser device 200 . The fourth bump 157 may be disposed between the fourth connection pad 134 and the housing 120 . Specifically, the fourth bump 157 may be disposed between the fourth connection pad 134 and the other area of the connection hole 121 of the housing 120 . As shown in FIG. 2 , the third connection pad 133 and the fourth connection pad 134 are electrically connected to each other by a second connection line 136 , and the second connection pad 132 and the third connection pad are electrically connected to each other. 133 may be electrically connected by the first connection line 135 . Accordingly, the first signal line of the substrate 110? Surface light emitting laser device 200, third bump 155, third connecting pad 133, second connecting line 136, fourth connecting pad 134? An electrical path including the first connection line 135 , the second connection pad 132 , the second bump 153 , the connection wiring 111 , and the second signal line of the substrate 110 may be formed. Accordingly, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110 .

The first to fourth bumps may be made of a metal material. For example, the first to fourth bumps 151 , 153 , 155 , and 157 may be made of gold (Au) or aluminum (Al), but are not limited thereto.

The first to fourth bumps 151 , 153 , 155 , and 157 described above may be referred to as dots.

The surface light emitting laser package 100 according to the first embodiment may provide adhesive portions 161 and 163 . The adhesive parts 161 and 163 may include a first adhesive part 161 and a second adhesive part 163 .

The first and second adhesive portions 161 and 163 may be formed of a material having excellent adhesiveness and heat dissipation characteristics. For example, the first and second adhesive portions 161 and 163 may include a resin-based insulating material. For example, the first and second adhesive portions 161 and 163 may be formed of a silicone resin, an epoxy resin, a thermosetting resin including a plastic material, or a high heat resistance material.

The first and second adhesive portions 161 and 163 may be formed of a material having excellent conductivity. For example, the first and second adhesive portions 161 and 163 may be silver paste, but is not limited thereto.

The first adhesive part 161 may surround the first bump 151 positioned between the first connection pad 131 and the surface light emitting laser device 200 . The second adhesive part 163 may surround the third bump 155 positioned between the third connection pad 133 and the surface light emitting laser device 200 .

Although not shown, the adhesive parts 161 and 163 surround the second bump 153 positioned between the second connection pad 132 and the area of the connection hole 121 of the housing 120 or the fourth connection pad 134 . and the fourth bump 157 positioned between the other side region of the connection hole 121 of the housing 120 may be surrounded.

According to the first embodiment, the second adhesive part 163 surrounds the third bump 155 and the third connection pad 133 and the second electrode 280 of the surface light emitting laser device 200 are attached thereto, Electrical disconnection between the third connection pad 133 and the second electrode 280 of the surface light emitting laser device 200 may be prevented by the third bump 155 .

According to the first embodiment, there is no need for a wire in the surface light-emitting laser device 200 . That is, the surface light-emitting laser device 200 and the substrate 110 may be electrically connected by the conductive lines 131 to 136 and the bumps disposed between the surface light-emitting laser device 200 and the substrate 110 . Accordingly, in the first embodiment, it is possible to prevent defects due to disconnection of wires in the prior art.

According to the first embodiment, the first to fourth connection pads 131 to 134 and the first and second connection lines 135 and 136 are provided in the diffusion unit 140 , so that these first to fourth connection pads are provided in the diffusion unit 140 . Desorption of the diffusion unit 140 can be easily detected through the disconnection of the lines 131 to 134 and the first and second connection lines 135 and 136 . For example, when one of the first to fourth connection pads 131 to 134 and the first and second connection lines 135 and 136 is disconnected, electricity between the substrate 110 and the surface light emitting laser device 200 is disconnected. The direct path is blocked so that the laser beam is not emitted from the surface light emitting laser device 200 , and the detachment of the diffusion unit 140 can be detected through whether the laser beam is emitted or not.

According to the first embodiment, the diffusion unit 140 is adhered to the surface light emitting laser device 200 or the housing 120 by the adhesive portions 161 and 163 , so that the adhesion of the diffusion unit 140 is strengthened and the diffusion portion Desorption of 140 can be prevented.

<Second embodiment>

6 is a cross-sectional view of a surface light emitting laser package according to a second embodiment.

The second embodiment is the same as the first embodiment except for the adhesive part 160 . In the description of the second embodiment, the same reference numerals are given to components having the same functions, shapes and/or structures as those of the first embodiment, and detailed descriptions are omitted. The description omitted in the second embodiment can be easily understood from the description of the first embodiment.

Referring to FIG. 6 , the surface light emitting laser package 100A according to the second embodiment may provide an adhesive part 160 .

The adhesive unit 160 is formed between one side region of the diffusion unit 140 and one side region of the surface light-emitting laser device 200 , between one side region of the diffusion unit 140 and one side region of the substrate 110 , and the diffusion unit 140 . It may be disposed in a region between one side region of the surface light emitting laser device 200 and one side region of the substrate 110 .

Between the other side area of the diffusion unit 140 of the bonding unit 160 and the other side area of the surface light emitting laser device 200, between the other side area of the diffusion unit 140 and the other side area of the substrate 110, and the diffusion unit 140 It may be disposed in a region between the other side region of the surface light emitting laser device 200 and the other side region of the substrate 110 .

The adhesive part 160 is disposed in the space region between the surface light emitting laser element 200 and the inner surface of the housing 120 in the opening 105 of the housing 120 and between the diffusion part 140 and the inner surface of the housing 120 . can be

The adhesive part 160 may be disposed between the surface light emitting laser device 200 corresponding to between the first connection pad 131 and the third connection pad 133 and the diffusion part 140 .

According to the second embodiment, the adhesive part 160 is disposed in all spaces within the opening 105 of the housing 120 including the circumference of the surface light emitting laser element 200 , so that the diffusion part 140 is formed by the adhesive part 160 . ) as well as the housing 120 is adhered, so the detachment of the diffusion unit 140 can be fundamentally blocked.

<Third embodiment>

7 is a cross-sectional view of the surface light-emitting laser package according to the third embodiment, and FIG. 8 is a plan view of the surface light-emitting laser package according to the third embodiment.

In the description of the third embodiment, the same reference numerals are assigned to components having the same functions, shapes and/or structures as those of the first and second embodiments, and detailed descriptions are omitted. The description omitted in the third embodiment can be easily understood from the description of the first and second embodiments.

7 and 8, the surface light-emitting laser package 100B according to the third embodiment includes a substrate 110, a surface light-emitting laser device 200 disposed on the substrate 110, and a surface light-emitting laser. The housing 120 surrounding the device 200 may include a diffusion unit 140 disposed on the surface light emitting laser device 200 .

The housing 120 may have an opening 105 penetrating vertically. The housing 120 may have a first step 180 formed on the upper side and connected to the opening 105 . The housing 120 may have at least a second step 182 formed at a position lower than the upper surface of the first step 180 . The first step 180 may be formed along the inner side of the housing 120 . The second step 182 is formed adjacent to the connection hole 121 , but may or may not be formed along the inner side of the housing 120 . The bottom surface of the second step 182 may extend from the bottom surface of the first step 180 toward the center of the housing 120 .

The housing 120 may include a first connection hole 121 and a second connection hole 122 . The second connection hole 122 may be formed to vertically penetrate the housing 120 corresponding to the other side of the first connection hole 121 .

The first connection hole 121 may include a vertical connection hole 121a formed in a vertical direction and a horizontal connection hole 121b connected to the vertical connection hole 121a and formed in a horizontal direction. The vertical connection hole 121a is formed vertically above the first step 180 , and the horizontal connection hole 121b is connected to the vertical connection hole 121a in a horizontal direction so as to be exposed to the side of the second step 182 . can be formed along The horizontal connection hole 121b may be connected to the upper side of the second step 182 .

A round connection hole may be formed instead of the vertical connection hole 121a and the horizontal connection hole 121b. One side of the round-type connection hole may be exposed on the inner surface of the housing 120 , and the other side of the round-type connection hole may be exposed on the upper side of the first step 180 of the housing 120 .

A first connection wire 111 may be disposed in the first connection hole 121 . The cross-section of the first connection wiring 111 may be a circle, a rectangle, or other shapes. Specifically, the first connection wiring 111 may include a vertical connection wiring 111a disposed in the vertical connection hole 121a and a horizontal connection wiring 111b disposed in the horizontal connection hole 121b. One side of the vertical connection wiring 111a may be exposed on the bottom surface of the first step 180 . One side of the horizontal connection wiring 111b may be in contact with the vertical connection wiring 111a and the other side of the horizontal connection wiring 111b may be disposed on the bottom surface of the second step 182 . In this case, the upper surface of the horizontal connection wiring 111b and the upper surface of the surface light emitting laser device 200 may be positioned on the same line. That is, the upper surface of the horizontal connection wiring 111b and the upper surface of the surface light emitting laser device 200 may have the same position. Alternatively, the upper surface of the horizontal connection wiring 111b may be positioned lower than the upper surface of the surface light emitting laser device 200 . Accordingly, the wire 190 may electrically connect the surface light emitting laser device 200 and the horizontal connecting wire 111b.

As shown in FIG. 8 , the horizontal connection wiring 111b may be disposed to be elongated in the longitudinal direction of the first connection pad 137 . Accordingly, the plurality of wires 190 may be easily bonded to different regions of the horizontal connection wiring 111b.

The second electrode of the surface light emitting laser device 200 and the horizontal connection wiring 111b may be electrically connected using the plurality of wires 190 . Specifically, one side of the wire 190 is electrically connected to the second electrode of the surface light-emitting laser device 200, and the other side of the wire 190 is one of the upper surface of the horizontal connection wiring 111b of the first connection wiring. may be electrically connected to the region.

A second connection wire 113 may be disposed in the second connection hole 122 .

A conductive line including a first connection pad 137 , a second connection pad 138 , and a connection line 139 may be disposed on a lower surface of the diffusion unit 140 . The first connection pad 137 and the second connection pad 138 may be electrically connected by a connection line.

The first connection pad 137 may be identical to the second connection pad 132 illustrated in FIG. 1 , and the second connection pad 138 may be identical to the fourth connection pad 134 illustrated in FIG. 1 . In the third embodiment, since the surface light-emitting laser device 200 is not electrically connected to any connection pad, the first connection pad 131 and the third connection pad 133 shown in FIG. 1 may be omitted. have.

The connection line 139 may be disposed between the first connection pad 137 and the second connection pad 138 in a zigzag shape, but may be disposed in any shape. Although it is illustrated in the drawing so that the connection line does not overlap the surface light-emitting laser device 200 , it may be arranged to overlap the surface light-emitting laser device 200 .

A first bump 156 is disposed between the first connection pad 137 and the first connection wiring 111 , and the first connection pad 137 and the first connection wiring 111 are formed by the first bump 156 . This can be electrically connected. Specifically, one side of the first bump 156 is in contact with the lower surface of the first connection pad 137 , and the other side of the first bump 156 is the upper surface of the vertical connection wiring 111a of the first connection wiring 111 . may come into contact with

The second bump 158 is disposed between the second connection pad 138 and the second connection wiring 113 , and the second connection pad 138 and the second connection wiring 113 are formed by the second bump 158 . This can be electrically connected. Specifically, one side of the second bump 158 may be in contact with the lower surface of the second connection pad 138 , and the other side of the second bump 158 may be in contact with the upper surface of the second connection wire 113 .

The lower surface of the surface light emitting laser device 200 , that is, the first electrode may be electrically connected to the first signal line of the substrate 110 . A lower surface of the second connection wiring 113 may be electrically connected to a second signal line of the substrate 110 . Accordingly, the first signal line of the substrate 110? Surface light emitting laser device 200? Wire 190? First connecting wire 111? First bump 156? First connecting pad 137? Connecting line? Second connecting pad 138? Second An electrical path composed of the bump 158 , the second connection wiring 113 , and the second signal line of the substrate 110 may be formed. Accordingly, the laser beam may be emitted from the surface light emitting laser device 200 by the power applied to the first and second signal lines of the substrate 110 .

Although not shown, adhesive portions may be disposed around the perimeter of the first bump 156 and the perimeter of the second bump 158 .

<Fourth embodiment>

9 is a cross-sectional view of a surface light emitting laser package according to a fourth embodiment.

The fourth embodiment is the same as the third embodiment except for the adhesive part 160 . In the description of the fourth embodiment, the same reference numerals are given to components having the same functions, shapes and/or structures as those of the third embodiment, and detailed descriptions are omitted. The description omitted in the fourth embodiment can be easily understood from the description of the fourth embodiment.

Referring to FIG. 9 , the surface light emitting laser package 100C according to the fourth embodiment may provide an adhesive part 160 .

The adhesive part 160 may be disposed in the opening 105 of the housing 120 . The adhesive part 160 may be disposed between the surface light emitting laser device 200 and the diffusion part 140 . The adhesive part 160 may be disposed on the periphery of the surface light emitting laser device 200 . The adhesive part 160 may be disposed on the first step 180 and the second step 182 of the housing 120 . The adhesive part 160 may be disposed between the first connection pad 137 and the second connection pad 138 . The adhesive part 160 may be disposed around the first bump 156 and the second bump 158 .

According to the fourth embodiment, the adhesive portion 160 is disposed in all spaces within the opening 105 of the housing 120 including the circumference of the surface light emitting laser element 200 , so that the diffusion portion 140 is formed by the adhesive portion 160 . ) as well as the housing 120 is adhered, so that the detachment of the diffusion unit 140 and the housing 120 can be fundamentally blocked.

Meanwhile, the surface light-emitting laser packages 100 , 100A, 100B, and 100C according to the embodiments described above may be applied to a proximity sensor, an autofocus device, and the like. For example, an autofocus device according to an embodiment may include a light emitting unit that emits light and a light receiving unit that receives light. As an example of the light emitting unit, at least one of the surface light emitting laser packages 100 , 100A, 100B, and 100C according to the first to fourth embodiments described with reference to FIGS. 1 to 9 may be applied. A photodiode may be applied as an example of the light receiving unit. The light receiving unit may receive light emitted from the light emitting unit and reflected from the object.

The auto focus device may be variously applied to a mobile terminal, a camera, a sensor for a vehicle, an optical communication device, and the like. The auto focus apparatus may be applied to various fields for multi-position detection for detecting a position of a subject.

10 is a perspective view of a mobile terminal to which an auto-focus device including a surface light-emitting laser package according to an embodiment is applied.

As shown in FIG. 10 , the mobile terminal 1500 according to the embodiment may include a camera module 1520 , a flash module 1530 , and an autofocus device 1510 provided on the rear side. Here, the autofocus device 1510 may include one of the surface light emitting laser packages 100, 100A, 100B, and 100C according to the first to fourth embodiments described with reference to FIGS. 1 to 9 as a light emitting part. can

The flash module 1530 may include a light emitting device that emits light therein. The flash module 1530 may be operated by a camera operation of a mobile terminal or a user's control. The camera module 1520 may include an image capturing function and an auto focus function. For example, the camera module 1520 may include an auto-focus function using an image.

The auto focus device 1510 may include an auto focus function using a laser. The auto focus device 1510 may be mainly used in a condition in which the auto focus function using the image of the camera module 1520 is deteriorated, for example, in proximity of 10 m or less or in a dark environment. The autofocus device 1510 may include a light emitting unit including a surface light emitting laser package and a light receiving unit that converts light energy such as a photodiode into electrical energy. The light receiving unit may receive the reflected light emitted from the surface light emitting laser package.

The above detailed description should not be construed as restrictive in all respects and should be considered as illustrative. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the embodiments are included in the scope of the embodiments.

100: surface light emitting laser package
105: opening
110: substrate
111, 113: connection wiring
111a: vertical connection wiring
111b: horizontal connection wiring
117: bottom surface
120: housing
121, 122: connection hole
121a: vertical connection hole
121b: horizontal connection hole
131, 132, 133, 134, 137, 138: connection pad
135, 136, 139: connecting line
140: diffuser
151, 153, 155, 156, 157, 158: bump
160, 161, 163: adhesive part
180, 182: step difference
190: wire
200: surface light emitting laser element

Claims (10)

Board;
a surface light emitting laser device disposed on the substrate;
a housing disposed on the substrate, the housing surrounding the surface light emitting laser device and having a step difference;
a diffusion part disposed on the step of the housing;
a conductive line disposed between the diffusion portion and the surface light-emitting laser device and between the diffusion portion and the step;
a connection hole formed at one side of the step; and
a connection wire disposed in the connection hole and electrically connected to the conductive line; and
The conductive line is
at least two or more connection pads disposed between the diffusion unit and the surface light-emitting laser device and between the diffusion unit and the step; and
A surface including at least two or more connection lines disposed between the diffusion part and the surface light emitting laser element and between the diffusion part and the step difference, the width being smaller than the width of the connection pad and electrically connected to the connection pad Light Emitting Laser Package. According to claim 1,
The connection hole is a surface light emitting laser package including a plurality of connection holes. According to claim 1,
The conductive line is
A surface light emitting laser package disposed in the form of a line under the diffusion part. According to claim 1,
The at least two or more connection pads,
a first connection pad overlapping one side of the surface light-emitting laser device; and
A surface light-emitting laser package including a second connection pad overlapping one side of the step of the housing. 5. The method of claim 4,
The width of each of the connection lines is 3% to 10% of the width of each of the connection pads. 5. The method of claim 4,
The surface light-emitting laser package further comprising a plurality of bumps electrically connecting the conductive line to the surface light-emitting laser element and the connection wiring. 7. The method of claim 6,
The plurality of bumps,
a plurality of first bumps disposed between the first connection pad and one side of the surface light emitting laser device; and
and a plurality of second bumps disposed between the second connection pad and one side of the step,
The plurality of second bumps is a surface light emitting laser package connected to the connection wiring. 8. The method of claim 7,
The at least two or more connection pads,
a third connection pad overlapping the other side of the surface light-emitting laser device; and
A surface light-emitting laser package including a fourth connection pad overlapping the other side of the step of the housing. 9. The method of claim 8,
The plurality of bumps,
a plurality of third bumps disposed between the third connection pad and the other side of the surface light emitting laser device; and
A surface light emitting laser package including a plurality of second bumps disposed between the fourth connection pad and the other side of the step. The surface light emitting laser package according to any one of claims 1 to 9; and
and a light receiving unit receiving the reflected light of the light emitted from the surface light emitting laser package.

Images