KR20190127317A - Apparatus for processing substrate - Google Patents

Abstract

Provided is a substrate processing apparatus, which is possible to increase output while process time is reduced. The substrate processing apparatus includes: a housing having a first area and a second area divided into each other; a heating plate provided on the first area in the housing; a first cooling plate provided on the second area in the housing; and a second cooling plate provided on the second area in the housing at a higher level than the first cooling plate, wherein the second cooling plate can move between the first area and the second area for movement of a substrate.

Description

Apparatus for processing substrate

The present invention relates to a substrate processing apparatus.

When manufacturing a semiconductor device or a display device, various processes such as photography, etching, ashing, ion implantation, thin film deposition, and cleaning are performed. Here, the photographic process includes a coating, an exposure, and a developing process. A photosensitive film is coated on the substrate (i.e., a coating step), a circuit pattern is exposed on the substrate on which the photosensitive film is formed (i.e., an exposure step), and an exposed area of the substrate is selectively developed (i.e., a developing step).

On the other hand, the substrate is heat-treated in the baking chamber before or after the application process (that is, before or after the photoresist is applied onto the substrate). Alternatively, the substrate may be heat treated in the baking chamber before or after the developing process. Alternatively, in the baking chamber, the substrate on which the protective film is applied may be heat treated. In addition, the heat-treated substrate may be moved to a cooling chamber to cool from room temperature to room temperature.

However, the overall process time is increased due to the movement time from the bake chamber to the cooling chamber, the process time in the cooling chamber, etc., and the size of the equipment itself is also increased by using a separate cooling chamber. In order to increase production, it is necessary to reduce the process time associated with such heat treatment / cooling processes.

The problem to be solved by the present invention is to provide a substrate processing apparatus capable of increasing the production amount by reducing the process time.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

One aspect of the substrate processing apparatus of the present invention for achieving the above object is a housing comprising a first region and a second region separated from each other; A heating plate disposed in the first region within the housing; A first cooling plate disposed in the second region within the housing; And a second cooling plate disposed in the housing at a level higher than the first cooling plate in the second region, wherein the second cooling plate is between the first region and the second region for movement of a substrate. You can move it.

The first cooling plate may be disposed at a higher level than the heating plate, and the first cooling plate may move between the first region and the second region for movement of the substrate.

An arm disposed in the second region, the arm for moving the substrate from the first cooling plate to the second cooling plate or for moving the substrate from the first cooling plate to the second cooling plate; The arm may be provided with a plurality of protrusions for supporting the substrate.

The first cooling plate includes a first plate and a plurality of first grooves formed on an outer circumferential surface of the first plate and used as a movement path of the plurality of protrusions, wherein the second cooling plate includes a second plate, It may include a plurality of second grooves formed on the outer circumferential surface of the second plate used as the movement path of the plurality of protrusions.

The heating plate includes a third plate and a plurality of through holes provided in the third plate, and moves up and down through the plurality of through holes, and moves between the heating plate and the second cooling plate of the substrate. The process may further include a plurality of support pins to temporarily support the substrate.

The second cooling plate includes a second plate and a plurality of slits provided in the second plate, and in the process of moving between the heating plate and the second cooling plate of the substrate, the plurality of support pins are connected to the second plate The substrate may be supported by penetrating a slit provided in the plate.

The first cooling plate and the second cooling plate may cool the substrate using constant temperature water.

When the substrate is loaded into the housing from the outside, the substrate may be loaded into a cooling plate which is an idle state among the first cooling plate and the second cooling plate.

The housing includes a first sidewall and a second sidewall facing each other, the first sidewall is provided with a first opening through which the substrate enters and exits by a first robot, and the second sidewall is disposed by the second robot. A second opening through which the substrate enters and exits may be installed.

Specific details of other embodiments are included in the detailed description and the drawings.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.
2 is a side view of a substrate processing apparatus according to an embodiment of the present invention.
3 is a block diagram of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 4 is a plan view illustrating the heating plate, the first cooling plate, and the second cooling plate illustrated in FIG. 1.
FIG. 5 is a plan view illustrating the shapes of the first cooling plate and the second cooling plate illustrated in FIG. 4.
6 to 12 are diagrams for describing a method of driving a substrate processing apparatus according to an embodiment of the present invention.
13 is a plan view of a substrate processing apparatus according to another embodiment of the present invention.
14 is a plan view illustrating the shapes of the first cooling plate and the second cooling plate illustrated in FIG. 13.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The embodiments of the present invention make the posting of the present invention complete and the general knowledge in the technical field to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When elements or layers are referred to as "on" or "on" of another element or layer, intervening other elements or layers as well as intervening another layer or element in between. It includes everything. On the other hand, when a device is referred to as "directly on" or "directly on" indicates that no device or layer is intervened in the middle.

The spatially relative terms " below ", " beneath ", " lower ", " above ", " upper " It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as including terms in different directions of the device in use or operation in addition to the directions shown in the figures. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in describing the present invention with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals, and the same reference numerals will be used. The description will be omitted.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. 2 is a side view of a substrate processing apparatus according to an embodiment of the present invention. 3 is a block diagram of a substrate processing apparatus according to an embodiment of the present invention.

First, referring to FIGS. 1 and 2, a substrate processing apparatus according to an embodiment of the present invention is a baking chamber capable of heat treating a substrate W, and includes a housing 10, a heating plate HP, and first cooling. The plate CP1, the second cooling plate CP2, and the like may be included.

The housing 10 includes a first region R1 and a second region R2 which are separated from each other. The heating plate HP is disposed in the first region R1, and the first cooling plate CP1 and the second cooling plate CP2 are disposed in the second region R2. In particular, the second cooling plate CP2 is disposed at a higher level than the first cooling plate CP1. Here, "A is placed at a level higher than B" means that A is always positioned higher than B, or A is positioned higher than B in a particular state / environment.

In the substrate processing apparatus according to the exemplary embodiment, the second cooling plate CP2 may move between the first region R1 and the second region R2 (see reference numeral M1). That is, the second cooling plate CP2 may move between the upper portion of the heating plate HP and the upper portion of the first cooling plate CP1 along the guide rail 400. Meanwhile, although the first cooling plate CP1 is illustrated as not moving between the first region R1 and the second region R2, the present invention is not limited thereto.

As illustrated in FIG. 1, the heating plate HP and the first cooling plate CP1 may be disposed adjacent to each other in the first direction x. As illustrated in FIG. 2, the first cooling plate CP1 and the second cooling plate CP2 may be disposed adjacent to each other in the third direction z.

In addition, the openings 12 and 14 through which the substrate W is brought into or taken out of the housing 10 may not be obstructed in the movement path of the second cooling plate CP2. ) Or in the second direction y. In addition, the openings 12 and 14 may be provided with doors for opening and closing.

For example, as shown in FIG. 1, the housing 10 includes a first sidewall and a second sidewall facing each other in a second direction y, and the first sidewall includes a first robot (eg, The first opening 12 through which the substrate W enters and exits by the index robot and the interface robot, and the second opening through which the substrate W enters and exits by the second robot (for example, a transfer robot) in the second side wall. (14). The first robot loads the substrate W into the heating plate HP through the first opening 12, and the second robot transfers the substrate W from the cooling plate CP1 or CP2 through the second opening 14. Can be exported.

The shape and configuration of the openings 12 and 14 can be various.

For example, all of the loading and unloading of the substrate W may be performed through the second opening 14 without including the first opening 12 and only the second opening 14.

In another example, the first opening 12 is elongated to cover the first region R1 and the second region R2, so that the first robot is formed of the heating plate HP and the cooling plate CP1 or CP2. The substrate W can be loaded directly into either plate.

Here, referring to FIG. 3, the controller 20 controls the heating unit 22, the constant temperature water supply unit 24, and the driving unit 26.

The heating part 22 is connected to the heating plate HP, and the heating part 22 may include heating means such as a hot wire or a thermoelectric element. The heating unit 22 may heat the substrate W positioned on the heating plate HP by heating the heating plate HP according to the temperature control of the control unit 20.

In addition, the constant temperature water supply unit 24 may provide, for example, constant temperature water at room temperature (about 18 ° C.) to the first cooling plate CP1 and / or the second cooling plate CP2. Since constant temperature water whose temperature is constantly controlled is provided to the first cooling plate CP1 and / or the second cooling plate CP2, the temperature of the first cooling plate CP1 and / or the second cooling plate CP2 is It is stable. Therefore, the heat-treated high temperature substrate W positioned on the first cooling plate CP1 and / or the second cooling plate CP2 may also be stably cooled.

In FIG. 3, the temperature of the first cooling plate CP1 and the second cooling plate CP2 is controlled by constant temperature water, but is not limited thereto. For example, it may be controlled using a thermoelectric element or the like.

In addition, the driving unit 26 allows the second cooling plate CP2 to move between the first region R1 and the second region R2.

1 to 3, the substrate W is loaded into the housing 10 through the first opening 12 from the outside (ie, from the robot). That is, the heating plate HP is provided with the substrate W. The heating plate HP heat-treats the substrate W. As shown in FIG.

After the heat treatment is completed, in the first region R1, the second cooling plate CP2 receives the heated substrate W from the heating plate HP.

The second cooling plate CP2 moves from the first region R1 to the second region R2. Here, since the second cooling plate CP2 is maintained at room temperature by constant temperature water, the heated substrate W is cooled on the second cooling plate CP2. That is, the substrate W may be cooled while moving from the first region R1 to the second region R2. In addition, the heating plate HP receives the new substrate W after providing the heat-treated substrate W to the second cooling plate CP2.

The second cooling plate CP2 transfers the substrate W to the first cooling plate CP1. In the first cooling plate CP1, the substrate W is sufficiently cooled to a predetermined temperature. Thereafter, it is carried out of the housing 10 through the second opening 14 to the outside. In the meantime, the second cooling plate CP2 may return to the heating plate HP to receive the heat-treated substrate W.

In an embodiment of the present invention, the heat treatment of the substrate W in the heating plate HP and the cooling of the substrate W in the cooling plates CP1 and CP2 may be simultaneously performed. Therefore, the work efficiency and productivity of a substrate processing apparatus can be improved.

Alternatively, according to the design, since the second cooling plate CP2 can sufficiently cool the heat-treated substrate W to a predetermined temperature, after the second cooling plate CP2 moves to the second region R2. In some cases, it may not be necessary to transfer the substrate W to the first cooling plate CP1. For example, when the substrate W is loaded on the first cooling plate CP1, the second cooling plate CP2 may not transfer the substrate W to the first cooling plate CP1. In this case, after the second cooling plate CP2 cools the substrate W to a predetermined temperature, the second cooling plate CP2 carries the cooled substrate W out of the housing 10.

On the other hand, unlike the case shown in FIG. 1, the case where the loading and unloading of the substrate W is performed through the second opening 14 without including the first opening 12 and only the second opening 14 is performed. Review.

In this case, the idle state of the first cooling plate CP1 and the second cooling plate CP2 when the substrate W is brought into the housing 10 through the second opening 14 from the outside. The substrate W is loaded into the phosphorus cooling plate (eg, the second cooling plate CP2 located in the second region R2).

The second cooling plate CP2 receives the substrate W from the second region R2 and moves to the first region R1.

After the second cooling plate CP2 moves to the first region R1, the second cooling plate CP2 transfers the substrate W to the heating plate HP.

The heating plate HP receives the substrate W from the second cooling plate CP2 and heat-treats the substrate W according to a predetermined program (temperature, time).

Meanwhile, while the second cooling plate CP2 performs the above-described operation, the first cooling plate CP1 may be in an idle state. Therefore, the first cooling plate CP1 may be previously provided with a new substrate W requiring heat treatment from the outside. Since the first cooling plate CP1 is also maintained at room temperature by constant temperature water, the substrate W is maintained at a predetermined temperature after being supplied from the outside. When the second cooling plate CP2 is in the idle state, the first cooling plate CP1 transfers the substrate W to the second cooling plate CP2. As described above, the second cooling plate CP2 transfers the substrate W to the heating plate HP. As described above, since the first cooling plate CP1 is provided with the substrate W in advance, the time required for the substrate W to be loaded into the housing 10 can be reduced.

Subsequently, after the heat treatment is finished, the second cooling plate CP2 receives the heated substrate W from the heating plate HP in the first region R1.

The second cooling plate CP2 moves from the first region R1 to the second region R2. Here, the second cooling plate CP2 cools the substrate W while moving from the first region R1 to the second region R2. As described above, the substrate W may be carried out to the outside immediately after cooling to the predetermined temperature in the second cooling plate CP2. Alternatively, the substrate W may be transferred to the first cooling plate CP1 in the second region R2, cooled to a predetermined temperature in the first cooling plate CP1, and then transported to the outside.

On the other hand, since the substrate W is sufficiently cooled in the first cooling plate CP1 or the second cooling plate CP2 and then taken out to the outside, the substrate W does not need to be transferred to a separate cooling chamber. Therefore, the movement time to a separate cooling chamber and the process time in a cooling chamber can be reduced.

In addition, as described above, since the first cooling plate CP1 and the second cooling plate CP2 are maintained at a predetermined temperature by constant temperature water, the substrate W cannot be conveyed due to an unexpected situation and the process is not performed. Even if delayed, the substrate W can be kept at a constant temperature. Therefore, process stability can be improved.

In addition, the size of the substrate processing apparatus, in particular, the length L can be reduced. For example, if a substrate is moved between a heating plate and a cooling plate using a separate conveying member (for example, a conveying plate), a separate space to be located when the separate conveying member is in an idle state. (Eg, the space between the heating plate and the cooling plate). Therefore, since the substrate processing apparatus which concerns on one Embodiment of this invention does not use the separate conveyance member for conveyance of a board | substrate, separate space is also unnecessary. Therefore, the size of the substrate processing apparatus can be reduced.

Meanwhile, the substrate processing apparatus described with reference to FIGS. 1 to 3 is not limited to a specific baking process, and may be used for various baking processes.

For example, a prebake process of removing impurities (organic and moisture) on the surface of the substrate W by heating the substrate W to a predetermined temperature before applying the photosensitive film, and placing the photosensitive film on the substrate W Soft bake process that is performed after coating, a post bake process that heats the substrate W before the developing process is performed, and a hard bake that heats the substrate W after the developing process is performed ( hard bake) process, in order to protect the photoresist film, may be used for baking process performed after forming the protective film on the photoresist film.

As described above, the substrate W is not conveyed to a separate cooling chamber after the baking process, but may be conveyed for another process (other than cooling), but is not limited thereto. That is, depending on the stability or design of the process, the substrate W may be conveyed to a separate cooling chamber.

Hereinafter, exemplary configurations of the heating plate HP, the first cooling plate CP1, and the second cooling plate CP2, which may perform the above-described operation, will be described with reference to FIGS. 4 and 5. FIG. 4 is a plan view illustrating the heating plate, the first cooling plate, and the second cooling plate illustrated in FIG. 1. FIG. 5 is a plan view illustrating the shapes of the first cooling plate and the second cooling plate illustrated in FIG. 4.

4 and 5, the first cooling plate CP1 includes a first plate 201 and a plurality of first grooves 220 formed on an outer circumferential surface of the first plate 201. The second cooling plate CP2 includes a second plate 301 and a plurality of second grooves 320 formed on an outer circumferential surface of the second plate 301.

Meanwhile, in the second region R2, the substrate W is moved from the first cooling plate CP1 to the second cooling plate CP2, or the second cooling plate CP2 from the first cooling plate CP1. An arm ARM for moving the furnace substrate W is provided. A plurality of protrusions 391 for supporting the substrate W are formed in the arm ARM.

The plurality of first grooves 220 of the first cooling plate CP1 and the plurality of second grooves 320 of the second cooling plate CP2 are used as moving paths of the plurality of protrusions 391. For example, while the arm ARM moves up from under the second cooling plate CP2, the arm takes the substrate W seated on the second cooling plate CP2. On the contrary, the arm ARM may transfer the substrate W held by the arm ARM to the second cooling plate CP2 while moving from top to bottom of the second cooling plate CP2.

Meanwhile, the heating plate HP includes a third plate 101 and a plurality of through holes 110 installed in the third plate 101.

In addition, the plurality of support pins 122 are connected to the bar 120 disposed under the third plate 101, and the plurality of support pins 122 move upward and downward through the plurality of through holes 110. Can be. The plurality of support pins 122 serves to temporarily support the substrate W during the movement between the heating plate HP and the second cooling plate CP2 of the substrate W.

Meanwhile, a plurality of slits 330a and 330b may be installed in the second cooling plate CP2. The plurality of slits 330a and 330b correspond to the plurality of support pins 122. In the process of moving between the heating plate HP and the second cooling plate CP2 of the substrate W, the plurality of support pins 122 pass through the slits 330a and 330b of the second cooling plate CP2 to form the substrate. (W) will be supported. Even though the plurality of support pins 122 protrudes through the heating plate HP, the slits 330a and 330b have the heating plate (2) without the second cooling plate CP2 being disturbed by the plurality of support pins 122. HP).

This will be described in detail using a method of driving a substrate processing apparatus to be described later.

6 to 12 are diagrams for describing a method of driving a substrate processing apparatus according to an embodiment of the present invention. FIG. 7 is a cross-sectional view taken along the line AA of FIG. 6. Hereinafter, the case where carrying in / out of the board | substrate W is made through the 2nd opening part 14 including only the 2nd opening part 14, without including the 1st opening part 12 is demonstrated.

First, the substrate W is loaded into the housing 10 from the outside (that is, from the transport robot). When the second cooling plate CP2 is in an idle state in the second region R2, the second cooling plate CP2 is provided with the substrate W.

6 and 7, the second cooling plate CP2 moves the substrate W from the second region R2 to the first region R1.

Referring to FIG. 8, when the second cooling plate CP2 is positioned on the heating plate HP, the plurality of support pins 122 pass through the plurality of through holes 110 of the heating plate HP. . The top surfaces of the plurality of support pins 122 rise above the top surface of the second cooling plate CP2. Accordingly, the plurality of support pins 122 receive the substrate W from the second cooling plate CP2.

6 and 8, the slits 330a and 330b of the second cooling plate CP2 are disposed at positions corresponding to the plurality of support pins 122. That is, even if the top surfaces of the plurality of support pins 122 are raised above the top surface of the heating plate HP, the second cooling plate CP2 is not disturbed by the plurality of support pins 122 and the second cooling plate ( CP2) may be located on the heating plate HP. This is because the plurality of support pins 122 pass through the slits 330a and 330b when the second cooling plate CP2 is moved toward the heating plate HP.

Subsequently, the second cooling plate CP2 exits from the upper side of the heating plate HP. For example, the second cooling plate CP2 moves from the first region R1 to the second region R2.

Subsequently, the plurality of support pins 122 descend below the heating plate HP. That is, as the top surfaces of the plurality of support pins 122 descend below the top surface of the heating plate HP, the substrates W on the plurality of support pins 122 are transferred to the heating plate HP.

Subsequently, heat treatment is performed on the substrate W in accordance with a predetermined program (temperature, time) in the heating plate HP.

When the heat treatment is completed, as the plurality of support pins 122 again rises above the heating plate HP, the plurality of support pins 122 lifts the substrate W.

Subsequently, the second cooling plate CP2 is moved above the heating plate HP, that is, between the heating plate HP and the substrate W, and the substrate W heat-treated from the plurality of support pins 122. Received.

Referring to FIG. 9, the second cooling plate CP2 moves the heat treated substrate W to the first region R1. Even while being moved, the substrate W heat-treated by the second cooling plate CP2 may be cooled.

The second cooling plate CP2 may receive the new substrate W from the outside after transferring the heat treated substrate W to the first cooling plate CP1, but is not limited thereto. Alternatively, since the temperature of the second cooling plate CP2 is kept constant by constant temperature water, the second cooling plate CP2 is heat-treated in the second cooling plate CP2 without transferring the substrate W heat-treated to the first cooling plate CP1. The substrate W can be cooled.

10 to 12, a process of transferring the substrate W from the second cooling plate CP2 to the first cooling plate CP1 will be described.

Referring to FIG. 10, the second cooling plate CP2 moves upward of the first cooling plate CP1.

Referring to FIG. 11, the arm ARM moves from the bottom of the second cooling plate CP2 to take the substrate W seated on the second cooling plate CP2.

The second cooling plate CP2 exits from the upper side of the first cooling plate CP1. For example, the second cooling plate CP2 may be moved from the second region R2 to the first region R1.

Referring to FIG. 12, the arm ARM moves down from the top of the first cooling plate CP1 to transfer the substrate W held by the arm to the first cooling plate CP1.

13 is a plan view of a substrate processing apparatus according to another embodiment of the present invention. 14 is a plan view illustrating the shapes of the first cooling plate and the second cooling plate illustrated in FIG. 13. For convenience of explanation, the following description will focus on differences from those described with reference to FIGS. 1 to 12.

In the substrate processing apparatus illustrated in FIG. 1, the first cooling plate CP1 may not move, and only the second cooling plate CP2 may move between the first region R1 and the second region R2.

In contrast, in the substrate processing apparatus shown in FIGS. 13 and 14, the first cooling plate CP1 is disposed at a level higher than the heating plate HP. The second cooling plate CP2 is disposed at a level higher than the first cooling plate CP1. In addition, in order to move the substrate, both the first cooling plate CP1 and the second cooling plate CP2 may move between the first region R1 and the second region R2 (see reference numerals M1 and M2). ).

The first cooling plate CP1 includes a first plate 201, a plurality of first grooves 220 formed on an outer circumferential surface of the first plate 201, and used as a movement path of the plurality of protrusions 391, and a first plate 201. It includes a plurality of slits 230a and 230b installed in one plate 201.

The plurality of slits 230a and 230b correspond to the plurality of support pins (see 122 of FIG. 5). That is, in the process of moving the first cooling plate CP1 between the first region R1 and the second region R2, the plurality of support pins 122 may include the slits 230a, The substrate W may be supported through the 230b.

The second cooling plate CP2 includes a second plate 301, a plurality of second grooves 320 formed on the outer circumferential surface of the second plate 301, and used as a movement path of the plurality of protrusions 391, and It includes a plurality of slits (330a, 330b) installed in the two plate (301).

The plurality of slits 330a and 330b correspond to the plurality of support pins 122. That is, in a process in which the second cooling plate CP2 moves between the first region R1 and the second region R2, the plurality of support pins 122 may include the slits 330a of the second cooling plate CP2. The substrate W may be supported through the 330b.

On the other hand, since both the first cooling plate CP1 and the second cooling plate CP2 can move between the first region R1 and the second region R2, the first cooling plate CP1 and the second cooling are The movement of the substrate W between the plates CP2 can be minimized. When the first cooling plate CP1 cannot move, when the first cooling plate CP1 is in the idle state, the first cooling plate CP1 receives the substrate W from the outside, and the first cooling plate CP1. ) Transfers the substrate W received from the outside to the second cooling plate CP2, and again transfers the second cooling plate CP2 to the heating plate HP.

On the other hand, when the first cooling plate CP1 can move, when the first cooling plate CP1 is in the idle state, the first cooling plate CP1 receives the substrate W from the outside, and the first cooling plate CP1 may directly transfer the substrate W to the heating plate HP.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

10: housing 20: control part
22: heating part 24: constant temperature water supply unit
26: drive portion 201: first plate
301: second plate 220: first groove
320: second groove HP: heating plate
CP1: first cooling plate CP2: second cooling plate
R1: first region R2: second region

Claims (9)

A housing including a first area and a second area, wherein the first area and the second area are separated from each other;
A heating plate disposed in the first region within the housing;
A first cooling plate disposed in the second region within the housing; And
A second cooling plate disposed in the housing at a level higher than the first cooling plate in the second region,
And the second cooling plate is movable between the first region and the second region for movement of the substrate. The method of claim 1,
The first cooling plate is disposed at a higher level than the heating plate,
And the first cooling plate can move between the first region and the second region for movement of the substrate. The method according to claim 1 or 2,
An arm disposed in the second region, the arm for moving the substrate from the first cooling plate to the second cooling plate or for moving the substrate from the first cooling plate to the second cooling plate;
The arm is provided with a plurality of protrusions for supporting the substrate. The method of claim 3, wherein
The first cooling plate includes a first plate and a plurality of first grooves formed on an outer circumferential surface of the first plate and used as a movement path of the plurality of protrusions.
And the second cooling plate includes a second plate and a plurality of second grooves formed on an outer circumferential surface of the second plate and used as movement paths of the plurality of protrusions. The method of claim 1,
The heating plate includes a third plate and a plurality of through holes provided in the third plate.
And a plurality of support pins moving upward and downward through the plurality of through holes and temporarily supporting the substrate in a process of moving between the heating plate and the second cooling plate of the substrate. The method of claim 5,
The second cooling plate includes a second plate and a plurality of slits provided in the second plate,
In the process of moving between the heating plate and the second cooling plate of the substrate, the plurality of support pins to support the substrate through the slit provided in the second plate. The method of claim 1,
And the first cooling plate and the second cooling plate cool the substrate using constant temperature water. The method of claim 1,
The substrate processing apparatus of carrying out a board | substrate to the cooling plate which is an idle state among the said 1st cooling plate and the said 2nd cooling plate when carrying in a board | substrate into the said housing from the exterior. The method according to claim 1 or 8,
The housing includes a first side wall and a second side wall facing each other,
The first side wall is provided with a first opening through which the substrate is moved in and out by a first robot,
The second side wall is provided with a second opening portion through which the substrate enters and exits by a second robot.

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