KR20190107991A - Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels - Google Patents

Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels Download PDF

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Publication number
KR20190107991A
KR20190107991A KR1020180029393A KR20180029393A KR20190107991A KR 20190107991 A KR20190107991 A KR 20190107991A KR 1020180029393 A KR1020180029393 A KR 1020180029393A KR 20180029393 A KR20180029393 A KR 20180029393A KR 20190107991 A KR20190107991 A KR 20190107991A
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South Korea
Prior art keywords
panel
board
transfer
board panel
transfer film
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KR1020180029393A
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Korean (ko)
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김민구
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김민구
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Priority to KR1020180029393A priority Critical patent/KR20190107991A/en
Priority to PCT/KR2018/003566 priority patent/WO2019177190A1/en
Priority to CN201810579351.0A priority patent/CN110271092A/en
Publication of KR20190107991A publication Critical patent/KR20190107991A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B15/00General arrangement or layout of plant ; Industrial outlines or plant installations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • B32B38/162Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • B32B38/164Drying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17Dry transfer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17Dry transfer
    • B44C1/1712Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243Coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/002Sandblasting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00Walls, panels

Abstract

The present invention relates to a panel manufacturing device capable of transferring front and rear angled planes and both sides angled planes for internal and external board panels. The panel manufacturing device reduces a work time since a board panel passes above a heater preheated while a primer is coated and dried by passing through a dryer and the board panel is heated to reduce coating and drying times of the primer. In addition, the panel manufacturing device greatly lowers a defection rate since a bonding resin is coated on a transfer film, not the board panel, and enables a semi-permanent use since a big load is not applied to an adhesive roller and there is no burden. Moreover, the panel manufacturing device enables manufacturing of transfer board panel at a high price since an upper part and front and rear angled planes of the board panel are transferred to improve a marketability, and increases a manufacturing amount by time requiring for drying in existing methods since a dry work is performed in a dryer installed on a line without any drying time. Furthermore, the panel manufacturing device enables a continuous work for transfer of the board panel to increase a manufacturing speed of the transferred board panel, thereby greatly increasing a manufacturing amount.

Description

내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치 { Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels }Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels}

본 발명은 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치에 관한 것으로, 더욱 구체적으로 설명하면, 프라이머가 도포되고 건조기를 거쳐서 미리 건조된 상태에서 이미 가열된 가열기의 위를 보드판넬이 통과되면서 보드판넬이 가열되게 되므로 프라이머의 도포 및 건조시간이 단축되어 작업시간이 단축되게 되고, 보드판넬상에 접합수지를 도포하지 않고 전사필름상에 접합수지를 도포하므로 불량율이 현저하게 절감되고, 접착롤러에 큰 하중이 작용되지 않아 무리가 가지 않으므로 반영구적인 사용이 가능하게 되고, 보드판넬의 상부와 전후 각면도 전사처리가 되어 상품성이 향상되어 고가의 전사 보드판넬의 제조가 가능하게 되고, 별도의 건조시간이 필요없이 라인상에 설치된 건조기에서 건조가 되게 되므로 종래의 건조에 필요한 시간만큼 제조량이 늘어나게 되고, 보드판넬의 전사를 위한 연속작업이 가능하게 되어 전사 보드판넬의 제조속도가 증대되어 제조량이 대폭적으로 증대되는 것이 가능한 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치에 관한 것이다.The present invention relates to a panel manufacturing apparatus capable of transferring to front and rear sides and both sides of an interior and exterior interior board panel, and more specifically, a panel is applied on a heater that is already heated in a state where a primer is applied and dried in advance through a dryer. As the board panel is heated as it passes, the application and drying time of the primer is shortened, thereby reducing the working time. The defect rate is remarkably reduced by applying the laminated resin on the transfer film without applying the laminated resin on the board panel. Since no heavy load is applied to the adhesive roller, it is possible to use it semi-permanently. The upper and front and rear sides of the board panel are also transferred to improve the merchandise and manufacture of expensive transfer board panels. Drying is done in the dryer installed on the line without the need for drying time. The amount of production is increased by the time required for drying, and the continuous operation for the transfer of the board panel is possible, and the manufacturing speed of the transfer board panel is increased, so that the production volume can be greatly increased. It relates to a transferable panel manufacturing apparatus.

근래에는 내장 및 외장용 보드판넬로 ALC(Autoclaved Lightweight Concrete) 보드가 널리 이용되고 있다. 이러한 ALC(Autoclaved Lightweight Concrete) 보드 제품은 경량성은 물론 단열성, 내화성, 차음성, 현장가공성, 치수 정확성, 시공 안정성 및 무독성과 같은 다기능성으로 인하여 선진 외국에서는 널리 사용되고 있으며, 블록, 패널, 특수제품 및 전용 모르타르로 구분되어 사용되고 있는 최첨단 건축 소재로서 표면에 전사지를 입혀서 장기간의 사용이 가능한 제품으로서 널리 이용되고 있는 실정이다.Recently, ALC (Autoclaved Lightweight Concrete) boards are widely used as interior and exterior board panels. These ALC (Autoclaved Lightweight Concrete) board products are widely used in advanced countries because of their lightness and multifunctionality such as insulation, fire resistance, sound insulation, workability, dimensional accuracy, construction stability and non-toxicity. It is a state-of-the-art building material that is divided into exclusive mortars, and is widely used as a product that can be used for a long time by coating a transfer paper on the surface.

이러한 수요가 많은 전사 ALC 보드의 제조방법은, ALC 보드를 세척하고, ALC 보드상에 프라이머액을 분사하고, ALC 보드를 열오븐기에서 가열하고, 가열되는 열을 올려서 전사필름이나 페트필름을 맞물러셔 열로 히팅시켜 열융착시키고, 이와 같이 전사필름이 융착된 ALC 보드를 하루정도 경화시키면, 규격이 두께 6mm X 폭 1220mm X 길이 2440mm 의 ALC 보드가 하루에 8시간 작업을 기준으로 200장정도가 제조되고 있으며, 특히 ALC 보드상에 전사되는 무늬를 변경시키고자 할 경우에는 제조량이 현저하게 떨어지게 되는 문제점이 있었다.In this method of manufacturing a transfer ALC board with high demand, washing the ALC board, spraying the primer solution on the ALC board, heating the ALC board in a heat oven, and raising the heated heat to interlock the transfer film or PET film When heat-sealed and heat-sealed by heather, and hardening the transfer film-bonded ALC board for about one day, about 200 sheets of ALC board of 6mm thickness X 1220mm X 2440mm length are manufactured based on 8 hours of work per day. In particular, there is a problem in that the manufacturing quantity is remarkably dropped when the pattern to be transferred on the ALC board is changed.

그리고, ALC 보드를 포함하는 전사가 필요한 모든 전사 보드판넬에서는 보드판넬의 표면에 전사를 하기 위해서는 보드판넬의 표면상에 프라이머 및 접합수지가 직접 도포되어야 하며 이와 같이 도포될 경우에는 보드판넬의 표면상에 접합되는 전사필름의 표면이 보드면의 영향을 받아 파도치는 것과 같이 울렁울렁해 보이는 현상이 발생되고 또한 보드판넬의 표면이 고르지 못하게 되어 연속적인 작업이 불가능하게 되고, 또한, 전사필름과 보드판넬의 표면을 접착시키는 도포롤러가 마모가 발생되고 손상이 되어 자주 교체를 하여야 하며, 불량율도 25%가 발생되어 재작업을 하거나 불량된 전사 보드판넬을 폐기처리하여야 하는 문제점이 있었다.In addition, in all transfer board panels requiring transfer including an ALC board, primers and bonding resins must be directly applied on the surface of the board panel in order to transfer the surface of the board panel. The surface of the transfer film bonded to the board is affected by the surface of the board and appears to be rippled like waves. Also, the surface of the board panel is uneven, which makes continuous work impossible. Also, the transfer film and the board panel are impossible. The coating roller for adhering the surface of the wear roller was worn and damaged and should be replaced frequently. There was also a problem of having to rework or dispose of the defective transfer board panel due to 25% defective rate.

이러한 문제점을 해결하기 위하여, 등록특허 10-1758062에 '전사 보드판넬의 제조장치' 라는 명칭으로, 전사를 위한 보드판넬이 다수가 적재되어 자동으로 보드판넬이 공급되는 위치에 배치되게 하는 보드투입기와, 상기 보드투입기에 인접하게 설치되며 공급되는 보드판넬의 표면상에 프라이머를 접착시키는 프라이머도포기와, 상기 프라이머도포기에 인접하게 설치되며 접착된 프라이머를 건조시키는 건조기와, 건조기에 인접하게 설치되며 건조된 프라이머층의 고른 두께로 연마하며 표면을 편평하게 하거나 프라이머표면의 이물질을 제거하거나 접착되는 프라이머표면을 고르게 샌딩하는 샌딩기와, 상기 샌딩기에 인접하게 설치되며 공급되는 보드판넬을 이송시키면서 예열시키는 이송예열기와, 상기 이송예열기상에 배치되며 샌딩기에서 샌딩된 이물질을 청소하고 흡입하는 제1세척기와, 상기 이송예열기에 인접하게 설치되며 예열된 보드판넬상에 전사필름을 부착시키는 전사필름접착기와, 상기 전사필름접착기에 인접하게 설치되며 전사된 전사 보드판넬을 이송하는 이송콘베어와, 상기 이송콘베어상에 설치되며 보드판넬의 표면에 묻은 이물질을 청소하는 제2세척기와, 상기 이송콘베어에 인접하게 설치되며 전사 보드판넬의 표면상에 보호비닐을 부착시키는 보호비닐점착기와, 상기 보호비닐점착기에 인접하게 설치되며 전사 보드판넬을 적재시키는 판넬적재기를 갖는 전사 보드판넬의 제조장치가 제안된 바가 있으나, 상기 제조장치의 문제점은, 보드판넬의 4개의 측면인 전후 측면과 양측면을 전사하는 것이 불가능하게 되는 구성을 가지므로, 4개의 측면을 전사가공하고자 할 경우에는 별도의 측면을 전사가공하는 측면전사가공을 수행하여야 하므로 다시 많은 시간과 인력이 소요되게 되는 문제점이 있었다.In order to solve this problem, in the Patent Registration No. 10-1758062 called 'manufacture apparatus of the transfer board panel', and a board feeder for placing a plurality of board panels for transfer is automatically placed in the position where the board panel is supplied A primer spreader for adhering the primer on the surface of the board panel to be supplied adjacent to the board feeder, a dryer for adhering the primer spreader installed adjacent to the primer applicator, and adjacent to the dryer A sanding machine that polishes to an even thickness of the dried primer layer and flattens the surface, removes foreign substances on the primer surface, or sands the primer surface evenly to be bonded, and transfers the substrate to be supplied and preheated while being supplied adjacent to the sanding machine. A preheater, disposed on the transfer preheater and sanded in the sanding machine A first washing machine for cleaning and sucking the substance, a transfer film adhesive installed adjacent to the transfer preheater and attaching a transfer film on the preheated board panel, and a transfer board panel installed adjacent to the transfer film adhesive. A conveying conveyor for transporting, a second washer installed on the conveying conveyor and cleaning the foreign matter on the surface of the board panel, and a protective vinyl installed adjacent to the conveying conveyor and attaching a protective vinyl on the surface of the transfer board panel. An apparatus for manufacturing a transfer board panel having a pressure-sensitive adhesive and a panel stacker installed adjacent to the protective vinyl adhesive and loading a transfer board panel has been proposed, but the problem of the manufacturing apparatus is a front and rear side which is four sides of the board panel. Since it is impossible to transfer both sides, it is necessary to transfer the four sides. It shall perform the lateral transfer process for transferring the processing aspects degrees, so there is a problem that causes back takes a lot of time and manpower.

등록특허 제10-1758062호Patent Registration No. 10-1758062

본 발명의 목적은, 이러한 문제점을 해결하기 위한 것으로, 프라이머가 도포되고 건조기를 거쳐서 미리 건조된 상태에서 이미 가열된 가열기 위를 상부면의 모서리에 전후 각면 및 양측면 각면이 경사지게 형성된 보드판넬이 통과되면서 보드판넬이 가열되게 되므로 프라이머의 도포 및 건조시간이 단축되어 작업시간이 단축되게 되고, 보드판넬상에 접합수지를 도포하지 않고 전사필름상에 접합수지를 도포하므로 불량율이 현저하게 절감되고, 접착롤러에 큰 하중이 작용되지 않아 무리가 가지 않으므로 반영구적이 사용이 가능하게 되고, 보드판넬의 상부면과 상부면에 이어진 2개의 전후 각면과 상부면에 이어진 양측면 각면도 전사처리가 되어 상품성이 향상되어 고가의 전사 보드판넬의 제조가 가능하게 되고, 별도의 건조시간이 필요없이 라인상에 설치된 건조기에서 건조가 되게 되므로 종래의 건조에 필요한 시간만큼 제조량이 늘어나게 되고, 보드판넬의 전사를 위한 연속작업이 가능하게 되어 전사보드판넬의 제조속도가 증대되어 제조량이 대폭적으로 증대되는 것이 가능한 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치를 제공하는 것이다.An object of the present invention is to solve this problem, while the front panel and the front and rear sides of both sides of the board is formed inclined at the corner of the upper surface on the heater already heated in a state where the primer is applied and pre-dried through the dryer. As the board panel is heated, the application time of the primer and drying time are shortened, and the working time is shortened.Because the coated resin is coated on the transfer film without applying the bonding resin on the board panel, the defect rate is remarkably reduced, and the adhesion roller It is possible to use semi-permanently because there is no excessive load, and two front and rear surfaces connected to the upper and upper surfaces of the board panel and both sides of the upper surface connected to the upper surface are also transferred to improve the productability. It is possible to manufacture the transfer board panel of the line, and does not require additional drying time. Since drying is performed in the dryer installed in the cabinet, the amount of production increases by the time required for conventional drying, and the continuous operation for the transfer of the board panel is possible, and thus the manufacturing speed of the transfer board panel is increased, thereby increasing the amount of production. It is to provide a panel manufacturing apparatus capable of transferring to front and rear sides and both sides of the board panel.

본 발명의 이러한 목적은, 전사를 위한 보드판넬이 다수가 적재되어 자동으로 보드판넬이 공급되는 위치에 배치되게 하는 보드투입기와, 상기 보드투입기에 인접하게 설치되며 공급되는 보드판넬의 표면상에 프라이머를 접착시키는 프라이머도포기와, 상기 프라이머도포기에 인접하게 설치되며 접착된 프라이머를 건조시키는 건조기와, 건조기에 인접하게 설치되며 건조된 프라이머층의 고른 두께로 연마하며 표면을 편평하게 하거나 프라이머표면의 이물질을 제거하거나 접착되는 프라이머표면을 고르게 샌딩하는 샌딩기와, 상기 샌딩기에 인접하게 설치되며 공급되는 보드판넬을 이송시키면서 예열시키는 이송예열기와, 상기 이송예열기상에 배치되며 샌딩기에서 샌딩된 이물질을 청소하고 흡입하는 제1세척기와, 상기 이송예열기에 인접하게 설치되며 예열된 보드판넬의 상부면과 보드판넬의 전후 각면에 전사필름을 부착시키는 1차 전사필름접착기와, 상기 1차 전사필름접착기에 인접하게 설치되며 상부면과 전후 각면이 전사된 상부면 전사 보드판넬의 상부 양측면 각면을 전사시키는 2차 전사필름접착기와, 상기 2차 전사필름접착기에 인접하게 설치되며 전사 보드판넬의 표면상에 보호비닐을 부착시키는 보호비닐점착기와, 상기 보호비닐점착기에 인접하게 설치되며 전사 보드판넬을 포장시키는 보드판넬포장기를 포함하는 본 발명에 따른 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치에 의하여 달성된다.It is an object of the present invention to provide a board feeder for transferring a plurality of board panels to be placed at a position where a board panel is automatically supplied, and a primer installed on a surface of a board panel installed adjacent to the board feeder and supplied. A primer coater for adhering the adhesive, a dryer installed adjacent to the primer applicator, and a dryer for drying the bonded primer, and adjacent to the dryer, and polished to an even thickness of the dried primer layer to level the surface of the primer Sanding machine for removing foreign matter or sanding the surface of the primer evenly bonded, a transfer preheater which is installed adjacent to the sanding machine and transfers the supplied board panel, and cleans the foreign material sanded on the sanding machine And a first washer to suck and suck, and adjacent to the feed preheater. And a first transfer film adhesive for attaching the transfer film to the upper surface of the preheated board panel and the front and rear surfaces of the board panel, and the upper surface transfer portion installed adjacent to the first transfer film adhesive and having the upper surface and the front and rear surfaces transferred to each other. A secondary transfer film adhesive for transferring each upper surface of both sides of the board panel, a protective vinyl adhesive installed adjacent to the secondary transfer film adhesive and attaching a protective vinyl on the surface of the transfer board panel, and adjacent to the protective vinyl adhesive It is achieved by a panel manufacturing apparatus capable of transferring up to front and rear sides and both sides of the interior and exterior packaging board panel according to the present invention including a board panel packaging machine for packaging the transfer board panel.

본 발명에 따른 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 제조장치는, 전사를 위한 보드판넬이 다수가 적재되어 자동으로 보드판넬이 공급되는 위치에 배치되게 하는 보드투입기와, 상기 보드투입기에 인접하게 설치되며 공급되는 보드판넬의 표면상에 프라이머를 접착시키는 프라이머도포기와, 상기 프라이머도포기에 인접하게 설치되며 접착된 프라이머를 건조시키는 건조기와, 건조기에 인접하게 설치되며 건조된 프라이머층의 고른 두께로 연마하며 표면을 편평하게 하거나 프라이머표면의 이물질을 제거하거나 접착되는 프라이머표면을 고르게 샌딩하는 샌딩기와, 상기 샌딩기에 인접하게 설치되며 공급되는 보드판넬을 이송시키면서 예열시키는 이송예열기와, 상기 이송예열기상에 배치되며 샌딩기에서 샌딩된 이물질을 청소하고 흡입하는 제1세척기와, 상기 이송예열기에 인접하게 설치되며 예열된 보드판넬의 상부면과 상부면의 전후측면에 경사지게 형성된 전후 각면에 전사필름을 부착시키는 1차 전사필름접착기와, 상기 1차 전사필름접착기에 인접하게 설치되며 상부면과 전후 각면이 전사된 상부면 전사 보드판넬의 양측의 경사진 각면을 전사시키는 2차 전사필름접착기와, 상기 2차 전사필름접착기에 인접하게 설치되며 전사 보드판넬의 표면상에 보호비닐을 부착시키는 보호비닐점착기와, 상기 보호비닐점착기에 인접하게 설치되며 전사 보드판넬을 포장시키는 보드판넬포장기를 포함하여, 프라이머가 도포되고 건조기를 거쳐서 미리 건조된 상태에서 이미 가열된 가열기 위를 보드판넬이 통과되면서 보드판넬이 가열되게 되므로 프라이머의 도포 및 건조시간이 단축되어 작업시간이 단축되게 되고, 보드판넬상에 접합수지를 도포하지 않고 전사필름상에 접합수지를 도포하므로 불량율이 현저하게 절감되고, 접착롤러에 큰 하중이 작용되지 않아 무리가 가지 않으므로 반영구적이 사용이 가능하게 되고, 보드판넬의 상부면의 2개의 전후 각면과 상부면의 양측면의 2개 측면 각면도 전사처리가 되어 상품성이 향상되어 고가의 전사 보드판넬의 제조가 가능하게 되고, 별도의 건조시간이 필요없이 라인상에 설치된 건조기에서 건조가 되게 되므로 종래의 건조에 필요한 시간만큼 제조량이 늘어나게 되고, 보드판넬의 전사를 위한 연속작업이 가능하게 되어 전사보드판넬의 제조속도가 증대되어 제조량이 대폭적으로 증대되는 것이 가능한 우수한 효과가 있다.An apparatus for manufacturing a panel manufacturing apparatus capable of transferring up and down front and rear surfaces and both side surfaces for an interior and exterior interior board panel according to the present invention includes a board feeder for placing a plurality of board panels for transfer and automatically being placed at a position where the board panel is supplied. A primer coater for adhering the primer on the surface of the board panel supplied and supplied adjacent to the board feeder, a dryer installed adjacent to the primer applicator and drying the bonded primer, and installed adjacent to the dryer Sanding machine for grinding the even surface of the primer layer to flatten the surface, remove foreign substances on the surface of the primer or evenly sand the primer surface to be bonded, and a transfer preheater which is installed adjacent to the sanding machine and is preheated while transferring the supplied board panel. And disposed on the transfer preheater and in the sanding machine. A first washing machine for cleaning and sucking sanded foreign substances, and a primary transfer film adhesive unit installed adjacent to the transfer preheater and attaching the transfer film to the front and rear sides of the preheated board panel inclined on the front and rear sides. And a second transfer film gluer installed adjacent to the first transfer film gluer and transferring inclined sides of both sides of an upper surface transfer board panel on which upper and front sides are transferred, and adjacent to the second transfer film gluer. And a protective vinyl adhesive for attaching the protective vinyl on the surface of the transfer board panel, and a board panel packaging machine installed adjacent to the protective vinyl adhesive and for packaging the transfer board panel, in which a primer is applied and passed through a dryer. In the dried state, the board panel is heated as it passes over the heater that is already heated. The application and drying time is shortened, and the working time is shortened.Because the laminated resin is coated on the transfer film without applying the laminated resin on the board panel, the defect rate is remarkably reduced, and a large load is not applied to the adhesive roller. Since it is not possible, semi-permanent use is possible, and the two front and rear sides of the upper surface of the board panel and the two side surfaces of the both sides of the upper surface are also transferred, thereby improving the merchandise and enabling the manufacture of expensive transfer board panels. Since the drying is performed in the dryer installed on the line without a separate drying time, the production amount is increased by the time required for the conventional drying, and the continuous operation for the transfer of the board panel is possible, and thus the manufacturing speed of the transfer board panel is increased. There is an excellent effect that it is possible to increase the production amount significantly.

도 1은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치가 개략적으로 도시된 정면도 및 평면도
도 2는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치에서 전사시키는 보드판넬의 사시도
도 3은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 보드투입기의 개략적인 종단면도
도 4는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 프라미머접착기의 개략적인 종단면도
도 5는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 건조기의 개략적인 종단면도
도 6은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 샌딩기의 개략적인 종단면도
도 7은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 이송예열기의 개략적인 종단면도
도 8은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 제1세척기의 개략적인 종단면도
도 9a, 9b는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 1차 전사필름접착기의 개략적인 종단면도 및 작동도
도 10은 본 발명의 제1실시예에 따른 전사 보드판넬의 제조장치의 2차 전사필름접착기의 개략적인 종단면도
도 11은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 보호비닐점착기의 개략적인 종단면도
도 12는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치의 판넬포장기의 개략적인 종단면도
도 13은 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치에 의하여 제조된 전사보드판넬의 개략적인 확대 종단면도
1 is a front view and a plan view schematically showing a panel manufacturing apparatus capable of transferring the front and rear and both sides of the interior and exterior board board according to the first embodiment of the present invention
Figure 2 is a perspective view of a board panel to be transferred in the panel manufacturing apparatus capable of transferring to the front and rear and both sides and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 3 is a schematic longitudinal cross-sectional view of the board feeder of the panel manufacturing apparatus capable of transferring to the front and rear and both sides and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 4 is a schematic longitudinal cross-sectional view of the primer gluer of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 5 is a schematic longitudinal cross-sectional view of the dryer of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 6 is a schematic longitudinal cross-sectional view of the sanding machine of the panel manufacturing apparatus capable of transferring to the front and rear and both sides and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 7 is a schematic longitudinal cross-sectional view of the transfer preheater of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 8 is a schematic longitudinal cross-sectional view of the first washing machine of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
Figure 9a, 9b is a schematic longitudinal cross-sectional view and operation of the primary transfer film adhesive of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
10 is a schematic longitudinal cross-sectional view of the secondary transfer film adhesive of the apparatus for manufacturing a transfer board panel according to the first embodiment of the present invention.
Figure 11 is a schematic longitudinal cross-sectional view of the protective vinyl adhesive of the panel manufacturing apparatus capable of transferring to the front and rear and both sides of the interior and exterior board panel according to the first embodiment of the present invention
12 is a schematic longitudinal cross-sectional view of a panel packaging machine of the panel manufacturing apparatus capable of transferring to the front and rear and both sides and both sides of the interior and exterior board board according to the first embodiment of the present invention.
Figure 13 is a schematic enlarged longitudinal sectional view of a transfer board panel manufactured by a panel manufacturing apparatus capable of transferring to the front and rear and both sides and both sides of the interior and exterior board board according to the first embodiment of the present invention

본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후 각면 및 양측면 각면까지 전사가능한 판넬 제조장치(A)는, 도 1에 도시된 바와 같이, 전사를 위한 보드판넬이 다수가 적재되어 자동으로 보드판넬이 공급되는 위치에 배치되게 하는 보드투입기(1)와, 상기 보드투입기(1)에 인접하게 설치되며 공급되는 보드판넬(b)의 표면상에 프라이머를 접착시키는 프라이머도포기(2)와, 상기 프라이머도포기(2)에 인접하게 설치되며 접착된 프라이머를 건조시키는 건조기(3)와, 건조기(3)에 인접하게 설치되며 건조된 프라이머층의 고른 두께로 연마하며 표면을 편평하게 하거나 프라이머표면의 이물질을 제거하거나 접착되는 프라이머표면을 고르게 샌딩하는 샌딩기(4)와, 상기 샌딩기(4)에 인접하게 설치되며 공급되는 보드판넬을 이송시키면서 예열시키는 이송예열기(5)와, 상기 이송예열기(5)상에 배치되며 샌딩기(4)에서 샌딩된 이물질을 청소하고 흡입하는 제1세척기(6)와, 상기 이송예열기(5)에 인접하게 설치되며 예열된 보드판넬의 상부면과 상부면의 전후면의 가장자리에 경사지게 형성된 각면상에 전사필름을 부착시키는 1차 전사필름접착기(7)와, 상기 1차 전사필름접착기(7)에 인접하게 설치되며 상부면과 전후 각면이 전사된 상부면전사 보드판넬의 상부면의 경사진 양측면 각면을 전사시키는 2차 전사필름접착기(8)와, 상기 2차 전사필름접착기(8)에 인접하게 설치되며 전사 보드판넬의 표면상에 보호비닐을 부착시키는 보호비닐점착기(9)와, 상기 보호비닐점착기(9)에 인접하게 설치되며 전사 보드판넬을 적재시키는 보드판넬포장기(10)를 포함한다.Panel manufacturing apparatus (A) capable of transferring to the front and rear sides and both sides of the inner and outer board board panel according to the first embodiment of the present invention, as shown in Figure 1, a plurality of board panels for the transfer is automatically loaded A board feeder (1) for placing the panel at a position to be supplied, a primer coater (2) for adhering a primer on a surface of the board panel (b) to be supplied and installed adjacent to the board feeder (1), It is installed adjacent to the primer coater (2) and the dryer (3) for drying the adhered primer, is installed adjacent to the dryer (3) and polished to an even thickness of the dried primer layer to flatten the surface or primer surface Transfer example for preheating while removing the foreign matter of the sanding machine (4) and sanding the surface of the primer evenly bonded, and the board panel is installed adjacent to the sanding machine (4) A pre-heater 5 and a first washer 6 disposed on the transfer preheater 5 to clean and suck the foreign matter sanded by the sanding machine 4 and installed adjacent to the transfer preheater 5 and preheated. A first transfer film gluer 7 for attaching a transfer film on each side of the top and bottom surfaces of the board panel inclined at an edge of the front and rear surfaces of the board panel, and adjacent to the first transfer film gluer 7, Secondary transfer film gluer 8 for transferring the inclined both sides of the upper surface of the upper surface transfer board panel is transferred adjacent to the front and rear surfaces, and the transfer board panel is installed adjacent to the secondary transfer film gluer (8) A protective vinyl adhesive (9) for attaching the protective vinyl on the surface of the, and is installed adjacent to the protective vinyl adhesive (9) includes a panel panel packaging machine (10) for loading the transfer board panel.

본 실시예에서 사용되는 보드판넬(b)은, 도 2에 도시된 바와 같이, 상부면(b1)의 전후의 가장자리에 경사진 전후 각면(b2)이 경사지게 형성되고, 상부면(b1)의 양측면에 경사진 측면 각면(b3)이 형성되어 있다.As shown in FIG. 2, the board panel b used in the present embodiment has an inclined front and rear surface b2 formed to be inclined at front and rear edges of the upper surface b1, and both side surfaces of the upper surface b1. Inclined side surface b3 is formed.

본 실시예에서, 상기 보드투입기(1)는, 도 3에 도시된 바와 같이, 전사시킬 보드판넬(b)이 100장단위로 승강대(1a)상에 배치되고, 상기 승강대(1a)는 에어로 승강되는 리프트와 같은 구동수단(1b)에 의하여 필요한 높이로 점진적으로 승강되는 구조를 갖는다.In the present embodiment, as shown in FIG. 3, the board panel b to be transferred is disposed on the platform 1a in units of 100 sheets, and the platform 1a is elevated by air. It has a structure of gradually raising and lowering to the required height by the driving means 1b such as a lift.

상기 프라이머도포기(2)는, 도 4에 도시된 바와 같이, 보드판넬(b)의 표면(b1,b2,b3)상에 프라이머를 도포시켜 전사필름(f)이 부착되게 하는 전처리공정을 거치게 되고, 상기 프라이머도포기(2)는 보드판넬(b)이 이송되는 이송벨트(2a)의 상부에 프라이머가 도포된 다수의 도포롤러(2b)가 배치되고 프라이머공급부(2c)에서 공급되는 프라이머가 그 표면에 도포되게 되는 것이다.As shown in FIG. 4, the primer coater 2 is subjected to a pretreatment process of applying a primer on the surfaces b1, b2, and b3 of the board panel b so that the transfer film f is attached. The primer coater 2 has a plurality of coating rollers 2b coated with a primer on the transfer belt 2a to which the board panel b is transferred, and the primer supplied from the primer supply unit 2c. It will be applied to the surface.

상기 건조기(3)는, 도 5에 도시된 바와 같이, 본 실시예에서는 광선을 이용하여 빛으로 건조시키는 광건조기가 사용되었으나, 이에 제한되는 것은 아니고, 고온의 건조온도가 필요할 경우에는 열풍으로 건조하는 건조가가 사용될 수도 있을 것이다. 이와 같이 프라이머도포기(2)를 거치면서 프라이머가 도포된 보드판넬(b)의 표면(b1,b2,b3)의 프라이머층을 건조기(3)를 통하여 건조시키므로 건조시간이 단축되게 되어 보드판넬(b)의 제조속도가 월등하게 향상되게 되는 것이다. 상기 건조기(3)의 건조온도는 프라이머층(P)의 두께에 따라서 차이가 있다고 할 것이나 대략 50 ~ 200℃ 사이의 온도가 적당하다고 할 것이다.As shown in FIG. 5, the dryer 3 is a photo-dryer used to dry light using light in the present embodiment. However, the dryer 3 is not limited thereto. When the dryer 3 requires a high drying temperature, the dryer 3 is dried by hot air. Dryers may be used. As such, the primer layer of the surface (b1, b2, b3) of the board panel (b) to which the primer is applied while passing through the primer coater (2) is dried through the dryer (3), so that drying time is shortened. The manufacturing speed of b) will be greatly improved. The drying temperature of the dryer 3 will be different depending on the thickness of the primer layer (P), but the temperature between about 50 ~ 200 ℃ will be appropriate.

상기 샌딩기(4)는, 도 6에 도시된 바와 같이, 보드판넬(b)의 표면에 묻어 있는 프라이머층의 표면이 불균일한 표면을 균일하게 연마하며 또한 표면에 부착되어 있는 불순물이나 고르지 못한 프라이머층의 보드판넬(b)의 표면을 샌딩하는 것으로서, 상기 샌딩기(4)는 내부에 배치된 샌딩롤러(4a)가 회전되면서 보드판넬(b)의 프라이머층의 표면을 고르게 샌딩가공하게 되는 것이다. 상기 샌딩기(4)에 의하여 샌딩된 표면은 전사필름(f)이 접착되기에 적합한 거칠기를 갖는 표면으로 가공된다.The sanding machine 4, as shown in Figure 6, the surface of the primer layer buried on the surface of the board panel (b) uniformly polishes the uneven surface, and also impurities or uneven primer attached to the surface By sanding the surface of the board panel (b) of the layer, the sanding machine (4) is to be sanded evenly to the surface of the primer layer of the board panel (b) while the sanding roller (4a) disposed therein is rotated . The surface sanded by the sanding machine 4 is processed into a surface having a roughness suitable for bonding the transfer film f.

상기 이송예열기(5)는 공급되는 보드판넬(b)을 이송시키면서 전사필름(f)의 접착을 위하여 접착 프라이머가 잘 흡수되어 전사가 잘 되도록 보드판넬(b)의 표면을 예열시키는 것으로, 도 7에 도시된 바와 같이, 상기 이송예열기(5)는 다수의 이송롤러(5a)와, 상기 이송롤러(5a)의 상부에 설치되어 보드판넬(b)을 예열시키도록 보드판넬(b)의 프라이머층의 예열에 필요한 온도인 40 ~ 60 ℃로 가열시키는 가열부(5b)를 포함하며 상기 가열부(5b)는 니크롬선과 같은 발열부를 갖거나 발열등과 같은 가열수단이 설치된 것으로, 상기 보드판넬(b)이 이송되게 되면서 가열부(5b)에 의하여 예열되는 것으로, 이와 같이 보드판넬(b)이 가열부(5b)를 통과되면서 그 표면이 예열되게 되고, 상기 가열부(5b)는 200 ℃ 이상의 온도로 가열되는 것이다.The transfer preheater 5 is to preheat the surface of the board panel (b) to transfer the board panel (b) to be supplied while the adhesive primer is well absorbed for the transfer of the transfer film (f) to facilitate the transfer, Figure 7 As shown in FIG. 2, the transfer preheater 5 is provided on a plurality of transfer rollers 5a and the upper portion of the transfer rollers 5a to preheat the board panel b. It includes a heating portion (5b) for heating to a temperature required for preheating of 40 ~ 60 ℃ and the heating portion (5b) has a heating portion such as nichrome wire or a heating means such as a heating lamp is installed, the board panel (b ) Is transferred and is preheated by the heating unit 5b. Thus, as the board panel b passes through the heating unit 5b, its surface is preheated, and the heating unit 5b has a temperature of 200 ° C or higher. To be heated.

상기 보드판넬(b)이 이송예열기(5)를 통과하면서 예열되는 중간에 제1세척기(6)를 통과되면서 보드판넬(b)의 표면에 부착된 이물질이 세척과 동시에 흡입되는 것으로, 도 8에 도시된 바와 같이, 상기 제1세척기(6)는 타원형으로 생기 회전솔(6a)이 회전되면서 보드판넬(b)의 표면에 부착된 먼지와 같은 이물질을 세척하고 이와 동시에 공기분사부(6b)에서 공기를 분사시키고 공기흡입구(6c))에서 세척된 이물질을 흡입하여 도시되지 않은 중앙집진장치로 먼지와 같이 이물질이 이송되게 되는 것이다.As the board panel (b) passes through the first washing machine (6) in the middle of being preheated while passing through the transfer preheater (5), foreign matter attached to the surface of the board panel (b) is sucked at the same time as washing, As shown in the drawing, the first washer 6 has an elliptical shape, and the rotary brush 6a is rotated to wash foreign substances such as dust attached to the surface of the board panel b and at the same time in the air sprayer 6b. By injecting air and sucking the foreign matter washed at the air inlet 6c), the foreign matter such as dust is transferred to a central dust collector (not shown).

상기 1차 전사필름접착기(7)는 표면이 샌딩처리되고 표면상의 먼지가 흡입되어 세척된 보드판넬(b)이 유입되어 전사필름(f)이 접착되는 곳으로, 도 9a에 도시된 바와 같이, 상기 1차 전사필름접착기(7)의 상부에는 전사필름롤(7a)이 배치되어 전사필름(f)의 접착면에 접착제가 도포되게 도포부(7b)를 통과되는 상태로 접착제가 도포되어 인입된 보드판넬(b)의 표면인 상부면(b1)과 전후 각면(b2)에 접착되게 된다. 상기 1차 전사필름접착기(7)는 상부에 전사필름(f)이 권취된 전사필름롤(7a)이 고정되고, 내부에는 접착제가 수납된 도포부(7b)가 배치되고, 상기 도포부(72)의 하부에는 접착제가 도포된 접착롤러(7c)와 상기 접착롤러(7c)의 하부에 배치된 가압롤러(7d)가 배치되어 상기 보드판넬(b)이 상기 접착롤러(7c)와 가압롤러(7d)사이를 통과하면서 전사필름(f)이 보드판넬(b)상에 접합되어 전사보드판넬(B)이 제조되게 되는 것이다. 이와 같이 접착롤러(7c)상에는 도포된 전사필름(f)이 걸려서 보드판넬(b)의 표면상에 접착되므로,접착롤러(7c)상에는 큰 힘이 작용되지 않으므로 반영구적으로 사용이 가능하게 되는 것이다. 상기 접착롤러(7c)는 스프링(도시되지 않음)에 의하여 승강가능하게 하방으로 탄력지지되어 있으므로, 도 9b에 도시된 바와 같이, 접착롤러(7c)가 전방 각면(b2)을 통과할 경우에는 하방으로 각면(b2)의 높이(H1)까지 하강되어 표면상에 전사를 하게 되고 H1까지 상승하여 상부면(b1)을 전사하고 다시 후방 각면(b2)의 경우에는 하강하여 후방 각면(b2)을 전사하게 작동되는 것이다.The first transfer film adhesive 7 is a place where the surface is sanded and the dust on the surface is sucked into the washed board panel (b) is introduced into the transfer film (f), as shown in Figure 9a, The transfer film roll 7a is disposed on the upper portion of the primary transfer film adhesive 7 so that the adhesive is applied and drawn in the state of passing through the application portion 7b so that the adhesive is applied to the adhesive surface of the transfer film f. It is bonded to the upper surface (b1) and the front and rear each surface (b2) that is the surface of the board panel (b). The primary transfer film adhesive 7 has a transfer film roll 7a on which a transfer film f is wound, and an application portion 7b containing an adhesive is disposed therein, and the application portion 72 is disposed therein. In the lower part of), an adhesive roller 7c coated with an adhesive and a pressure roller 7d disposed below the adhesive roller 7c are disposed so that the board panel b is the adhesive roller 7c and the pressure roller ( The transfer film f is bonded onto the board panel b while passing between 7d), so that the transfer board panel B is manufactured. As described above, since the applied transfer film f is caught on the adhesive roller 7c and adhered to the surface of the board panel b, it is possible to use semi-permanently because a large force is not applied to the adhesive roller 7c. Since the adhesive roller 7c is elastically supported downward to be elevated by a spring (not shown), as shown in FIG. 9B, when the adhesive roller 7c passes through the front face b2, Is lowered to the height (H1) of each surface b2 to be transferred onto the surface and ascends to H1 to transfer the upper surface (b1), and again in the case of the rear surface (b2) to transfer the rear surface (b2). Will work.

상기 1차 전사필름접착기(7)는 가압롤러(7d)의 높이를 조절하는 수단, 예를 들면, 실린더와 같은 수단이 설치되어 있어 상기 보드판넬(b)의 두께에 따라 그 높이를 조절하는 것은 당연하다고 할 것이다.The primary transfer film adhesive 7 is provided with a means for adjusting the height of the pressure roller (7d), for example, such as a cylinder to adjust the height according to the thickness of the board panel (b) Of course you will.

상기 2차 전사필름접착기(8)는, 도 10에 도시된 바와 같이, 전사필름(f)의 부착되지 않은 상부면(b1)의 양 측면 각면(b3)에 전사필름(f)을 부착시키기 위한 것으로서, 가압롤러(8a)가 대칭으로 배치되어 전사필름(f)의 가장자리를 가압하여 전사필름(f)의 가장자리가 보드판넬(b)의 양측면의 각면(b3)에 접착되어 전사되게 하는 것이다. 이와 같이 상기 2차 전사필름접착기(8)는 측면에 전사필름(f)이 부착되지 않은 보드판넬(b)의 측면 각면(b3)에 대향되게 배치된 가압롤러(8a)사이를 통과하면서 전사필름(f)의 측면의 가장자리가 보드판넬(b)의 측면 각면(b3)상에 접합되는 것이다. As shown in FIG. 10, the secondary transfer film gluer 8 is used to attach the transfer film f to both side surfaces b3 of the unattached upper surface b1 of the transfer film f. As such, the pressure rollers 8a are symmetrically arranged to press the edges of the transfer film f so that the edges of the transfer film f are adhered to the respective sides b3 of both sides of the board panel b to be transferred. As described above, the secondary transfer film adhesive machine 8 passes between the pressure rollers 8a disposed opposite the side surface b3 of the board panel b on which the transfer film f is not attached to the side surface. The edge of the side surface of (f) is joined on the side surface b3 of the board panel b.

상기 2차 전사필름접착기(8)는 가압롤러(8a)의 폭을 조절하는 수단, 예를 들면, 실린더와 같은 수단이 설치되어 있어 상기 보드판넬(b)의 폭에 따라 그 높이를 조절하는 것은 당연하다고 할 것이다.The secondary transfer film adhesive 8 is provided with a means for adjusting the width of the pressure roller 8a, for example, a cylinder, so that the height is adjusted according to the width of the board panel b. Of course you will.

상기 보호비닐점착기(9)는 전사보드판넬(B)의 전사면을 보호하기 위하여 보호비닐을 점착시키는 곳으로, 도 11에 도시된 바와 같이, 상부에는 비닐이 권취된 비닐롤(9a)이 배치되고, 비닐롤(9a)에 권취된 보호비닐(v)은 한 쌍의 가압롤러(9b)사이를 통과되면서 상기 전사보드판넬(B)의 표면에 점착되는 것이다. '점착'이라는 용어는 보호비닐(v)의 표면에 발생된 점착력에 의하여 전사보드판넬(B)의 표면에 접착제와 같은 접착수단에 의하여 접착되는 것이 아니고 떼어내게 되면 아무런 흔적이 없이 이탈되는 것을 의미한다.The protective vinyl adhesive 9 is to place a protective vinyl to protect the transfer surface of the transfer board panel (B), as shown in Figure 11, the vinyl roll (9a) wound around the vinyl The protective vinyl (v) disposed and wound around the vinyl roll (9a) is adhered to the surface of the transfer board panel (B) while passing between the pair of pressure roller (9b). The term 'adhesion' means that the adhesive force generated on the surface of the protective vinyl (v) is not adhered to the surface of the transfer board panel (B) by an adhesive means such as an adhesive, and when detached, it is released without any trace. do.

상기 보드판넬포장기(10)는, 도 12에 도시된 바와 같이, 보호비닐(v)이 표면에 부착된 전사보드판넬(B)이 적정수량, 본 실시예에서는 100장단위로, 적재되는 것으로, 이와 같이 제조된 전사보드판넬(B)은 100장이 적재되면 지게차(도시되지 않음)로 운반하기 좋게 적재되는 것이다. 상기 보드판넬포장기(10)는 이미 설명한 상기 보드투입기(1)와 반대로 작동되는 것으로서, 전사보드판넬(B)이 100장단위로 승강대(10a)상에 배치되고, 상기 승강대(10a)는 에어로 승강되는 리프트와 같은 구동수단(10b)에 의하여 필요한 높이로 점진적으로 하강되는 구조를 갖는다.The board panel packaging machine 10, as shown in Figure 12, the transfer board panel (B) attached to the surface of the protective vinyl (v) is a proper quantity, in this embodiment, is loaded in 100 units, The transfer board panel (B) manufactured as described above is loaded with a good for transport by a forklift (not shown) when 100 sheets are loaded. The board panel packaging machine 10 is operated in the opposite manner to the above-described board feeder 1, the transfer board panel (B) is arranged on the platform 10a in units of 100, the platform 10a is lifted by air It has a structure that is gradually lowered to the required height by the drive means 10b, such as a lift.

이와 같은 구성을 갖는 본 발명의 제1실시예에 따른 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치(A)의 작동을 설명하면, 보드판넬(b)이 보드투입기(1)상에 100장이 투입되고, 맨위의 보드판넬(b)이 프라이머도포기(2)내로 투입되면, 프라이머도포기(2)의 프라이머액이 도포된 도포롤러(22)가 보드판넬(b)의 상부면에 접촉되면서 보드판넬(b)의 상부에 프라이머액이 도포되면서 프라이머층(p)이 형성되게 되는 것이고, 이와 같이 프라이머층이 도포된 보드판넬(b)이, 건조기(3)를 통과되면서 건조기(3)에서 발광되는 광선에 의하여 프라이머층이 건조되는 상태로 건조되어 건조기(3)를 통과하게 되므로 보드판넬(b)의 건조시간이 대폭적으로 단축되게 되는 것이다.Referring to the operation of the panel manufacturing apparatus (A) capable of transferring to the front and rear and front and rear surfaces and both sides of the interior and exterior board panel according to the first embodiment of the present invention having such a configuration, the board panel (b) is the board feeder (1) 100 sheets are put into the top panel, and the top board panel (b) is introduced into the primer coater (2), and the application roller 22 to which the primer solution of the primer coater (2) is applied is the upper surface of the board panel (b). The primer layer (p) is formed while the primer solution is applied to the upper portion of the board panel (b) while being in contact with the board. The board panel (b) to which the primer layer is applied is passed through the dryer (3). Since the primer layer is dried in the dried state by the light emitted from 3) and passes through the dryer 3, the drying time of the board panel b is drastically shortened.

이와 같이 건조기(3)를 통과한 보드판넬(b)의 프라이머층(p)의 샌딩기(4)의 샌딩롤러(41)에 의하여 샌딩되면서 불균일한 표면이 고르게 샌댕가공되게 되는 것이며, 이와 같이 샌딩가공된 프라이머층(p)의 표면은 전사필름(f)이 접착되기에 적합한 표면으로 가공되며, 이와 같이 샌딩처리된 보드판넬(b)은 이송예열기(5)를 통과되면서 전사필름(f)의 접착에 적당한 온도인 200 ℃ 이상으로 가열된 가열부(52)에 의하여 40 ~ 60 ℃ 의 온도로 예열되게 되며, 상기 보드판넬(b)이 이송예열기(5)를 통과하면서 예열되는 중간에 제1세척기(6)를 통과되면서 보드판넬(b)의 표면에 부착된 이물질이 타원형으로 생기 회전솔(61)이 회전되면서 보드판넬(b)의 표면에 부착된 먼지와 같은 이물질을 세척하고 이와 동시에 공기분사부(62)에서 공기를 분사시키고 공기흡입구(63))에서 세척된 이물질을 흡입하여 세척되는 것이다.As such, the non-uniform surface is sanded evenly while being sanded by the sanding roller 41 of the sanding machine 4 of the primer layer p of the board panel b passing through the dryer 3. The surface of the processed primer layer (p) is processed to a surface suitable for bonding the transfer film (f), the sanded board panel (b) is passed through the transfer preheater (5) of the transfer film (f) It is preheated to a temperature of 40 ~ 60 ℃ by the heating unit 52 heated to 200 ℃ or more suitable temperature for bonding, the board panel (b) in the middle of the preheating while passing through the transfer preheater (5) The foreign matter attached to the surface of the board panel (b) is elliptical while passing through the washing machine (6). As the rotary brush (61) rotates, the foreign matter such as dust attached to the surface of the board (b) is washed, and at the same time, Air is injected from the jetting section 62 and the air is blown out at the air suction port 63). It is cleaned by inhaling the foreign substance that has been chucked.

이와 같이 제1세척기(6)에서 표면이 세척된 보드판넬(b)은 1차 전사필름접착기(7)에서 전사필름롤(7a)에 권취된 전사필름(f)의 접착면에 접착제가 도포되게 도포부(7b)를 통과되는 상태로 접착제가 도포되어 인입된 보드판넬(b)이 접착롤러(7c)와 가압롤러(7d)사이를 통과하면서 프라이머층이 형성된 보드판넬(b)의 표면에 전사필름(f)이 접착되어 보드판넬(b)이 제조되게 되며, 이와 같이 본 발명에서는 보드판넬(b)의 표면에 접착제를 도포하지 않고 전사필름(f)의 표면에 접착제를 도포하게 되므로서 보드판넬(b)의 표면에 부착되는 전사필름(f)의 표면이 균일하게 접착되어 불량율의 발생이 현저하게 줄어들게 되는 것은 물론이고, 접착롤러(7c)에 무리가 가지않게 되므로서 정비회수가 획기적으로 줄어들게 되면서 장비의 가동율이 월등하게 향상되게 되는 것이며, 상기 접착롤러(7c)가 승강작동되면서 보드판넬(b)의 상부면(b1)과 전후 각면(b2)에 전사필름이 접착되게 되는 것이다.As described above, the board panel (b) whose surface is cleaned in the first washing machine (6) is coated with an adhesive on the adhesive surface of the transfer film (f) wound on the transfer film roll (7a) in the primary transfer film adhesive (7). An adhesive is applied in the state of passing through the application part 7b, and the board panel b drawn in is transferred between the adhesive roller 7c and the pressure roller 7d and transferred to the surface of the board panel b on which the primer layer is formed. The film (f) is bonded to the board panel (b) is to be manufactured, as described above, in the present invention, the adhesive is applied to the surface of the transfer film (f) without applying the adhesive on the surface of the board panel (b) board The surface of the transfer film (f) attached to the surface of the panel (b) is uniformly adhered to significantly reduce the occurrence of the defective rate, as well as the adhesive roller (7c) will not be overwhelmed, repair and maintenance As equipment decreases, utilization rate improves significantly. Said, will be as the adhesive roller (7c) is activated lifting the transfer film to be bonded to the top surface (b1) and before and after the respective surfaces (b2) of the board panel (b).

상기 1차 전사필름접착기(7)를 통과한 보드판넬(b)은 인접한 2차 전사필름접착기(8)를 통하여, 보드판넬(b)의 전사필름이 접착되지 않은 양 측면 각면에 전사필름(f)이 가압롤러(8a)사이를 통과하면서, 보드판넬(b)의 양측면 각면(b3)에 전사필름(f)이 접착되게 되고, 보드판넬(b)은 상부면 전후좌우의 각면이 모두 전사된 전사보드판넬(B)이 제조되는 것이다. 이와 같이, 상부면 및 상부면 전후좌우의 각면이 모두 전사된 전사보드판넬(B)이 보호비닐점착기(9)로 이송되고, 보호비닐점착기(9)에서는, 보호비닐이 권취된 비닐롤(9a)에서 인출된 보호비닐(v)이 가압롤러(9b)를 통과되면서 전사보드판넬(B)의 전사필름(f)상에 점착되는 상태로 되고, 이와 같이 보호필름이 점착된 전사보드판넬(B)은 보드판넬포장기(10)상의 승강대(10a)상에 연속적으로 배치되고 에어로 승강되는 리프트와 같은 구동수단(10b)에 의하여 필요한 높이로 점진적으로 하강되면서 소정의 수량, 예를 들면, 100장의 전사보드판넬(B)이 승강대(10a)상에 적재되면, 지게차(도시되지 않음)와 같은 운반수단에 의하여 적재공간으로 이송되게 되는 것이다.The board panel (b) passing through the primary transfer film adhesive (7) is a transfer film (f) on each side of both sides where the transfer film of the board panel (b) is not bonded through an adjacent secondary transfer film adhesive (8). ) Is passed between the pressure roller (8a), the transfer film (f) is bonded to each side surface (b3) of the board panel (b), the board panel (b) is the transfer of all of the front, rear, left and right sides of the upper panel The transfer board panel (B) is to be manufactured. In this way, the transfer board panel B on which the upper surface, each of the front, front, rear, left, and right sides of the upper surface are transferred is transferred to the protective vinyl adhesive 9, and in the protective vinyl adhesive 9, the vinyl roll on which the protective vinyl is wound The protective vinyl (v) drawn out from (9a) passes through the pressure roller (9b) and is adhered onto the transfer film (f) of the transfer board panel (B), and thus the transfer board panel to which the protective film is adhered. (B) is a predetermined quantity, for example, 100 while being gradually lowered to the required height by a drive means (10b) such as a lift that is continuously placed on the platform (10a) on the board panel packaging machine 10 and lifted by air When the transfer board panel (B) is loaded on the platform 10a, it is to be transferred to the loading space by a transport means such as a forklift truck (not shown).

이상과 같이 본 발명에 따른 내외장재 보드판넬용 전후 각면 및 양 측면 각면까지 전사가능한 판넬 제조장치는, 프라이머가 도포되고 건조기를 거쳐서 미리 건조된 상태에서 이미 가열된 가열기 위를 보드판넬이 통과되면서 보드판넬이 가열되게 되므로 프라이머의 도포 및 건조시간이 단축되어 작업시간이 단축되게 되고, 보드판넬상에 접합수지를 도포하지 않고 전사필름상에 접합수지를 도포하므로 불량율이 현저하게 절감되고, 접착롤러에 큰 하중이 작용되지 않아 무리가 가지 않으므로 반영구적이 사용이 가능하게 되고, 현재까지는 시도된 적이 없는 보드판넬의 상부면과 상부면의 가장자리의 전후좌우의 각면도 전사처리가 되어 상품성이 향상되어 고가의 전사 보드판넬의 제조가 가능하게 되고, 별도의 건조시간이 필요없이 라인상에 설치된 건조기에서 건조가 되게 되므로 종래의 건조에 필요한 시간만큼 제조량이 늘어나게 되고, 보드판넬의 전사를 위한 연속작업이 가능하게 되어 전사보드판넬의 제조속도가 증대되어 제조량이 대폭적으로 증대되는 것이 가능하게 되는 것이다.As described above, the apparatus for manufacturing a panel capable of transferring to front, rear, and both sides of the interior and exterior interior board panel according to the present invention includes a board panel while a primer is applied and a board panel passes through a heater that is already dried in a pre-dried state through a dryer. Since the heating and the application time of the primer is shortened and the working time is shortened, and the bonding resin is applied on the transfer film without applying the bonding resin on the board panel, the defect rate is remarkably reduced and large on the adhesive roller. Since the load is not applied, there is no difficulty, so semi-permanent use is possible. The board panel can be manufactured and installed on the line without the need for a separate drying time. Since the drying is done in the dryer, the production amount is increased by the time required for the conventional drying, and the continuous operation for the transfer of the board panel is possible, so that the manufacturing speed of the transfer board panel is increased, thereby greatly increasing the production amount. .

본 발명에 따른 내외장재 보드판넬용 전후 각면 및 양 측면 각면까지 전사가능한 판넬 제조장치는 일반적인 전사보드판넬의 제조산업에서 동일한 장치를 반복적으로 제조하는 것이 가능하다고 할 것이므로 산업상 이용가능성이 있는 발명이라고 할 것이다.Panel manufacturing apparatus that can be transferred to the front and rear sides and both sides of the interior and exterior board panels according to the present invention will be said to be an invention that can be industrially available because it is possible to repeatedly manufacture the same apparatus in the manufacturing industry of general transfer board panel will be.

A: 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치
1: 보드투입기 2: 프라이머도포기
3: 건조기 4: 샌딩기
5: 이송예열기 6: 제1세척기
7: 1차 전사필름접착기 8: 2차 전사필름접착기
9: 보드판넬포장기 10: 보호비닐점착기
A: Panel manufacturing apparatus capable of transferring to front and rear sides and both sides of interior and exterior board panels
1: board feeder 2: primer coater
3: dryer 4: sanding machine
5: transfer preheater 6: first washer
7: 1st transfer film gluer 8: 2nd transfer film gluer
9: board panel packing machine 10: protective vinyl adhesive

Claims (3)

내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치(A)에 있어서,
상기 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치(A)는, 전사를 위한 보드판넬이 다수가 적재되어 자동으로 보드판넬이 공급되는 위치에 배치되게 하는 보드투입기(1)와,
상기 보드투입기(1)에 인접하게 설치되며 공급되는 보드판넬(b)의 표면상에 프라이머를 접착시키는 프라이머도포기(2)와,
상기 프라이머도포기(2)에 인접하게 설치되며 접착된 프라이머를 건조시키는 건조기(3)와,
건조기(3)에 인접하게 설치되며 건조된 프라이머층의 고른 두께로 연마하며 표면을 편평하게 하거나 프라이머표면의 이물질을 제거하거나 접착되는 프라이머표면을 고르게 샌딩하는 샌딩기(4)와,
상기 샌딩기(4)에 인접하게 설치되며 공급되는 보드판넬을 이송시키면서 예열시키는 이송예열기(5)와,
상기 이송예열기(5)상에 배치되며 샌딩기(4)에서 샌딩된 이물질을 청소하고 흡입하는 제1세척기(6)와,
상기 이송예열기(5)에 인접하게 설치되며 예열된 보드판넬의 상부면과 전후 각면상에 전사필름을 부착시키는 1차 전사필름접착기(7)와,
상기 1차 전사필름접착기(7)에 인접하게 설치되며 상부면이 전사된 상부면전사 보드판넬의 측면 각면을 전사시키는 2차 전사필름접착기(8)와,
상기 2차 전사필름접착기(8)에 인접하게 설치되며 전사 보드판넬의 표면상에 보호비닐을 부착시키는 보호비닐점착기(9)와,
상기 보호비닐점착기(9)에 인접하게 설치되며 전사 보드판넬을 적재시키는 보드판넬포장기(10)를 포함하는 것을 특징으로 하는 전사 보드판넬의 제조장치
In the panel manufacturing apparatus (A) capable of transferring to the front and rear and both sides of the interior and exterior board panels,
The panel manufacturing apparatus (A) capable of transferring up to front and rear surfaces and both sides of the interior and exterior material board panel includes a board feeder (1) for placing a plurality of board panels for transfer so that the board panels are automatically supplied;
A primer coater (2) installed adjacent to the board feeder (1) and adhering the primer on the surface of the board panel (b) to be supplied;
A dryer 3 installed adjacent to the primer coater 2 and drying the bonded primer;
A sanding machine (4) installed adjacent to the dryer (3) and polished to an even thickness of the dried primer layer to flatten the surface, to remove foreign substances on the surface of the primer, or to sand the primer surface evenly;
A transfer preheater 5 installed adjacent to the sanding machine 4 and preheated while transferring the supplied board panel;
A first washer 6 disposed on the transfer preheater 5 to clean and suck the foreign matter sanded by the sanding machine 4;
It is installed adjacent to the transfer preheater (5) and the primary transfer film gluer (7) for attaching the transfer film on the upper surface and front and rear surfaces of the pre-heated board panel,
A secondary transfer film gluer 8 installed adjacent to the primary transfer film gluer 7 and transferring side surfaces of the upper surface transfer board panel on which the top surface is transferred;
A protective vinyl adhesive (9) installed adjacent to the secondary transfer film adhesive (8) and attaching a protective vinyl on the surface of the transfer board panel;
Apparatus for manufacturing a transfer board panel, characterized in that it comprises a board panel packaging machine 10 is installed adjacent to the protective vinyl adhesive (9) to load the transfer board panel
제1항에 있어서,
상기 1차 전사필름접착기(7)는, 상기 1차 전사필름접착기(7)의 상부에는 전사필름롤(7a)이 배치되어 전사필름(f)의 접착면에 접착제가 도포되게 도포부(7b)를 통과되는 상태로 접착제가 도포되어 인입된 보드판넬(b)의 표면인 상부면(b1)과 전후 각면(b2)에 접착되며,
상기 1차 전사필름접착기(7)는 상부에 전사필름(f)이 권취된 전사필름롤(7a)이 고정되고, 내부에는 접착제가 수납된 도포부(7b)가 배치되고, 상기 도포부(72)의 하부에는 접착제가 도포된 접착롤러(7c)와 상기 접착롤러(7c)의 하부에 배치된 가압롤러(7d)가 배치되고,
상기 접착롤러(7c)는 승강가능하게 하방으로 탄력지지되어 있으므로 접착롤러(7c)가 전방 각면(b2)을 통과할 경우에는 하방으로 각면(b2)의 높이까지 하강되어 표면상에 전사를 하게 되고 상승하여 상부면(b1)을 전사하고 다시 후방 각면(b2)의 경우에는 하강하여 후방 각면(b2)을 전사하게 작동되는 것을 특징으로 하는 내외장재 보드판넬용 전후 각면 및 양 측면 각면까지 전사가능한 판넬 제조장치
The method of claim 1,
In the primary transfer film adhesive 7, a transfer film roll 7a is disposed on an upper portion of the primary transfer film adhesive 7 so that an adhesive is applied to an adhesive surface of the transfer film f. The adhesive is applied in the state passing through and bonded to the upper surface (b1) and the front and rear each surface (b2), which is the surface of the board panel (b) inserted,
The primary transfer film adhesive 7 has a transfer film roll 7a on which a transfer film f is wound, and an application portion 7b containing an adhesive is disposed therein, and the application portion 72 is disposed therein. At the bottom of the), an adhesive roller 7c coated with an adhesive and a pressure roller 7d disposed below the adhesive roller 7c are disposed.
Since the adhesive roller 7c is elastically supported downward to move up and down, when the adhesive roller 7c passes through the front face b2, it is lowered down to the height of each face b2 and transferred onto the surface. Upward transfer of the upper surface (b1), and in the case of the rear surface (b2) again down the front surface and both sides of the interior and exterior panels for the interior and exterior board panel, characterized in that the operation is operated to transfer the panel Device
제1항에 있어서,
상기 2차 전사필름접착기(8)는, 전사필름(f)의 부착되지 않은 상부면(b1)의 양 측면 각면(b3)에 전사필름(f)을 부착시키기 위한 것으로서,
상기 2차 전사필름접착기(8)는, 가압롤러(8a)가 대칭으로 배치되어 전사필름(f)의 가장자리를 가압하여 전사필름(f)의 가장자리가 보드판넬(b)의 양측면의 각면(b3)에 접착되어 전사되는 것을 특징으로 하는 내외장재 보드판넬용 전후각면 및 양측면 각면까지 전사가능한 판넬 제조장치
The method of claim 1,
The secondary transfer film adhesive 8 is for attaching the transfer film f to each side surface b3 of both sides of the unattached upper surface b1 of the transfer film f,
In the secondary transfer film adhesive machine 8, the pressure rollers 8a are symmetrically arranged to press the edges of the transfer film f so that the edges of the transfer film f are on both sides b3 of both sides of the board panel b. Panel manufacturing apparatus capable of transferring to front and rear and both sides of both sides
KR1020180029393A 2018-03-13 2018-03-13 Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels KR20190107991A (en)

Priority Applications (3)

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KR1020180029393A KR20190107991A (en) 2018-03-13 2018-03-13 Panel manufacturing equipment transferring to front and back sides and both sides of boards for interior and exterior board panels
PCT/KR2018/003566 WO2019177190A1 (en) 2018-03-13 2018-03-27 Panel manufacturing apparatus, for interior/exterior material board panels, capable of performing transfer even on front and back faces and two side faces
CN201810579351.0A CN110271092A (en) 2018-03-13 2018-06-07 It can be to the manufacturing device for the internal and external ornament panelling panel that front and back scarf and two sides scarf are transferred

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Publication number Priority date Publication date Assignee Title
KR102179253B1 (en) * 2020-04-27 2020-11-16 박수원 Protective film attachment apparatus for aluminium material

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WO2019177190A1 (en) 2019-09-19

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