KR20190106119A - 부분적으로 전극이 형성된 바이폴라 정전척 - Google Patents

부분적으로 전극이 형성된 바이폴라 정전척 Download PDF

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Publication number
KR20190106119A
KR20190106119A KR1020180027120A KR20180027120A KR20190106119A KR 20190106119 A KR20190106119 A KR 20190106119A KR 1020180027120 A KR1020180027120 A KR 1020180027120A KR 20180027120 A KR20180027120 A KR 20180027120A KR 20190106119 A KR20190106119 A KR 20190106119A
Authority
KR
South Korea
Prior art keywords
upper dielectric
dielectric
electrode
edge
electrostatic chuck
Prior art date
Application number
KR1020180027120A
Other languages
English (en)
Korean (ko)
Inventor
조생현
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Priority to KR1020180027120A priority Critical patent/KR20190106119A/ko
Priority to TW108104735A priority patent/TW201943013A/zh
Priority to PCT/US2019/020987 priority patent/WO2019173497A1/en
Priority to CN201980015431.6A priority patent/CN111788670A/zh
Publication of KR20190106119A publication Critical patent/KR20190106119A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020180027120A 2018-03-07 2018-03-07 부분적으로 전극이 형성된 바이폴라 정전척 KR20190106119A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020180027120A KR20190106119A (ko) 2018-03-07 2018-03-07 부분적으로 전극이 형성된 바이폴라 정전척
TW108104735A TW201943013A (zh) 2018-03-07 2019-02-13 在其部分上具有電極之雙極靜電夾具
PCT/US2019/020987 WO2019173497A1 (en) 2018-03-07 2019-03-06 Bipolar electrostatic chuck having electrode on portion thereof
CN201980015431.6A CN111788670A (zh) 2018-03-07 2019-03-06 在双极静电卡盘的部分上具有电极的双极静电卡盘

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180027120A KR20190106119A (ko) 2018-03-07 2018-03-07 부분적으로 전극이 형성된 바이폴라 정전척

Publications (1)

Publication Number Publication Date
KR20190106119A true KR20190106119A (ko) 2019-09-18

Family

ID=67847444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180027120A KR20190106119A (ko) 2018-03-07 2018-03-07 부분적으로 전극이 형성된 바이폴라 정전척

Country Status (4)

Country Link
KR (1) KR20190106119A (zh)
CN (1) CN111788670A (zh)
TW (1) TW201943013A (zh)
WO (1) WO2019173497A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11574833B2 (en) 2020-05-18 2023-02-07 Samsung Display Co., Ltd. Electrostatic chuck
KR20230072078A (ko) 2021-11-17 2023-05-24 주식회사 에이치앤이루자 정전척 및 이를 이용한 평판 기판 척킹 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438070B2 (ja) 2020-09-11 2024-02-26 新光電気工業株式会社 静電チャック、基板固定装置及び基板固定装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775135B1 (ko) 2016-06-01 2017-09-26 (주)브이앤아이솔루션 정전척의 제조방법
KR101797927B1 (ko) 2016-06-01 2017-11-15 (주)브이앤아이솔루션 정전척

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142569A (ja) * 2001-10-31 2003-05-16 Applied Materials Inc 静電チャックおよびチャック方法
DE10156407A1 (de) * 2001-11-16 2003-06-05 Bosch Gmbh Robert Haltevorrichtung, insbesondere zum Fixieren eines Halbleiterwafers in einer Plasmaätzvorrichtung, und Verfahren zur Wärmezufuhr oder Wärmeabfuhr von einem Substrat
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP2005285825A (ja) * 2004-03-26 2005-10-13 Advantest Corp 静電チャック及び静電チャックによる基板固定方法
JP2005347545A (ja) * 2004-06-03 2005-12-15 Nec Kansai Ltd 静電チャック装置
US7525787B2 (en) * 2005-09-30 2009-04-28 Lam Research Corporation Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
US7619870B2 (en) * 2006-08-10 2009-11-17 Tokyo Electron Limited Electrostatic chuck
JP5036339B2 (ja) * 2007-02-07 2012-09-26 日本碍子株式会社 静電チャック及びその製造方法
JP5227568B2 (ja) * 2007-11-08 2013-07-03 株式会社日本セラテック 静電チャック
KR20110025686A (ko) * 2011-02-25 2011-03-10 주식회사 아토 정전척 및 그 제조방법
KR20130007394A (ko) * 2011-06-30 2013-01-18 세메스 주식회사 정전 척 및 이를 포함하는 기판 처리 장치, 그리고 기판 처리 방법
JP5860668B2 (ja) * 2011-10-28 2016-02-16 東京エレクトロン株式会社 半導体装置の製造方法
US8902561B2 (en) * 2012-02-02 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic chuck with multi-zone control
EP2839506B1 (en) * 2012-02-29 2016-08-24 ASML Netherlands B.V. Electrostatic clamp
US10950477B2 (en) * 2015-08-07 2021-03-16 Applied Materials, Inc. Ceramic heater and esc with enhanced wafer edge performance
KR20170039781A (ko) * 2015-10-01 2017-04-12 삼성디스플레이 주식회사 정전척 및 이를 포함하는 기판 처리 장치
KR101694754B1 (ko) * 2016-09-08 2017-01-11 (주)브이앤아이솔루션 정전척 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775135B1 (ko) 2016-06-01 2017-09-26 (주)브이앤아이솔루션 정전척의 제조방법
KR101797927B1 (ko) 2016-06-01 2017-11-15 (주)브이앤아이솔루션 정전척

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11574833B2 (en) 2020-05-18 2023-02-07 Samsung Display Co., Ltd. Electrostatic chuck
KR20230072078A (ko) 2021-11-17 2023-05-24 주식회사 에이치앤이루자 정전척 및 이를 이용한 평판 기판 척킹 방법

Also Published As

Publication number Publication date
CN111788670A (zh) 2020-10-16
TW201943013A (zh) 2019-11-01
WO2019173497A1 (en) 2019-09-12

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