KR20190102856A - Laminating apparatus and laminating method - Google Patents

Abstract

The present invention relates to an attaching apparatus and an attaching method, and more specifically, to an attaching apparatus and an attaching method, which attach an object to be attached onto an attaching sheet. According to one embodiment of the present invention, the attaching apparatus includes: a support frame on which the attaching sheet is supported; a pressurizing unit applying pressure to at least one of the object to be attached, which is provided on a first surface of the attaching sheet, and the attaching sheet; and a first plate provided in a direction of the first surface of the attaching sheet and providing a support surface on which the object to be attached is supported when applying the pressure.

Description

Adhesion apparatus and laminating method {Laminating apparatus and laminating method}

The present invention relates to a pressure-sensitive adhesive device and a pressure-sensitive adhesive method, and more particularly to a pressure-sensitive adhesive device and a pressure-sensitive adhesive method for adhering the adherend to the pressure-sensitive adhesive sheet.

BACKGROUND OF THE INVENTION Semiconductor manufacturing technology is being developed in a trend of high integration, thinness, and miniaturization, and a semiconductor package is representative of various types of high integration semiconductor devices.

Semiconductor packages are being applied to various fields such as smartphones, displays, home appliances, automobiles, industrial devices, and medical devices. However, due to the demand for multifunction, network, high capacity and high speed of semiconductor packages, the amount of electromagnetic waves is increasing, and the importance of electromagnetic shielding is increasing due to the high frequency of electromagnetic waves.

Accordingly, various methods for shielding electromagnetic waves have been proposed. Among them, a uniform film is formed to form a uniform film, which has excellent film quality and electromagnetic shielding function, excellent adhesion to the package mold, and excellent sputtering method for environmental problems. A method of depositing an electromagnetic shielding film is emerging.

In order to deposit an electromagnetic shielding film on a semiconductor package by sputtering, conventionally, a method of depositing an electromagnetic shielding film after attaching an adhesive tape to a frame, loading the semiconductor package thereon, attaching the bottom surface of the semiconductor package, and then depositing the electromagnetic shielding film .

However, in such a method, a lot of gaps are generated between the adhesive tape and the lower surface of the semiconductor package, which causes deposition contamination on the lower surface of the semiconductor package, resulting in poor quality of the semiconductor package and lower yield. There is a problem.

In particular, a LGA (Land Grid Array) semiconductor package having a land-shaped metal electrode on the lower surface so as to be in contact with an electrode of the main board, or a BGA (Ball Grid Array) semiconductor having solder balls on the lower surface In the case of a package, there has been a problem that the adhesion with the lower surface of the semiconductor package becomes more difficult.

In order to overcome this problem, a method of inserting a solder ball or a protruding land by making a pocket in a tape has been attempted, but there is a problem in that a gap occurs in the adhesive surface, resulting in poor adhesion, and it is difficult to accurately insert a semiconductor package into a pocket. If the shape of the pocket is not accurate, it is difficult to be in close contact, which causes contamination, and there is a problem in that the process time is long for precision loading and perfect contact, resulting in a decrease in productivity and increased man-hours.

Korean Registered Patent Publication No. 10-1501735

The present invention provides a pressure-sensitive adhesive device and a pressure-sensitive adhesive method for supporting a pressure-sensitive adhesive on the first plate and applying pressure to at least one of the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive.

Adhesive apparatus according to an embodiment of the present invention is a support frame on which the adhesive sheet is supported; A pressurizing portion for applying pressure to at least one of the adherend and the adhesive sheet provided on the first surface of the adhesive sheet; And a first plate disposed in a direction of the first surface of the adhesive sheet and providing a support surface on which the adherend is supported when the pressure is added.

And a first packing member provided between the first plate and the support frame, wherein the pressing unit forms a negative pressure in a space defined by the first plate, the support frame, and the first packing member. It may include a first pressure forming portion.

A second plate provided to face the first plate in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface; And a gap adjusting unit for adjusting a gap between the first plate and the second plate.

And a second packing member provided between the second plate and the support frame, wherein the pressing unit forms a positive pressure in a space defined by the second plate, the support frame, and the second packing member. It may include a second pressure forming portion.

A support piece extending toward the other one of the edges of one of the first plate and the second plate and bent inward and supporting the support frame, wherein the other one corresponds to the support piece An insertion groove is formed, and the support frame may be transferred between the support piece and the other one by adjusting the gap between the first plate and the second plate.

A pattern hole may be formed to accommodate the adherend, and the pattern plate may be provided between the first surface of the adhesive sheet and the first plate.

The pattern plate may have a thickness thinner than that of the adherend.

The adherend is a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet includes: an adhesive layer to which the semiconductor package is attached so that the protruding terminal is in contact with one surface thereof; And a strain holding layer provided on the other surface of the adhesive layer facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by the pressure.

The pressure may be equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible.

The pressing unit may be provided in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface, and may include a roller in the form of a soft material or a brush to press the second surface of the pressure-sensitive adhesive sheet.

Adhesive method according to another embodiment of the present invention is a process of supporting the adhesive sheet to the support frame; Temporarily attaching the adherend on the first surface of the adhesive sheet; Disposing the support frame such that the first surface of the adhesive sheet faces the first plate; And pressing at least one of the adhesive sheet and the adherend.

And a step of closely contacting the first packing member, the first plate, and the support frame provided between the first plate and the support frame, wherein the pressing process includes the first plate and the support frame. And forming a negative pressure in a space defined by the first packing member.

And adjusting a distance between the second plate and the first plate disposed to face the second surface of the pressure-sensitive adhesive sheet facing the first surface.

And a step of closely contacting the second packing member, the second plate, and the support frame provided between the second plate and the support frame, wherein the pressing process includes the second plate and the support frame. And forming a positive pressure in a space defined by the second packing member.

Providing a pattern plate formed with a pattern hole to accommodate the adherend on the first surface of the adhesive sheet; may further include a.

The adherend is a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet includes: an adhesive layer to which the semiconductor package is attached such that the protruding terminal contacts one surface thereof; And a strain holding layer provided on the other surface opposite to one surface of the adhesive layer, wherein the strain holding layer is plastically deformed along the protruding terminal by pressure, and the plastic deformation of the strain holding layer is performed during the pressing. A pressure equal to or more than this possible yield value can be added to at least one of the adhesive sheet and the adherend.

The pressure-sensitive adhesive device according to an embodiment of the present invention supports at least one of the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive by supporting the adhesive to be provided on the first surface of the pressure-sensitive adhesive sheet on the first plate provided in the direction of the first surface of the pressure-sensitive adhesive sheet. By adding pressure to the adhesive sheet, the adherend can be adhered to the adhesive sheet. Thereby, the phenomenon of the gap which arises between the adhesive sheet and the lower surface of a to-be-adhered body can be prevented.

In addition, by forming a negative pressure (or vacuum) in the space between the adhesive sheet and the first plate and applying pressure to the adhesive sheet and the adherend, the adhesive sheet is prevented from being damaged and the generation of particles such as cracks. The adhesive may be in close contact, and a constant pressure may be added to the entire surface of the adhesive sheet.

In addition, by adding a second plate in the direction of the second surface of the pressure sensitive adhesive sheet and forming a positive pressure in the space between the pressure sensitive adhesive sheet and the second plate to add air pressure to the pressure sensitive adhesive sheet, it is possible to enter between the lower surface of the pressure sensitive adhesive sheet and the adherend. Fine bubbles can be removed, and the adhesive sheet and the adherend can be adhered more effectively.

And when the adhesive sheet is pressed through the pattern plate provided in the first surface direction of the adhesive sheet, the adhesive sheet around the adherend can be suppressed or prevented from rising along the side of the adherend, whereby the adhesive sheet is avoided. The area adhering to the side of the adhesive can be minimized.

Meanwhile, the pressure-sensitive adhesive sheet may be a semiconductor package carrier sheet including an adhesive layer and a strain holding layer, and the adhesive may be a semiconductor package including a protruding terminal, and in this case, a pressure equal to or higher than a yield value at which plastic strain of the strain holding layer is possible. Is added to at least one of the adhesive sheet and the adherend, the lower surface of the semiconductor package with the protruding terminal can also be in close contact with the semiconductor package carrier sheet, preventing the lifting phenomenon generated between the semiconductor package carrier sheet and the lower surface of the semiconductor package. can do.

1 is a perspective view showing a pressure-sensitive adhesive device according to an embodiment of the present invention.
Figure 2 is a conceptual diagram for explaining the pressure added by the pressing unit according to an embodiment of the present invention.
Figure 3 is a conceptual diagram for explaining the adhesion of the adhesive sheet and the adherend by the pressure in accordance with an embodiment of the present invention.
Figure 4 is a conceptual diagram for explaining the pressurization through the first pressure forming portion and the second pressure forming portion according to an embodiment of the present invention.
5 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to an embodiment of the present invention.
6 is a conceptual view illustrating a support piece and a gap adjusting unit according to an embodiment of the present invention.
7 is a conceptual view illustrating a pattern plate according to an embodiment of the present invention.
8 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to an embodiment of the present invention.
9 is a flow chart showing an adhesive method according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. In the description, like reference numerals refer to like elements, and the drawings may be partially exaggerated in size in order to accurately describe embodiments of the present invention, and like reference numerals refer to like elements in the drawings.

1 is a perspective view showing an adhesive device according to an embodiment of the present invention.

1, the adhesive device 100 according to an embodiment of the present invention includes a support frame 110 on which the adhesive sheet 10 is supported; A pressing unit 120 for applying pressure to at least one of the adhesive 20 and the adhesive sheet 10 provided on the first surface of the adhesive sheet 10; And a first plate 130 disposed in the direction of the first surface of the adhesive sheet 10 to provide a support surface on which the adherend 20 is supported when the pressure is applied.

The support frame 110 may be supported by the adhesive sheet 10, may be in a plate shape having two surfaces facing each other, and may be formed in a hollow shape by opening a central portion so that a hole (or opening) is formed therein. . In this case, the adhesive sheet 10 may be attached to the support frame 110 to be supported, and may attach the first surface edge of the adhesive sheet 10 to the bottom surface (or the second surface) of the support frame 110. . Here, the adhesive sheet 10 may be attached to a position by cutting the adhesive sheet 10 to a size corresponding to the support frame 110 in advance, but the adhesive sheet 10 may be attached to the inner circumference of the support frame 110. It may be desirable to cut the outer edge of the adhesive sheet 10 in accordance with the size of the support frame 110 in a state attached to fill the. On the other hand, the support frame 110 may be a variety of shapes, such as circular, oval, polygonal, the adhesive sheet 10 is stably supported so that the adherend 20 adheres well on the first surface of the adhesive sheet 10 It is enough if it can be a shape.

The pressing unit 120 may apply pressure to at least one of the adhesive 20 and the adhesive sheet 10 provided on the first surface (or adhesive surface) of the adhesive sheet 10. At this time, the adherend 20 may be provided corresponding to the central portion of the support frame 110, the hole of the first surface of the adhesive sheet 10, may be configured in plurality. Here, the adherend 20 is seated on the first surface of the adhesive sheet 10 at a predetermined interval so that the lower surface (or the second surface) of the adherend 20 is attached to the first surface of the adhesive sheet 10. It may be attachable, it may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as a picker (picker). By applying pressure to at least one of the pressure-sensitive adhesive sheet 10 and the adherend 20 in a direction facing each other through the pressing unit 120, it can be in close contact with each other, and on the first surface of the pressure-sensitive adhesive sheet 10 The to-be-adhered object 20 temporarily attached to can be made to adhere to the 1st surface of the adhesive sheet 10. FIG. The pressing unit 120 may be in direct contact with the pressure-sensitive adhesive sheet 10 and / or the adhesive 20, and may be indirectly pressurized by using air pressure. Pressure may be added to 20.

The first plate 130 may be disposed (or provided) in the first surface direction (or side) of the adhesive sheet 10, and the adherend 20 may be applied when the pressure is applied by the pressing unit 120. This supporting surface can be provided. In this case, the first plate 130 is provided to face at least a portion (eg, an edge) of the support frame 110, such that the support surface of the first plate 130 is provided on the first surface of the adhesive sheet 10. The upper surface (or the first surface) of the adherend 20 may be supported on the support surface of the first plate 130. When the upper surface of the adherend 20 is supported through the first plate 130, the pressure may be well transmitted to the adhesive sheet 10 and / or the adherend 20.

On the other hand, the shape of the support surface of the first plate 130 may vary in a flat shape, convex shape, concave shape, etc., the shape of the adhesive sheet 10 is bent by the pressure by the pressing unit 120 It can be determined according to. When supporting the adherend 20 according to the shape of the adhesive sheet 10 that is bent through the shape of the support surface of the first plate 130, the adhesive sheet 10 may not have excessive force (or excessive force is applied). ), The action / reaction force may be transmitted well in the vertical direction between the supporting surface of the first plate 130 and the upper surface of the adherend 20.

2 is a conceptual diagram illustrating the pressure addition by the pressing unit according to an embodiment of the present invention. FIG. 2 (a) shows before the pressure is added, and FIG. 2 (b) shows the state where the pressure is added.

Referring to FIG. 2, the adhesive device 100 according to the present invention may further include a first packing member 141 provided between the first plate 130 and the support frame 110. 120 may include a first air pressure forming part 121 that forms a negative pressure in a space defined by the first plate 130, the support frame 110, and the first packing member 141. have.

The first packing member 141 may be provided between the first plate 130 and the support frame 110. The first packing member 141 may be in close contact with the first plate 130 and the support frame 110. It is possible to prevent the gap between the 130 and the support frame 110 to allow the air to enter and exit. In addition, the height of the adherend 20 may be secured between the first plate 130 and the support frame 110.

The first air pressure forming unit 121 may form negative pressure (or vacuum or negative pressure) in a space defined by the first plate 130, the support frame 110, and the first packing member 141. Here, the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object. The first air pressure forming unit 121 may include a vacuum pump and forms a negative pressure in a space defined by the first plate 130, the support frame 110, and the first packing member 141. The upper surface of the adherend 20 can be supported (or contacted) with the first plate 130, and the pressure-sensitive adhesive sheet 10 is pressed in the direction of the adherend 20 (or the first plate direction). (Or suction force) can be added.

3 is a conceptual view for explaining the adhesion between the pressure-sensitive adhesive sheet and the adherend according to an embodiment of the present invention, Figure 3 (a) shows before pressing, Figure 3 (b) is a pressure-sensitive adhesive sheet And adhesion of the adherend.

Referring to FIG. 3, as shown in FIG. 3A, before the negative pressure is formed in the space defined by the first plate 130, the support frame 110, and the first packing member 141, the adherend 20 is formed. ) Is not contacted (or supported) with the first plate 130, but is defined by the first plate 130, the support frame 110 and the first packing member 141 as shown in FIG. After the negative pressure is formed in the space, the upper surface of the adherend 20 may be supported by the first plate 130, and pressure may be added to the adhesive sheet 10 in the direction of the adherend 20. As a result, a reaction force due to the adhesion to the first plate 130 is added to the upper surface of the adherend 20, and a pressure is added to the adherend 20 in the direction of the adherend 20, whereby the additive adherend The lower surface of the 20 may be adhered to the first surface of the adhesive sheet 10. As a result, it is possible to prevent the phenomenon of the gap generated between the adhesive sheet 10 and the lower surface of the adherend 20, and due to the lift phenomenon, deposition contamination on the lower surface of the adherend 20 such as a semiconductor package. This can solve the problems such as poor quality of the adherend 20, the yield is reduced.

Here, since the upper surface of the relatively flat adherend 20 is supported by the first plate 130, the reaction force by the adhesion to the first plate 130 can be effectively added, the adhesive sheet 10 and / Alternatively, the pressure added to the adherend 20 may be well transmitted in a direction toward each other such that the lower surface of the adherend 20 and the first surface of the adhesive sheet 10 may be in close contact with each other.

In addition, by contacting the lower surface of the adherend 20 with the first surface of the adhesive sheet 10 through air pressure (for example, negative pressure), damage and particles of the adherend 20 such as cracks are caused. The adherend 20 can be brought into close contact with the adhesive sheet 10 without generation of particles, and a constant pressure is applied to the entire surface of the adhesive sheet 10 and / or the entire surface of the adherend 20. In addition to being added as well as added at the same time, the lower surface of the adherend 20 can be stably (or effectively) adhered to the first surface of the adhesive sheet 10.

On the other hand, the adhesive device 100 of the present invention includes a first vent 181 for venting the space defined by the first plate 130, the support frame 110 and the first packing member 141; It may further include. The first vent 181 may vent the space defined by the first plate 130, the support frame 110, and the first packing member 141. The first plate 130 and the support frame 110 may be ventilated. ) And a vent that can communicate with the space defined by the first packing member 141, wherein the first plate 130, the support frame 110, and the first packing member 141 having negative pressure are formed. It is possible to supply air to the space defined by. In this case, the vent may be opened and closed by a valve or the like. The adherend 20 may be formed by performing negative pressure formation and aeration in a space defined by the first plate 130, the support frame 110, and the first packing member 141 (or in an appropriate order, number of times, and time). Lower surface of the adhesive sheet and the first surface of the adhesive sheet 10 can be in close contact.

The adherend 20 may include a protrusion such as a protruding terminal 21 on a lower surface (or a contact surface with the adhesive sheet), and a lower surface of the adherend 20 and the first of the adhesive sheet 10. When the surface is in close contact with the protrusions on the lower surface of the adherend 20, even if the adhesive sheet 10 can be in close contact with the protrusions to be adhered, so that the adhesive sheet 10 is deformed along the protrusions It may be.

4 is a conceptual diagram illustrating the pressure through the first air pressure forming unit and the second air pressure forming unit according to an embodiment of the present invention, and FIG. 4 (a) shows a spaced state of the first air pressure forming unit and the second air pressure forming unit. 4 (b) shows a proximity state of the first air pressure forming portion and the second air pressure forming portion.

Referring to FIG. 4, the adhesive device 100 according to the present invention may include a second plate 150 provided to face the first plate 130 in a second surface direction of the adhesive sheet 10 facing the first surface. ); And a gap adjusting unit 160 for adjusting a gap between the first plate 130 and the second plate 150. The second plate 150 may be provided (or disposed) to face the first plate 130 in the second surface direction (or side) of the adhesive sheet 10, and the first plate 130 and the second plate may be provided. The support frame 110 may be positioned between the 150. Pressure may be applied to the pressure sensitive adhesive sheet 10 in the second surface direction of the pressure sensitive adhesive sheet 10 through the second plate 150, and the lower surface of the adherend 20 and the first surface of the pressure sensitive adhesive sheet 10. This can be effectively adhered and adhered.

The gap adjusting unit 160 may adjust the gap between the first plate 130 and the second plate 150, and closely contact the first plate 130 and the support frame 110 to the first packing member 141. A space defined by the first plate 130, the support frame 110, and the first packing member 141 may be formed. When the first plate 130 and the support frame 110 are in close contact with the first packing member 141, the upper surface of the adherend 20 may or may not be in contact with the first plate 130. After the negative pressure is formed, the upper surface of the adherend 20 may contact the first plate 130. In addition, the second plate 150 may be in contact with the second surface of the adhesive sheet 10 through the gap adjusting unit 160 to directly press the second surface of the adhesive sheet 10, or the second plate 150 may be used. ) And the support frame 110 may be narrowed to add air pressure (for example, positive pressure) to the second surface of the adhesive sheet 10.

The adhesive device 100 according to the present invention may further include a second packing member 142 provided between the second plate 150 and the support frame 110, and the pressing unit 120 may further include a second packing member 142. The plate 150, the support frame 110, and the second packing member 142 may include a second air pressure forming unit 122 that forms a positive pressure in a space defined by the pressure.

The second packing member 142 may be provided between the second plate 150 and the support frame 110, may be in close contact with the second plate 150 and the support frame 110, and the second plate ( It is possible to prevent the gap between the 150 and the support frame 110 to allow the air to enter and exit.

The second air pressure forming unit 122 may form a positive pressure in a space defined by the second plate 150, the support frame 110, and the second packing member 142. Here, the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface. The second air pressure forming unit 122 may include a gas supply unit supplying a gas such as air to a space defined by the second plate 150, the support frame 110, and the second packing member 142. The pressure may be applied in a direction compressing the second surface of the adhesive sheet 10 by forming a positive pressure in a space defined by the second plate 150, the support frame 110, and the second packing member 142. .

Through this, the pressure-sensitive adhesive sheet 10 and the adhesive 20 can be brought into close contact with the negative pressure formed in the space defined by the first plate 130, the support frame 110, and the first packing member 141. The pressure may be provided, and the second surface of the pressure sensitive adhesive sheet 10 may be pressed to allow air between the lower surface of the pressure sensitive adhesive sheet 10 and the adherend 20 to escape well, thereby allowing the pressure sensitive adhesive sheet 10 and Fine bubbles may be prevented from occurring between the lower surfaces of the adherend 20, and the adhesive sheet 10 and the adherend 20 may be adhered to each other more effectively.

In addition, the pressure is applied only through the air pressure (for example, negative pressure and positive pressure) using the first air pressure forming portion 121 and the second air pressure forming portion 122, and the lower surface of the adherend 20 and the adhesive sheet 10 By bringing the first surface of the sheet into close contact with each other, the lower surface of the adherend 20 can be brought into close contact with the first surface of the adhesive sheet 10 without damaging the adherend 20 such as cracks and generating particles.

On the other hand, the pressure-sensitive adhesive device 100 of the present invention further includes a second vent 182 through the space defined by the second plate 150, the support frame 110 and the second packing member 142; can do. The second vent 182 may vent the space defined by the second plate 150, the support frame 110, and the second packing member 142, and the second plate 150 and the support frame 110 may be ventilated. And a vent that can communicate with the space defined by the second packing member 142, and defined by the second plate 150, the support frame 110, and the second packing member 142 in which the static pressure is formed. Air (or gas) can be discharged (or exhausted) from the space to be used. In this case, the vent may be opened and closed by a valve or the like. The lower surface of the adherend 20 and the adhesive sheet 10 may be formed by appropriately forming positive pressure and aeration in the space defined by the second plate 150, the support frame 110, and the second packing member 142. One side can be stuck more effectively.

5 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to an embodiment of the present invention.

Referring to FIG. 5, the adhesive device 100 according to the present invention extends toward the other one of the edges of one of the first plate 130 and the second plate 150, and is bent inwardly, and the support frame 110 is provided. The support piece 143 for supporting) may be further included, and the other one may include an insertion groove 144 corresponding to the support piece 143. The support piece 143 extends toward the other one of the edges of one of the first plate 130 and the second plate 150 and may be bent inward, and may be configured in plural and spaced apart from each other. Can be. Here, the support piece 143 may support the support frame 110 at the time of loading the support frame 110, the support frame 110 and the other one (for example, the second plate) When the spaced apart may support the support frame 110. In this case, the support piece 143 may support the edge of the support frame 110, and provides a space for the transport device (not shown) such as an end effector to seat and exit the support frame 110. can do.

An insertion groove 144 may be formed in the other one to correspond to the support piece 143, and the insertion groove 144 may correspond to the position, shape, and size of the support piece 143 to correspond to the first plate 130. The support piece 143 may be inserted in the proximity of the second plate 150. Accordingly, the first plate 130 and the support frame 110 may be in close contact with the first packing member 141 without interfering with the support piece 143, and the second plate 150 may be attached to the second packing member 142. ) And the support frame 110 may be in close contact.

6 is a conceptual view illustrating a support piece and a gap adjusting unit according to an embodiment of the present invention. FIG. 6 (a) shows before the second plate is raised and FIG. 6 (b) is after the second plate is raised. Indicates.

Referring to FIG. 6, the support frame 110 may be transferred between (or between) the support piece 143 and the other one by adjusting the gap between the first plate 130 and the second plate 150. That is, when the support piece 143 is inserted into the insertion groove 144 by adjusting the gap between the first plate 130 and the second plate 150, the support frame 110 is the support piece 143 in the Can be passed to the other. When the first plate 130 and the second plate 150 are close, the support piece 143 may be inserted into the insertion groove 144, the support piece 143 is inserted into the insertion groove 144 The support frame 110 may be transferred from the support piece 143 onto the other one. In this case, the support frame 110 may be transferred onto the first packing member 141 or the second packing member 142 supported by the other one. As a result, the first plate 130 and the support frame 110 are in close contact with the first packing member 141 to define the space defined by the first plate 130, the support frame 110, and the first packing member 141. The second plate 150 and the support frame 110 may be in close contact with the second packing member 142 to the second plate 150, the support frame 110, and the second packing member 142. The space defined by may be formed.

Here, when the support piece 143 is formed at any one edge of the first plate 130 and the second plate 150, the lower portion of the first plate 130 and the second plate 150 The distance between the first plate 130 and the second plate 150 may be adjusted only by the other lifting, and the support frame 110 supported by the support piece 143 may be transferred onto the other one below. Can be.

On the other hand, the gap adjusting unit 160 may be configured in the form of a lifting device, as shown in FIGS. For example, the interval adjusting unit 160 in the form of a lift device is connected to the second plate 150 to elevate the second plate 150, thereby reducing the distance between the first plate 130 and the second plate 150. I can regulate it.

In addition, the adhesive apparatus 100 of the present invention includes an upper plate on which one of the first plate 130 and the second plate 150 is supported (or fixed) and a sidewall plate supporting the upper plate. A housing 191; And a support table 192 for supporting the other one of the first plate 130 and the second plate 150 and the housing 191. The housing 191 may include the upper plate on which one of the first plate 130 and the second plate 150 is supported, and the side wall plate supporting the upper plate, and the first plate ( The space between the 130 and the second plate 150 may be adjusted. The upper plate may be supported by any one of the upper of the first plate 130 and the second plate 150, the edge of any one of the upper of the first plate 130 and the second plate 150 The support frame 110 may be supported by the support piece 143 formed on the support piece 143. The side wall plate may support the upper plate and may provide a height at which a gap between the first plate 130 and the second plate 150 is adjusted.

The support table 192 may support the remaining one of the first plate 130 and the second plate 150 and / or the housing 191, and in the form of a hoist in the center of the support table 192. The gap adjusting unit 160 may be provided to elevate the other one of the lower parts of the first plate 130 and the second plate 150.

7 is a conceptual diagram illustrating a pattern plate according to an embodiment of the present invention.

In the adhesive device 100 according to the present invention, a pattern hole that can accommodate the adherend 20 is formed, and the pattern plate 170 provided between the first surface of the adhesive sheet 10 and the first plate 130. It may further include; The pattern plate 170 may have a pattern hole to accommodate the adherend 20, and may be provided to face the first plate 130 in a first surface direction of the adhesive sheet 10, and may be provided with an adhesive sheet. It may be located between the first surface of the (10) and the first plate 130. Here, the adherend 20 may be accommodated in the pattern hole, and a pattern line of the pattern plate 170 forming the sidewall of the pattern hole may be provided around (or around) the adherend 20. In addition, when the adherend 20 is formed in plural, a pattern line of the pattern plate 170 may be provided between the adherends 20. The pattern plate 170 has a pressure-sensitive adhesive sheet 10 around the adhesive 20 in which the pressure-sensitive adhesive 20 is not placed when pressure is applied to the pressure-sensitive adhesive sheet 10 in the direction of the adhesive 20. To prevent it from rising. Thereby, it can suppress or prevent that the adhesive sheet 10 rises along the side surface of the to-be-adhered object 20, and sticks to the side surface of the to-be-adhered object 20. FIG.

When the adhesive sheet 10 is locally attached to the side of the adherend 20, an electromagnetic wave shielding film may not be deposited on the side of the adherend 20 to which the adhesive sheet 10 is attached, and is not deposited. In this case, a gap of the electromagnetic wave shielding film is generated so that the electromagnetic wave emitted from the adherend 20 cannot be shielded. On the other hand, when a weak pressure is applied to suppress or prevent adhesion of the adhesive sheet 10 to the side of the adherend 20, the adhesion between the lower surface of the adherend 20 and the adhesive sheet 10 When the electromagnetic wave shielding film is deposited on the adherend 20 such as a semiconductor package, the deposition material may penetrate into the gap between the bottom edge of the adherend 20 and be deposited on the bottom surface of the adherend 20. have.

In this case, the pattern plate 170 may have a thickness thinner than the adherend 20. When the thickness of the pattern plate 170 is greater than or equal to the thickness of the adherend 20, the pattern plate 170 may be formed on the adhesive sheet 10 at the periphery (or circumference) of the adherend 20. It can prevent the pressure-sensitive adhesive sheet 10 is in close contact with the edge of the lower surface of the adherend 20 by blocking the pressure added in the direction, and thus the adhesion of the adhesive sheet 10 to the lower edge of the adherend 20 The deposition material may not be well formed, and when the electromagnetic shielding film or the like is deposited on the adherend 20 such as a semiconductor package, the deposition material may be formed in the gap between the bottom surface of the adherend 20. It may be deposited on the lower surface. In this case, deposition contamination may occur on the lower surface of the adherend 20, so that the quality of the adherend 20, such as a semiconductor package, may be deteriorated, and the yield may be degraded.

On the other hand, the pattern hole may have a shape spaced apart (or largely processed) by 0.1 to 2 mm (or about 0.5 mm) from the edge of the adherend 20. At this time, the interval of the adherend 20 may be 1 to 3 mm (or about 2 mm), the interval of the pattern hole may be 0.5 to 2 mm (or about 1 mm). When the pattern hole has a shape spaced 0.1 to 2 mm apart from the edge of the adherend 20, a region (or area) to which the adhesive sheet 10 is adhered to the side of the adherend 20 even under high pressure. It can be minimized, and even the equipment with high precision may allow the adherend 20 to be accommodated in the pattern hole. As the size of the pattern hole is the same as the size of the adherend 20, the area to which the adhesive sheet 10 is bonded may disappear, but the pattern hole is 0.1 mm or more from the edge of the adherend 20. In the case where it is not largely formed, precise loading is required to accommodate the adherend 20 in the pattern hole, so that expensive processing equipment for high precision loading or long processing time is required for precision loading. .

On the other hand, in the case where the pattern hole is formed larger than 2 mm by the edge of the adherend 20, the pattern line of the pattern plate 170 moves away from the periphery of the adherend 20 and the adherend 20 ), The effect of preventing the adhesive sheet 10 from rising up may be reduced, and the number of the pattern holes that may be formed in one pattern plate 170 is limited to one support frame 110. The number of adherends 20 provided on the supported adhesive sheet 10 may be reduced (or limited).

The adherend 20 may be a semiconductor package including at least one protruding terminal 21 on one surface thereof, and the adhesive sheet 10 may be attached to the semiconductor package so that the protruding terminal 21 is in contact with one surface thereof. Layer (not shown); And a strain holding layer (not shown) provided on the other surface facing one surface of the adhesive layer (not shown) and plastically deforming along the protruding terminal 21 by the pressure. . That is, the adhesion device 100 may be an adhesion device for protecting an electrode (or terminal) of a semiconductor package.

The adherend 20 may be a semiconductor package including at least one protruding terminal 21 on one surface thereof, and the protruding terminal 21 may be a metal electrode or a solder ball in the form of a land. . For example, the semiconductor package may include a ball grid array (BGA) in which a plurality of solder balls are arranged in a matrix on a lower surface thereof, or a land grid array in which metal electrodes in a land form are arranged in a matrix form. Array (LGA) semiconductor package, a metal film (ie, an electromagnetic shielding film) for shielding the electromagnetic wave by a sputtering process or the like may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet 10 have.

The adhesive sheet 10 may be a semiconductor package carrier sheet, and may include an adhesive layer (not shown) and a strain holding layer (not shown). The semiconductor package carrier sheet may serve to firmly fix the semiconductor package to the first surface (or upper surface), and a plurality of the semiconductor packages may be arranged in a compact size in one semiconductor package carrier sheet. . For example, after the semiconductor package is tightly fixed to the semiconductor package carrier sheet, the semiconductor package may be mounted on a transfer tray (not shown) to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the semiconductor package carrier sheet. Instead of being formed, a metal film for shielding electromagnetic waves may be formed only on the side surfaces and the upper surface of the semiconductor package. The semiconductor package carrier sheet may include at least one layer having magnetic properties. Here, magnetic means a property of being attached to a magnet body such as an electromagnet, a permanent magnet, and forms a separate magnetic layer on the semiconductor package carrier sheet or at least one of an adhesive layer (not shown) and a strain holding layer (not shown). The magnetic substance (or magnetic powder) may be contained (or included) in the. The semiconductor package carrier sheet may be in close contact with the susceptor by a magnetic force provided from the magnet part of the susceptor in the sputtering apparatus during the sputtering process.

The semiconductor package may be attached (or adhered) to the adhesive layer (not shown) such that the protruding terminal 21 contacts one surface thereof. For example, the adhesive layer (not shown) adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the semiconductor package carrier sheet The adhesive may serve to adhere the semiconductor package so that the semiconductor package can be easily detached. The adhesive layer (not shown) may be formed by processing a flowable adhesive material having adhesiveness into a film form. For example, the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto. The adhesive material constituting the adhesive layer (not shown) may be various materials in addition to the silicone-based adhesive material.

The strain retaining layer (not shown) may be provided on the other surface of the adhesive layer (not shown) to which the semiconductor package is attached, and may be bonded to the adhesive layer (not shown), and the pressure may be Pressure) can be plastically deformed along the protruding terminal 21. That is, the strain holding layer (not shown) may have a feature in which the shape is not restored after the plastic deformation through the deformation of the shape along the protruding terminal 21 by the pressure through the pressing unit 120. For example, the strain holding layer (not shown) may be formed of a nonmagnetic metal material that is not restored after being processed, and may be formed in the form of a nonmagnetic metal sheet or a nonmagnetic metal film having a thin thickness. Here, the strain retaining layer (not shown) may be formed of a non-magnetic metal material that is ductile and has excellent workability and is easily processed to a very thin thickness and allows a magnetic field to pass through, and may include aluminum, aluminum alloy, and copper. Material and a copper alloy material.

In addition, the strain holding layer (not shown) may be deformed by a pressure applied to the adhesive layer (not shown) while the protrusion terminal 21 of the semiconductor package is tightly fixed to the adhesive layer (not shown). After this deformation and plastic deformation, it may not be restored to its original shape. In this case, the material and the thickness of the strain holding layer (not shown) may be important in order to improve the handleability while preventing the shape from being restored after the shape of the strain holding layer (not shown) is deformed. When the thickness of the strain holding layer (not shown) is too thin, it may be very easily torn or broken, and handling may be very difficult. On the contrary, when the thickness of the strain holding layer (not shown) is too thick, the protruding terminals 21 of the semiconductor package may be used. Even if the pressure is applied to the shape, the shape may not be deformed correctly along the shape of the protruding terminal 21.

The pressure may be equal to or higher than the yield value at which the plastic deformation of the strain holding layer (not shown) is possible. That is, the pressing unit 120 may add a pressure equal to or higher than a yield value at which the strain holding layer (not shown) may be plastically deformed to at least one of the adhesive sheet 10 and the adherend 20. When at least one of the pressure-sensitive adhesive sheet 10 and the adherend 20 is subjected to a pressure less than the yield value at which the plastic deformation of the strain holding layer (not shown) is applied, plastic deformation is possible to the strain holding layer (not shown). Since no pressure above the yield value is applied, the strain holding layer (not shown) cannot be plastically deformed, and can be restored to its original shape. In this case, the bottom surface of the adherend 20 may not be adhered to the adhesive sheet 10 to be adhered, and a lifting phenomenon may occur between the adhesive sheet 10 and the bottom surface of the adherend 20. As a result, deposition contamination occurs on the lower surface of the adherend 20 such as a semiconductor package, so that the quality of the adherend 20 may be deteriorated and the yield may decrease.

Accordingly, the pressing unit 120 may apply a pressure equal to or higher than a yield value at which the strain holding layer (not shown) may be plastically deformed to at least one of the adhesive sheet 10 and the adherend 20, and the protruding terminal 21. The deformation retaining layer (not shown) may be plastically deformed to conform to the shape of the adhesive sheet 20 so that the lower surface of the adherend 20 adheres to the adhesive sheet 10 to be adhered thereto. The lifting phenomenon which arises between the lower surface of the adhesive sheet 10 and the to-be-adhered object 20 can be prevented.

8 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to an embodiment of the present invention.

Referring to FIG. 8, the pressing unit 220 is provided in a second surface direction of the adhesive sheet 10 facing the first surface, and forms a flexible material or brush that presses the second surface of the adhesive sheet 10. It may include a roller. The roller may be provided to face at least a portion of the first plate 230 and / or the support frame 210 in the second surface direction of the adhesive sheet 10 facing the first surface, and the adhesive sheet 10 The second side of the) may be pressed, and may be made of a soft material or in the form of a brush. In this case, the upper surface of the adherend 20 may be supported by the first plate 230. Since the roller presses the second surface of the pressure sensitive adhesive sheet 10 supported by the support frame 210, the pressure sensitive adhesive sheet 10 is torn due to the excessively strong pressing force such as the protruding terminal 21 of the adhesive 20. It may be made of a soft material or in the form of a brush so that the adhesive sheet 10 may be adhered to and adhered to the protruding terminal 21. Through this, the pressing force for pressing the second surface of the pressure sensitive adhesive sheet 10 can be evenly distributed according to the shape of the lower surface (or lower part) of the adherend 20. As a result, the pressure sensitive adhesive sheet 10 is stably pressed to protrude. While preventing the adhesive sheet 10 from being torn or broken, the adhesive sheet 10 may be adhered along the protruding terminal 21 or the like to prevent the adhesive sheet 10 from being torn or broken.

9 is a flow chart showing an adhesive method according to another embodiment of the present invention.

Looking at the adhesion method according to another embodiment of the present invention in more detail with reference to Figure 9, it will be omitted that overlaps with the above-described parts with respect to the adhesive device according to an embodiment of the present invention.

Adhesive method according to another embodiment of the present invention is a step of supporting the adhesive sheet to the support frame (S100); Attaching the adherend on the first surface of the adhesive sheet (S200); Disposing the support frame such that the first surface of the adhesive sheet faces the first plate (S300); And pressing at least one of the adhesive sheet and the adherend (S400).

First, the adhesive sheet is supported on the support frame (S100). The adhesive sheet may be supported by the support frame, and may be formed in a hollow shape by opening a central portion to form a hole therein. In this case, the adhesive sheet may be attached to the support frame to be supported, and the edge of the first surface of the adhesive sheet may be attached to the bottom surface (or the second surface) of the support frame. Here, the adhesive sheet may be attached to a position by cutting the adhesive sheet in advance in a size corresponding to the support frame, but the adhesive frame is attached to fill the inner circumference of the support frame. It may be desirable to cut the outer edge of the adhesive sheet in accordance with the size of the.

Next, the adhesive material is temporarily attached on the first surface of the adhesive sheet (S200). The adherend may be temporarily attached onto the first surface of the adhesive sheet, and the adherend may be provided corresponding to a central portion of the support frame in which holes are formed among the first surfaces of the adhesive sheet. Can be configured. Here, the adherend may be seated on the first surface of the pressure-sensitive adhesive sheet at a predetermined interval so that the bottom surface (or the second surface) of the adherend may be temporarily attached to the first surface of the pressure-sensitive adhesive sheet, and the picker It may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as).

Next, the support frame is disposed such that the first surface of the adhesive sheet faces the first plate (S300). The support frame may be disposed so that the first surface of the pressure sensitive adhesive sheet faces the first plate, and the upper surface (or the first surface of the pressure sensitive adhesive material so as to transfer pressure well to the pressure sensitive adhesive sheet and / or the adherend. 1 side) can be supported on the first plate.

Then, at least one of the adhesive sheet and the adherend is pressed (S400). Pressure may be added (or pressed) to at least one of the adhesive sheet and the adherend in a direction facing each other, thereby allowing the adhesive sheet and the adherend to adhere to each other, The adherend temporarily attached on the first surface may be adhered to the first surface of the adhesive sheet.

The adhesion method according to the present invention may further include a step (S361) of closely contacting the first packing member, the first plate, and the support frame provided between the first plate and the support frame. Pressing (S400) may include a step (S410) of forming a negative pressure in the space defined by the first plate, the support frame and the first packing member.

After the process of arranging the support frame (S300), the first packing member, the first plate, and the support frame provided between the first plate and the support frame may be in close contact with each other (S361). The first plate and the support frame may be in close contact with the first packing member provided between the first plate and the support frame, and a gap through which air may enter and exit between the first plate and the support frame. (gap) can be prevented from occurring. This may form a space defined by the first plate, the support frame and the first packing member, the height of the adherend between the first plate and the support frame through the first packing member. You can also secure.

In addition, a negative pressure (or a vacuum or a negative pressure) may be formed in a space defined by the first plate, the support frame, and the first packing member (S410). Here, the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object. In this case, a negative pressure may be formed through a vacuum pump, and a negative pressure is formed in a space defined by the first plate, the support frame, and the first packing member, so that an upper surface of the adherend is formed on the first surface. It can be supported by the plate, it can be added to the pressure-sensitive adhesive sheet in the direction of the adherend (or suction force).

Accordingly, a reaction force due to the adhesion to the first plate is added to the upper surface of the adherend, and pressure is added to the adherend sheet in the direction of the adherend, whereby the lower surface of the adherend adheres to the first surface of the adhesive sheet. It may be adhered to the surface and adhered. Here, the relatively flat upper surface of the adherend is supported on the first plate, whereby reaction force due to the adhesion to the first plate can be effectively added, and is added to the adhesive sheet and / or the adherend The pressure is well transmitted in a direction toward each other so that the lower surface of the adherend and the first surface of the pressure-sensitive adhesive sheet can be in close contact. In addition, by adhering the lower surface of the adherend and the first surface of the adhesive sheet through air pressure, the adherend may be adhered to the adhesive sheet without damaging the adherend such as cracks and generating particles.

The adhesive method according to the present invention may further include adjusting a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface (S360). .

After the process of arranging the support frame (S300), a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface may be adjusted (S360). The distance between the first plate and the second plate can be adjusted, and the first plate and the support frame are in close contact with the first packing member to be defined by the first plate, the support frame and the first packing member. It can form a space to be. When the first plate and the support frame are in close contact with the first packing member, an upper surface of the adherend may contact the first plate, and after contact with the first plate, the upper surface of the adherend may be It may be in contact with the first plate. In addition, the second plate may be brought into contact with the second surface of the adhesive sheet by adjusting the gap between the first plate and the second plate to directly press the second surface of the adhesive sheet. An air pressure may be added to the 2nd surface of the said adhesive sheet by narrowing the space | interval of the said support frame.

The adhesive method according to the present invention further comprises a step (S362) of closely contacting the second packing member, the second plate and the support frame provided between the second plate and the support frame; Process S400 may further include forming a static pressure in a space defined by the second plate, the support frame, and the second packing member (S420).

After the process of arranging the support frame (S300), the second packing member, the second plate, and the support frame provided between the second plate and the support frame may be in close contact with each other (S362). The second plate and the support frame may be in close contact with the second packing member provided between the second plate and the support frame, and a gap for allowing air to enter and exit between the second plate and the support frame. This can be prevented from occurring.

In addition, a static pressure may be formed in a space defined by the second plate, the support frame, and the second packing member (S420). Here, the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface. A positive pressure (or air pressure) may be formed through a gas supply unit, and a positive pressure is formed in a space defined by the second plate, the support frame, and the second packing member to compress the second surface of the adhesive sheet. Pressure can be added.

This may provide a sufficient pressure to adhere the adhesive sheet and the adherend together with the negative pressure formed in the space defined by the first plate, the support frame and the first packing member, and the adhesive sheet By pressing the second side of the air so that the air between the adhesive sheet and the lower surface of the adhered well to escape well, it is possible to prevent the formation of fine bubbles between the adhesive sheet and the lower surface of the adhered, more effectively The adhesive sheet and the adhesive may be in close contact with each other.

The adhesive method according to the present invention may further include a step (S350) of providing a pattern plate having a pattern hole to accommodate the adherend on the first surface of the adhesive sheet.

After the process of temporarily attaching the adherend (S200), a pattern plate on which the pattern hole may be accommodated may be provided on the first surface of the adhesive sheet (S350). The pattern plate may have a pattern hole to accommodate the adherend, and may be provided on the first surface of the adhesive sheet to face the first plate, and may be closer to the support frame than the first plate. Can be located. Here, the adherend may be accommodated in the pattern hole, and a pattern line of the pattern plate forming sidewalls of the pattern hole may be provided around the adherend, and the adherend may include a plurality of adherends. In this case, a pattern line of the pattern plate may be provided between the adherends. The pattern plate may prevent the adhesive sheet from rising up around the adherend on which the adherend is not placed when pressure is applied to the adhesive sheet in the direction of the adherend. Accordingly, the pressure-sensitive adhesive sheet can be prevented from being raised along the side of the adherend and adhered to the side of the adherend.

The adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet may include an adhesive layer to which the semiconductor package is attached to contact the protruding terminal on one surface thereof; And a strain holding layer provided on the other surface of the adhesive layer facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by pressure. That is, the adhesion method may be an adhesion method for protecting the electrode of the semiconductor package.

The adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the protruding terminal may be a metal electrode or a solder ball having a land shape. For example, the semiconductor package may be a ball grid array (BGA) semiconductor package in which a plurality of solder balls are arranged in a matrix on a lower surface, or a land grid array (LGA) semiconductor package in which metal electrodes in a land form are arranged in a matrix. The metal film may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet to shield electromagnetic waves by a sputtering process.

The adhesive sheet may be a semiconductor package carrier sheet, and may include the adhesive layer and the strain holding layer. The semiconductor package carrier sheet may serve to firmly fix the semiconductor package to the first surface, and a plurality of the semiconductor packages may be arranged in a compact size in one semiconductor package carrier sheet. For example, after the semiconductor package is tightly fixed to the semiconductor package carrier sheet, the semiconductor package may be mounted on a transfer tray (not shown) to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the semiconductor package carrier sheet. Instead of being formed, a metal film for shielding electromagnetic waves may be formed only on the side surfaces and the upper surface of the semiconductor package.

The adhesive layer may be attached (or adhered) to the semiconductor package such that the protruding terminal contacts one surface thereof. For example, the adhesive layer adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the semiconductor package carrier sheet It may serve to adhere the semiconductor package to facilitate the detachment of the package. The adhesive layer may be formed by processing a flowable adhesive material having adhesiveness into a film form. For example, the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto. The adhesive material constituting the adhesive layer may include various materials in addition to the silicone-based adhesive material.

The strain holding layer may be provided on the other side of the adhesive layer to which the semiconductor package is adhered, and may be bonded to the adhesive layer, and may be fired along the protruding terminal by pressure (or external pressure). It can be modified. That is, the strain holding layer may have a feature that the shape is not restored after the plastic deformation after the shape is deformed along the protruding terminal by pressure. Here, the strain holding layer is fired by pressing against at least one of the adhesive sheet and the adherend (or pressure for pressing at least one of the adhesive sheet and the adherend) in the pressing step (S400). It can be modified.

In the pressing step (S400), a pressure equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible may be added to at least one of the adhesive sheet and the adherend. When a pressure less than the yield value at which plastic deformation of the strain holding layer is applied to at least one of the adhesive sheet and the adherend is not applied, the pressure at least a yield value at which plastic deformation is possible may not be applied to the strain holding layer. The holding layer cannot be plastically deformed and can be restored to its original shape. In this case, the bottom surface of the adherend may not be adhered to the pressure sensitive adhesive sheet, and thus a lifting phenomenon may occur between the pressure sensitive adhesive sheet and the bottom surface of the adherend.

Therefore, a pressure equal to or higher than a yield value at which plastic deformation of the strain retaining layer is possible may be applied to at least one of the adhesive sheet and the adherend, and the strain retaining layer may be plastically deformed along the shape of the protruding terminal, thereby The lower surface of the adhesive may be adhered to the adhesive sheet to be adhered, and the lifting phenomenon generated between the adhesive sheet and the lower surface of the adherend may be prevented.

As described above, in the present invention, the adhesive to be provided on the first surface of the adhesive sheet is supported on the first plate provided in the first surface direction of the adhesive sheet to thereby apply pressure to at least one of the adhesive sheet and the adhesive. The adhesive can be adhered to the pressure-sensitive adhesive sheet in close contact. Thereby, the lifting phenomenon generated between the adhesive sheet and the lower surface of the adherend can be prevented. In addition, by forming a negative pressure in the space between the adhesive sheet and the first plate and applying pressure to the adhesive sheet and the adherend, the adherend can be adhered to the adhesive sheet without damaging the adherend such as cracks and generating particles. , A constant pressure may be simultaneously applied to the entire surface of the pressure sensitive adhesive sheet and / or the whole (surface) of the adherend. In addition, by adding a second plate in the direction of the second surface of the pressure sensitive adhesive sheet and forming a positive pressure in the space between the pressure sensitive adhesive sheet and the second plate to add air pressure to the pressure sensitive adhesive sheet, it is possible to enter between the lower surface of the pressure sensitive adhesive sheet and the adherend. Fine bubbles can be removed, and the adhesive sheet and the adherend can be adhered more effectively. And when the adhesive sheet is pressed through the pattern plate provided in the first surface direction of the adhesive sheet, it is possible to prevent the adhesive sheet around the adherend from rising along the side of the adherend, whereby the adhesive sheet is Sticking to the side can be prevented. Meanwhile, the pressure-sensitive adhesive sheet may be a semiconductor package carrier sheet including an adhesive layer and a strain holding layer, and the adhesive may be a semiconductor package including a protruding terminal, and in this case, a pressure equal to or higher than a yield value at which plastic strain of the strain holding layer is possible. Is added to at least one of the adhesive sheet and the adherend, the lower surface of the semiconductor package with the protruding terminal can also be in close contact with the semiconductor package carrier sheet, preventing the lifting phenomenon generated between the semiconductor package carrier sheet and the lower surface of the semiconductor package. can do.

As used in the above description, the term “on” refers to a case in which the direct contact is not directly contacted but is positioned opposite to the upper or lower part, and is not only positioned opposite to the entire upper or lower part but also partially. It is also possible to be located opposite, and used to mean facing away from the position or in direct contact with the upper or lower surface.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the above-described embodiments, and the general knowledge in the field of the present invention belongs without departing from the gist of the present invention as claimed in the claims. Those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, the technical protection scope of the present invention will be defined by the claims below.

10: adhesive sheet 20: adhesive
21: protruding terminal 100: adhesive device
110, 210: support frame 120, 220: pressing part
121: first air pressure forming portion 122: second air pressure forming portion
130, 230: first plate 141: first packing member
142: second packing member 143: support piece
144: insertion groove 150: second plate
160: spacing control unit 170: pattern plate
181: first vent 182: second vent
191 housing 192 support table

Claims (16)

A support frame on which the adhesive sheet is supported;
A pressurizing portion for applying pressure to at least one of the adherend and the pressure-sensitive adhesive sheet provided on the first surface of the pressure-sensitive adhesive sheet; And
And a first plate disposed in a direction of the first surface of the adhesive sheet and providing a support surface on which the adherend is supported upon the addition of the pressure. The method according to claim 1,
Further comprising: a first packing member provided between the first plate and the support frame,
The pressing unit,
And a first air pressure forming portion for forming a negative pressure in a space defined by the first plate, the support frame, and the first packing member. The method according to claim 2,
A second plate provided to face the first plate in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface; And
The adhesive device further comprises; a gap adjusting unit for adjusting the distance between the first plate and the second plate. The method according to claim 3,
And a second packing member provided between the second plate and the support frame.
The pressing unit,
And a second air pressure forming unit for forming a positive pressure in a space defined by the second plate, the support frame, and the second packing member. The method according to claim 3,
A support piece extending toward the other one of the edges of one of the first plate and the second plate and bent inward and supporting the support frame;
The other one is formed with an insertion groove corresponding to the support piece,
And the support frame is transferred between the support piece and the other one by adjusting a gap between the first plate and the second plate. The method according to claim 1,
And a pattern plate having a pattern hole to accommodate the adherend, and a pattern plate provided between the first surface of the pressure sensitive adhesive sheet and the first plate. The method according to claim 6,
And the pattern plate has a thickness thinner than that of the adherend. The method according to claim 1,
The adherend is a semiconductor package including at least one protruding terminal on one surface thereof,
The adhesive sheet,
An adhesive layer to which the semiconductor package is attached such that the protruding terminal contacts one surface thereof; And
And a semiconductor package carrier sheet provided on the other surface of the adhesive layer facing the one surface, the semiconductor package carrier sheet including a strain holding layer plastically deformed along the protruding terminal by the pressure. The method according to claim 8,
The pressure-sensitive adhesive device wherein the pressure is equal to or more than a yield value at which plastic deformation of the strain holding layer is possible. The method according to claim 1,
The pressing unit,
A pressure-sensitive adhesive device comprising a roller in the form of a soft material or a brush provided in the direction of the second surface of the pressure-sensitive adhesive sheet facing the first surface, and pressing the second surface of the pressure-sensitive adhesive sheet. Supporting the adhesive sheet on a support frame;
Temporarily attaching the adherend on the first surface of the adhesive sheet;
Disposing the support frame such that the first surface of the adhesive sheet faces the first plate; And
And pressing at least one of the adhesive sheet and the adherend. The method according to claim 11,
And a step of closely contacting the first packing member, the first plate, and the support frame provided between the first plate and the support frame.
The pressing step includes the step of forming a negative pressure in the space defined by the first plate, the support frame and the first packing member. The method according to claim 12,
And adjusting a gap between the second plate and the first plate disposed to face the second surface of the pressure-sensitive adhesive sheet facing the first surface. The method according to claim 13,
And adhering a second packing member, the second plate, and the support frame to each other, provided between the second plate and the support frame.
The pressing step further comprises the step of forming a positive pressure in the space defined by the second plate, the support frame and the second packing member. The method according to claim 11,
And providing a pattern plate having a pattern hole to accommodate the adherend on the first surface of the adhesive sheet. The method according to claim 11,
The adherend is a semiconductor package including at least one protruding terminal on one surface thereof,
The adhesive sheet,
An adhesive layer to which the semiconductor package is attached such that the protruding terminal contacts one surface thereof; And
A semiconductor package carrier sheet provided on the other surface of the adhesive layer opposite to one surface, the semiconductor package carrier sheet including a strain holding layer plastically deformed along the protruding terminal by pressure;
In the pressing step, the pressure-sensitive adhesive method of adding a pressure or more of the yield value capable of plastic deformation of the strain holding layer to at least one of the adhesive sheet and the adherend.

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