KR20190102289A - Exposure apparatus, substrate processing apparatus, exposure method of substrate, and substrate processing method - Google Patents

Abstract

The exposure apparatus 100 includes a light transmitting unit 160, an illuminometer 183, a light blocking unit 190, and a light transmitting control unit 12. The vacuum ultraviolet ray is irradiated to the to-be-processed surface of the board | substrate W by the light transmission part. In the irradiation period of the vacuum ultraviolet rays from the light transmitting portion to the substrate, a part of the vacuum ultraviolet light is received by the illuminometer, and the illuminance of the received vacuum ultraviolet rays is measured. Incident of vacuum ultraviolet rays to the light receiving surface of the illuminance meter is intermittently interrupted by the light shielding portion during the irradiation period. The irradiation of the vacuum ultraviolet ray to the board | substrate by the light transmission part is stopped based on the illumination intensity measured with the illuminometer.

Description

Exposure apparatus, substrate processing apparatus, exposure method of substrate, and substrate processing method

The present invention relates to an exposure apparatus that performs an exposure process on a substrate, a substrate processing apparatus, an exposure method of a substrate, and a substrate processing method.

In recent years, in order to refine | miniaturize the pattern formed in a board | substrate, development of the photolithography technique using the Directed Self Assembly (DSA) of a block copolymer is advanced. In such a photolithography technique, after a heat treatment is performed on a substrate to which the block assembly is applied, one surface of the substrate is exposed to modify the block assembly. In this process, accurate adjustment of the exposure amount of the substrate is required.

Patent Literature 1 describes an exposure apparatus that performs exposure treatment on a film (DSA film) containing an induction self-organizing material on a substrate. The exposure apparatus has a light output portion capable of emitting a cross-sectional band-shaped vacuum ultraviolet ray, and is configured to be movable from the front position to the rear position so that the substrate crosses the path of the vacuum ultraviolet ray from the light output portion. Prior to the exposure treatment, the illuminance of the vacuum ultraviolet ray is detected in advance by the illuminance sensor, and the moving speed of the substrate is calculated based on the detected illuminance so that the vacuum ultraviolet ray of the desired exposure amount is irradiated. At the time of an exposure process, by moving a board | substrate at the calculated movement speed, the vacuum ultraviolet-ray of a desired exposure amount is irradiated to the DSA film on a board | substrate.

Japanese Patent Application Laid-Open No. 2016-183990

When the exposure apparatus is used over a long period of time, the illuminance sensor deteriorates and its characteristics change. For this reason, the frequency of the replacement and maintenance of the illuminance sensor increases. If the illuminance sensor is replaced or repaired frequently, the operating cost of the exposure apparatus increases and the operation efficiency of the exposure apparatus decreases by prolonging the downtime of the exposure apparatus.

An object of the present invention is to provide an exposure apparatus, a substrate processing apparatus, an exposure method, and a substrate processing method capable of improving operation efficiency.

(1) The exposure apparatus which concerns on one aspect of this invention receives a part of vacuum ultraviolet-ray which was provided so that a vacuum ultraviolet-ray could be irradiated to the to-be-processed surface of a board | substrate, and a vacuum ultraviolet-ray from a light-transmitting part to a board | substrate. An illuminometer having a light receiving surface and measuring illuminance of the received vacuum ultraviolet rays, a light shielding portion intermittently blocking the incidence of vacuum ultraviolet rays on the light receiving surface of the illuminance meter during the irradiation period, and the light transmitting portion so as to irradiate the substrate with vacuum ultraviolet rays. In addition to controlling, the light transmitting control unit controls the light transmitting unit to stop the irradiation of the vacuum ultraviolet ray to the substrate based on the illuminance measured by the illuminometer.

In this exposure apparatus, a vacuum ultraviolet ray is irradiated to the to-be-processed surface of a board | substrate by a light transmitting part. In the irradiation period of the vacuum ultraviolet rays from the light transmitting portion to the substrate, a part of the vacuum ultraviolet light is received by the illuminometer, and the illuminance of the received vacuum ultraviolet rays is measured. Incident of vacuum ultraviolet rays to the light receiving surface of the illuminometer is intermittently interrupted by the light shielding portion during the irradiation period. Irradiation of the vacuum ultraviolet ray to the board | substrate by a light transmission part is stopped based on the illuminance measured with the illuminometer.

According to this configuration, since vacuum ultraviolet rays are irradiated to the illuminometer intermittently, the rate of deterioration of the illuminometer decreases. For this reason, an illuminometer will lengthen life. Therefore, it is not necessary to frequently replace and repair the illuminometer. Thereby, while operating cost of an exposure apparatus can be reduced, the downtime of an exposure apparatus can be minimized. As a result, the operation efficiency of the exposure apparatus can be improved.

(2) The illuminance meter is provided at a position capable of receiving a part of the vacuum ultraviolet light from the light transmitting portion during the irradiation period, and the light shielding portion is movable to intermittently block the incidence of the vacuum ultraviolet light on the light receiving surface of the illuminometer during the irradiation period. The light blocking member and the first driving unit for moving the light blocking member may be included. In this case, incidence of vacuum ultraviolet rays on the light receiving surface of the illuminometer can be interrupted intermittently with a simple configuration.

(3) The light shielding portion may include a second driving portion which alternately moves the illuminometer to a first position capable of receiving a part of the vacuum ultraviolet rays from the light transmitting portion in the irradiation period and a second position in which the vacuum ultraviolet rays from the light transmitting portion cannot be received. do. In this case, incidence of vacuum ultraviolet rays on the light receiving surface of the illuminometer can be interrupted intermittently with a simple configuration.

(4) The light transmitting portion may be configured to irradiate vacuum ultraviolet rays to the entire region on one surface of the substrate and the region outside the substrate, and the illuminometer may be located in the region outside the substrate at least upon incidence of the vacuum ultraviolet rays on the light receiving surface in the irradiation period. . In this case, the illuminometer can measure the illuminance of the vacuum ultraviolet ray without interfering with the substrate.

(5) The substrate has a circular shape, and the emission portion of the vacuum ultraviolet ray in the light transmitting portion has a rectangular shape containing a circular area corresponding to the area of the substrate, and the light receiving surface of the illuminometer emits light of the light transmitting portion in the irradiation period. The vacuum ultraviolet light emitted from the corner region except for the circular region in the portion may be arranged to be movable or fixed to a position where it can be incident. In this case, the illuminometer can be arranged without increasing the size of the exposure apparatus.

(6) The illuminometer may be arranged such that the light receiving surface is positioned at a constant height relative to the target surface of the substrate in the irradiation period. In this case, the attenuation rate of the vacuum ultraviolet light from the light transmitting part to the target surface of the substrate is correlated with the attenuation rate of the vacuum ultraviolet light from the light transmitting part to the light receiving surface of the illuminometer. For this reason, the illuminance of the vacuum ultraviolet-ray irradiated to the to-be-processed surface of a board | substrate can be acquired correctly based on the illuminance measured with an illuminometer. Thereby, the exposure amount of a board | substrate can be calculated correctly based on the roughness measured with an illuminometer.

(7) The illuminometer may be arranged such that the light receiving surface is positioned at the same height as the surface to be processed of the substrate in the irradiation period. In this case, the attenuation rate of the vacuum ultraviolet light from the light transmitting part to the target surface of the substrate is the same as that of the vacuum ultraviolet light from the light transmitting part to the light receiving surface of the illuminometer. Thereby, the illumination intensity of the vacuum ultraviolet-ray irradiated to the to-be-processed surface of a board | substrate becomes the same as the illumination intensity measured with an illuminometer. As a result, the exposure amount of a board | substrate can be calculated more easily based on the illuminance measured with an illuminometer.

(8) The exposure apparatus is provided in a processing chamber accommodating a substrate to be processed, and in the processing chamber, below the light transmitting portion, a placing portion on which the substrate is placed, and the number of substrates between the processing chamber and the outside. (Iii) A mounting part may be further provided which controls a mounting part so that a mounting part may move to a 3rd position, and a mounting part may move to a 4th position above a 3rd position at the time of the emission of the vacuum ultraviolet-ray of a light transmitting part. In this case, it can also be made easily between inside and outside of a processing chamber, without interfering a board | substrate with a light transmission part. In the irradiation of vacuum ultraviolet rays from the light transmitting portion to the substrate, the light source portion and the substrate are close to each other, so that the substrate can be exposed efficiently.

(9) The illuminometer may move in the vertical direction following the movement of the placing unit. In this case, even during the movement of the mounting portion, the light receiving surface of the illuminometer is positioned at a constant height relative to the surface to be processed of the substrate during the irradiation period of vacuum ultraviolet rays. For this reason, even when a vacuum ultraviolet ray is irradiated to a board | substrate during the movement of a mounting part, the accurate exposure amount of a board | substrate is calculated. Therefore, the exposure of the substrate can be completed in a shorter time by irradiating the vacuum ultraviolet rays to the substrate also in the process of moving the mounting portion to the third position and the fourth position after the substrate is brought into the processing chamber.

(10) The mounting portion may include a first portion on which the substrate is placed and a second portion on which the illuminometer is arranged at the time of receiving the ultraviolet light. In this case, the illuminometer can be easily moved in the vertical direction in accordance with the movement of the placing part.

(11) A substrate processing apparatus according to another aspect of the present invention includes a coating treatment portion for forming a film on a substrate by applying a treatment liquid to the substrate, a heat treatment portion for heat-treating the substrate on which the film is formed by the coating treatment portion, and a heat treatment portion by the heat treatment portion. The exposure apparatus which concerns on one aspect of this invention which exposes the board | substrate which were used, and the developing process part which develops the film | membrane of a board | substrate by supplying a solvent to the board | substrate exposed by the exposure apparatus are provided.

In this substrate processing apparatus, a film | membrane is formed in a board | substrate by apply | coating a process liquid to a board | substrate by a coating process part. The substrate on which the film is formed by the coating treatment section is heat treated by the heat treatment section. The board | substrate heat-treated by the heat processing part is exposed by said exposure apparatus. The film of a board | substrate is developed by supplying a solvent to the board | substrate exposed by the exposure apparatus by the developing process part.

In the exposure apparatus, since the vacuum ultraviolet ray is intermittently irradiated to the illuminometer, the rate of deterioration of the illuminometer decreases, and the illuminometer extends its life. Thereby, while operating cost of an exposure apparatus can be reduced, the downtime of an exposure apparatus can be minimized. As a result, the operation efficiency of the exposure apparatus can be improved.

(12) The processing liquid may include an induction self-organizing material. In this case, the substrate to which the treatment liquid containing the induced self-organizing material is coated is subjected to heat treatment, whereby microphase separation occurs on one surface of the substrate. Moreover, the board | substrate with which the pattern of two types of polymers was formed by micro phase separation is exposed and developed. Thereby, one of two types of polymers is removed and a micronized pattern can be formed.

(13) An exposure method according to still another aspect of the present invention comprises the steps of irradiating a vacuum ultraviolet ray to a target surface of a substrate by a light transmitting portion, and vacuum ultraviolet ray by an illuminometer during the irradiation period of vacuum ultraviolet light from the light transmitting portion to the substrate. Receiving a portion of the light and measuring the illuminance of the received vacuum ultraviolet rays, intermittently blocking the incidence of vacuum ultraviolet rays on the light-receiving surface of the illuminometer by the light shielding portion during the irradiation period, and the illuminance measured by the illuminometer And stopping the irradiation of the vacuum ultraviolet rays to the substrate by the light transmitting portion based on the step.

According to the exposure method, since the vacuum ultraviolet ray is irradiated to the illuminometer intermittently, the rate of deterioration of the illuminometer is lowered and the illuminometer becomes longer in life. Thereby, while operating cost of an exposure apparatus can be reduced, the downtime of an exposure apparatus can be minimized. As a result, the operation efficiency of the exposure apparatus can be improved.

(14) A substrate processing method according to still another aspect of the present invention includes the steps of forming a film on a substrate by applying a processing liquid to a target surface of the substrate by a coating processing portion, and forming a substrate on which a film is formed by the coating processing portion by a heat treatment portion. A heat treatment step, an exposure method according to another aspect of the present invention for exposing a substrate heat-treated by the heat treatment unit by an exposure apparatus, and supplying a solvent to the to-be-processed surface of the substrate exposed by the exposure apparatus. Developing the film of the substrate.

According to this substrate processing method, the substrate after formation of the film and before development is exposed by vacuum ultraviolet rays. In the exposure method, since the vacuum ultraviolet ray is irradiated to the illuminometer intermittently, the rate of deterioration of the illuminometer is lowered and the illuminometer becomes longer in life. Thereby, while operating cost of an exposure apparatus can be reduced, the downtime of an exposure apparatus can be minimized. As a result, the operation efficiency of the exposure apparatus can be improved.

According to this invention, it becomes possible to improve the operation efficiency of an exposure apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS It is typical sectional drawing which shows the structure of the exposure apparatus which concerns on 1st Embodiment of this invention.
2 is a diagram for explaining an arrangement of an illuminometer.
3 is a cross-sectional perspective view of the exposure apparatus.
4 is a longitudinal sectional view of the exposure apparatus.
5 is a graph showing the relationship between the oxygen concentration in the case and the exhaust time.
6 is a graph showing the relationship between the illuminance of vacuum ultraviolet rays irradiated onto the substrate by the light source unit and the lighting time of the light source unit.
FIG. 7 is a functional block diagram illustrating the configuration of the controller of FIG. 1.
8 is a schematic view for explaining the operation of the exposure apparatus.
9 is a schematic view for explaining the operation of the exposure apparatus.
It is a schematic diagram for demonstrating operation | movement of an exposure apparatus.
It is a schematic diagram for demonstrating operation | movement of an exposure apparatus.
12 is a flowchart illustrating an example of an exposure process performed by the control unit of FIG. 7.
FIG. 13 is a flowchart illustrating an example of an exposure process performed by the controller of FIG. 7.
14 is a flowchart illustrating an example of an exposure process performed by the control unit of FIG. 7.
It is a typical block diagram which shows the whole structure of the substrate processing apparatus provided with the exposure apparatus of FIG.
It is a schematic diagram which shows an example of the process of the board | substrate with the substrate processing apparatus of FIG.
It is sectional perspective view of the exposure apparatus in 2nd Embodiment of this invention.
18 is a longitudinal cross-sectional view of the exposure apparatus of FIG. 17.
It is sectional perspective view of the exposure apparatus in 3rd Embodiment of this invention.
20 is a longitudinal cross-sectional view of the exposure apparatus of FIG. 19.

[1] First embodiment

(1) Configuration of the exposure apparatus

Hereinafter, the exposure apparatus, the substrate processing apparatus, the exposure method, and the substrate processing method which concern on 1st Embodiment of this invention are demonstrated using drawing. In addition, in the following description, a board | substrate is a board | substrate for flat panel displays (FPD), such as a semiconductor substrate, a liquid crystal display device, or an organic electroluminescent (EL) display apparatus, a board for optical disks, a board for magnetic disks, and a magneto-optical disk. It means a substrate, a substrate for photomask or a substrate for solar cell.

FIG. 1: is a schematic cross section which shows the structure of the exposure apparatus which concerns on 1st Embodiment of this invention. As shown in FIG. 1, the exposure apparatus 100 includes the control unit 110, the processing chamber 120, the blocking unit 130, the water supply unit 140, the lifting unit 150, the light transmitting unit 160, and the replacement unit. 170, a measurement unit 180, and a light shielding unit 190. The control unit 110 acquires the measured value from the measurement unit 180, and operates the blocking unit 130, the lifting unit 150, the light transmitting unit 160, the replacement unit 170, and the light blocking unit 190. To control. The function of the control unit 110 will be described later.

The processing chamber 120 includes a case 121 having an upper opening and an inner space, an annular member 122, and a covering member 123. The conveyance opening 121a for conveying the board | substrate W of a process target is formed in the side surface of the case 121 between the inside and the exterior of the case 121. In the present embodiment, a film (hereinafter referred to as a directed self assembly (DSA) film) containing an induced self-organizing material is formed on the substrate W to be processed. Moreover, the opening part 121b through which the connection member 152 of the elevation part 150 mentioned later passes is formed in the bottom face of the case 121. As shown in FIG.

The housing 161 of the light transmitting portion 160 described later is disposed above the case 121 through the annular member 122, whereby the upper opening of the case 121 is closed. Seal members s1 and s2 are mounted between the case 121 and the annular member 122, and between the annular member 122 and the housing 161, respectively. In addition, the covering member 123 is mounted between the case 121 and the housing 161 so as to cover the outer circumferential surface of the annular member 122.

The blocking unit 130 includes a shutter 131, a rod-shaped connecting member 132, and a driving device 133. The connecting member 132 connects the shutter 131 and the driving device 133. The drive device 133 is a step motor, for example. The drive apparatus 133 moves the shutter 131 between the open position in which the shutter 131 opens the conveyance opening 121a, and the closed position in which the shutter 131 closes the conveyance opening 121a.

The seal member 131a is attached to the shutter 131. In the state where the shutter 131 is in the closed position, the inside of the case 121 is sealed by bringing the seal member 131a into close contact with the portion surrounding the conveyance opening 121a in the case 121. In addition, in order to prevent friction between the seal member 131a and the case 121, the drive device 133 moves the shutter 131 to the case 121 when the shutter 131 is moved between the open position and the closed position. In the state spaced apart from the up and down direction.

The drive device 133 is equipped with position sensors 133a and 133b for detecting the upper limit position and the lower limit position of the shutter 131, respectively. The position sensors 133a and 133b give the detection result to the control unit 110. In this embodiment, the drive device 133 and the drive devices 153 and 192 described later are provided outside the processing chamber 120. For this reason, even when dust generate | occur | produces by the drive of the drive apparatus 133, 153, 192, invasion of the dust directly in the case 121 is prevented.

The water supply unit 140 includes, for example, a disk-shaped support plate 141 and a plurality of (three in this example) support pins 142. The supporting plate 141 is disposed in the case 121 in a horizontal posture. The opening part 141a through which the connection member 152 of the lifting part 150 mentioned later passes through is formed in the center part of the support plate 141. As shown in FIG. The plurality of support pins 142 extend upward from the top surface of the support plate 141 to surround the opening 141a. The substrate W to be processed can be placed on the upper ends of the plurality of support pins 142.

The lifting unit 150 includes a flat mounting plate 151, a rod-shaped connecting member 152, and a driving device 153. The placement plate 151 is disposed in the case 121 in a horizontal position above the support plate 141 of the water supply unit 140. The mounting plate 151 is provided with a plurality of through holes 151a respectively corresponding to the plurality of support pins 142 of the support plate 141.

The connection member 152 is disposed to extend up and down through the opening 121b of the case 121 and the opening 141a of the support plate 141, and the driving device 153 is disposed below the case 121. The connecting member 152 connects the mounting plate 151 and the drive device 153. The seal member s3 is disposed between the outer circumferential surface of the connecting member 152 and the inner circumferential surface of the opening 121b so that the connecting member 152 can slide in the vertical direction.

The drive device 153 is a step motor, for example, and is placed between a processing position above the upper end portions of the plurality of support pins 142 and a standby position below the upper end portions of the plurality of support pins 142 ( 151 is moved in the vertical direction. In the state where the mounting plate 151 is in the standby position, the plurality of support pins 142 are inserted through the plurality of through holes 151a, respectively. The drive apparatus 153 is equipped with the position sensors 153a and 153b which detect the upper limit position and the lower limit position of the mounting board 151, respectively. The position sensors 153a and 153b provide the detection result to the control unit 110.

The light transmitting unit 160 includes a housing 161 having a lower opening and an inner space, a light transmitting plate 162, a planar light source unit 163, and a power supply device 164. In the present embodiment, the light transmitting plate 162 is a quartz glass plate. As the material of the light-transmitting plate 162, other materials that transmit the vacuum ultraviolet rays described later may be used. As described above, the housing 161 is disposed above the case 121 so as to close the upper opening of the case 121. The light transmitting plate 162 is attached to the housing 161 so as to close the lower opening of the housing 161. The inner space of the case 121 and the inner space of the housing 161 are interposed so as to be optically accessible by the light transmitting plate 162.

The light source unit 163 and the power supply unit 164 are accommodated in the housing 161. In this embodiment, the light source part 163 is comprised by arrange | positioning horizontally the several rod-shaped light source which radiates the vacuum ultraviolet-ray with a wavelength about 120 nm or more and about 230 nm or less at predetermined intervals. Each light source may be xenon excimer lamp, for example, another excimer lamp, deuterium lamp, etc. may be sufficient as it. The light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light amount distribution in the case 121 through the light transmitting plate 162. The area of the emission surface of vacuum ultraviolet-ray in the light source part 163 is larger than the area of the to-be-processed surface of the board | substrate W. FIG. The power supply device 164 supplies power to the light source unit 163.

The replacement unit 170 includes pipes 171p, 172p, and 173p, valves 171 ′, 172 ｖ, and a suction device 173. Pipes 171p and 172p are connected between the air supply port of the case 121 and the supply source of the inert gas. In this embodiment, an inert gas is nitrogen gas, for example. Valves 171 'and 172' are fitted into the pipes 171p and 172p.

Inert gas is supplied into the case 121 from the side of the support plate 141 through the pipe 171p. Inert gas is supplied into the case 121 from below the support plate 141 through the pipe 172p. The flow rate of the inert gas is adjusted by the valves 171ｖ, 172ｖ. In this embodiment, nitrogen gas is used as an inert gas.

The pipe 173p branches into the branch pipe 173a and the branch pipe 173b. The branch pipe 173a is connected to the exhaust port of the case 121, and an end portion of the branch pipe 173b is disposed between the case 121 and the shutter 131. The suction device 173 is fitted to the pipe 173p. The valve 173k is fitted into the branch pipe 173b. The suction device 173 is an ejector, for example. The pipe 173p is connected to the exhaust facility. The suction device 173 discharges the atmosphere in the case 121 through the branch pipe 173a and the pipe 173p. In addition, the suction device 173 discharges the atmosphere between the case 121 and the shutter 131 through the branch pipe 173b and the pipe 173p together with dust generated by the movement of the shutter 131. The gas discharged by the suction device 173 is made harmless by the exhaust installation.

The measurement unit 180 includes an oxygen concentration meter 181, an ozone concentration meter 182, and an illuminometer 183. The oxygen concentration meter 181, the ozone concentration meter 182, and the illuminometer 183 are connected to the control unit 110 via connection ports p1, p2, and p3 provided in the case 121, respectively. The oxygen concentration meter 181 is, for example, a galvanic oxygen sensor or a zirconia oxygen sensor, and measures the oxygen concentration in the case 121. The ozone concentration meter 182 measures the ozone concentration in the case 121.

The illuminometer 183 includes light receiving elements such as a photodiode and measures the illuminance of the vacuum ultraviolet light from the light source unit 163 irradiated to the light receiving surface of the light receiving element. Here, illuminance is the uniformity of the vacuum ultraviolet-ray irradiated per unit area of a light receiving surface. The unit of illuminance is represented by "W / m <^2>", for example. In the present embodiment, the illuminometer 183 is attached to the mounting plate 151 so that the light receiving surface of the light receiving element is located at substantially the same height as the surface to be processed of the substrate W. As shown in FIG. 2 is a diagram for explaining the arrangement of the illuminometer 183.

As shown in FIG. 2, the light transmitting plate 162 has a rectangular shape, and the substrate W has a circular shape. For this reason, the vicinity of the edge part of the transparent plate 162 does not overlap with the board | substrate W of a process position when it sees from a plane. Here, the mounting plate 151 has a circular portion 151b overlapping with the center portion of the floodlight plate 162 and a corner portion 151c overlapping with one corner portion of the floodlight plate 162 when viewed in plan view. It includes. At the time of an exposure process, the board | substrate W is mounted in the circular part 151b. The illuminometer 183 is attached to the edge part 151c. According to this arrangement, the illuminance meter 183 can measure the illuminance of the vacuum ultraviolet ray without interfering with the substrate W. FIG.

3 is a cross-sectional perspective view of the exposure apparatus 100 of FIG. 1. 4 is a longitudinal cross-sectional view of the exposure apparatus 100 of FIG. 3. In FIG. 3 and FIG. 4, in order to make the internal structure of the exposure apparatus 100 easy to understand, illustration of some component is abbreviate | omitted. As shown in FIG. 3 and FIG. 4, the light blocking portion 190 includes the light blocking member 191, the driving device 192, the guide portion 193, the rod-shaped support member 194, and the plate-shaped connecting member 195. ).

The drive device 192 is, for example, an air cylinder and has a drive shaft 192a that can move back and forth in one direction. The drive device 192 is attached to the outer surface of the case 121. The guide part 193 is attached to the outer surface of the case 121 and guides the support member 194 to be movable in a direction parallel to the advancing direction of the drive shaft 192a. The support member 194 is provided to penetrate the side wall of the case 121 through the guide portion 193.

The light shielding member 191 has a cross-sectional reverse L shape formed of the horizontal plate 191a and the vertical plate 191b. The lower end of the vertical plate 191b is mounted to one end of the support member 194 in the case 121. The connection member 195 connects the other end of the support member 194 and the front end of the drive shaft 192a of the drive device 192 outside the case 121.

As the drive shaft 192a of the drive device 192 moves forward and backward, as shown by an arrow in FIG. 4, the light blocking member 191 moves between the light shielding position and the non-light shielding position. Here, the light shielding position is the position of the light shielding member 191 which the horizontal plate 191a shields the vacuum ultraviolet rays irradiated from the light source unit 163 to the illuminometer 183. The non-shielding position is a position of the shielding member 191 in which the horizontal plate 191a does not shield the vacuum ultraviolet rays irradiated from the light source unit 163 to the illuminometer 183. In FIG. 4, the light shielding member 191 in a light shielding position is shown by the solid line, and the light shielding member 191 in a non-shielding position is shown by the dashed-dotted line.

(2) Outline operation of the exposure apparatus

In the exposure apparatus 100 of FIG. 1, an exposure process is performed by irradiating a vacuum ultraviolet ray to the substrate W from the light source unit 163. However, when the oxygen concentration in the case 121 is high, the oxygen molecules absorb the vacuum ultraviolet rays to separate them into oxygen atoms, and ozone is generated when the separated oxygen atoms recombine with other oxygen molecules. In this case, the vacuum ultraviolet rays reaching the substrate W are attenuated. The attenuation of the vacuum ultraviolet ray is larger than that of the ultraviolet ray having a wavelength longer than about 230 nm.

Here, at the time of an exposure process, the atmosphere in the case 121 is substituted by the substitution part 170 by inert gas. As a result, the oxygen concentration in the case 121 decreases. 5 is a graph showing the relationship between the oxygen concentration in the case 121 and the exhaust time. 5 represents the oxygen concentration, and the abscissa represents the exhaust time. As shown in FIG. 5, the longer the exhaust time, the lower the oxygen concentration in the case 121. At the time t0 when the oxygen concentration measured by the oxygen concentration meter 181 falls to a predetermined exposure start concentration, irradiation of vacuum ultraviolet rays from the light source unit 163 to the substrate W is started.

Here, the exposure start concentration is an oxygen concentration that is predetermined so that vacuum ultraviolet rays can reach the light source unit 163 from the light source unit 163 and ozone does not damage the film formed on the surface to be processed of the substrate W. Although the specific exposure start concentration differs depending on the type and component of the film formed on the substrate W to be processed, the oxygen concentration is higher than 1% and less than the oxygen concentration in the atmosphere, which is considered that little oxygen remains in the case 121. low. The oxygen concentration drops to 1% at the time point t1. In the present embodiment, the irradiation of vacuum ultraviolet rays is started at a time point t0 which is earlier by Δt than the time point t1 at which the oxygen concentration drops to 1%. Thereby, the time required for an exposure process can be shortened.

When the exposure amount of the vacuum ultraviolet rays irradiated to the substrate W by the light source unit 163 reaches a predetermined set exposure amount, the irradiation of the vacuum ultraviolet rays is stopped, and the exposure process ends. Here, an exposure amount is energy of the vacuum ultraviolet-ray irradiated per unit area of the to-be-processed surface of the board | substrate W at the time of an exposure process. The unit of exposure amount is represented by "J / m <^2>", for example. Therefore, the exposure amount of vacuum ultraviolet-ray is acquired by integration of the illumination intensity of the vacuum ultraviolet-ray measured by the illuminometer 183.

6 is a graph showing the relationship between the illuminance of vacuum ultraviolet rays emitted from the light source unit 163 and the lighting time of the light source unit 163. The vertical axis of FIG. 6 represents illuminance, and the horizontal axis represents lighting time. The light source of the light source unit 163 that emits vacuum ultraviolet rays is relatively expensive. For this reason, it is preferable to cut off the electric power supplied to the light source part 163 from the power supply device 164, and to turn off the light source part 163 in the period which does not irradiate a vacuum ultraviolet-ray to the board | substrate W. FIG. Thereby, the life of the light source part 163 can be extended.

However, immediately after the light source 163 is turned on, as shown in FIG. 6, the illuminance of the vacuum ultraviolet ray irradiated onto the substrate W decreases with time, and converges to a constant value LV after a predetermined time. For this reason, it is difficult to measure the roughness which has fixed value LV before an exposure process. In this embodiment, vacuum ultraviolet rays are irradiated to the substrate W and the illuminometer 183 simultaneously during the exposure process. Therefore, when the illumination intensity of the vacuum ultraviolet ray irradiated to the board | substrate W changes, the illumination intensity of the vacuum ultraviolet ray measured by the illuminometer 183 also changes in this way.

As described above, in the present embodiment, the illuminometer 183 is provided so that the light receiving surface of the light receiving element is positioned at substantially the same height as the surface to be processed of the substrate W. As shown in FIG. Therefore, even in the case where the vacuum ultraviolet rays are partially absorbed and attenuated by the oxygen molecules remaining between the substrate W and the light source unit 163, they are substantially the same as the surface to be processed of the substrate W and the light receiving surface of the illuminometer 183. The degree of vacuum ultraviolet light reaches. The illuminance measured by the illuminometer 183 is equal to the illuminance of the vacuum ultraviolet ray irradiated onto the target surface of the substrate W. FIG. As a result, the illuminance of the vacuum ultraviolet ray reaching the substrate W can be accurately measured with a simple configuration.

On the other hand, if the illuminometer 183 continues to be irradiated with vacuum ultraviolet rays for a long time, the illuminometer 183 tends to deteriorate, and the lifetime of the illuminometer 183 decreases. In addition, the frequency of performing maintenance work such as calibration of the illuminometer 183 increases. In this embodiment, the light shielding member 191 moves between the light shielding position and the non-light shielding position during the exposure process. In this case, the rate of degradation of the illuminometer 183 decreases as compared with the case where the vacuum ultraviolet ray is intermittently irradiated to the illuminometer 183, and the vacuum ultraviolet ray is continuously irradiated to the illuminometer 183. As a result, the illuminometer 183 increases the lifespan. Moreover, the frequency of the maintenance work of the illuminometer 183 can be reduced.

In this structure, the illuminance of the vacuum ultraviolet ray irradiated to the substrate W is not measured in the period in which the light shielding member 191 is in the light shielding position (hereinafter referred to as light shielding period). For this reason, it is preferable that the illuminance of the vacuum ultraviolet-ray irradiated to the board | substrate W is interpolated in light shielding period. Interpolation of the illuminance in the light shielding period can be performed based on the illuminance measured by the illuminometer 183 before and after the light shielding period. For example, by connecting the value of the illuminance measured before and after the shading period with a spline curve, the illuminance in the shading period can be splined interpolated.

(3) control unit

FIG. 7 is a functional block diagram showing the configuration of the controller 110 of FIG. 1. As shown in FIG. 7, the control unit 110 includes the occlusion control unit 1, the elevation control unit 2, the exhaust control unit 3, the air supply control unit 4, the concentration acquisition unit 5, and the concentration comparison unit 6. And a light shielding control unit 7, an illuminance obtaining unit 8, an illuminance interpolation unit 9, an exposure amount calculating unit 10, an exposure amount comparing unit 11, and a light transmitting control unit 12.

The control unit 110 is configured by, for example, a CPU (central processing unit) and a memory. The control program is stored in advance in the memory of the control unit 110. By the CPU of the control unit 110 executing the control program stored in the memory, the function of each unit of the control unit 110 is realized.

The occlusion control unit 1 controls the drive device 133 so that the shutter 131 moves between the occlusion position and the open position based on the detection result of the position sensors 133a and 133b in FIG. 1. The lifting control unit 2 controls the drive unit 153 to move the mounting plate 151 between the standby position and the processing position based on the detection results of the position sensors 153a and 153b in FIG. 1.

The exhaust control unit 3 controls the suction device 173 and the valve 173ｖ to exhaust the atmosphere in the case 121 of FIG. 1 and the atmosphere between the case 121 and the shutter 131. The air supply control unit 4 controls the valves 171 ′ and 172 ′ in FIG. 1 to supply an inert gas into the case 121.

The concentration acquisition part 5 acquires the value of the oxygen concentration measured by the oxygen concentration meter 181 of FIG. The concentration comparison unit 6 compares the oxygen concentration measured by the concentration acquisition unit 5 with the exposure start concentration.

The light blocking control unit 7 controls the driving device 192 so that the light blocking member 191 of FIG. 4 reciprocates between the light blocking position and the non-shielding position. The illuminance acquisition part 8 acquires the value of the illuminance of the vacuum ultraviolet-ray measured by the illuminometer 183 of FIG. The illuminance interpolation unit 9 irradiates the substrate W in the light shielding period based on the control timing of the light shielding member 191 by the light shielding control unit 7 and the value of the illuminance acquired by the illuminance acquisition unit 8. The intensity of vacuum ultraviolet light is interpolated.

The exposure amount calculation unit 10 uses the substrate W from the illuminance of the vacuum ultraviolet light obtained by the illuminance acquisition unit 8 and the illuminance of the vacuum ultraviolet light interpolated by the illuminance interpolation unit 9 and the light source unit 163 of FIG. 1. The exposure amount of the vacuum ultraviolet ray irradiated to the board | substrate W is calculated based on the irradiation time of the vacuum ultraviolet-ray to. The exposure amount comparison unit 11 compares the exposure amount calculated by the exposure amount calculation unit 10 with a predetermined set exposure amount.

The light emission control unit 12 controls the supply of power from the power supply unit 164 to the light source unit 163 in FIG. 1 so that the light source unit 163 emits vacuum ultraviolet rays based on the comparison result by the concentration comparison unit 6. . In addition, the light projection control unit 12 provides the exposure amount calculation unit 10 as a time for supplying electric power from the power supply device 164 to the light source unit 163 as the irradiation time of vacuum ultraviolet light from the light source unit 163 to the substrate W. do. In addition, the light projection control unit 12 controls the power supply device 164 so that the light source unit 163 stops the emission of vacuum ultraviolet rays based on the comparison result by the exposure amount comparison unit 11.

(4) exposure treatment

8-11 is a schematic diagram for demonstrating operation | movement of the exposure apparatus 100. FIG. In FIGS. 8-11, in order to make the structure of the case 121 and the housing 161 easy to understand, illustration of some components is abbreviate | omitted and the case 121 and the housing 161 of the case 161 are omitted. The outline is indicated by a dashed line. 12, 13, and 14 are flowcharts showing an example of exposure processing performed by the control unit 110 of FIG. 7. Hereinafter, the exposure process by the control part 110 is demonstrated, referring FIGS. 8-11.

As shown in FIG. 8, in the initial state of the exposure process, the shutter 131 is in the closed position, the placing plate 151 is in the standby position, and the light blocking member 191 is in the non-shielding position. In addition, the oxygen concentration in the case 121 is measured by the oxygen concentration meter 181 at all times or periodically, and is acquired by the concentration acquisition part 5. At this point in time, the oxygen concentration in the case 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere.

First, the occlusion control part 1 moves the shutter 131 to an open position, as shown in FIG. 9 (step S1). Thereby, the board | substrate W of a process target can be mounted in the upper end part of the some support pin 142 via the conveyance opening 121a. In this example, the board | substrate W is mounted on the upper end part of the some support pin 142 by the conveying apparatus 220 of FIG. 15 mentioned later.

Next, the lifting control unit 2 determines whether or not the substrate W is placed on the upper ends of the plurality of support pins 142 (step S2). When the board | substrate W is not mounted, the lifting control part 2 waits until the board | substrate W is mounted on the upper end part of the some support pin 142. When the substrate W is placed, the lifting control unit 2 moves the shutter 131 to the closed position (step S3).

Next, the exhaust control part 3 discharges the atmosphere in the case 121 by the suction apparatus 173 of FIG. 1 (step S4). In addition, the air supply control unit 4 supplies an inert gas into the case 121 through the pipes 171p and 172p in FIG. 1 (step S5). The processing of steps S4 and S5 may be started either first or simultaneously. Thereafter, the lifting control unit 2 raises the placement plate 151 from the standby position, as shown in FIG. 10, to place the substrate W on the placement plate 151 (step S6). At this point, the height of the mounting surface of the substrate W and the light receiving surface of the illuminometer 183 coincide.

Next, the concentration comparison unit 6 determines whether or not the oxygen concentration in the case 121 has dropped to the exposure start concentration (step S7). When oxygen concentration does not fall to exposure start concentration, the density comparison part 6 waits until oxygen concentration falls to exposure start concentration. When the oxygen concentration decreases to the exposure start concentration, the light projection control unit 12 emits vacuum ultraviolet rays by the light source unit 163 (step S8). Thereby, the vacuum ultraviolet-ray is irradiated to the board | substrate W from the light source part 163 through the translucent plate 162, and exposure of the DSA film L3 formed in the to-be-processed surface is started. In addition, the lifting control unit 2 starts the raising of the mounting plate 151 (step S9).

Subsequently, the illuminance acquisition unit 8 starts measuring the illuminance of the vacuum ultraviolet ray in the illuminometer 183 and acquires the measured illuminance from the illuminometer 183 (step S10). In addition, the light shielding control unit 7 moves the light shielding member 191 reciprocally between the light shielding position and the non-light shielding position (step S11). The processing of steps S8 to S11 may be started either first or simultaneously.

The illuminance interpolation part 9 interpolates the illuminance of the vacuum ultraviolet-ray of a light shielding period (step S12). The exposure amount calculation unit 10 integrates the illuminance of the vacuum ultraviolet ray acquired by the illuminance acquisition unit 8 and the illuminance of the vacuum ultraviolet ray interpolated by the illuminance interpolation unit 9 to determine the vacuum ultraviolet ray irradiated onto the substrate W. The exposure amount is calculated (step S13).

Thereafter, the elevating control unit 2 determines whether the placing plate 151 has reached the processing position (step S14). When the mounting plate 151 has not reached the processing position, the lifting control unit 2 proceeds to the processing of step S16. On the other hand, when the mounting plate 151 reaches the processing position, the lifting control unit 2 stops the rising of the mounting plate 151 (step S15). As shown in FIG. 11, when the mounting plate 151 reaches the processing position, the substrate W is close to the light transmitting plate 162.

Next, the exposure amount comparison unit 11 determines whether or not the exposure amount calculated by the exposure amount calculation unit 10 has reached the set exposure amount (step S16). When the exposure amount does not reach the set exposure amount, the exposure amount comparison unit 11 returns to the processing of step S10. The processes of steps S10 to S16 are repeated until the exposure amount reaches the set exposure amount.

The light emission control part 12 stops the emission of the vacuum ultraviolet-ray from the light source part 163 until the exposure amount reaches the set exposure amount (step S17). Moreover, the illuminance acquisition part 8 stops the measurement of the illuminance by the illuminometer 183 (step S18). In addition, the light shielding control unit 7 stops the movement of the light blocking member 191 (step S19). In this example, the light blocking member 191 is returned to the non-light blocking position.

Next, the lifting control unit 2 lowers the mounting plate 151 to the standby position as shown in FIG. 10 (step S20). Thereby, the board | substrate W may be made into the some support pin 142 from the mounting board 151. FIG. Next, the exhaust control unit 3 stops discharging the atmosphere in the case 121 by the suction device 173 (step S21). In addition, the air supply control unit 4 stops the supply of the inert gas from the pipes 171p and 172p into the case 121 (step S22). The processing of steps S17 to S22 may be started either first or simultaneously.

Thereafter, the occlusion control unit 1 moves the shutter 131 to the open position as shown in FIG. 9 (step S23). Thereby, the board | substrate W after exposure can be carried out from the some support pin 142 to the exterior of the case 121 through the conveyance opening 121a. In this example, the board | substrate W is carried out from the some support pin 142 to the exterior of the case 121 by the conveying apparatus 220 of FIG. 15 mentioned later.

Next, the occlusion control part 1 determines whether the board | substrate W was carried out on the some support pin 142 (step S24). When the board | substrate W is not carried out, the occlusion control part 1 waits until the board | substrate W is carried out on the some support pin 142. When the board | substrate W is carried out, the blocking control part 1 moves the shutter 131 to a closed position as shown in FIG. 8 (step S25), and complete | finishes an exposure process. By repeating the above operation, the plurality of substrates W can be subjected to exposure processing in sequence.

In the above exposure process, vacuum ultraviolet rays are irradiated from the light source unit 163 to the substrate W before the placement plate 151 is moved to the processing position. In this case, the vacuum ultraviolet ray is irradiated to the board | substrate W also in the process of moving the mounting plate 151 from a standby position to a process position. For this reason, the exposure of the board | substrate W completes in a short time. Thereby, the efficiency of the exposure process of the board | substrate W can be improved more.

In addition, vacuum ultraviolet-ray may be irradiated to the board | substrate W from the light source part 163 after the mounting plate 151 is moved to a processing position. That is, the processes of steps S9, S14, and S15 may be executed between the processes of steps S6 to S8, or may be executed simultaneously with the process of step S7. In this case, the placing plate 151 can be moved to the standby position in the period of decreasing the oxygen concentration in the case 121 to the exposure start concentration. For this reason, the exposure of the board | substrate W completes in a short time. Thereby, the efficiency of the exposure process of the board | substrate W can be improved more.

Moreover, in said exposure process, although the mounting plate 151 moves from a processing position to a standby position after the exposure amount of the board | substrate W reaches | attains the setting exposure amount, this invention is not limited to this. The placing plate 151 may move from the processing position to the standby position before the exposure amount of the substrate W reaches the set exposure amount. That is, the process of step S20 may be executed before the process of step S16. In this case, the vacuum ultraviolet-ray is irradiated to the board | substrate W also in the process of moving the mounting board 151 from a processing position to a standby position. For this reason, the board | substrate W is carried out from the process chamber 120 at an earlier time, and an exposure process is complete | finished. Thereby, the efficiency of the exposure process of the board | substrate W can be improved more.

(5) substrate processing apparatus

FIG. 15 is a schematic block diagram showing an overall configuration of a substrate processing apparatus including the exposure apparatus 100 of FIG. 1. In the substrate processing apparatus 200 demonstrated below, the process using the induction self-organization (DSA) of a block copolymer is performed. Specifically, a processing liquid containing an induction self-organizing material is applied onto the target surface of the substrate W. Thereafter, two types of polymer patterns are formed on the target name of the substrate W by microphase separation occurring in the induced self-organizing material. One pattern of two types of polymers is removed with a solvent.

The treatment liquid containing the induced self-organizing material is called DSA liquid. Moreover, the process which removes one of the patterns of the two types of polymer formed on the to-be-processed surface of the board | substrate W by microphase separation is called developing process, and the solvent used for developing process is called developing solution.

As shown in FIG. 15, in addition to the exposure apparatus 100, the substrate processing apparatus 200 includes the control apparatus 210, the conveying apparatus 220, the heat treatment apparatus 230, the coating apparatus 240, and the developing apparatus ( 250). The control apparatus 210 includes a CPU and a memory or a microcomputer, for example, and controls the operations of the conveying apparatus 220, the heat treatment apparatus 230, the coating apparatus 240, and the developing apparatus 250. In addition, the control device 210 operates the blocking portion 130, the lifting portion 150, the light transmitting portion 160, the replacement portion 170, and the light blocking portion 190 of the exposure apparatus 100 of FIG. 1. The control unit 110 is given a command to control.

The conveying apparatus 220 conveys this board | substrate W between the exposure apparatus 100, the heat processing apparatus 230, the coating apparatus 240, and the developing apparatus 250, holding the board | substrate W of a process target. . The heat treatment apparatus 230 heat-treats the substrate W before and after the coating treatment by the coating apparatus 240 and the developing treatment by the developing apparatus 250.

The coating device 240 applies a film to the film by supplying the DSA liquid to the target surface of the substrate W. FIG. In this embodiment, the block copolymer comprised from two types of polymer is used as DSA liquid. As a combination of two kinds of polymers, for example, polystyrene-poly methyl methacrylate (PS-PMMA), polystyrene-poly dimethyl siloxane (PS-PDMS), polystyrene-polyferrocenyldimethylsilane (PS-PFS), polystyrene- Polyethylene oxide (PS-PEO), polystyrene-polyvinyl pyridine (PS-PVP), polystyrene-polyhydroxy styrene (PS-PHOST), and polymethylmethacrylate-polymethacrylate polyhedral oligomeric silses Quioxane (PMMA-PMAPOSS) etc. are mentioned.

The developing apparatus 250 performs the film developing process by supplying a developing solution to the to-be-processed surface of the board | substrate W. FIG. As a solvent of the developer, for example, toluene, heptane, acetone, propylene glycol mono methyl ether acetate (PGMEA), propylene glycol mono methyl ether (PGME), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA) or Tetra methyl ammonium hydroxide (TMAH) etc. are mentioned.

FIG. 16: is a schematic diagram which shows an example of the process of the board | substrate W by the substrate processing apparatus 200 of FIG. In FIG. 16, the state of the board | substrate W which changes every time a process is performed is shown by sectional drawing. In this example, as shown in FIG. 16 (a) as an initial state before the board | substrate W is carried in to the substrate processing apparatus 200, the base layer L1 is formed so that the to-be-processed surface of the board | substrate W may be covered. On the underlayer L1, a guide pattern L2 made of, for example, a photoresist is formed. Hereinafter, the operation of the substrate processing apparatus 200 will be described with reference to FIGS. 15 and 16.

The conveying apparatus 220 conveys the board | substrate W of a process target to the heat processing apparatus 230 and the coating device 240 in order. In this case, in the heat treatment apparatus 230, the temperature of the substrate W is adjusted to a temperature suitable for forming the DSA film L3. Moreover, in the coating device 240, a DSA liquid is supplied to the to-be-processed surface of the board | substrate W, and a coating process is performed. Thereby, as shown to FIG. 16 (b), the DSA film L3 comprised from two types of polymers is formed in the area | region on the base layer L1 in which the guide pattern L2 is not formed.

Next, the conveying apparatus 220 conveys the board | substrate W in which the DSA film L3 was formed to the heat processing apparatus 230 and the exposure apparatus 100 in order. In this case, in the heat treatment apparatus 230, the heat treatment of the substrate W is performed, whereby microphase separation occurs in the DSA film L3. Thereby, as shown to FIG. 16 (c), the pattern Q1 which consists of one polymer and the pattern Q2 which consists of another polymer are formed. In this example, the linear pattern Q1 and the linear pattern Q2 are oriented so as to conform to the guide pattern L2.

Thereafter, in the heat treatment apparatus 230, the substrate W is cooled. Moreover, in the exposure apparatus 100, the vacuum ultraviolet-ray for modifying the DSA film L3 is irradiated to the whole DSA film L3 after microphase separation, and exposure processing is performed. Thereby, the bond between one polymer and the other polymer is cut | disconnected, and the pattern Q1 and the pattern Q2 are isolate | separated.

Next, the conveying apparatus 220 conveys the board | substrate W after the exposure process by the exposure apparatus 100 to the heat processing apparatus 230 and the developing apparatus 250 in order. In this case, in the heat treatment apparatus 230, the substrate W is cooled. Moreover, in the developing apparatus 250, the developing solution is supplied to the DSA film L3 on the board | substrate W, and developing process is performed. As a result, as shown in FIG. 16D, the pattern Q1 is removed and finally, the pattern Q2 remains on the substrate W. As shown in FIG. Finally, the conveying apparatus 220 collects the substrate W after the developing process from the developing apparatus 250.

(6) effect

In the exposure apparatus 100 which concerns on this invention, since vacuum ultraviolet-ray is intermittently irradiated to the illuminometer 183, the rate of deterioration of the illuminometer 183 falls. For this reason, the illuminometer 183 increases the lifespan. Therefore, it is not necessary to frequently replace and repair the illuminometer 183. Thereby, while operating cost of the exposure apparatus 100 can be reduced, the downtime of the exposure apparatus 100 can be minimized. As a result, the operation efficiency of the exposure apparatus 100 can be improved.

[2] Second Embodiment

The difference from the exposure apparatus and substrate processing apparatus which concerns on 1st Embodiment about the exposure apparatus and substrate processing apparatus which concerns on 2nd Embodiment is demonstrated. 17 is a cross-sectional perspective view of the exposure apparatus in the second embodiment of the present invention. 18 is a longitudinal cross-sectional view of the exposure apparatus 100 of FIG. 17. In FIG. 17 and FIG. 18, illustration of some components is omitted in order to facilitate understanding of the internal configuration of the exposure apparatus 100.

As shown in FIG. 18, in the exposure apparatus 100 according to the present embodiment, the illuminometer 183 is fixed to the inner surface of the case 121 by the fixing member 124. The illuminometer 183 overlaps with the vicinity of one corner of the light transmitting plate 162 in plan view, and the light receiving surface of the light receiving element is located at approximately the same height as the surface to be processed of the substrate W at the processing position. Is placed. Thus, in this embodiment, since the illuminometer 183 is not attached to the mounting board 151, the mounting board 151 does not have the edge part 151c of FIG. 2 for attaching the illuminometer 183. As shown in FIG.

17 and 18, the exposure apparatus 100 according to the present embodiment includes the light shielding portion 190A instead of the light shielding portion 190 of FIG. 3. The light blocking portion 190A includes a light blocking member 191, a drive device 192, and a rod-shaped support member 194. The light shielding member 191 is a shutter, for example, and is provided so that a movement is possible between the light-shielding position which shields the vacuum ultraviolet-ray irradiated to the illuminometer 183 from the light source part 163, and the non-light-shielding position which does not shield the vacuum ultraviolet-ray.

The drive apparatus 192 is a step motor, for example, and has the drive shaft 192a rotatable. The drive device 192 is attached to the lower surface of the case 121 so that the drive shaft 192a faces upward. The support member 194 connects the light blocking member 191 and the drive shaft 192a of the drive device 192 to extend in the vertical direction. As the drive shaft 192a of the drive device 192 rotates about an axis parallel to the vertical direction, the light blocking member 191 moves between the light shielding position and the non-light shielding position.

In the present embodiment, the illuminometer 183 does not move in the vertical direction. For this reason, in an exposure process, after the board | substrate W is moved to a process position, and the to-be-processed surface of the board | substrate W and the light receiving surface of the light receiving element of the illuminometer 183 become substantially the same height, from the light source part 163 It is preferable that vacuum ultraviolet rays are emitted. Therefore, in the exposure process in this embodiment, it is preferable that the process of step S9, S14, S15 of FIGS. 12-14 is performed between the process of step S6-S8.

[3] Third embodiment

The difference from the exposure apparatus and substrate processing apparatus which concerns on 1st Embodiment about the exposure apparatus and substrate processing apparatus which concerns on 3rd Embodiment is demonstrated. 19 is a sectional perspective view of an exposure apparatus in a third embodiment of the present invention. 20 is a longitudinal cross-sectional view of the exposure apparatus 100 of FIG. 19. In FIG. 19 and FIG. 20, in order to make the internal structure of the exposure apparatus 100 easy to understand, illustration of some component is abbreviate | omitted.

As shown to FIG. 19 and FIG. 20, the exposure apparatus 100 which concerns on this embodiment includes the light shielding part 190B instead of the light shielding part 190 of FIG. The light blocking portion 190B has the same configuration as the light blocking portion 190 of FIG. 3 except that the light blocking member 191 is not included. The support member 194 supports the illuminometer 183 by one end in place of the light blocking member 191. In the present embodiment, since the illuminometer 183 is not mounted to the placement plate 151, as in the second embodiment, the placement plate 151 is the corner portion 151c of FIG. 2 for attaching the illuminometer 183. Does not have

As the drive shaft 192a of the drive device 192 moves forward and backward, as shown by an arrow in FIG. 20, the illuminometer 183 moves between a non-light-shielding position that can receive vacuum ultraviolet light and a light-shielding position that cannot receive vacuum ultraviolet light. In FIG. 20, the illuminance meter 183 in a non-shielding position is shown by the solid line, and the illuminometer 183 in the light shielding position is shown by the dashed-dotted line. Specifically, the non-shielding position is a position overlapping with one edge portion of the light transmitting plate 162 when viewed in plan. The light shielding position is a position outside of the floodlight plate 162 in a plan view.

That is, in this embodiment, the illuminance meter 183 moves not between the light shielding member 191 but between a non-light shielding position and a light shielding position during the exposure process. Therefore, in the exposure process of this embodiment, the illuminometer 183 is moved between the non-light shielding position and the light shielding position instead of the light blocking member 191 in step S11 of FIG. 13. In addition, in step S19 of FIG. 13, the movement of the illuminometer 183, not the light blocking member 191, is stopped.

Moreover, also in this embodiment, it is preferable that the illumination intensity of the vacuum ultraviolet-ray irradiated to the board | substrate W in a non-light-receiving period is interpolated. The interpolation method of illuminance in the non-light-receiving period of this embodiment is the same as the interpolation method of illuminance in the light-shielding period of the first embodiment.

In addition, in this embodiment, the illuminometer 183 does not move to an up-down direction similarly to 2nd Embodiment. For this reason, in an exposure process, after the board | substrate W is moved to a process position and the to-be-processed surface of the board | substrate W and the light-receiving surface of the light receiving element of the illuminometer 183 become substantially the same height, it vacuums from the light source part 163. It is preferable that ultraviolet rays are emitted. Therefore, in the exposure process in this embodiment, it is preferable that the process of step S9, S14, S15 of FIGS. 12-14 is performed between the process of step S6-S8.

[4] Other Embodiments

(1) In 1st-3rd embodiment, although DSA liquid is used as a process liquid, this invention is not limited to this. Other treatment liquids different from the DSA liquid may be used.

(2) In 1st-3rd embodiment, the emission surface of vacuum ultraviolet-ray is larger than the to-be-processed surface of the board | substrate W, Although the front surface exposure of the board | substrate W is performed, this invention is not limited to this. The emitting surface of vacuum ultraviolet-ray may be smaller than the to-be-processed surface of the board | substrate W, and surface-shaped vacuum ultraviolet-ray does not need to be emitted. In this case, the vacuum ultraviolet ray is irradiated to the whole to-be-processed surface of the board | substrate W by moving the emission surface of the vacuum ultraviolet-ray and the to-be-processed surface of the board | substrate W relatively.

(3) In 1st-3rd embodiment, although the inert gas is supplied in the case 121 at the time of an exposure process, this invention is not limited to this. In the case where the oxygen concentration in the case 121 can be sufficiently reduced during the exposure treatment, the inert gas may not be supplied into the case 121.

(4) In the first to third embodiments, the light transmitting plate 162 has a rectangular shape, but the present invention is not limited thereto. The light transmitting plate 162 may have other shapes, such as polygonal shape, circular shape, oval shape, or ellipse shape other than rectangular state. In this case, the illuminance meter 183 is arrange | positioned in the position which overlaps with the non-overlapping area | region of the to-be-processed surface of the light transmission board 162 and the board | substrate W when viewed in plan view. Thereby, the illuminance meter 183 can measure the illumination intensity of a vacuum ultraviolet-ray, without interfering with the board | substrate W. As shown in FIG.

(5) In the first embodiment, the illuminometer 183 is attached to the mounting plate 151, but the present invention is not limited thereto. As long as the illuminometer 183 can move in the up and down direction following the movement of the placing plate 151, the illuminometer 183 may not be mounted on the placing plate 151. In this case, the illuminometer 183 may be configured to be movable by the driving device 153 which is common to the mounting plate 151, or may be configured to be movable by a driving device different from the driving device 153. .

(6) In 2nd Embodiment, although the light-shielding part 190A is provided in the exposure apparatus 100, this invention is not limited to this. The light shielding portion 190 as in the first embodiment may be provided in the exposure apparatus 100 instead of the light shielding portion 190A.

(7) In the second embodiment, the illuminance meter 183 is fixed so that the light shielding member 191 is configured to be movable by the drive device 192, but the present invention is not limited thereto. The light blocking member 191 may be fixed and the illuminometer 183 may be configured to be movable by the driving device 192. That is, the illuminometer 183 and the light shielding member 191 need only be relatively movable. In this configuration, the position where the illuminometer 183 and the light blocking member 191 overlap in the plan view becomes the light shielding position, and the position where the illuminometer 183 and the light blocking member 191 do not overlap in the plan view is the non-shielding position. Becomes

In addition, also in the first embodiment, the light blocking member 191 may be fixed, and the illuminometer 183 may be configured to be movable by the drive device 192. In this case, it is preferable that the edge part 151c of the mounting board 151 to which the illuminometer 183 is mounted is comprised so that a movement is possible in a horizontal plane independently of the circular part 151b.

(8) In the first to third embodiments, the illuminometer 183 is disposed so that the light receiving surface is approximately the same height as the processing target surface of the substrate W at the processing position, but the present invention is not limited thereto. . The illuminance meter 183 may be arrange | positioned so that a light receiving surface may be located in fixed height with respect to the to-be-processed surface of the board | substrate W in a process position. In addition, when the illuminance meter 183 can measure the illumination intensity of a vacuum ultraviolet ray with sufficient precision, you may measure the vacuum ultraviolet ray irradiated to the board | substrate W of the process moved to a process position in 2nd and 3rd embodiment. .

(9) In the first to third embodiments, the irradiation of the vacuum ultraviolet rays from the light source unit 163 to the substrate W is disclosed when the oxygen concentration drops to the exposure start concentration, but the present invention is not limited thereto. . The irradiation of the vacuum ultraviolet-ray from the light source part 163 to the board | substrate W may be started at the time when oxygen concentration fell to oxygen concentration (for example, oxygen concentration in which ozone does not generate | occur | produce) lower than exposure start concentration.

(10) Although the roughness in the light shielding period is interpolated in the first to third embodiments, the present invention is not limited thereto. It is not necessary to interpolate the illuminance in the light shielding period. Therefore, the control part 110 does not need to include the light shielding control part 7 and the illuminance interpolation part 9.

[5] Correspondence relationship between each component of claim and each part of embodiment

Hereinafter, although the corresponding example of each component of an claim and each component of embodiment is demonstrated, this invention is not limited to the following example.

In the above embodiment, the substrate W is an example of the substrate, the light transmitting unit 160 is an example of the light transmitting unit, the illuminometer 183 is an example of the illuminance meter, and the light blocking units 190, 190A, 190B are the light blocking unit. Yes. The light transmitting control unit 12 is an example of the light transmitting control unit, the exposure apparatus 100 is an example of the exposure apparatus, the light blocking member 191 is an example of the light blocking member, and the driving unit 192 is an example of the first or second driving unit. The floodlight plate 162 is an example of the exit section.

The processing chamber 120 is an example of the processing chamber, the placing plate 151 is an example of the placing unit, the lifting control unit 2 is an example of the placing control unit, the circular portion 151b is an example of the first portion, and the circular portion 151b. ) Is an example of the second part. The coating apparatus 240 is an example of a coating process part, the heat processing apparatus 230 is an example of a heat processing part, the developing apparatus 250 is an example of a developing process part, and the substrate processing apparatus 200 is an example of a substrate processing apparatus.

As each component of the claims, various other components having the configurations or functions described in the claims may be used.

Claims (14)

A light-transmitting unit provided on the surface to be processed of the substrate so as to irradiate vacuum ultraviolet rays,
An illuminometer having a light receiving surface for receiving a part of the vacuum ultraviolet light during the irradiation period of the vacuum ultraviolet light from the light transmitting part to the substrate, and measuring the illuminance of the received vacuum ultraviolet light;
A light shielding portion intermittently blocking the incidence of vacuum ultraviolet rays on the light receiving surface of the illuminometer during the irradiation period;
And a transmissive control unit for controlling the light transmitting unit to stop the irradiation of the vacuum ultraviolet light to the substrate based on the illuminance measured by the illuminometer, while controlling the light transmitting unit to irradiate a vacuum ultraviolet ray to the substrate. The method according to claim 1,
The illuminometer is provided at a position capable of receiving a part of vacuum ultraviolet rays from the light transmitting portion in the irradiation period,
The light shielding portion,
A light blocking member that is movable to intermittently block incidence of vacuum ultraviolet light on the light receiving surface of the illuminometer during the irradiation period;
Exposure apparatus including the 1st drive part which moves the said light shielding member. The method according to claim 1,
The light shielding portion includes a second driving portion which alternately moves the illuminometer to a first position capable of receiving a portion of the vacuum ultraviolet rays from the light transmitting portion in the irradiation period and a second position incapable of receiving the vacuum ultraviolet rays from the light transmitting portion. Exposure apparatus including. The method according to any one of claims 1 to 3,
The light transmitting portion is configured to irradiate vacuum ultraviolet rays to the entire region of one surface of the substrate and the region outside the substrate,
The illuminometer is located in an area outside the substrate at least upon incidence of vacuum ultraviolet rays on the light receiving surface in the irradiation period. The method according to any one of claims 1 to 4,
The substrate has a circular shape,
The emitting part of the vacuum ultraviolet-ray in the said light transmission part has a rectangular shape which contains the circular area | region corresponded to the said whole area | region of a board | substrate,
The light receiving surface of the illuminometer is exposed to be movable or fixed to a position where vacuum ultraviolet light emitted from a corner region except for the circular region at the light emitting portion of the light transmitting portion is allowed to enter in the irradiation period. Device. The method according to any one of claims 1 to 5,
The illuminometer is arranged such that the light receiving surface is positioned at a constant height relative to the target surface of the substrate in the irradiation period. The method according to claim 6,
The illuminometer is arranged such that the light receiving surface is positioned at the same height as the surface to be processed of the substrate in the irradiation period. The method according to any one of claims 1 to 7,
A processing chamber accommodating a substrate to be processed;
In the processing chamber, a placing portion provided below the light transmitting portion, the substrate is placed,
The placing portion moves to the third position when the substrate is transferred between the processing chamber and the outside, and the placing portion moves to the fourth position above the third position when the vacuum ultraviolet rays of the light transmitting portion are emitted. An exposure apparatus further including a mounting control part which controls the said mounting part so that it may be carried out. The method according to claim 8,
The illuminometer moves in the vertical direction following the movement of the placing unit. The method according to claim 9,
The placement unit,
A first portion on which the substrate is mounted,
An exposure apparatus comprising a second portion in which the illuminometer is disposed upon receiving a vacuum ultraviolet ray. A coating processing unit for forming a film on the substrate by applying the processing liquid to the substrate;
A heat treatment part for heat-treating the substrate on which the film is formed by the coating treatment part;
The exposure apparatus in any one of Claims 1-10 which exposes the board | substrate heat-treated by the said heat processing part,
A substrate processing apparatus comprising: a developing unit that develops a film of the substrate by supplying a solvent to the substrate exposed by the exposure apparatus. The method according to claim 11,
The processing liquid includes a substrate self-organizing material. Irradiating a vacuum ultraviolet ray to the to-be-processed surface of a board | substrate by a light transmitting part,
In the irradiation period of the vacuum ultraviolet rays from the light transmitting portion to the substrate, receiving a part of the vacuum ultraviolet rays by an illuminometer and measuring the illuminance of the received vacuum ultraviolet rays;
Intermittently interrupting the incidence of vacuum ultraviolet rays on the light receiving surface of the illuminometer by the light shielding unit in the irradiation period;
And stopping the irradiation of the vacuum ultraviolet rays to the substrate by the light transmitting part based on the illuminance measured by the illuminometer. Forming a film on the substrate by applying a treatment liquid to the to-be-processed surface of the substrate by a coating treatment portion;
Heat-treating the substrate on which the film is formed by the coating treatment unit by a heat treatment unit;
The exposure method of Claim 13 which exposes the board | substrate heat-processed by the said heat processing part with the exposure apparatus,
And developing a film of the substrate by supplying a solvent to the to-be-processed surface of the substrate exposed by the exposure apparatus by the developing processing unit.

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