KR20190090928A - Thermo electric module - Google Patents

Abstract

Disclosed according to an embodiment is a thermoelectric module. The thermoelectric module includes a first heat conducting plate including a groove; a thermoelectric element disposed on the first heat conducting plate; a second heat conducting plate disposed on the thermoelectric element; a moving member having one end inserted into the groove of the first heat conducting plate and movable in the inner direction and the outer direction of the groove; and a drive part for moving the moving member. The thermoelectric element may include a first substrate; a plurality of thermoelectric legs disposed on the first substrate; a second substrate disposed on the plurality of thermoelectric legs; an electrode including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; and a lead wire electrically connected to the electrode. It is possible to provide a thermoelectric module with high reliability and excellent heat conductivity.

Description

Thermoelectric Modules {THERMO ELECTRIC MODULE}

The present invention relates to a thermoelectric module, and more particularly to a thermal conduction block of a thermoelectric module.

Thermoelectric phenomenon is a phenomenon caused by the movement of electrons and holes in a material, and means a direct energy conversion between heat and electricity.

The thermoelectric module generically refers to a device using a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

The thermoelectric module may be classified into a device using a temperature change of an electrical resistance, a device using a Seebeck effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and a device using a Peltier effect, a phenomenon in which endothermic or heat generation by a current occurs.

Thermoelectric modules are applied to a variety of home appliances, electronic components, communication components, and the like. For example, the thermoelectric module may be applied to a cooling device, a heating device, a power generating device, or the like. Accordingly, the demand for thermoelectric performance of thermoelectric modules is increasing.

The thermoelectric module includes a substrate, an electrode, and a thermoelectric leg, and a plurality of thermoelectric legs are arranged in an array form between the upper substrate and the lower substrate, and a plurality of upper electrodes are disposed between the plurality of thermoelectric legs and the upper substrate. A plurality of lower electrodes are disposed between the thermoelectric leg and the lower substrate. Here, the plurality of upper electrodes and the plurality of lower electrodes connect the thermoelectric legs in series or in parallel.

In general, when the thermoelectric module is applied to the cooling device, the current is blocked in the thermoelectric module after cooling the device.

However, at this time, there is a problem that the temperature of the cooled device rises rapidly due to heat exchange with the device cooled through the thermoelectric module having high thermal conductivity and the outside.

The technical problem to be achieved by the present invention is to block the thermal conductivity of the thermoelectric module.

On the other hand, the problem to be solved in the embodiment is not limited to this, it will be said that also includes the object and effect that can be grasped from the solution means or embodiment of the problem described below.

Thermoelectric module according to an embodiment of the present invention includes a first thermal conductive plate including a groove; A thermoelectric element disposed on the first thermal conductive plate; A second thermal conductive plate disposed on the thermoelectric element; A moving member having one end inserted into a groove of the first heat conductive plate and movable in an inner direction and an outer direction of the groove; And a driving unit to move the moving member. The thermoelectric device includes a first substrate; A plurality of thermoelectric legs disposed on the first substrate; A second substrate disposed on the plurality of thermoelectric legs; An electrode including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; A lead wire electrically connected to the electrode; .

The driving unit may be an electromagnet.

Further comprising a magnetic member disposed at the other end of the moving member, when the current is applied to the electromagnet, attraction or repulsion may occur between the electromagnet and the magnetic member.

The first heat conductive plate and the movable member may be made of the same material.

The thermal conductivity of the first thermal conductive plate and the moving member may be the same.

The thermal conductivity of the first thermally conductive plate and the movable member may be less than the thermal conductivity of air.

The apparatus may further include an elastic member disposed between an inner side surface of the first heat conductive plate forming the groove and one end of the movable member.

The second heat conductive plate further includes a second moving member, one end of which is inserted into the second groove of the second heat conductive plate and movable in an inner direction and an outer direction of the second groove, The driving unit may move the second moving member.

The driving unit may be an electromagnet.

Further comprising a second magnetic member disposed at the other end of the second moving member,

When a current is applied to the electromagnet, attraction or repulsion may occur between the electromagnet and the second magnetic member.

The total volume of the first heat conductive plate except for the grooves may be 0.3 to 1 times the total volume of the grooves.

According to an embodiment of the present invention, it is possible to obtain a thermoelectric module capable of blocking thermal conduction. In particular, according to the embodiment of the present invention, it is possible to obtain a thermoelectric module having excellent thermal conductivity and high reliability.

Various and advantageous advantages and effects of the present invention are not limited to the above description, and will be more readily understood in the course of describing specific embodiments of the present invention.

1 is a block diagram schematically showing a water purifier to which a thermoelectric module is applied according to an embodiment of the present invention;
2 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention;
3 is a perspective view of the thermoelectric element of FIG.
4 is an exemplary view illustrating driving of a moving member in the thermoelectric module of FIG. 2;
5 and 6 are exemplary views showing the movement of the movable member in the thermoelectric module according to another exemplary embodiment of the present invention.
7 is an exemplary view illustrating driving of a moving member in a thermoelectric module according to another exemplary embodiment of the present invention.

As the present invention allows for various changes and numerous embodiments, particular embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be given the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted.

1 is a block diagram schematically illustrating a water purifier to which a thermoelectric module is applied according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention, and FIG. 3 is a thermoelectric element of FIG. 2. 4 is a perspective view illustrating driving of a moving member in the thermoelectric module of FIG. 2.

First, referring to FIG. 1, a water purifier 1 to which a thermoelectric module according to an embodiment of the present invention is applied includes a raw water supply pipe 12a, a water purification tank inlet pipe 12b, a water purification tank 12, and a filter assembly 13. , A cooling fan 14, a heat storage tank 15, a cold water supply pipe 15a, and a thermoelectric module 1000.

The raw water supply pipe 12a is a supply pipe for introducing purified water from the water source into the filter assembly 13, and the purified water tank inflow pipe 12b is an inflow for introducing purified water from the filter assembly 13 into the purified water tank 12. The cold water supply pipe 15a is a supply pipe through which the cold water cooled to a predetermined temperature by the thermoelectric module 1000 in the purified water tank 12 is finally supplied to the user.

The purified water tank 12 temporarily receives the purified water through the filter assembly 13 to store and supply the purified water introduced through the purified water tank inlet 12b to the outside.

The filter assembly 13 is composed of a precipitation filter 13a, a pre carbon filter 13b, a membrane filter 13c, and a post carbon filter 13d.

That is, the water flowing into the raw water supply pipe 12a may be purified through the filter assembly 13.

The heat storage tank 15 is disposed between the purified water tank 12 and the thermoelectric module 1000 to store cold air formed in the thermoelectric module 1000. The cold air stored in the heat storage tank 15 is applied to the purified water tank 12 to cool the water contained in the purified water tank 120.

The heat storage tank 15 may be in surface contact with the purified water tank 12 so that the cold air may be smoothly transferred.

As described above, the thermoelectric module 1000 includes a heat absorbing surface and a heat generating surface, and one side is cooled and the other side is heated by electron movement on the P-type semiconductor and the N-type semiconductor.

Here, one side may be the purified water tank 12 side, the other side may be the opposite side of the purified water tank 12.

That is, the thermoelectric module 1000 can cool the purified water tank 12 efficiently in the water purifier 1.

2 and 3, a thermoelectric module 1000 according to an embodiment of the present invention includes a thermoelectric element 100, a first thermal conductive plate 200, a second thermal conductive plate 300, and a moving member 400. And a driver 500.

The first thermally conductive plate 200 and the second thermally conductive plate 300 are disposed to face each other with the thermoelectric element 100 interposed therebetween. The first thermally conductive plate 200 and the second thermally conductive plate 300 may be made of a metal material having excellent thermal conductivity.

Here, the first heat conduction plate 200 is installed between the heat absorbing surface of the thermoelectric element 100 and the surface of the cooling side (not shown) to improve the heat transfer area when the heat absorbing through the heat absorbing surface of the thermoelectric element 100. At this time, the first thermal conductive plate 200 is used aluminum, but, of course, it is possible to use copper, stainless steel, or brass.

Since the first heat conduction plate 200 can widen the heat transfer area in use, the temperature gradient can be reduced, and above all, the second heat conduction plate 300 and the cooling side (not shown) attached to the heat dissipation direction of the thermoelectric element 100. By artificially spaced apart the gap and the heat can be blocked from the relatively hot second heat conducting plate 300 toward the cold cooling side (not shown).

The first heat conductive plate 200 includes a groove 210 formed to have a predetermined depth from one side to the inner side. Here, the first heat conductive plate 200 includes an inner side surface 211 constituting the groove 210.

The moving member 400 is inserted into the groove 210, and the groove 210 guides a path through which the moving member 400 can be moved. Here, an air injection hole (not shown) may be formed in the groove 210 to maintain the same pressure as the outside when the moving member 400 is inserted and discharged.

A plurality of fins may be formed on the bottom surface of the first heat conductive plate 200 to expand the heat generation or endothermic area.

The second thermal conductive plate 300 is in close contact with the heat-generating surface of the thermoelectric element 100 to dissipate heat of the thermoelectric element 100, and usually extruded heat sinks are used, but in some cases, a skiving type heat sink and a heat pipe Embedded type heat sink and pin bonded type heat sink can be used.

Here, the first heat conduction plate 200 is described as the heat absorbing surface, the second heat conducting plate 300 is set as the heat dissipation surface, but this may be changed with the heat absorbing surface and the heat dissipation surface according to the current direction applied to the thermoelectric element. .

The thermoelectric element 100 includes a P-type thermoelectric leg 120, an N-type thermoelectric leg 130, a lower substrate 140, an upper substrate 150, a lower electrode 161, an upper electrode 162, and a solder layer (not shown). City).

The lower electrode 161 is disposed between the lower substrate 140 and the lower surface of the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130, and the upper electrode 162 is the upper substrate 150 and the P-type thermoelectric leg. It is disposed between the upper surface of the 120 and the N-type thermoelectric leg (130). Accordingly, the plurality of P-type thermoelectric legs 120 and the plurality of N-type thermoelectric legs 130 are electrically connected by the lower electrode 161 and the upper electrode 162. A pair of P-type thermoelectric legs 120 and N-type thermoelectric legs 130 disposed between the lower electrode 161 and the upper electrode 162 and electrically connected to each other may form a unit cell.

For example, when a voltage is applied to the lower electrode 161 and the upper electrode 162 through the lead wires 181 and 182, a current from the P-type thermoelectric leg 120 to the N-type thermoelectric leg 130 due to the Peltier effect. The flowing substrate absorbs heat to act as a cooling unit, and the substrate flowing current from the N-type thermoelectric leg 130 to the P-type thermoelectric leg 120 may be heated to act as a heat generating unit.

Here, the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 may be a bismuth fluoride (Bi-Te) -based thermoelectric leg including bismuth (Bi) and tellurium (Te) as a main raw material. P-type thermoelectric leg 120 is antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium relative to the total weight 100wt% A mixture comprising 99 to 99.999 wt% of bismustelulide (Bi-Te) -based main raw material including at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In) and Bi or Te 0.001 It may be a thermoelectric leg including to 1wt%. For example, the main raw material is Bi-Se-Te, and may further include Bi or Te as 0.001 to 1wt% of the total weight. The N-type thermoelectric legs 230 are selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium based on the total weight of 100 wt%. A mixture comprising 99 to 99.999 wt% of bismustelulide (Bi-Te) -based main raw material including at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In) and Bi or Te 0.001 It may be a thermoelectric leg including to 1wt%. For example, the main raw material is Bi-Sb-Te, and may further include Bi or Te as 0.001 to 1wt% of the total weight.

The P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 may be formed in a bulk type or a stacked type. In general, the bulk P-type thermoelectric leg 120 or the bulk N-type thermoelectric leg 130 is heat-treated thermoelectric material to produce an ingot (ingot), pulverizing and sieving the ingot to obtain a powder for thermoelectric legs, and then Sintering, and can be obtained through the process of cutting the sintered body. The stacked P-type thermoelectric leg 120 or the stacked N-type thermoelectric leg 230 is formed by applying a paste containing a thermoelectric material on a sheet-shaped substrate to form a unit member, and then stacking and cutting the unit members. Can be obtained.

In this case, the pair of P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 preferably has the same height in the same shape, it may have a different shape and volume. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 are different, the cross-sectional area of the N-type thermoelectric leg 130 may be different from that of the P-type thermoelectric leg 120. It may be.

Meanwhile, an insulator (not shown) may be disposed on the side surfaces of the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 in the height direction (Z-axis direction).

On the other hand, the performance of the thermoelectric device according to an embodiment of the present invention can be represented by Seebeck index. The Seebeck index ZT may be expressed as in Equation 1.

는 제벡 계수[V/K]이고,

는 전기 전도도[S/m]이며,

는 파워 인자(Power Factor, [W/mK²])이다. 그리고, T는 온도이고, k는 열전도도[W/mK]이다. k는

로 나타낼 수 있으며, a는 열확산도[cm²/S]이고, cp 는 비열[J/gK]이며,

는 밀도[g/cm³]이다.here,

Is the Seebeck coefficient [V / K],

Is the electrical conductivity [S / m],

Is the power factor ([W / mK ² ]). And T is the temperature and k is the thermal conductivity [W / mK]. k is

Where a is the thermal diffusivity [cm ² / S], cp is the specific heat [J / gK],

Is the density [g / cm ³ ].

In order to obtain the Seebeck index of the thermoelectric module, the Z value (V / K) may be measured using a Z meter, and the Seebeck index (ZT) may be calculated using the measured Z value.

Here, the lower electrode 120 disposed between the lower substrate 140 and the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130, and the upper substrate 150 and the P-type thermoelectric leg 120 and the N-type The upper electrode 162 disposed between the thermoelectric legs 130 may include at least one of copper (Cu), silver (Ag), and nickel (Ni).

The lower substrate 140 and the upper substrate 150 that face each other may be an insulating substrate or a metal substrate. The insulating substrate may be an alumina substrate or a polymer resin substrate having flexibility. Flexible polymer resin substrates are highly permeable, such as polyimide (PI), polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), and resin Various insulating resin materials, such as plastics, can be included. Alternatively, the insulating substrate may be a fabric. The metal substrate may comprise Cu, Cu alloy or Cu—Al alloy. In addition, when the lower substrate 140 and the upper substrate 150 are metal substrates, a dielectric layer is further formed between the lower substrate 140 and the lower electrode 161 and between the upper substrate 150 and the upper electrode 162, respectively. Can be. The dielectric layer may include a material having a thermal conductivity of 5-10 W / K.

At this time, the size of the lower substrate 140 and the upper substrate 150 may be formed differently. For example, the volume, thickness, or area of one of the lower substrate 140 and the upper substrate 150 may be greater than the volume, thickness, or area of the other. Thereby, the heat absorption performance or heat dissipation performance of a thermoelectric module can be improved.

Meanwhile, as shown in FIG. 3, the lower substrate 140 is formed to have a first length D1 in the first direction, and the upper substrate 150 is formed to have a second length D2 in the first direction. Can be.

Here, the first length D1 is larger than the second length D2, and thus it is easy to connect the lead wires 181 and 182 to the lower electrode 261 formed at the end of the first direction on the lower substrate 140. Do.

The lower electrode 261 and the lead wires 181 and 182 may be electrically connected to each other by at least one of various methods such as a welding method or a mechanical fastening method.

The plurality of lower electrodes 161 and the plurality of upper electrodes 162 electrically connect the P-type thermoelectric leg 120 and the N-type thermoelectric leg 130 using electrode materials such as Cu, Ag, and Ni. The thickness of the lower electrode 161 and the upper electrode 162 may be formed in the range of 0.01mm to 0.3mm. More preferably, it can be implemented in the range of 10 μm to 20 μm.

In addition, the plurality of lower electrodes 161 and the plurality of upper electrodes 162 may each be an array of m * n (where m and n may each be integers of 1 or more, and m and n may be the same or different from each other). It may be arranged in the form, but is not limited thereto. Each lower electrode 161 and the upper electrode 162 may be spaced apart from other neighboring lower electrode 161 and the upper electrode 162. For example, each of the lower and upper electrodes 161 and 162 may be spaced apart from each other by about 0.5 to 0.8 mm from other neighboring electrodes 161 and 162.

A pair of P-type thermoelectric legs 120 and N-type thermoelectric legs 130 are disposed on each lower electrode 161, and a pair of P-type thermoelectric legs 120 and N are disposed under each upper electrode 162. The thermoelectric leg 130 may be disposed.

That is, the lower surface of the P-type thermoelectric leg 120 is disposed on the lower electrode 161, the upper surface is disposed on the upper electrode 162, and the lower surface of the N-type thermoelectric leg 130 is disposed on the lower electrode 161. The upper surface may be disposed on the upper electrode 162. When the P-type thermoelectric leg 120 of the pair of P-type thermoelectric legs 120 and the N-type thermoelectric legs 130 disposed on the lower electrode 161 is disposed on one of the plurality of lower electrodes 162, the N-type The thermoelectric leg 130 may be disposed on another lower electrode 162 adjacent thereto. Accordingly, the plurality of P-type thermoelectric legs 120 and the plurality of N-type thermoelectric legs 130 may be connected in series through the plurality of lower electrodes 161 and the plurality of lower electrodes 162.

In this case, a pair of lower solder layers (not shown) may be applied on the lower electrode 161 to bond the pair of P-type thermoelectric legs 120 and the N-type thermoelectric legs 130 to each other. A pair of P-type thermoelectric legs 120 and N-type thermoelectric legs 130 may be disposed on the solder layer, respectively.

In addition, a pair of upper solder layers (not shown) may be applied under the upper electrode 162 to bond a pair of P-type thermoelectric legs 120 and N-type thermoelectric legs 130. A pair of P-type thermoelectric legs 120 and N-type thermoelectric legs 130 may be disposed under the upper solder layer 172, respectively.

One end of the moving member 400 is inserted into the groove 210 of the first heat conductive plate 200 and is moved in the inner direction and the outer direction of the groove 210.

That is, the groove 210 of the first heat conductive plate 200 forms an accommodating space for accommodating the movable member 400, the movable member 400 is accommodated inside the groove 210, and the movable member 400. ) May reciprocate linearly along the groove 210.

Although not shown, a guide portion such as a rail may be disposed between the inner surface of the first heat conductive plate 200 forming the groove 210 and the moving member 400.

The moving member 400 is preferably made of the same material as the first thermal conductive plate 200 and has the same thermal conductivity. Alternatively, the moving member 400 is preferably very similar in thermal conductivity to the first thermal conductive plate 200.

As shown in FIG. 2, when the voltage is applied to the lower electrode 161 and the upper electrode 162 through the lead wires 181 and 182 to form the cooling unit and the heating unit, the moving member 400 is formed. The first thermal conductive plate 200 may be disposed in the groove 210 to provide a thermal conductive path within the first thermal conductive plate 200.

On the contrary, as shown in FIG. 4, when the current applied to the lead wires 181 and 182 is cut off, the moving member 400 of the groove 210 of the first heat conductive plate 200 is driven through the driving unit 500. It is disposed outside, to form an air layer in the groove 210 of the first thermal conductive plate 200.

That is, an air layer having a lower thermal conductivity than the first thermal conductive plate 200 and the moving member 400 is formed in the first thermal conductive plate 200, so that the first thermal conductive plate 200 and the second thermal conductive plate 300 are formed. The heat exchange between) can be suppressed.

Here, the space formed by the groove 210 may be formed in the range of 0.3 times to 1 times the volume of the first heat conductive plate 200 except for the groove 210. More preferably, it can be implemented in the range of 0.5 to 0.8 times.

When the volume of the space formed by the groove 210 is 0.3 times or less than the volume of the first heat conductive plate 200, the air layer formed when the moving member 400 is discharged from the first heat conductive plate 200 is insufficient in heat conduction. When the blocking effect is not expected and the volume of the space formed by the groove 210 is one or more times larger than the volume of the first heat conductive plate 200, the first member when the moving member 400 is discharged from the first heat conductive plate 200 is first. There is a problem in that reliability cannot be secured according to the rigidity of the thermal conductive plate 200.

The driving unit 500 is disposed on the other side of the thermoelectric element 100 and may be implemented to substantially move the moving member 400.

The driving unit 500 may be implemented by a mechanical device such as a motor or a piston, but since the driving unit 500 is in contact with the moving member 400, the driving unit 500 may be implemented as an electromagnet capable of moving the moving member 400 in a non-contact state. .

That is, the driving unit 500 may be spaced apart from each other without contacting the moving member 400 or the first heat conductive plate 200, and thus may not affect the heat transfer.

The driver 500 may have a first polarity (eg, N) and a second polarity (eg, S) according to the current application direction.

Here, the magnetic member 410 having the first polarity N is disposed at the other end of the moving member 400.

That is, as shown in FIG. 2, when the driving unit 500 has the first polarity N, the moving member 400 is moved by the first heat conductive plate due to the repulsive force between the driving unit 500 and the magnetic member 410. It may be inserted into the groove 210 of the 200 to provide a heat transfer path.

On the contrary, as shown in FIG. 4, when the driving part 500 has the second polarity S, the moving member 400 is moved by the first heat conductive plate due to the attraction force between the driving part 500 and the magnetic member 410. It is discharged from the inside of the groove 210 of the 200, forms an air layer in the groove 210 and can block the heat transfer.

In addition, although not shown, a sealing member (not shown) is disposed outside the thermoelectric element 100, and the sealing member may be sealed to prevent moisture from penetrating into the thermoelectric element 100.

Here, the sealing member may be composed of an adhesive such as waterproof tape, waterproof silicone, rubber or resin material, and is preferably implemented by waterproof silicone that is cured after being introduced.

Hereinafter, a thermoelectric module according to another exemplary embodiment of the present invention will be described with reference to FIGS. 5 and 6.

5 and 6 are exemplary driving diagrams illustrating the movement of the movable member in the thermoelectric module according to another exemplary embodiment of the present invention.

5 and 6, the elastic member 600 is different from the thermoelectric module 1000 according to the exemplary embodiment of the present invention illustrated in FIG. 2, and thus, the elastic member 600 will be described below. Only a detailed description thereof will be omitted, and detailed descriptions thereof will be omitted.

Referring to FIG. 5, an elastic member 600 is disposed between the inner surface 211 of the first heat conductive plate 200 forming the groove 210 and one end of the moving member 400.

The elastic member 600 may be made of a material having excellent elastic recovery rate, such as a spring.

Meanwhile, as the current is applied, the driving unit 500 may have a different polarity from that of the magnetic member 410 disposed at the other end of the moving member 400 or may be driven in a state in which the current is cut off.

That is, as shown in FIG. 5, when the driving part 500 has the first polarity N, the moving member 400 is moved by the first heat conductive plate due to the repulsive force between the driving part 500 and the magnetic member 410. It may be inserted into the groove 210 of the 200 to provide a heat transfer path.

Here, the elastic member 600 disposed between the inner surface 211 of the first heat conductive plate 200 and one end of the moving member 400 may maintain a compressed state.

Subsequently, referring to FIG. 6, when a current is blocked in the driving part 500, the moving member 400 is moved inside the groove 210 of the first heat conductive plate 200 due to the elastic restoring force of the elastic member 600. It is discharged, forming an air layer in the groove 210 and can block heat transfer.

Hereinafter, a thermoelectric module according to another embodiment of the present invention will be described with reference to FIG. 7.

7 is an exemplary view illustrating driving of a moving member in a thermoelectric module according to another exemplary embodiment of the present invention.

The thermoelectric module 3000 illustrated in FIG. 7 is the second thermal conductive plate 700, the second moving member 800, and the driving unit 550 compared to the thermoelectric module 1000 according to the exemplary embodiment of the present invention illustrated in FIG. 2. Since the configuration of) is different, hereinafter, only the second heat conductive plate 700, the second moving member 800, and the driving unit 550 will be described in detail, and detailed descriptions of the same reference numerals will be omitted.

The second thermal conductive plate 700 includes a groove 710 formed to have a predetermined depth from one side to the inner side. Hereinafter, the groove 710 is described as the second groove 710 to avoid duplication of terms.

Here, the second heat conductive plate 700 includes an inner side surface 711 forming the second groove 710.

The moving member 800 is inserted into the second groove 710, and the second groove 710 guides a path through which the moving member 800 can be moved. Hereinafter, the moving member 800 will be described as the second moving member 800 to avoid duplication of terms.

Here, an air injection hole (not shown) may be formed in the second groove 710 to maintain the same pressure as the outside when the second moving member 800 is inserted and discharged.

One end of the second moving member 800 is inserted into the second groove 710 of the second heat conductive plate 700, and is moved in the inner direction and the outer direction of the second groove 710.

That is, the second groove 710 of the second heat conductive plate 700 forms an accommodation space for accommodating the second moving member 800, and the second moving member 800 inside the second groove 710. Is accommodated, and the second moving member 800 may reciprocate linearly along the second groove 710.

Although not shown, a guide portion such as a rail may be disposed between the inner surface of the second heat conductive plate 700 constituting the second groove 710 and the second moving member 800.

The second moving member 800 is preferably made of the same material as the second heat conductive plate 700 and the same thermal conductivity. Alternatively, the second moving member 800 may preferably have very similar thermal conductivity to the second thermal conductive plate 700.

Here, when a voltage is applied to the lower electrode 161 and the upper electrode 162 through the lead wires 181 and 182 to form the cooling part and the heat generating part, the second moving member 800 is the second heat conductive plate 700. Disposed in the second groove 710 of the second groove 710 to provide a heat conduction path within the second heat conductive plate 700, and to supply voltages to the lower electrode 161 and the upper electrode 162 through the lead wires 181 and 182. Is applied to form the cooling unit and the heat generating unit, the moving member 400 is disposed inside the groove 210 of the first heat conductive plate 200 to provide a heat conduction path inside the first heat conductive plate 200. can do.

On the contrary, as shown in FIG. 7, when the current applied to the lead wires 181 and 182 is cut off, the second moving member 800 passes through the driving unit 550 in the second groove of the second heat conductive plate 700. Is disposed outside the 710, to form an air layer in the second groove 710 of the second heat conductive plate 700, the moving member 400 is the groove of the first heat conductive plate 200 through the drive unit 550. It is disposed outside the 210, it can form an air layer in the groove 210 of the first thermal conductive plate 200.

That is, an air layer having a lower thermal conductivity than the second thermal conductive plate 700 and the second moving member 800 is formed in the second thermal conductive plate 700, so that the first thermal conductive plate 200 and the second thermal conductive plate 700 are formed. Heat exchange between the 700 can be suppressed.

Here, the space formed by the second groove 710 may be formed in a range of 0.3 times to 1 times the volume of the second heat conductive plate 700 except for the second groove 710. More preferably, it can be implemented in the range of 0.5 to 0.8 times.

When the volume of the space formed by the second groove 710 is 0.3 times or less than the volume of the second heat conductive plate 700, the air layer formed when the second moving member 800 is discharged from the second heat conductive plate 700 is the volume. In this case, the heat conduction blocking effect cannot be expected, and when the volume of the space formed by the second groove 710 is one or more times larger than the volume of the second heat conducting plate 700, the second moving member ( When the 800 is discharged, there is a problem in that reliability cannot be secured according to the rigidity of the second heat conductive plate 700.

The driving unit 550 may be implemented as a mechanical device such as a motor or a piston, but since the driving unit 550 is in contact with the moving member 400 and the second moving member 800, the moving member 400 and the second moving may be in an uncontacted state. It is preferable to implement the electromagnet that can move the member (800).

That is, the driving unit 550 may be disposed to be spaced apart without contacting the moving member 400, the first heat conductive plate 200, the second moving member 800, or the second heat conductive plate 700. May not affect.

The driver 550 may have a first polarity (for example, N) and a second polarity (for example, S) according to the current application direction.

Here, the magnetic member 810 having the first polarity N is disposed at the other end of the second moving member 800. In the following description, the magnetic member 810 is described as a second magnetic member 810 to avoid duplication of terms.

That is, when the driving unit 550 has the first polarity N, the second moving member 800 is moved by the repulsive force between the driving unit 550 and the second magnetic member 810. Is inserted into the second groove 710 to provide a heat transfer path, due to the repulsive force between the magnetic member 410, the moving member 400 is inserted into the groove 210 of the first heat conductive plate 200. Can provide a heat transfer path.

On the contrary, as shown in FIG. 7, when the driving unit 550 has the second polarity S, the second moving member 800 is moved due to the attraction force between the driving unit 550 and the second magnetic member 810. It is discharged from the inside of the second groove 710 of the second heat conductive plate 700 to form an air layer in the second groove 710 to block heat transfer, the driving unit 550 has a second polarity (S) In this case, due to the attraction between the driving unit 550 and the magnetic member 410, the moving member 400 is discharged from the inside of the groove 210 of the first heat conductive plate 200 to form an air layer in the groove 210 and heat You can block delivery.

That is, by the operation of the driving unit 550, by forming an air layer on each of the first thermal conductive plate 200 and the second thermal conductive plate 700, it is possible to more effectively block the heat transfer.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: thermoelectric element
120: P type thermoelectric leg 130: N type thermoelectric leg
140: lower substrate 150: upper substrate
161: lower electrode 162: upper electrode
200: first heat conduction plate 300, 700: second heat conduction plate
400 and 800: moving member 500: drive part
600: elastic member

Claims (11)

A first heat conducting plate comprising a groove;
A thermoelectric element disposed on the first thermal conductive plate;
A second thermal conductive plate disposed on the thermoelectric element;
A moving member having one end inserted into a groove of the first heat conductive plate and movable in an inner direction and an outer direction of the groove; And
A drive unit for moving the moving member; Including,
The thermoelectric element is
A first substrate;
A plurality of thermoelectric legs disposed on the first substrate;
A second substrate disposed on the plurality of thermoelectric legs;
An electrode including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; And
A lead wire electrically connected to the electrode; Thermoelectric module comprising a.
The method of claim 1,
The driving unit is an electromagnet module.
The method of claim 2,
Further comprising a magnetic member disposed at the other end of the moving member,
At the time of applying the current to the electromagnet, the thermoelectric module generates a attraction force or repulsion between the electromagnet and the magnetic member.
The method of claim 1,
And the first heat conducting plate and the moving member are made of the same material.
The method of claim 1,
And a thermal conductivity of the first thermally conductive plate and the moving member is the same.
The method of claim 5, wherein
And a thermal conductivity between the first thermally conductive plate and the moving member is less than that of air.
The method of claim 1,
The thermoelectric module of claim 1, further comprising an elastic member disposed between the inner surface of the first thermal conductive plate forming the groove and one end of the movable member.
The method of claim 1,
The second heat conducting plate includes a second groove,
One end is inserted into the second groove of the second heat conductive plate, and further includes a second moving member movable in the inner direction and the outer direction of the second groove,
And the driving part moves the second moving member.
The method of claim 8,
The driving unit is an electromagnet module.
The method of claim 9,
Further comprising a second magnetic member disposed at the other end of the second moving member,
When the current is applied to the electromagnet, the thermoelectric module generates a attraction force or repulsive force between the electromagnet and the second magnetic member.
The method of claim 1,
The total volume of the first heat conducting plate excluding the groove is
0.3 to 1 times the total volume of the groove of the thermoelectric module.

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