KR102509339B1 - Thermo electric element - Google Patents

Abstract

A thermoelectric element according to an embodiment of the present invention includes a first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate, the plurality of P-type thermoelectric legs, and the plurality of N-type thermoelectric legs. a second substrate disposed on an N-type thermoelectric leg; and a plurality of electrodes connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series, wherein the plurality of electrodes comprise the first substrate and the plurality of electrodes. A plurality of first electrodes disposed between a plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a plurality of first electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. a second electrode between the first electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and between the second electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs A solder disposed therebetween, and a connection layer disposed between the plurality of first electrodes and between the plurality of second electrodes, wherein the connection layer extends from the first substrate and the second substrate and extends from the first substrate to the plurality of second electrodes. It is the same material as the first substrate and the second substrate.

Description

Thermoelectric element {THERMO ELECTRIC ELEMENT}

The present invention relates to a thermoelectric element, and more particularly, to a thermoelectric element including a solder.

The thermoelectric phenomenon is a phenomenon caused by the movement of electrons and holes inside a material, and means a direct energy conversion between heat and electricity.

A thermoelectric element is a generic term for an element using a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

The thermoelectric element can be classified into an element using a temperature change of electrical resistance, an element using the Seebeck effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and an element using the Peltier effect, which is a phenomenon in which heat absorption or heat generation occurs due to current. .

Thermoelectric elements are variously applied to home appliances, electronic parts, and communication parts. For example, the thermoelectric element may be applied to a cooling device, a heating device, or a power generating device. Accordingly, the demand for thermoelectric performance of the thermoelectric element is increasing.

In manufacturing such a thermoelectric element, solder is used for bonding between the thermoelectric leg and the electrode. However, when the solder overflows, an electrical connection is made between adjacent electrodes, resulting in a short circuit and deterioration of performance of the thermoelectric element.

A technical problem to be achieved by the present invention is to provide a thermoelectric element with less occurrence of a short circuit between electrodes.

A thermoelectric device according to an embodiment of the present invention includes a first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate, the plurality of P-type thermoelectric legs, and the plurality of N-type thermoelectric legs. a second substrate disposed on an N-type thermoelectric leg; and a plurality of electrodes connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series, wherein the plurality of electrodes comprise the first substrate and the plurality of electrodes. A plurality of first electrodes disposed between a plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a plurality of first electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. a second electrode between the first electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and between the second electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs A solder disposed therebetween, and a connection layer disposed between the plurality of first electrodes and between the plurality of second electrodes, wherein the connection layer extends from the first substrate and the second substrate and extends from the first substrate to the plurality of second electrodes. It is the same material as the first substrate and the second substrate.

One surface of the connection layer may be the same plane as a surface where the solder contacts the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs.

The material may include epoxy.

An area of the solder may be 40% to 60% of an area of each of the first electrode and the second electrode.

The solder may have a dumbbell shape.

A distance between the first electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and between the second electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs may be 0.1 mm. .

The plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs may include receiving grooves for accommodating the solder.

The receiving groove may be formed at both ends of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs.

According to an embodiment of the present invention, it is possible to prevent a short circuit between adjacent electrodes inside the thermoelectric element, thereby reducing the probability of defects occurring in manufacturing the thermoelectric element, and obtaining a thermoelectric element having excellent performance.

In addition, according to an embodiment of the present invention, a high bonding force between the thermoelectric leg and the electrode is provided through solder, so that the structural stability of the thermoelectric element can be improved.

Further, improved bonding strength between solder and the thermoelectric legs may be provided through thermoelectric legs having various shapes.

1 is a cross-sectional view of a thermoelectric element according to an embodiment of the present invention.
2 is a perspective view of a thermoelectric element according to an embodiment of the present invention.
3 is a cross-sectional view of a thermoelectric element when there is no connection layer.
4 is a diagram illustrating soldering of a thermoelectric element when there is no connection layer.
5 is a cross-sectional view of a thermoelectric element in the presence of a connection layer.
6 is a view showing solder of a thermoelectric element when a connection layer is present.
7 is a view showing receiving grooves of a P-type thermoelectric leg and an N-type thermoelectric leg of a thermoelectric element according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments are illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as second and first may be used to describe various components, but the components are not limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a second element may be termed a first element, and similarly, a first element may be termed a second element, without departing from the scope of the present invention. The terms and/or include any combination of a plurality of related recited items or any of a plurality of related recited items.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, but the same or corresponding components regardless of reference numerals are given the same reference numerals, and overlapping descriptions thereof will be omitted.

1 is a cross-sectional view of a thermoelectric element according to an embodiment of the present invention, and FIG. 2 is a perspective view of a thermoelectric element according to an embodiment of the present invention.

1 and 2, the thermoelectric element 100 includes a first substrate 110, a first electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, and a second electrode 150. , a second substrate 160, a dielectric layer 170, a connection layer 180, and a solder 190.

The first electrode 120 is disposed between the first substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second electrode 150 is disposed between the second substrate 160 and the P-type thermoelectric leg. It is disposed between the thermoelectric leg 130 and the N-type thermoelectric leg 140 . Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 are electrically connected by the first electrode 120 and the second electrode 150 . A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the first electrode 120 and the second electrode 150 and electrically connected to each other may form a unit cell.

For example, when a voltage is applied to the first electrode 120 and the second electrode 150 through the lead wires 181 and 182, the P-type thermoelectric leg 130 moves from the N-type thermoelectric leg 140 due to the Peltier effect. A substrate through which current flows may absorb heat and act as a cooling part, and a substrate through which current flows from the N-type thermoelectric leg 140 to the P-type thermoelectric leg 130 may be heated and act as a heating part.

Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth steluride (Bi-Te)-based thermoelectric legs containing bismuth (Bi) and tellurium (Ti) as main materials. The P-type thermoelectric leg 130 includes antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium with respect to 100 wt% of the total weight. (Ga), tellurium (Te), bismuth (Bi) and indium (In) bismuth steluride (Bi-Te)-based main raw material containing at least one of 99 to 99.999 wt% and a mixture containing Bi or Te 0.001 It may be a thermoelectric leg containing 1wt% to 1wt%. For example, the main raw material is Bi-Se-Te, and Bi or Te may be further included in an amount of 0.001 to 1 wt% of the total weight. The N-type thermoelectric leg 140 includes selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium with respect to 100 wt% of the total weight. (Ga), tellurium (Te), bismuth (Bi) and indium (In) bismuth steluride (Bi-Te)-based main raw material containing at least one of 99 to 99.999 wt% and a mixture containing Bi or Te 0.001 It may be a thermoelectric leg including 1wt% to 1wt%. For example, the main raw material is Bi-Sb-Te, and Bi or Te may be further included in an amount of 0.001 to 1 wt% of the total weight.

The P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be formed in a bulk or stacked type. In general, the bulk P-type thermoelectric leg 130 or the bulk-type N-type thermoelectric leg 140 heat-treats a thermoelectric material to produce an ingot, crushes and sieves the ingot to obtain powder for the thermoelectric leg, and then obtains powder for the thermoelectric leg. It can be obtained through a process of sintering and cutting the sintered body. The laminated P-type thermoelectric leg 130 or the laminated N-type thermoelectric leg 140 is formed by applying a paste containing a thermoelectric material on a sheet-shaped substrate to form unit members, and then stacking and cutting the unit members. can be obtained

In this case, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume or different shapes and volumes. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different, the height or cross-sectional area of the N-type thermoelectric leg 140 is set as the height or cross-sectional area of the P-type thermoelectric leg 130. may be formed differently.

Performance of the thermoelectric element 100 according to an embodiment of the present invention may be expressed as a Seebeck exponent. The Seebeck index (ZT) can be expressed as in Equation 1.

Here, α is the Seebeck coefficient [V/K], σ is the electrical conductivity [S/m], and α ² σ is the power factor (W/mK ² ). And, T is the temperature and k is the thermal conductivity [W/mK]. k can be expressed as a·c _p ·ρ, where a is the thermal diffusivity [cm ² /S], c _p is the specific heat [J/gK], and ρ is the density [g/cm ³ ].

To obtain the Seebeck exponent of the thermoelectric element 100, a Z value (V/K) may be measured using a Z meter, and the Seebeck exponent (ZT) may be calculated using the measured Z value.

Here, the first electrode 120 disposed between the first substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second substrate 160 and the P-type thermoelectric leg 130 and the second electrode 150 disposed between the N-type thermoelectric legs 140 includes at least one of copper (Cu), silver (Ag), and nickel (Ni), and may have a thickness of 0.01 mm to 0.3 mm. there is. When the thickness of the first electrode 120 or the second electrode 150 is less than 0.01 mm, the function as an electrode may be deteriorated and electrical conduction performance may be lowered. When the thickness exceeds 0.3 mm, the conduction efficiency may be lowered due to an increase in resistance can

Also, the first substrate 110 and the second substrate 160 facing each other may be an insulating substrate or a metal substrate. The insulating substrate may be an alumina substrate or a flexible polymer resin substrate. Polymer resin substrates having flexibility have high permeability such as polyimide (PI), polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), and resin. It may include various insulating resin materials such as plastic. The metal substrate may include Cu, a Cu alloy, a Cu-Al alloy, or Bn, and may have a thickness of 0.1 mm to 0.5 mm. When the thickness of the metal substrate is less than 0.1 mm or greater than 0.5 mm, heat dissipation characteristics or thermal conductivity may be excessively high, and thus reliability of the thermoelectric element 100 may be deteriorated. In addition, when the first substrate 110 and the second substrate 160 are metal substrates, between the first substrate 110 and the first electrode 120 and between the second substrate 160 and the second electrode 150 Each dielectric layer 170 may be further formed. The dielectric layer 170 includes a material having a thermal conductivity of 5 to 10 W/K, and may be formed to a thickness of 0.01 mm to 0.15 mm. When the thickness of the dielectric layer 170 is less than 0.01 mm, insulation efficiency or withstand voltage characteristics may be reduced, and when the thickness exceeds 0.15 mm, thermal conductivity may be lowered and heat dissipation efficiency may be lowered.

At this time, the size of the first substrate 110 and the second substrate 160 may be formed differently. For example, the volume, thickness or area of one of the first substrate 110 and the second substrate 160 may be greater than that of the other. Accordingly, heat absorbing performance or heat dissipation performance of the thermoelectric element 100 may be improved.

In addition, a heat dissipation pattern, for example, a concave-convex pattern, may be formed on the surface of at least one of the first substrate 110 and the second substrate 160 . Accordingly, heat dissipation performance of the thermoelectric element 100 may be improved. When the concavo-convex pattern is formed on a surface contacting the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, bonding characteristics between the thermoelectric leg and the substrate may also be improved.

The connection layer 180 is disposed between the plurality of first electrodes 120 and between the plurality of second electrodes 150, and the plurality of first electrodes 120, the plurality of second electrodes 150, and the solder 190 ) is surrounded by One surface of the connection layer 180 may be the same plane as a surface where the solder 190 and the plurality of P-type thermoelectric legs 130 contact each other. In addition, one surface of the connection layer 180 may be the same plane as a surface where the solder 190 and the plurality of N-type thermoelectric legs 140 contact each other.

The connection layer 180 may protrude from the substrate between the plurality of electrodes. In this case, the connection layer 180 acts as a barrier between the plurality of first electrodes 120 and between the plurality of second electrodes 150, and the solder 190 on the first electrode 120 and the second electrode 150 ) can be prevented from overflowing.

In addition, one surface of the connection layer 180 may be disposed above or below a surface where the solder 190 contacts the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 .

The other surface of the connection layer 180 is in contact with the board, and the connection layer 180 may have the same height as the distance from the board to the solder 190.

In addition, the connection layer 180 is an extension of the first substrate 110 and the second substrate 160 and may include the same material as the first substrate 110 and the second substrate 160 . Accordingly, the connection layer 180 includes insulation or metal, and the insulation may be alumina or a polymer resin having flexibility.

As an example, the connection layer 180 may include epoxy, phenol, polymer polyimide (PI), polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate ( It may include various insulating resin materials such as high permeability plastics such as PET) and resin. In addition, the connection layer 180 may include Cu, a Cu alloy, a Cu-Al alloy, or Bn.

As an example, the connection layer 180 may include epoxy. And the thermal conductivity of epoxy is 9.5 W/mK, which is higher than the thermal conductivity of air 0.025 W/mK. Accordingly, the thermal conductivity of the connection layer 180 may be higher than that of air.

Accordingly, due to a difference in thermal conductivity between the connection layer 180 and air, the solder 190 disposed on the first electrode 120 and the second electrode 150 may have a dumbbell shape. In this regard, it will be described in FIGS. 3 to 6 below.

The solder 190 may be disposed between the first electrode 120 and the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 . In addition, the solder 190 may be disposed between the second electrode 150 and the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 .

A distance between the first electrode 120 and the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 may be preferably 0.1 mm or less, but is not limited thereto. In addition, the distance between the second electrode 150 and the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 may be preferably 0.1 mm or less, but is not limited thereto. Accordingly, the height of the solder 190 may be 0.1 mm or less.

The solder 190 is made of tin (Sn), silver (Ag), copper (Cu), bismuth (Bi), indium (In), zinc (Zn), antimony (Sb), lead (Pb), and gold (Au). It may include an alloy of a composition in which any one or two or more are contained.

The solder 190 may be an adhesive member for bonding between the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 and the electrodes 120 and 150 . In addition, the solder 190 may have conductivity for thermoelectric efficiency between the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 and the electrodes 120 and 150, and may include nanowires or the like to have improved adhesion characteristics. can

When the solder 190 is reflowed on the first electrode 120 and the second electrode 150 under a constant pressure and temperature, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 and are joined

Also, the area of the solder 190 may be 30% to 70% of the area of each of the first electrode 120 and the second electrode 150 . In more detail, the area of the solder 190 may be 40% to 60% of the area of each of the first electrode 120 and the second electrode 150 . Accordingly, the probability that the solder 190 disposed on the electrode overflows and a short circuit occurs between the electrodes may be very low.

3 to 4 are views showing a cross-sectional view of the thermoelectric element and solder of the thermoelectric element when there is no connection layer, respectively, and FIGS. 5 and 6 are cross-sectional views of the thermoelectric element and solder of the thermoelectric element when there is a connection layer, respectively. is a drawing showing

Referring to FIGS. 3 and 4 , when there is no connection layer between adjacent first electrodes and between adjacent second electrodes, solder on the first electrode and the second electrode may overflow. Therefore, it is electrically connected to the adjacent first electrode, and a short circuit, which is an electrical phenomenon, may occur.

This is because the solder spreads evenly over the entire upper surface of the first electrode as the first electrode disposed on the first substrate contacts air except for the surface in contact with the first substrate. The same may be applied to the second substrate and the second electrode as described above.

Referring to FIG. 4 , it can be seen that the solder disposed on the first substrate spreads over the entire first substrate when there is no connection layer.

Referring to FIGS. 5 and 6 , when there is a connection layer between the first electrodes and between adjacent second electrodes, the solder on the first electrode and the second electrode may have a dumbbell shape. Accordingly, electrical connection (short) between adjacent first electrodes caused by overflow of solder may be prevented, thereby reducing the defect rate of the thermoelectric element. In addition, a thermoelectric element having improved thermoelectric performance may be provided.

This is because only the surface opposite to the surface in contact with the first electrode and the first substrate is in contact with air, and the other surfaces are surrounded by the substrate and the connection layer. In one embodiment, the connection layer is an extended portion of the first substrate and may include the same epoxy as the first substrate. In this case, as described above, since the thermal conductivity of epoxy is higher than that of air, a large amount of heat transfer occurs from the edge of the first substrate to the connection layer in contact with the edge of the first substrate during reflow. This lowers the temperature at the edge of the first substrate. Due to this, the spread of the solder decreases due to the difference in thermal conductivity toward the edge of the first substrate during reflow, so that the solder may have a dumbbell shape.

When the solder has a dumbbell shape, overflowing of the solder on the electrode can be prevented. In addition, the solder may aggregate on the electrode at a junction between the P-type thermoelectric leg and the N-type thermoelectric leg, and thus have improved bonding strength. This improves the structural stability of the thermoelectric element.

In addition, the above description can be equally applied to the second substrate.

7 is a view showing receiving grooves of a P-type thermoelectric leg and an N-type thermoelectric leg of a thermoelectric element according to an embodiment of the present invention. Referring to FIG. 7 , accommodating grooves h1 , h2 , h3 , and h4 are formed at both ends of the P-type thermoelectric leg and the N-type thermoelectric leg where the P-type thermoelectric leg and the N-type thermoelectric leg are connected to the first substrate and the second substrate. It can be.

The accommodating grooves h1 , h2 , h3 , and h4 may receive solder to improve bonding strength between the P-type thermoelectric leg and the N-type thermoelectric leg and the solder.

In addition, the receiving grooves h1, h2, h3, and h4 may have various shapes. For example, it may have a shape such as an ellipse (h1), a rectangle (h2), or a triangle (h3).

In the case of the ellipse (h1) and the triangle (h3), the area of the receiving groove increases in the direction of one end of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, but in the case of the square (h2), the area of the receiving groove is larger than the plurality of P-type thermoelectric legs. The direction of one end of the thermoelectric leg and the plurality of N-type thermoelectric legs may be the same. The receiving groove may have various areas by having various shapes.

A plurality of shapes may be repeated shapes h4. And, the height of the receiving groove may be 0.1 mm or less.

The thermoelectric element according to the embodiment of the present invention may act on a device for power generation, a device for cooling, a device for heating, and the like. Specifically, the thermoelectric element according to the embodiment of the present invention is mainly used in optical communication modules, sensors, medical devices, measuring devices, aerospace industries, refrigerators, chillers, automobile ventilation seats, cup holders, washing machines, dryers, and wine cellars. , a water purifier, a sensor power supply, a thermopile, and the like.

Here, as an example of applying the thermoelectric element according to the embodiment of the present invention to a medical device, there is a polymerase chain reaction (PCR) device. A PCR device is a device for amplifying DNA to determine a nucleotide sequence of DNA, and requires precise temperature control and a thermal cycle. To this end, a Peltier-based thermoelectric element may be applied.

Another example of applying the thermoelectric element according to the embodiment of the present invention to a medical device is an optical detector. Here, the photodetector includes an infrared/ultraviolet ray detector, a charge coupled device (CCD) sensor, an X-ray detector, a thermoelectric thermal reference source (TTRS), and the like. A Peltier-based thermoelectric element may be applied to cool the photodetector. Accordingly, it is possible to prevent a change in wavelength, a decrease in output, and a decrease in resolution due to an increase in temperature inside the photodetector.

As another example of application of the thermoelectric element according to the embodiment of the present invention to medical devices, the field of immunoassay, the field of in vitro diagnostics, the field of temperature control and cooling (general temperature control and cooling systems), There are physical therapy fields, liquid chiller systems, and blood/plasma temperature control fields. Accordingly, precise temperature control is possible.

Another example of applying the thermoelectric element according to the embodiment of the present invention to a medical device is an artificial heart. Accordingly, power can be supplied to the artificial heart.

Examples of applications of the thermoelectric element according to the embodiment of the present invention to the aerospace industry include star tracking systems, thermal imaging cameras, infrared/ultraviolet detectors, CCD sensors, Hubble Space Telescope, TTRS, and the like. Accordingly, the temperature of the image sensor may be maintained.

Other examples of the thermoelectric element according to the embodiment of the present invention applied to the aerospace industry include a cooling device, a heater, and a power generating device.

In addition, the thermoelectric element according to the embodiment of the present invention can be applied to other industrial fields for power generation, cooling, and heating.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. You will understand that it can be done.

100: thermoelectric element
110: first substrate
120: first electrode
130: P-type thermoelectric leg
140: N-type thermoelectric leg
150: second electrode
160: second substrate
170: dielectric layer
180: connection layer
190: solder

Claims (8)

a first substrate;
a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate;
a second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; and
a plurality of electrodes connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series;
The plurality of electrodes,
a plurality of first electrodes disposed between the first substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; and
a plurality of second electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs;
Solder disposed between the first electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and between the second electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; and
Further comprising a connection layer disposed between the plurality of first electrodes and between the plurality of second electrodes,
The connection layer extends from the first substrate and the second substrate and is made of the same material as the first substrate and the second substrate,
The thermal conductivity of the connecting layer is higher than the thermal conductivity of air,
The thermoelectric element of claim 1 , wherein the solder has a dumbbell shape and has an area of 40% to 60% of an area of each of the first electrode and the second electrode. According to claim 1,
One side of the connection layer is
A thermoelectric element having the same plane as a surface at which the solder is in contact with the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. According to claim 2,
The material is a thermoelectric element including epoxy. delete delete According to claim 1,
A distance between the first electrode, the plurality of P-type thermoelectric legs, and the plurality of N-type thermoelectric legs, and between the second electrode and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs is 0.1 mm. . According to claim 1,
The plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs,
A thermoelectric element comprising an accommodation groove accommodating the solder. According to claim 7,
The receiving groove is formed at both ends of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs.

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