KR20190081968A - Heat radiating sheet integrated digitizer and display device comprising the same - Google Patents

Abstract

According to the present invention, a digitizer comprises: an insulating layer; a thermal diffusion magnetic layer formed on the insulating layer; and a metal thin film formed on the thermal diffusion magnetic layer. The thermal diffusion magnetic layer includes one or more heat dissipating particles of CNT, graphene, and ceramic particles and one or more magnetic particles of Fe, Al, Si, Mn, and Cr.

Description

Technical Field [0001] The present invention relates to a digitizer and a display device including the digitizer,

The present invention relates to a digitizer and a display device including the same.

Recently, a technique of applying a digitizer to a display device has attracted attention, and the digitizer is a structure adjacent to a display surface, and heat dissipation characteristics are important factors.

Up to now, although the heat dissipation characteristics are secured by the method of interposing the graphite between the adhesive layers, graphite is low in flexibility and flexibility, and is a cause of defects such as breakage of graphite in graphite or graphite- .

Therefore, there is a need for a digitizer that is flexible and has excellent heat radiation effect, can prevent peeling, and is excellent in durability and reliability.

In addition, it is required to reduce the number of layers of the multilayer structure to improve not only the processability but also the thickness of the display device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a digitizer which is flexible and excellent in heat radiation effect and peeling prevention effect, and a display device including the same.

Another object of the present invention is to provide a digitizer excellent in durability and reliability and a display device including the same.

It is still another object of the present invention to provide a digitizer and a display device including the same that can reduce the number of layers of a multi-layered structure to improve not only the processability but also the thickness of the display device.

The above and other objects of the present invention can be achieved by the present invention described below.

One aspect of the invention relates to a digitizer.

In one embodiment, the digitizer includes an insulating layer, a heat diffusing magnetic layer formed on the insulating layer, and a metal thin film formed on the heat diffusing magnetic layer, wherein the heat diffusing magnetic layer includes at least one heat dissipating particle of CNT, graphene, And one or more magnetic particles of Fe, Al, Si, Mn, and Cr.

The ceramic particles may be selected from the group consisting of aluminum hydroxide (Al (OH) ₃ ), neodymium oxide (Nd ₂ O ₃ ), talc, alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), aluminum nitride It may include one or more of the nitride (BN) and silica (SiO _2).

The thermal diffusion magnetic layer may have a thermal conductivity of 0.5 W / m · K to 20 W / m · K.

The thermal diffusion magnetic layer may have an adhesive force of 500 gf / cm 2 to 2,500 gf / cm 2.

The thermal diffusion magnetic layer may have a magnetic permeability of 100 mu m to 200 mu m and a performance coefficient of 4,000 to 8,500.

The thermal diffusion magnetic layer may have a thickness of 10 mu m to 80 mu m.

The metal thin film may include at least one of copper, nickel, silver, aluminum, gold, tin, zinc, and manganese.

The metal thin film may have a thickness of 5 탆 to 36 탆.

The digitizer may have a flexural elasticity of 10 mg to 40 mg at 25 ° C.

The thermal diffusion magnetic layer may be formed of a composition for forming a thermal diffusion magnetic layer, and the composition for forming a thermal diffusion magnetic layer may include 2 to 20% by weight of heat radiation particles and 50 to 90% by weight of magnetic particles.

The thermal diffusion magnetic layer may have a weight ratio of the heat dissipation particles and the magnetic particles of 1:45 to 1: 4.

The composition for forming a thermal diffusion magnetic layer may include at least one of an epoxy-based adhesive, an acrylic adhesive, and a urethane-based adhesive in an amount of 10 to 40% by weight of the thermally-induced magnetic layer composition.

The composition for forming a heat-induced magnetic layer includes a urethane-based adhesive, and the urethane-based adhesive may include 5 to 30% by weight of a urethane resin in the thermally-induced magnetic layer composition, 1 to 10% by weight of an epoxy resin, and 1 to 10% .

Another aspect of the invention relates to a display device.

In one embodiment, the display device may include a printed circuit board, a digitizer of claim 1 formed on the printed circuit board, a display panel formed on the digitizer, and a touch screen panel formed on the display panel .

The present invention provides a digitizer which is flexible and has excellent heat dissipation effect, peel prevention effect, durability and reliability, and can reduce the number of layers of a multi-layer structure to improve not only the processability but also the thickness of the display device, and a display device including the same .

FIG. 1 is a simplified illustration of a cross-section of a digitizer according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a display device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings. However, the techniques disclosed in this application are not limited to the embodiments described herein but may be embodied in other forms.

Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this invention to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. Also, while only a portion of the components is shown for convenience of explanation, those skilled in the art will readily recognize the remaining portions of the components.

When an element is described at the point of view of the general description of the drawings and an element is referred to as being located above or below another element, it is to be understood that the element may be located immediately above or below another element, Quot; can be intervened. Those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. In the drawings, the same reference numerals denote substantially the same elements.

It should be understood, however, that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" Acts, components, parts, or combinations thereof, but does not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof It should be understood that it does not.

In the present specification, 'X to Y' representing the range means 'X or more and Y or less'.

In the present specification, the coefficient of performance is a constant for determining a property to be magnetized in a unit area, and is a value obtained by removing a thickness variable by replacing the thickness with 1 at a permeability value. It is used to confirm the degree of magnetization performance within a unit area.

Digitizer

A digitizer according to one embodiment of the present invention will be described with reference to FIG. FIG. 1 is a simplified illustration of a cross-section of a digitizer according to an embodiment of the present invention.

1, a digitizer 100 according to an embodiment of the present invention includes an insulating layer 10, a thermal diffusion magnetic layer 20 formed on the insulating layer 10, and a thermal diffusion layer 20 formed on the thermal diffusion magnetic layer 20, The thermal diffusion magnetic layer 20 includes at least one of heat dissipation particles of CNT, graphene and ceramic particles and at least one of Fe, Al, Si, Mn, and Cr magnetic particles.

The heat radiation particles include at least one of CNT, graphene, and ceramic particles.

The CNT and the graphene are not particularly limited as long as they are effective for heat dissipation.

The ceramic particles may be selected from the group consisting of aluminum hydroxide (Al (OH) ₃ ), neodymium oxide (Nd ₂ O ₃ ), talc, alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), aluminum nitride It may include one or more of the nitride (BN) and silica (SiO _2). The ceramic particles may have a particle diameter (D50) of 0.1 占 퐉 to 20 占 퐉, specifically, 3 占 퐉 to 10 占 퐉. In the range of the particle diameter, the balance between the adhesive force and the heat radiation effect is excellent.

The magnetic particles may include at least one of Fe, Al, Si, Mn, and Cr.

The insulating layer 10 may serve to maintain insulation with a circuit board that may be disposed below.

The insulating layer 40 may be a polymer resin, and any polymer resin conventionally used in the art may be used without limitation. Specifically, it may be an acrylic resin, a polyurethane resin, a polyester resin, a cellulose resin, an epoxy resin, a polyamide resin, a polyimide resin, a silicone resin, a phenol resin, an alkyd resin, a melamine resin, have. The number average molecular weight of the polymer resin may be 10,000 to 300,000, but is not limited thereto. For example, the insulating layer 300 may use a polyimide resin in terms of chemical resistance, withstanding voltage characteristics, scratch resistance, and abrasion resistance.

The thermal diffusion magnetic layer 20 serves as a digitizer panel and can radiate heat generated in the apparatus. In the prior art, the metal layer (or the magnetic layer), the heat dissipation layer, and the adhesive layer between the metal layer (or the magnetic layer) and the adhesive layer therebetween are separately formed to make it difficult to realize thinning, and the process is complicated. However, Thereby solving the above problems.

Specifically, the thermal diffusion magnetic layer 20 includes magnetic particles, and when an external magnetic field is generated, a thin electromagnetic field is generated. An external pen (not shown, for example, having a miniature antenna coil generating an alternating magnetic field) It is possible to send and receive wireless communication. When the pen approaches the thermal diffusion magnetic layer 10, an electromagnetic induction phenomenon occurs, and an electromagnetic field already formed in the thermal diffusion magnetic layer 20 is deformed. By sensing the deformation of the magnetic field through a sensor disposed at one corner, Recognizes the Y coordinate and recognizes the operation of the pen.

In addition, the thermal diffusion magnetic layer 20 includes heat dissipation particles having excellent thermal conductivity, and efficiently dissipates heat generated in components in the device, thereby improving the accuracy, durability and reliability of the display device.

The thermal diffusion magnetic layer 20 may have a thermal conductivity of 0.5 W / m · K to 20 W / m · K, specifically 3 W / m · K to 5 W / m · K. The heat radiating effect of the digitizer is excellent in the range of the thermal conductivity.

The thermal diffusion magnetic layer 20 may have an adhesive force (or a peel strength) of 500 gf / cm to 2,500 gf / cm, specifically 700 gf / cm to 1,500 gf / cm. Within this range, the heat-diffusing magnetic layer can be stably attached to the insulating layer and the metal thin film without requiring a pressure-sensitive adhesive or an adhesive, and the durability and reliability of the display device are excellent.

The thermal diffusion magnetic layer 20 may have a magnetic permeability of 100 mu m to 200 mu m and a performance coefficient of 4,000 to 8,500. Within this range, there is an advantage that the accuracy of the digitizer is high.

The heat-diffusing magnetic layer 20 is formed of a composition for forming a heat-induced magnetic layer, and the composition for forming a heat-induced magnetic layer comprises 2 to 20% by weight of heat radiation particles, specifically 5 to 12% by weight and 50 to 90% By weight to 84% by weight. Within this range, the accuracy and heat radiation effect of the digitizer are excellent.

The thermal diffusion magnetic layer may have a weight ratio of the heat dissipation particles and the magnetic particles of 1:45 to 1: 4, specifically 1: 5 to 1:30. In the weight ratio range, both the accuracy and the heat radiation effect of the digitizer are excellent.

The heat-diffusing magnetic layer composition may include at least one of an epoxy-based adhesive, an acrylic-based adhesive, and a urethane-based adhesive in an amount of 10 to 40% by weight of the thermally-induced magnetic layer composition. In the above range, the digitizer is excellent in the balance between the heat radiation effect and the adhesive force.

The heat-induced magnetic layer composition comprises a urethane-based adhesive, wherein the urethane-based adhesive contains 5 to 30% by weight of a urethane resin (polyol + TDI), 1 to 10% by weight of an epoxy resin and 1 to 10% by weight of an acrylic adhesive strength enhancer can do. In the above range, the thermal diffusion magnetic layer is excellent in balance between the heat radiation effect and the adhesive force.

The epoxy resin may include at least one of YD-128, YD-134, and YD014.

The thickness of the thermal diffusion magnetic layer 20 may be 10 占 퐉 to 80 占 퐉, specifically, 25 占 퐉 to 60 占 퐉. In the above range, it is possible to realize thinness without deteriorating the heat radiation characteristic of the digitizer.

The metal thin film 30 may include at least one of copper, nickel, silver, aluminum, gold, tin, zinc, and manganese. The metal foil may be deposited on the thermal diffusion film in the form of a foil. Alternatively, the metal thin film may be formed on a thermal diffusion film by a sputtering method.

The metal thin film 30 can be a copper thin film in terms of excellent heat conduction and electromagnetic shielding properties.

The metal thin film 30 may have a thickness of 5 탆 to 36 탆, specifically 8 탆 to 25 탆, more specifically 12 탆 to 20 탆. In this case, the balance between the heat dissipation effect and thinning of the digitizer is excellent.

The digitizer may have a flexural elasticity at 25 캜 of 10 mg to 40 mg, specifically 20 mg to 30 mg. In this range, it is possible to prevent the occurrence of cracking or peeling even when the digitizer is used in a curved or curved display device.

The digitizer may be manufactured by applying a composition for forming a thermally-induced magnetic layer on an insulating layer, drying and / or curing the composition at 110 ° C to 150 ° C for 1 minute to 3 minutes to form a thermal diffusion magnetic layer, But is not limited thereto.

Display device

Another aspect of the invention relates to a display device. A display device according to an embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view of a display device according to an embodiment of the present invention.

2, a display device 1000 according to an exemplary embodiment of the present invention includes a printed circuit board 200, a digitizer 100 formed on the printed circuit board 200, A display panel 300 formed on the display panel 300 and a touch screen panel 400 formed on the display panel 300.

The printed circuit board 200 is a main circuit board capable of driving a display device, and can be stacked on the digitizer 100 via an adhesive layer.

The display panel 300 may be an LCD, an LED, an OLED or an AMOLED type to serve as an interface with a display device user, and the touch screen panel 400 may be disposed on the display panel 300. The touch screen panel 400 may be implemented on-cell on the display panel 300, but is not limited thereto.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.

Example

Example  One

A thermally-induced magnetic layer (thickness: 40 占 퐉) was formed by drying and / or curing in a B-stage state to form a metal thin film (Cu, 12 占 퐉) A digitizer was manufactured by bonding the foil. The composition for forming a heat-induced magnetic layer is such that 65% by weight of magnetic particles (Fe-Al-Si, D-90 100 μm), 10% by weight of heat radiation particles (SiO _2, 3 μm, BN, 10 μm) 18% by weight of polyol + TDI Hanwha advanced material), 5% by weight of epoxy resin (YD128, Kukdo Chemical) and 2% by weight of acrylic adhesive strength enhancer (CS-60, CSC).

Comparative Example  One

A metal layer of an Fe alloy (component) having a thickness of 25 mu m was formed on the insulating layer, and graphite (thickness: 17 mu m) was laminated via an epoxy adhesive, and then a metal thin film (Cu, ) Foil was bonded to produce a digitizer. The total thickness of the metal layer, the graphite and the two adhesive layers was 37 탆.

Property evaluation method

(1) Flexural elasticity at 25 캜 (unit: mg): Digitizers of Example 1 and Comparative Example 1 were cut into 1 cm x 15 cm, bent in a loop shape, and flexural elasticity was measured at a distance of 10 mm The results are shown in Table 1 below.

(2) Maximum temperature (° C): The temperature of the digitizer surface was measured with a thermal imager after 10 minutes from placing the heat source at the same point after the digitizer was manufactured.

(3) Adhesion (kgf / cm): The adhesive strength of the thermal diffusion adhesive film to the metal layer and the metal thin film in Example 1 and the adhesion of the graphite to the metal layer and the metal thin film in Comparative Example 1 were measured. The test method was a hot press (160 ° C, 45 kgf / cm ² , 60 minutes) on the FCCL Cu surface, followed by peeling at 1 cm x 15 cm and pulling at a 90 ° angle of 50 mm / min.

Flexural elasticity (25 ℃) Maximum temperature Adhesion Example 1 25 mg 66.8 캜 Adhesion to metal layer:
0.7kgf / cm
Adhesion to metal foil:
1.2kgf / cm Comparative Example 1 36 mg 68.1 DEG C Adhesion to metal layer:
0.7kgf / cm
Adhesion to metal foil:
2.0 kgf / cm

As shown in Table 1, Example 1 in which the thermally-induced magnetic layer of the present invention was applied had a low flexural modulus at 25 占 폚 without lowering the heat radiation effect and the adhesive strength, so that even when applied to a curved surface or a curved- And it is possible to realize a thinner structure and a simple process.

On the other hand, in Comparative Example 1 in which the metal layer and the graphite were laminated together with the two layers of the pressure-sensitive adhesive, there was a problem that the graphite was broken or peeled when applied to a curved or end curved display due to a high flexural modulus, .

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are in all respects illustrative and not restrictive.

10: insulating layer 20: thermal diffusion magnetic layer
30: metal thin film 100: digitizer
200: printed circuit board 300: display panel
400: touch screen panel 1000: display device

Claims (14)

Insulating layer;
A thermal diffusion layer formed on the insulating layer; And
And a metal thin film formed on the thermal diffusion magnetic layer,
The thermal diffusion magnetic layer may include one or more heat dissipation particles of CNT, graphene, and ceramic particles; And at least one magnetic particle selected from the group consisting of Fe, Al, Si, Mn, and Cr.
The method according to claim 1,
The ceramic particles may be selected from the group consisting of aluminum hydroxide (Al (OH) ₃ ), neodymium oxide (Nd ₂ O ₃ ), talc, alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), aluminum nitride digitizer comprising at least one of nitride (BN) and silica (SiO _2).
The method according to claim 1,
Wherein the thermal diffusion magnetic layer has a thermal conductivity of 0.5 W / m K to 20 W / m K.
The method according to claim 1,
Wherein the thermally-diffusing magnetic layer has an adhesive force of 500 gf / cm to 2,500 gf / cm.
The method according to claim 1,
The thermal diffusion magnetic layer has a permeability of 100 mu m to 200 mu m and a coefficient of performance of 4,000 to 8,500.
The method according to claim 1,
Wherein the thermally-diffused magnetic layer is 10 占 퐉 to 80 占 퐉 thick.
The method according to claim 1,
Wherein the metal thin film comprises at least one of copper, nickel, silver, aluminum, gold, tin, zinc and manganese.
The method according to claim 1,
Wherein the metal thin film has a thickness of 5 占 퐉 to 36 占 퐉.
The method according to claim 1,
Wherein the digitizer has a flexural elasticity at 25 占 폚 of 10 mg to 40 mg.
The method according to claim 1,
The thermal diffusion magnetic layer is formed of a composition for forming a thermal diffusion magnetic layer,
Wherein the composition for forming a thermal diffusion magnetic layer comprises 2 to 20% by weight of heat radiation particles and 50 to 90% by weight of magnetic particles.
The method according to claim 1,
Wherein the thermal diffusion magnetic layer is a 1:45 to 1: 4 weight ratio of heat dissipation particles and magnetic particles.
10. The method of claim 9,
Wherein the composition for forming a thermal diffusion magnetic layer comprises 10 to 40% by weight of at least one of an epoxy adhesive, an acrylic adhesive, and a urethane adhesive in a thermal diffusion magnetic layer composition.
10. The method of claim 9,
Wherein the composition for forming a heat-induced magnetic layer comprises a urethane-based adhesive, wherein the urethane-based adhesive includes 5 to 30% by weight of a urethane resin in the thermally-induced magnetic layer composition, 1 to 10% by weight of an epoxy resin, and 1 to 10% by weight of an acrylic adhesion promoter.
Printed circuit board;
A digitizer of claim 1 formed on the printed circuit board;
A display panel formed on the digitizer; And
And a touch screen panel formed on the display panel.

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