KR20140089962A - The thermal radiation film which is formed on the wireless coil - Google Patents

Abstract

The present invention is characterized in that a coil for transmitting and receiving electroluminescence data and a substrate on which a coil is formed are further provided, a heat radiation film layer is further provided on the coil, the coil is an NFC coil, a ferrite sheet is provided below the coil, The heat-radiating film formed in the heat-radiating film is patterned so that a heat-radiating film patterned in the form of a coil is formed at the upper end of the coil for transmitting and receiving data or power energy wirelessly, It is possible to provide a heat dissipation film.

Description

[0001] The present invention relates to a heat radiation film coated on a wireless coil,

The present invention relates to a method for forming a heat-radiating film on an upper end of a coil for transmitting and receiving data or power energy wirelessly, and a method for forming a heat-radiating film having a coil-like pattern on a coil.

Recently, with the development of the electronic industry, various electronic products, especially semiconductor components and display components, have become increasingly highly integrated and miniaturized, so that it is possible to efficiently solve heat problems generated in LCDs, PDPs, Performance and life span.

Thus, a heat-radiating film having an infrared radiation function is formed in the heat source, thereby releasing heat generated in the electronic device to the outside.

In addition, as communication and information processing technologies have been developed in recent years, use of portable devices that are convenient to carry such as mobile phones has been gradually increasing. The portable devices include NFC (Near Field Communication) antennas for short- Is used.

That is, in a Korean patent (No. 10-0990240), 800 weight parts of toluene, 400 weight parts of cyclohexane, 800 weight parts of SBS (Styrene Butadiene Styrene) and 600 weight parts of xylene were mixed with aluminum oxide (Al2O3) (BN) of 100 parts by weight and beryllium oxide (BeO) of 50 parts by weight based on 100 parts by weight of the filler mixture.

In Korean Patent Laid-Open Publication No. 10-2012-0103299, a green sheet having a half cut is cut to a size smaller than a set size to produce a plurality of divided sheets; And forming a sintered sheet having the set size by collecting the generated plurality of divided sheets, thereby producing a sintered sheet for an NFC antenna.

However, the heat radiation film can not be formed on the upper end of the antenna coil. Therefore, there is a need to solve the above-mentioned disadvantages.

Prior Art 1: Korean Patent No. 10-0990240 (October 20, 2010) Prior Art 2: Korean Patent Application No. 10-2012-0103299 (September 19, 2012)

SUMMARY OF THE INVENTION It is an object of the present invention to provide an antenna coil for transmitting and receiving data or energy, Method.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a coaxial cable which is provided with a coil for transmitting and receiving radio wave data and a substrate on which a coil is formed and further comprising a heat radiation film layer on the coil, The heat radiation film formed on the coil is achieved by being patterned.

A heat dissipation film is provided on the NFC coil, and an adhesive layer is formed on the upper side of the film when the attaching portion for attaching the film exists on the upper side of the film.

Further, a heat dissipation film is provided on the NFC coil, and if the attaching portion for attaching the film exists in the lower portion of the film, an adhesive layer is formed under the film.

On the other hand, the coil is formed on a substrate in the form of a wire wound around the coil. When a gap exists between the lead and the lead, the coil does not have a heat radiation film.

According to the present invention, a heat radiating film patterned in the form of a coil is formed on the top of a coil for transmitting and receiving data or power energy by radio, and a pattern shape for releasing heat generated from the device It is possible to provide a heat dissipation film having an excellent heat resistance.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an embodiment showing a patterned heat radiation film of the present invention. Fig.
2 is a view showing an embodiment showing a method of mounting a patterned heat-radiating film on a heat source component.
Figs. 3 to 9 are views of an embodiment of the present invention in which the shape of a pattern is described.
Figure 10 is an embodiment of a film layer actually used.

Hereinafter, a heat radiation sheet having a multi-layer structure according to a preferred embodiment of the present invention will be described in detail.

In this case, the known technology can be applied to the configuration of the present invention in a state in which the detailed description is omitted. In addition, the shapes shown in the drawings of the present invention may be shown to be different from the actual dimensions in order to explain the structure and the principle.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an embodiment showing a patterned heat radiation film of the present invention. Fig.

As shown in FIG. 1, a coil for transmitting and receiving wireless data means a normal coil 60, and in the present invention, it means NFC (Near Field Communication).

However, application of the technology of the present invention is not limited to the NFC coil. The coil for transmitting and receiving data or energy wirelessly can be applied to the technique of the present invention. That is, the coil 60 is formed in the form of a coiled electric wire, and the coil 60 is formed on the film in the form of an FPC (Flexible Printed Circuit). Of course, a flexible PCB is not necessarily used, and a normal PCB substrate may be used, or a film-type substrate may be used.

That is, the coil may be formed on the film substrate through the printing method, and the patterned coil may be formed through the etching process after deposition or through the laser after coating.

Meanwhile, in the present invention, a conventional coil 60 and a substrate 61 on which the coil is formed are provided. A heat radiation film is formed on the coil and the top of the substrate. That is, a heat dissipation film 70 provided at an upper end of the coil and a heat dissipation film provided at an upper end of the substrate 61 are provided. At this time, the heat radiation film 70 provided at the upper end of the coil has a pattern shape.

If the heat radiating film 70 is formed without patterning, the coil 60 can not function properly. Ceramic particles, carbon nanotube (CNT) particles or metal particles may be formed on the heat radiation film layer, and the particles may affect the magnetic field.

At this time, as a method of patterning the heat radiation film, a screen printing method may be used, or the whole may be printed and then etched. Alternatively, the heat radiation film may be coated and then patterned through a laser.

At this time, a heat radiation film directly patterned on the substrate 61 on which the coil is formed may be formed.

Generally, one heat-radiating film 70 (71) shown in FIG. 1 is manufactured by a method of forming and cutting a plurality of heat-radiating films 70 on a large substrate having a plurality of single substrates 71 do.

Alternatively, if a patterned heat-radiating film is directly formed on an upper end of a large-sized substrate having a plurality of coils 60 and then cut, a more conveniently patterned heat-radiating film can be provided on the upper end of the coil.

2 is a view showing an embodiment showing a method of mounting a patterned heat-radiating film on a heat source component.

A ferrite sheet (magnetic sheet) 30 is provided under the coil 60 and the substrate 61. A layer of the heat radiation film 70 is provided on the coil 60 and the substrate 61 again. The heat radiating film 70 of the present invention is patterned in the shape of a coil.

In addition, the case 90 is positioned above the heat radiating film. In this case, the case 90 refers to a case that encloses an electronic component that generates heat. The heat source may be a battery, a semiconductor chip, a backlight, a display, or the like.

At this time, in the present invention, the upper and lower standards were made as parts of the heat source. That is, the parts of the heat source are the lower part, the case becomes the upper part, and the film of the present invention is present therebetween.

Figs. 3 to 6 are views of an embodiment of the present invention in which the shape of the pattern is described.

As shown in FIG. 3, the formation of the coil 60 on the substrate 61 means that the conductor has a shape in which the conductor is wound. Accordingly, as shown in the enlarged view of the rectangular shape, there is an interval 60a between the conductor (coil) 60 and the conductor (coil) 60.

4 shows a layer of the heat radiating film 70. Fig. The heat dissipation film 70 is not formed at a position where the coil gap 60a is located.

In addition, the heat radiating film is also formed on the portion where the conductor (coil) 60 is not formed, that is, the coil 60 also on the outer portion and the inner portion.

As a result, when the heat radiation films 70 (71) are formed on the substrate 61 on which the coil 60 is formed, it is not formed in the interval 60a between the conductors (coils) 60. Therefore, a gap 70a is also present between the films 70. [ At this time, the width of the gap 60a between the wires (coils) 60 may not necessarily be the same as the width of the gap 70a between the films 70.

The spacing 70a between the films 70 is located at the position of the gap 60a between the coils 60. [

Generally, the heat-radiating film layer is formed by mixing 20 to 70% of solid particles with a resin stream, and the thickness of the layer may range from 10 micrometers to 0.5 mm.

The resin particles may be an ordinary resin used for a heat dissipation coating or a heat radiation film. The solid particles may be aluminum oxide (Al2O3), boron nitride (BN), silicon carbide (SiC), silicon nitride, beryllium oxide (AlN), carbon nanotubes (CNT), graphite, copper (Cu), silver (Ag), or the like can be used.

Further, it is also possible to use alumina (Al2O3), zirconia (ZrO2), silica (SiO2), zircon (ZrSiO4), magnesia (MgO), yttrium (Y2O3), cozite (2MgO.2Al2O3.5SiO2) 4SiO 2), mullite (Al 2 O 3 .3SiO 2), aluminum titanate (Al 2 O 3 .TiO 2), and the like. Then, TiO2, ceramics, iron oxide, aluminum oxide, barium sulfate, and silicon oxide may be added.

On the other hand, oxides, emulsions, carbide or black metal powders of Fe, Co, Ni, Cu, Mn, Mo, Ag,

However, in order to enhance the heat dissipation effect, it is preferable to use CNT as a base and to add other metal particles.

In addition, the heat-radiating filler can be classified into an insulating filler and a conductive filler according to electrical characteristics. For example, aluminum oxide (Al2O3), boron nitride (BN), silicon carbide (SiC), silicon nitride, beryllium oxide (BeO) and aluminum nitride (AlN) belong to insulating fillers, and carbon nanotubes (CNT) (Graphite), copper (Cu) and silver (Ag) belong to the conductive filler.

Of course, when the metal particles used for the heat-radiating film layer are used only as the insulating filler, the heat-radiating film layer can be formed on the coil 60 and the upper surface of the substrate 61 without forming a pattern.

However, in the present invention, when conductive solid particles are used in order to enhance the heat radiation effect, a pattern is formed on the heat radiation film.

5 and 7 show a cross sectional structure in which the heat dissipation layer 70 is present where the conductor of the coil 60 is present and the gap 70a is present in the heat dissipation layer at the interval 60a between the coil conductors. FIG. In this way, a pattern is also formed in the heat-radiating layer.

An outer heat dissipation film 71a is formed on an outer portion of the coil 60 and a heat dissipation film 71b is formed on an inner portion of the coil 60. [

5, the substrate 71 of the heat radiating film 70 may be directly formed on the coil 60. However, a separate substrate 71 (film-shaped resin substrate) for forming the heat radiating layer as shown in Fig. May not be formed.

Therefore, as shown in Fig. 6, the heat radiation films 70, 71a, and 71b may be formed on the upper surface of the coil 60 or the substrate 61 of the coil. At this time, the heat radiation film 70 formed on the upper end of the coil is patterned by coil formation.

That is, FIGS. 5 and 6 are enlarged views of the heat dissipation film layer in the original drawing in order to display the patterned heat dissipation film. In the heat radiating film shown in the above circle, the heat radiating film is formed on the upper end of the coil, and the heat radiating film also has the interval 70a in the interval 60a between the coil and the coil.

7 is a view showing an embodiment in which a heat radiation film is provided inside.

As shown in the drawing, the heat radiation film 71b may be provided directly in the interior to further enhance heat dissipation. If the coil substrate 61 is not provided in the coil 60, the heat-radiating film may be disposed on the top of the fillet sheet 30 as shown in FIG. 8, As shown in FIG.

FIG. 9 is a view of an embodiment in which a fillet sheet is not provided in a coil, and the heat radiation film is directly coated on the heat source inside the coil, thereby further increasing the heat radiation effect.

The coil substrate 61 and the ferrite sheet may be both provided below the coil 60 and only the ferrite sheet may be provided and the ferrite sheet and the coil substrate may not be provided therein.

10 is a view of an embodiment of a film layer actually used.

In the drawing, a heat source (HEAT) is an electronic component (a battery, a backlight, a semiconductor chip) or the like that generates heat. And a layer of ferrite sheet (30) is provided between the heat source and the film layer. Therefore, the ferrite sheet (magnetic film) 30 is provided at the bottom.

A substrate 61 and a coil 60 are provided thereon. And a heat dissipation film 70 (71a) 71b (71) is provided thereon.

At this time, the substrate 61 provided with the coil may be omitted and the coil 60 may be provided on the ferrite sheet 30 as it is. Further, the substrate 71 provided with the heat-radiating film may be omitted, and the heat-radiating film may be formed directly on the coil 60 and the coil substrate 61.

If the coil substrate 61 and the heat radiating film substrate 61 are not both provided, the heat radiating film 71a formed on the outer side of the coil and the heat radiating film 71b formed on the inside of the coil may be formed on the upper side of the ferrite sheet 30 As shown in FIG.

On the other hand, an adhesive layer 31 is provided between the film layer and the attaching portion of the present invention. The adhesive layer serves as an adhesive layer for attaching a film to the case. That is, in the case where the attaching portion is in the heat source direction, the adhesive layer 31 is formed below the film layer as shown in FIG. 3B, and when the attaching portion is opposite to the heat source, .

The adhesive layer 31 is made of a general adhesive resin selected from the group consisting of acrylic, silicone, rubber, acrylic-urethane copolymer and polyurethane. In the present invention, the solid particles are mixed with the adhesive layer by about 20 to 80%.

At this time, the kind of the solid particles to be mixed is the same as the solid particles used in the heat radiation film layer.

Of course, since the pressure-sensitive adhesive layer may have sufficient electrical conductivity properties, it is possible to use the electrically conductive material in a larger percentage of the solid particles. On the other hand, the heat-radiating film layer uses an electrically conductive material, but solid particles other than conductive materials should be used.

In the present invention, the releasing paper is a film for separating, the separating paper 32 is separated before using the film of the present invention, and then the film of the present invention is attached to the attaching portion. The release paper 32 may be a polyester film type or a paper type in which resin is coated on an art paper, but a conventional release film is applicable to the release paper of the present invention.

At this time, the ferrite sheet may also be a magnetic film in which metal particles are mixed with a resin, and a commercially available material can be used. Manganese, permalloy, permendur, metal glass, powdered iron, manganese oxide, zinc, zinc oxide and the like can be used.

The protective film layer 33 may further include a protection film layer 33 for protecting the heat dissipation layer when the attachment part is below the heat dissipation layer 70 as shown in FIG. ) Is made of a transparent resin layer. The thickness of the resin layer is preferably 0.1 mm or less and less than 10 micro-meters.

On the other hand, the coil 60 and the coil substrate 61 proposed in the present invention are not necessarily limited to NFC (near field communication) coils. The principles of the present invention can be applied to coils that transmit and receive data wirelessly or transmit and receive energy.

60: coil 61: coil substrate
70: heat radiation film at the upper end of the coil 71: heat radiation film substrate
71a: Coil outer heat dissipating film 71b: Coil inner heat dissipating film
32: release paper film 31: adhesive layer

Claims (4)

And a substrate on which a coil is formed, and a heat radiation film layer is further provided on the coil,
Wherein the coil is an NFC coil, a ferrite sheet is disposed under the coil, and a heat radiation film formed on the coil is patterned. The heat dissipation film according to claim 1, wherein a heat radiation film is provided on the NFC coil, and an adhesive layer is formed on the film when the attachment part for attaching the film exists on the film. The heat radiating film according to claim 1, wherein a heat radiation film is provided on the NFC coil, and an adhesive layer is formed under the film when the attachment part for attaching the film exists below the film. The wireless coil according to claim 1 or 2, wherein the coil is formed on the substrate in the form of a wire wound thereon, and when no gap is present between the lead and the wire, Formed heat-radiating film.

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