KR20190074934A - Sputtering apparatus and method of using the same - Google Patents

Abstract

The present invention provides a sputtering apparatus and a method for using the same, which can improve discharging of a coolant. The sputtering apparatus comprises: a first coolant passage (R1) of an annular shape formed between a target (110) and a magnet unit (130) to allow a coolant for cooling the target (110) to flow therein; a second coolant passage (R2) installed in the magnet unit (130) to allow the coolant to flow therein; and a liquid discharge device (P2) to send gas to discharge the coolant towards the second coolant passage (R2) from the first coolant passage (R1). A connection portion (RJ) between the first and the second coolant passage (R1, R2) can be arranged on a biased position in a vertically downward direction in the annular first coolant passage (R1).

Description

[0001] SPUTTERING APPARATUS AND METHOD OF USING THE SAME [0002]

The present invention relates to a magnetron sputtering type sputtering apparatus and a method of using the same.

In a magnetron sputtering sputtering apparatus, a technique is known in which a target to be a cathode is constituted by a cylindrical member and is configured to rotate when sputtering is performed. In this technique, the plasma near the target becomes high temperature, and the target and the magnet are heated. When the target is heated to a high temperature, there is a fear of being damaged. When the temperature of the magnet becomes high, demagnetization or element (demagnetization) is caused. Further, when the target is composed of a backing tube and a target material adhered to the outer circumferential surface of the backing tube by an adhesive, the adhesive may melt. Therefore, in the above sputtering apparatus, a cooling fluid flow path for cooling the target and the magnet is provided.

Further, in the sputtering apparatus as described above, magnets and the like are unitized and detachable inside the cylindrical target. As a result, the maintenance of the magnet unit in which the magnet or the like is unitized can be easily performed.

However, when a large amount of cooling fluid remains inside the magnet unit at the time of maintenance, it will cause trouble at the time of maintenance. Therefore, it is preferable to discharge the cooling fluid as much as possible before removing the magnet unit from the inside of the target. 11 and 12, the discharge mechanism of the cooling liquid in the sputtering apparatus according to the conventional example will be described. Figs. 11 and 12 show a schematic configuration of the cooling fluid flow path inside the target according to the conventional example.

A first cooling fluid flow path R1 formed between the target 700 and the magnet unit and a second cooling fluid flow path R2 provided inside the magnet unit are provided inside the target 700 according to the conventional example . When discharging the cooling liquid W, a gas (usually air) is sent from the first cooling liquid flow path R1 toward the second cooling liquid flow path (see a solid line arrow S in Figs. 11 and 12). A pressure is applied to the cooling liquid W so that the cooling liquid W is discharged from the second cooling liquid flow path R2 to the outside of the target 700 T).

When the liquid level of the cooling liquid W falls down to the inside of the second cooling liquid flow path R2, a gas flow path that escapes from the first cooling liquid flow path R1 to the second cooling liquid flow path R2 is formed Reference). As a result, the cooling fluid W is hardly pressed in the direction in which the cooling fluid W is pushed out of the target 700, and the cooling fluid W is not discharged. As described above, in the sputtering apparatus according to the conventional example, since the cooling liquid is not sufficiently discharged, the sputtering apparatus has a problem during maintenance.

In order to solve such a problem, there is also known a technique in which the discharge of the cooling liquid is promoted by swelling the balloon member in the cooling liquid flow path (see Patent Document 1). However, in such a technique, not only a mechanism is required to inflate the balloon member, but also a process for inflating the balloon member before maintenance is increased. Therefore, the cost also increases.

Japanese Patent Application Laid-Open No. 2013-100568

SUMMARY OF THE INVENTION An object of the present invention is to provide a sputtering apparatus and a method of using the same that can enhance the dischargeability of a cooling liquid.

The present invention employs the following means to solve the above problems.

That is, in the sputtering apparatus of the present invention,

A sputtering apparatus of a magnetron sputtering system which performs sputtering in a state in which a magnetic field is formed between a target and a substrate on which a thin film is to be formed by the constituent atoms of the target,

A cylindrical target disposed at a position opposite to the substrate and rotating at the time of sputtering;

A magnet unit having a magnet for forming the magnetic field and a support member for supporting the magnet, the magnet unit detachably installed in the target,

An annular first cooling fluid flow path formed between the target and the magnet unit and through which a cooling fluid for cooling the target flows,

A second cooling fluid channel provided in the magnet unit and through which the cooling fluid flows,

A drainage device for sending a gas for discharging the cooling liquid from the first cooling liquid flow path to the second cooling liquid flow path

Respectively,

And the connecting portion between the first cooling fluid channel and the second cooling fluid channel is configured to be arranged at a position offset in the vertical direction below the annular first cooling fluid channel.

According to the present invention, the liquid level of the cooling liquid in the cooling liquid flow path can be lowered to the connection portion between the first cooling liquid flow path and the second cooling liquid flow path by sending the gas by the liquid draining device. The connecting portion between the first cooling fluid flow path and the second cooling fluid flow path can be disposed at a position offset below the vertical direction in the annular first cooling fluid flow path, so that the cooling fluid can be sufficiently discharged.

As described above, according to the present invention, the dischargeability of the cooling liquid can be enhanced.

1 is a schematic configuration diagram of a sputtering apparatus according to Embodiment 1 of the present invention.
2 is a schematic view showing the arrangement of magnets according to Embodiment 1 of the present invention.
3 is a schematic configuration diagram of a rotary cathode according to Embodiment 1 of the present invention.
4 is a schematic configuration diagram of a rotary cathode according to Embodiment 1 of the present invention.
5 is an explanatory diagram of a mechanism for discharging a cooling liquid in the sputtering apparatus according to Embodiment 1 of the present invention.
6 is an explanatory diagram of a mechanism for discharging a cooling liquid in the sputtering apparatus according to Embodiment 1 of the present invention.
7 is an explanatory diagram of a discharge mechanism of a cooling liquid in a sputtering apparatus according to a comparative example of the present invention.
8 is an explanatory diagram of a discharge mechanism of a cooling liquid in a sputtering apparatus according to a comparative example of the present invention.
9 is a schematic cross-sectional view of a rotary cathode according to Embodiment 2 of the present invention.
10 is a schematic cross-sectional view of a magnet unit according to Embodiment 2 of the present invention.
11 is an explanatory diagram of a mechanism for discharging a cooling liquid in the sputtering apparatus according to the conventional example.
12 is an explanatory diagram of a discharge mechanism of the cooling liquid in the sputtering apparatus according to the conventional example.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail by way of examples with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements and the like of the constituent parts described in this embodiment are not intended to limit the scope of the present invention only to such a matter as long as no specific description is given.

(Example 1)

A magnetron sputtering sputtering apparatus according to Embodiment 1 of the present invention will be described with reference to Figs. 1 to 6. Fig.

<Overall Configuration of Sputtering Apparatus>

1 and 2, the overall structure of the sputtering apparatus 1 according to this embodiment will be described. Fig. 1 is a schematic configuration diagram of a sputtering apparatus according to Embodiment 1 of the present invention, and shows a schematic configuration when the entire sputtering apparatus is viewed in cross section. 1 corresponds to the upper side in the vertical direction when the sputtering apparatus 1 is used, and the lower side in Fig. 1 corresponds to the lower side in the vertical direction when the sputtering apparatus 1 is used. 2 is a schematic view showing the arrangement of magnets.

The sputtering apparatus 1 according to the present embodiment includes a chamber 20 capable of setting the interior V to a low pressure state (normally close to vacuum) and a rotary cathode 10). The rotary cathode 10 is constituted by a plurality of devices or members. In the present embodiment, a plurality of devices and members constituting the rotary cathode 10 are installed outside the chamber 20 And is exposed to the atmosphere A. The chamber 20 according to the present embodiment also functions as an anode. A mounting table 30 for mounting a substrate 40 for forming a thin film is provided in a lower portion of the chamber 20. The mounting table 30 is configured to be capable of transporting the substrate 40 to a desired position.

The rotary cathode device body 100 in the rotary cathode 10 has a cylindrical target 110 as a cathode and a magnet unit 130 provided inside the target 110. In this case, As the target 110, a type in which a target material is adhered to an outer peripheral surface of a backing tube made of SUS or Ti by an adhesive such as In or an integral type in which a backing tube and a target material are integrated is applicable. The target 110 is provided at a position facing the substrate 40 placed on the mounting table 30 and configured to rotate at the time of sputtering. The magnet unit 130 is provided with a magnet 134 therein.

2 is a view of the magnet 134 in Fig. 1 viewed from below. The magnet 134 is disposed such that two different kinds of magnetic poles (the first magnetic pole 134a and the second magnetic pole 134b) face downward in use. Although the first magnetic pole 134a is an N pole and the second magnetic pole 134b is an S pole, the first magnetic pole 134a is an S pole and the second magnetic pole 134b is an N pole . The second magnetic poles 134b are provided so as to surround the first magnetic poles 134a with a gap therebetween. As described above, since the magnet unit 130 is provided inside the target 110, a magnetic field (a leakage magnetic field) is formed between the target 110 and the substrate 40.

In the sputtering apparatus 1 configured as described above, plasma is generated between the target 110 and the anode 20 by applying a voltage equal to or more than a certain value between the target 110 and the anode 20. Then, as the positive ions in the plasma strike the target 110, the particles of the target material are released from the target 110. Particles ejected from the target 110 repeatedly collide, and neutral atoms of the target material among the ejected particles are deposited on the substrate 40. As a result, a thin film is formed on the substrate 40 by the constituent atoms of the target 110. In the sputtering apparatus 1 according to the present embodiment, the leakage magnetic field can concentrate the plasma in the vicinity of P shown in Fig. 1 (near the vicinity of a magnetic field substantially parallel to the target 110) have. Thus, the deposition rate of the target material on the substrate 40 can be improved because the sputtering is performed efficiently. Furthermore, in the sputtering apparatus 1 according to the present embodiment, the target 110 is configured to rotate during sputtering. As a result, the consumption area of the target 110 (erosion area due to the erosion) does not concentrate on a part of the target area, and utilization efficiency of the target 110 can be increased.

<Rotary Cathode>

Particularly, the rotary cathode 10 according to the present embodiment will be described in more detail with reference to Figs. 3 and 4. Fig. Figs. 3 and 4 are schematic configuration diagrams of the rotary cathode 10 according to the first embodiment of the present invention, showing a schematic configuration when the rotary cathode 10 is viewed in cross section. Fig. Fig. 3 shows the state at the time of sputtering, and Fig. 4 shows the state at the time of discharging the cooling liquid. 3 and 4 schematically show a cross-sectional view in which the rotary cathode 10 is cut on a plane parallel to the rotation center axis of the target. However, for convenience of explanation, in order to show a characteristic configuration, The location is not necessarily the same.

The rotary cathode 10 includes a rotary cathode device body 100 having a target 110, an end block 200 having a function of rotating the target 110, a function of rotatably supporting the target 110, And a support block 300 having a support surface 300a. The rotary cathode 10 further includes a support member 400 for supporting the end block 200 and the support block 300, a first motor 510 for rotating the target 110, And a second motor 550 for rotating the magnet unit 130 installed inside the magnet unit. The rotary cathode device body 100 is disposed in the interior V of the above-described chamber 20 (not shown in FIGS. 3 and 4), and the inside of the end block 200 and the first motor 510, the second motor 520, and the like are exposed to the atmosphere A.

&Lt; Rotary cathode body &

The rotary cathode device body 100 includes a target 110 and a magnet unit 130 detachably installed inside the target 110. [ The rotary cathode device body 100 also includes a support block-side annular member 120 fixed to the target 110 and rotatably supported by the support block 300.

The magnet unit 130 includes a cylindrical case 131, a first lid 132 for closing one end of the case 131, and a second lid 133 for blocking the other end of the case 131 . A magnet 134 and a support member 135 for supporting the magnet 134 are provided in the case 131. [ Both ends of the support member 135 are fixed to the first lid 132 and the second lid 133, respectively. A pair of first pipes 136 extending in parallel to the rotation center axis of the target 110 and a pair of second pipes 136 extending from the pair of first pipes 136 to the case 131 A pair of second pipes 137 extending toward the outer peripheral surface side and opening to the outer peripheral surface of the case 131 are provided.

The support block-side annular member 120 is provided with a shaft portion 121 to be inserted into the through hole 310 formed in the support block 300. The support block side annular member 120 can be rotated with respect to the support block 300 by providing the bearing B between the shaft portion 121 and the through hole 310. [ The support block-side annular member 120 is provided with a bearing hole 122 for rotating the annular member 120 on the support block side with respect to the magnet unit 130. A shaft portion 133a provided in the first lid 133 of the magnet unit 130 is inserted into the bearing hole 122. The bearing B is provided in the annular gap between the shaft portion 133a and the bearing hole 122 so that the annular member 120 on the support block side can rotate with respect to the magnet unit 130 . A sealing device S is also provided at an annular gap between the shaft portion 133a and the bearing hole 122. [ The ring-shaped support member 120 and the target 110 are fixed by a fastening member 123 such as a clamp. A gasket G for sealing an annular gap between the support block-side annular member 120 and the target 110 is also provided.

In the rotary cathode device body 100 configured as described above, a cylindrical space formed between the target 110 and the magnet unit 130 is formed in a cylindrical shape in which a cooling liquid for cooling the target 110 flows, 1 cooling fluid flow path R1. The inner space of the first pipe 136 and the inner space of the second pipe 137 provided inside the magnet unit 130 serve as the second cooling fluid channel R2 through which the cooling fluid flows. The connection region RJ between the first cooling fluid flow path R1 and the second cooling fluid flow path R2 is disposed on the opposite side of the magnet 134 with the rotation center axis of the target 110 interposed therebetween. With this arrangement, the pair of second pipes 137 are disposed inside the magnet unit 130 without interfering with the arrangement of the magnets 134. [

<End block>

The end block 200 includes a case 210 fixed to the support member 400, a shaft member 220 installed in the case 210, and a shaft member 220 installed to be rotatable with respect to the shaft member 220 And an end block side annular member (230). A pair of bearings B are provided between the shaft member 220 and the end block side annular member 230. As a result, the end block side annular member 230 can rotate with respect to the shaft member 220. A sealing device S for sealing an annular gap between the shaft member 220 and the end block side annular member 230 is also provided. The magnet unit 130 and the shaft member 220 are connected by a connecting member 270 such as a pin. Therefore, the magnet unit 130 does not rotate with respect to the shaft member 220.

The end block side annular member 230 and the target 110 are fixed by a fastening member 231 such as a clamp. A gasket G for sealing an annular gap between the end block side annular member 230 and the target 110 is also provided. Further, a bearing B and a sealing device S are also provided between the case 210 and the end block side annular member 230. The annular member 230 is rotatable with respect to the case 210 and the annular gap between the case 210 and the end block side annular member 230 is sealed. Further, a gasket G is also provided between the case 210 and the support member 400. Therefore, although the inside of the case 210 is exposed to the atmosphere, the space in which the rotary cathode device body 100 is disposed is maintained in a low-pressure state (normally close to vacuum).

Further, the end block side annular member 230 is configured to rotate by the first motor 510. The first driving mechanism for rotating the end block side annular member 230 includes a first pulley 520 fixed to the rotation shaft of the first motor 510 and a second pulley 520 fixed to the end block side annular member 230. [ A pulley 240 and a first belt 530 wound around the first pulley 520 and the second pulley 240. According to the first driving mechanism, when the first pulley 520 is rotated by the first motor 510, the rotational power is transmitted to the second pulley 240 by the first belt 530, The annular member 230 rotates. The target 110 fixed to the annular member 230 on the end block side also rotates together with the annular member 120 on the support block side.

The shaft member 220 has a first flow path 221 connected to the first cooling fluid flow path R1 provided in the rotary cathode device body 100 and a second flow path 221 connected to the rotary cathode device main body 100 And a second flow path 222 connected to the second cooling fluid flow path R2. Most of the first flow path 221 and the second flow path 222 are provided so as to extend in parallel with the rotation center axis of the target 110. A rotary joint 260 is provided in the case 210 to rotatably support the shaft member 220 and supply the cooling fluid to the respective flow paths and to discharge the cooling fluid from the flow path have. The rotary joint 260 is formed of a cylindrical member concentrically provided with the shaft member 220. A ring gear is formed on the annular gap between the rotary joint 260 and the shaft member 220 B and a sealing device S are provided. The rotary joint 260 is connected to a supply pipe 261 and a discharge pipe 262. The inside of the supply pipe 261 is connected to the inside of the first flow path 221 and the inside of the discharge pipe 262 is connected to the inside of the second flow path 222.

Further, the shaft member 220 is configured to rotate by the second motor 550. The second driving mechanism for rotating the shaft member 220 includes a third pulley 560 fixed to the rotation shaft of the second motor 550 and a fourth pulley 250 fixed to the shaft member 220. [ And a second belt 570 wound around the third pulley 560 and the fourth pulley 250. According to the second driving mechanism, when the third pulley 560 is rotated by the second motor 550, the rotational power is transmitted to the fourth pulley 250 by the second belt 570, (220) rotates. The magnet unit 130 fixed to the shaft member 220 also rotates.

The plurality of sealing devices S provided in each of the above-described portions can rotate the two members provided on the inner side and the outer side in the radial direction of the sealing device S, As shown in Fig. 3 and 4, the sputtering apparatus 10 is provided with a gasket G between two members fixed to each other at a plurality of locations so as to prevent leakage of the cooling liquid. The description of the position in which the gasket G is disposed is omitted as appropriate.

<Sputtering>

When the sputtering is performed by the sputtering apparatus 1, the magnet 134 is moved downward in the vertical direction, and the connection region RJ between the first cooling fluid channel R1 and the second cooling fluid channel R2 is larger than the magnet 134 The position of the magnet unit 130 in the rotational direction is determined so as to be disposed above the vertical direction. 1 and Fig. 3 show a state when sputtering is performed. During the sputtering, the magnet unit 130 is fixed, and the target 110 continues to rotate. During the sputtering, the cooling liquid flows into the target 110. That is, the cooling liquid is supplied to the supply pipe 261 by the cooling liquid pump P1 that supplies the cooling liquid. The cooling liquid supplied to the supply pipe 261 flows from the first flow path 221 provided inside the shaft member 220 to the first cooling fluid flow path R1 provided in the rotary cathode device body 100. Thereafter, the cooling liquid is discharged from the second cooling liquid flow path R2 through the second flow path 222 provided inside the shaft member 220 to the outside of the apparatus from the discharge pipe 262 (See the arrows in Fig. 3). The direction in which the cooling liquid flows may be opposite to the arrow in Fig. In this case, the discharge pipe 262 in the drawing may be used as a supply pipe, and the supply pipe 261 may be used as a discharge pipe.

<Emission of cooling liquid>

At the time of maintenance, the cooling fluid in the target 110 is discharged before the magnet unit 130 is taken out from the target 110. The position of the magnet unit 130 in the rotational direction of the magnet unit 130 so that the connection region RJ between the first cooling fluid channel R1 and the second cooling fluid channel R2 is arranged below the magnet 134 in the vertical direction, (See Fig. 4). The connection region RJ between the first cooling fluid flow path R1 and the second cooling fluid flow path R2 is disposed at a position offset in the vertical direction below the annular first cooling fluid flow path R1. Here, when the first cooling liquid flow path R1 and the second cooling liquid flow path R2 are connected to each other within a range of ± 45 degrees from the position directly below the annular first cooling liquid flow path R1 in the vertical direction, Suitable.

When discharging the cooling liquid, a gas (normally, air) for discharging the cooling liquid is sent from the first cooling liquid flow path R1 toward the second cooling liquid flow path R2 by the liquid pouring apparatus P2 such as a pump. More specifically, the gas is delivered to the supply pipe 261 by the liquid delivery device P2. A pipe connected to the cooling liquid pump P1 and a pipe connected to the liquid draining device P2 are connected to the supply pipe 261. In the case of supplying the cooling liquid and the gas, So that it can be switched. In addition, since a known technique such as a switching valve may be employed for the device for switching the objects to be supplied, the description thereof will be omitted here.

The gas supplied to the supply pipe 261 flows from the first flow path 221 provided inside the shaft member 220 to the first cooling fluid flow path R1 provided in the rotary cathode device body 100. Thereby, the cooling liquid is discharged from the discharge pipe 262 through the second flow path 222 from the second cooling fluid flow path R2. After a certain amount of cooling liquid is discharged, the gas supplied from the supply pipe 261 is discharged from the second cooling liquid flow path R2 through the second flow path 222 to the outside of the apparatus from the discharge pipe 262 (See arrows in Fig. 4).

&Lt; The sputtering apparatus according to this embodiment is excellent.

According to the sputtering apparatus 1 of the present embodiment configured as described above, the liquid level in the cooling liquid flow path is supplied to the first cooling liquid flow path R1 and the second cooling liquid flow path R2 to the connecting portion RJ. Since the connection region RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2 is disposed at a position offset in the vertical direction below the annular first cooling liquid flow path R1, It can be sufficiently discharged. This point will be described in more detail with reference to Figs. 5 and 6. Fig. Fig. 5 and Fig. 6 are explanatory views of the discharge mechanism of the cooling liquid W in the sputtering apparatus 1 according to the present embodiment, and schematically show the structure of the cooling liquid flow path inside the target 110. Fig.

As described above, in the interior of the target 110, a first cooling fluid flow path R1 formed between the target 110 and the magnet unit 130 and a second cooling fluid flow path R1 formed between the magnet unit 130 and the second And a cooling liquid flow path R2 is provided. When discharging the cooling liquid W, the gas is transferred from the first cooling liquid flow path R1 to the second cooling liquid flow path R2 (see a solid line arrow S in Figs. 5 and 6). A pressure is applied to the cooling liquid W so that the cooling liquid W is discharged from the second cooling liquid flow path R2 to the outside of the target 110 T).

When the liquid level of the cooling liquid W falls down to the connection region RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2, the second cooling liquid flow path R2 flows from the first cooling liquid flow path R1, (See Fig. 6). Thereby, the pressure in the direction of pushing the cooling liquid W to the outside of the target 110 is hardly applied to the cooling liquid W, and the cooling liquid W is not discharged.

As described above, according to the sputtering apparatus 1 of the present embodiment, the liquid level of the cooling liquid W in the cooling liquid flow path is reduced to the connection portion RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2 I can get off. As a result, most of the cooling liquid W in the magnet unit 130 can be discharged. Therefore, it is possible to prevent the cooling liquid W from being obstructed during the maintenance.

In the sputtering apparatus 1, when the structure is adopted in which the gas is sent from the second cooling liquid flow path R2 toward the first cooling liquid flow path R1, the cooling liquid W can not be sufficiently discharged. This point will be described with reference to Figs. 7 and 8. Fig. Figs. 7 and 8 are explanatory diagrams of the discharge mechanism of the cooling liquid W in the sputtering apparatus according to the comparative example, and show a schematic structure of the cooling liquid flow path inside the target 110. Fig.

Even when the gas is fed from the second cooling liquid flow path R2 toward the first cooling liquid flow path R1 (see the solid line arrow S in Figs. 7 and 8), if the space to which the gas is fed is a sealed space, W and the cooling liquid W is discharged from the first cooling liquid flow path R1 to the outside of the target 110 (see the dotted arrow T in Fig. 7).

Since the closed space is formed in the second cooling liquid flow path R2, the cooling liquid W is supplied until the connection portion RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2 is reached . On the other hand, when the liquid level of the entire cooling liquid W decreases, a closed space is formed in a state that the gas is confined above the first cooling liquid flow path R1. Therefore, between the space in the second cooling liquid flow path R2 and the sealed space above the first cooling liquid flow path R1, the gas is transported in the cooling liquid W in a bubble state.

When the liquid level of the cooling liquid W descends to a portion connected to the outside of the target 110 in the first cooling liquid flow path R1, the second cooling liquid flow path R2 flows from the second cooling liquid flow path R2 to the first cooling liquid flow path R1 And a flow path of the escaping gas is formed (see Fig. 8). Thereby, the pressure in the direction of pushing the cooling liquid W to the outside of the target 110 is hardly applied to the cooling liquid W, and the cooling liquid W is not discharged. Therefore, when the supply of the gas by the drain device P2 is stopped, a part of the cooling liquid W flows back into the second cooling liquid flow path R2, W) remains.

(Example 2)

As described above, according to the sputtering apparatus 1 of the first embodiment, the cooling liquid is supplied until the liquid level of the cooling liquid reaches the connection region RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2 Can be discharged. Therefore, it is preferable that the connection region RJ between the first cooling liquid flow path R1 and the second cooling liquid flow path R2 is set at an absolute minimum and below the vertical direction.

In the first embodiment, the pair of first pipes 136 and the pair of second pipes 137 for forming the second cooling liquid flow path R2 have the same configuration. The first pipe 136 and the second pipe 137 are connected to each other in the same direction in the direction in which the rotation center axis of the target 110 extends Position. Therefore, it is necessary to dispose the second piping 137 at a different position in the circumferential direction with respect to the pair of second piping 137 at the position where the second piping 137 opens to the outer peripheral surface of the case 131 (see Fig. 1) .

Therefore, in the case of the sputtering apparatus 1 according to the first embodiment, two connecting portions RJ of the first cooling liquid flow path R1 and the second cooling liquid flow path R2 are connected to the central axis line It is not structurally possible to arrange it at a position directly below the vertical direction. Therefore, the two connection portions RJ of the first cooling fluid flow path R1 and the second cooling fluid flow path R2 must be arranged slightly above the lowest portion in the vertical direction of the case 131 .

Thus, in this embodiment, the two connection portions RJ of the first cooling liquid flow path R1 and the second cooling liquid flow path R2 are all disposed at the lowest position in the vertical direction in the case 131 The magnet unit 130 will be described.

Figs. 9 and 10 show a second embodiment of the present invention. In this embodiment, the arrangement of the first pipe and the second pipe is different from that of the first embodiment. Other configurations and operations are the same as those of the first embodiment, and therefore, the same constituent parts are denoted by the same reference numerals, and a description thereof will be omitted as appropriate.

9 is a schematic cross-sectional view of a rotary cathode according to Embodiment 2 of the present invention (cross-sectional view cut from a plane perpendicular to the rotation center axis of the target), with respect to a main portion of the rotary cathode device body 100, Fig. 10 is a schematic cross-sectional view of the magnet unit according to the second embodiment of the present invention, and shows the schematic configuration of the main portion of the magnet unit 130 in cross section. 10 schematically shows a cross-sectional view in which the magnet unit 130 is cut on a plane parallel to the rotation center axis of the target. However, for the sake of explanation, in order to show a characteristic configuration, It is not the same face. 9 and 10 correspond to the upper portion in the vertical direction when the cooling liquid is discharged, and the lower portions in Figs. 9 and 10 correspond to the lower portion in the vertical direction when the cooling liquid is discharged. The configuration other than the magnet unit 130 in the sputtering apparatus is the same as that described in the first embodiment, and a description thereof will be omitted.

The magnet unit 130 according to the present embodiment has a cylindrical case 131 as well as a first lid 132 for blocking one end of the case 131 and a case 131 And a second lid 133 for blocking the other end of the second lid 133. A magnet 134 and a support member 135 for supporting the magnet 134 are provided in the case 131. [ The configuration of the case 131, the first lid 132, the second lid 133, the magnet 134 and the support member 135 is the same as that of the first embodiment, and a description thereof will be omitted.

In the magnet unit 130 according to the present embodiment as well, a pair of first pipes 136a and 136b extending in parallel to the rotation center axis of the target 110, A pair of second pipes 137a and 137b extending from the pair of first pipes 136a and 136b toward the outer peripheral surface of the case 131 and opening to the outer peripheral surface of the case 131 are provided.

In the case of the present embodiment, the pair of second pipes 137a and 137b are connected to the pair of first pipes 136a and 136b, respectively, at positions different from each other in the rotational axis direction of the target. The connection positions RJ between the first cooling fluid flow path R1 and the second cooling fluid flow path R2 at which the pair of second pipes 137a and 137b are connected to the first cooling fluid flow path R1, (See Fig. 9) when viewed toward the rotation center axis direction.

According to the magnet unit 130 constituted as described above, the two connection portions RJ of the first cooling fluid flow path R1 and the second cooling fluid flow path R2 are formed in the case 131 in the vertical direction It is possible to arrange it at the lowest position. Therefore, it is possible to arrange the two connection portions RJ of the first cooling fluid flow path R1 and the second cooling fluid flow path R2 in the lower vertical direction than in the first embodiment. Thereby, it becomes possible to discharge a much larger amount of cooling liquid.

(etc)

The connection region RJ between the first cooling fluid flow path R1 and the second cooling fluid flow path R2 is formed so as to be opposed to the magnet 134 with the rotation center axis of the target 110 interposed therebetween As shown in Fig. The reason for adopting such a configuration is that the magnets 134 disposed inside the magnet unit 130 generally occupy a large area and that when discharging the cooling fluid, the first cooling fluid channel R1 and the second cooling fluid channel And the connecting portion RJ with respect to the center line R2 is located below the vertical direction. However, it is possible to connect the connecting portion RJ between the first cooling fluid flow path R1 and the second cooling fluid flow path R2 and the two portions of the magnet 134 divided by the surface including the rotation center axis of the target 110 In the case where there is no problem in arranging them on the same area side, such arrangement may be adopted. When adopting this configuration, it is not necessary to change the position of the magnet unit in the rotating direction in the case of performing the sputtering and the case of discharging the cooling liquid.

1: Sputtering device
10: Rotary cathode
100: Rotary cathode device body
110: Target
130: Magnet unit
134: Magnet
136, 136a, 136b: first piping
137, 137a, 137b: second piping
200: End block
300: Support block
P2: drainage device
R1: first cooling liquid flow path
R2: the second cooling liquid flow path
RJ: Connection site

Claims (6)

A sputtering apparatus of a magnetron sputtering system which performs sputtering in a state in which a magnetic field is formed between a target and a substrate on which a thin film is to be formed by the constituent atoms of the target,
A cylindrical target disposed at a position opposite to the substrate and rotating at the time of sputtering;
A magnet unit having a magnet for forming the magnetic field and a support member for supporting the magnet, the magnet unit detachably installed in the target,
An annular first cooling fluid flow path formed between the target and the magnet unit and through which a cooling fluid for cooling the target flows;
A second cooling fluid channel provided in the magnet unit and through which the cooling fluid flows,
A drainage device for sending a gas for discharging the cooling liquid from the first cooling liquid flow path to the second cooling liquid flow path
Respectively,
Wherein a connecting portion between the first cooling fluid passage and the second cooling fluid passage is arranged at a position offset in the vertical direction below the annular first cooling fluid passage. The method according to claim 1,
Wherein a connecting portion between the first cooling fluid passage and the second cooling fluid passage is arranged within a range of +/- 45 degrees from a position directly under the vertical direction in the annular first cooling fluid passage. 3. The method according to claim 1 or 2,
Wherein a connecting portion between the first cooling fluid passage and the second cooling fluid passage is disposed on the opposite side with respect to the magnet with the rotation center axis of the target interposed therebetween. 4. The method according to any one of claims 1 to 3,
A pair of first pipes extending parallel to a rotation center axis of the target,
And a pair of second pipes extending from the pair of pipes toward the first cooling fluid channel,
And,
The second cooling liquid flow path is formed by the inner space of the first pipe and the inner space of the second pipe,
The pair of second pipes are connected to the pair of first pipes at different positions in the direction of the axis of rotation axis respectively and the position at which the pair of second pipes are connected to the first cooling liquid flow path, Wherein the sputtering device is superimposed when viewed in the direction of the axis of rotation. 5. The method according to any one of claims 1 to 4,
Wherein the connecting portion of the first cooling liquid flow path and the second cooling liquid flow path is disposed at a position shifted downward in the vertical direction in the annular first cooling liquid flow path when the gas is fed by the liquid draining device . A method of using the sputtering apparatus according to any one of claims 1 to 5,
The sputtering is performed by disposing the magnet in a direction perpendicular to the vertical direction and connecting the first cooling fluid flow path and the second cooling fluid flow path in the vertical direction above the magnet,
Wherein the connecting portion of the first cooling fluid flow path and the second cooling fluid flow path is disposed below the magnet in the vertical direction when the gas is fed by the liquid draining device.

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