KR20190068407A - Cooling plate - Google Patents

Cooling plate Download PDF

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Publication number
KR20190068407A
KR20190068407A KR1020180095583A KR20180095583A KR20190068407A KR 20190068407 A KR20190068407 A KR 20190068407A KR 1020180095583 A KR1020180095583 A KR 1020180095583A KR 20180095583 A KR20180095583 A KR 20180095583A KR 20190068407 A KR20190068407 A KR 20190068407A
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South Korea
Prior art keywords
cooling plate
water
circulation channel
bottom plate
cooling
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KR1020180095583A
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Korean (ko)
Inventor
젱홍 뎅
창러 관
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동타이 하이-테크 이큅먼트 테크놀로지 씨오., 엘티디
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Publication of KR20190068407A publication Critical patent/KR20190068407A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463—Cooling of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0472—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being helically or spirally coiled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0366—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Abstract

The present invention relates to a cooling device in a vacuum deposition technical field, and provides a cooling plate, including a cooling plate main body having a circulation waterway in which an acquisition line and a redemption line are provided in parallel with each other. According to the present invention, the cooling plate provides the circulation waterway in which the acquisition line and the redemption line in the cooling plate main body are provided in parallel with each other, thereby improving heat exchanging efficiency of the cooling plate and solving a problem that the entire temperature of the cooling plate is non-uniform by a temperature difference between acquisition and redemption.

Description

냉각판{COOLING PLATE}COOLING PLATE

본 발명은 진공 증착 기술분야의 냉각 장치에 관한 것이며, 특히 냉각판에 관한 것이다.The present invention relates to a cooling device in the field of vacuum deposition technology, and more particularly to a cooling plate.

일반적으로, 진공 증착의 냉각판은 증착 장치의 공정 챔버와 웨이퍼 인출측에 장착되고, 자체 순환 냉각수를 통해 지속적으로 열량을 가져감으로써 기판의 냉각 속도를 빠르게 하고 기판이 대기에 노출될 때 자체 온도를 효과적으로 낮춤으로써 장치의 전체 공정의 사이클 타임을 단축시킨다.Generally, a cooling plate of a vacuum vapor deposition is mounted on the process chamber and the wafer drawing side of a vapor deposition apparatus, and the cooling rate of the substrate is increased by bringing the heat continuously through self-circulating cooling water, Effectively shortens the cycle time of the entire process of the apparatus.

종래의 진공 증착 분야의 냉각판 구조는 주로 두꺼운 판에 심공 드릴을 이용하여 가공된 단일 회로 수로, 송수관을 직접 절곡하여 성형하는 구조를 사용하였다. 이와 같은 두꺼운 판에 심공 드릴을 이용하여 가공된 수로 구조는 가공 공정의 제한을 받으며 대부분 하나의 입구와 출구를 가지는 단일 회로 수로로서 냉각 효율이 낮고 입수측과 환수측의 온도차이가 크고 판 전체의 온도 균일성이 저하되기에 장치 전체 공정의 사이클 타임에 심각한 영향을 끼치며, 송수관을 절곡하여 성형하는 배관 구조는 각 배관들 사이에 간격이 많이 생겨 대면적으로 사용할 경우 통상 송수관을 평판에 고정시키며 배관과 평판 사이의 열전도 효과가 나쁘고 유지 보수 및 청소 작업량이 크다.The cooling plate structure in the conventional vacuum deposition field has a structure in which the pipe is directly bent and formed by a single circuit water processed by using a deep hole drill in a thick plate. In this thick plate, the channel structure processed by using the deep hole drill is limited to the processing process, and as a single circuit channel having one inlet and one outlet, the cooling efficiency is low and the temperature difference between the inlet side and the return side is large, The temperature uniformity is deteriorated, which seriously affects the cycle time of the entire process. The piping structure for bending and forming the water pipe has a lot of gaps between the pipes. When the pipe is used in a large area, And the thermal conductivity between the plate and the plate is poor, and the maintenance and cleaning workload is large.

본 발명의 실시예는 냉각판의 자체 온도가 불균일한 문제를 해결하기 위한 냉각판을 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a cooling plate for solving the problem that the temperature of the cooling plate itself is not uniform.

상기 기술적 과제를 해결하기 위하여, 본 발명은 내부에 입수 라인과 환수 라인이 병렬되는 순환 수로가 마련되는 냉각판 본체를 포함하는 냉각판을 제공한다.According to an aspect of the present invention, there is provided a cooling plate including a cooling plate body provided with a circulation channel in which an inlet line and a water-return line are arranged in parallel.

또한, 상기 냉각판 본체는 일체형 구조의 복수의 부분으로 구분되며, 각각의 상기 부분에는 대응되게 하나의 독립적인 상기 순환 수로가 마련된다.In addition, the cooling plate body is divided into a plurality of portions of the integral structure, and each of the portions is provided with a corresponding one independent circulation channel.

또한, 상기 냉각판 본체의 각각의 상기 부분은 인접되는 상기 부분이 측벽을 공용하는 홈이며, 각각의 상기 순환 수로는 대응되는 상기 홈 내부에 마련된다.In addition, each of the portions of the cooling plate body is a groove in which the adjacent portion shares the side wall, and each circulation channel is provided in the corresponding groove.

또한, 상기 순환 수로는, 상기 홈 표면에 밀링 하여 형성되는 입수 및 환수가 병렬되는 수조(water groove) 및/또는 입수 및 환수가 병렬되는 송수관을 포함한다.In addition, the circulating water channel includes a water groove formed by milling the groove surface in parallel with the water intake and the water return, and / or a water pipe in which the water intake and the water exchange are parallel.

또한, 상기 냉각판 본체에는 밑판이 더 마련되며, 상기 냉각판 본체는 두개의 중심선을 기준선으로 4개의 직사각형 홈으로 구분되며, 각각의 상기 홈에는 상기 홈과 실링 연결된 밑판이 인레이(inlay)되어 있다.The cooling plate body is further provided with a base plate, and the cooling plate body is divided into four rectangular grooves with two center lines as reference lines, and each of the grooves is inlayed with a bottom plate sealingly connected with the grooves .

또한, 상기 냉각판에는 상기 순환 수로와 어긋나는 위치에 복수의 보스가 마련되며, 상기 밑판에는 상기 보스와 대응되게 수납공이 마련되고, 상기 보스는 상기 수납공내부에 마련되고 상기 밑판과 연결된다.In addition, the cooling plate is provided with a plurality of bosses at positions shifted from the circulation channel, and the bottom plate is provided with a receiving hole corresponding to the boss, and the boss is provided inside the receiving hole and connected to the bottom plate.

또한, 상기 밑판에는 분기관이 마련되고, 상기 냉각판 본체에는 상기 순환 수로와 어긋나는 위치에 관통되는 기공이 더 마련되며, 상기 밑판에는 상기 기공과 대응되는 통기공이 마련되며, 상기 분기관에는 상기 기공 및 통기공과 연통되는 기체분사공이 마련된다.The cooling plate body is further provided with pores passing through the cooling plate body at a position shifted from the circulation channel. The base plate is provided with a vent hole corresponding to the pores, And a gas injection hole communicating with the pores and the vent holes.

또한, 각각의 상기 밑판의 대각선상에는 각각 하나의 상기 분기관이 마련되며 각각의 상기 분기관에는 흡기관이 대응되게 마련된다.In addition, one branch pipe is provided on the diagonal line of each of the bottom plates, and each branch pipe corresponds to an intake pipe.

또한, 상기 밑판에는 하나의 메인 흡기관과 복수의 상기 분기관이 마련되며, 상기 분기관과 상기 메인 흡기관은 연통된다.In addition, one main intake pipe and a plurality of branch pipes are provided on the bottom plate, and the branch pipe and the main intake pipe communicate with each other.

또한, 상기 순환 수로는 물흐름의 이동 방향을 따라 바 형태의 돌기가 마련된다.Also, the circulation channel is provided with a bar-shaped protrusion along the moving direction of the water flow.

또한, 상기 냉각판 본체에는 냉각판 온도의 균일성을 측정하는 써모커플 및/또는 유량을 제어 가능한 순환 물펌프가 마련된다.The cooling plate body is provided with a thermocouple for measuring the uniformity of the cooling plate temperature and / or a circulating water pump capable of controlling the flow rate.

본 발명의 상기 기술방안은 아래와 같은 장점이 있다.The above technical solution of the present invention has the following advantages.

본 발명에 따른 냉각판은 냉각판 본체내부에 입수 라인과 환수 라인이 병렬되는 순환 수로를 마련함으로써 입수와 환수의 온도차이에 의해 냉각판 전체의 온도가 불균일게 되는 문제를 해결한다.The cooling plate according to the present invention solves the problem that the temperature of the entire cooling plate becomes uneven due to the temperature difference between the intake and the return water by providing the circulation channel in which the intake line and the water return line are arranged in parallel within the cooling plate body.

상술한 본 발명의 기술방안, 기술방안을 구성하는 기술특징 및 이러한 기술방안이 가지는 장점 외에, 본 발명의 기타 기술특징 및 이러한 기술특징이 가지는 장점은 도면을 참조하여 더욱 상세하게 설명될 것이다.Other technical features of the present invention and advantages of the technical features of the present invention will be described in more detail with reference to the drawings, in addition to the technical features of the present invention, the technical features constituting the technical solution and the advantages of the technical solution described above.

도1은 본 발명의 실시예에 따른 냉각판의 조립 개략도이다.
도2는 본 발명의 실시예에 따른 냉각판의 평면 개략도이다.
도3은 도2의 A-A선을 따라 절개한 단면도이다.
도4는 도3의 B부분의 확대도이다.
도5는 도3의 C부분의 확대도이다.
도6은 도3의 D부분의 확대도이다.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an assembly of a cooling plate according to an embodiment of the present invention; FIG.
2 is a schematic plan view of a cooling plate according to an embodiment of the present invention.
3 is a cross-sectional view taken along line AA of FIG.
4 is an enlarged view of a portion B in Fig.
5 is an enlarged view of a portion C in Fig.
6 is an enlarged view of a portion D in Fig.

이하, 본 발명에 따른 실시예의 목적, 기술방안 및 장점을 더욱 명확하게 설명하기 위하여, 본 발명에 따른 실시예의 기술방안을 본 발명의 실시예의 도면을 참조하여 명확하고 상세하게 설명한다. 이하에서 설명되는 실시예는 본 발명의 일부 실시예일 뿐이며 전부 실시예가 아니다. 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 실시예의 기초상에서 창조적인 노동을 진행하지 않고 얻은 기타 모든 실시예는 본 발명의 보호범위에 속할 것이다.BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. The embodiments described below are only some embodiments of the present invention and are not all embodiments. Those of ordinary skill in the art will recognize that other embodiments that do not proceed with creative labor on the basis of embodiments of the present invention will fall within the scope of the present invention.

본 발명의 설명에 있어서, 별도로 규정하거나 한정하지 않은 한, "장착", "서로 연결", "연결" 등의 용어는 일반적인 의미로 이해되어야 하며, 예를 들어, 고정적인 연결일 수 있고, 탈착 가능한 연결일 수 있으며, 또는 일체로 연결될 수도 있고; 기계적으로 연결될 수 있고, 전기적으로 연결될 수도 있으며; 직접 서로 연결될 수 있고 중간 매체를 통해 간접적으로 연결될 수 있으며, 또는 두개 소자 내부가 연통될 수도 있다. 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 구체적인 상황에 따라 본 발명에서의 상기 용어의 구체적인 의미를 이해할 수 있을 것이다.In the description of the present invention, unless otherwise specified or limited, the terms "mounting", "interconnecting", "connecting" and the like are to be understood in their general sense and may be, for example, Possible connection, or may be integrally connected; May be mechanically connected and electrically connected; They may be directly connected to each other, indirectly through the intermediate medium, or may communicate with each other. Those skilled in the art will appreciate the specific meaning of the term in the context of the present invention.

또한, 본 발명의 설명에 있어서, 별도로 설명되지 않는 한, "복수 개", "복수 갈래", "복수 그룹"은 2개 또는 2개 이상을 의미하며, "여러개", "여러 갈래", "여러 그룹"은 1개 또는 1개 이상을 의미한다.In the description of the present invention, unless stated otherwise, "plural", "plural groups", "plural groups" means two or more than two, and "plural", " Several groups "means one or more than one.

도1에 도시된 바와 같이, 본 발명의 실시예에 따른 냉각판은 냉각판 본체(1), 상기 냉각판 본체(1)내부에 마련되며 입수 라인과 환수 라인이 병렬되는 순환 수로(3)를 포함한다.1, a cooling plate according to an embodiment of the present invention includes a cooling plate body 1, a circulation channel 3 provided inside the cooling plate body 1 and having an inlet line and a water return line in parallel, .

이때, 입수 라인과 환수 라인이 병렬되는 것은 입수 라인과 출수 라인의 형태가 동일하거나 유사하고 서로 인접하게 배치되며, 입수 라인의 입수구와 출수 라인의 출수구는 동일단부에 마련되고, 상기 입수 라인의 출수구와 출수 라인의 입수구는 연통되거나 또는 입수 라인의 끝단은 직접 출수 라인의 전단과 일체형 구조를 이루는 것을 의미함을 밝혀둔다.The inlet and outlet lines of the inlet line and the outlet line are provided at the same end, and the inlet and outlet lines of the inlet line are arranged in parallel with each other. And the inlet port of the outflow line are communicated or the end of the inlet line is integrated with the front end of the direct outflow line.

예를 들면, 순환 수로는 S자형일 수 있다. 이때, 입수 라인과 출수 라인은 모두 동일한 S자형을 이루며, 두개의 S자형 라인의 동일단부는 각각 입수구와 출수구이고, 대향되는 다른 일단부는 서로 연통되는 일체형 구조이다. 즉, 이러한 구조는 하나의 배관으로 두개의 S자형을 형성하고 두개의 통구는 각각 입수구와 출수구이다.For example, the circulation channel may be S-shaped. At this time, the intake line and the outflow line all have the same S-shape, and the same ends of the two S-shaped lines are respectively the inlet and outlet, and the other opposite ends communicate with each other. That is, this structure forms two S-shaped pipes with one pipe, and the two pipes are respectively the inlet and outlet.

순환 수로의 형태는 상기 S자형에 한정되지 않으며, Z자형, 코일형 등의 기타 형태일 수도 있다.The shape of the circulation channel is not limited to the S-shape, but may be other shapes such as a Z-shape, a coil shape, and the like.

냉각판 본체(1)내부에 입수 라인과 출수 라인이 병렬되는 순환 수로(3)를 마련함으로써, 한 측면으로는, 순환 수로(3)는 냉각판과 순환 수로(3)내의 액체의 열교환 면적을 증가하여 냉각판의 열교환 효율을 향상시키고, 다른 한 측면으로는, 입수 라인과 출수 라인이 병렬되는 순환 수로(3)를 사용하여 입수와 출수의 온도차이에 의해 전체 냉각판의 온도가 불균일하게 되는 문제를 해결할 수 있음을 이해할 수 있다.The circulation channel 3 is provided on one side of the cooling plate main body 1 so that the heat exchange area of the liquid in the cooling plate and the circulation channel 3 is set to be The temperature of the entire cooling plate is made to be uneven by the temperature difference between the inlet and outlet using the circulation channel 3 in which the inlet line and the outlet line are arranged in parallel with each other It can be understood that the problem can be solved.

본 발명의 실시예에 따른 순환 수로는 "回"자형인 것이 바람직하다. 본 발명의 제1실시예는, 상기 순환 수로(3)는 직접 냉각판 본체(1)의 저면에 밀링(milling) 하여 형성되며, 냉각판 본체의 저면에 밑판을 용접하여 상기 순환 수로를 실링한다. 즉, 순환 수로(3)는 냉각판 본체(1) 저면의 순환 수조(circulating water groove)와 밑판이 배합되어 형성된 것이다.It is preferable that the circulation channel according to the embodiment of the present invention is a " turn " In the first embodiment of the present invention, the circulating water channel 3 is formed by milling on the bottom surface of the direct cooling plate body 1, and a bottom plate is welded to the bottom surface of the cooling plate body to seal the circulation channel . That is, the circulating water channel 3 is formed by mixing a circulating water groove on the bottom surface of the cooling plate body 1 and a base plate.

본 발명의 제2실시예는, 상기 순환 수로(3)는 상기 냉각판 본체(1)의 저면에 마련되는 송수관을 포함한다. 송수관 형태의 순환 수로는 제1실시예의 홈내부에 직접 마련될 수 있고, 기타 방식으로 고정될 수도 있음을 밝혀둔다.In the second embodiment of the present invention, the circulation channel (3) includes a water pipe provided on the bottom surface of the cooling plate body (1). It is noted that the circulation channel in the form of a water pipe can be provided directly in the groove of the first embodiment and can be fixed in other ways.

본 발명의 제3실시예는, 상기 순환 수로(3)는 제1실시예와 제2실시예의 두가지 방식을 결합하여 사용된 형태일 수 있다. 즉, 순환 수로의 한 구간은 밀링하여 형성된 홈이고, 다른 한 구간은 상기 홈과 연통되는 송수관 형태일 수 있다.In the third embodiment of the present invention, the circulation channel 3 may be used in combination with the two modes of the first and second embodiments. That is, one section of the circulation channel may be a groove formed by milling, and the other section may be in the form of a water pipe communicating with the groove.

본 발명의 제4실시예는, 제1실시예, 제2실시예 또는 제3실시예의 기초상에서 기공을 더 마련한다. 구체적으로, 냉각판 본체에는 순환 수로와 어긋나는 위치에 복수의 관통되는 기공이 마련된다. 냉각판 본체에 배치되는 기공은 냉각수를 통과하게 하는 동시에 하부로부터 상부로 기체를 불어 열량을 효과적으로 가져감으로써 냉각판과 기판 사이의 열교환 능력을 강화시킬 수 있음을 이해할 수 있다.The fourth embodiment of the present invention further provides pores on the basis of the first embodiment, the second embodiment, or the third embodiment. Specifically, the cooling plate body is provided with a plurality of penetrating pores at positions shifted from the circulation channel. It can be understood that the pores arranged in the cooling plate body can enhance the heat exchange ability between the cooling plate and the substrate by allowing the cooling water to pass therethrough and blowing the gas from the lower part to the upper part effectively.

기공의 기체유입장치는 냉각판 본체의 하방에 마련되는 분기관일 수 있으며, 분기관에는 기공과 연통되는 기체분사공이 마련될 수 있다. 기공의 기체유입장치는 통기판과 같은 기타 부재일 수 있다. The pneumatic gas inflow device may be a branch pipe provided below the cooling plate main body, and the branch pipe may be provided with a gas injection hole communicating with the pore. The gas inlet device of the pores may be other members such as a cylinder substrate.

본 발명의 제5실시예는, 상기 냉각판 본체(1)는 일체형 구조의 복수의 부분으로 구분되며, 각 부분에는 대응되게 하나의 독립적인 순환 수로(3)가 마련된다. 본 실시예의 순환 수로의 구체적인 구성은 제1실시예, 제2실시예 또는 제3실시예 중의 어느 한 방식을 적용할 수 있으며, 제4실시예의 기공 방안을 적용할 수도 있음을 밝혀둔다.In the fifth embodiment of the present invention, the cooling plate body 1 is divided into a plurality of parts of an integral structure, and each part is provided with one independent circulating water channel 3 correspondingly. It is noted that any of the first, second, and third embodiments can be applied to the concrete construction of the circulation channel of this embodiment, and the purging scheme of the fourth embodiment can also be applied.

복수의 부분은 순환 액체가 냉각판 본체(1)내에서의 열교환 시간을 단축시켜 각 부분의 순환액체와 냉각판이 비교적 큰 온도의 차이를 유지할 수 있음으로써 열교환 효율을 향상시키고, 각각의 순환 수로의 유통 범위를 작게하여 냉각판 온도의 균일성을 더욱 향상시킬 수 있음을 이해할 수 있다.The plurality of portions can shorten the heat exchange time in the cooling plate body 1 by the circulating liquid so that the circulating liquids and the cooling plates in each portion can maintain a relatively large temperature difference to improve the heat exchange efficiency, It can be understood that the uniformity of the cooling plate temperature can be further improved by reducing the distribution range.

이하, 냉각판 본체가 4개 부분으로 구분되어 각각 냉각을 진행하는 것을 예로 들어 본 발명의 냉각판에 대하여 상세하게 설명한다.Hereinafter, the cooling plate of the present invention will be described in detail as an example that the cooling plate main body is divided into four parts and cooling progresses, respectively.

도1에 도시된 바와 같이, 본 실시예의 냉각판의 상기 냉각판 본체의 저면은 두개의 중심선을 기준선으로 4개의 등분된 홈으로 구분되며, 인접되는 홈은 측벽을 공용하고, 상기 홈은 직사각형을 이룬다. 4개의 상기 순환 수로(3)는 각각 4개의 홈내부에 대응되게 마련되며, 각각의 홈에는 밑판(2)이 인레이되어 있다. 설명의 편의를 위하여, 상기 밑판을 각각 제1밑판(21), 제2밑판(22), 제3밑판(23), 제4밑판(24)으로 정의하고, 제1밑판(21), 제2밑판(22), 제3밑판(23), 제4밑판(24)은 각각 대응되는 홈과 풀 용접(full welding)되어 성형된다. 도2에서, 도면부호25는 밑판과 냉각판 본체의 용접 위치를 나타낸다.As shown in Fig. 1, the bottom surface of the cooling plate body of the cooling plate of this embodiment is divided into four equally divided grooves with two center lines as reference lines, and adjacent grooves share a side wall, and the grooves have a rectangular shape It accomplishes. Each of the four circulation ducts 3 is provided so as to correspond to the inside of each of the four grooves, and the bottom plate 2 is inlaid in each of the grooves. For convenience of explanation, the bottom plate is defined as a first bottom plate 21, a second bottom plate 22, a third bottom plate 23 and a fourth bottom plate 24, respectively, and the first bottom plate 21, The bottom plate 22, the third bottom plate 23 and the fourth bottom plate 24 are formed by full welding with the corresponding grooves, respectively. In Fig. 2, reference numeral 25 denotes welding positions of the base plate and the cooling plate body.

밑판(2), 냉각판 본체(1)와 대응되는 홈의 대각선상에는 순환 수로(3)와 어긋나는 위치에 냉각판 본체(1)를 관통하는 복수의 기공(12)이 마련되며, 밑판(2)의 대응되는 위치에는 통기공(미도시)이 마련된다. 상기 4개의 분기관(8)은 각 홈의 대각선(즉 밑판(2)과 45°각을 이루는 방향)에 대응되게 각 밑판(2)의 외면에 용접되고, 각각의 분기관(8)에는 기공(12)에 대응되게 기공(12) 및 통기공과 연통되는 기체분사공(82)이 마련된다. 도6은 구체적인 기공(12)과 기체분사공(82)을 나타내는 예시도이다. 도2에서, 도면부호81은 분기관과 밑판의 용접위치를 나타낸다. 상기와 같이, 대각선으로 마련함으로써 분기 범위를 최대한 크게 형성할 수 있고, 밑판(2)의 중심에 위치하여 기공(12)으로부터 나오는 기체의 균일성에 유리하며, 분기관(8)을 밑판(2)에 용접하는 구조를 적용함으로써 기체분사공의 흡기측의 실링을 실현할 수 있다.A plurality of pores 12 passing through the cooling plate body 1 are provided on the diaphragm of the bottom plate 2 and the grooves corresponding to the cooling plate main body 1 at positions shifted from the circulation water passage 3, A vent hole (not shown) is provided at a corresponding position of the vent hole. The four branch pipes 8 are welded to the outer surface of the bottom plate 2 corresponding to the diagonal line of each groove (that is, a direction forming an angle of 45 ° with the bottom plate 2) (12) and a gas injection hole (82) communicating with the vent hole. Fig. 6 is an exemplary view showing specific pores 12 and gas injection holes 82. Fig. In Fig. 2, reference numeral 81 denotes welding positions of the branch pipe and the bottom plate. The divergence can be made as large as possible and it is advantageous in uniformity of the gas coming out of the pores 12 at the center of the bottom plate 2 and the branch pipe 8 can be arranged on the bottom plate 2, The sealing on the intake side of the gas injection hole can be realized.

이와 동시에, 도1 또는 도2에 도시된 바와 같이, 각각의 분기관(8)에는 흡기관(9)이 각각 연결되어 있으며, 각 흡기관(9)은 냉각판 전체의 중간 위치까지 연장되어 분기관(8)의 측면과 용접됨으로써, 흡기관과 분기관 사이의 기밀성을 실현한다. 도2에서 도면부호91은 흡기관과 분기관의 용접점을 나타낸다. 흡기관의 다른 일단부에는 조인트가 용접되어 있으며, 상기 조인트는 VCR수나사(93)가 형성된 VCR수조인트(92)인 것이 바람직하다.At the same time, as shown in Fig. 1 or Fig. 2, each branch pipe 8 is connected to an intake pipe 9, and each intake pipe 9 extends to an intermediate position of the entire cooling plate, And is welded to the side surface of the engine (8), thereby realizing airtightness between the intake pipe and the branch pipe. 2, reference numeral 91 denotes a welding point between the intake pipe and the branch pipe. Preferably, the joint is welded to the other end of the intake tube, and the joint is a VCR water joint 92 formed with a VCR male screw 93. [

흡기관(9)이 냉각판 본체의 중간 위치까지 연장됨으로써 흡기관의 길이가 길어져 흡기관과 기체의 진공챔버 인입구를 연결할 때 일정한 유연성이 존재하고, 즉, 흡기관의 길이가 길어져, 흡기관을 진공챔버 인입구와 맞대어 결합할 경우, 진공챔버 인입구의 위치가 약간 편차가 있더라도 경질의 흡기관에 손상을 주지 않는다.Since the length of the intake pipe is increased by extending the intake pipe 9 to an intermediate position of the cooling plate main body, there is a certain degree of flexibility when connecting the inlet pipe of the intake pipe and the vacuum chamber of the gas. That is, Even when the position of the vacuum chamber inlet is slightly deviated, it does not damage the hard intake tube when the vacuum chamber inlet is brought into contact with it.

도2에 도시된 바와 같이(오른쪽 아래부분의 홈내부만 도시), 상기 순환 수로(3)는 상기 홈 표면에 밀링하여 형성된다. 도2의 오른쪽 아래부분은 순환 수로의 구조를 나타내기 위한 것으로서 밑판의 구조를 생략하였음을 밝혀둔다.As shown in Fig. 2 (only the inside of the groove in the lower right portion is shown), the circulation channel 3 is formed by milling on the groove surface. The lower right part of FIG. 2 is for illustrating the structure of the circulation channel, and the structure of the bottom plate is omitted.

밀링 하여 형성된 순환 수로(3)는 송수관을 코일형태로 설치할 때 굽힘 손상이 쉽게 발생되는 것을 방지할 수 있음을 이해할 수 있다.It can be understood that the circulation channel 3 formed by milling can prevent bending damage from being easily generated when the water pipe is installed in the form of a coil.

밑판(2)과 냉각판 본체(1)의 고정을 강화하기 위하여, 도4에 도시된 바와 같이, 상기 냉각판 본체(1)에는 상기 순환 수로(3)와 어긋나는 위치에 복수의 보스(boss)(11)를 마련하고, 상기 밑판에는 상기 보스(11)와 대응되게 수납공이 마련되며, 상기 보스(11)는 상기 수납공내부에 마련되고 상기 밑판과 용접 연결된다. 도4에서 상기 용접 방식을 상세하게 나타낸다. 보스(11)와 수납공이 배합되어 밑판(2)의 보조용접점을 형성함으로써 밑판(2)의 용접점을 대면적으로 증가하여 밑판(2)의 강성을 대면적으로 향상시킬 수 있음을 이해할 수 있다.4, the cooling plate body 1 is provided with a plurality of bosses at positions shifted from the circulation channel 3 in order to strengthen the fixing of the base plate 2 and the cooling plate body 1, The boss 11 is provided inside the receiving hole and is welded to the bottom plate. The boss 11 is provided in the bottom plate so as to correspond to the boss 11. The welding method is shown in detail in Fig. It is understood that the welding point of the bottom plate 2 can be increased to a large area and the rigidity of the bottom plate 2 can be increased to a large area by forming the auxiliary welding point of the bottom plate 2 by combining the boss 11 and the receiving hole have.

도5에 도시된 바와 같이, 상기 순환 수로(3)의 횡단면의 저면은 빗살형 구조(31)이며, 빗살형 구조(31)는 순환 수로(3)에서 순환 수로(3)의 액체 흐름 방향을 따라 마련되는 복수의 바 형태의 돌기인 것이 바람직하다. 빗살형 구조(31)는 물이 흐르는 과정에서 액체와 냉각판 본체(1)의 열전도 면적을 효과적으로 증가시켜 열교환 효율을 향상시킬 수 있음을 이해할 수 있다.5, the bottom surface of the cross-section of the circulation channel 3 is a comb-like structure 31, and the comb-like structure 31 is arranged in such a manner that the liquid flow direction of the circulation channel 3 in the circulation channel 3 It is preferable that a plurality of bar-shaped projections are provided. It can be understood that the comb-shaped structure 31 can effectively increase the heat conduction area of the liquid and the cooling plate main body 1 in the process of flowing water, thereby improving the heat exchange efficiency.

이하, 본 발명의 실시예에 따른 냉각판의 구체적인 가공 과정에 대해 설명한다.Hereinafter, a specific processing procedure of the cooling plate according to the embodiment of the present invention will be described.

1. 냉각판 가공:1. Cold plate machining:

a. 냉각판 저면에 4개의 홈을 가공하고(밑판에 용접 위치를 인레이함), 수로와 어긋나는 위치에 복수의 보스를 마련한다(밑판의 보조용접점을 형성하고, 밑판의 용접점을 대면적으로 증가하여 밑판의 강성을 대면적으로 향상시킴).a. Four grooves are machined on the bottom of the cooling plate (inlaying the welding position on the bottom plate), and a plurality of bosses are provided at positions deviating from the water channel (forming an auxiliary welding spot on the bottom plate and increasing the welding spot of the bottom plate to a large area Thereby improving the rigidity of the base plate to a large area).

b. 4개의 홈 면에 각각 순환 수로를 밀링하여 형성한다(도2를 참조). 각 순환 수로는 두개의 라인이 병렬되는 회로로서, 입수 라인과 환수 라인이 병렬되며 이는 고온(40-60℃)의 환수와 저온(16-20℃)의 입수 사이의 열교환에 유리하고 전체의 큰 판의 열 균일성에 대한 영향을 감소하고; 수로의 횡단면을 "빗살형 구조"(도5를 참조)로 가공하여 물이 흐르는 과정에서 열전도 면적을 효과적으로 증가함으로써 열교환 효율을 향상시키며; 4개의 독립적인 순환 수로는 냉각판의 단위 시간내에 통과되는 물 흐름량을 증가하여 냉각판의 냉각 효율을 효과적으로 향상시킬 수 있다.b. And is formed by milling a circulation channel on each of four groove surfaces (see Fig. 2). Each circulating channel is a circuit in which two lines are arranged in parallel. The inlet line and the water-circulating line are in parallel, which is advantageous for heat exchange between a high temperature (40-60 ° C.) and a low temperature (16-20 ° C.) Reduce the influence of the plate on thermal uniformity; To improve the heat exchange efficiency by effectively increasing the heat conduction area in the process of flowing water by processing the cross section of the channel into a "comb-like structure" (see FIG. 5); Four independent circulation channels can effectively increase the cooling efficiency of the cooling plate by increasing the amount of water passing through the unit time of the cooling plate.

c. 냉각판 양측면의 수로구에 대응되는 위치에 입수공과 환수공을 가공하고, 송수관 조인트(7)의 용접 위치에 대응된다.c. The inlet and outlet holes are machined at positions corresponding to the water channel on both sides of the cooling plate and correspond to the welding position of the water pipe joint 7. [

d. 도2에 도시된 바와 같이, 45도각 방향으로 기체분사공을 균일하게 형성함으로써 기체분사는 냉각판과 기판 사이의 열교환 효율을 효과적으로 향상시킨다.d. As shown in FIG. 2, by uniformly forming the gas injection holes in the 45-degree direction, the gas injection effectively improves the heat exchange efficiency between the cooling plate and the substrate.

2. 냉각판의 4개의 홈내부에 각각 제1밑판, 제2밑판, 제3밑판, 제4밑판을 대응되게 인레이하고 풀 용접하여 일체로 형성하고, 용접 후 누설여부를 측정하여 실링을 확보함으로써 냉각판 내부의 순환 수로의 실링을 실현한다.2. The first bottom plate, the second bottom plate, the third bottom plate, and the fourth bottom plate are correspondingly inlaid and fully welded into the four grooves of the cooling plate to form a single body. After welding, leakage is measured to secure sealing Thereby realizing the sealing of the circulation channel inside the cooling plate.

3. 4개의 흡기관의 출구를 대응되는 분기관에 각각 용접하고, 4개의 흡기관의 흡기구에 각각 VCR수조인트를 용접한다.3. Weld the outlets of the four intake pipes to the corresponding branch pipes and weld the VCR number joints respectively to the intake ports of the four intake pipes.

4. 흡기관과 용접하여 일체로 형성되는 분기관은 제1밑판, 제2밑판, 제3밑판, 제4밑판에 각각 풀 용접하여 메인 흡기관과 냉각판의 각 기체분사공 사이가 관통되도록 하여 기체분사관 통로를 형성한다.4. The branch pipes integrally formed by welding with the intake pipe are fully welded to the first bottom plate, the second bottom plate, the third bottom plate and the fourth bottom plate, respectively, so that the gas is injected between the main intake pipes and the cooling plate Thereby forming a gas injecting passage.

5. 각 구역의 입수관(4)과 환수관(5)의 관 연결용 관 조인트(6) 및 슬리브 조인트(7)를 용접한다.5. Weld the tube joints (6) and sleeve joints (7) of the inlet and outlet pipes (4) and (5) of each zone.

본 발명의 실시예에 따른 냉각판의 복수의 병렬되는 회로는 냉각판 본체 저면의 복수의 영역에 서로 독립된 순환 수로를 가공하고 밑판을 용접하여 수로를 실링한다. 본 발명의 실시예에 따른 냉각판의 각각의 수로의 입수 수로와 환수 수로는 병렬됨으로써 입수 및 환수의 온도차이로 인해 발생되는 전체 냉각판의 온도 균일성을 높이고, 수로 횡단면은 빗살형 구조를 적용함으로써 물의 열전도 면적을 증가하고 열전도 효율을 향상시킨다. 복수의 구역에서 독립적으로 물순환되므로 전체 냉각판의 총 물 흐름량을 증가시키고 냉각판의 열교환 능력을 강화시켜 기판에 대한 냉각 속도를 향상시킨다. 또한, 냉각판에 기공을 배치함으로써 냉각수를 통과시키는 동시에 하부로부터 상부로 기체를 불어 열량을 효과적으로 가져감으로써 냉각판과 기판 사이의 열교환 능력을 강화시킨다.The plurality of parallel circuits of the cooling plate according to the embodiment of the present invention seal the water channel by machining the circulating water channels independent of each other in a plurality of regions of the bottom surface of the cooling plate body and welding the bottom plate. The inlet and outlet channels of each of the channels of the cooling plate according to the embodiment of the present invention are arranged in parallel to increase the temperature uniformity of the entire cooling plate due to the temperature difference between the inlet and the outlet, Thereby increasing the heat conduction area of the water and improving the heat conduction efficiency. Water circulation in the plurality of zones independently increases the total water flow amount of the entire cooling plate and enhances the heat exchange ability of the cooling plate to improve the cooling rate for the substrate. Further, by arranging the pores in the cooling plate, the cooling water is passed and the gas is blown from the lower part to the upper part effectively to increase the heat amount, thereby enhancing the heat exchange ability between the cooling plate and the substrate.

이와 동시에, 본 실시예의 냉각판은, 냉각판에 써모커플(thermocouple)을 추가배치하여 온도를 측정함으로써 냉각판의 균일성을 측정할 수 있으며, 냉각판 주변 급수에 유량 제어 가능한 순환 물펌프를 추가배치하여 냉각판에 장착되는 써모커플과 함께 냉각판 표면의 냉각온도의 자동적인 온도 제어 기능을 실현할 수 있다. 또한, 홈내부에 송수관을 마련하여 입수와 환수가 병렬되는 방식을 적용하고, 밑판을 실링하는 방식을 적용하지 않는 것도 본 발명의 하나의 실행 가능한 방안이다.At the same time, the cooling plate of this embodiment can measure the uniformity of the cooling plate by measuring the temperature by additionally arranging a thermocouple on the cooling plate and adding a circulating water pump capable of controlling the flow rate to the water around the cooling plate It is possible to realize an automatic temperature control function of the cooling temperature on the surface of the cooling plate together with the thermocouple mounted on the cooling plate. It is also a feasible practice of the present invention to provide a water line in the groove to provide a parallel arrangement of incoming and outgoing water, and not to employ a method of sealing the base plate.

상술한 실시예에서, 흡기방식은 실시예에서 제공한 4개의 분기관이 각각 하나의 흡기관에 연결되는 방식에 한정되지 않으며, 4개의 분기관은 동일한 하나의 메인 흡기관에 연결되어 흡기할 수 있으며, 즉, 하나의 메인 흡기관은 복수의 분기관과 연통된다. 또한, 분기관의 설치방식도 상술한 대각선상에 설치되는 방식에 한정되지 않으며, 중심위치에 위치하는 하나의 메인 흡기관을 직접 배치하여 복수의 분기관은 서로 다른 위치에서 메인 흡기관의 양측에 연결되는 형태일 수 있으며, 예를 들면, 기공은 순환 수로와 엇갈리는 위치에서 대체로 "王"자형으로 배열되며, 이와 대응되게, 복수의 분기관은 메인 흡기관의 양측에 연결되어 대체로 "王"자형으로 된다.In the above-described embodiment, the intake system is not limited to the manner in which the four branch pipes provided in the embodiment are respectively connected to one intake pipe, and the four branch pipes are connected to the same main intake pipe, That is, one main intake pipe communicates with a plurality of branch pipes. In addition, the manner in which the branch pipes are installed is not limited to the manner in which the branch pipes are installed on the above-mentioned diagonal line. One main intake pipe located at the center position is directly arranged, For example, the pores are arranged in a "king" shape at a position offset from the circulation channel, and correspondingly, a plurality of branch pipes are connected to both sides of the main intake pipe, .

상술한 바와 같이, 본 발명의 실시예에 따른 냉각판은 냉각효과를 증가시키고 기판에 대한 냉각판의 냉각효율을 향상시켜 냉각시간이 장치의 전체 공정의 사이클 타임에 주는 영향을 감소시킨다. 또한 본 실시예의 냉각판 전체의 온도 균일성이 비교적 우수하고, 용접에 의한 일체형 구조를 적용함으로써 이후의 유지보수가 용이하다.As described above, the cooling plate according to the embodiment of the present invention increases the cooling effect and improves the cooling efficiency of the cooling plate for the substrate, thereby reducing the influence of the cooling time on the cycle time of the entire process of the apparatus. Further, the temperature uniformity of the entire cooling plate of the present embodiment is comparatively excellent and subsequent maintenance is easy by applying the integral structure by welding.

상기 실시예들은 본 발명의 기술방안을 설명하기 위하여 제시된 것으로서 본 발명을 한정하는 것이 아니다. 상술한 실시예를 참조하여 본 발명에 대해 상세하게 설명하였으나 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 상술한 실시예들에 기재된 기술방안을 수정할 수 있으며, 또는 그중 일부 기술특징에 대해 균등 치환 가능하며 이러한 수정 또는 치환은 해당 기술방안의 본질이 본 발명의 실시예들의 기술방안의 사상과 범위를 벗어나지 않음을 이해할 수 있을 것이다. The above embodiments are presented for illustrating the technical solution of the present invention and do not limit the present invention. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It is to be understood that such modifications and substitutions are not to be regarded as a departure from the spirit and scope of the inventive concept of the embodiments of the present invention.

1: 냉각판 본체 11: 보스
12: 기공 2: 밑판
21: 제1밑판 22: 제2밑판
23: 제3밑판 24: 제4밑판
25: 밑판과 냉각판 본체의 용접위치 3: 순환 수로
31: 빗살형 구조 4: 입수관
5: 환수관 6: 송수관 조인트
7: 슬리브 조인트 8: 분기관
81: 분기관과 밑판의 용접위치 82: 기체분사공
9: 흡기관 91: 흡기관과 분기관의 용접점
92: VCR수조인트 93: VCR수나사1: cooling plate body 11: boss
12: Pore 2: Base plate
21: first bottom plate 22: second bottom plate
23: third bottom plate 24: fourth bottom plate
25: welding position of base plate and cooling plate body 3: circulation channel
31: comb type structure 4: inlet pipe
5: water return pipe 6: water pipe joint
7: Sleeve joint 8: Branch tube
81: welding position of the branch pipe and the bottom plate 82:
9: intake pipe 91: welding point of intake pipe and branch pipe
92: Number of VCRs Joint 93: VCR male thread

Claims (11)

내부에 입수 라인과 환수 라인이 병렬되는 순환 수로가 마련되는 냉각판 본체를 포함하는 것을 특징으로 하는 냉각판.And a cooling plate body provided with a circulation channel in which an inlet line and a water-return line are arranged in parallel. 제1항에 있어서,
상기 냉각판 본체는 일체형 구조의 복수의 부분으로 구분되며, 각각의 상기 부분에는 대응되게 하나의 독립적인 상기 순환 수로가 마련되는 것을 특징으로 하는 냉각판.The method according to claim 1,
Characterized in that the cooling plate body is divided into a plurality of parts of an integral structure, and each said part is provided with a corresponding one independent circulation channel. 제2항에 있어서,
상기 냉각판 본체의 각각의 상기 부분은 인접되는 부분이 측벽을 공용하는 홈이며, 각각의 상기 순환 수로는 대응되는 상기 홈내부에 마련되는 것을 특징으로 한느 냉각판.3. The method of claim 2,
Wherein each of said portions of said cooling plate main body is a groove in which an adjacent portion shares the side wall, and each of said circulation water passages is provided inside said corresponding groove. 제3항에 있어서,
상기 순환 수로는, 상기 홈 표면에 밀링 하여 형성되는 입수 및 환수가 병렬되는 수조 및/또는 입수 및 환수가 병렬되는 송수관을 포함하는 것을 특징으로 하는 냉각판.The method of claim 3,
Wherein the circulation channel includes a water tank formed by milling the groove surface and having a water inlet and a water outlet connected in parallel and / or a water feed pipe having a water inlet and a water outlet connected in parallel. 제4항에 있어서,
상기 냉각판 본체에는 밑판이 더 마련되며, 상기 냉각판 본체는 두개의 중심선을 기준선으로 4개의 직사각형 홈으로 구분되며, 각각의 상기 홈에는 상기 홈과 실링 연결된 밑판이 인레이되어 있는 것을 특징으로 하는 냉각판.5. The method of claim 4,
Wherein the cooling plate body further includes a bottom plate, the cooling plate body is divided into four rectangular grooves with two center lines as a reference line, and each of the grooves is inlaid with a bottom plate sealingly connected with the grooves. plate. 제5항에 있어서,
상기 냉각판에는 상기 순환 수로와 어긋나는 위치에 복수의 보스가 마련되며, 상기 밑판에는 상기 보스와 대응되게 수납공이 마련되고, 상기 보스는 상기 수납공내부에 마련되고 상기 밑판과 연결되는 것을 특징으로 하는 냉각판.6. The method of claim 5,
Wherein the cooling plate is provided with a plurality of bosses at positions shifted from the circulation channel, and the bottom plate is provided with a storage hole corresponding to the boss, and the boss is provided inside the storage hole and connected to the bottom plate Cooling plate. 제6항에 있어서,
상기 밑판에는 분기관이 마련되고, 상기 냉각판 본체에는 상기 순환 수로와 어긋나는 위치에 관통되는 기공이 더 마련되며, 상기 밑판에는 상기 기공과 대응되는 통기공이 마련되며, 상기 분기관에는 상기 기공 및 통기공과 연통되는 기체분사공이 마련되는 것을 특징으로 하는 냉각판.The method according to claim 6,
The cooling plate body is further provided with pores passing through the cooling plate body at a position shifted from the circulation channel. The base plate is provided with a vent hole corresponding to the pores, and the pores are provided with pores and / And a gas injection hole communicating with the ventilation hole is provided. 제7항에 있어서,
각각의 상기 밑판의 대각선상에는 각각 하나의 상기 분기관이 마련되며 각각의 상기 분기관에는 흡기관이 대응되게 마련되는 것을 특징으로 하는 냉각판.8. The method of claim 7,
Wherein one of the branch pipes is provided on a diagonal line of each of the bottom plates, and each branch pipe is provided with an intake pipe corresponding thereto. 제8항에 있어서,
상기 밑판에는 하나의 메인 흡기관과 복수의 상기 분기관이 마련되며, 상기 분기관과 상기 메인 흡기관은 연통되는 것을 특징으로 하는 냉각판.9. The method of claim 8,
Wherein one of the main intake pipe and the plurality of branch pipes is provided on the bottom plate, and the branch pipe and the main intake pipe communicate with each other. 제1항 내지 제9항 중 어느 한 항에 있어서,
상기 순환 수로는 물흐름의 이동 방향을 따라 바 형태의 돌기가 마련되는 것을 특징으로 하는 냉각판.10. The method according to any one of claims 1 to 9,
Characterized in that the circulation channel is provided with a bar-like projection along the direction of movement of the water flow. 제1항에 있어서,
상기 냉각판 본체에는 냉각판 온도의 균일성을 측정하는 써모커플 및/또는 유량을 제어 가능한 순환 물펌프가 마련되는 것을 특징으로 하는 냉각판.The method according to claim 1,
Wherein the cooling plate body is provided with a thermocouple for measuring the uniformity of the cooling plate temperature and / or a circulating water pump capable of controlling the flow rate.
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