CN108118296A - A kind of coldplate - Google Patents
A kind of coldplate Download PDFInfo
- Publication number
- CN108118296A CN108118296A CN201711297818.4A CN201711297818A CN108118296A CN 108118296 A CN108118296 A CN 108118296A CN 201711297818 A CN201711297818 A CN 201711297818A CN 108118296 A CN108118296 A CN 108118296A
- Authority
- CN
- China
- Prior art keywords
- coldplate
- water channel
- bottom plate
- cyclic water
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000003801 milling Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 14
- 238000001771 vacuum deposition Methods 0.000 abstract description 4
- 102000010637 Aquaporins Human genes 0.000 description 54
- 238000003466 welding Methods 0.000 description 12
- 108091006146 Channels Proteins 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 108010063290 Aquaporins Proteins 0.000 description 1
- 208000032443 Masked facies Diseases 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0472—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being helically or spirally coiled
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0366—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/10—Particular layout, e.g. for uniform temperature distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Chemical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711297818.4A CN108118296A (en) | 2017-12-08 | 2017-12-08 | A kind of coldplate |
PCT/CN2018/092236 WO2019109626A1 (en) | 2017-12-08 | 2018-06-21 | Cooling plate |
JP2018152954A JP2019104984A (en) | 2017-12-08 | 2018-08-15 | Cooling plate |
KR1020180095583A KR20190068407A (en) | 2017-12-08 | 2018-08-16 | Cooling plate |
US15/998,844 US20190178582A1 (en) | 2017-12-08 | 2018-08-17 | Cooling plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711297818.4A CN108118296A (en) | 2017-12-08 | 2017-12-08 | A kind of coldplate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108118296A true CN108118296A (en) | 2018-06-05 |
Family
ID=62229923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711297818.4A Pending CN108118296A (en) | 2017-12-08 | 2017-12-08 | A kind of coldplate |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190178582A1 (en) |
JP (1) | JP2019104984A (en) |
KR (1) | KR20190068407A (en) |
CN (1) | CN108118296A (en) |
WO (1) | WO2019109626A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109489319A (en) * | 2018-12-15 | 2019-03-19 | 湖南玉丰真空科学技术有限公司 | A kind of vacuum chamber cooling device |
WO2019109626A1 (en) * | 2017-12-08 | 2019-06-13 | 北京创昱科技有限公司 | Cooling plate |
CN110195952A (en) * | 2019-04-25 | 2019-09-03 | 浙江大学 | A kind of thermal field outer cover that labyrinth slot type is cooling |
CN110828938A (en) * | 2019-11-25 | 2020-02-21 | 江苏理工学院 | Double-layer runner power battery liquid cooling plate control system and control method thereof |
CN113135023A (en) * | 2021-03-23 | 2021-07-20 | 新沂崚峻光电科技有限公司 | Device for printing embossing film |
CN113747738A (en) * | 2020-05-29 | 2021-12-03 | 光宝科技股份有限公司 | Liquid distribution module and heat dissipation system |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116123779B (en) * | 2023-04-17 | 2023-06-13 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling heat insulation device applied to hypersonic high-temperature wind tunnel and processing method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000299584A (en) * | 1999-04-12 | 2000-10-24 | Wada Stainless Kogyo Kk | Electronic board cooling device |
CN2671719Y (en) * | 2004-02-16 | 2005-01-19 | 宁波兴业电子铜带有限公司 | Cry stallizing device for copper alloy strip blank horizontal casting |
CN1880907A (en) * | 2005-06-07 | 2006-12-20 | 日立电线株式会社 | Cooling plate |
CN101785135A (en) * | 2007-07-18 | 2010-07-21 | 塞能量公司 | A bipolar plate for a fuel cell comprising a by-passed serpentine flow path for oxidant gas, a cooling plate for a fuel cell comprising a by-passed serpentine flow path for coolant fluid, fuel cell comprising such plates and uses thereof |
CN205960153U (en) * | 2016-06-02 | 2017-02-15 | 郑州宇通客车股份有限公司 | Liquid cooling battery module , liquid cooling power battery system and electric vehicle |
CN206179836U (en) * | 2016-11-11 | 2017-05-17 | 武汉帝尔激光科技股份有限公司 | Brilliant silicon solar cell is with cooling sucking disc |
KR101768128B1 (en) * | 2016-02-16 | 2017-08-16 | 한국에너지기술연구원 | High-temperature polymer electrolyte memberance fuel cell stack having independent cooling plate and method of producing thereof |
CN207834249U (en) * | 2017-12-08 | 2018-09-07 | 北京创昱科技有限公司 | A kind of coldplate |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0868582A (en) * | 1994-08-29 | 1996-03-12 | Toshiba Corp | Cooling plate and manufacture thereof |
JPH0992622A (en) * | 1995-09-21 | 1997-04-04 | Nissin Electric Co Ltd | Semiconductor manufacturing device |
US6364954B2 (en) * | 1998-12-14 | 2002-04-02 | Applied Materials, Inc. | High temperature chemical vapor deposition chamber |
JP2004047685A (en) * | 2002-07-11 | 2004-02-12 | Hitachi High-Technologies Corp | Vacuum processor and substrate holding-device |
DE102004005394A1 (en) * | 2004-02-04 | 2005-08-25 | Daimlerchrysler Ag | Electrochemical energy storage |
SE529516C2 (en) * | 2005-10-24 | 2007-09-04 | Alfa Laval Corp Ab | Universal flow module |
JP2009026950A (en) * | 2007-07-19 | 2009-02-05 | Alps Electric Co Ltd | Liquid-cooling system |
JP5086732B2 (en) * | 2007-08-09 | 2012-11-28 | 株式会社日本自動車部品総合研究所 | Cooling system |
US7651959B2 (en) * | 2007-12-03 | 2010-01-26 | Asm Japan K.K. | Method for forming silazane-based dielectric film |
CN201449171U (en) * | 2009-05-05 | 2010-05-05 | 蔡应麟 | Tubular energy saver |
US20110094718A1 (en) * | 2009-10-22 | 2011-04-28 | Tai-Her Yang | Heat absorbing or dissipating device with double-scroll piping transmitting temperature difference fluid |
US20110127022A1 (en) * | 2009-12-01 | 2011-06-02 | Lockheed Martin Corporation | Heat Exchanger Comprising Wave-shaped Fins |
JP5463224B2 (en) * | 2010-07-09 | 2014-04-09 | 日本発條株式会社 | Manufacturing method of plate with flow path, plate with flow path, temperature control plate, cold plate, and shower plate |
US8925622B2 (en) * | 2012-03-15 | 2015-01-06 | Adpv Technology Limited | Cooling plate |
IN2015DN04028A (en) * | 2012-10-16 | 2015-10-02 | Abell Foundation Inc | |
KR101970866B1 (en) * | 2013-06-11 | 2019-04-19 | 캐논 아네르바 가부시키가이샤 | Vacuum treatment device |
US10288361B2 (en) * | 2015-03-17 | 2019-05-14 | Hatco Corporation | Hot and cold shelf assembly with replaceable heating elements |
CN108118296A (en) * | 2017-12-08 | 2018-06-05 | 北京创昱科技有限公司 | A kind of coldplate |
-
2017
- 2017-12-08 CN CN201711297818.4A patent/CN108118296A/en active Pending
-
2018
- 2018-06-21 WO PCT/CN2018/092236 patent/WO2019109626A1/en active Application Filing
- 2018-08-15 JP JP2018152954A patent/JP2019104984A/en active Pending
- 2018-08-16 KR KR1020180095583A patent/KR20190068407A/en not_active Application Discontinuation
- 2018-08-17 US US15/998,844 patent/US20190178582A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000299584A (en) * | 1999-04-12 | 2000-10-24 | Wada Stainless Kogyo Kk | Electronic board cooling device |
CN2671719Y (en) * | 2004-02-16 | 2005-01-19 | 宁波兴业电子铜带有限公司 | Cry stallizing device for copper alloy strip blank horizontal casting |
CN1880907A (en) * | 2005-06-07 | 2006-12-20 | 日立电线株式会社 | Cooling plate |
CN101785135A (en) * | 2007-07-18 | 2010-07-21 | 塞能量公司 | A bipolar plate for a fuel cell comprising a by-passed serpentine flow path for oxidant gas, a cooling plate for a fuel cell comprising a by-passed serpentine flow path for coolant fluid, fuel cell comprising such plates and uses thereof |
KR101768128B1 (en) * | 2016-02-16 | 2017-08-16 | 한국에너지기술연구원 | High-temperature polymer electrolyte memberance fuel cell stack having independent cooling plate and method of producing thereof |
CN205960153U (en) * | 2016-06-02 | 2017-02-15 | 郑州宇通客车股份有限公司 | Liquid cooling battery module , liquid cooling power battery system and electric vehicle |
CN206179836U (en) * | 2016-11-11 | 2017-05-17 | 武汉帝尔激光科技股份有限公司 | Brilliant silicon solar cell is with cooling sucking disc |
CN207834249U (en) * | 2017-12-08 | 2018-09-07 | 北京创昱科技有限公司 | A kind of coldplate |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019109626A1 (en) * | 2017-12-08 | 2019-06-13 | 北京创昱科技有限公司 | Cooling plate |
CN109489319A (en) * | 2018-12-15 | 2019-03-19 | 湖南玉丰真空科学技术有限公司 | A kind of vacuum chamber cooling device |
CN110195952A (en) * | 2019-04-25 | 2019-09-03 | 浙江大学 | A kind of thermal field outer cover that labyrinth slot type is cooling |
CN110828938A (en) * | 2019-11-25 | 2020-02-21 | 江苏理工学院 | Double-layer runner power battery liquid cooling plate control system and control method thereof |
CN113747738A (en) * | 2020-05-29 | 2021-12-03 | 光宝科技股份有限公司 | Liquid distribution module and heat dissipation system |
CN113135023A (en) * | 2021-03-23 | 2021-07-20 | 新沂崚峻光电科技有限公司 | Device for printing embossing film |
Also Published As
Publication number | Publication date |
---|---|
US20190178582A1 (en) | 2019-06-13 |
WO2019109626A1 (en) | 2019-06-13 |
JP2019104984A (en) | 2019-06-27 |
KR20190068407A (en) | 2019-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108118296A (en) | A kind of coldplate | |
CN107677152B (en) | Microchannel liquid cooling board | |
CN207834249U (en) | A kind of coldplate | |
CN103841793A (en) | Water-cooling heat radiator and producing method | |
WO2022111441A1 (en) | Box-type controller cooling structure | |
CN203399460U (en) | Water-cooled radiator | |
CN211406671U (en) | High-efficiency liquid cooling heat dissipation system | |
TWM627038U (en) | Water cooling heat dissipation structure in serial connection | |
CN208459954U (en) | Cooling plate, cooler and computing equipment | |
CN201994284U (en) | Cooling device and power module | |
CN106041347A (en) | Heat exchanger combining vacuum brazing technology with friction stir welding technology | |
CN202977401U (en) | Liquid-cooled heat dissipation module | |
CN106933316A (en) | A kind of computer heat radiating device based on Internet technology | |
CN207369502U (en) | A kind of industrial recirculated water cooling electrical cabinet | |
CN206686498U (en) | Large scale cooled plate for wind-power electricity generation power model | |
CN213519929U (en) | Novel cooling plate and device using same | |
CN201772772U (en) | Sealed fin heat exchanger | |
CN209489041U (en) | A kind of double surface radiators | |
CN209356998U (en) | A kind of computer water-cooling circulatory system | |
CN206490571U (en) | Current transformer | |
CN207612522U (en) | A kind of cooled plate | |
CN206192164U (en) | New type heat exchanger core that contains ellipse round runner | |
CN205619811U (en) | Double -deck fine passageway group heat exchanger with low surface energy heat transfer characteristic | |
CN206282221U (en) | Water-cooling seat | |
CN206471325U (en) | Liquid cooling structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing Applicant after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address after: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing Applicant after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 102209 Beijing city Changping District town Beiqijia Hongfu Pioneer Park No. 15 hospital Applicant before: BEIJING CHUANGYU TECHNOLOGY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191125 Address after: 518112 Building 2, Dongfang Shengshi, Jinpai community, Buji street, Longgang District, Shenzhen City, Guangdong Province Applicant after: Shenzhen yongshenglong Technology Co.,Ltd. Address before: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210218 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Applicant after: Zishi Energy Co.,Ltd. Address before: 518112 Building 2, Dongfang Shengshi C, Jinpai community, Buji street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Shenzhen yongshenglong Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180605 |
|
WD01 | Invention patent application deemed withdrawn after publication |