KR20190050201A - Semiconductor device array and method of manufacturing semiconductor device array using the same - Google Patents

Abstract

The present invention provides a semiconductor device array which is easy to be separated from a substrate, and a manufacturing method thereof. According to an embodiment of the present invention, the semiconductor device array comprises: a substrate; a plurality of semiconductor structures arranged on the substrate; and an insulation layer arranged on the plurality of semiconductor structures. The substrate includes a groove arranged between the plurality of semiconductor structures. The insulation layer includes a first insulation layer arranged on the plurality of semiconductor structures and a second insulation layer arranged on the groove. The first insulation layer and the second insulation layer are connected to each other.

Description

Technical Field [0001] The present invention relates to a semiconductor device array and a method of manufacturing the same,

An embodiment relates to a semiconductor element array and a manufacturing method thereof.

A light emitting diode (LED) is one of light emitting devices that emits light when current is applied. The light emitting diode is capable of emitting light with high efficiency at a low voltage, thus providing excellent energy saving effect. In recent years, the problem of luminance of a light emitting diode has been greatly improved, and it has been applied to various devices such as a backlight unit of a liquid crystal display device, a display board, a display device, and a home appliance.

Semiconductor devices including compounds such as GaN and AlGaN have many merits such as wide and easy bandgap energy, and can be used variously as light emitting devices, light receiving devices, and various diodes.

Particularly, a light emitting device such as a light emitting diode or a laser diode using a semiconductor material of Group 3-5 or 2-6 group semiconductors can be applied to various devices such as a red, Blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize a white light beam with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, , Safety, and environmental friendliness.

In recent years, studies have been made on a technique of using a micro-sized LED as a pixel of a display.

However, such a micro-sized light emitting diode has a problem that it is difficult to selectively separate it from the wafer. Particularly, there is a problem that defects occur when the light emitting diode is transferred to another substrate by the particles remaining in the separation.

An embodiment provides a semiconductor element array which can be easily separated from a substrate and a method of manufacturing the same.

An embodiment provides a method of manufacturing a semiconductor element array capable of preventing the generation of particles upon separation from a substrate.

The problems to be solved in the embodiments are not limited to these, and the objects and effects that can be grasped from the solution means and the embodiments of the problems described below are also included.

A semiconductor element array according to an embodiment of the present invention includes: a substrate; A plurality of semiconductor structures disposed on the substrate; And an insulating layer disposed on the plurality of semiconductor structures, wherein the substrate includes a groove disposed between the plurality of semiconductor structures, the insulating layer including a first insulating layer disposed on the plurality of semiconductor structures, And a second insulating layer disposed in the groove, wherein the first insulating layer and the second insulating layer are connected to each other.

The semiconductor structure may include a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.

A first electrode electrically connected to the first conductive semiconductor layer through the first insulating layer; And a second electrode electrically connected to the second conductive type semiconductor layer through the first insulating layer.

A method of manufacturing a semiconductor element array according to an embodiment of the present invention includes: forming a semiconductor structure layer on a first substrate; Cutting the semiconductor structure layer into a plurality of semiconductor structures; Forming an electrode on the plurality of semiconductor structures; And forming an insulating layer on the plurality of semiconductor structures, wherein the cutting step forms a groove on the first substrate when cutting the semiconductor structure layer.

The forming of the semiconductor structure layer may include: forming a sacrificial layer on the first substrate; And forming the semiconductor structure layer on the sacrificial layer.

The step of forming the insulating layer may include forming the insulating layer in the plurality of semiconductor structures and the groove.

And selectively separating the plurality of semiconductor structures after forming the insulating layer.

The semiconductor structure can be selectively separated by irradiating a laser to the rear surface of the first substrate.

The sacrificial layer can be separated by absorbing the laser.

The semiconductor structure may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer.

The sidewalls of the grooves may have the same inclination angle as the sides of the plurality of semiconductor structures.

And forming a step in the semiconductor structure layer between the step of forming a semiconductor structure layer and the step of cutting, wherein the step of forming the step includes etching the semiconductor structure layer at a predetermined interval to form the first conductive layer Type semiconductor layer can be exposed.

According to the embodiment of the present invention, it is possible to improve the breakage of the insulating layer when the semiconductor element is detached from the wafer.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1A to 1G are views showing a method of manufacturing a semiconductor element array according to an embodiment of the present invention,
2 is a plan view of a semiconductor element array according to an embodiment of the present invention,
3A to 3E are views showing a method of transferring a semiconductor device according to an embodiment of the present invention,
4A is a photograph before the semiconductor element is separated from the substrate,
4B is a photograph after the semiconductor element is separated from the substrate,
5 is a photograph showing a state in which a semiconductor device is cleanly separated from a substrate according to an embodiment of the present invention,
6 is a view showing a method of separating a semiconductor device without etching the sacrificial layer,
FIG. 7 is a view showing a state where particles remain when the semiconductor device is separated by the method of FIG. 6, and FIG.
8 is a view of a semiconductor device according to an embodiment of the present invention,
9 is a conceptual diagram of a display device to which a semiconductor device according to the embodiment is transferred.

The embodiments may be modified in other forms or various embodiments may be combined with each other, and the scope of the present invention is not limited to each embodiment described below.

Although not described in the context of another embodiment, unless otherwise described or contradicted by the description in another embodiment, the description in relation to another embodiment may be understood.

For example, if the features of configuration A are described in a particular embodiment, and the features of configuration B are described in another embodiment, even if the embodiment in which configuration A and configuration B are combined is not explicitly described, It is to be understood that they fall within the scope of the present invention.

In the description of the embodiments, in the case where one element is described as being formed "on or under" another element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

In addition, the semiconductor device package according to the present embodiment may include semiconductor devices of micro size or nano size. Here, the small semiconductor element can refer to the structural size of the semiconductor element. The size of the small semiconductor device may be 1 탆 to 100 탆. In addition, the size of the semiconductor device according to the embodiment may be 30 mu m to 60 mu m, but is not limited thereto. In addition, the technical features or aspects of the embodiments can be applied to a semiconductor device with a scale of a smaller size.

1A to 1G are views showing a method of manufacturing a semiconductor element array according to an embodiment of the present invention.

A method of manufacturing a semiconductor element array according to an embodiment of the present invention includes: forming a first substrate; Forming a semiconductor structure layer on the first substrate; Cutting the semiconductor structure layer into a plurality of semiconductor structures; Forming an electrode on the plurality of semiconductor structures; And forming an insulating layer on the plurality of semiconductor structures.

Referring to FIG. 1A, forming the first substrate may first implant ions into the donor substrate S. The donor substrate S may comprise an ionic layer (I). The donor substrate S by the ionic layer I may include an intermediate layer 170 disposed on one side and a first layer 171 disposed on the other side. The ions implanted into the donor substrate S may include hydrogen (H) ions, but are not limited thereto.

Referring to FIG. 1B, the sacrificial layer 120 may be disposed between the substrate 110 and the coupling layer 130.

The substrate 110 may be a light-transmitting substrate including sapphire (Al ₂ O ₃ ), glass, or the like. Accordingly, the substrate 110 can transmit the laser light irradiated from the bottom. Therefore, the sacrifice layer 120 can absorb laser light when the laser is lifted off.

A sacrificial layer 120 and a bonding layer 130 may be stacked on the substrate 110. The order of the sacrificial layer 120 and the bonding layer 130 may be reversed.

The bonding layer 130 disposed on the substrate may be disposed to face the bonding layer 130 disposed on the donor substrate S. The bonding layer 130 disposed on the substrate and the bonding layer 130 disposed on the donor substrate S may include but are not limited to SiO ₂ .

The bonding layer 130 disposed on the sacrificial layer 120 may be bonded to the bonding layer 130 disposed on the donor substrate S through an O ₂ plasma treatment. However, the present invention is not limited thereto, and cutting can be performed by a material other than oxygen.

The sacrificial layer 120 is disposed on the substrate 110 and the coupling layer 130 is disposed on the sacrificial layer 120 and the donor substrate S is disposed on the coupling layer 130 .

Referring to FIG. 1C, the ionic layer I of FIG. 1B is removed by fluid jet cleaving, so that the first layer 171 can be separated from the intermediate layer 170.

At this time, the first layer 171 separated from the donor substrate can be reused as a substrate. Therefore, it is possible to provide an effect of manufacturing cost and cost reduction.

The step of forming the layer of semiconductor structure on the first substrate may form the semiconductor structure 140 on the intermediate layer 170. The intermediate layer 170 may contact the semiconductor structure 140. However, since the roughness of the upper surface of the intermediate layer 170 is poor due to voids generated by the ion implantation process, defects may occur during deposition of Red Epi.

Therefore, a planarization process can be performed on the upper surface of the intermediate layer 170. [ For example, chemical mechanical planarization may be performed on the upper surface of the intermediate layer 170, and the semiconductor structure 140 may be disposed on the upper surface of the intermediate layer 170 after planarization. With this configuration, the semiconductor structure 140 can be improved in electrical characteristics.

The semiconductor structure 140 includes a first conductive semiconductor layer 141 disposed on the intermediate layer 170, a first clad layer 144 disposed on the first conductive semiconductor layer, a second clad layer 144 disposed on the first clad layer 144, An active layer 142 disposed on the active layer 142, and a second conductive semiconductor layer 143 disposed on the active layer 142. The specific structure of the semiconductor structure 140 will be described later.

Referring to FIG. 1D, a first etching may be performed to expose the first conductive semiconductor layer 141 at an upper portion of the semiconductor structure 140.

The primary etching may be performed by wet etching or dry etching, but the present invention is not limited thereto, and various methods can be applied. Before the first etching is performed, the second electrode 152 of FIG. 1E may be disposed on the second conductive type semiconductor layer 143 and may be patterned as shown in FIG. 1E. However, the present invention is not limited to this method.

Referring to FIG. 1E, the step of forming the electrodes on the semiconductor structure may include forming the first electrode 151 and the second electrode 152 on the semiconductor structure 140.

The second electrode 152 may be electrically connected to the second-conductivity-type semiconductor layer 143b. The area of the lower surface of the second electrode 152 may be smaller than the upper surface of the second conductive type semiconductor layer 143. For example, the second electrode 152 may be disposed at a distance of 1 占 퐉 to 3 占 퐉 from the edge of the second-conductivity-type semiconductor layer 143b.

The first electrode 151 and the second electrode 152 may be formed by conventional electrode forming methods such as stuffering, coating, and deposition. However, the present invention is not limited thereto.

In addition, as described above, the second electrode 152 is formed before the first etching, and the first electrode 151 is etched after the first etching to be disposed on the exposed surface of the first conductive type semiconductor layer 41 .

The first electrode 151 and the second electrode 152 may be disposed at different positions from the substrate 110. The first electrode 151 may be disposed on the first conductive semiconductor layer 141. The second electrode 152 may be disposed on the second conductive type semiconductor layer 143. Accordingly, the second electrode 152 may be disposed above the first electrode 151.

Referring to FIG. 1F, the step of cutting the semiconductor structure into a plurality of semiconductor structures may perform a secondary etching to an upper surface of the substrate 110. The secondary etching may be performed by wet etching or dry etching, but is not limited thereto. In a semiconductor device, the secondary etching may be made to have a larger thickness than the primary etching.

The semiconductor structure disposed on the substrate through the secondary etching may be isolated in the form of a plurality of chips. For example, two semiconductor structures may be disposed on the substrate 110 through a secondary etch in FIG. 1F. The number of semiconductor structures can be variously set according to the size of the substrate and the size of the semiconductor structure. In this case, the steps of separating the semiconductor structure and forming the electrodes may be reversed in order. That is, the semiconductor structure may be separated after the electrode is formed first, or the electrode may be formed after the semiconductor structure is separated. Further, it is also possible to form an electrode after the semiconductor structure is first etched, and then to separate the semiconductor structure.

At this time, the secondary etching may proceed to a partial region of the substrate 110 through the semiconductor structure. Accordingly, the substrate 110 may be formed with a groove H1 disposed between the plurality of semiconductor structures. Since the groove H1 of the substrate is formed in the course of etching the semiconductor structure 140, the sidewall of the groove H1 may have the same inclination angle as the sides of the plurality of semiconductor structures 140. [ However, the present invention is not limited thereto, and the groove H1 of the substrate may be formed by a separate etching process.

With this configuration, the bonding layer 120 and / or the sacrificial layer 130 disposed between the plurality of semiconductor structures can be reliably removed. The depth of the groove H1 is not particularly limited as long as it can remove the bonding layer 120 and / or the sacrificial layer 130 disposed between the semiconductor structures.

If the bonding layer and / or the sacrificial layer of the semiconductor structure are connected to each other, any one semiconductor structure may be separated from the substrate to affect the neighboring semiconductor structure.

When only one of the semiconductor structures is separated from the substrate, the sacrifice layer of the neighboring semiconductor structure may be separated from the substrate.

Referring to FIG. 1G, in the step of forming the insulating layer, the insulating layer 160 may be formed entirely on the plurality of semiconductor structures 140 and the grooves H1. The insulating layer 160 may cover the sides of the sacrificial layer 120, the bonding layer 130, the intermediate layer 170, and the semiconductor structure 140.

The insulating layer 160 may cover a portion of the upper surface of the first electrode 151. And a portion of the upper surface of the first electrode 151 may be exposed. The upper surface of the exposed first electrode 151 may be electrically connected to an electrode pad or the like to perform current injection or the like.

In addition, the insulating layer 160 may cover a portion of the upper surface of the second electrode 152. A portion of the upper surface of the second electrode 152 may be exposed. Like the first electrode 151, the upper surface of the exposed second electrode 152 may be electrically connected to an electrode pad or the like to perform current injection or the like. The insulating layer 160 may be partially disposed on the upper surface of the substrate. The insulating layer 160 disposed between the adjacent semiconductor chips may be placed in contact with the substrate 110.

Referring to FIG. 1G, the fabricated semiconductor element array may include a substrate 110 and a plurality of semiconductor elements 10 disposed on the substrate 110. According to the embodiment, a plurality of semiconductor elements 10 may be arranged on the substrate 110. [

The plurality of semiconductor elements 10 are electrically connected to the first conductivity type semiconductor layer 144 and the second conductivity type semiconductor layer 143 and between the first conductivity type semiconductor layer 144 and the second conductivity type semiconductor layer 143 The semiconductor structure 140 including the active layer 142 disposed on the semiconductor structure 140, the insulating layer 160 disposed on the semiconductor structure 140, the first conductive semiconductor layer 144 through the insulating layer 160, And a second electrode 152 that is electrically connected to the second conductive semiconductor layer 143 through the insulating layer 160. The first electrode 151 may be formed of a material having a high crystallinity.

As described above, the substrate 110 may include a groove H1 disposed between the plurality of semiconductor structures 140. The groove H1 may be in the form of a line, but is not limited thereto.

The insulating layer 160 may include a first insulating layer 161 disposed on the top and sides of the semiconductor structure 140 and a second insulating layer 162 disposed in the groove H1 of the substrate 110 have. At this time, the first insulating layer 161 and the second insulating layer 162 may be connected to each other.

The insulating layer 160 may entirely cover the plurality of semiconductor structures 140, one surface of the substrate 110, and the grooves H1 of the substrate 110. [

The upper surface of the semiconductor structure 140 includes a first upper surface S11 on which the first electrode 151 is disposed, a second upper surface S12 on which the second electrode 152 is disposed, And an inclined plane S13 disposed between the first upper surface S2 and the second upper surface S2.

The difference between the height P1 from the bottom surface of the semiconductor structure 140 to the second top surface S12 and the height P2 from the bottom surface of the semiconductor structure 140 to the first top surface S11 P3) may be greater than 0 and less than 2 [mu] m.

If the height difference P3 between the first upper surface S11 and the second upper surface S12 is greater than 2 mu m, the chip may be leveled in the transfer process. That is, as the step difference increases, the chip may become difficult to keep horizontal. The transfer process may mean transferring the chips from the growth substrate to another substrate as shown in FIG.

The first angle? ₁ between the inclined plane S13 and the horizontal plane may be smaller than the second angle? ₂ between the side surface of the semiconductor structure 140 and the horizontal plane. The first angle? ₁ between the inclined plane S13 and the imaginary horizontal plane may be 20 ° to 50 °. If the first angle? ₁ is smaller than 20 占 the area of the second upper surface S12 may be reduced and the light output may be lowered. Further, when the first angle? ₁ is larger than 50 degrees, the inclination angle increases and the risk of breakage due to an external impact may increase.

The second angle? ₂ between the side surfaces of the semiconductor structure 120 and the horizontal plane may be greater than 70 ° and less than 90 °. When the second angle? ₂ is smaller than 70 占 the area of the second upper surface S12 may be reduced and the light output may be lowered. When the second angle? ₂ between all the side surfaces of the semiconductor structure 120 and the horizontal plane is less than 90 占 the area of the inclined plane S13 decreases from the first top surface S11 to the second top surface S12 Can be narrowed.

2 is a plan view of a semiconductor element array according to an embodiment of the present invention.

Referring to FIG. 2, each semiconductor element 10 may have a planar longitudinal side E1 and a short side, and the longitudinal side E1 may be a micro-size smaller than 100 .mu.m. Illustratively, if the substrate 110 is 5 inches, numerous semiconductor devices can be placed on the substrate 110.

The groove H1 may be arranged so as to surround one semiconductor element 10 in a plan view. Illustratively, the groove H1 may have a checkerboard shape in which a first directional groove H11 and a second directional groove H12 are formed, respectively. The semiconductor device 10 may be disposed in a space surrounded by the first directional grooves H11 and the second directional grooves H12.

The insulating layer 160 may be disposed entirely on the substrate 110 on which the plurality of semiconductor structures are disposed. The insulating layer 160 may be disposed on the first directional grooves H11 and the second directional grooves H12 of the substrate 110. [ That is, the insulating layer 160 may be disposed entirely on the remaining area except the holes 160a and 160b for exposing the electrodes of the semiconductor device 10. [

3A to 3E are views showing a method of transferring a semiconductor device according to an embodiment of the present invention.

3A to 3E, a method of transferring a semiconductor device according to an embodiment includes selectively irradiating a semiconductor device including a plurality of semiconductor devices disposed on a substrate 110 to separate semiconductor devices from the substrate And disposing the separated semiconductor elements on the panel substrate. Here, the semiconductor element before transfer may include the configurations of FIGS. 1A to 1G as it is.

First, referring to FIG. 3A, the substrate 110 may be the same as the substrate 110 described in FIGS. 1A to 1G. In addition, as described above, a plurality of semiconductor elements may be disposed on the substrate 110. [ For example, the plurality of semiconductor elements may include a first semiconductor element 10-1, a second semiconductor element 10-2, a third semiconductor element 10-3, and a fourth semiconductor element 10-4 have. However, the number of semiconductor elements is not limited to this number, and semiconductor elements may have various numbers.

Referring to FIG. 3B, at least one semiconductor device selected from among the plurality of semiconductor devices 10-1, 10-2, 10-3, and 10-4 can be separated into a growth substrate using the transport mechanism 210 . The transport mechanism 210 may include a first bonding layer 211 and a transport frame 212 disposed below. Illustratively, the transfer frame 212 has a concave-convex structure, and the semiconductor element and the first bonding layer 211 can be easily bonded. In this case, since the step difference of the semiconductor device according to the embodiment is smaller than 2 탆, the semiconductor device can maintain the horizontal state during the transfer process.

3C, when the laser beam is selectively irradiated to the rear surface of the semiconductor elements 10-1 and 10-3 to be separated, the sacrifice layer of the semiconductor elements 10-1 and 10-3 is decomposed, / RTI > Then, the first semiconductor element 10-1 and the third semiconductor element 10-3 can be separated from the transport mechanism 210 by moving the transport mechanism 210 upward. And the bonding between the second bonding layer 310 and the first semiconductor element 10-1 and the third semiconductor element 10-3 can be performed.

A laser lift-off (LLO) using a photon beam having a specific wavelength band can be applied to the method for separating the semiconductor device from the substrate 110. For example, the center wavelength of the irradiated laser may be 266 nm, 532 nm, 1064 nm, but is not limited thereto.

At this time, the bonding layer 130 disposed between the semiconductor device and the substrate 110 can prevent physical damage to the semiconductor devices due to laser lift-off (LLO). The sacrificial layer can be separated from the semiconductor device by a laser lift-off (LLO). For example, the sacrificial layer may be partially removed due to separation and the remaining sacrificial layer may be separated with the bonding layer. Accordingly, the sacrificial layer and the bonding layer, the semiconductor structure, the first electrode, and the second electrode, which are disposed on the sacrificial layer, can be separated from the substrate 110 in the semiconductor device.

In addition, a plurality of semiconductor elements separated by the substrate 110 may have a predetermined spacing from each other. The first semiconductor element 10-1 and the third semiconductor element 10-3 are separated from the growth substrate and the first semiconductor element 10-1 and the third semiconductor element 10-3 are separated from the growth substrate, The second semiconductor element 10-2 and the fourth semiconductor element 10-4 having the same distance as the separation distance of the fourth semiconductor element 10-4 can be separated in the same manner. Thereby, semiconductor devices having the same distance can be transferred to the display panel.

Referring to FIG. 3D, a selected semiconductor device can be disposed on the panel substrate 300. FIG. For example, the first semiconductor element 10-1 and the third semiconductor element 10-3 can be disposed on the panel substrate 300. [

Specifically, the second bonding layer 310 may be disposed on the panel substrate 300, and the first semiconductor element 10-1 and the third semiconductor element 10-3 may be disposed on the second bonding layer 310, Lt; / RTI > Thus, the first semiconductor element 10-1 and the third semiconductor element 10-3 can be in contact with the second bonding layer 310. In this manner, semiconductor devices having spaced spacings can be disposed on the panel substrate, thereby improving the efficiency of the transfer process.

And a laser may be irradiated to separate the first bonding layer 211 and the selected semiconductor element. For example, a laser beam may be irradiated onto the transport mechanism 210 to physically separate the first bonding layer 211 and the selected semiconductor element. Illustratively, the bonding layer 211 may lose its adhesive function when the laser is irradiated.

Referring to FIG. 3E, when the transport mechanism 210 is moved upward after the laser irradiation, the first semiconductor element 10-1 and the third semiconductor element 10-3 can be separated from the transport mechanism 210 have. And the bonding between the second bonding layer 310 and the first semiconductor element 10-1 and the third semiconductor element 10-3 can be performed.

FIG. 4A is a photograph of the semiconductor element before it is separated from the substrate, FIG. 4B is a photograph of the semiconductor element after the semiconductor element is separated from the substrate, and FIG. to be.

4A, the semiconductor device according to the embodiment includes a first insulating layer 161 and a second insulating layer 162 formed on the side surface of the semiconductor structure 140 and the groove H1 of the substrate 110 to form a sacrificial layer 130 ) Are completely separated from each other. 4B, when the semiconductor device is separated from the substrate 110, only the second insulating layer 162 disposed in the trench H1 is left, so that the first insulating layer 161 is clearly separated. Referring to FIG. 5, it can be seen that there is no generated particles in the separated region F1 of the semiconductor device due to separation of the sacrificial layer or the insulating layer.

FIG. 6 is a view showing a method of separating a semiconductor device without etching the sacrificial layer, and FIG. 7 is a view showing a state where particles remain when the semiconductor device is separated by the method of FIG.

As shown in FIG. 6, if only the semiconductor structure is subjected to the second etching and the sacrificial layer SL1 is not etched, the neighboring semiconductor elements may be affected in the process of separating the semiconductor elements.

Illustratively, when the sacrificial layer SL1 is thick, there is a problem that the sacrificial layer SL1 of the channel region CH is irregularly separated during the lift-off process. Here, the channel region can be defined as a region between neighboring semiconductor structures.

In addition, when the sacrificial layer is thinly left in the channel region, the remaining sacrificial layer SL1 may be separated as shown in FIG. 7 to form particles. These particles may cause defects in the transferring process. Therefore, in the embodiment of the present invention, such a defect can be prevented by etching the sacrifice layer in the channel region in advance.

8 is a diagram of a semiconductor device according to an embodiment of the present invention.

Referring to FIG. 8, a semiconductor device according to an embodiment includes a sacrificial layer 120, a coupling layer 130 disposed on the sacrificial layer 120, an intermediate layer 170 disposed on the coupling layer 130, A first clad layer 144 disposed on the first conductivity type semiconductor layer; an active layer 142 disposed on the first clad layer 144; , A second conductive semiconductor layer (143) disposed on the active layer, a first electrode (151) electrically connected to the first conductive semiconductor layer, a second electrode electrically connected to the second conductive semiconductor layer The electrode 152 and the sacrificial layer 120, the coupling layer 130, the first conductive semiconductor layer 141, the first clad layer 144, the active layer 142, and the second conductive semiconductor layer 142 And an insulating layer 160 that surrounds the insulating layer 160.

The sacrificial layer 120 may be a layer disposed at the lowermost portion of the semiconductor device according to the embodiment. That is, the sacrifice layer 120 may be a layer disposed outermost in the 1-2 direction (X ₂ axis direction). The sacrificial layer 120 may be disposed on a substrate (not shown).

The maximum width W ₁ in the second direction (Y-axis direction) of the sacrificial layer 120 may be 30 탆 to 60 탆.

Here, the first direction includes the 1-1 direction and the 1-2 direction in the thickness direction of the semiconductor structure 140. The 1-1 direction is a direction from the first conductivity type semiconductor layer 121 to the second conductivity type semiconductor layer 123 in the thickness direction of the semiconductor structure 140. The 1-2 direction is a direction from the second conductivity type semiconductor layer 123 to the first conductivity type semiconductor layer 121 in the thickness direction of the semiconductor structure 140. Here, the second direction (Y-axis direction) may be a direction perpendicular to the first direction (X-axis direction). The second direction (Y-axis direction) includes the second-1-direction (Y1-axis direction) and the second-2-direction (Y2-axis direction).

The sacrificial layer 120 may be a layer that is left while transferring the semiconductor device to the display device. For example, when the semiconductor element is transferred to the display device, the sacrifice layer 120 may be partially separated by the laser irradiated at the time of transfer, and the remaining portion may be left. At this point, the sacrificial layer 120 may comprise a material that is separable at the wavelength of the irradiated laser. The wavelength of the laser may be any one of 266 nm, 532 nm, and 1064 nm, but is not limited thereto.

The sacrificial layer 120 may include oxide or nitride. However, the present invention is not limited thereto. For example, the sacrificial layer 120 may include an oxiade-based material with a low strain that occurs during epitaxial growth.

The sacrificial layer 120 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide ), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IZON (IZO nitride), AGZO (Al- Ga ZnO), IGZO , NiO, RuOx / ITO, Ni / IrOx / Au or Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Sn, In, Ru, Au, and Hf.

The sacrificial layer 120 may have a thickness d ₁ of 20 nm or more in the first direction (X-axis direction). Preferably, the sacrificial layer 120 may have a thickness in a first direction (X-axis direction) and a thickness d ₁ of 40 nm or more.

The sacrificial layer 120 may be formed by an E-beam evaporator, a thermal evaporator, a metalorganic chemical vapor deposition (MOCVD), a sputtering, or a pulsed laser deposition (PLD) method , But is not limited thereto.

The bonding layer 130 may be disposed on the sacrificial layer 120. Bonding layer 130 may include a material such as SiO _2, SiNx, TiO _2, polyimide, resins.

The thickness d ₂ of the bonding layer 130 may be 30 nm to 1 μm. However, the present invention is not limited thereto. Here, the thickness may be a length in the X-axis direction. The bonding layer 130 may be annealed to bond the sacrificial layer 120 and the intermediate layer 170 to each other. At this time, hydrogen ions in the bonding layer 130 may be released and peeling may occur. Thus, the bonding layer 130 may have a surface roughness of 1 nm or less. With this structure, the separation layer and the bonding layer can be easily bonded. The bonding layer 130 and the sacrificial layer 120 may be arranged at mutually different positions.

The intermediate layer 170 may be disposed on the bonding layer 130. The intermediate layer 170 may include GaAs. The intermediate layer 170 may be bonded to the sacrificial layer 120 through the bonding layer 130.

Semiconductor structure 140 may be disposed on intermediate layer 170. The semiconductor structure 140 includes a first conductive semiconductor layer 141 disposed on the intermediate layer 170, a first clad layer 144 disposed on the first conductive semiconductor layer, a second clad layer 144 disposed on the first clad layer 144, An active layer 142 disposed on the active layer 142, and a second conductive semiconductor layer 143 disposed on the active layer 142.

The first conductive semiconductor layer 141 may be disposed on the intermediate layer 170. The thickness d ₄ of the first conductivity type semiconductor layer 141 may be 1.8 탆 to 2.2 탆. However, the present invention is not limited thereto.

The first conductive semiconductor layer 141 may be formed of a compound semiconductor such as a Group III-V or a Group II-VI, and the first dopant may be doped. The first conductive type first semiconductor layer 112 may be formed of InxAlyGa1-x-yP (0? X? 1, 0? Y? 1, 0? X + , 0? Y? 1, 0? X + y? 1).

The first dopant may be an n-type dopant such as Si, Ge, Sn, Se, or Te. When the first dopant is an n-type dopant, the first conductivity type semiconductor layer 141 doped with the first dopant may be an n-type semiconductor layer.

The first conductive semiconductor layer 141 may include at least one of AlGaP, InGaP, AlInGaP, InP, GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, InGaAs, AlInGaAs and GaP.

The first conductive semiconductor layer 141 may be formed using a chemical vapor deposition (CVD) method, a molecular beam epitaxy (MBE) method, a sputtering method, or a vapor phase epitaxy (HVPE) method. .

The first clad layer 144 may be disposed on the first conductive semiconductor layer 141. The first clad layer 144 may be disposed between the first conductivity type semiconductor layer 141 and the active layer 142. The first clad layer 144 may include a plurality of layers. The first clad layer 144 may include an AlInP-based layer / AlInGaP-based layer.

The thickness d ₅ of the first clad layer 144 may be 0.45 탆 to 0.55 탆. However, the present invention is not limited thereto.

The active layer 142 may be disposed on the first clad layer 144. The active layer 142 may be disposed between the first conductive semiconductor layer 141 and the second conductive semiconductor layer 143. The active layer 142 is a layer in which electrons (or holes) injected through the first conductivity type semiconductor layer 141 and holes (or electrons) injected through the second conductivity type semiconductor layer 143 meet. As the electrons and the holes are recombined, the active layer 142 transitions to a low energy level and can generate light having ultraviolet wavelength.

The active layer 142 may have any one of a single well structure, a multiple well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure or a quantum well structure. ) Is not limited to this.

The active layer 142 may be formed of any one or more pairs of GaInP / AlGaInP, GaP / AlGaP, InGaP / AlGaP, InGaN / GaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / GaN, GaAs / AlGaAs and InGaAs / AlGaAs. But are not limited thereto.

The thickness d ₆ of the active layer 142 may be 0.54 μm to 0.66 μm. However, the present invention is not limited thereto.

Electrons are cooled in the first cladding layer 144, and the active layer 142 can generate more radiation recombination.

The second conductive semiconductor layer 143 may be disposed on the active layer 142. The second conductivity type semiconductor layer 143 may include a second conductivity type semiconductor layer 143a and a second conductivity type semiconductor layer 143b.

The second-first conductivity type semiconductor layer 143a may be disposed on the active layer 142. The second-conductivity-type semiconductor layer 143b may be disposed on the second-conductivity-type semiconductor layer 143a.

The second-first conductivity type semiconductor layer 143a may include TSBR and P-AllnP. The thickness d ₇ of the second-first conductivity type semiconductor layer 143a may be 0.57 mu m to 0.70 mu m. However, the present invention is not limited thereto.

The second-first conductivity type semiconductor layer 143a may be formed of a compound semiconductor such as group III-V, group II-VI, or the like. And the second dopant may be doped in the second-first conductivity type semiconductor layer 143a.

The second-first conductivity type semiconductor layer 143a may be formed of InxAlyGa1-x-yP (0? X? 1, 0? Y? 1, 0? X + , 0? Y? 1, 0? X + y? 1). When the second conductivity type semiconductor layer 143 is a p-type semiconductor layer, it may include Mg, Zn, Ca, Sr, and Ba as a p-type dopant.

The second conductivity type semiconductor layer 143a may be a p-type semiconductor layer, and the second conductivity type semiconductor layer 143a doped with the second dopant may be a p-type semiconductor layer.

The second-conductivity-type semiconductor layer 143b may be disposed on the second-conductivity-type semiconductor layer 143a. The second conductivity type semiconductor layer 143b may include a p-type GaP-based layer.

The second conductivity type semiconductor layer 143b may include a superlattice structure of a GaP layer / InxGa1-xP layer (0? X? 1).

For example, the second-conductivity-type semiconductor layer 143b may be doped with Mg at a concentration of about 10 × ¹⁰ -18, but the present invention is not limited thereto.

In addition, the second-second conductivity type semiconductor layer 143b may be formed of a plurality of layers, and only a part of the layers may be doped with Mg.

The thickness d ₈ of the second-conductivity-type semiconductor layer 143b may be 0.9 탆 to 1.1 탆. However, the present invention is not limited thereto.

The first electrode 151 may be disposed on the first conductive semiconductor layer 141. The first electrode 151 may be electrically connected to the first conductive semiconductor layer 141.

The first electrode 151 may be disposed on a portion of the upper surface of the first conductive semiconductor layer 141 where the mesa etching is performed. Accordingly, the first electrode 151 may be disposed below the second electrode 152 disposed on the upper surface of the second conductive type semiconductor layer 143.

Insulating layer 2-2 direction (Y ₂ axis direction) with the edge of the second electrode 152 is smallest width (W ₂₎ with the second-second direction (Y ₂ axis direction) between the 160 to 2.5㎛ Lt; / RTI > Similarly, the shortest width W _{6 in the second-1} direction (Y ₁ -axis direction) between the edge and the first electrode 151 in the second-1 direction (Y ₁ -axis direction) of the insulating layer 160 is 2.5 μm Lt; / RTI > However, the present invention is not limited to such a length.

The first electrode 151 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide ZnO, ZnO, IrOx, AlGaO, AlGaO, AZO, ATO, GZO, IZO, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, or Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Sn, In, Ru, , Au, and Hf, but is not limited to these materials.

The first electrode 151 may be formed by conventional electrode forming methods such as stuffering, coating, vapor deposition, or the like.

As described above, the second electrode 152 may be disposed on the second-conductivity-type semiconductor layer 143b. The second electrode 152 may be electrically connected to the second-conductivity-type semiconductor layer 143b.

The second electrode 152 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide ZnO, ZnO, IrOx, AlGaO, AlGaO, AZO, ATO, GZO, IZO, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, or Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Sn, In, Ru, , Au, and Hf, but is not limited to these materials.

The second electrode 152 may be formed by conventional electrode forming methods such as stuffering, coating, vapor deposition, or the like.

In addition, the first electrode 151 may be wider in the second direction (Y-axis direction) than the second electrode 152. However, the present invention is not limited to such a length.

The insulating layer 160 may cover the sacrificial layer 120, the bonding layer 130, and the semiconductor structure 140. The insulating layer 160 may cover the side surfaces of the sacrificial layer 120 and the side surfaces of the coupling layer 130. The insulating layer 160 may cover a part of the upper surface of the first electrode 151. With this structure, the first electrode 151 is electrically connected to the electrode or the pad through the exposed upper surface, and current can be injected. Likewise, the second electrode 152 may include an exposed top surface as well as the first electrode 151. The insulating layer 160 covers the coupling layer 130 and the sacrificial layer 120 so that the sacrificial layer 120 and the coupling layer 130 may not be exposed to the outside.

The insulating layer 160 may cover a part of the upper surface of the first electrode 151. In addition, the insulating layer 160 may cover a part of the upper surface of the second electrode 152. A portion of the upper surface of the first electrode 151 may be exposed. A portion of the upper surface of the second electrode 152 may be exposed.

The upper surface of the exposed first electrode 151 and the exposed upper surface of the second electrode 152 may be circular, but are not limited thereto. The distance W ₄ in the second direction (Y-axis direction) between the center of the upper surface of the exposed first electrode 151 and the center of the upper surface of the second electrode 152 may be 20 μm to 30 μm. Here, the center point refers to a point bisecting the width of each of the first electrode exposed in the second direction (Y-axis direction) and the exposed second electrode.

Center point and the second-first axial direction of the exposed first electrode (151) (Y _1-axis direction) to the maximum width to the second-first-axis direction (Y-axis _{direction. 1)} between the edge of the first electrode (151) (W ₅ ) may be 5.5 [mu] m to 7.5 [mu] m. At the center of the exposed first electrode 152 and the second-second axis direction (Y-axis direction, ₂₎ the maximum width to the second-second axis direction (Y-axis _{direction. 2)} between the edge of the second electrode 152 (W ₆ ) may be 5.5 탆 to 7.5 탆. However, the present invention is not limited to such a length.

The insulating layer 160 may electrically isolate the first conductive semiconductor layer 141 and the second conductive semiconductor layer 143 from the semiconductor structure 140. The insulating layer 160 may be formed of at least one selected from the group consisting of SiO ₂ , SixOy, Si ₃ N ₄ , Si _x N _y , SiO _x N _y , Al ₂ O ₃ , TiO ₂ , AlN, But is not limited thereto.

9 is a conceptual diagram of a display device to which a semiconductor device according to the embodiment is transferred.

9, a display device including a semiconductor device according to an embodiment of the present invention includes a second panel substrate 410, a driving thin film transistor T2, a planarization layer 430, a common electrode CE, a pixel electrode AE, Semiconductor devices.

The driving thin film transistor T2 includes a gate electrode GE, a semiconductor layer SCL, an ohmic contact layer OCL, a source electrode SE, and a drain electrode DE.

The driving thin film transistor is a driving element and can be electrically connected to the semiconductor element to drive the semiconductor element.

The gate electrode GE may be formed together with the gate line. The gate electrode GE may be covered with the gate insulating layer 440.

The gate insulating layer 440 may be formed of a single layer or a plurality of layers made of an inorganic material, and may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or the like.

The semiconductor layer SCL may be arranged in a predetermined pattern (or island) on the gate insulating layer 440 so as to overlap with the gate electrode GE. The semiconductor layer SCL may be formed of a semiconductor material composed of any one of amorphous silicon, polycrystalline silicon, oxide, and organic material, but is not limited thereto.

The ohmic contact layer OCL may be disposed on the semiconductor layer SCL in a predetermined pattern or island shape. The ohmic contact layer PCL may be for ohmic contact between the semiconductor layer SCL and the source / drain electrodes SE and DE.

The source electrode SE is formed on the other side of the ohmic contact layer OCL so as to overlap with one side of the semiconductor layer SCL.

The drain electrode DE may be formed on the other side of the ohmic contact layer OCL so as to be spaced apart from the source electrode SE while overlapping with the other side of the semiconductor layer SCL. The drain electrode DE may be formed together with the source electrode SE.

The planarizing film may be disposed on the entire surface of the second panel substrate 410. The driving thin film transistor T2 may be disposed inside the planarizing film. The planarizing film according to one example may include, but is not limited to, an organic material such as benzocyclobutene or photo acryl.

The groove 450 is a predetermined light emitting region, and semiconductor elements may be disposed. Here, the light emitting region may be defined as a region other than the circuit region in the display apparatus.

The grooves 450 may be recessed in the planarization layer 430, but are not limited thereto.

The semiconductor device may be disposed in the groove 450. The first and second electrodes of the semiconductor device may be connected to a circuit (not shown) of the display device.

The semiconductor device may be bonded to the groove 450 through the adhesive layer 420. Here, the adhesive layer 420 may be the second bonding layer, but is not limited thereto.

The second electrode 152 of the semiconductor device may be electrically connected to the source electrode SE of the driving TFT T2 through the pixel electrode AE. And the first electrode 151 of the semiconductor device may be connected to the common power line CL through the common electrode CE.

The first and second electrodes 151 and 152 may be separated from each other and the electrode 151 at a relatively low position among the first and second electrodes 151 and 152 may be the same as the upper surface of the planarization layer 430 It can be placed on a horizontal line. However, the present invention is not limited thereto.

The pixel electrode AE may electrically connect the source electrode SE of the driving TFT T2 with the second electrode of the semiconductor device.

The common electrode CE may electrically connect the common power supply line CL and the first electrode of the semiconductor device.

The pixel electrode AE and the common electrode CE may each include a transparent conductive material. The transparent conductive material may include, but is not limited to, ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

A display device according to an embodiment of the present invention may include a standard definition (SD) resolution (760x480), a high definition (HD) resolution (1180x720), a full HD (FHD) resolution (1920x1080) (Ultra HD) resolution (3480 × 2160) or a UHD or higher resolution (eg, 4K (K = 1000), 8K, etc.). At this time, the semiconductor devices according to the embodiments may be arranged and connected in plural to the resolution.

Also, the display device may be a display board having a diagonal size of 100 inches or more or a TV, and the pixel may be implemented by a light emitting diode (LED). Therefore, power consumption can be reduced, can be provided with a long lifetime at a low maintenance cost, and can be provided as a self-luminous display with high brightness.

The embodiment has advantages of color purity and color reproduction because it realizes images and images using semiconductor devices.

The embodiment realizes images and images using a light emitting device package excellent in linearity, and thus a large display device of 100 inches or more can be realized.

The embodiment can realize a large-sized display device of 100 inches or more with high resolution at low cost.

The semiconductor device according to the embodiment may further include an optical member such as a light guide plate, a prism sheet, and a diffusion sheet to function as a backlight unit. Further, the semiconductor device of the embodiment can be further applied to a display device, a lighting device, and a pointing device.

At this time, the display device may include a bottom cover, a reflector, a light emitting module, a light guide plate, an optical sheet, a display panel, an image signal output circuit, and a color filter. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit.

The reflector is disposed on the bottom cover, and the light emitting module emits light. The light guide plate is disposed in front of the reflection plate to guide light emitted from the light emitting module forward, and the optical sheet includes a prism sheet or the like and is disposed in front of the light guide plate. The display panel is disposed in front of the optical sheet, and the image signal output circuit supplies an image signal to the display panel, and the color filter is disposed in front of the display panel.

The illumination device may include a light source module including a substrate and semiconductor elements of the embodiment, a heat dissipation unit for dissipating heat of the light source module, and a power supply unit for processing or converting an electrical signal provided from the outside to provide the light source module . Further, the lighting device may include a lamp, a head lamp, or a street lamp or the like.

Further, the camera flash of the mobile terminal may include a light source module including the semiconductor device of the embodiment.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (20)

Board;
A plurality of semiconductor structures disposed on the substrate; And
And an insulating layer disposed on the plurality of semiconductor structures,
Wherein the substrate comprises a groove disposed between the plurality of semiconductor structures,
Wherein the insulating layer comprises a first insulating layer disposed on the plurality of semiconductor structures and a second insulating layer disposed in the groove,
And the first insulating layer and the second insulating layer are connected to each other.
The method according to claim 1,
The semiconductor structure may include:
A first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.
3. The method of claim 2,
A first electrode electrically connected to the first conductive semiconductor layer through the first insulating layer; And
And a second electrode electrically connected to the second conductive type semiconductor layer through the first insulating layer.
The method of claim 3,
An upper surface of the semiconductor structure includes a first upper surface on which the first electrode is disposed, a second upper surface on which the second electrode is disposed, and an inclined surface disposed between the first upper surface and the second upper surface, ,
Wherein a difference between a height from the bottom surface of the semiconductor structure to the second top surface and a height from the bottom surface of the semiconductor structure to the first top surface is greater than zero and less than 2 占 퐉.
5. The method of claim 4,
Wherein the first angle formed by the inclined plane with the horizontal plane is smaller than the second angle formed between the side surface of the semiconductor structure and the horizontal plane.
6. The method of claim 5,
Wherein the first angle is 20 DEG to 50 DEG and the second angle is 70 DEG to 90 DEG.
The method according to claim 1,
Wherein the semiconductor structure has planar long side and short side,
Wherein the long side surface is smaller than 100 mu m.
5. The method of claim 4,
Wherein a width of the inclined surface is narrower from the first upper surface to the second upper surface.
3. The method of claim 2,
Wherein the semiconductor structure includes a sacrificial layer disposed between the first conductive type semiconductor layer and the substrate.
10. The method of claim 9,
Wherein the semiconductor structure includes a bonding layer disposed between the first conductive type semiconductor layer and the sacrificial layer.
Forming a layer of semiconductor structure on a first substrate;
Cutting the semiconductor structure layer into a plurality of semiconductor structures; And
Forming an insulating layer on the plurality of semiconductor structures,
Wherein the cutting step comprises:
And forming grooves on the first substrate at the time of cutting the semiconductor structure layer.
12. The method of claim 11,
Wherein forming the semiconductor structure layer comprises:
Forming a sacrificial layer on the first substrate; And
And forming the semiconductor structure layer on the sacrificial layer.
13. The method of claim 12,
Wherein forming the insulating layer comprises:
Wherein the insulating layer is formed in the plurality of semiconductor structures and the grooves.
13. The method of claim 12,
After the step of forming the insulating layer,
And selectively separating the plurality of semiconductor structures.
15. The method of claim 14,
And irradiating a laser to the rear surface of the first substrate to selectively separate the semiconductor structure.
16. The method of claim 15,
Wherein the sacrificial layer is separated by absorbing the laser.
12. The method of claim 11,
The semiconductor structure
A first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.
18. The method of claim 17,
Wherein the active layer emits light in a red wavelength range.
12. The method of claim 11,
Wherein the side walls of the grooves have the same inclination angle as the side surfaces of the plurality of semiconductor structures.
18. The method of claim 17,
Between forming the semiconductor structure layer and cutting,
Forming a step in the semiconductor structure layer,
Wherein the step of forming the step includes exposing the first conductivity type semiconductor layer by etching the semiconductor structure layer at regular intervals.

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