KR20190040794A - Method of attaching mask to frame - Google Patents

Abstract

The present invention relates to a method of attaching a mask to a frame. According to the present invention, the method of attaching a mask to a frame is characterized in that tensile force (F1-F4) is applied to at least both sides of a mask (100) on which a plurality of mask patterns (P) are formed, and at least a part of the edge of the mask (100) is attached to a frame (200) having a plurality of mask cell (C) regions, while the tensile force (F1-F4) applied to respective sides of the mask (100) does not exceed 4 N. Therefore, an objective of the present invention is to prevent deformation such as warping or twisting of the mask.

Description

METHOD OF ATTACHING MASK TO FRAME < RTI ID = 0.0 >

The present invention relates to a method of attaching a mask to a frame. More particularly, the present invention relates to a method of attaching a mask to a frame in which a frame and a mask are integrally formed, and the alignment between the masks can be clarified.

Recently, electroforming methods have been studied in the manufacture of thin plates. In the electroplating method, an anode body and a cathode body are immersed in an electrolytic solution, and a power source is applied to electrodeposit a metal thin plate on the surface of the cathode body, so that an ultra thin plate can be manufactured and mass production can be expected.

On the other hand, FMM (Fine Metal Mask) method for depositing an organic material at a desired position by bringing a thin film metal mask (Shadow Mask) into close contact with a substrate is mainly used as a technique of forming a pixel in an OLED manufacturing process.

In a conventional OLED manufacturing process, a mask is formed in a stick shape or a plate shape, and then a mask is welded and fixed to an OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, several masks can be fixed to the OLED pixel deposition frame for the manufacture of a large area OLED. In the process of fixing to the frame, each mask is stretched so as to be flat. Adjusting the tensile force so that the entire portion of the mask is flat is a very difficult task. Particularly, in order to align a mask pattern having a size of several to several tens of micrometers while flattening each of the cells, it is necessary to perform a high level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask do.

Nevertheless, there has been a problem in that, in fixing the plurality of masks to one frame, alignment between the masks and between the mask cells is not good. Further, in the process of welding and fixing the mask to the frame, there is a problem that the thickness of the mask film is too thin and the mask is warped due to the load.

In the case of ultra-high quality OLED, QHD image quality is 500 ~ 600 PPI (pixel per inch), pixel size is about 30 ~ 50㎛, 4K UHD and 8K UHD high image quality are higher ~ 860 PPI, ~ 1600 PPI Resolution. Considering the pixel size of the ultra-high-resolution OLED, the alignment error between each cell must be reduced to about several micrometers, and the deviation from the OLED can lead to a product failure, resulting in a very low yield. Therefore, it is necessary to develop techniques for preventing deformation such as masking and twisting, clarifying alignment, fixing the mask to the frame, and the like.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of attaching a mask to a frame such that the mask and the frame form an integral structure.

It is also an object of the present invention to provide a method of attaching a mask to a frame which can prevent the deformation such as warping or twisting of the mask and clarify the alignment.

It is another object of the present invention to provide a method of attaching a mask to a frame capable of remarkably reducing the production time and significantly increasing the yield.

It is an object of the present invention to provide a method of attaching a mask to a frame by applying a tensile force to at least both sides of a mask having a plurality of mask patterns and attaching at least a part of the rim of the mask to a frame having a plurality of mask cell regions , But the tensile force applied to each side of the mask does not exceed 4N.

The mask can be stretched to correspond to one mask cell region.

The mask may include one mask cell.

The tensile force applied to each side of the mask including one mask cell can be reduced to 1 / N more than in the case of the mask including N (N is 2 or more) mask cells.

The frame includes a frame frame part; And at least one first grid frame portion extending in the first direction and having both ends connected to the frame frame portion.

The frame may further include at least one second grid frame portion extending in a second direction perpendicular to the first direction and intersecting the first grid frame portion and having both ends connected to the frame frame portion.

The frame may have a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.

One edge of each of the two masks can be attached to the upper surface of one first grid frame portion.

A mask pattern portion formed with a plurality of mask patterns, and a dummy portion around the mask pattern portion, and at least a part of the dummy portion can be attached to the frame.

A plurality of masks can be sequentially attached to the subsequent frame corresponding to each mask cell area.

The mask may be attached so as to correspond to at least one mask cell region of the frame.

At least a part of the rim of the mask can be welded and attached to the frame.

The pixel position accuracy (PPA) between the mask attached to one mask cell region and the mask attached to the neighboring mask cell region may not exceed 3 탆.

The mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

According to the present invention configured as described above, there is an effect that the mask and the frame form an integral structure.

Further, according to the present invention, it is possible to prevent deformation such as warping or twisting of the mask and to make alignment clear.

Further, according to the present invention, the production time can be remarkably reduced and the yield can be remarkably increased.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of attaching a conventional mask to a frame.
FIG. 3 is a schematic view showing an alignment error between cells in a process of stretching a conventional mask. FIG.
4 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic view showing a mode of applying a tensile force to a mask according to an embodiment of the present invention.
FIG. 7 is a schematic view showing a process corresponding to a cell region of a frame according to an embodiment of the present invention. FIG.
8 is a schematic view showing a process of attaching a mask to a frame according to an embodiment of the present invention.
FIG. 9 is a partially enlarged cross-sectional view showing a form in which a mask according to an embodiment of the present invention is attached to a frame.
10 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

1 is a schematic view showing a conventional OLED pixel deposition mask 10;

Referring to FIG. 1, the conventional mask 10 may be made of a stick-type or a plate-type. The mask 10 shown in Fig. 1 (a) is a stick-shaped mask, and both sides of the stick can be welded and fixed to the OLED pixel deposition frame. The mask 100 shown in FIG. 1 (b) is a plate-type mask and can be used in a pixel forming process with a large area.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smart phone. In the cell C, a pixel pattern P is formed so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. For example, a pixel pattern P is formed in the cell C so as to have a resolution of 70 X 140. That is, a large number of pixel patterns P constitute one cell C in a cluster, and a plurality of cells C can be formed in the mask 10. [

2 is a schematic view showing a process of attaching the conventional mask 10 to the frame 20. Fig. FIG. 3 is a schematic view showing that an alignment error occurs between cells in a process of stretching (F1 to F2) a conventional mask 10. The stick mask 10 having the five cells (C: C1 to C5) shown in FIG. 1 (a) will be described as an example.

Referring to Fig. 2 (a), first, the mask 10 should be flattened. Tensile force F1 to F2 is applied in the longitudinal direction of the mask 10, and the mask 10 is stretched according to the pulling. In this state, the mask 10 is loaded on the frame 20 in a rectangular frame shape. The cells C 1 to C 5 of the mask 10 are located in the hollow space portion of the frame 20. The frame 20 may be of a size such that the cells C1 to C5 of one mask 10 are located in the hollow space inside the frame and the cells C1 to C5 of the plurality of masks 10 Area. ≪ / RTI >

Referring to FIG. 2B, the mask 10 is aligned while finely adjusting the tensile force F1 to F2 applied to each side of the mask 10, and then a portion of the side of the mask 10 is welded (W) (10) and the frame (20). Fig. 2 (c) shows a cross-sectional side view of the frame 10 and the interconnected mask 10.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to the respective sides of the mask 10 are finely adjusted, there arises a problem that alignment between the mask cells C1 to C3 is not performed well. For example, the distances D1 to D1 ", D2 to D2 " between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The mask 10 is large in size including a plurality (for example, five) of cells C1 to C5, and has a very thin thickness on the order of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment state in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each cell.

Therefore, a minute error of the tensile forces F1 to F4 can cause an error in the extent to which each cell C1 to C3 of the mask 10 stretches or spreads, D1 ", D2 to D2 ") are different from each other. Of course, it is difficult to arrange the mask pattern P so that the error is completely zero. However, in order to prevent the mask pattern P having a size of several to several tens of micrometers from adversely affecting the pixel process of the ultra high definition OLED, . The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition to this, a plurality of masks 10 of about 6 to 20 are connected to each of the frames 20, and a plurality of cells C to C5 of the mask 10, It is also a very difficult task to clarify the alignment state between the substrates, and the process time due to alignment is inevitably increased, which is a significant reason for reducing the productivity.

Accordingly, the present invention is applicable to a mask which is capable of preventing deformation such as warping or twisting of the mask 100 and clarifying alignment in the frame 200, remarkably reducing the manufacturing time, and significantly increasing the yield .

FIG. 4 is a front view (FIG. 4A) and a side sectional view (FIG. 4B) showing a frame-integrated mask according to an embodiment of the present invention. 5 is a front view (FIG. 5A) and a side sectional view (FIG. 5B) showing a frame 200 according to an embodiment of the present invention. FIG. 4B is a side sectional view taken along the line A-A 'of FIG. 4, and FIG. 5B is a side sectional view taken along the line B-B' of FIG. 5A.

Referring to FIGS. 4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200 one by one.

A plurality of mask patterns P are formed in each of the masks 100, and one cell C may be formed in one of the masks 100. The mask 100 can be formed by electroforming so as to be formed into a thin thickness. The mask 100 may be a super invar material having a thermal expansion coefficient of about 1.0 X 10 < ^-6 > / DEG C and an invar, about 1.0 X 10 < ^-7 > / DEG C. Since the mask 100 of this material has a very low thermal expansion coefficient, there is little possibility that the pattern shape of the mask is deformed by heat energy, and thus it can be used as FMM (Fine Metal Mask) and shadow mask in manufacturing high resolution OLED. In consideration of the development of techniques for performing the pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 may be formed of nickel (Ni), nickel-cobalt ) Or the like.

The frame 200 may include a frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The frame 200 may be made of a metal such as invar, super invar, aluminum, titanium, or the like, and may be made of a material such as Invar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as that of the mask .

The frame 200 may include at least one first grid frame portion 220 extending in a first direction (transverse direction). The first grid frame part 220 may be formed in a straight line shape, and both ends may be connected to the frame part 210. When the frame 200 includes a plurality of first grid frame portions 220, it is preferable that each of the first grid frame portions 220 is equally spaced. In other words, each of the first grid frame portions 220 may be disposed at equal intervals and interleaved in the hollow portion of the frame frame portion 210. The first and second grid frame parts 220 and 220 are formed so as to correspond to the corner parts (upper and lower edges) of the frame part 210 parallel to the first grid frame part 220, And the first grid frame portions 220 adjacent to the first grid frame portions 220 may be the same.

In addition, the frame 200 may include at least one second grid frame portion 230 extending in a second direction (longitudinal direction). The second grid frame part 230 may be formed in a straight line shape, and both ends may be connected to the frame part 210. When the frame 200 includes a plurality of second grid frame portions 230, it is preferable that the respective second grid frame portions 230 are equally spaced. In other words, each of the second grid frame portions 230 may be disposed at equal intervals and interleaved in the hollow portion of the frame frame portion 210. The second grid frame part 230 contacting the edge part (left / right corner) of the frame part 210 parallel to the second grid frame part 230 and the second grid frame part 230 facing the edge part, And the second grid frame portions 230 adjacent to the second grid frame portions 230 may be the same.

The spacing between the first grid frame units 220 and the spacing between the second grid frame units 230 may be the same or different depending on the size of the mask cell C. [

The shape of the cross section perpendicular to the longitudinal direction of the first and second grid frame portions 220 and 230 may be a triangle 220a or a quadrangle 200b such as a parallelogram (FIGS. 4B and 9B) (see Figs. (a) and (b)], and corner portions may be rounded to some extent.

Since the first grid frame unit 220 and the second grid frame unit 230 are perpendicular to each other, there may exist crossing points that intersect with each other.

For example, the first and second grid frame portions 220 and 230 may have predetermined grooves formed therein, and intersections may be formed as the grooves are inserted and connected to each other. Alternatively, the first and second grid frame portions 220 and 230 may be welded to each other to form an intersection point. Alternatively, the frame frame portion 210, the first and second grid frame portions 220 and 230 may be formed by processing the inside of the panel material. In addition to this, the frame 200 shown in Fig. 5 can be manufactured by using a known technique without limitation.

The thickness T1 of the frame part 210 may be greater than the thickness T2 of the first grid frame part 220. [ The thickness T2 of the second grid frame portion 230 is also the same. The frame part 210 may be formed to have a thickness ranging from several millimeters to several centimeters because it is responsible for the overall rigidity of the frame 200. In the case of the first and second grid frame portions 220 and 230, if the thickness T2 becomes too thick, the organic material source 600 (see FIG. 12) It can cause problems. On the other hand, if the thickness T2 is too small, it may be difficult to secure the rigidity enough to support the mask 100. [ Accordingly, the first and second grid frame units 220 and 230 may have a width and a thickness of about 1 to 5 mm.

The frame unit 200 may include a plurality of mask cells C regions by combining the frame unit 210 and the first and second grid frame units 220 and 230. The mask cell C area means a blank hollow area except for the area occupied by the frame frame part 210 and the first and second grid frame parts 220 and 230 in the frame part 200 . That is, the first grid frame part 220 and the second grid frame part 230 intersect with each other to form a mask cell C region like a checkerboard in the hollow part of the frame frame part 210

As shown in Fig. 4, as the cell C of the mask 100 is associated with this mask cell C region, it can be used as a path through which the pixels of the OLED are substantially deposited through the mask pattern P . As described above, one mask cell C corresponds to one display such as a smart phone. That is, mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, although one mask 100 may have a plurality of cells C, it is necessary to avoid the large-area mask 100 for the clear alignment of the mask 100, The small-area mask 100 is preferable.

The frame 200 has a plurality of mask cell C regions, and each of the masks 100 may be attached so as to correspond to one mask cell C, respectively. Each of the masks 100 includes a mask pattern portion MR (see FIG. 6, corresponding to the cell C) formed with a plurality of mask patterns P and a dummy portion DR around the mask pattern portion (Corresponding to the portion of the mask film 110 excluding the cell C). The dummy portion DR may include only the mask layer 110 or may include a mask layer 110 having a predetermined dummy pattern in a shape similar to the mask pattern P. [ The mask pattern portion MR corresponds to the mask cell C region of the frame 200 and a part or all of the dummy portion DR can be attached to the frame 200. [ As a result, the mask 100 and the frame 200 can have an integrated structure.

Hereinafter, a process for manufacturing a frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 can be provided. The frame 200 can be manufactured by connecting the first grid frame part 220 to the frame part 210. The second grid frame unit 230 may further be connected to intersect the first grid frame unit 220 to further form a mask cell (C) area. In the present specification, four first and second grid frame portions 220 and 230 are connected to the frame portion 210 to form a 5 × 5 mask cell region.

Next, a plurality of masks 100 on which a plurality of mask patterns P are formed can be provided. It has been described that a mask 100 of Invar or Super Invar can be manufactured by the electroplating method and one cell C can be formed in the mask 100. [ The width of the mask pattern P may be less than 40 占 퐉, and the thickness of the mask 100 may be about 2 to 50 占 퐉. Since the frame 200 includes a plurality of mask cells C regions, a plurality of masks 100 corresponding to the respective mask cells C can be provided as many as the number of cells C in the mask.

6 is a schematic view showing a tensile form of the mask 100 according to an embodiment of the present invention. FIG. 7 is a schematic view showing a process in which a mask 100 according to an embodiment of the present invention corresponds to a cell C region of a frame 200.

Next, referring to FIGS. 6 and 7, the mask 100 may correspond to one mask cell (C) region of the frame 200. FIG. 6, both sides (two sides) of the mask 100 are stretched (F1 to F2) along the uniaxial direction of the mask 100 so that the mask 100 is flattened and flattened to the mask cell C ) Area. It is possible to grasp the mask 100 at one point and hold it at several points (e.g., 1 to 3 points in Fig. 6). On the other hand, all sides of the mask may be stretched (F1 to F4) along all the axial directions, not the uniaxial direction.

At this time, the tensile forces F1 to F4 applied to the respective sides of the mask 100 may not exceed 4N. The tensile force F1 to F4 applied depending on the size of the mask 100 can be varied. The mask 100 is attached to the frame 200 even after the mask 100 is attached to the frame 200 after the mask 100 is stretched because the force of 1 N is smaller than the force of gravity of 400 g, The tension applied to the mask 100 by the frame 200 is very small. Thus, the deformation of the mask 100 and / or the frame 200 by the tension can be minimized, and the misalignment of the mask 100 (or the mask pattern P) can be minimized.

2, for example, in the case of a conventional large-area mask 10, that is, a mask 10 including five (C1 to C5) or more mask cells C, A large tensile force F1 to F2 in the major axis direction is required in order to flatten the whole to correspond to the frame 20. The stick type mask 10 including five cells (C1 to C5) requires a tensile force of about 4 to 10 N. After attaching the mask 10 to the frame 20 ), and (c)), tensile force is applied to the frame 20, so that the possibility of deformation of the frame 20 due to the tension increases, and the alignment error increases.

On the other hand, even if the mask 100 including one cell C of the present invention is made of the same material as the mask 10 of Fig. 2, the required tensile forces F1 to F2 or F1 to F4 are significantly reduced do. The mask 100 including one cell C of the present invention is more preferable than the case of the mask 10 including N (N is 2 or more) mask cells C (see FIG. 2, N = 5) (F1 to F2 or F1 to F4) applied to each side can be reduced to 1 / N. For example, the mask 100 including one cell C may have tensile forces F1 to F2, or F1 to F4, which are necessary for the mask 10 of FIG. 2 including five cells (C1 to C5) ) Is reduced to 1/5. That is, the mask 100 can be attached to the frame 200 after the tensile force F1 to F4 of about 0.8 to 2.5 N is applied to the mask 100 / frame 200, So that the possibility of deformation of the mask 100 / frame 200 is minimized and the alignment error can be minimized.

The conventional mask 10 of FIG. 2 has a long length since it includes five cells (C1 to C5), whereas the mask 100 of the present invention includes one cell (C) So that the degree to which the pixel position accuracy (PPA) is distorted can be reduced. For example, assuming that the length of a mask 10 including a plurality of cells (C1 to C5, ...) is 1 m and a PPA error of 10 m is generated in all 1 m, Can be 1 / n of the upper error range according to the reduction of the relative length (corresponding to the reduction in the number of cells (C)). If the length of the mask 100 according to the present invention is 100 mm, the length of the conventional mask 10 is reduced from 1 m to 1/10, so that a PPA error of 1 μm is generated over the entire length of 100 mm, There is an effect that remarkably decreases.

On the other hand, if the mask 100 includes a plurality of cells C and the alignment error is minimized even if the cells C correspond to the regions of the frame 200, And may correspond to a plurality of mask cell (C) regions of the mask cell (200). Also in this case, it is preferable that the mask 100 has as few cells C as possible in consideration of process time and productivity.

It is possible to confirm the alignment state in real time through the microscope while adjusting the tensile forces F1 to F4 so as to correspond to the mask cell C region in a state where the mask 100 is flat. In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously match a plurality of cells (C: C1 to C5) The manufacturing time can be remarkably reduced as compared with the conventional method (see Fig. 2).

That is, in the method of manufacturing a frame-integrated mask according to the present invention, five cells (C1 to C5) are fabricated through five processes of associating five masks (100) to one cell (C) The time can be shortened compared with the conventional method of simultaneously matching and simultaneously confirming the alignment state of the five cells (C1 to C5).

The method of manufacturing a frame-integrated mask of the present invention is characterized in that the product yield in the 25th step of aligning and aligning 25 masks (100) to 25 cell areas (C) May be much higher than the conventional product yield rate in the fifth step of aligning and aligning the five masks 10 (see FIG. 2A) each containing 25 cells (C). The conventional method of aligning five cells (C1 to C5) in five cell regions (C) at a time is a much more cumbersome and difficult task, resulting in a lower product yield.

On the other hand, after the mask 100 corresponds to the frame 200, the mask 100 may be temporarily fixed to the frame 200 through a predetermined adhesive. Thereafter, the welding (W) step to be described later can be performed.

8 is a schematic view showing a process of attaching the mask 100 to the frame 200 according to an embodiment of the present invention. FIG. 9 is a cross-sectional view taken along the line C-C 'of FIG. 8, and is a partially enlarged cross-sectional view showing a state in which the mask 100 is attached to the frame 200.

Next, referring to FIG. 8, a part or all of the rim of the mask 100 may be attached to the frame 200. Attachment may be performed with a weld (W), and preferably with a laser weld (W). The welded portion may be integrally connected with the same material as the mask 100 / frame 200. 9 shows that the thickness and the width of the welded portion are slightly exaggerated for convenience of explanation. In fact, the portion of the welded portion W is hardly protruded, 200).

A portion of the mask 100 may be melted and welded (W) to the frame 200 by irradiating the laser onto the rim portion (or the dummy portion) of the mask 100. The welding W must be performed as close as possible to the edge of the frame 200 to minimize the hysterical space between the mask 100 and the frame 200 and increase the adhesion. The welded portion W may be formed in the form of a line or a spot and may be a medium for integrally connecting the mask 100 and the frame 200 with the same material as the mask 100 .

9, two adjacent masks 100a and 100b are attached (W) on the upper surface of the first grid frame part 220 (or the second grid frame part 230) . The width and thickness of the first grid frame part 220 (or the second grid frame part 230) may be about 1 to 5 mm. In order to improve the productivity of the first grid frame part 220, (Or the second grid frame portion 230) and the edges of the masks 100a and 100b should be reduced to about 0.1 to 2.5 mm as much as possible.

The shape of the cross section perpendicular to the longitudinal direction of the first and second grid frame portions 220 and 230 may be a triangle 200a. However, in order to better support the load and tensile force of the mask 100, (E.g., the parallelogram 200b), and the sides and edges may be partially rounded.

When the mask 100 is attached to the frame 200, the mask 100 is attached to the frame 200 (or the frame frame portion 210, the first and second grid frame portions 220 and 230) (F 1 to F 2 or F 1 to F 4) in the direction of the arrow F direction. Thus, the mask 100 stretched tightly toward the frame 200 is temporarily attached to the frame 200. In this state, when the laser welding W is performed, the mask 100 can be welded (W) to the upper portion of the frame 200 while receiving the tensile forces F1 to F4 to the outside. Therefore, it is possible to maintain the state that the mask 100 is pulled toward the frame 200 side tightly without being torn or warped by the load.

On the other hand, when the adhesive agent is used, a step of cleaning the adhesive agent after the welding (W) process of the mask 100 and the frame 200 may be further performed.

Next, when the process of attaching one mask 100 to the frame 200 is completed, the remaining masks 100 are sequentially associated with the remaining mask cells C, and the process of attaching the remaining masks 100 to the frame 200 is repeated can do. Since the mask 100 already attached to the frame 200 can present the reference position, the time in the process of sequentially matching the remaining masks 100 to the cell C and confirming the alignment state is remarkably reduced There is an advantage to be able to. In addition, since the PPA (pixel position accuracy) between the mask 100a attached to one mask cell region and the mask 100b attached to the adjacent mask cell region does not exceed 3 mu m, There is an advantage that a mask for forming an OLED pixel can be provided.

10 is a schematic view showing an OLED pixel deposition apparatus 1000 using a frame-integrated mask 100, 200 according to an embodiment of the present invention.

10, an OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 (Not shown).

A target substrate 900 such as a glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source evaporator 500. Integrated masks 100, 200 [or FMM] for depositing the organic source 600 on a pixel-by-pixel basis may be closely attached to the target substrate 900 or may be disposed in close proximity to each other. The magnet 310 generates a magnetic field and can be brought into close contact with the target substrate 900 by a magnetic field.

The deposition source supply part 500 can supply the organic material source 600 through the left and right paths and the organic material sources 600 supplied from the deposition source supply part 500 can supply the pattern P And may be deposited on one side of the target substrate 900. The deposited organic material source 600 that has passed through the pattern P of the frame-integrated mask 100, 200 can act as the pixel 700 of the OLED.

The patterns of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S) in order to prevent uneven deposition of the pixel 700 by a shadow effect . Organic materials 600 passing through the pattern in a diagonal direction along the sloped surface can also contribute to the formation of the pixel 700, so that the pixel 700 can be uniformly deposited in thickness as a whole.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

100: mask
110: mask film
200: frame
210:
220: first grid frame section
230: second grid frame section
1000: OLED pixel deposition apparatus
C: cell, mask cell
F1 to F4: Tensile force
P: mask pattern
W: Welding

Claims (14)

A method of attaching a mask to a frame,
A tensile force is applied to at least both sides of a mask having a plurality of mask patterns and at least a part of the rim of the mask is attached to a frame having a plurality of mask cell regions, Attachment method. The method according to claim 1,
And the mask is stretched to correspond to one mask cell region. The method according to claim 1,
Wherein the mask comprises one mask cell. The method of claim 3,
The tensile force applied to each side of the mask including one mask cell is reduced to 1 / N in the tensile force, as compared with the case of the mask including N (N is 2 or more) mask cells. The method according to claim 1,
The frame,
A frame frame part; And
At least one first grid frame part extending in the first direction and having both ends connected to the frame part,
Wherein the mask is attached to the mask. 6. The method of claim 5,
The frame,
At least one second grid frame portion extending in a second direction perpendicular to the first direction and intersecting the first grid frame portion and having opposite ends connected to the frame portion,
Further comprising the steps of: The method according to claim 6,
Wherein the frame has a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. 6. The method of claim 5,
And attaching one edge of the two masks to the upper surface of one first grid frame portion, respectively. The method according to claim 1,
In the mask,
A mask pattern portion having a plurality of mask patterns formed thereon, and a dummy portion around the mask pattern portion,
Wherein at least a portion of the dummy portion is attached to the frame. The method according to claim 1,
Wherein a plurality of masks are successively attached to a subsequent frame corresponding to each of the mask cell regions. The method according to claim 1,
And attaching the mask so as to correspond to at least one mask cell area of the frame. The method according to claim 1,
Wherein at least a part of the rim of the mask is welded and attached to the frame. The method according to claim 1,
Wherein a pixel position accuracy (PPA) between a mask adhered to one mask cell region and a mask adhered to a neighboring mask cell region does not exceed 3 mu m. The method according to claim 1,
Wherein the mask and the frame are made of any one of invar, super invar, nickel, and nickel-cobalt.

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