KR20180127790A - Thin film coating apparatus for large area optical substrate - Google Patents

Abstract

The present invention relates to a thin film coating apparatus for a large area substrate, capable of depositing a thin film at a uniform thickness while minimizing the size of a coating chamber for thin film deposition of a substrate, such as a large diameter lens. According to the present invention, the thin film coating apparatus for a large area substrate comprises: an idle motor to idle a substrate on the center of the upper part of the coating chamber in order to vacuum-deposit a thin film on the substrate in a coating chamber; a rod mask, which has a cylindrical shape mounted to surround the circumference of a target placed on the lower part of the coating chamber, to adjust a scattering angle of the target; a thickness measurer mounted on one side of the coating chamber out of a scattering angle range of the target to measure the thickness of the thin film deposited on the substrate; an oxygen supplier forming a circular band-shaped body with a plurality of discharge holes formed on the upper circumferential surface of the rod mask and supplying oxygen into the coating chamber by using the inside of the rod mask as a supply passage; a horizontal mask placed on the central part of the upper part of the rod mask, which is the inside of the inner circumferential surface of the oxygen supplier, to adjust a penetration ratio of the target corresponding to the thickness of the thin film deposited on the substrate, which is measured by the thickness measurer; and a shutter mounted between the target and the horizontal mask to be able to be opened/closed so as to prevent scattering of the target.

Description

[0001] The present invention relates to a thin film coating apparatus for a large area substrate,

The present invention relates to a thin film coating apparatus, and more particularly, to a large-area substrate thin film coating apparatus capable of depositing a thin film with uniform thickness while minimizing the size of a coating chamber for thin film deposition of an optical substrate such as a large diameter lens.

1 and 2 are views for explaining the principle of a thin film coating apparatus for depositing a thin film on a substrate according to the related art. In the general thin film coating apparatus, as shown in FIG. 1, C and the surface of the substrate S disposed at the outermost periphery are different from each other, a portion where the thickness of the thin film deposited on the substrate is close to the distance from the target T is thickly deposited as shown in Fig. 2, Are thinly deposited to form a non-uniform thin film as a whole.

As shown in FIG. 2, since the thin film is not uniformly deposited, the spectral characteristics that are very important among the characteristics of the optical lens can not be satisfied due to variations in the thickness of the thin film. In particular, as the thickness of the thin film becomes larger, the deviation of the distance between the target T and the substrate S becomes larger as the size of the substrate becomes larger. Therefore, an error value with respect to the thickness of the thin film becomes larger, There arises a problem that the size of the chamber must be very large.

Therefore, as shown in FIG. 3, in the case of the small-diameter optical substrate, the deviation of the distance between the target T and the substrate S is not so large, and uniform thin film deposition is possible. 3 schematically illustrates the principle of a dome-shaped coating chamber for depositing a uniform thickness of a thin film on a substrate. Generally, the diameter of the coating chamber is about 1300-1500 mm and the diameter of the coatable substrate is 100 mm or less.

However, in the case of a large-area substrate, it is not possible to use the dome type deposition method shown in FIG. 3, which is applicable only to a small-diameter substrate, and a thin film having a uniform thickness can be deposited by the method shown in FIGS. There is no problem.

In general, a coating chamber for depositing a transparent thin film on an optical substrate having a diameter of about 500 mm has a diameter of about 2500-3000 mm, and the thin film is deposited to a uniform thickness through double axis rotation as shown in FIG.

FIG. 4 is a view schematically showing a conventional dual-axis thin film coating apparatus. As shown in FIG. 4, the target 21 is rotated by revolving by the first rotation axis 12 and by rotation by the second rotation axis 14, Is deposited on the substrate 13 as a uniform thin film. However, since it is difficult to obtain the uniformity required for the mirror or multilayer film deposition only by the double axis rotation, the thickness of the thin film deposited to increase the uniformity of the target 21 is measured with the thickness measuring device 15 while the mask 22 And a shutter (shutter) 23 are additionally used, and an oxygen supplier (24, O ₂ Port) is separately used.

4, since the substrate 13 is rotated and revolved by the double axis to deposit the thin film, the thin film is relatively uniformly deposited, while the thin film is relatively uniformly deposited, as compared with the diameter of the coating chamber 10 There is a problem that the substrate can not be deposited.

That is, in order to coat a large-area substrate having a diameter of about 1500 to 2000 mm in the conventional double-shaft coating method shown in FIG. 4, a coating chamber having a theoretical diameter of 4500 to 6000 mm is required, So that it is impossible to coat a large-area substrate of 1000 mm or more in the past.

KR 10-2010-0014598 A (2010.02.10) KR 10-2015-0058860 A (2015.05.29) KR 10-1502816 B1 (2015.03.10)

It is an object of the present invention to solve the above problems and to provide a method of depositing a large-area substrate, which is capable of uniformly depositing a thickness of a thin film without using additional equipment while minimizing the size of a deposition apparatus including a coating chamber, And a substrate thin film coating apparatus.

Another object of the present invention is to provide a large-area substrate thin film coating apparatus capable of depositing a uniform thin film on a large area substrate by simple installation of a mask module while maintaining the structure of a conventional coating chamber.

According to an aspect of the present invention, there is provided a large-area substrate thin film coating apparatus including: an idle motor for idling a substrate in an upper center of a coating chamber for vacuum depositing a thin film on a substrate in a coating chamber; A rod-shaped cylinder mounted to surround a periphery of a target positioned at a lower portion of the coating chamber, the rod-shaped mask adjusting the scattering angle of the target; A thickness gauge mounted on one side of the coating chamber outside the scattering angle range of the target to measure a thickness of the thin film deposited on the substrate; An oxygen supplier for forming a circular band-shaped body having a plurality of discharge holes on an upper circumferential surface of the rod mask and supplying oxygen into the coating chamber using the inside of the rod mask as a supply passage; A horizontal mask positioned at an upper central portion of the rod mask inside the inner circumferential surface of the oxygen supplier for controlling the passage rate of the target in correspondence with the thickness of the thin film deposited on the substrate measured by the thickness measuring device; And a shutter, which is installed between the target and the horizontal mask so as to be openable and closable, to block scattering of the target.

In addition, in the large-area substrate thin film coating apparatus according to the present invention, it is preferable that the rod mask adjusts the scattering angle of the target according to the radius of the substrate by adjusting the height.

Also, in the large-area substrate thin-film coating apparatus according to the present invention, the horizontal mask may have a height from the center of the substrate to a distance from the center to the substrate, It is preferable to use a circular band type multi-mask having a multi-pass ratio depending on the radius.

Also, the large-area substrate thin film coating apparatus according to the present invention is a mask module having the load mask, the horizontal mask, the oxygen supplier, and the shutter integrally, and is detachably attached to the coating chamber, Installation and maintenance can be carried out easily and quickly, thereby greatly reducing the manufacturing cost.

As described above, the present invention can deposit a thin film having a uniform thickness without changing the structure of a conventional coating chamber or increasing the size thereof in order to deposit a thin film on a large area substrate including a general optical substrate, Which is very economical and has a very efficient advantage since it does not incur the additional cost or maintenance cost of changing the structure or increasing the size of the coating chamber.

1 and 2 are views for explaining the principle of a thin film coating apparatus for depositing a thin film on a substrate according to the prior art,
Figure 3 schematically illustrates the principle of a dome-shaped coating chamber for depositing a thin film of uniform thickness on a substrate according to the prior art,
FIG. 4 is an internal structural view of a conventional thin film coating apparatus;
5 is an internal structural view of a large-area substrate thin film coating apparatus according to the present invention,
FIG. 6 is a perspective view of a mask module of the large-area substrate thin film coating apparatus of FIG. 5,
FIG. 7 is a top view of the oxygen supply portion of the mask module of FIG. 6,
8 is a top view of the horizontal mask of the mask module of Fig.

Hereinafter, embodiments of a large-area substrate thin film coating apparatus according to the present invention will be described in detail with reference to the drawings. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS The same features of the Figures represent the same reference symbols wherever possible. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Hereinafter, the attached drawings are exaggerated or simplified in order to facilitate understanding and clarification of the structure and operation of the technology, and it is to be understood that each component does not exactly coincide with the actual size.

The terms first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In addition, when an element is referred to as including an element, it is understood that the element may include other elements, not the other element, unless specifically stated otherwise, and the meaning of the term " Means a unit or module type that processes at least one function or operation, and may be implemented as hardware, software, or a combination of hardware and software.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It is to be understood that the same terms as those defined in the commonly used terms are defined in consideration of the functions of the present invention and are to be construed in accordance with the technical idea of the present invention and the meaning commonly understood or commonly recognized in the technical field And is not to be construed as an ideal or overly formal sense unless expressly defined to the contrary.

FIG. 6 is a perspective view of a mask module of the large-area substrate thin film coating apparatus of FIG. 5, and FIGS. 7 and 8 are cross- And a top view of the supply unit and the horizontal mask, respectively.

5 to 8, the large-area substrate thin-film coating apparatus according to the present invention includes a substrate 101 and a substrate 101. The substrate 101 is rotated at an upper center in a coating chamber 100 for vacuum-depositing a thin film on a bottom surface of the substrate 101 An idle motor 120 and a cylindrical shape that is mounted so as to surround the periphery of the target 104 located under the coating chamber 100 and limits the scattering angle of the target 104 to within the radius of the substrate 101 A thickness measuring device 103 mounted on one side of the coating chamber 100 as a position deviating from the scattering angle range of the target 104 and measuring the thickness of the thin film deposited on the substrate 101, A body 221 of a circular band shape having a plurality of oxygen discharge holes 222 is formed on the upper surface of the rod mask 230 and oxygen is supplied into the coating chamber 100 using the inside of the rod mask 230 as a supply passage. An oxygen supply unit 220 for supplying oxygen to the upper portion of the load mask 210, A horizontal mask 230 for adjusting the passing rate of the target 104 in correspondence to the thickness of the thin film deposited on the substrate 101 measured by the thickness measuring device 103 and a horizontal mask 230 for adjusting the passing rate of the target 104 between the target 104 and the horizontal mask 230 And a shutter 240 mounted so as to be openable and closable to block the scattering of the target 104.

The idle motor 120 may be a motor capable of adjusting the rotation speed of the idle motor 120. The height of the load mask 210 may be adjusted to adjust the scattering angle of the target 104 to correspond to the radius of the substrate 101 So that the height can be adjusted. 8, the horizontal mask corresponds to the distance from the target 104 to the substrate 101. When the distance is long, the pass rate is high. When the distance is short, the horizontal mask has a radius from the center It is preferable to provide a multiple mask of a circular band type having a multiple pass rate.

The rod mask 210 has a different radiation angle for each of the coating materials emitted from the target 104 so that the thickness of the thin film deposited on the central portion and the edge of the substrate 101 varies, It is difficult to deposit a thin film on a substrate. Therefore, the thin film is used as a film for eliminating the deviation of a thin film deposited on the center and edges by applying a vignetting effect.

The horizontal mask 220 shields the unnecessary edge thin film through the load mask 210 and minimizes the thickness of the thin film deposited at the central portion and controls the thickness of the thin film to be maximally deposited at the edge to control the uniformity of the thin film more precisely. .

The oxygen supply unit 230 supplies oxygen (O ₂ ) to the oxide-based material to form an oxide-specific material. In the position of the oxygen supply unit 24 mounted in the conventional coating chamber 10, Since a smooth oxide composition ratio can not be obtained due to the shielding by the electrode 210, oxygen is supplied through the discharge hole 222 located at the upper end of the rod mask 210, so that the oxide- So that the configuration can be made.

When the material is coated in a state where the melting point of each material is different and the outgassing is not sufficiently performed, the thin film is deposited in the form of a bulk material in bulk to adversely affect the density. Since it affects the thin film due to the sprit of the material, it can be preliminarily sufficiently pre-melted and then deposited on the thin film, so that the coating material deposited on the substrate 101 To control the thickness of the substrate.

6, the load mask 210, the horizontal mask 220, the oxygen supplier 230, and the shutter 240 are mounted on the cylindrical load mask 210 as a mask module 200 By being implemented as a single device, it is possible to easily and quickly attach and detach the coating chamber 100 to and from the coating chamber 100, and thus the installation and maintenance of the equipment can be performed easily and quickly, thereby greatly reducing the manufacturing cost.

Since the material to be evaporated for evaporation is different in melting point, size, shape, and surface size, particles that are vaporized in a vacuum and sublimated or vaporized and scattered on the substrate 101 have a cosine distribution as shown in Equation 1 below. I have.

Therefore, the thickness of the deposited thin film becomes thinner toward the outer side than the center thickness, so that the thin film is deposited with a non-uniform thickness.

Accordingly, in the large-area substrate thin film coating apparatus according to the present invention, the load mask 210 and the horizontal mask 220 are used together to uniformly obtain the thicknesses of the center and the outer periphery. In one embodiment, Al ₂ O ₃ and SiO _{2 2} is obtained as shown in Table 1 below and the coating operation is carried out through a combination of these to measure the thickness of the thin film at a distance of 150 mm from the center of the substrate 101 to the outside of the substrate 101, A mask profile was calculated as shown in Table 2 and FIG.

As shown in Table 2 and FIG. 9, the large-area substrate thin film coating apparatus according to the present invention can uniformly deposit a thin film by integrating a load mask and a horizontal mask.

As described above, the large-area substrate thin-film coating apparatus according to the present invention is a large-area substrate thin-film coating apparatus capable of uniformly depositing a thickness of a thin film without using additional equipment while minimizing the size of a deposition apparatus including a coating chamber. And it is possible to deposit a uniform thin film on a large area substrate by simple installation of the mask module while maintaining the structure of the existing coating chamber.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

100: coating chamber 101: substrate
102: Idle motor 103: Thickness measuring device
104: target 200: mask module
210: load mask 220: oxygen supplier
230: horizontal mask 240: shutter

Claims (4)

A thin film coating apparatus for vacuum depositing a thin film on a substrate in a coating chamber,
An idle motor for idling the substrate at an upper center of the coating chamber;
A rod-shaped cylinder mounted to surround a periphery of a target located at a lower portion of the coating chamber, the rod-shaped mask adjusting the scattering angle of the target;
A thickness gauge mounted on one side of the coating chamber outside the scattering angle range of the target to measure a thickness of the thin film deposited on the substrate;
An oxygen supplier for forming a circular band-shaped body having a plurality of discharge holes on an upper circumferential surface of the rod mask and supplying oxygen into the coating chamber using the inside of the rod mask as a supply passage;
A horizontal mask positioned at an upper central portion of the rod mask inside the inner circumferential surface of the oxygen supplier for adjusting the passage rate of the target in correspondence with the thickness of the thin film deposited on the substrate measured by the thickness measuring device; And
And a shutter that is installed between the target and the horizontal mask so as to be openable and closable and blocks scattering of the target.
The apparatus according to claim 1,
Wherein the scattering angle of the target is adjusted in accordance with the radius of the substrate by adjusting the height of the substrate.
The apparatus of claim 1, wherein the horizontal mask comprises:
Wherein the substrate is a circular band mask having a multi-pass ratio according to a radius from the center so as to correspond to a distance from the target to the substrate, a high rate of passage when the distance is long, and a low rate when the distance is short. Device.
The method according to claim 1,
Wherein the mask is integrally provided with the load mask, the horizontal mask, the oxygen supplier, and the shutter, and is detachably attached to the coating chamber.

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