KR20180106191A - Light source module and head lamp having thereof - Google Patents

Abstract

Disclosed are a light source module to compensate a focal position in accordance with a gap between light emitting devices, and a headlamp including the same. According to one embodiment of the present invention, the light source module comprises: a substrate; a resin member having first and second side surfaces disposed on an opposite side to each other, and an upper light exit surface, and disposed on the substrate; and the light emitting device adjacent to the first side surface of the resin member and having a light exit area facing the second side surface. The light exit surface of the resin member comprises: a first area at least partially overlapped with the light emitting device in a vertical direction; a second area recessed towards the substrate between the first area and the second side surface; and a third area disposed between the second area and the second side surface. The first area has a first light extraction structure, the third area has a second light extraction structure, the height of the first area is greater than that of the second and third areas with respect to the upper surface of the substrate, and the second area is more adjacent to a second side surface direction than a straight line perpendicular to the light exit area of the light emitting device. The second area comprises a first reflective surface extended from the first area towards the substrate and a second reflective surface extended from the first reflective surface towards the second side surface. A boundary portion between the first and second reflective surfaces in the second area is higher than the upper surface of the light emitting device, and is spaced apart from the light emitting device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light source module,

An embodiment relates to a light source module having a light emitting element.

An embodiment relates to a headlamp having a light source module.

An embodiment relates to a vehicle lamp having a light source module.

Typical lighting applications include automotive lights as well as backlights for displays and signs.

A light emitting device such as a light emitting diode (LED) has advantages such as low power consumption, semi-permanent lifetime, quick response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Such a light emitting diode is applied to various lighting devices such as various display devices, an interior lamp, and an outdoor.

Generally, a vehicle is equipped with a variety of vehicle lamps having a lighting function and a signal function for notifying other vehicle users or other road users of the traveling state of the vehicle so that an object located in the vicinity of the vehicle can be easily identified at night when traveling .

For example, a headlamp that irradiates light forward to secure a driver's view, a brake that lights when the brake is applied, and a device that operates in a manner of directly emitting light by using a lamp, such as a turn signal used when turning right or left And a reflector functioning in a manner of reflecting light so that the vehicle can be easily recognized from the outside is mounted on the front and rear of the vehicle.

Such automotive lamps generally use light sources such as halogen lamps or high intensity discharge (HID) lamps.

In recent years, lamps employing light emitting diodes as vehicle light sources have been proposed. Compared with an incandescent lamp, a light emitting diode is advantageous in that power consumption is small. However, since the emission angle of light emitted from the light emitting diode is small, there is a demand for increasing the light emission area of the lamp using the light emitting diode when the light emitting diode is used as a vehicle lamp.

Because the size of the light emitting diode is small, it can increase the design freedom of the lamp and it is economical due to the semi-permanent lifetime.

An embodiment provides a light source module having a light emitting element and a lens thereon in a headlamp for a vehicle.

Embodiments provide a light source module that compensates for a focus position according to the distance between light emitting elements with a lens.

Embodiments provide a light source module that compensates for a focus position according to an interval between light emitting devices on opposite sides, with a lens.

Embodiments can improve the light intensity of the light source module and the head lamp having the same.

The embodiment can provide a lamp for a vehicle having a light source module.

A light source module according to an embodiment includes a base portion and a body including a base portion and a support portion protruding from the base portion in a first direction and having first and second recesses in different regions; A first light emitting portion disposed in a first recess of the main body; And a second light emitting portion disposed in a second recess of the main body, wherein the first recess has a first bottom portion, first and second side portions inclined to both sides of the first bottom portion in the first direction, The first recess includes a second bottom, third and fourth sides inclined to both sides of the first bottom in the first direction, And first and second sidewalls on both sides of the first bottom portion in a second direction, the first light emitting portion includes a first circuit substrate on a first bottom portion of the first recess, first and second light emitting portions on the first circuit substrate, And a first lens on the first and second light emitting devices, wherein the second light emitting portion includes a second circuit substrate on a second bottom portion of the second recess, and a third and fourth circuit substrate on the second circuit substrate, And a second lens on the third and fourth light emitting elements, wherein the first and second light emitting elements are arranged such that a thickness of a center region overlapping the first to fourth light emitting elements is smaller than a thickness of the first to fourth light emitting elements Adjacent edges And may include a thickness greater than the thickness of the region.

A headlamp according to an embodiment includes: a housing having a cavity opened in a first direction and having a concave inner surface; A main body on the bottom of the cavity of the housing and a support portion protruding in the first direction from the base portion and having first and second recesses in directions opposite to each other; A first light emitting portion disposed in a first recess of the main body; And a second light emitting portion disposed in a second recess of the main body, wherein the first recess has a first bottom portion, first and second side portions inclined to both sides of the first bottom portion in the first direction, The first recess includes a second bottom, third and fourth sides inclined to both sides of the first bottom in the first direction, And first and second sidewalls on both sides of the first bottom portion in a second direction, the first light emitting portion includes a first circuit substrate on a first bottom portion of the first recess, first and second light emitting portions on the first circuit substrate, And a first lens on the first and second light emitting devices, wherein the second light emitting portion includes a second circuit substrate on a second bottom portion of the second recess, and a third and fourth circuit substrate on the second circuit substrate, And a second lens on the third and fourth light emitting elements, wherein the first and second light emitting elements are arranged such that a thickness of a center region overlapping the first to fourth light emitting elements is smaller than a thickness of the first to fourth light emitting elements Adjacent edges And the first and second lenses have curved surfaces whose outer curved surfaces in the second direction are convex, and inner curved surfaces in the third direction have concave curved surfaces.

According to the embodiment, the first and second lenses may have curved surfaces whose outer curved surfaces in the second direction are convex, and inner curved surfaces in the third direction may have concave curved surfaces.

According to the embodiment, the first and second lenses may have a constant thickness in the first direction and may extend on the first to fourth sides.

According to an embodiment of the present invention, the first and second bottom portions have a lower depth than the first to fourth sidewalls, and the interval between the first and second bottom portions, on which the first and second circuit boards are disposed, 2 circuit board thickness.

According to an embodiment of the present invention, at least one of the first and second light emitting devices is disposed in a plurality of directions in a first direction, at least one of the third and fourth light emitting devices is disposed in a plurality of directions in a first direction, The first reflective cup may surround the lower region of the second light emitting device, and the second light emitting unit may include a second reflective cup surrounding the lower region of the fourth light emitting device.

According to an embodiment of the present invention, the first and second bottom portions may be disposed on opposite sides with respect to the first direction.

According to the embodiment, the thickness of the outer portion of the first and second recesses may be equal to or less than the distance between the light emitting surfaces of the first and third light emitting devices.

According to the embodiment, at least one of the inner curved surface and the outer curved surface of the first and second lenses may include an anti-reflective material.

According to the embodiment, the focal positions of the inner surface of the housing passing through the first and second lenses may be different from each other.

According to the embodiments, it is possible to improve the luminous intensity of the linear light source or the planar light source in the light source module having the light emitting element.

According to the embodiment, the focus position can be moved from the light source module to the lens, thereby preventing a decrease in luminous intensity.

According to the embodiments, the focal position can be moved to a position adjacent to the light emitting surface of the light emitting device by using the lenses on the opposite sides of the light source module, thereby improving the brightness.

The optical reliability of the light source module and the illumination device having the same according to the embodiment can be improved.

The reliability of the headlamp for a vehicle having the light source module according to the embodiment can be improved.

The embodiment can be applied to a backlight unit having a light source module, various display devices, a surface light source illumination device, or a vehicle lamp.

1 is a view showing a vehicle equipped with a vehicle headlamp according to an embodiment of the present invention.
2 is a perspective view of the head lamp of Fig.
3 is a perspective view of a head lamp having a light source module according to an embodiment.
Figure 4 is a front view of the headlamp of Figure 3;
Fig. 5 is a cross-sectional view of the head lamp of Fig. 4 on the AA side. Fig.
6 is a perspective view of a light source module according to an embodiment.
7 is a view illustrating a structure in which a lens is removed from the light source module of FIG.
FIG. 8 is a first plan view of the light source module of FIG. 7; FIG.
9 is a second plan view of the light source module of FIG.
10 is a sectional view of the light source module of Fig. 6 on the BB side.
11 is a CC side sectional view of the light source module of Fig.
12 is a partial sectional view of the light source module of Fig. 6 on the DD side.
13 is a perspective view of the lens of the light source module of Fig.
Figure 14 is a side view of the lens of Figure 13;
15 is a partial cross-sectional view of a headlamp to which the light source module of FIG. 6 is coupled.
16 is a view for explaining the focal position of the light source module in the case where there is no lens in the embodiment.
17 is a view for explaining the focus position of a light source module having a lens in the embodiment.
18 (a) and 18 (b) illustrate movement of a focus position according to the presence or absence of a lens of the light source module in the embodiment.
19 is a view for explaining the illumination distance of the screen from the headlamp according to the embodiment.
Fig. 20 is a view for explaining the illuminance distribution of (a) the high beam and (b) the low beam in the headlamp of Fig.
21 is an example of a light emitting device of the light source module according to the embodiment.
22 is another example of the light emitting device of the light source module according to the embodiment.
23 is a view showing the relationship between the lens thickness and the focus position in the light source module according to the embodiment.
24 is a graph showing the relationship between the thickness of the lens coated with an anti-reflective coating and the luminous intensity of the low beam in (a) high beam and (b) in the light source module according to the embodiment.
Fig. 25 is a graph showing the relationship between the thickness of a lens having no anti-reflective coating and the luminous intensity of a low beam in (a) a high beam and (b) in a light source module according to the embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments described herein and the configurations shown in the drawings are only a preferred embodiment of the present invention, and that various equivalents and modifications may be made thereto at the time of the present application.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and the meaning of each term should be interpreted based on the contents throughout this specification. The same reference numerals are used for portions having similar functions and functions throughout the drawings.

The illumination device according to the present invention is applicable to various lamp devices requiring illumination, such as a vehicle lamp, a domestic illumination device, and an industrial illumination device. For example, when the present invention is applied to a vehicle lamp, it can be applied to a headlamp, a car light, a side mirror, a fog lamp, a tail lamp, a brake light, a daylight driving lamp, a vehicle interior light, a door scar, And the like. The lighting device of the present invention can be applied to indoor, outdoor advertisement devices, display devices, and various types of electric trains, and can be applied to all lighting-related fields and advertisement-related fields that are currently being developed, commercialized, .

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

1 is a view showing a vehicle equipped with a headlamp for a vehicle according to an embodiment of the present invention.

Referring to FIG. 1, a vehicle 1 according to an embodiment of the present invention includes a front head lamp 101, a rear lamp, an indoor lighting, a door scarf, and a rear combination lamp.

2, the headlamp 101 for a vehicle includes a first light source unit 105, a second light source unit 107, a third light source unit 109, a clearance lamp, a side mirror, (Daytime running right), a fog light, and a turn signal lamp are used. However, the present invention is not limited thereto. The configuration of the headlamp 101 for a vehicle, which is used in accordance with the light distribution pattern application, . The headlamp 101 for a vehicle in the present invention means a headlamp, but is not limited thereto. In the present invention, the vehicle headlamp 10 means a lamp provided on the left or right side of the vehicle, and other vehicle headlamps not described in the present invention are the same as those of the headlamp 101 for a vehicle of the present invention Or it may be understood to have a symmetrical configuration. Tail lamps, back-up lamps, and stop lamps are used for the rear lamp of the vehicle.

2 is a perspective view of a vehicle headlamp according to an embodiment of the present invention.

2, the exit surface of the first light source unit 105 extends along a free-form surface 103 formed outward from the front center of the vehicle, and the exit surface of the second light source unit 107 extends along the free- And may extend along the free-form surface 103 to be recognized by the light source unit 105. The first light source unit 105 may surround one side of the free curved surface 103 and the second light source unit 107 may surround the rest of the free curved surface 103. [ Therefore, the exit surface of the first and second light source units 105 and 107 can include a free-form surface by the free-form surface 103. [ Here, the free-form surface 103 is a curved surface expressed as a group of curved surfaces connected to satisfy the condition of constant continuity. In the present invention, the free-form surface 103 is formed toward the outer rear from the front center of the vehicle, Or may be a rectangular shape when viewed from the side, but may mean a 3D surface including all shapes such as polygonal ellipses.

The first and second light source units 105 and 107 may be planar light source units, and the emission surface may be a three-dimensional free curved surface having at least one curved portion. 1 and 2, the exit surface of the first light source unit 105 has a convex curved shape toward the right upper end, and the exit surface of the second light source unit 107 has a convex curved shape toward the left lower end Lt; / RTI > Therefore, it is possible to realize differentiation from other vehicles through a three-dimensional free-form surface shape having at least one curved portion. However, the number of the valley portions and the shape of the three-dimensional free-form surface are not limited as long as the above-described discrimination can be realized.

The third light source module 109 may be disposed adjacent to the first light source module 105 and the second light source module 107. The third light source module 109 may be disposed between the first and second light source modules 105 and 107. The third light source module 109 may be disposed between the free curved surfaces 103 and may have a free curved surface. At least one or two or more of the first, second, and third light source modules 103, 105, and 109 may form a low beam distribution pattern and a high beam distribution pattern. The low beam light distribution pattern and the high beam light distribution pattern may be selectively turned on and off according to the driving mode or the driving situation. At least one of the first to third light source modules 105, 107, and 109 may include a head lamp described later. The headlamp may include an H4 valve.

FIG. 3 is a perspective view of a head lamp having a light source module according to an embodiment, FIG. 4 is a front view of the head lamp of FIG. 3, FIG. 5 is a cross- 7 is a first plan view of the light source module of FIG. 7, FIG. 9 is a plan view of the second light source module of FIG. 7, and FIG. 6 is a cross-sectional side view of the light source module shown in Fig. 6, and Fig. 11 is a cross-sectional side view of the light source module of Fig. 6, Fig. 14 is a side view of the lens of Fig. 13, and Fig. 15 is a partial cross-sectional view of a headlamp to which the light source module of Fig. 6 is coupled.

3 to 5, a vehicle headlamp 90 according to an embodiment includes a light source module 10 and a housing 92, and the light source module 10 is disposed inside the housing 92 And the irradiated light can be reflected in the emitting direction through the inner surface 92A of the housing 92. [

The housing 92 may include a metal or a non-metal material, and the non-metal material may include a plastic material. The housing 92 may be a reflector of the headlamp. The inner surface 92A of the housing 92 may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflection (AR) material. For example, the high reflection material may include at least one of metals such as Al, Ag, and Au, and the non-reflective material may be MgF ₂ , Al ₂ O ₃ , SiO, SiO ₂ , TiO ₂ + ZrO ₂ , TiO ₂ , ZrO ₂ Or the like. The reflective layer of the inner surface 92A may be a single layer or multiple layers.

The head lamp 90 may include an inner lens and / or an outer lens for projecting the light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module 10 can be adjusted according to the shape of the inner lens and the number of the light source units. The light source module 10 selectively irradiates light of a high beam distribution pattern and a low beam distribution pattern, and the high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off according to the traveling mode or driving situation have.

The housing 92 includes, for example, a cavity 95 in which an emitting side region is opened in all directions, and the cavity 95 is disposed with a curved surface along the outer periphery of the light source module 10, Or the hemispherical lower portion may have a shape having a horizontal surface. The hemispherical lower horizontal surface can reduce light lost on the road at a portion adjacent to the vehicle. The cavity 95 of the housing 92 may be provided in various shapes according to the light distribution pattern. The cavity 95 may have a curved surface on the inner surface 92A and may reflect the incident light and emit the light in the light emitting direction. The inner surface 92A of the housing 95 may be provided with curved surfaces having different curvatures to control the light distribution and the luminous intensity, but the present invention is not limited thereto.

The inner surface 92A of the housing 92 may include a partially domed or partially oval parabolic surface. The inner surface 92A may have a plurality of facets. The facets can be free-form, flat, and / or curved (e.g., concave or convex) members. In some instances, a single facet may have portions that are free-shaped, and / or flat portions, and / or curved portions (e.g., any combination thereof). In some embodiments, the facet (or at least the facet on the facet) may be at least approximated, or otherwise determined by an algebraic equation. For example, the facets of the facets or inward facing surfaces can be represented by one or more fifth-order algebraic equations (of course, other expressions of any order are possible, of course). In at least one exemplary embodiment, the surface (or, for example, the coating) of the facet has a high reflectance (e.g., 80% or more reflectance). Non-limiting examples of coatings on facets and / or facets include aluminum and silver, but other reflective materials may be used.

The inner surface 92A of the housing 92 is laterally spaced apart from the light source module 10 and the light emitted from the light source module 10 is reflected by the inner surface 92A and the housing 92 To the emission side of the liquid crystal display device. As shown in Fig. 19, when the screen 99 separated by the headlamp 90 at a predetermined distance D21 is irradiated with light, it can have the highest light volume near the center of the screen 90. [ 20, the high beam H _B has the highest luminous intensity in the vicinity of the center of the screen, and in (b) the low beam L _B has the highest luminous intensity near the center of the screen Light intensity.

The cavity 95 of the housing 92 includes a recessed recess or a recessed recess which is generally a bowl, a parabolic antenna, or a dish shape having an inner surface 92A and a convex outer surface, . The cavity 95 may include various features and accessories for fixedly supporting or containing components such as the light source module 10 and the processor. The exterior of the housing 92 may include various features and accessories for mounting or connecting the headlamp 90 to the interior of the vehicle and may include an electrical interface for connecting power and / Of 91). The housing 92 and the cavity 95 are merely examples and may be modified into various shapes. The housing 92 according to the embodiment can function as a reflector of the left / right headlamp 90. [

<Light source module 10>

Referring to FIG. 5, the light source module 10 may include a main body 20 and light emitting units 30 and 40 disposed in different areas of the main body 20. The main body 20 may protrude into the cavity 95 through the rear of the housing 92.

The main body 20 may include a circular column or a polygonal columnar shape. The body 20 may be coupled to the vehicle at the rear of the housing 92 and protrude into the interior of the housing 92. The main body 20 has a circular or polygonal shape when viewed from the front and the light emitting portions 30 and 40 are arranged at different angles with respect to the X axis direction of the main body 20, Direction. The light emitting units 30 and 40 emit light in different directions in the main body 20. [ As shown in FIG. 6, the light emitted through the light emitting units 30 and 40 may be radiated in the main body 20 in a radial direction, reflected by the inner surface 92A, and emitted in an emitting direction. 5, the X-axis direction may be a first direction in which light is emitted to the outside, the Y-axis direction may be a second direction orthogonal to the X-axis direction, and the Z- And the third direction orthogonal to the first direction. The third direction may be a direction in which the light emitting portions 30 and 40 are vertically overlapped or a direction in which some of the light emitting portions 30 and 40 are overlapped.

The main body 20 may be made of a plastic material or a metal material. The main body 20 is made of a metal such as titanium, copper, nickel, gold, chromium, tantalum, platinum, tin, ), Phosphorus (P), and aluminum (Al), and may be formed as a single layer or multiple layers. The body 20 may include at least one of a highly thermally conductive metal such as aluminum or an aluminum alloy. The main body 20 may include a heat dissipation plate.

5 and 6, the main body 20 includes a base portion 21 coupled to the housing 92 and a support portion 23 protruding from the base portion 21 in the cavity 95 or in the light- ). The base portion 21 may be formed as a circular or polygonal plate so as to be coupled to the inside or the outside of the housing 92. The support portion 23 may protrude from the center of the base portion 21 toward the cavity 95 of the housing 92. The base portion 21 may be combined with the bottom of the cavity 95 of the housing 92 such that the width or diameter of the base portion 21 is larger than the width of the support portion 23 (D1 in FIG.

The support portion 23 may include recesses 25 and 26 in which the light emitting portions 30 and 40 are disposed. The recesses 25 and 26 are recessed from the surface of the support portion 23 and can be disposed at a predetermined angle, for example, in the range of 90 to 270 degrees with respect to the direction of the exit side of the housing 92 . The recesses 25 and 26 may include a first recess 25 disposed in a first region of the support portion 23 and a second recess 26 disposed in a second region of the support portion 23 . The first and second recesses 25 and 26 may be disposed at a predetermined angle, for example, in a range of 90 to 270 degrees with respect to a direction in which the support portion 23 protrudes. The first recess 25 may be disposed at an angle of 180 degrees with respect to the second recess 26 with respect to a direction in which the support portion 23 protrudes. The first and second recesses 25 and 26 may be disposed in opposite directions, or may be spaced apart from each other by an obtuse angle. The shapes of the first and second recesses 25 and 26 may be symmetrical with respect to each other. The recesses 25, 26 in the support 24 according to the embodiment may include two or three or more recesses, but are not limited thereto. The support portion 24 may function as a heat dissipation plate.

The light emitting portions 30 and 40 include a first light emitting portion 30 disposed in the first recess 25 and a second light emitting portion 40 disposed in the second recess 26, can do. The first light emitting unit 30 may include at least one of ultraviolet light, green light, blue light, red light, and white light, and may emit white light, for example. The second light emitting unit 40 may include at least one of ultraviolet light, green light, blue light, red light, and white light, and may emit white light, for example. The first and second light emitting units 30 and 40 may emit at least one or both of a high beam and a low beam. For example, the first light emitting unit 30 emits light of a high beam and a low beam at the first recess 25, and the second light emitting unit 40 emits light of a high beam and a low beam at the second recess 26 Thereby emitting light of a high beam and a low beam. The high beam and the low beam emitted from the first and second light emitting units 30 and 40 may be selectively turned on or off according to the driving mode or the driving condition. The low beams of the first and second light emitting units 30 and 40 may be turned on or off at the same time or may be turned on or off with a time difference depending on the driving situation. The high beams of the first and second light emitting units 30 and 40 may be turned on or off at the same time or turned on or off with a time difference depending on the driving situation. The first and second light emitting units 30 and 40 may include light emitting chips, for example, light emitting diode (LED) chips (hereinafter referred to as light emitting chips).

7 and 8, the first recess 25 of the support portion 23 is connected to the first and second recesses 25 and 25 of the first and second recesses 25 and 25, Two side surfaces 5A and 5B. The X-axis direction of the first recess 25 may be a forward direction or a longitudinal direction of the main body 20, and the first and second side surfaces 5A and 5B may correspond to each other on both sides in the X-axis direction. The first and second side surfaces 5A and 5B may be disposed on both sides in the X-axis direction, and may be provided as reflective surfaces. The first and second side surfaces 5A and 5B include a flat surface and may be disposed at an inclined surface with respect to the Z-axis direction. An angle of a straight line extending in an inclined direction of the first and second side surfaces 5A and 5B may be arranged in a range of an obtuse angle. The first and second side surfaces 5A and 5B may have a hemispherical shape and be inclined from the first bottom portion 5 to the surface of the support portion 21. [ The first and second side surfaces 5A and 5B may be arranged in a stepped structure, but the present invention is not limited thereto. The first and second side surfaces 5A and 5B may include concave curved surfaces so that the concave curved surfaces can control the directional distribution of the incident light. The gap between the first and second sides 5A and 5B may be gradually closer to the first bottom 5. The lower interval between the first and second sides 5A and 5B may be equal to the length D3 in the X-axis direction of the first bottom 5. The width of the first bottom part 5 in the Y axis direction may be equal to or less than the length D3 and may be equal to the width D1 or diameter of the support part 23. [ Here, the Z-axis direction may be a direction orthogonal to the X-axis and Y-axis directions, the Z-axis direction may be a forward direction or a traveling direction, and the Y-axis direction may be orthogonal to the X-axis direction. The width D1 of the support portion 23 may be in the range of 15 mm or more, for example, 15 mm to 35 mm, and may be selectively applied to the head lamp.

The first bottom portion 5 of the first recess 25 may include first and second side walls 5C and 5D on the outer side. The first sidewall 5C may be connected to an upper portion of the first and second side surfaces 5A and 5B and the second side wall 5D may be connected to a lower portion of the first and second side surfaces 5A and 5B. have. The first and second sidewalls 5C and 5D may be separated from each other in the Y-axis direction and have a long length in the X-axis direction (e.g., D3). The first and second side walls 5C and 5D may protrude from the first bottom 5 in a stepped structure. The distance D11 between the first and second side walls 5C and 5D may be smaller than the width D1 of the support portion 23 and larger than the width of the first circuit board 31 in the Y- . The first and second sidewalls 5C and 5D may be disposed parallel to each other or non-parallel to each other, but the present invention is not limited thereto. The upper surfaces of the first and second side walls 5C and 5D may be planar or irregular. The outer surfaces of the first and second sidewalls 5C and 5D may be curved or flat. The inner surfaces of the first and second sidewalls 5C and 5D correspond to each other and may be flat or irregular. The first and second side walls 5C and 5D protrude to a lower height than the first and second side surfaces 5A and 5B so that the first and second side walls 5C and 5D can be opened in the first direction or the X axis direction.

9, the second recess 26 has third and fourth side surfaces 6A and 6B facing each other in the X-axis direction from the second bottom portion 6 of the second recess 26 . The X axis direction in the second recess 26 may be a forward direction or a longitudinal direction of the main body 20 and the third and fourth side surfaces 6A and 6B may correspond to each other on both sides in the X axis direction. The third and fourth side surfaces 6A and 6B are disposed on both sides in the X-axis direction, and can be provided as reflecting surfaces. The third and fourth side surfaces 6A and 6B include flat surfaces and may be disposed in a plane inclined with respect to the third direction or the Z axis direction. The angle of the straight line extending in the oblique direction of the third and fourth side surfaces 6A and 6B may be arranged in a range of an obtuse angle. The third and fourth side surfaces 6A and 6B may have a hemispherical shape and be inclined from the second bottom portion 6 to the surface of the support portion 23. [ The third and fourth side surfaces 6A and 6B may be arranged in a stepped structure, but the present invention is not limited thereto. The third and fourth sides 6A and 6B can include concave curved surfaces, which can control the directional distribution of the incident light. The gap between the third and fourth side surfaces 6A and 6B may be gradually closer to the second bottom portion 6. The lower interval between the third and fourth sides 6A and 6B may be the same as the length D3 in the X-axis direction of the second bottom 6. The width of the second bottom portion 6 in the Y-axis direction may be equal to or less than the length D3 and may be smaller than the width D1 of the support portion 23. [

The second bottom portion 6 of the second recess 26 may include third and fourth side walls 6C and 6D on the outer side. The third side wall 6C may be connected to the upper portions of the third and fourth side surfaces 6A and 6B and the fourth side wall 6D may be connected to the lower side of the third and fourth side surfaces 6A and 6B. have. The third and fourth side walls 6C and 6D may be spaced from each other in the Y-axis direction and have a long length in the X-axis direction (e.g., D3). The third and fourth side walls 6C and 6D may protrude from the second bottom portion 6 in a stepped structure. The distance D11 between the third and fourth side walls 6C and 6D may be smaller than the width D1 of the support portion 23 and may be larger than the width of the second circuit board 41 in the Y- . The third and fourth sidewalls 6C and 6D may be disposed parallel to each other or non-parallel to each other, but the present invention is not limited thereto. The upper surfaces of the third and fourth side walls 6C and 6D may be flat or irregular. The outer surfaces of the third and fourth sidewalls 6C and 6D are opposite to each other and may be curved or flat. The inner surfaces of the third and fourth side walls 6C and 6D correspond to each other, and may be flat or irregular. The third and fourth side walls 6C and 6D protrude to a lower height than the third and fourth side surfaces 6A and 6B so that the first direction or the X-axis direction can be opened.

The outer portions 23A and 23B of the first and second recesses 25 and 26 in the support portion 23 are formed in the first and second recesses 25 and 26 as shown in FIGS. 9, 10 and 11, And may have a thickness D6 greater than the spacing between the bottoms 5,6. An area between the bottom portions 5 and 6 of the first and second recesses 25 and 26 is an inner portion 23C and a thickness D6 that is thinner than the thickness T1 of the outer frame portions 23A and 23B Lt; / RTI &gt; The thickness D6 may be less than or equal to 40% of the thickness T1 and may range, for example, from 15% to 40%. If the thickness D6 is smaller than the above range, the internal stiffness may be lowered and the heat radiation efficiency may be lowered. If the thickness D6 is larger than the above range, the gap D8 between the light-emitting surfaces A1 and A2 becomes large, . The thickness T1 of the outer frame portions 23A and 23B is the thickness in the Z axis direction and may be equal to or smaller than the spacing D8 between the light emitting surfaces A1 and A2. The thickness T1 of the outer frame portions 23A and 23B may be set to be not more than five times the thickness D6 of the inner portion 23C. This can reduce the light loss blocked in the second direction or the Y-axis direction by the side walls 5C, 5D, 6C, 6D of the outer frame portions 23A, 23B. The thickness T1 of the outer frame portions 23A and 23B may be in a range of 3 mm or more, for example, 3 mm to 6 mm. The depth D5 of the first and second bottom portions 5 and 6 in the support portion 23 is a depth depressed in the Z axis direction and is a distance between the first and second bottom portions 5 and 6, 23C). Accordingly, the circuit boards 31 and 41 and the light emitting devices 32, 33, 42 and 43 of the light source module can be disposed on the first and second bottom portions 5 and 6. The distance between the first and second bottom portions 5 and 6 or the thickness D6 of the inner portion 23C may be smaller than the sum of the thicknesses of the first and second circuit boards 31 and 41.

(First and second light emitting portions 30 and 40)

The first light emitting portion 30 may be disposed in the first recess 25 and the second light emitting portion 40 may be disposed in the second recess 26. Although the first and second light emitting units 30 and 40 are disposed in different recesses 25 and 26, the first light emitting unit 30 and the second light emitting unit 30 may have the same configuration, 2 Configuration of the light emitting unit 40 will be briefly described with reference to the configuration and operation of the first light emitting unit 30. FIG.

6 to 8 and 10, the first light emitting portion 30 emits light in a first lateral direction on the first recess 25, and the second light emitting portion 40 emits light in a first lateral direction And irradiates light on the second recess 26 in the second lateral direction. The first light emitting portion 30 emits light of a high beam and a low beam at the first recess 25 and the second light emitting portion 40 emits light of a high beam and a low beam at the second recess 26, And the light of the low beam is emitted. The light emitted from the first and second light emitting units 30 and 40 may include at least one of ultraviolet light, blue light, green light, red light, and white light, for example, white light.

The first light emitting portion 30 includes a first circuit substrate 31, first and second light emitting devices 32 and 33 on the first circuit substrate 31, And may include a first lens 39. The first circuit board 31 is disposed on the first bottom portion 5 of the first recess 25 and may be fixed to the first bottom portion 5 with an adhesive or a fastening member. The adhesive may comprise a thermally conductive adhesive, and the fastening member may comprise a screw or a rivet.

The first circuit board 31 may be disposed lower than the upper surfaces of the first and second side walls 5C and 5D. The thickness of the first circuit board 31 may be smaller than the height of the first and second sidewalls 5C and 5D or the depth of the first bottom 5. The first light emitting device 32 of the first light emitting unit 30 includes an LED that emits light for high beam and the second light emitting device 33 may include an LED that emits light for low beam. The first and second light emitting devices 32 and 33 emit light of the same color or light of different colors. The first and second light emitting devices 32 and 33 emit light of white light and emit light of the same color temperature or different color temperature. The color temperature of the first and second light emitting devices 32 and 33 may have a color temperature range of 2500K to 12000K.

6, 9, and 10, the second light emitting unit 40 includes a second circuit substrate 41, a third and fourth light emitting devices 42 and 43 on the second circuit substrate 41, , And a second lens (49) on the second circuit board (41).

The second circuit board 41 is disposed on the second bottom portion 6 of the second recess 35 and may be fixed to the second bottom portion 6 with an adhesive or a fastening member. The second circuit board 41 may be disposed lower than the upper surfaces of the third and fourth side walls 6C and 6D. The thickness of the second circuit board 41 may be smaller than the height of the third and fourth side walls 6C and 6D or the depth of the second bottom portion 6. The third light emitting device 42 of the first light emitting unit 40 may include an LED for generating high beam light and the fourth light emitting device 43 may include an LED for generating low beam light. The third and fourth light emitting devices 42 and 43 may emit light of the same color or emit light of different colors. The third and fourth light emitting devices 42 and 43 may emit light of white light and emit light of the same color temperature or different color temperature. The color temperature of the third and fourth light emitting devices 42 and 43 may have a color temperature range of 2500K to 12000K.

The first and second circuit boards 31 and 41 include boards on which circuit patterns are printed. For example, the first and second circuit boards 31 and 41 may be resin-based printed circuit boards (PCBs), metal core PCBs, A flexible PCB, a ceramic PCB, and an FR-4 substrate. The first and second circuit boards 31 and 41 may include a flexible or non-flexible board. The first and second circuit boards 31 and 41 may be a board having a heat dissipation plate or a heat dissipation pad at the bottom for dissipating heat. The thickness of the first and second circuit boards 31 and 41 may be 0.7 mm or less, for example, 0.6 mm ± 0.1 mm. If the thickness of the first and second circuit boards 31 and 41 is smaller than the above range, heat radiation efficiency may be lowered. If the first and second circuit boards 31 and 41 are thicker than the above range, There is a problem that the distance between the surfaces becomes farther away, the lightness can be lowered, and the focus position changes.

10, the distance D7 between the circuit boards 31 and 41 of the first and second light emitting units 30 and 40 may be smaller than the thickness T1 of the outer frame units 23A and 23B, For example, 3 mm or less or 1.8 mm to 3 mm. The inner thickness D6 of the recesses 25 and 26 and the heat dissipation thickness of the circuit boards 31 and 41 can be secured.

The light emitting devices 32, 33, 42 and 43 may be light emitting chips, for example, light emitting diode (LED) chips (hereinafter referred to as light emitting chips), or packages in which the light emitting chips are packaged. The light emitting chip may emit at least one of ultraviolet light, blue light, red light, green light, ultraviolet light (UV), and infrared light. The light emitting devices 32, 33, 42, and 43 may be of a top view type or a side view type, but the present invention is not limited thereto. As another example, the light emitting devices 32, 33, 42, and 43 may be implemented as a chip on board (COB) type of light emitting chip, but the present invention is not limited thereto. The light emitting devices 32, 33, 42, and 43 may include a phosphor that is in contact with or spaced from the light emitting chip. The phosphor may be a resin member or provided in the form of a film to convert the wavelength of some light emitted from the light emitting chip. The phosphor may include at least one of yellow, green, red and blue phosphors.

The first light emitting device 32 may include one or more LEDs and may be arrayed m × n, where m, n may be one or more, and m≥n. The second light emitting device 33 may include one or more LEDs, and may be arrayed by o x p, where o, p may be one or more, and may have a relationship o o p. The third light emitting device 42 may include one or more LEDs and may be arrayed by q × r, where q, r may be one or more, and may have a relationship of q≥r. The fourth light emitting device 44 may include one or more LEDs and may be arrayed v x w, where v, w may be one or more, and may have a relationship of v? W. When m, o, q, v are two or more, the array direction thereof may be a horizontal direction, a longitudinal direction of the main body, or an opening direction of the housing 92. When n, p, r, w are two or more, the array direction thereof may be a vertical direction, a width direction of the main body, or an inner side direction of the housing 90.

The number of the first and third light emitting devices 32 and 42 may be equal to each other. The number of the second and fourth light emitting devices 33 and 43 may be equal to each other. The number of the first and second light emitting devices 32 and 42 may be the same or different from each other. The number of the third and fourth light emitting devices 33 and 43 may be equal to or different from each other. The first and third light emitting devices 32 and 42 may be disposed closer to the base unit 21 than the second and fourth light emitting devices 33 and 43. The second and fourth light emitting devices 33 and 43 may be disposed closer to the emission side end 23E of the support 23 than the first and third light emitting devices 32 and 42. On the contrary, the second and fourth light emitting devices may be disposed closer to the base unit 21 than the first and third light emitting devices. The first and third light emitting devices 32 and 42 may be disposed closer to the base 21 than the second and fourth light emitting devices 33 and 43.

The straight line connecting the center of the array of the first light emitting devices 32 may be disposed on a line different from a straight line connecting the centers of the arrays of the second light emitting devices 33. For example, A straight line connecting the centers of the arrays of the second light emitting devices 33 may be disposed below the straight line connecting the center of the array of the second light emitting devices 33. The straight line connecting the center of the array of the third light emitting devices 42 may be disposed on a line different from a straight line connecting the centers of the arrays of the fourth light emitting devices 43. For example, May be arranged below the straight line connecting the center of the array of the fourth light emitting device (43).

8, 9 and 11, the first light emitting portion 30 includes a first reflective cup 36, the first reflective cup 36 is open at the top, 33, respectively. The first reflective cup 36 surrounds the lower region of the second light emitting device 33 and opens the upper region to prevent the light emitted from the second light emitting device 33 from traveling in the downward direction. can do. The second light emitting part 40 may include a second reflective cup 46 and the second reflective cup 46 may be disposed such that the upper part thereof is opened and the lower outer side of the fourth light emitting device 43 is surrounded . The second reflective cup 46 is opened to surround the lower region of the fourth light emitting device 43 and is reflected to prevent the light emitted from the fourth light emitting device 43 from traveling downward . The first and second reflective cups 36 and 46 may have a concave curved surface on the inner side or a surface having mixed curved surfaces, but the present invention is not limited thereto. The first and second reflecting cups 36 and 46 are disposed below the optical axis of the second and fourth light emitting devices 33 and 43, for example, below the straight line in the Z axis direction, 33, and 43, the light can be reflected in the downward direction. The first and second reflective cups 36 and 46 cover the lower region so that the light emitted from the second and fourth light emitting devices 33 and 43 can be irradiated with the light for low beam. The first and second reflective cups 36 and 36 may be integrally extended from the first and second circuit boards 31 and 41 or separately attached thereto.

Referring to FIG. 11, the first and second reflective cups 36 and 46 may be separated from the inner curved surface R2 of the first and second lenses 39 and 49 by a predetermined gap G1. The height G2 of the first and second reflective cups 36 and 46, for example, in the Z-axis direction may include a range of 6 mm or less, for example, 3 mm to 6 mm from the surface of the circuit boards 31 and 41 . If the height G2 of the first and second reflective cups 36 and 36 is larger than the above range, it is difficult to control the uniform distribution of light by contacting the lenses 39 and 49. If the height G2 is smaller than the above range, . The first and second reflective cups 36 and 46 may be made of the same material as that of the support part 21 or may be made of another material such as a metal material. The first and second reflective cups 36 and 46 may include a non-metallic material such as resin or plastic.

The light source module according to the embodiment may include lenses 39 and 49. [ The light emitting units 30 and 40 according to the embodiment may include the lenses 39 and 49. The lenses 39 and 49 include a first lens 39 disposed on the emission side of the first light emitting unit 30 and a second lens 49 disposed on the emission side of the second light emitting unit 40. [ . &Lt; / RTI &gt; The focus position of the first lens 39 and the focus position of the second lens 49 may be spaced apart from each other and optimized for a head lamp having an LED light source. 10 and 11, the first and second lenses 39 and 49 cover the upper portions of the first and second recesses 25 and 26, The light emitted from the elements 32, 33, 42, and 43 can be refracted and emitted. The first and second lenses 39 and 49 may include curved surfaces convex in the Z-axis direction with reference to the Y-axis direction. The first and second lenses 39 and 49 may include an inner curved surface R2 concave in the Z-axis direction and an outer curved surface R1 convex in the Z-axis direction. The lenses 39 and 49 may be made of a glass material, a resin material such as silicone or epoxy, or a transparent plastic material. The lenses 39 and 49 may have a refractive index in the range of 1.5 + - 0.2. The first and second lenses 39 and 49 may include a convex meniscus lens shape.

As shown in FIGS. 10, 11 and 13, the outer curved surface R1 of the lenses 39 and 49 may have a positive curvature and the inner curved surface R2 may have a negative curvature. The radius of curvature of the outer curved surface R1 may range from 8.6 mm or more, for example, 8.6 mm to 10.30 mm. The radius of curvature of the inner curved surface R2 may have a range of 8 mm or more, for example, 8.6 mm to 10.30 mm. The outer curved surface R1 and the inner curved surface R2 of the lenses 39 and 49 may have the same radius of curvature or different radii of curvature and may have a relationship of R1? R2, for example. The outer curved surface R1 and the inner curved surface R2 of the lenses 39 and 49 can be selected within the radius of curvature according to the thickness d of the center area and the focal position. The outer curved surface R1 of the lenses 39 and 49 may not protrude from the outer surface of the support portion 23. [

The first and second lenses 39 and 49 may have a shape in which the thickness d of the center region is thicker than the peripheral edge in the Y-axis direction. The first and second lenses 39 and 49 may include a shape in which the thickness d of the center region is thicker than the peripheral edge in the X and Y axis directions. The center area of the first and second lenses 39 and 49 may be an area overlapped with the light emitting devices 32, 33, 42, and 43 in the Z axis direction. The first and second lenses 39 and 49 have the largest thickness d of the center region and gradually become closer to the side walls 5C, 5D, 6C and 6D of the first and second recesses 25 and 26 And may be formed to have a thin thickness (e.g., B4). As shown in FIG. 12, the first and second lenses 39 and 49 may be arranged to have a constant thickness in the X-axis direction. The edge portions of the lenses 39 and 49 in the X-axis direction protrude above the recesses (not shown) of the support portion 23 and can be fixed with a member such as an adhesive or a screw.

10 to 12, the inner curved surface R2 of the first and second lenses 39 and 49 is curved along the side walls 5C, 5D, 6C and 6D of the first and second recesses 25 and 26, R3, R4, R5, and R6 of Fig. 13) may be fixed with the adhesive 69 or other fixing member. In this case, the side surfaces 5A, 5B, 6A, The adhesive 69 may comprise a resin material such as silicone or epoxy. At least an outer portion of the first and second lenses 39 and 49 may be fastened with a fastening member such as a screw on the support portion 23.

The bottom surfaces R3 and R4 of the first and second lenses 39 and 49 are adhered to the side walls 5C and 5D and 6C and 6D. The width B4 of the bottom faces R3 and R4 in the Y axis direction may be smaller than the width D4 of the side walls 5C, 5D, 6C and 6D. The thickness B4 in the Y axis direction on the bottom surfaces R3 and R4 of the first and second lenses 39 and 49 may be a minimum thickness and may be 1/2 or less of the width D4, 2 to 1/4. The minimum thickness B4 may be in the range of 1.5 mm or less, for example, 0.8 mm to 1.5 mm.

The first and second lenses 39 and 49 may be provided with a gradually thinner thickness in a direction closer to the bottom surfaces R3 and R4 so that the deviation of the amount of emitted light can be reduced. The bottom surfaces R3 and R4 of the first and second lenses 39 and 49 are disposed on the outer sides of the side walls 5C and 5D and the side walls 5C and 6D, , 6D can be exposed. The outer curved surface R2 of the first and second lenses 39 and 49 may extend from the curved surface of the outer frame portion 23A of the support portion 23. [ The outer curved surface R2 of the first and second lenses 39 and 49 may be disposed on the same surface as the surface of the support portion 23 or may not protrude outward beyond the surface of the support portion 23. [

10 and 14, the height B2 of the first and second lenses 39 and 49 in the Z-axis direction is 1/2 or less of the length B1 in the Y-axis direction, for example, 9 mm or less, . &Lt; / RTI &gt; The length B1 in the Y axis direction of the first and second lenses 39 and 49 may be equal to or less than the width D1 or diameter of the support portion 23 and B1 may be arranged in a range of 0.90 to 0.99 of D1 . The length B1 in the Y-axis direction of the first and second lenses 39 and 49 may be in a range of 17 mm or more, for example, 17 mm to 19 mm, or 17 mm to 32 mm. As shown in FIG. 14, the maximum length B3 of the first and second lenses 39 and 49 in the X-axis direction may be greater than the length B11 of the bottom surfaces R3 and R4 or the minimum length. The maximum length B3 of the first and second lenses 39 and 49 in the X-axis direction may be set to be 1.5 times or more, for example, 1.5 to 1.9 times the length B11, and may be 30 mm or more, To 40 mm. The lengths B3 and B11 of the first and second lenses 39 and 49 in the X-axis direction may vary depending on the sizes of the first and second recesses 25 and 26. [

15, the light source module 10 may include the main body 20 and the light emitting units 30 and 40. The light source module 10 may be tilted at a predetermined angle? 1 with respect to the vertical axis direction , This angle [theta] 1 may be 30 degrees or less and is not limited thereto. The light emitted through the light source module 10 can be reflected by the inner surface 92A of the housing 92 and irradiated in the forward or vehicle running direction.

The head lamp according to the embodiment can be applied by replacing the LED light source with the filament light source of the head lamp of the comparative example. Here, the head lamp of the comparative example is optimized for the linear light source irradiated from the filament light source, but the diameter or diameter of the filament is about 1 mm, so that the focus of the head lamp of the comparative example is located near the filament light source or the filament. Here, the headlamp may include an H4 valve. In the case of replacing the LED light source, that is, the light emitting element (for example, 32, 33, 42, 43) with the head lamp of this comparative example, the focus position P1 of the housing is set to the support portion 23 As shown in FIG. However, when the LED light source of Fig. 16 is used, the interval (D8 in Fig. 10) between the light emitting surfaces A1 and A2 of the LED light sources, i.e., the light emitting elements 32, 33, 3 mm or 3 mm to 4 mm. The light emitted from the light emitting elements 32, 33, 42, and 43 is emitted to the inside of the housing 92 when the distance between the light emitting surfaces A1 and A2 of the light emitting elements 32, 33, Even if the light is reflected by the surface 92A and emitted in all directions, there may be a problem that the light intensity is lowered. That is, as the focus position between the light emitting elements 32, 33 (42, 43) on the opposite sides is distant from each other, the range of dispersion of light becomes large, and the light intensity decreases. To this end, the problem of reducing the thickness of the components between the light-emitting surfaces A1 and A2 in order to narrow the gap between the light-emitting surfaces A1 and A2 of the light-emitting elements 32, 33, Lt; / RTI &gt; For example, when the thickness of the circuit boards 31 and 41 is reduced in order to reduce the distance between the light emitting surfaces of the light emitting devices 32, 33, 42 and 43, the heat radiation capability of the circuit board is lowered, A deviation may be generated, or the heat radiation reliability may be deteriorated. Further, if the thickness D6 of the inner portion 23C of the support portion 23 is further reduced, the rigidity of the inner portion 23C of the support portion 23 may be lowered and the efficiency may be lowered on the heat radiation side. Therefore, if the distance between the light-emitting surfaces is narrowed, the light intensity of the head lamp can be increased, which is similar to the diameter of the filament. However, the thickness of the circuit board and the internal thickness of the support portion may be reduced, have.

In the embodiment, the lenses 39 and 49 are disposed on the light emitting devices 32, 33, 42 and 43 to move the focus position of the housing 92 to optically narrow the gap between the light emitting surfaces, The heat dissipation of the substrates 31 and 41 can be prevented from lowering and the brightness can be improved. 16, the focus P1 of the same housing can be moved to the focal points P2 and P3 of the different housings 92 as shown in FIG. 18A shows that the focus P2 of the housing is moved by a predetermined distance when the focus P1 of the housing 92 is in the absence of the lens when the lenses 39 and 49 are present.

The refractive index of the lens is 1.5 and the outer radius of curvature is 1.5 mm when the thickness of the center region of the lenses 39 and 49 is d, the inner radius of curvature is R2, 9.50, and the relationship between the thickness d of the center region and the focus moving distance f is shown in the graphs of Table 1 and Fig. Here, the focal length moving distance f is a moving distance in one light emitting portion, and the focal length moving distance in the housing 92 can be calculated as f x 2.

When the thickness d is increased from 1 mm to 4.5 mm and the curvature radius R2 of the inner curved surface is increased from 8.52 mm to 12.32 mm as shown in Table 1 and Fig. 23, the focal distance f is 0.01 mm to 1.15 mm.

d (mm) R2 (mm) f (mm) 1.0 8.52 0.01 1.5 8.69 0.30 2.0 8.92 0.55 2.5 9.25 0.76 3.0 9.69 0.92 3.5 10.30 1.04 4.0 11.14 1.11 4.5 12.32 1.15

Here, the thickness (D6 in FIG. 10) of the inside 23C of the support portion 23 of the main body 20 may be in the range of 0.7 mm to 0.9 mm. The thickness of the circuit boards 31 and 41 may range from 0.5 mm to 0.7 mm. The thickness of the inner portion 23C of the support portion 23 may be thicker than the thickness of the circuit boards 31 and 41 in the range of 0.1 mm or more, for example, 0.1 mm to 0.3 mm. The thickness of the light emitting devices 32, 33, 42, and 43 may be in a range of 0.6 mm or more, for example, 0.6 mm to 1 mm. The distance (D8 in FIG. 10) between the light emitting surfaces A1 and A2 of the light emitting elements 32, 33, 42 and 43 in the headlamp is in a range of 3 mm or more, for example, 3 mm to 4 mm, or 3.2 mm to 3.8 mm . Accordingly, the focal length f of the lenses 39 and 49 may be 0.5 mm or more, for example, 0.5 mm to 1.1 mm or less, and the total focal length 2 x f can be moved from 1 mm to 2.2 mm. have.

17, the focus positions P2 and P3 of the housing 92 may be disposed at the bottom or the bottom of the circuit board 31 or 41 rather than the inner center of the support 23. Embodiments can provide the focal length of the housing to be shorter than the focal length of the housing of the comparative example. Therefore, it is possible to compensate the focus position of the housing according to the focus shift distance of the lens, thereby preventing a decrease in luminous intensity according to the change of the focus position of the housing using the LED light source. For example, when the physical distance between the light emitting surfaces of the light emitting elements is 100%, the focus position can be shifted to 90% or less, for example, 70% to 90% at an optical interval. This can reduce the dispersion effect of the light due to the focus shift of the LED light source and improve the luminous intensity of the headlamp by more than 3% as shown in Table 2 and Table 3. [

At least one or both of the inner curved surface R2 and the outer curved surface R1 of the lenses 31 and 41 in the light emitting portions 30 and 40 according to the embodiment may be a surface without anti-reflection coating or anti- . &Lt; / RTI &gt; The anti-reflective coating can reduce the reflection and increase the light transmission efficiency, and can increase the transmittance of a transmitted wavelength, for example, a wavelength of 400 nm to 800 nm, or increase the transmittance of a specific wavelength band, for example, 400 nm to 600 nm. The anti-reflective coating material may include at least one of MgF ₂ , SiO ₂ , ZrO ₂ , and Al ₂ O ₃ .

Table 2 is a table comparing the luminous intensities of the inner and outer curved surfaces of the lens according to the embodiment, and Table 3 compares the luminous intensities of the inner and outer curved surfaces of the lens without anti-reflective coating.

d (mm) Hi-Beam Low-Beam Brightness (MAX cd) ratio(%) Brightness (MAX cd) ratio(%) (No lens) 45611 100.0 63040 100.0 1.0 44265 97.0 61657 97.8 1.5 46847 102.7 63657 101.0 2.0 48280 105.9 65883 104.5 2.5 50448 110.6 67153 106.5 3.0 51616 113.2 67985 107.8 3.5 53010 116.2 68303 108.3

When the thickness d of the lens having the anti-reflective coating is 1 mm, the luminous intensity of the high beam and the low beam is lower than that of the case without the lens, and the lens thickness is 1.5 mm to 3.5 mm, the luminous intensity of the high beam and the low beam increases.

FIG. 24 is a graph showing the relation between the lens thickness d and the luminous intensity in the high beam mode when the anti-reflection coating lens is applied in the present invention. FIG. 24 (b) ) And the light intensity.

Table 3 shows the case where there is no anti-reflective coating on the inner and outer curved surfaces of the lens.

d (mm) Hi-Beam Low-Beam Brightness (MAX cd) ratio(%) Brightness (MAX cd) ratio(%) (No lens) 45611 100.0 63040 100.0 1.0 42370 92.9 58846 93.3 1.5 44863 98.4 60664 96.2 2.0 46153 101.2 62856 99.7 2.5 48144 105.6 64048 101.6 3.0 49364 108.2 64738 102.7 3.5 50696 111.1 65053 103.2

As shown in Table 3 and FIG. 25, when the light intensity is 100% in the case of no lens, and the thickness d of the lens having no anti-reflective coating is 1 mm and 1.5 mm, the luminous intensity of the high beam and the low beam And the luminous intensity of the high beam or the low beam is increased up to the lens thickness of 1.5 mm to 3.5 mm. It can be seen that when the thickness d of the center region of the lens is set to 2 mm to 3.5 mm, the luminosity of both the high beam and the low beam is increased. FIG. 25 is a graph showing the relationship between the lens thickness d and the luminous intensity in the high beam mode when a lens having no anti-reflective coating is applied in the present invention. FIG. 25 (b) And the ratio of the thickness (d) to the luminous intensity.

Therefore, it can be seen that the thickness d of the center region of the lens has a brightness improvement effect of 1.5 mm or more in the case of the anti-reflective coating and 2.0 mm or more in the absence of the anti-reflection coating. It can also be seen that the brightness of the high beam is improved to be higher than that of the low beam.

A unit having a light source module according to an embodiment may include a head lamp, a car light, a side mirror, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp Daytime running right, vehicle interior light, door scarf, rear combination lamp, and the like. For example, on the vehicle shown in Fig. 34, the light source unit can be applied to a lamp such as a turn signal lamp, such as a daytime running light, a back light, etc., to increase the center luminance.

The headlamp for a vehicle according to the embodiment may be provided with a support portion for the LED light source in the housing and may compensate the focus position according to the distance between the light emitting surfaces by using the lens of the light source module. Accordingly, the focal point at the filament position is intentionally moved to the lens so as to be moved adjacent to the LED light-emitting surface, thereby preventing a decrease in luminous intensity. For example, the light emitting unit of the light source module is disposed on the opposite side, for example, in the direction of 180 degrees. However, the present invention is applicable to the light emitting unit having the lens and the LED light source within the range of 90 to 270 degrees.

21 is a side sectional view showing an example of a light emitting device according to the embodiment.

21, a light emitting device includes a support substrate 310, a light emitting chip 340 disposed on the support substrate 310, a phosphor layer 360 disposed on the light emitting chip 340, And a bonding member 350 disposed on the upper surface S31 and the side surface S32 of the light emitting chip 340. The reflecting member 370 is disposed around the phosphor layer 360,

The supporting substrate 310 includes an insulating material, for example, a ceramic material. The ceramic material includes a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) which is co-fired. The material of the support substrate 10 may be a metal compound such as Al ₂ O ₃ or AlN and preferably may include aluminum nitride (AlN) or alumina (Al ₂ O ₃ ) Lt; RTI ID = 0.0 &gt; W / mK. &Lt; / RTI &gt;

As another example, the support substrate 310 may be made of a resin material such as a resin-based insulating material such as polyphthalamide (PPA). The support substrate 310 may be formed of a thermosetting resin including silicon, a modified silicone resin, an epoxy resin, a modified epoxy resin, or a plastic material, or a high heat-resistant, high-light-resistant material. As another example, the support substrate 310 may be optionally doped with an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide. The support substrate 310 may be made of, for example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an epoxy resin such as hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride 4- (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator in an epoxy resin, an ethylene glycol, a titanium oxide pigment, a glass fiber And a partially solidified curing reaction by heating to form a B-staged solid epoxy resin composition. However, the present invention is not limited thereto.

The supporting substrate 310 includes a plurality of lead electrodes 313 and 315 on an upper surface thereof and the plurality of lead electrodes 313 and 315 includes a first lead electrode 313 and a second lead electrode 315, for example. The first lead electrode 313 and the second lead electrode 315 may be electrically separated from each other and electrically connected to the light emitting chip 340. For example, the light emitting chip 340 may be electrically connected to the first and second lead electrodes 313 and 315 through bonding members 331 and 333. The bonding members 331 and 333 may include a conductive material such as a solder material for electrically connecting the light emitting chip 340 and the first and second lead electrodes 313 and 315. The side surfaces of the first lead electrode 313 and the second lead electrode 315 may be spaced apart from the upper surface of the supporting substrate 310.

The supporting substrate 10 may include a plurality of connection electrodes 317 and 319 and a plurality of lead frames 314 and 316 on a bottom surface thereof. The plurality of connection electrodes 317 and 319 may include at least one first connection electrode 317 connected to the first lead electrode 313 and at least one second connection electrode 319 connected to the second lead electrode 315, And the plurality of lead frames 314 and 316 include a first lead frame 314 connected to the first connection electrode 317 and a second lead frame 316 connected to the second connection electrode 319 can do. The first connection electrode 317 connects the first lead electrode 313 and the first lead frame 314 to each other and the second connection electrode 319 connects the second lead electrode 315 and the second lead electrode 314. [ And connects the second lead frame 316 to each other.

The first lead electrode 313, the second lead electrode 315, the first lead frame 314 and the second lead frame 316 may be formed of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver . Ag or aluminum (Ag) is formed on the surfaces of the first and second lead electrodes 313 and 315 to improve incident light reflection efficiency. A gold (Au) layer is formed on the first lead frame 314 and the second lead frame 316 to prevent corrosion by moisture and improve electrical reliability.

The first connection electrode 317 and the second connection electrode 319 may be formed of the same material as the first lead electrode 313, but the present invention is not limited thereto. The first lead electrode 313, the second lead electrode 315, the first lead frame 314 and the second lead frame 316 may be formed to have a thickness ranging from 50 μm to 100 μm, The electrical characteristics and thermal conduction characteristics may be deteriorated.

The light emitting chip 340 may be disposed on the first lead electrode 313 and the second lead electrode 315 in a flip chip manner. The light emitting chip 340 may be electrically connected to the first and second lead electrodes 313 and 315 by bonding members 331 and 333 made of a conductive material. The light emitting chip 340 includes a substrate 341, a light emitting structure 343 having a semiconductor layer, and a plurality of electrodes 331 and 333. The substrate 341 may include at least one of an insulating material, a semiconductor material, and a conductive material. At least one of sapphire (Al 2 O 3), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge and Ga 2 O 3 can be used as the substrate 341. Since the substrate 341 occupies most of the thickness of the light emitting chip 340, the substrate 341 may have a thickness of, for example, 30 탆 or more.

The light emitting structure 343 is disposed under the substrate 341 and includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The light emitting structure 343 emits a predetermined peak wavelength within a wavelength range from ultraviolet rays to visible rays. The plurality of electrodes 331 and 333 may correspond to or be electrically connected to the first and second lead electrodes 313 and 315 of the support substrate 310. One of the plurality of electrodes 331 and 333 may be electrically connected to the n-type semiconductor layer and may be connected to the first lead electrode 313 through a bonding member 331 and the other electrode 333 may be connected to the p- Layer and may be connected to the second lead electrode 315 by a bonding member 333. [

The light emitting chip 340 is a light source and selectively emits light in a wavelength band from ultraviolet to visible light. The light emitting chip 340 may include at least one of a UV LED chip, a green LED chip, a block LED chip, a red LED chip, or a white LED chip. The light emitting chip 340 may have a thickness of 30 탆 or more, for example, 30 탆 to 180 탆. The light-emitting chip 340 may have a top-view shape of a polygonal shape, for example, a regular square or a rectangular shape.

A phosphor layer 360 may be disposed on the light emitting chip 340. The phosphor layer 360 may have a larger area than a top surface area of the light emitting chip 340, that is, a bottom surface area. The outer surface of the phosphor layer 360 may protrude outward beyond the side surface S32 of the light emitting chip 340. [ Since the outer surface of the phosphor layer 360 protrudes outward beyond the upper surface S31 of the light emitting chip 340, the light emitted from the upper region of the light emitting chip 340 can also be received. The phosphor layer 360 absorbs a part of the light emitted from the upper surface S31 and the side surface S32 of the light emitting chip 340 and converts the light into light having a different wavelength. The phosphor layer 360 converts the wavelength of light incident through the bonding member 350. The phosphor layer 360 may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. For example, the phosphor may be at least one selected from the group consisting of Eu, Based phosphor, an oxynitride-based phosphor, a cyanogen-based phosphor mainly activated by a lanthanoid element such as Ce, a lanthanide-based phosphor such as Eu, an alkaline earth halide apatite phosphor mainly activated by a transition metal- , Alkaline earth metal borate halogen phosphors, alkaline earth metal aluminate phosphors, alkaline earth silicates, alkaline earth sulfides, alkaline earth thiogallates, alkaline earth silicon nitrides, germanium salts or lanthanoids such as Ce Of rare earth aluminates, rare earth silicates or lanthanoids such as Eu It may be equal to or greater than at least any one selected from organic and organic complexes mainly activated and the like. As a specific example, the above-mentioned phosphors can be used, but the present invention is not limited thereto.

The light emitted from the phosphor layer 360 and the light emitted from the light emitting chip 340 may be mixed with white light. The white light may have a color temperature of at least one of Warm white, Cool white, or Neutral white.

The reflective member 370 may be disposed on the support substrate 310 and may be disposed around the light emitting chip 340. The reflective member 370 may be in contact with the upper surface of the support substrate 310 and the surface of the plurality of lead electrodes 313 and 315.

The reflective member 370 may be in non-contact with a part or the entire area of the side surface S32 of the light emitting chip 340. [ An adhesive member 350 may be disposed between the reflective member 370 and the side surface S32 of the light emitting chip 340. [ The reflective member 370 reflects light emitted to the side surface S32 of the light emitting chip 340 and is reflected toward the phosphor layer 360, for example. The interface between the reflective member 370 and the adhesive member 350 may be curved or inclined. The light incident on the interface having such a curved surface or an inclined surface can be pre-reflected.

The reflective member 370 may be disposed around the light emitting chip 340 and the phosphor layer 360. The reflective member 370 may be in contact with or not in contact with the outer surface of the phosphor layer 360. For example, when the adhesive member 350 is disposed on the outer surface of the phosphor layer 360, May be in non-contact with the outer surface of the phosphor layer 360. The reflective member 370 may reflect light emitted through the outer surface of the phosphor layer 360.

The height of the upper surface of the reflective member 370 may be lower than the height of the upper surface of the phosphor layer 360. A problem that a part of the reflective member 370 penetrates into the upper surface of the phosphor layer 360 in the manufacturing process when the upper surface of the reflective member 370 is arranged to be equal to or higher than the upper surface of the phosphor layer 360 Lt; / RTI &gt; When the reflective member 370 is disposed at the same height as or higher than the upper surface of the phosphor layer 360, the directivity angle may be narrowed.

The reflective member 370 is doped with a metal oxide in a resin material. The resin material includes silicon or epoxy, and the metal oxide is a material having a refractive index higher than that of the resin material, and includes at least one of Al2O3, TIO2, and SiO2. The metal oxide is formed in the reflective member 70 in a range of 5 wt% or more, for example, 5 to 30 wt%. The reflective member 370 may have a reflectance of 90% or more with respect to the light emitted from the light emitting chip 340.

The adhesive member 350 may be disposed on the surface of the light emitting chip 340. The bonding member 350 includes a first bonding portion 351 disposed on the upper surface S31 of the light emitting chip 340 and a second bonding portion 353 disposed on the side surface S32 of the light emitting chip 340 And the first and second adhesive portions 351 and 353 may be connected to each other. The first bonding portion 351 is disposed between the light emitting chip 340 and the phosphor layer 360 and the phosphor layer 360 is bonded to the upper surface S31 of the substrate 341 of the light emitting chip 340 give.

The second adhesive portion 353 of the adhesive member 350 may be formed of a curved surface R21 having an outer surface or a boundary surface with the reflective member 370 having a predetermined curvature so as to pre- .

Another example of the light emitting device according to the embodiment will be described with reference to FIG.

Referring to FIG. 22, the light emitting device 200 includes a light emitting chip 200A. The light emitting device 200 may include a light emitting chip 200A and a phosphor layer 250 disposed on the light emitting chip 200A. The phosphor layer 250 includes at least one or more of blue, green, yellow, and red phosphors, and may be a single layer or a multi-layer structure. A phosphor is added to the phosphor layer 250 in the light transmitting resin material. The light transmitting resin material may include a material such as silicon or epoxy, and the phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride materials.

The phosphor layer 250 may be disposed on the upper surface of the light emitting chip 200A or on the upper surface and the side surface of the light emitting chip 200A. The phosphor layer 250 may be disposed on a surface of the light emitting chip 200A where the light is emitted to change the wavelength of the light. The phosphor layer 250 may include a single layer or a different phosphor layer, and the different layers may have at least one phosphor selected from the group consisting of red, yellow and green phosphors, And may have a phosphor different from the first layer of the red, yellow, and green phosphors formed on the first layer. As another example, the different phosphor layers may include three or more phosphor layers, but the present invention is not limited thereto. As another example, the phosphor layer 250 may include a film type. Since the film type phosphor layer has a uniform thickness, the color distribution due to the wavelength conversion can be uniform.

In the light emitting chip 200A, the light emitting chip 200A includes a light emitting structure 225 and a plurality of pads 245 and 247. The light emitting structure 225 may be formed of a compound semiconductor layer of a group II to VI element, for example, a compound semiconductor layer of a group III-V element, or a compound semiconductor layer of a group II-VII element. The plurality of pads 245 and 247 are selectively connected to the semiconductor layer of the light emitting structure 225 to supply power.

The light emitting structure 225 includes a first conductive semiconductor layer 222, an active layer 223, and a second conductive semiconductor layer 224. The light emitting chip 200A may include a substrate 221. The substrate 221 is disposed on the light emitting structure 225. The substrate 221 may be, for example, a light-transmitting substrate, an insulating substrate, or a conductive substrate.

The first conductive semiconductor layer 222 may be formed of a semiconductor doped with a first conductive dopant, for example, an n-type semiconductor layer. The first conductive semiconductor layer 222 includes a composition formula of In _x Al _y Ga _{1 -x- y} N (0? X? 1, 0? _Y? 1, 0? _X + y? The first conductive semiconductor layer 115 may be a compound semiconductor of Group III-V elements such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, . The first conductive dopant is an n-type dopant and includes dopants such as Si, Ge, Sn, Se, and Te. The active layer 223 is disposed below the first conductive semiconductor layer 222 and selectively includes a single quantum well, a multiple quantum well (MQW), a quantum wire structure, or a quantum dot structure. And includes the well layer and the period of the barrier layer. InGaN / AlGaN, InGaN / InGaN, InGaN / InGaN, AlGaAs / GaA, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InGaN / AlGaN, AlGaN / AlGaN, / RTI &gt; pair of &lt; / RTI &gt; The second conductive semiconductor layer 224 is disposed under the active layer 223. The second conductive semiconductor layer 119 may be formed of a semiconductor doped with a second conductive dopant such as In _x Al _y Ga _{1 -x- y} N (0? X? 1, 0? _Y ? 1, y? 1). The second conductive semiconductor layer 119 may include at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP. The second conductive semiconductor layer 119 may be a p-type semiconductor layer, and the first conductive dopant may include Mg, Zn, Ca, Sr, and Ba as p-type dopants. The first conductive semiconductor layer 222 may be a p-type semiconductor layer, and the second conductive semiconductor layer 224 may be an n-type semiconductor layer. A third conductive type semiconductor layer having a polarity opposite to the second conductive type may be formed on the second conductive type semiconductor layer 224. Also, the light emitting structure 225 may have any one of an np junction structure, a pn junction structure, an npn junction structure, and a pnp junction structure.

The light emitting chip 200A has pads 245 and 247 disposed thereunder and the pads 245 and 247 include first and second pads 245 and 247. The first and second pads 245 and 247 are spaced apart from each other below the light emitting chip 200A. The first pad 245 is electrically connected to the first conductive semiconductor layer 222 and the second pad 247 is electrically connected to the second conductive semiconductor layer 224. [ The first and second pads 245 and 247 may have a polygonal or circular bottom shape or correspond to the shapes of the first and second lead electrodes 215 and 217 of the circuit board 200. The bottom surface area of each of the first and second pads 245 and 247 may be, for example, a size corresponding to the top surface size of each of the first and second lead electrodes 215 and 217.

The light emitting chip 200A may include at least one of a buffer layer (not shown) and an undoped semiconductor layer (not shown) between the substrate 221 and the light emitting structure 225. The buffer layer is a layer for relaxing the difference in lattice constant between the substrate 221 and the semiconductor layer, and may be selectively formed from Group II to VI compound semiconductors. An undoped Group III-V compound semiconductor layer may be further formed under the buffer layer, but the present invention is not limited thereto. The substrate 221 can be removed. When the substrate 221 is removed, the phosphor layer 250 may contact the upper surface of the first conductive type semiconductor layer 222 or the upper surface of another semiconductor layer.

The light emitting chip 200A includes first and second electrode layers 241 and 242, a third electrode layer 243, and insulating layers 231 and 233. Each of the first and second electrode layers 241 and 242 may be formed as a single layer or a multilayer, and may function as a current diffusion layer. The first and second electrode layers 241 and 242 include a first electrode layer 241 disposed under the light emitting structure 225; And a second electrode layer 242 disposed under the first electrode layer 241. The first electrode layer 241 diffuses a current, and the second electrode layer 241 reflects incident light.

The first and second electrode layers 241 and 242 may be formed of different materials. The first electrode layer 241 may be formed of a light-transmitting material, for example, a metal oxide or a metal nitride. The first electrode layer may include at least one of indium tin oxide (ITO), indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZO) indium gallium zinc oxide, indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and gallium zinc oxide (GZO). The second electrode layer 242 may contact the lower surface of the first electrode layer 241 and function as a reflective electrode layer. The second electrode layer 242 includes a metal such as Ag, Au, or Al. The second electrode layer 242 may partially contact the lower surface of the light emitting structure 225 when the first electrode layer 241 is partially removed. As another example, the structures of the first and second electrode layers 241 and 242 may be stacked in an omni directional reflector layer (ODR) structure. The omnidirectional reflection structure may have a stacked structure of a first electrode layer 241 having a low refractive index and a second electrode layer 242 made of a highly reflective metal material in contact with the first electrode layer 241. The electrode layers 241 and 242 may have a laminated structure of, for example, ITO / Ag. The total reflection angle at the interface between the first electrode layer 241 and the second electrode layer 242 can be improved.

As another example, the second electrode layer 242 may be removed and formed of a reflective layer of another material. The reflective layer is a distributed Bragg reflection: can be formed of (distributed bragg reflector DBR) structure, and the distributed Bragg reflection structure to each other comprises a structure du dielectric layers are arranged alternately having different refractive indices, e.g., SiO ₂ layer , A Si ₃ N ₄ layer, a TiO ₂ layer, an Al ₂ O ₃ layer, and a MgO layer, respectively. As another example, the electrode layers 241 and 242 may include both a distributed Bragg reflection structure and an omni-directional reflection structure, and in this case, the light emitting chip 200A having a light reflectance of 98% or more can be provided. Since the light emitted from the second electrode layer 242 is emitted through the substrate 221, the light emitting chip 200A mounted in the flip-type can emit most of the light in the vertical direction. The light emitted to the side of the light emitting chip 200A may be reflected by the reflective sheet 600 to the incident surface area of the optical lens.

The third electrode layer 243 is disposed under the second electrode layer 242 and is electrically insulated from the first and second electrode layers 241 and 242. The third electrode layer 243 may be formed of a metal such as titanium, copper, nickel, gold, chromium, tantalum, platinum, tin, ), Silver (Ag), and phosphorus (P). A first pad 245 and a second pad 247 are disposed under the third electrode layer 243. The insulating layers 231 and 233 prevent unnecessary contact between the first and second electrode layers 241 and 242, the third electrode layer 243, the first and second pads 245 and 247, and the light emitting structure 225. The insulating layers 231 and 233 include first and second insulating layers 231 and 233. The first insulating layer 231 is disposed between the third electrode layer 243 and the second electrode layer 242. The second insulating layer 233 is disposed between the third electrode layer 243 and the second half pads 245 and 247. The first and second pads 245 and 247 may include the same material as the first and second lead electrodes 215 and 217.

The third electrode layer 243 is connected to the first conductive semiconductor layer 222. The connection part 244 of the third electrode layer 243 protrudes in a via structure through the first and second electrode layers 241 and 242 and the lower part of the light emitting structure 225 and contacts the first conductivity type semiconductor layer 222 do. The connection portions 244 may be arranged in a plurality. A portion 232 of the first insulating layer 231 extends around the connecting portion 244 of the third electrode layer 243 to form the third electrode layer 243 and the first and second electrode layers 241 and 242, Type semiconductor layer 224 and the active layer 223. An insulating layer may be disposed on the side surface of the light emitting structure 225 to protect the side surface of the light emitting structure 225. The present invention is not limited thereto.

The second pad 247 is disposed below the second insulating layer 233 and contacts the at least one of the first and second electrode layers 241 and 242 through an open region of the second insulating layer 233 Or connected. The first pad 245 is disposed below the second insulating layer 233 and is connected to the third electrode layer 243 through an open region of the second insulating layer 233. [ The protrusion 248 of the first pad 247 is electrically connected to the second conductive semiconductor layer 224 through the first and second electrode layers 241 and 242 and the protrusion 246 of the second pad 245 Is electrically connected to the first conductive type semiconductor layer 222 through the third electrode layer 243.

The first and second pads 245 and 247 are spaced apart from each other at a lower portion of the light emitting chip 200A and face the first and second lead electrodes 215 and 217 of the circuit board 200, respectively. The first and second pads 245 and 247 may include polygonal recesses 271 and 273 and the recesses 271 and 273 are formed to be convex in the direction of the light emitting structure 225. The recesses 271 and 273 may be formed to have a depth equal to or smaller than the thickness of the first and second pads 245 and 247. The depths of the recesses 271 and 273 may be different from the depths of the first and second pads 245 and 247, Can be increased.

The bonding members 255 and 257 are disposed in a region between the first pad 245 and the first lead electrode 215 and a region between the second pad 247 and the second lead electrode 217. The bonding members 255 and 257 may include an electrically conductive material, and a portion thereof may be disposed in the recesses 271 and 273. The bonding area between the bonding members 255 and 257 and the first and second pads 245 and 247 can be increased because the bonding members 255 and 257 are disposed in the recesses 271 and 273, have. Accordingly, the first and second pads 245 and 247 are bonded to the first and second lead electrodes 215 and 217, thereby improving the electrical reliability and heat dissipation efficiency of the light emitting chip 200A.

The joining members 255 and 257 may include a solder paste material. The solder paste material includes at least one of Au, Sn, Pb, Cu, Bi, In, and Ag. Since the bonding members 255 and 257 conduct the heat directly to the circuit board 200, the heat conduction efficiency can be improved as compared with the structure using the package. Also, since the bonding members 255 and 257 are materials having a small difference in thermal expansion coefficient from the first and second pads 245 and 247 of the light emitting chip 200A, the thermal conduction efficiency can be improved.

As another example, the bonding members 255 and 257 may include a conductive film, and the conductive film includes at least one conductive particle in the insulating film. The conductive particles may include at least one of, for example, a metal, a metal alloy, and carbon. The conductive particles may include at least one of nickel, silver, gold, aluminum, chromium, copper, and carbon. The conductive film may include an anisotropic conductive film or an anisotropic conductive adhesive.

Between the light emitting chip 200A and the circuit board 200, an adhesive member, for example, a thermally conductive film may be included. The thermally conductive film may be a polyester resin such as polyethylene terephthalate, polybutylene terephthalide, polyethylene naphthalate and polybutylene naphthalate; Polyimide resin; Acrylic resin; Styrenic resins such as polystyrene and acrylonitrile-styrene; Polycarbonate resin; Polylactic acid resin; Polyurethane resin; Etc. may be used. Further, polyolefin resins such as polyethylene, polypropylene and ethylene-propylene copolymer; Vinyl resins such as polyvinyl chloride and polyvinylidene chloride; Polyamide resins; Sulfonic resin; Polyether-ether ketone resin; Allylate series resin; Or a blend of the resins.

The light emitting chip 200A emits light through the surface of the circuit board and the side surface and the upper surface of the light emitting structure 225, thereby improving light extraction efficiency. The light emitting chip 200A can be directly bonded onto such a circuit board, so that the process can be simplified. Further, since the heat dissipation of the light emitting chip 200A is improved, the light emitting chip 200A can be advantageously utilized in an illumination field or the like.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: Light source module
20:
21: Base portion
23:
25,26: recess
30, 40:
31, 41: circuit board
32, 33, 42,
36,46: reflective cup
39, 49: Lens
92: Housing
95: Cavity
101,90: Head lamp

Claims (11)

A main body including a base portion and a support portion protruding from the base portion in a first direction and having first and second recesses in different regions;
A first light emitting portion disposed in a first recess of the main body; And
And a second light emitting portion disposed in a second recess of the body,
The first recess includes a first bottom portion, first and second side surfaces inclined to both sides of the first bottom portion in the first direction, and first and second side walls on both sides of the first bottom portion in the second direction,
The second recess includes a second bottom portion, third and fourth side surfaces inclined to both sides in the first direction of the second bottom portion, and third and fourth side walls on both sides of the first bottom portion in the second direction,
The first light emitting portion includes a first circuit substrate on a first bottom portion of the first recess, first and second light emitting elements on the first circuit substrate, and a first lens on the first and second light emitting elements, ,
The second light emitting portion includes a second circuit substrate on a second bottom portion of the second recess, a third and fourth light emitting elements on the second circuit substrate, and a second lens on the third and fourth light emitting elements, ,
Wherein the first and second lenses have a thickness of a center region overlapped with the first to fourth light emitting elements, the thickness of which is thicker than the thickness of the edge region adjacent to the first to fourth sidewalls. The light source module according to claim 1, wherein the first and second lenses have a curved surface with an outer curved surface in a second direction and a curved inner surface with a concave surface in a third direction. The light source module according to claim 2, wherein the first and second lenses have a constant thickness in a first direction and extend on the first to fourth sides. 4. The apparatus according to any one of claims 1 to 3, wherein the first and second bottom portions have a lower depth than the first to fourth side walls,
Wherein a distance between the first and second bottom portions of the first and second circuit boards is smaller than a sum of thicknesses of the first and second circuit boards. The light emitting device according to any one of claims 1 to 3, wherein at least one of the first and second light emitting devices is disposed in a plurality of directions in the first direction,
At least one of the third and fourth light emitting devices is disposed in a plurality of directions in the first direction,
Wherein the first light emitting portion includes a first reflective cup surrounding a lower region of the second light emitting element,
And the second light emitting portion includes a second reflective cup surrounding the lower region of the fourth light emitting element. The light source module according to any one of claims 1 to 3, wherein the first and second bottom portions are disposed on opposite sides with respect to a first direction. The light source module according to claim 6, wherein a thickness of an outer portion of the first and second recesses is equal to or smaller than an interval between the light emitting surfaces of the first and third light emitting devices. [3] The light source module of claim 2, wherein at least one of the inner curved surface and the outer curved surface comprises an anti-reflective material. The light source module according to any one of claims 1 to 3, wherein the outer curved surface of the first and second lenses is disposed on the same surface as the surface of the support portion of the main body or on the surface of the support portion. A housing having a cavity open in a first direction and having a concave inner surface;
A main body on the bottom of the cavity of the housing and a support portion protruding in the first direction from the base portion and having first and second recesses in directions opposite to each other;
A first light emitting portion disposed in a first recess of the main body; And
And a second light emitting portion disposed in a second recess of the body,
The first recess includes a first bottom portion, first and second side surfaces inclined to both sides of the first bottom portion in the first direction, and first and second side walls on both sides of the first bottom portion in the second direction,
The second recess includes a second bottom portion, third and fourth side surfaces inclined to both sides in the first direction of the second bottom portion, and third and fourth side walls on both sides of the first bottom portion in the second direction,
The first light emitting portion includes a first circuit substrate on a first bottom portion of the first recess, first and second light emitting elements on the first circuit substrate, and a first lens on the first and second light emitting elements, ,
The second light emitting portion includes a second circuit substrate on a second bottom portion of the second recess, a third and fourth light emitting elements on the second circuit substrate, and a second lens on the third and fourth light emitting elements, ,
Wherein the first and second lenses have a thickness of a center region overlapped with the first to fourth light emitting elements to be thicker than a thickness of an edge region adjacent to the first to fourth sidewalls,
Wherein the first and second lenses have curved surfaces whose outer curved surfaces are convex in the second direction and curved surfaces whose inner curved surfaces in the third direction are concave. 11. The lens of claim 10, wherein the first and second lenses have a constant thickness in the first direction and extend on the first to fourth sides,
The first and second bottom portions have lower depths than the first to fourth sidewalls,
Wherein a distance between the first and second bottom portions of the first and second circuit boards is smaller than a sum of thicknesses of the first and second circuit boards,
Wherein the focus position of the inner surface of the housing passing through the first and second lenses is different.

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