KR20180104649A - A method of manufacturing a light receiving module and a light receiving module - Google Patents

Abstract

The light receiving module includes a substrate 20, a semiconductor light receiving element 10 electrically connected to the electrode portion of the substrate 20 through the bump 51, and a semiconductor light receiving element (not shown) provided on the first surface 21 side of the substrate 10 and a second resin part 40 provided on the second surface 22 side of the substrate and covering the entire second surface. The semiconductor photodetector element 10 is arranged so that the photodetection area 12a faces the through hole 26. [ The substrate has flange portions (20a, 20b) projecting from the first resin portion (30) in the first direction. The second resin portion has a protruding portion 46 projecting into the through hole 26 of the substrate and the protruding portion 46 covers the photodetecting region 12a of the semiconductor light receiving element 10.

Description

A method of manufacturing a light receiving module and a light receiving module

The present disclosure relates to a light receiving module and a method of manufacturing the light receiving module.

2. Description of the Related Art A semiconductor device in which a light receiving element is mounted on a wiring board is known. In the devices described in Patent Documents 1 and 2, the light receiving element is mounted on the substrate by the flip chip method. That is, a bump is provided between the substrate and the light receiving element, and the light receiving element is connected to the electrode terminal or the wiring pattern of the substrate by the bump. The light receiving element is sealed by a resin.

In the apparatus described in Patent Document 1, a through hole is provided in the substrate, and the light receiving surface of the light receiving element is opposed to the through hole. A sealing resin is filled in a gap portion between the light receiving element and the substrate to form a thin sealing resin layer. After the curing of the sealing resin layer is completed, a portion other than the light-receiving surface of the light-receiving element is sealed with a resin, and a second sealing resin layer is formed. In manufacturing the apparatus, a plurality of light receiving elements are provided on a substrate, and a sealing resin layer is formed on such a light receiving element, followed by cutting / separating along the dicing line, thereby obtaining a plurality of semiconductor devices.

In the apparatus described in Patent Document 2, a semiconductor element is mounted on a substrate such that the light sensitive portion of the surface of the semiconductor element is opposed to the substrate. The semiconductor element is molded by resin. A light-transmissive window is provided at a portion of the substrate facing the light-sensitive portion. As this transparent window, a quartz glass plate, resin, or the like is used.

Patent Document 1: Japanese Patent Application Laid-Open No. 2008-226895 Patent Document 2: Japanese Unexamined Patent Publication No. 62-84937

In the apparatuses described in Patent Documents 1 and 2, the light-receiving surface of the light-receiving element is opposed to the through-hole or the transparent window of the substrate, so that light enters through the through-hole or the window. In this case, since the light is incident in accordance with the size of the through hole or the window, as a result, the aperture ratio according to their sizes is obtained. However, further improvement of the aperture ratio is difficult.

The present disclosure describes a light receiving module and a method of manufacturing a light receiving module capable of increasing the light receiving sensitivity by improving the aperture ratio.

A light receiving module according to an aspect of the present disclosure includes a first surface, a second surface opposite to the first surface, an electrode portion provided on the first surface, and an end surface connecting the first surface and the second surface. And electrically connected to the electrode portion of the substrate through a bump provided between the first surface and the first surface of the substrate, the substrate having a terminal portion electrically connected to the electrode portion, An underfill filled in the periphery of the bump as a gap between the semiconductor light-receiving element and the first surface of the substrate; a semiconductor light-receiving element provided on the first surface side of the substrate to seal the semiconductor light- And a second resin part provided on the second surface side of the substrate and covering the entire second surface and optically transparent to light of a predetermined wavelength, In the thickness direction And the semiconductor light receiving element is arranged so that the light detecting area of the semiconductor light receiving element faces the through hole and the length of the substrate in the first direction orthogonal to the thickness direction is equal to the length of the substrate in the first direction And the flange portion includes a cross section in which the exposed portion and the terminal portion of the first surface are provided, and the second resin portion has a flange portion projecting in the first direction from the first resin portion, And a protrusion protruding into the through-hole of the substrate, the protrusion covering the photodetecting area of the semiconductor photodetector.

According to this light receiving module, the semiconductor light receiving element is provided on the first surface of the substrate through the bumps. This flip-chip mounting can avoid the problem of disconnection and the like compared with the case of using a wire, so that high reliability can be realized. The substrate has a flange portion projecting from the first resin portion. When the light receiving module is mounted, a hole or the like is provided on the mounting board, and the first resin portion is inserted into the hole portion. By mounting the flange portion on the mounting substrate, the light receiving module can be easily mounted on the mounting substrate. The second resin part provided on the second surface side of the substrate is optically transparent to light of a predetermined wavelength. In the second resin part, when light is incident from the exposed surface on the opposite side of the surface covering the substrate, the refractive index of the second resin part is larger than the refractive index of air, so that light is diffused in the second resin part, It is trapped inside the resin part. That is, the light directly incident on the through hole of the substrate from the exposed surface is incident on the light detecting region of the semiconductor light receiving element, but the other light is reflected on the second surface of the substrate or the exposed surface of the second resin portion , And enters the light detection area through the through hole. Since the second resin part covers the entire second surface of the substrate, the exposed surface is also large, and thus the light receiving range is wide. And the second resin part can make the light entering the wide range enter the light detecting area through the through hole. The aperture ratio is improved in the light receiving module compared to the conventional light receiving module which is limited to the aperture ratio according to the size of the through hole. In addition, the protrusion of the second resin part protrudes into the through-hole, and further covers the light-detecting area. As a result, light in the second resin portion can be reliably guided not only to the through hole but also to the light detection area. As a result, the light receiving sensitivity can be increased. Since the semiconductor light-receiving element is sealed by the first resin part having light-shielding properties, incident light other than light passing through the through-hole can be cut off. Therefore, noise is reduced. By reducing the noise, the S / N ratio with respect to the light receiving sensitivity is improved.

In some aspects, the length of the second resin portion in the first direction is equal to the length of the substrate in the first direction, and the cross section of the second resin portion in the first direction is the length And is continuous on the same plane as the cross section of the substrate. In this case, light incident in a wide range in the first direction can be made incident on the light detecting area, and the light receiving sensitivity can be further increased.

In some aspects, the length of the second resin portion in the thickness direction and the second direction orthogonal to both the first direction is the same as the length of the substrate in the second direction, and the length of the second resin portion in the second direction The cross section of the resin section is continuous on the same plane as the cross section of the substrate in the second direction. In this case, light incident in a wide range in the second direction can be made incident on the light detecting area, and the light receiving sensitivity can be further increased.

In some embodiments, the through-hole is tapered to be tapered from the second surface side toward the first surface side. In this case, light is easily incident on the light detecting area, and the light receiving sensitivity can be further increased.

In some embodiments, in the second resin portion, the exposed surface on the opposite side of the surface covering the second surface is in the form of a Fresnel lens. In this case, light incident from the exposed surface can easily be guided to the through hole, and the light collection efficiency is enhanced. Therefore, the light receiving sensitivity can be further increased.

In some embodiments, the second surface of the substrate is a reflective surface that reflects light of a predetermined wavelength. In this case, the light component in the interior of the second resin part can be increased, and the light confinement effect is further improved. Therefore, the light receiving sensitivity can be further increased.

A method of manufacturing a light receiving module according to an aspect of the present disclosure is a substrate having opposing first and second surfaces, wherein the first surface has a plurality of electrode portions and is electrically connected to the electrode portions, A step of preparing a substrate provided with a plurality of terminal portions extending in the thickness direction and provided with a plurality of through holes penetrating in the thickness direction, a step of forming a plurality of semiconductor photodetectors facing the first surface of the substrate, A step of providing a bump between the first surface and the semiconductor light receiving element and electrically connecting the semiconductor light receiving element to the electrode portion by bonding the semiconductor light receiving element, a step of forming a gap between the semiconductor light receiving element and the first surface of the substrate A step of forming an underfill filled in the periphery of the bump, a step of forming a first resin having a light shielding property with respect to light of a predetermined wavelength on the first surface side of the substrate A step of forming a first sealing resin portion by sealing the first surface and the semiconductor light receiving element using the first resin and the second sealing resin by using a second resin optically transparent to light of a predetermined wavelength on the second surface side of the substrate, A step of forming a second sealing resin part by sealing the entire surface of the first sealing resin part, a step of exposing a plurality of terminal parts while exposing a part of the first surface by removing a part of the first sealing resin part, And dicing each of the first line passing through the region where the first surface is not provided and the second line passing through the exposed portion of the first surface to separate the substrate, In the step of electrically connecting the elements, the semiconductor light-receiving element is disposed so that the light-detecting area of the semiconductor light-receiving element faces the through hole, and in the step of forming the second sealing resin part, To the inlet (流入) a second resin into the through-hole, and more cover the light detecting region of the semiconductor light-receiving element to the second resin.

According to this manufacturing method, high reliability can be realized by flip-chip type mounting using bumps in the same manner as the operation effect of the light receiving module. On the first surface side, the first surface and the semiconductor light-receiving element are sealed using a first resin having a light-shielding property, and then a part of the first sealing resin portion is removed to expose the first surface. By dicing into the second line passing through the exposed portion of the first surface, a flange portion protruding from the first resin portion (the first resin portion that is not removed) is formed on the substrate. According to this flange portion, the light receiving module can be easily mounted on the mounting board as in the above-described light receiving module. On the other hand, on the second surface side, the entire second surface is sealed using a second resin that is optically transparent to light of a predetermined wavelength. The second resin flows into the through hole and the second resin covers the light detecting area facing the through hole. Therefore, the aperture ratio is improved and the light receiving sensitivity is increased like the light receiving module described above. According to this manufacturing method, a light receiving module having high reliability and high light receiving sensitivity can be manufactured through a simple process and a small process.

In some aspects, in the step of preparing a substrate, a plurality of through holes are formed in a state in which a plurality of substrates are overlapped with each other by performing the same perforation for one perforation. In this case, the efficiency of the boring process of the substrate is enhanced.

According to some aspects of the present disclosure, the aperture ratio is improved, and as a result, the light receiving sensitivity can be increased.

1 is a perspective view showing a light receiving module according to an embodiment of the present disclosure;
Fig. 2 is a perspective view showing the light receiving module of Fig. 1 viewed from the bottom side. Fig.
3 is a cross-sectional view taken along line III-III in FIG.
4 is a flowchart showing a manufacturing method of the light receiving module of Fig.
FIG. 5A is a perspective view showing an object to be processed in a step of the manufacturing method shown in FIG. 4, and FIG. 5B is a perspective view showing an object to be processed in a step following FIG. .
FIG. 6A is a perspective view showing an object to be processed in the process subsequent to FIG. 5B, and FIG. 6B is a cross-sectional view of the object to be processed in the process in FIG.
FIG. 7A is a perspective view showing the object to be processed in the process subsequent to FIG. 6A, and FIG. 7B is a sectional view of the object to be processed in the process in FIG.
Fig. 8A is a perspective view showing an object to be processed in the process subsequent to Fig. 7A, and Fig. 8B is a plan view showing an object to be processed in the process subsequent to Fig. 8A .
Fig. 9 is a perspective view showing the light-receiving module of Fig. 1 mounted on a mounting substrate; Fig.
FIG. 10 is a diagram for explaining an operation effect of the light receiving module of FIG. 1;
11 (a) is a perspective view showing a light receiving module according to a first modification, and Fig. 11 (b) is a perspective view showing a light receiving module according to a second modification.
Fig. 12 is a view for explaining an action effect of the light receiving module of Fig. 11 (b).

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

The light receiving module 1 according to the present embodiment will be described with reference to Figs. 1 to 3. Fig. The light receiving module 1 is, for example, a surface incident type light receiving module mounted on a small electronic device or the like. The light receiving module 1 receives and detects so-called front light. The electronic apparatus on which the light receiving module 1 is mounted is not particularly limited, and all kinds of electronic apparatuses can be mentioned. The light receiving module 1 may be mounted on, for example, a cellular phone or mounted on an automobile electronic device or the like. The light receiving module 1 has a generally rectangular parallelepiped shape. Regarding the dimensions of the light receiving module 1, for example, one side of the light receiving module 1 is about 1 to 10 mm. The dimensions of the light receiving module 1 can be arbitrarily set according to the use thereof.

The light receiving module 1 includes a semiconductor light receiving element 10 (see FIG. 3) for detecting light incident on the light receiving module 1 and a substrate 20 on which the semiconductor light receiving element 10 is mounted. 3, the semiconductor light-receiving element 10 is, for example, a rectangular chip and has a first surface 11 and a second surface 12 opposed to each other and four side surfaces 13). On the second surface 12, a photodetection area 12a is provided. That is, the second surface 12 is the light-receiving surface of the semiconductor light-receiving element 10. As the semiconductor photodetector 10, for example, a photodiode having a pn junction structure or the like can be used. The semiconductor light-receiving element 10 is not limited to the above structure, and may be a photodiode having a pin structure, for example.

As shown in Figs. 1 to 3, the substrate 20 is an insulating substrate having a rectangular plate shape. The substrate 20 includes a first surface 21 and a second surface 22 facing each other and a pair of first side surfaces 23a and 23b facing each other and a pair of second side surfaces 24a and 24b facing each other. . The first surface 21 and the opposite second surface 22 are parallel. The first side surfaces 23a and 23b connect the first surface 21 and the second surface 22 and oppose each other in the first direction orthogonal to the thickness direction of the substrate 20. [ The second side surfaces 24a and 24b connect the first surface 21 and the second surface 22 and face each other in the thickness direction of the substrate 20 and in the second direction orthogonal to both the first direction and the second direction have. Both the first side surfaces 23a and 23b and the second side surfaces 24a and 24b extend in a direction perpendicular to the first surface 21. In the following description, an XYZ orthogonal coordinate system is used for ease of explanation. The Z direction corresponds to the thickness direction of the substrate 20, the X direction corresponds to the above-mentioned first direction, and the Y direction corresponds to the above-mentioned second direction.

The substrate 20 is a wiring substrate, for example, a glass epoxy substrate. On the first surface 21 of the substrate 20, a predetermined wiring pattern is formed. The first surface 21 is provided with two electrode portions 28a and two electrode portions 28b (see FIG. 2) electrically connected to the wiring pattern. The electrode portion 28a and the electrode portion 28b are made of a conductive metal foil, for example, a copper foil. The copper foil may be plated with nickel and gold. In Fig. 3, the illustration of the electrode portion 28a and the electrode portion 28b is omitted. The substrate 20 may be a single-sided substrate having a wiring pattern formed on only the first surface 21 and a double-sided substrate having wiring patterns formed on the first and second surfaces 21 and 22.

Two terminal portions 27a electrically connected to the two electrode portions 28a are provided on the first side surface 23a which is one end surface in the X direction. The terminal portions 27a are arranged so as to be spaced apart from each other in the Y direction on the first side surface 23a. Two terminal portions 27b electrically connected to the two electrode portions 28b are provided on the first side surface 23b which is the other end surface in the X direction. The terminal portions 27b are arranged so as to be spaced apart from each other in the Y direction on the first side surface 23b.

The terminal portion 27a and the terminal portion 27b extend in the thickness direction of the substrate 20, that is, in the Z direction. The terminal portion 27a and the terminal portion 27b may be formed until reaching the second surface 22 from the first surface 21, respectively. The terminal portion 27a and the terminal portion 27b have a structure in which a semicircular tubular through hole is plated on the semicircular tubular through hole. The copper plating layer may be further plated with nickel and gold. A conductive resin material may be filled in the semi-cylindrical tubular terminal portion 27a and the terminal portion 27b, and such a resin material may not be filled, and the inside may be filled with a cavity. Further, in the case where the inside is hollow, an electrode section made of a metal foil may cover the end face of the cavity.

The terminal portion 27a and the terminal portion 27b are provided so as to connect the first surface 21 and the second surface 22 and the second surface 22 is provided with a plurality of Is provided. In this case, a plurality of electrode portions similar to the electrode portion 28a and the electrode portion 28b may be provided on the second surface 22.

The two terminal portions 27a and the two electrode portions 28a and the two terminal portions 27b and the two electrode portions 28b are parallel to the first side surface 23a and the first side surface 23b Also, the plane is symmetrical with respect to the virtual plane (vertical bisector) located at the middle of these sides. The virtual plane in this case is a plane perpendicular to the X direction, that is, a plane parallel to the YZ plane. In the light receiving module 1, a plurality of terminal portions (i.e., a plurality of electrode portions) are provided symmetrically. The plurality of terminal portions may be provided asymmetrically with respect to the virtual plane.

The second surface 22 of the substrate 20 is a reflecting surface that reflects light of a predetermined wavelength. The second surface 22 may be, for example, a reflecting surface that reflects infrared light. In order to make the second surface 22 a reflective surface, a substrate 20 made of a material having a high reflectance of light may be used. As the substrate 20, a high reflection glass epoxy substrate may be used. As the substrate 20, for example, a so-called white substrate, an ivory substrate, or the like may be used. The second surface 22 of the substrate 20 may be polished in addition to forming the reflective surface by the material of the substrate 20. [ For example, the second surface 22 may be a gold-plated surface. A white reflective film may be formed on the second surface 22. As described above, since the second surface 22 is a reflecting surface, the light component in the second resin part 40 to be described later can be increased.

As shown in Figs. 1 and 3, the substrate 20 is provided with a through hole 26 penetrating the substrate 20 in the thickness direction, i.e., the Z direction. The substrate 20 has a columnar shape and is provided at the center of the substrate 20. That is, in the through hole 26, the circular opening on the side of the first surface 21 and the circular opening on the side of the second surface 22 have the same size (i.e., diameter). The through hole 26 is formed such that the central axis of the through hole 26 is along the Z direction. In other words, the through hole 26 extends in a direction perpendicular to the first surface 21 and the second surface 22. [ The through hole 26 serves as an incident path of light to the light detection region 12a of the semiconductor photodetector element 10 in cooperation with the second resin portion 40 described later.

3, the semiconductor light-receiving element 10 is mounted on the first surface 21 of the substrate 20 through a plurality of bumps 51. The semiconductor light- More specifically, the semiconductor light-receiving element 10 is provided so that the second surface 12 of the semiconductor light-receiving element 10 faces the first surface 21. A plurality of bumps 51 are provided between the first surface 21 and the second surface 12 so as to be arranged around the through hole 26. The bumps 51 are made of a conductive material such as gold. The bump 51 electrically connects the semiconductor light receiving element 10 to the electrode portions 28a and 28b of the substrate 20. [ As described above, the semiconductor light-receiving element 10 is flip-chip mounted on the substrate 20. In other words, the semiconductor light-receiving element 10 is bonded to the substrate 20 wirelessly. By the flip chip mounting, the light receiving module 1 is thinned, and high reliability and durability are improved.

The semiconductor photodetector element 10 is arranged so that the photodetection area 12a faces the through hole 26. [ When viewed in the Z direction, the photodetecting area 12a and the through hole 26 are approximately the same size, and the respective areas may overlap. The through hole 26 may be larger than the light detecting area 12a.

A gap is formed between the second surface 12 of the semiconductor photodetector element 10 and the first surface 21 of the substrate 20 by providing the bumps 51. [ The gap is filled with an underfill 52. The underfill 52 is, for example, a curable resin mainly containing an epoxy resin or the like. The underfill 52 is filled around the bump 51 to seal and fix the semiconductor light-receiving element 10 and the bump 51.

The underfill 52 fills the gap between the second surface 12 and the first surface 21 at the time of filling the underfill 52 as shown in Figure 6B, The outer peripheral portion 52b of the semiconductor light receiving element 10 may be slightly out of the side surface 13 of the semiconductor light receiving element 10 (see also Fig. On the other hand, the inner peripheral portion 52a of the underfill 52 does not enter the inner side (within the through hole 26) than the main wall surface 26a of the through hole 26, (52) is charged.

1 to 3, the light-receiving module 1 includes a light-shielding first resin portion 30 provided on the first surface 21 side of the substrate 20, And a second transparent resin part 40 provided on the side of the second transparent resin film 22. The first resin part 30 and the second resin part 40 are provided on both sides of the substrate 20 and are provided with a semiconductor light receiving element 10 and a substrate 20 (a part of the substrate 20) It is a sealed package. Hereinafter, each configuration of the first resin part 30 and the second resin part 40 will be described.

The first resin part 30 has a rectangular plate shape and seals the first surface 11 and the four side surfaces 13 of the semiconductor light receiving element 10. The first resin part 30 has a light shielding property against light of a predetermined wavelength. The first resin part 30 is formed of, for example, epoxy resin, silicone, or the like. As the first resin part 30, a so-called black resin is preferably used.

The first resin part 30 has a back surface 31 constituting the bottom surface of the light receiving module 1 and a surface 32 opposite to the back surface 31 and a pair of opposing first side surfaces 33a 33b And a pair of second side surfaces 34a, 34b facing each other. The opposite surfaces 31 and 32 are parallel. The first side surfaces 33a and 33b connect the back surface 31 and the surface 32 and face each other in the X direction. The second side surfaces 34a and 34b connect the back surface 31 and the surface 32 and face each other in the Y direction. The first side surfaces 33a and 33b and the second side surfaces 34a and 34b all extend in a direction perpendicular to the back surface 31. [

The second resin part 40 has a rectangular plate shape as a whole. The second resin portion 40 covers the entire second surface 22 of the substrate 20. The second resin part 40 is optically transparent to light of a predetermined wavelength. The second resin part 40 is, for example, a thermosetting resin, and is formed of epoxy resin, silicon, or the like. The refractive index of the second resin part 40 is larger than the refractive index of air. For example, the refractive index n of the second resin portion 40 formed of an epoxy resin is about 1.5. Further, the second resin part 40 may be formed of a photo-curable resin which is cured by irradiating light of a specific wavelength. The second resin part 40 may include a filler for diffusing light.

The second resin part 40 includes a back surface 41 covering the entire second surface 22 and a surface 42 opposite to the back surface 41 and a pair of opposed first surfaces 43a and 43b And a pair of opposing second side surfaces 44a, 44b. The opposite surface 41 and surface 42 are parallel. The first side surfaces 43a and 43b connect the back surface 41 and the surface 42 and face each other in the X direction. The second side surfaces 44a and 44b connect the back surface 41 and the surface 42 and face each other in the Y direction. The first side surfaces 43a and 43b and the second side surfaces 44a and 44b all extend in a direction perpendicular to the back surface 41. [

In the second resin part 40, the surface 42 constituting the upper surface (upper surface) of the light receiving module 1 is an exposed surface and functions as a light incident surface of the light receiving module 1. Particularly, the second resin portion 40 covering the whole of the second surface 22 has a surface 42 having a very large area as compared with the through hole 26, and the aperture ratio of the light receiving module 1 as a whole . Hereinafter, the positional relationship with respect to the substrate 20 with respect to the first resin part 30 and the second resin part 40 will be described in detail.

As shown in Figs. 2 and 3, the length of the substrate 20 in the X direction is larger than the length of the first resin portion 30 in the X direction. The first resin portion 30 is shorter than the substrate 20 in the X direction and exposes both ends of the substrate 20 in the X direction. More specifically, the first side faces 33a and 33b, which are the end faces of the first resin portion 30 in the X direction, are located in the X direction with respect to the first side faces 23a and 23b that are the end faces of the substrate 20 in the X direction And is located on the semiconductor light-receiving element 10 side (on the side surface 13 side). Thus, the first resin portion 30 does not cover the entire first surface 21 of the substrate 20.

On the other hand, the length of the substrate 20 in the Y direction is equal to the length of the first resin portion 30 in the Y direction. The first resin portion 30 covers the entire length of the substrate 20 in the Y direction. More specifically, the second side surfaces 34a and 34b, which are the end surfaces of the first resin portion 30 in the Y direction, are the second side surfaces 24a and 24b, which are the end surfaces of the substrate 20 in the Y direction, And are continuous on the same plane.

With the above arrangement, the substrate 20 has the flange portions 20a, 20b projecting in the X direction from the first resin portion 30. [ These flange portions 20a and 20b are formed in a plane symmetry with respect to the virtual plane. The flange portion 20a includes a rectangular exposed portion 21a of the first surface 21 and the first side surface 23a provided with the two terminal portions 27a. In the flat exposed portion 21a, two electrode portions 28a are provided. The flange portion 20b includes a rectangular exposed portion 21b of the first surface 21 and the first side surface 23b provided with the two terminal portions 27b. In the flat exposed portion 21b, two electrode portions 28b are provided. These flange portions 20a and 20b abut the reflow surface 91 and function as a stopper when the light receiving module 1 is mounted on the mounting board 90 (see Fig. 9).

As shown in Figs. 1 and 3, the length of the substrate 20 in the X direction is equal to the length of the second resin portion 40 in the X direction. The second resin portion 40 covers the entire length of the substrate 20 in the X direction. More specifically, the second side surfaces 44a and 44b, which are the end surfaces of the second resin portion 40 in the X direction, are formed on the second side surfaces 24a and 24b, which are the end surfaces of the substrate 20 in the X direction, And are continuous on the same plane.

The length of the substrate 20 in the Y direction is equal to the length of 40 in the Y direction. The second resin part 40 covers the entire length of the substrate 20 in the Y direction. More specifically, the second side surfaces 44a and 44b, which are the end surfaces of the second resin portion 40 in the Y direction, are the second side surfaces 24a and 24b, which are the end surfaces of the substrate 20 in the Y direction, And are continuous on the same plane.

The second resin portion 40 of the light receiving module 1 has the rectangular main body portion 45 covering the entire second surface 22. The second resin part 40 is provided at the center of the main body part 45 and further has a protruding part 46 protruding into the through hole 26 of the substrate 20. As shown in Fig. 3, the projecting portion 46 is provided continuously to the main body portion 45 and has a columnar shape. The projecting portion (46) projects further from the through hole (26). The protruding portion 46 penetrates the substrate 20 and reaches the second surface 12 of the semiconductor light receiving element 10. [ In other words, the circular distal end face 46a closely contacts the second face 12 to cover the light detecting area 12a. The distal end (lower end) of the protruding portion 46 is in close contact with the inner peripheral portion 52a of the underfill 52 (see Fig. 6 (b)).

Next, a manufacturing method of the light receiving module 1 will be described with reference to Figs. 4 to 8. Fig. In the following description, the objects to be treated 100A to 100E refer to the structures in the middle of the manufacturing method.

First, as shown in FIG. 5A, a substrate 200 such as a glass epoxy substrate is prepared and a through hole 26 is formed in the substrate 200 to obtain an object to be processed 100A (step S01; substrate preparation process). In this step S01, for example, a plurality of glass epoxy substrates subjected to predetermined patterning are prepared. A plurality of the same circumferential through holes 26 are formed for one drilling by performing drilling in a state in which these substrates 200 are superimposed. For the drilling process, for example, a known method using a drill or the like can be used. At this time, the substrate 200 is provided with a plurality of electrode portions on the first surface 21 and a plurality of terminal portions 201 extending in the Z direction from the first surface 21. The plurality of electrode portions correspond to the electrode portions 28a and 28b. The plural terminal portions 201 correspond to the terminal portions 27a and 27b. The plurality of terminal portions 201 connect the first surface 21 and the second surface 22. The terminal portion 201 has a cylindrical shape or a cylindrical shape.

In the workpiece 100A obtained in the step S01, the plurality of through holes 26 are arranged in the X direction and arranged in the Y direction, for example. The plurality of terminal portions 201 are arranged in, for example, the X direction and the Y direction. The line provided with the through hole 26 (the line passing through the center of the through hole 26) and the line provided with the terminal portion 201 (the line passing through the center of the terminal portion 201) do not overlap but are offset . The through hole 26 and the terminal portion 201 are provided so that the number of the through holes 26 and the terminal portion 201 is, for example, 1: 2. In the case of assuming four terminal portions 201 positioned at the vertexes of a rectangle, one through hole 26 is arranged on the intersection of two diagonal lines connecting them.

The substrate 200 on which the plurality of through holes 26 have been formed may be prepared. In this case, it is not necessary to perform drilling in step S01. In addition, in order to prepare for filling the underfill 52 in step S03, the underfill material may be adhered to the substrate 200 from the beginning with a film. A perforation process may be performed on the substrate 200 on which the film is adhered.

Then, the semiconductor light-receiving element 10 is bonded to the first surface 21 of the substrate 200 (step S02: bonding step of the semiconductor light-receiving element 10). In this step S02, the semiconductor light-receiving elements 10 are arranged so that the second surface 12 of the semiconductor light-receiving element 10 faces the first surface 21 and covers the respective through holes 26 5 (b)). At this time, the semiconductor photodetector element 10 is arranged so that the photodetection area 12a of the semiconductor photodetector element 10 faces the through hole 26. [ A plurality of bumps 51 are provided between the first surface 21 and the second surface 12 to perform die bonding and bump bonding (i.e., flip chip bonding). Thereby, the semiconductor light-receiving element 10 is electrically connected to the electrode portion. 5 to 8, in the manufacturing method of the present embodiment to which the flip chip mounting is applied, each step is performed in a state in which the substrate 200 is turned upside down.

Subsequently, the underfill 52 is filled in the gap between the subject body 100 and the first surface 21 of the substrate 200 to obtain the subject body 100B (step S03: underfill filling step). In this step S03, a liquid curable resin containing an epoxy resin or the like is introduced into the gap between the first surface 21 and the second surface 12 on the first surface 21. The underfill 52 is filled around the bump 51 to seal and fix the semiconductor light-receiving element 10 and the bump 51. As described above, the outer peripheral portion 52b of the underfill 52 is somewhat hollowed out from the side surface 13 all around the semiconductor light-receiving element 10 (see FIG. 5 (b)). The underfill 52 is filled so that the inner peripheral portion 52a of the underfill 52 does not enter the inner side (within the through hole 26) of the main wall surface 26a of the through hole 26.

When the first resin part 30 is moved in the gap and the through hole 26 is formed in the process of forming the first sealing resin part 60 in step S04 by filling the gap with the underfill 52 in this step S03, Is prevented. Since the inner peripheral portion 52a of the underfill 52 does not enter into the through hole 26 in the step of forming the second sealing resin portion 80 in step S05, The protrusions 46 are provided.

As described above, in step S01, the underfill material may be adhered to the substrate 200 as a film. If this method is employed, the filling step of step S03 can be omitted. As the underfill 52, an anisotropic conductive resin may be used.

Next, as shown in Figs. 6A and 6B, the first surface 21 of the substrate 20 is covered with the first resin having a light shielding property, And the semiconductor light-receiving element 10 are sealed to form a first sealing resin portion 60 to obtain a workpiece 100C (step S04; a step of forming the first sealing resin portion). In this step S04, a plate-like first sealing resin portion 60 is formed over the entire surface of the first surface 21. [ The first surface 61 of the first sealing resin portion 60 is formed on a flat surface parallel to the first surface 21. [ The second surface 62 of the first sealing resin portion 60 is formed by covering the first surface 11 and the side surface 13 of the semiconductor light receiving element 10 and the first surface 21 of the substrate 20 And is brought into close contact with these surfaces. The first sealing resin portion 60 is formed, for example, by filling a thermosetting resin in an uncured state in a mold or a dam frame, and then heating and curing the resin. Further, if the thermosetting resin does not flow out in an uncured state, it may be formed by applying and potting and then heating and curing without using a mold or the like. The first resin part 30 may be formed by filling a photocurable resin in an uncured state in a mold or a dam-shaped frame, and then irradiating light of a specific wavelength to cure it. If the photo-curable resin does not flow out in an uncured state, it may be formed by applying light or irradiating light of a specific wavelength after curing without application of a mold or the like.

The outer peripheral portion 52b of the underfill 52 is filled in the front periphery of the semiconductor light receiving element 10 in the step S03 so that the first sealing resin portion 60 is disposed between the semiconductor light receiving element 10 and the substrate 20 (See Fig. 6 (b)).

Subsequently, as shown in Figs. 7A and 7B, a second resin optically transparent to light of a predetermined wavelength is used on the second surface 22 side of the substrate 20 The entire surface of the second surface 22 is sealed to form the second sealing resin portion 80 to obtain the object to be treated 100D (step S05: step of forming the second sealing resin portion). In this step S05, the second sealing resin portion 80 is formed over the entire surface of the second surface 22. At this time, the second resin flows into the through hole 26 of the substrate 200, and the photodetecting area 12a of the semiconductor photodetector 10 is covered with the second resin. As a result, the protruding portions 46 that have entered all of the through holes 26 are formed so that the distal end face 46a of the protruding portion 46 reaches the photodetection region 12a. The second surface 82 of the second sealing resin portion 80 is formed on a flat surface parallel to the second surface 22. The first surface 81 of the second sealing resin part 80 covers the second surface 22 of the substrate 200 and the photodetection area 12a of the semiconductor photodetector element 10, do. As a method of forming the second sealing resin portion 80, a method similar to the method of forming the first sealing resin portion 60 described above can be used.

The inner peripheral portion 52a of the underfill 52 does not enter the through hole 26 in step S03 so that the protruding portion 46 of the second sealing resin portion 80 can be prevented from coming into contact with the through hole 26 And the front end face 46a surely reaches the light detection area 12a (see Fig. 7 (b)).

8A, a part of the first sealing resin portion 60 is removed to expose a part of the first surface 21, and the plurality of terminal portions 201 are exposed, (Step S06: electrode exposing step). In this step S06, the first sealing resin portion 60 is removed in a range corresponding to the terminal portions 201 arranged in a line in the Y direction to form a plurality of exposed portions A. [ A rectangular parallelepiped residual portion 65 is formed between the exposed portions A. The remaining portion 65 corresponds to the first resin portion 30 of the light receiving module 1. [

Specifically, in step S06, the height of the dicing blade is adjusted so that the portion corresponding to the thickness of the first sealing resin portion 60 is ground using, for example, a dicing blade having a rectangular cross- . Then, the first sealing resin portion 60 is cut a plurality of times in the Y direction. At this time, the region where the semiconductor light-receiving element 10 is provided is avoided by performing the cut only in the range where the terminal portion 201 is provided. The width of the dicing blade can be appropriately changed. Further, the present invention is not limited to the case of performing dicing. For example, a part of the first sealing resin portion 60 may be removed by chemical etching to form a plurality of exposed portions A.

Next, as shown in Fig. 8B, the first line L1 in the X direction where the semiconductor light-receiving element 10 is not provided and the second line L2 in the Y direction passing through the terminal portion 201 of the exposed portion A And each of the light receiving modules 1 is obtained by dividing the substrate 20 (step S07: disengaging step). In this step S07, the remaining portion 65 and the second sealing resin portion 80 are divided by dicing in the first line L1 so that the first resin portion 30 and the second resin portion 40 are separated, . At this time, the second side surface 24a, the second side surface 34a, and the second side surface 44a, which are the same surface, are formed, and the second side surface 24b, the second side surface 34b, 44b are formed (see Fig. 1). The exposed portion A is divided into approximately halves by the dicing in the second line L2 so that the flange portion 20a or the flange portion 20b of the light receiving module 1 is formed. At this time, the first side surface 23a and the first side surface 43a which are the same plane are formed, and the first side surface 23b and the first side surface 43b which are the same plane are formed. Each of the terminal portions 201 in a cylindrical shape (or a cylindrical shape) is divided into a semicircular (or semicircular) semicircular terminal portion 27a, 27b.

In step S07, a dicing blade having a rectangular cross section similar to that used in step S06 is used. However, the thickness of the braid portion is made different to make the braid portion thinner. Therefore, the flange portion 20a or the flange portion 20b is formed by dicing twice in which the thickness of the braid portion is different.

According to the light receiving module 1 of the present embodiment described above, the semiconductor light receiving element 10 is provided on the first surface 21 of the substrate 20 through the bumps 51. [ Such a flip chip mounting can avoid the problem of disconnection and the like compared with the case of using a wire, so that high reliability is realized. The substrate 20 has flange portions 20a, 20b protruding from the first resin portion 30. The flange portions 20a, 9, when the light receiving module 1 is mounted, the mounting board 90 is provided with a hole 92 or the like. The hole portion 92 is set to be large enough to accommodate the first resin portion 30. The first resin portion 30 can be inserted into the hole portion 92 and the like so that the first resin portion 30 can be inserted therein. The light receiving module 1 can be easily mounted on the mounting board 90 by mounting the flange portions 20a and 20b on the reflow surface 91 of the mounting board 90. [ Since the terminal portions 27a and 27b of the substrate 20 are exposed to the first side surfaces 23a and 23b, connection using the connection portion 93 is also easy.

As shown in Fig. 10, the second resin part 40 provided on the second surface 22 side of the substrate 20 is optically transparent to light of a predetermined wavelength. When light is incident on the second resin portion 40 from the exposed surface (surface 42) opposite to the surface covering the substrate 20, the refractive index of the second resin portion 40 is larger than the refractive index of the air , The light is diffused inside the second resin part (40) and is trapped inside the second resin part (40). That is, light directly incident from the exposed surface (surface 42) to the through hole 26 of the substrate 20 is incident on the photodetection region 12a of the semiconductor photodetector element 10, Is reflected by the second surface 22 of the substrate 20 or the surface 42 of the second resin part 40 and then enters the light detection area 12a through the through hole 26. [ Since the second resin portion 40 covers the entire second surface 22 of the substrate 20, the exposed surface (the surface 42) is also large, and thus the light receiving range is very wide. The second resin part 40 can make the light incident on the entire surface of the exposed surface (surface 42) enter the photodetection area 12a through the through hole 16. The aperture ratio is improved in this light receiving module 1 as compared with the conventional light receiving module which is limited to the aperture ratio according to the size of the through hole. In addition, the protruding portion 46 of the second resin portion 40 protrudes into the through hole 26, and further covers the photodetection region 12a. This makes it possible to reliably guide the light in the second resin portion 40 to the photodetection region 12a as well as the through hole 26. [ As a result, the light receiving sensitivity can be increased. Since the semiconductor light-receiving element 10 is sealed by the first resin part 30 having a light-shielding property, incident light other than light passing through the through-hole 26 is blocked. Thus, the noise is reduced. By reducing the noise, the S / N ratio with respect to the light receiving sensitivity is improved. Since the second resin part 40 covers the entire second surface 22 and the protruding part 46 covers the light detecting area 12a, Is prevented.

The first side faces 43a and 43b which are the end faces of the second resin portion 40 in the X direction are continuous in the same plane as the first side faces 23a and 23b of the substrate 20 in the X direction . Therefore, the light incident on the wide range in the X direction can be made incident on the light detecting area 12a, and the light receiving sensitivity of the light receiving module 1 is further increased.

The second side faces 44a and 44b which are the end faces of the second resin portion 40 in the Y direction are continuous in the same plane as the second side faces 24a and 24b which are the end faces of the substrate 20 in the Y direction . Therefore, light incident in a wide range in the Y direction can be incident on the light detection area 12a, and the light receiving sensitivity of the light receiving module 1 is further increased.

Since the second surface 22 of the substrate 20 is a reflecting surface that reflects light of a predetermined wavelength, it is possible to increase the light component inside the second resin portion 40, do. Therefore, the light receiving sensitivity of the light receiving module 1 is further increased.

The first surface 21 of the substrate 20 and the first surface 21 of the semiconductor light receiving element 10 are made of a first resin having a light shielding property, And then a part of the first sealing resin part 60 is removed to expose the first surface 21. The remaining portion 65 (first resin portion 30) of the first sealing resin portion 60 is formed on the substrate 20 by dicing in the second line L2 passing through the exposed portion A of the first surface, A flange portion protruding from the flange portion is formed. According to this flange portion, the light receiving module 1 can be easily mounted on the mounting board. On the other hand, on the second surface 22 side, the entire second surface 22 is sealed by using a second resin optically transparent to light of a predetermined wavelength. The second resin flows into the through hole 26 and the second resin covers the light detecting area 12a facing the through hole 26. This improves the aperture ratio and increases the light receiving sensitivity. According to this manufacturing method, a light receiving module having high reliability and high light receiving sensitivity can be manufactured through a simple process and a small process.

By performing the perforations in a state in which the plurality of substrates 200 are overlapped, a plurality of the same columnar through holes 26 are formed for one perforation, so that the efficiency of the perforating process of the substrate 200 is enhanced.

In addition to the above-described embodiments, the present invention includes various modifications. 11A, the light receiving module 1A may be replaced with a Fresnel lens portion (not shown) formed on the surface 42 in place of the second resin portion 40 of the light receiving module 1. For example, And a second resin portion 40A including the first and second resin portions 47A and 47B. Since the exposed surface forms a Fresnel lens shape, the light incident from the exposed surface can easily be guided to the through hole 26, and the light collection efficiency is improved. Therefore, the light receiving sensitivity is further increased.

11B and 12, in the light receiving module 1b, a through hole 26B formed in the substrate 20 is formed in addition to the Fresnel lens portion 47 of the light receiving module 1A And tapered toward the first surface 21 side from the second surface 22 side. The through hole 26B has a tapered shape that tapers at a constant inclination from the second surface 22 side toward the first surface 21 side. According to this configuration, in addition to the same effect as that of the light receiving module 1A, light is easily incident on the through hole 26B, and the light receiving sensitivity is further increased.

For example, the following modifications can be adopted. The present invention is not limited to the case where the flange portions 20a and 20b are provided only in the X direction, and a flange portion may also be provided in the Y direction. In this case, the portion for removing the first sealing resin portion 60 may be increased in Step S06 to remove the first sealing resin portion 60 in the X direction as well as in the Y direction. In the case where a flange portion protruding in all directions of the first resin portion 30 is provided, for example, the terminal portions may be provided on each side of the substrate 20 (for example, two on each of the four sides, Etc).

The flange portions 20a and 20b include a cross section provided with the terminal portions 27a and 27b, but the cross section is not limited to the cross section in the X direction (first direction) but may be the cross section in the Y direction. That is, the terminal portions may be provided on the side surfaces of the flange portions 20a, 20b (both end portions of the second side surfaces 24a, 24b). In other words, although the terminal portions 27a and 27b are provided on the first side surfaces 23a and 23b in the above embodiment, the present invention is not limited to this embodiment. The number and arrangement of the electrode portion and the terminal portion can be appropriately changed. However, the terminal portion may be provided in the flange portion.

The cross section of the second resin part 40 and the cross section of the substrate 20 are not limited to the case where they are continuous on the same plane. The cross section of the second resin portion 40 and the cross section of the substrate 20 may not be continuous on the same plane. For example, the cross section of the second resin section 40 may be inclined with respect to the cross section of the substrate 20. [

The through hole provided in the substrate 20 is not limited to a columnar shape but may be a square columnar shape. The through hole may be a polygonal columnar shape. The tapered through-hole provided in the substrate 20 is not limited to a circular truncated cone, but may be a square truncated cone. The through hole may have a polygonal truncated cone shape. The tapered through-hole may have a tapered shape such that the inclination angle changes from the second surface 22 side toward the first surface 21 side in a plurality of steps. A tapered through hole may be employed for the light receiving module 1 (which does not include the Fresnel lens portion 47). The through hole is not limited to the case where the center axis is formed so as to follow the Z direction, and the center axis may be formed to be slightly inclined with respect to the Z direction.

[Industrial Availability]

According to some aspects of the present disclosure, the aperture ratio is improved, and as a result, the light receiving sensitivity can be increased.

One… Receiver module 10 ... Semiconductor light receiving element
12a ... The photodetection area 20 ... Board
21 ... The first surface 22 ... The second surface
26, 26B ... Through holes 27a, 27b ... Terminal portion
28a, 28b ... The electrode part 30 ... The first resin part
40 ... The second resin part 51 ... Bump
52 ... Under Fill A ... Exposed portion
L1 ... The first line L2 ... The second line

Claims (8)

A first surface, a second surface opposite to the first surface, an electrode portion provided on the first surface, and an electrode portion provided on an end surface connecting the first surface and the second surface, A substrate having a terminal portion connected to the substrate,
A semiconductor light receiving element which is provided so as to face the first surface of the substrate and is electrically connected to the electrode portion of the substrate through a bump provided between the semiconductor surface and the first surface,
An underfill which is filled around the bump as a gap between the semiconductor light receiving element and the first surface of the substrate,
A first resin part provided on the first surface side of the substrate and sealing the semiconductor light-receiving element and having a light-shielding property with respect to light having a predetermined wavelength,
And a second resin part provided on the second surface side of the substrate and covering the entirety of the second surface and optically transparent to light of the predetermined wavelength,
Wherein the substrate is provided with a through hole penetrating the substrate in the thickness direction,
The semiconductor photodetector element is arranged so that the photodetecting area of the semiconductor photodetector faces the through hole,
Wherein a length of the substrate in a first direction orthogonal to the thickness direction is larger than a length of the first resin portion in the first direction and the substrate is projected from the first resin portion in the first direction Wherein the flange portion includes the exposed portion of the first surface and the cross-section provided with the terminal portion,
And the second resin portion has a protrusion protruding into the through hole of the substrate, and the protrusion covers the light detecting area of the semiconductor photodetector. The method according to claim 1,
Wherein a length of the second resin portion in the first direction is equal to a length of the substrate in the first direction and a cross section of the second resin portion in the first direction is the same as the length in the first direction Is continuous on the same plane as the end face of the substrate in the light receiving module. The method according to claim 1 or 2,
The length of the second resin portion in the thickness direction and the second direction orthogonal to both the first direction is the same as the length of the substrate in the second direction, And the cross section of the second resin section is continuous on the same plane as the cross section of the substrate in the second direction. The method according to any one of claims 1 to 3,
And the through-hole is tapered to be tapered from the second surface side toward the first surface side. The method according to any one of claims 1 to 4,
Wherein the exposed surface of the second resin portion opposite to the surface covering the second surface has a Fresnel lens shape. The method according to any one of claims 1 to 5,
Wherein the second surface of the substrate is a reflective surface reflecting light of the predetermined wavelength. A substrate having opposing first and second surfaces, wherein a plurality of electrode portions are provided on the first surface, a plurality of terminal portions electrically connected to the electrode portion and extending in the thickness direction from the first surface are provided A step of preparing the substrate provided with a plurality of through holes penetrating in the thickness direction,
Wherein a plurality of semiconductor light receiving elements are arranged to face the first surface of the substrate and to cover the through holes, bumps are provided between the first surface and the semiconductor light receiving element, and the semiconductor light receiving element is bonded A step of electrically connecting the semiconductor light-receiving element to the electrode portion,
Forming an underfill filled in the periphery of the bump as a gap between the semiconductor light-receiving element and the first surface of the substrate;
A step of forming a first sealing resin part on the first surface side of the substrate by sealing the first surface and the semiconductor light-receiving element using a first resin having a light-shielding property with respect to light of a predetermined wavelength; ,
A step of forming a second sealing resin portion on the second surface side of the substrate by sealing the entire second surface with a second resin optically transparent to the light of the predetermined wavelength,
Removing a portion of the first sealing resin portion to expose a portion of the first surface and exposing the plurality of terminal portions;
And dicing each of the first line passing through the region where the semiconductor light-receiving element is not provided and the second line passing through the exposed portion of the first surface to separate the substrate,
In the step of electrically connecting the semiconductor light-receiving element, the semiconductor light-receiving element is disposed such that the light-detecting area of the semiconductor light-receiving element faces the through-hole,
In the step of forming the second sealing resin part, the second resin is introduced into the through hole of the substrate, and further the manufacturing of the light receiving module for covering the light detecting area of the semiconductor light receiving element with the second resin Way. The method of claim 7,
Wherein the step of preparing the substrate includes the step of perforating a plurality of the substrates in a superimposed state so as to form a plurality of the through holes of the same column shape per one perforation.

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