KR20180103931A - Receiving module and manufacturing method of optical module - Google Patents

Abstract

The light-receiving module includes a semiconductor light-receiving element, a substrate on which a semiconductor light-receiving element is mounted and which has a terminal portion that is electrically connected to the semiconductor light-receiving element on a principal surface, and a semiconductor light- And a resin portion sealing the main surface. The resin part has a first end face extending in a direction intersecting the main face, a second end face opposing the first end face and extending in a direction intersecting the main face, and a second end face connecting the first end face and the second end face, And has a third cross-section parallel to the second cross-section. The second end face is inclined with respect to the main surface, and the second end face and the third end face are covered with a light shielding film which shields light of a predetermined wavelength.

Description

Receiving module and manufacturing method of optical module

The present disclosure relates to a light receiving module and a method of manufacturing the optical module.

In order to realize miniaturization of the optical module, an optical module is known which allows light to enter or exit from the side surface with respect to the detection surface of the optical element. For example, Patent Document 1 discloses an optical semiconductor device in which an inclined surface provided with a reflective film is provided in a region facing the light detecting surface. In this optical semiconductor device, light is detected by reflecting light incident from a side surface to a light detecting surface using a reflective film.

Patent Document 1: Japanese Patent No. 3762545

In order to improve the performance of the optical module as described above, it is necessary to cover a portion other than an incident surface or an outgoing surface of light by using a cover or a case having a light-shielding property. However, by providing a cover or a case, miniaturization of the optical module is hindered.

The present disclosure describes a light receiving module and a manufacturing method of an optical module capable of achieving miniaturization while realizing a light shielding function.

A light receiving module according to an aspect of the present disclosure includes a semiconductor light receiving element, a substrate on which a semiconductor light receiving element is mounted, a substrate having a terminal portion on a main surface thereof electrically connected to the semiconductor light receiving element, And a resin part that is optically transparent and seals the semiconductor light receiving element and the main surface of the substrate. A second end face opposing the first end face and extending in a direction intersecting the main face, and a second end face that connects the first end face and the second end face, And has a third cross-section parallel to the second cross-section. The first end surface is a roughened surface (rough surface, rough surface) and is exposed. The second end surface is inclined with respect to the principal surface. The second end surface and the third end surface are covered with a light shielding film that shields light of a predetermined wavelength.

The light-receiving module according to one aspect of the present invention has a light-shielding film formed on the second end face and the third end face of the resin part. With this configuration, the light shielding function is realized, and intrusion of extraneous light into the light receiving module is suppressed. Further, light incident from the first end face into the inside of the resin part is reflected by the light-shielding film and is trapped inside the resin part. Further, since the first end surface is a roughened surface, the light incident on the first end surface becomes diffused light and enters the inside of the resin portion. Since the refractive index of the resin part is larger than the refractive index of air, the diffused light incident from the first end face is trapped inside the resin part. By this action, light incident from the first end face can be detected with high sensitivity. Further, since it is not necessary to cover the light-receiving module with a cover or a case for light-shielding, it is possible to reduce the size of the light-receiving module.

In some embodiments, the substrate is a glass epoxy substrate, the substrate has a notch continuous to the second end face, and the notch is covered with a light-shielding film that shields light of a predetermined wavelength. With this configuration, disturbance light can be prevented from entering the inside of the resin portion through the substrate.

In some embodiments, the second section is a rough surface. According to this configuration, the diffused light incident on the inside of the resin part is diffused more than in the second end face. The diffused light is reflected by the light shielding film covering the second end face. Therefore, it is possible to uniformize the brightness in the inside of the resin part, and it is possible to detect the light incident from the first end face with high precision.

In some embodiments, the resin portion further has a fourth end face and a fifth end face which connect the first end face and the second end face and extend in the direction intersecting the main face of the substrate, and the fourth end face and the fifth end face have a predetermined And is covered with a light-shielding film that shields light having a wavelength. The fourth section and the fifth section are covered with the light-shielding film, whereby intrusion of the disturbance light into the light-receiving module is further suppressed. Further, the light incident from the first end face into the inside of the resin part can be more efficiently confined inside the resin part.

In some embodiments, the fourth end face and the fifth end face are roughened, and are inclined with respect to the main surface of the substrate. According to this configuration, the diffused light incident on the inside of the resin part is further diffused even in the fourth end face and the fifth end face. Therefore, in the interior of the resin part, the luminance can be more uniform, and the light incident from the first end face can be detected with higher precision.

A method of manufacturing an optical module according to an aspect of the present disclosure includes the steps of fixing a semiconductor optical element on a main surface of a substrate, electrically connecting the semiconductor optical element to a terminal portion formed on a main surface of the substrate, A step of forming a sealing resin portion by sealing a principal surface of a semiconductor optical element and a substrate using an optically transparent resin with respect to light having a wavelength; and a step of forming a bevel cut in a first direction along the main surface of the substrate A step of forming an inclined surface which is inclined with respect to the main surface on the ceiling resin portion, a step of covering the parallel surfaces and the inclined surface of the ceiling resin portion parallel to the main surface with a light shielding film which shields light of a predetermined wavelength, And dicing the substrate in a second direction orthogonal to one direction to separate the substrate into pieces.

In the method of manufacturing an optical module according to an embodiment, a bevel cut is performed in the first direction to form an inclined surface on the sealing resin portion. This inclined surface is covered with a light-shielding film. In addition to this inclined surface, the parallel surface of the sealing resin portion parallel to the main surface of the substrate is also covered with the light-shielding film. Therefore, it is possible to manufacture an optical module in which the light-shielding film is integrated, and it is possible to achieve miniaturization of the optical module while realizing the light-shielding function.

In some embodiments, the manufacturing method of the optical module further includes a step of performing a half cut in the second direction prior to the step of covering with the light-shielding film. According to this manufacturing method, a light-shielding film can be formed on the end face (the end face extending in the second direction) other than the light incidence face or the light exit face among the sealing resin portions. Therefore, it is possible to manufacture an optical module having better optical performance.

In some embodiments, in the step of forming the inclined surface on the sealing resin portion, the notch portion continuous to the inclined surface is formed on the substrate by performing the bevel cut in the first direction. According to this manufacturing method, the notch portion formed on the substrate can be covered with the light-shielding film.

According to the present disclosure, it is possible to achieve miniaturization while realizing the light shielding function.

1 (a) and 1 (b) are perspective views showing a light receiving module according to an embodiment of the present disclosure.
FIG. 2A is a cross-sectional view taken along line IIA-IIA in FIG. 1A, and FIG. 2B is a cross-sectional view taken along line IIB-IIB in FIG.
3 is a flowchart showing a method of manufacturing an optical module.
FIG. 4A is a perspective view showing an object to be processed in one step of the manufacturing method shown in FIG. 3, and FIG. 4B is a perspective view showing an object to be processed in the step following FIG. to be.
FIG. 5A is a perspective view showing a part of the object to be processed in the process subsequent to FIG. 4B, FIG. 5B is a sectional view along the line VB-VB in FIG. 5 (c) is a cross-sectional view along the VC-VC line in Fig. 5 (a).
FIG. 6A is a perspective view showing a part of an object to be processed in the process subsequent to FIG. 5A, FIG. 6B is a cross-sectional view along line VIB-VIB in FIG. 6 (c) is a cross-sectional view taken along the VIC-VIC line of part of FIG. 6 (a).
FIG. 7A is a perspective view showing a part of the object to be processed in the process subsequent to FIG. 6A, FIG. 7B is a cross-sectional view taken along the line VIIB-VIIB in FIG. 7 (c) is a cross-sectional view along line VIIC-VIIC of FIG. 7 (a).
Fig. 8 is a perspective view showing the object to be processed in the process subsequent to Fig. 7 (a). Fig.
Fig. 9 is a cross-sectional view taken along the line VIIB-VIIB in Fig. 7 (a), showing a cutting position for disengaging the substrate.
10 is a view showing another example of a cutting position for disengaging the substrate.
11 is a view showing still another example of a cutting position for disengaging the substrate.
12 is a diagram for explaining the operation and effect of the light receiving module shown in Fig.
Figs. 13A and 13B are diagrams for explaining the difference in the effect of the presence or absence of the light-shielding film in the notched portion. Fig. 13A is a sectional view showing the light- 13 (b) is a cross-sectional view of the light receiving module shown in Fig.
14 (a) and 14 (b) are perspective views showing a light receiving module according to the variation disclosed herein.
FIG. 15A is a cross-sectional view taken along line XVA-XVA in FIG. 14A, and FIG. 15B is a cross-sectional view taken along line XVB-XVB in FIG. 14A.
FIG. 16A is a perspective view showing a part of an object to be processed in a step of the manufacturing method shown in FIG. 3, FIG. 16B is a sectional view taken along line XVIB-XVIB in FIG. 16A, 16 (c) is a cross-sectional view taken along the line XVIC-XVIC in FIG. 16 (a).
Fig. 17 is a perspective view showing an object to be processed in the process subsequent to Fig. 16 (a). Fig.
18 (a) and 18 (b) are perspective views showing a light emitting module according to the embodiment of the present disclosure.
Fig. 19 is a diagram for explaining the operational effects of the light emitting module shown in Figs. 18 (a) and 18 (b).

Hereinafter, various embodiments will be described in detail with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals.

The configuration of the light receiving module 100 according to the present embodiment will be described with reference to Figs. 1 and 2. Fig. The light receiving module 100 is a side light incident light receiving module mounted on a small electronic device such as a cellular phone. As shown in Fig. 1, the light receiving module 100 generally has a rectangular truncated cone shape. The light receiving module 100 includes a semiconductor light receiving element 10 for detecting light incident on the light receiving module 100, a substrate 20 on which the semiconductor light receiving element 10 is mounted, And a resin part 30 optically transparent to light of a predetermined wavelength. The semiconductor light-receiving element 10 is mounted on the main surface 20M of the substrate 20. On the main surface 20M of the substrate 20, a terminal portion 21 is provided. The terminal portion 21 is electrically connected to the semiconductor light-receiving element 10. The resin part 30 is a package provided on the main surface 20M of the substrate 20 and sealing the semiconductor light receiving element 10 and the main surface 20M. The resin portion 30 has a first end face 31, a second end face 32, a third end face 33, a fourth end face 34 and a fifth end face 35. The first end surface 31 and the second end surface 32 are a pair of side surfaces opposed to each other and the fourth end surface 34 and the fifth end surface 35 are a pair of side surfaces opposed to each other. The third end face 33 is an upper face (upper face) connecting the four side faces. Regarding the dimensions of the light receiving module 100, for example, one side of the light receiving module 100 is about 0.5 to 2.0 mm. The dimensions of the light receiving module 100 can be arbitrarily set according to the use.

The semiconductor light-receiving element 10 has, for example, a light-receiving surface 11 and two electrodes 12a and 12b. One electrode 12a is formed on the light receiving surface 11 and the other electrode 12b is formed on the surface opposite to the light receiving surface 11. [ The electrodes 12a and 12b are formed of a conductive material such as gold or copper. As the semiconductor photodetector 10, for example, a photodiode having a pn junction structure or the like can be used. The semiconductor light-receiving element 10 is not limited to the above structure, and may be a photodiode having a pin structure, for example.

The substrate 20 has a rectangular parallelepiped shape and has a rectangular main surface 20M and four side surfaces 20S1 to 20S4. Each side surface 20S1 to 20S4 is formed substantially perpendicular to the main surface 20M. Two terminal portions 21a and 21b for electrically connecting the semiconductor light receiving element 10 and the substrate 20 are formed on the main surface 20M. The electrode 12b of the semiconductor light receiving element 10 is placed on the terminal portion 21b so as to face the terminal portion 21b. Thereby, the electrode 12b and the terminal portion 21b are electrically connected. The electrode 12a of the semiconductor photodetector element 10 is electrically connected to the terminal portion 21a through the bonding wire 22. As the substrate 20, for example, a glass epoxy substrate is used. The terminal portions 21a and 21b and the bonding wire 22 are made of a conductive material such as gold or copper.

The resin part 30 has a rectangular truncated cone shape. The first end face 31 of the resin part 30 extends in a direction intersecting with the main surface 20M of the substrate 20. [ In the light receiving module 100, the first end face 31 is provided substantially perpendicular to the main face 20M. The first end face 31 is provided on the same side as the side face 20S1 of the substrate 20. The second end face 32, which faces the first end face 31, extends in the direction intersecting the main face 20M. In the light receiving module 100, the second end face 32 is inclined with respect to the main face 20M. Here, " one surface is inclined with respect to the main surface 20M " means that the surface of the main surface 20M forms an acute angle with respect to the main surface 20M. In other words, the plane is at a predetermined angle with respect to the plane perpendicular to the main surface 20M. The third end face 33 is parallel to the main surface 20M of the substrate 20. The fourth end face 34 and the fifth end face 35 each connect the first end face 31 and the second end face 32 and extend in the direction crossing the main face 20M of the substrate 20 have. In the light receiving module 100, the fourth end face 34 and the fifth end face 35 are inclined with respect to the main surface 20M. The resin part 30 is formed of a resin material such as a thermosetting resin optically transparent to light of a predetermined wavelength, for example, an epoxy resin or the like. The refractive index of the resin part 30 is larger than the refractive index of air, and in one example, the refractive index n of the resin part 30 formed of epoxy resin is about 1.5. Further, the resin part 30 may be formed of a photocurable resin which is cured by irradiating light of a specific wavelength. In addition, the resin part 30 may include a filler for diffusing light.

Three notches 23, 24, and 25 are formed in the substrate 20. The notch portion 23 is continuous on the same plane as the second end face 32 of the resin portion 30 and connects the side face 20S2 of the substrate 20 to the second end face 32. [ The notch portion 24 is continuous on the same plane as the fourth end face 34 of the resin portion 30 and connects the side face 20S3 of the substrate 20 to the fourth end face 34. [ The notched portion 25 is continuous on the same plane as the fifth end face 35 of the resin portion 30 and connects the side face 20S4 and the fifth end face 35 of the substrate 20. That is, the notched portions 23, 24, and 25 are provided on the side surface of the substrate 20. The notch portions 23, 24, and 25 are inclined with respect to the main surface 20M of the substrate 20. [ The glass epoxy substrate used as the substrate 20 has a structure in which a glass fiber layer and an epoxy resin layer are laminated. The substrate 20 has a glass fiber layer 20a (see Fig. 13 (a)), which is the uppermost layer including the main surface 20M. The notched portions 23, 24, and 25 are formed at least on the glass fiber layer 20a. In one example, the thickness of the glass epoxy substrate is about 0.2 to 1.6 mm.

The first end face 31 of the resin part 30 functions as an incidence surface of light with the exposed rough surface. The second end face 32, the fourth end face 34 and the fifth end face 35 also function as a diffusing surface for diffusing the light incident on the resin portion 30 with a roughened surface. On the other hand, the third end face 33 is a mirror surface. Here, the roughened surface refers to a surface formed by grinding with a dicing blade in a manufacturing process to be described later, and having a plurality of fine irregularities of a micrometer order or more. In the definition of the surface roughness, the rough surface means a surface having a surface roughness greater than that of a mirror surface having a surface roughness Ra of 0.2 or less.

The light receiving module 100 further includes a light shielding film 40 for shielding light having a predetermined wavelength. The light shielding film 40 is sandwiched between the second end face 32, the third end face 33, the fourth end face 34 and the fifth end face 35 of the resin portion 30 and the notch portion 23, 24, and 25, respectively. The light shielding film 40 is formed of a metal such as Cr, Ag, Al, Pd or the like, or an alloy such as Ag-Pd, monel or the like. The thickness of the light-shielding film 40 is 1 占 퐉 or less.

Next, a manufacturing method of the light receiving module 100 will be described with reference to Figs. 3 to 8. Fig. 3 is a flowchart showing a method of manufacturing an optical module in some embodiments. Figs. 4 to 8 are views showing a part of the workpiece 300 in one step of the manufacturing method shown in Fig. 3. Here, the object to be processed 300 refers to the structure in the middle step of the above manufacturing method. 5A, 6A, 7A, and 8, XYZ orthogonal coordinate systems are also shown for ease of explanation.

First, the semiconductor optical element is fixed on the main surface 20M of the substrate 20 (step ST1). More specifically, the semiconductor light-receiving element 10 is fixed on the terminal portion 21b so that the electrode 12b of the semiconductor light-receiving element 10 faces the terminal portion 21b of the substrate 20. [ For fixing the semiconductor light-receiving element 10, a conductive die-bonding paste such as a silver paste may be used. It is possible to fix the semiconductor light receiving element 10 and electrically connect the electrode 12b and the terminal portion 21b by using the die bonding paste having conductivity. A die bonder device can be used for fixing the semiconductor light receiving element 10. [ It is not always necessary to use a die bonding paste having conductivity to fix the semiconductor light-receiving element 10, and an insulating adhesive or the like may be used.

Next, the semiconductor light-receiving element 10 and the terminal portion 21 on the substrate 20 are electrically connected (step ST2). In the step ST2, the electrode 12a and the terminal portion 21a of the semiconductor light-receiving element 10 are electrically connected through the bonding wire 22 by wire bonding, as shown in Fig. 4 (a). In the case where the electrode 12b and the terminal portion 21b are not electrically connected in the step ST1, the electrode 12b and the terminal portion 21b can be electrically connected by wire bonding. As the bonding wire 22, Ag, Cu, Al, or the like is used, for example. For the wire bonding in step ST2, a wire bonder device can be used. As a bonding method, a thermocompression bonding method or an ultrasonic thermocompression bonding method can be applied.

Then, a sealing resin part 50 is formed (step ST3). More specifically, as shown in Fig. 4B, a sealing resin portion 50 for sealing the main surface 20M of the substrate 20 and the semiconductor light-receiving element 10 is formed. The sealing resin part 50 is formed, for example, by filling a thermosetting resin in an uncured state in a mold or a dam frame, and then heating and curing the resin. The thermosetting resin may be formed by heat curing after coating or potting, without using a mold or the like, as long as the thermosetting resin does not flow out (flow out) in the uncured state. The sealing resin part 50 may be formed by filling a photocurable resin in an uncured state in a dam-shaped frame and then curing it by irradiating light of a specific wavelength. The photocurable resin may be formed by irradiating light of a specific wavelength and curing it after coating or potting if the photocurable resin does not flow out in the uncured state.

Next, a bevel cut is performed in the first direction (Y-axis direction) along the main surface 20M of the substrate 20 to form a sloped surface on the sealing resin portion 50 (step ST4). In step ST4, bevel cutting is performed using a dicing apparatus. When the bevel cut is performed, the height of the dicing blade is adjusted so that the half cut is performed. In the bevel cut, a first dicing blade (not shown) having a tapered cross-section is used. One side surface in the thickness direction of the braid portion of the first dicing blade is substantially perpendicular to the rotation axis of the first dicing blade and the other side surface is inclined with respect to the rotation axis.

As shown in Fig. 5 (a), the first dicing blade is used to cut the end face 51 (the first end face 31 of the light receiving module 100 ) And an inclined surface 52 (an end surface corresponding to the second end surface 32 of the light receiving module 100) inclined with respect to the main surface 20M are formed in the sealing resin portion 50 do. At this time, as shown in Figs. 5 (a) and 5 (b), a notch portion 23 continuous to the inclined surface 52 is formed on the substrate 20 by partially cutting away the side surface 20S2. As shown in Fig. 5 (c), the sealing resin portion 50 remains continuous in the first direction (Y-axis direction) of the object to be processed 300. [ The shape of the surface of the end surface 51 and the surface of the inclined surface 52 depends on the particle size of the side surface of the first dicing blade since the end surface 51 and the inclined surface 52 are formed by grinding with the first dicing blade. It becomes one dish. As the first dicing blade, for example, a general electroforming dicing blade can be used. The dicing blade used in step ST4 is not limited to the first dicing blade having a tapered cross section of the braid part. For example, a V-shaped dicing blade having a cross section of the braid portion may be used.

Next, a half cut is performed in a second direction (X-axis direction) orthogonal to the first direction (Y-axis direction) (step ST5). In step ST5, a cut is performed using a dicing apparatus. The height of the dicing blade is adjusted so that the half cut is performed in the same manner as in step ST4. In step ST5, a second dicing blade (not shown) having a V-shaped cross section of the braid part is used. One side surface and the other side surface in the thickness direction of the braid portion of the second dicing blade are inclined with respect to the rotation axis of the second dicing blade and are formed so as to increase in thickness as they approach the rotation axis side. The inclination angles of the one side surface and the other side surface with respect to the rotation axis may be the same or different.

6 (a) and 6 (c), the inclined surface 54 inclined with respect to the main surface 20M of the substrate 20 And the inclined surface 55 (corresponding to the fifth end face 35 of the light receiving module 100) are formed in the sealing resin portion 50. The sealing resin portion 50 is formed on the sealing resin portion 50 as shown in Fig. 6C, the side surface 20S3 and the side surface 20S4 are partly cut off and the notch portion 24 continuous to the inclined surface 54 and the notch portion 24 continuous to the inclined surface 55 are formed, (25) is formed on the substrate (20). The shape of the surface of the inclined surface 54 and the inclined surface 55 is set such that the rough surface 54 and the inclined surface 55 are formed by grinding with the second dicing blade, do. As the second dicing blade, for example, a general electroforming dicing blade can be used.

Subsequently, the parallel surface 53 of the sealing resin portion 50 and the inclined surfaces 52, 54, and 55 are covered with a light shielding film 40 that shields light having a predetermined wavelength (step ST6). In step ST6, a film forming apparatus such as a sputtering apparatus or a vapor deposition apparatus is used. The object to be processed 300 is processed in a film forming apparatus. The parallel surface 53, the inclined surface 52, the inclined surface 54 and the inclined surface 55 of the sealing resin portion 50 are covered with the light shielding film 40 as shown in Figs. 7 (a) to 7 (c) . Further, the notched portions 23, 24, and 25 formed on the substrate 20 are also covered with the light shielding film 40. By forming inclined surfaces (inclined surfaces 52, 54, and 55) by the steps ST4 and ST5, the light-shielding film 40 can be easily formed on these surfaces. The end surface 51 of the sealing resin portion 50 is not covered with the light shielding film 40 because it is substantially perpendicular to the main surface 20M of the substrate 20 and remains exposed. As the material of the light-shielding film 40, a metal material such as Cr, Ag, or Al can be used. The method for forming the light shielding film 40 is not limited to a dry process such as sputtering or vapor deposition, and a wet process such as plating may be used.

Next, in the manufacturing method shown in Fig. 3, the substrate 20 is separated (step ST7). In step ST7, cutting is performed in the first direction and the second direction using a dicing apparatus. As a result, the substrate 20 is separated into individual light receiving modules 100 as shown in Fig. In the cut in step ST7, the height of the dicing blade is adjusted so that the point where the half cut is performed in steps ST4 and ST5 is completely cut off. In this cut, a third dicing blade (not shown) having a rectangular cross section is used. Both side surfaces in the thickness direction of the braid portion of the third dicing blade are substantially perpendicular to the rotation axis of the third dicing blade. As the third dicing blade, for example, a general electroforming dicing blade can be used.

Fig. 9 is a view showing a cutting position in the first direction in step ST7. Fig. The two-dot chain line in Fig. 9 indicates a point where the dicing blade is cut in step ST7. The dicing method shown in Fig. 9 differs from the dicing method shown in Fig. 9 in that the dicing is performed at a point between the end surface 51 and the inclined surface 52 formed at step ST4 (a midpoint excluding the end surface 51 and the inclined surface 52, do. In this method, the width of the grinding by dicing can be minimized, so that the number (the yield) of the light receiving modules 100 that can be manufactured from a single substrate can be increased. The cutting position in the first direction in the step ST7 is not limited to this, and various modifications are possible.

A modified example of the cutting position in the first direction in step ST7 will be described below. 10 is a view showing a modified example of the cutting position in the first direction in step ST7. The two-dot chain line in Fig. 10 indicates a point where the dicing blade is cut in step ST7. In the dicing method shown in Fig. 10, dicing is performed at a point including the end face 51 formed in step ST4. By dicing in this way, the end face 51 formed in step ST4 is ground to form a new end face 51A. Therefore, even when a light shielding film 40 is formed on the end face 51 in the step ST6, the end face 51A which is completely exposed after the dicing can be obtained. Thus, it is possible to improve the yield. Further, in order to perform dicing in this way, the width of the third dicing blade whose cross section of the braid portion is rectangular may be appropriately changed.

11 is a view showing still another modified example of the cutting position in the first direction in step ST7. The two-dot chain line in Fig. 11 indicates a point where the dicing blade is cut in step ST7. In the modified example shown in Fig. 11, the bevel cut in step ST4 is performed by using a second dicing blade having a V-shaped cross section of the braid part similar to the dicing blade used in step ST5 have. As a result, the end surface (end surface) 51 is inclined with respect to the main surface 20M of the substrate 20. In this case, in step ST7, dicing is performed using a third dicing blade whose cross section of the braid part is rectangular, so that the range including the entire inclined section 51 is ground. By executing the step ST7 in this way, the inclined end face 51 is ground, and a new end face 51B which is substantially perpendicular to the main face 20M is formed. Therefore, the exposed end face 51 can be reliably obtained, and the yield can be improved. In addition, the types of dicing blades used in manufacturing the light receiving module 100 can be limited to two types. With these, it is possible to suppress the manufacturing cost.

Next, the operation and effect of the light receiving module 100 manufactured by the above-described manufacturing method will be described with reference to Figs. 12 and 13. Fig. Figs. 12 and 13 are diagrams for explaining the operation effect of the light receiving module 100. Fig.

In the light receiving module 100, the light shielding film 40 is formed on the second end face 32 and the third end face 33 of the resin part 30. [ With this configuration, the light shielding function is realized, and as shown in Fig. 12, intrusion of disturbance light into the light receiving module 100 is suppressed. The light incident from the first end face 31 to the inside of the resin part 30 is reflected by the light shielding film 40 and is trapped inside the resin part 30. [ Further, since the first end surface 31 is a roughened surface, the light incident on the first end surface 31 becomes diffused light and enters the inside of the resin part 30. [ The refractive index n of the resin portion 30 is about 1.5 and larger than the refractive index of air (n = 1). This difference in the refractive index allows the diffused light incident on the resin part 30 to be totally reflected so that the resin part 30 has the effect of blocking the diffused light incident from the first end face 31 I have. By these actions, the light incident from the first end face 31 can be detected with high sensitivity by the semiconductor photodetector 10. Further, since the light-shielding film 40 is formed integrally with the resin portion 30, it is not necessary to cover the light-receiving module with a cover or a case for shielding light, and the light-receiving module 100 can be miniaturized.

The substrate 20 of the light receiving module 100 is a glass epoxy substrate and the substrate 20 has a notch portion 23 continuous with the second end surface 32 and the notch portion 23 is provided with a light having a predetermined wavelength Shielding film 40 for shielding light. When the notch portion 23 is not covered with the light-shielding film, the glass epoxy substrate propagates the light. As shown in Fig. 13 (a), the disturbance light is transmitted through the glass epoxy substrate to the resin portion 30). When disturbance light penetrates through the substrate 20, it is presumed that the influence of the glass fiber layer 20a including the main surface 20M is large. Thus, it is possible to prevent disturbance light from being incident on the glass fiber layer 20a by forming the notch portion 23 in at least the uppermost glass fiber layer 20a and covering the glass fiber layer 20a with the light shielding film 40. [ 13 (b), it is possible to prevent disturbance light from entering the inside of the resin portion 30 through the substrate 20 by blocking the disturbance light. In addition, in order to suppress the incidence of disturbance light through the substrate 20, it is not necessary to use an expensive substrate such as a ceramic substrate. Accordingly, it is possible to realize the light receiving module 100 of high performance while maintaining the low cost.

The substrate 20 of the light receiving module 100 has a notch portion 24 continuous to the fourth end face 34 and a notch portion 25 continuous to the fifth end face 35 in addition to the notch portion 23 Have. The notch portion 24 and the notch portion 25 are also formed so as to reach at least the glass fiber layer 20a and are covered with the light shielding film 40. [ With this configuration, the notch portion 24 and the notch portion 25 achieve the same effect as the notch portion 23 covered with the light-shielding film 40 as described above.

In the light receiving module 100, since the second end surface 32 is a rough surface, the diffused light incident into the inside of the resin part 30 is more diffused than in the second end surface 32. [ The diffused light is reflected by the light-shielding film 40 covering the second end face 32. Therefore, it is possible to uniformize the brightness in the inside of the resin part 30, and it is possible to detect the light incident from the first end face 31 with high precision.

In the resin portion 30 of the light receiving module 100, the fourth end face 34 and the fifth end face 35 are covered with a light shielding film 40 that shields light having a predetermined wavelength. The fourth end face 34 and the fifth end face 35 are covered with the light shielding film 40 so that the intrusion of the disturbance light into the light receiving module 100 is further suppressed. In addition, the light incident from the first end face 31 to the inside of the resin part 30 can be more efficiently confined inside the resin part 30. [

In the light receiving module 100, the fourth end face 34 and the fifth end face 35 are rough surfaces and are also inclined with respect to the main surface 20M of the substrate 20. [ According to this configuration, the diffused light incident on the inside of the resin portion 30 is further diffused even in the fourth end face 34 and the fifth end face 35. [ Therefore, in the inside of the resin part 30, the luminance can be made more uniform, and the light incident from the first end face 31 can be detected more accurately.

Next, a modified example of the light receiving module 100 according to the present embodiment will be described with reference to Figs. 14 and 15. Fig. 14 (a) and 14 (b) are perspective views showing a light receiving module 200 according to the present modification. 15A is a cross-sectional view taken along the line XVA-XVA of the light receiving module 200 according to the present modification, and FIG. 15B is a cross-sectional view taken along the XVB-XVB line of the light receiving module 200 according to the present modification. Fig. The light receiving module 200 according to the present modification is different from the light receiving module 100 in that the fourth end face 34 and the fifth end face 35 of the resin part 30 are formed on the main face 20M , And that the fourth end face 34 and the fifth end face 35 are not covered with the light shielding film 40. In this case,

In the light receiving module 100, only the first end surface 31 of the resin part 30 is exposed. On the other hand, in the light receiving module 200, the first end face 31, the fourth end face 34 and the fifth end face 35 are exposed, and the second end face 32 and the third end face 33 ) Are covered with the light-shielding film 40, as shown in Fig. The fourth end face 34 and the fifth end face 35 connect the first end face 31 and the second end face 32 and are provided substantially perpendicular to the main face 20M. In addition, the fourth end face 34 and the fifth end face 35 are exposed rough faces.

In the manufacturing method of the light receiving module 200, steps ST1 to ST4 are executed in the same manner as the manufacturing method shown in Fig. As a result, the object to be processed 300 is processed into the same state as the object to be processed 300 shown in Fig.

Next, the process ST5 is not executed and the process ST6 is executed. Step ST5, that is, half cut in the second direction is not performed, so that step ST6 is executed in a state where the inclined surfaces 54 and 55 are not formed in the sealing resin portion 50. [ Therefore, in step ST6, only the inclined surface 52, the parallel surface 53, and the notch portion 23 of the sealing resin portion 50 are covered with the light-shielding film 40 as shown in Figs. 16A to 16C, .

Subsequently, the substrate 20 is separated (step ST7). To this end, in step ST7, a cut is made in the first direction (Y-axis direction) and the second direction (X-axis direction) using a dicing machine. In the first direction, the point where the half cut is performed in step ST4 is completely cut off. In addition, in the second direction, the substrate 20, the sealing resin portion 50, and the light-shielding film 40 are cut by one cut. As a result, as shown in Fig. 17, the object to be processed 300 is disassembled and the light receiving module 200 is formed.

The light receiving module 200 is a light receiving module for detecting light incident from the first end face 31 of the resin portion 30, like the light receiving module 100. The second end face 32 and the third end face 33 of the resin portion 30 of the light receiving module 200 are covered with the light shielding film 40. [ Thus, the disturbance light is reflected by the light shielding film 40, and the intrusion into the light receiving module 200 is suppressed. Light incident from the first end face 31 functioning as an incident surface enters the inside of the resin portion 30 and is detected by the semiconductor light receiving element 10. [ Since the light-shielding film 40 is formed integrally with the light-receiving module 200, the light-shielding film 40 can be miniaturized while realizing the light-shielding function. In other respects, the light receiving module 200 can obtain almost the same operational effects as the light receiving module 100. [

In the light receiving module 200, since the fourth end face 34 and the fifth end face 35 of the resin portion 30 are not covered with the light shielding film 40, the light shielding property against the disturbance light, The effect of blocking diffused light inside the light receiving module 100 can be slightly behind the light receiving module 100. However, the light receiving module 200 can be manufactured with a smaller number of processes than the light receiving module 100. In addition, the types of dicing blades used in manufacturing the light receiving module 200 can be limited to two types. Therefore, it is possible to suppress the manufacturing cost and improve the mass productivity.

Next, the light emitting module 400 according to the embodiment of the present disclosure will be described with reference to Fig. 18 is a perspective view showing the light emitting module 400 according to the embodiment of the present disclosure. The point that the light emitting module 400 shown in Fig. 18 is different from the light receiving module 100 is that the semiconductor light emitting element 410 is mounted on the substrate 420 in place of the semiconductor light receiving element 10.

The light emitting module 400 has substantially the same structure as the light receiving module 100 and includes a semiconductor light emitting device 410, a substrate 420, a resin portion 430, and a light shielding film 440. The semiconductor light emitting device 410 is mounted on the main surface 420M of the substrate 420. [ On the main surface 420M of the substrate 420, a terminal portion 421 is provided. The terminal portion 421 is electrically connected to the semiconductor light emitting element 410. The resin part 430 is provided on the main surface 420M of the substrate 420 and seals the semiconductor light emitting device 410 and the main surface 420M. The resin portion 430 has a first end face 431, a second end face 432, a third end face 433, a fourth end face 434, and a fifth end face 435. The first end face 431 is exposed and the second end face 432, the third end face 433, the fourth end face 434 and the fifth end face 435 are covered with the light shielding film 440. The overall dimensions of the light emitting module 400 can be arbitrarily set within the same range as the overall dimensions of the light receiving module 100. [

The above-described light emitting module 400 can be manufactured by the same manufacturing method as the manufacturing method shown in Fig. In the fabrication of the light emitting module 400, the semiconductor light emitting element 410 is fixed on the main surface 20M of the substrate 20 instead of the semiconductor light receiving element 10 in step ST1. As the semiconductor light emitting element 410, for example, a light emitting diode or a semiconductor laser can be used. The semiconductor light emitting element 410 may be fixed by using a die bonding paste having conductivity as in the case of fixing the semiconductor light receiving element 10. The processes from step ST2 to step ST7 are the same as the above-described method of manufacturing the light receiving module 100, and a description thereof will be omitted.

The light emitting module 400 is a light emitting module having a first end face 431 of the resin part 430 as a light emitting face. The second end face 432, the third end face 433, the fourth end face 434 and the fifth end face 435 of the resin part 430 of the light emitting module 400 are covered with the light shielding film 440. 19, the light emitted from the semiconductor light emitting element 410 passes through the second end face 432, the third end face 433, the fourth end face 434, and the fifth end face 435, The light is reflected by the light shielding film 440 to the inside of the resin portion 430 and emitted from the first end face 431 only. Therefore, the loss of light emitted from the semiconductor light emitting element 410 can be suppressed, and light can be emitted from the first end face 431. Since the light-shielding film 440 is formed integrally with the light-emitting module 400, it is possible to achieve miniaturization while realizing a light-shielding function.

In the light emitting module 400, the second end face 432, the third end face 433, the fourth end face 434, and the fifth end face 435 of the resin part 430 are rough surfaces, Is diffused in the inside of the resin part 430. Thus, the entire surface of the first end face 431, which is the exit surface of the light, can emit light. Since the first end surface 431 also has a rough surface, the light emitted from the first end surface 431 becomes diffused light.

Various embodiments have been described above, but the present invention is not limited to the above-described embodiments, and various modifications may be employed. For example, the fourth end face 34 and the fifth end face 35 of the resin part 30 may be covered with the light shielding film 40 in the light receiving module 200 as well. In the light emitting module 400, the fourth end face 434 and the fifth end face 435 of the resin part 430 may be formed substantially perpendicular to the main surface 420M of the substrate 420. In that case, the fourth end face 434 and the fifth end face 435 may be exposed. In the light-receiving module or the light-emitting module, the notch portion (the notch portion 23 or the like) continuous on the same plane as the inclined plane (the second end face 32 or the like) may be formed below the uppermost layer of the substrate. The notch portion may be formed to reach the bottom surface of the substrate.

[Industrial Availability]

According to the present disclosure, it is possible to achieve miniaturization while realizing the light shielding function.

10 ... Semiconductor light receiving element 11 ... Receiving surface
12a, 12b ... Electrode 20 ... Board
20M ... Week 20a ... Glass fiber layer
21 ... The terminal portion 22 ... Bonding wire
23, 24, 25 ... Notch 30 ... Resin part
31 ... The first end face 32 ... Second cross section
33 ... The third end face 34 ... Fourth section
35 ... The fifth cross section 40 ... Shielding film
50 ... The sealing resin part 100 ... Receiving module
200 ... Receiver module 300 ... The object to be treated
400 ... Emitting module 410 ... Semiconductor light emitting element
420 ... Substrate 420M ... When
421 ... The terminal portion 430 ... Resin part
440 ... Shielding film

Claims (10)

A semiconductor light receiving element,
A substrate on which the semiconductor light-receiving element is mounted and having a terminal portion on a main surface that is electrically connected to the semiconductor light-
And a resin part optically transparent to light of a predetermined wavelength and sealing the semiconductor light-receiving element and the main surface of the substrate,
The resin part
A first end face extending in a direction intersecting the main face,
A second end face opposing the first end face and extending in a direction crossing the main face,
A first end surface and a second end surface, and a third end surface parallel to the main surface of the substrate,
Wherein the first end face is a rough face and is also exposed,
The second end face is inclined with respect to the main face,
And the second end face and the third end face are covered with a light shielding film that shields light of the predetermined wavelength. The method according to claim 1,
Wherein the substrate is a glass epoxy substrate,
Wherein the substrate has a notch portion continuous with the second end face,
Wherein the notch portion is covered with a light-shielding film that shields light of the predetermined wavelength. The method according to claim 1 or 2,
And the second cross section is a rough surface. The method according to any one of claims 1 to 3,
The resin portion further has a fourth end face and a fifth end face which connect the first end face and the second end face and extend in a direction crossing the main face of the substrate,
And the fourth end face and the fifth end face are covered with a light-shielding film that shields light of the predetermined wavelength. The method of claim 4,
Wherein the fourth end face and the fifth end face are rough faces and are inclined with respect to the main face of the substrate. A step of fixing the semiconductor optical element on the main surface of the substrate,
A step of electrically connecting the semiconductor optical element to a terminal portion formed on the main surface of the substrate,
A step of sealing the main surface of the semiconductor optical element and the substrate using an optically transparent resin with respect to light of a predetermined wavelength to form a sealing resin portion;
A step of forming a bevel cut in a first direction along the main surface of the substrate to form an inclined surface inclined to the main surface in the sealing resin portion;
A step of covering the parallel surface and the inclined surface of the sealing resin portion parallel to the main surface with a light shielding film for shielding light of the predetermined wavelength;
And performing dicing in at least a second direction orthogonal to the first direction to separate the substrate into individual pieces. The method of claim 6,
Further comprising the step of performing a half cut in the second direction prior to the step of covering the light shielding film with the light shielding film. The method according to claim 6 or 7,
Wherein a notch portion continuous to the inclined surface is formed on the substrate by performing a bevel cut in the first direction in the step of forming the inclined surface on the sealing resin portion. The method according to any one of claims 6 to 8,
Wherein the semiconductor optical element is a semiconductor light receiving element. The method according to any one of claims 6 to 8,
Wherein the semiconductor optical element is a semiconductor light emitting element.

Images