KR102606362B1 - Light receiving module and method of manufacturing the light receiving module - Google Patents

Abstract

The light receiving module includes a semiconductor light receiving element, a substrate on which the semiconductor light receiving element is mounted and a terminal portion electrically connected to the semiconductor light receiving element, and which is optically transparent to light of a predetermined wavelength and includes the semiconductor light receiving element and the substrate. It is provided with a resin part that seals the main surface. The resin portion has a first end surface extending in a direction intersecting the main surface, a second end surface facing the first end surface and extending in a direction intersecting the main surface, and connecting the first end surface and the second end surface, and connecting the first end surface to the main surface of the substrate. It has a third cross section parallel to . The first cross-section is rough and exposed, the second cross-section is inclined with respect to the main surface, and the second and third cross-sections are covered with a light-shielding film that blocks light of a predetermined wavelength.

Description

Light receiving module and method of manufacturing the light receiving module

The present disclosure relates to a method of manufacturing a light receiving module and an optical module.

In order to realize miniaturization of optical modules, optical modules are known that allow light to enter or exit from the side with respect to the detection surface of the optical element. For example, Patent Document 1 discloses an optical semiconductor device in which an inclined surface with a reflective film is provided in an area facing the light detection surface. This optical semiconductor device detects light by reflecting light incident from the side onto the light detection surface using a reflective film.

Patent Document 1: Japanese Patent No. 3762545

In order to improve the performance of the optical module as described above, it is necessary to cover parts other than the light incident or exit surface using a cover or case having light blocking properties. However, providing a cover or case hinders miniaturization of the optical module.

This disclosure explains a method of manufacturing a light receiving module and an optical module that can achieve miniaturization while realizing a light blocking function.

A light receiving module according to an aspect of the present disclosure includes a semiconductor light receiving element, a substrate on which the semiconductor light receiving element is mounted and a terminal portion electrically connected to the semiconductor light receiving element, and a terminal portion on the main surface that receives light of a predetermined wavelength. It is optically transparent and includes a semiconductor light receiving element and a resin portion that seals the main surface of the substrate. The resin portion has a first end surface extending in a direction intersecting the main surface, a second end surface facing the first end surface and extending in a direction intersecting the main surface, and connecting the first end surface and the second end surface, and connecting the first end surface to the main surface of the substrate. It has a third cross section parallel to . The first cross-section is a rough surface and is exposed, the second cross-section is inclined with respect to the main surface, and the second and third cross-sections are covered with a light-shielding film that blocks light of a predetermined wavelength.

In the light receiving module according to one aspect, a light-shielding film is formed on the second end surface and the third end surface of the resin part. With this configuration, a light-shielding function is realized, and penetration of extraneous light into the light-receiving module is suppressed. Additionally, light incident from the first end face into the inside of the resin portion is reflected by the light shielding film and is trapped inside the resin portion. Additionally, since the first cross section is a rough surface, the light incident on the first cross section becomes diffused light and enters the inside of the resin portion. Since the refractive index of the resin portion is greater than that of air, the diffused light incident from the first end face is trapped inside the resin portion. Due to this effect, it is possible to detect light incident from the first end face with high sensitivity. Additionally, since there is no need to cover the light receiving module with a cover or case for blocking light, the light receiving module can be miniaturized.

In some embodiments, the substrate is a glass epoxy substrate, the substrate has a notch portion continuous to the second end surface, and the notch portion is covered with a light-shielding film that blocks light of a predetermined wavelength. With this configuration, it is possible to suppress disturbance light from penetrating into the interior of the resin portion through the substrate.

In some embodiments, the second cross-section is rough. According to this configuration, the diffused light incident on the inside of the resin portion is further diffused in the second cross section. Additionally, the diffused light is reflected by the light-shielding film covering the second end surface. Therefore, it is possible to achieve uniformity of luminance inside the resin portion, and it is possible to detect light incident from the first end face with high precision.

In some embodiments, the resin portion connects the first end face and the second end face, and further has a fourth end face and a fifth end face extending in a direction intersecting the main surface of the substrate, and the fourth end face and the fifth end face are predetermined. It is covered with a light-shielding film that blocks light of different wavelengths. By covering the fourth and fifth cross sections with a light shielding film, the penetration of extraneous light into the light receiving module is further suppressed. Additionally, light incident from the first end face into the resin portion can be confined within the resin portion more efficiently.

In some embodiments, the fourth and fifth cross sections have a rough surface and are inclined with respect to the main surface of the substrate. According to this configuration, the diffused light incident on the inside of the resin portion is further diffused in the fourth and fifth cross sections as well. Therefore, it is possible to achieve greater uniformity of luminance inside the resin portion, and it is possible to detect light incident from the first end face with greater precision.

A method of manufacturing an optical module according to an aspect of the present disclosure includes a process of fixing a semiconductor optical element on the main surface of a substrate, a process of electrically connecting the semiconductor optical element and a terminal portion formed on the main surface of the substrate, and a predetermined A process of forming a sealing resin portion by sealing the main surface of a semiconductor optical element and a substrate using a resin that is optically transparent to light of any wavelength, and making a bevel cut in a first direction along the main surface of the substrate. A step of forming an inclined surface inclined with respect to the main surface in the sealing resin part, and a step of covering the parallel surface and the inclined surface of the sealing resin part parallel to the main surface with a light-shielding film that blocks light of a predetermined wavelength, by performing at least the following: A step of performing dicing in a second direction orthogonal to one direction to separate the substrate into pieces is included.

In the optical module manufacturing method according to one aspect, an inclined surface is formed in the sealing resin portion by performing a bevel cut in the first direction. This slope is covered with a light shield. In addition to this inclined surface, the parallel surface of the sealing resin portion parallel to the main surface of the substrate is also covered with a light-shielding film. Therefore, an optical module with an integrated light-shielding film can be produced, making it possible to achieve a light-shielding function and achieve miniaturization of the optical module.

In some aspects, the method of manufacturing an optical module further includes a step of performing a half cut in the second direction prior to the step of covering with a light-shielding film. According to this manufacturing method, a light-shielding film can be formed on an end surface (cross section extending in the second direction) other than the light incident or exit surface of the sealing resin part. Therefore, it is possible to manufacture an optical module with better optical performance.

In some embodiments, in the step of forming an inclined surface in the sealing resin portion, a notch portion continuous to the inclined surface is formed in the substrate by performing a bevel cut in the first direction. According to this manufacturing method, the notch formed in the substrate can also be covered with a light-shielding film.

According to the present disclosure, it is possible to achieve miniaturization while realizing a light blocking function.

1(a) and 1(b) are perspective views showing a light receiving module according to an embodiment of the present disclosure.
Figure 2(a) is a cross-sectional view taken along line IIA-IIA in Figure 1(a), and Figure 2(b) is a cross-sectional view taken along line IIB-IIB in Figure 1(a).
Figure 3 is a flowchart showing a manufacturing method of an optical module.
FIG. 4(a) is a perspective view showing the object to be processed in one step of the manufacturing method shown in FIG. 3, and FIG. 4(b) is a perspective view showing the object to be processed in the process following FIG. 4(a). am.
FIG. 5(a) is a perspective view showing a part of the object to be processed in the process following FIG. 4(b), and FIG. 5(b) is a cross-sectional view taken along line VB-VB in FIG. 5(a). Figure 5(c) is a cross-sectional view taken along line VC-VC in Figure 5(a).
Figure 6(a) is a perspective view showing a part of the object to be processed in the process following Figure 5(a), and Figure 6(b) is a cross-sectional view taken along line VIB-VIB in Figure 6(a). Figure 6(c) is a cross-sectional view of a portion of Figure 6(a) along line VIC-VIC.
Figure 7(a) is a perspective view showing a part of the object to be processed in the process following Figure 6(a), and Figure 7(b) is a cross-sectional view taken along line VIIB-VIIB in Figure 7(a). 7(c) is a cross-sectional view taken along line VIIC-VIIC of FIG. 7(a).
FIG. 8 is a perspective view showing the object to be processed in the process following (a) in FIG. 7.
FIG. 9 is a cross-sectional view taken along line VIIB-VIIB in (a) of FIG. 7, showing a cutting position for dividing the substrate into pieces.
Figure 10 is a diagram showing another example of a cutting position for dividing a substrate into pieces.
Figure 11 is a diagram showing another example of a cutting position for dividing a substrate into pieces.
FIG. 12 is a diagram for explaining the effects of the light receiving module shown in FIG. 1.
Figures 13(a) and 13(b) are diagrams for explaining the difference in operational effects depending on the presence or absence of a light-shielding film in the notch portion, and Figure 13(a) is a cross-sectional view showing a light receiving module of a comparative example; FIG. 13(b) is a cross-sectional view of the light receiving module shown in FIG. 1.
Figures 14(a) and 14(b) are perspective views showing a light receiving module according to a modified example of the present disclosure.
Figure 15(a) is a cross-sectional view taken along the line XVA-XVA in Figure 14(a), and Figure 15(b) is a cross-sectional view taken along the line XVB-XVB in Figure 14(a).
FIG. 16(a) is a perspective view showing a part of the object to be processed in one step of the manufacturing method shown in FIG. 3, FIG. 16(b) is a cross-sectional view taken along line XVIB-XVIB in FIG. 16(a), FIG. 16(c) is a cross-sectional view taken along line XVIC-XVIC of FIG. 16(a).
FIG. 17 is a perspective view showing the object to be processed in the process following (a) in FIG. 16.
Figures 18(a) and 18(b) are perspective views showing a light emitting module according to an embodiment of the present disclosure.
FIG. 19 is a diagram for explaining the effects of the light emitting module shown in FIGS. 18(a) and 18(b).

Hereinafter, various embodiments will be described in detail with reference to the drawings. In addition, in each drawing, identical or significant parts are assigned the same reference numerals.

With reference to FIGS. 1 and 2 , the configuration of the light receiving module 100 according to this embodiment will be described. The light receiving module 100 is a side incident type light receiving module that is mounted on small electronic devices such as mobile phones, for example. As shown in FIG. 1, the light receiving module 100 has an overall square conical shape. The light receiving module 100 is provided on the substrate 20, a semiconductor light receiving element 10 that detects light incident on the light receiving module 100, a substrate 20 on which the semiconductor light receiving element 10 is mounted, It is provided with a resin portion 30 that is optically transparent to light of a predetermined wavelength. The semiconductor light receiving element 10 is mounted on the main surface 20M of the substrate 20. A terminal portion 21 is provided on the main surface 20M of the substrate 20. The terminal portion 21 is electrically connected to the semiconductor light receiving element 10. The resin portion 30 is a package provided on the main surface 20M of the substrate 20 and seals the semiconductor light receiving element 10 and the main surface 20M. The resin portion 30 has a first end face 31, a second end face 32, a third end face 33, a fourth end face 34, and a fifth end face 35. The first end face 31 and the second end face 32 are a pair of sides facing each other, and the fourth end faces 34 and the fifth end faces 35 are a pair of sides facing each other. The third end surface 33 is an upper surface connecting the four side surfaces. Regarding the dimensions of the light receiving module 100, for example, one side of the light receiving module 100 is about 0.5 to 2.0 mm. The dimensions of the light receiving module 100 can be arbitrarily set depending on the purpose.

The semiconductor light receiving element 10 has, for example, a light receiving surface 11 and two electrodes 12a and 12b. One electrode 12a is formed on the light-receiving surface 11, and the other electrode 12b is formed on a surface opposite to the light-receiving surface 11. The electrodes 12a and 12b are formed of a conductive material such as gold or copper. For the semiconductor light receiving element 10, for example, a photodiode having a pn junction structure can be used. In addition, the semiconductor light receiving element 10 is not limited to the above structure, and may be, for example, a photodiode having a pin structure.

The substrate 20 has a rectangular parallelepiped shape and has a rectangular main surface (20M) and four side surfaces (20S1 to 20S4). Each side (20S1 to 20S4) is formed approximately perpendicular to the main surface (20M). On the main surface 20M, two terminal portions 21a and 21b are formed to electrically connect the semiconductor light receiving element 10 and the substrate 20. The electrode 12b of the semiconductor light receiving element 10 is placed on the terminal portion 21b so as to face the terminal portion 21b. By this, the electrode 12b and the terminal portion 21b are electrically connected. Additionally, the electrode 12a of the semiconductor light receiving element 10 is electrically connected to the terminal portion 21a through a bonding wire 22. For the substrate 20, for example, a glass epoxy substrate is used. The terminal portions 21a and 21b and the bonding wire 22 are formed of a conductive material such as gold or copper, for example.

The resin portion 30 has a square cone shape. The first end surface 31 of the resin portion 30 extends in a direction intersecting the main surface 20M of the substrate 20. In the light receiving module 100, the first end surface 31 is provided approximately perpendicular to the main surface 20M. This first end surface 31 is provided on the same side as the side surface 20S1 of the substrate 20. The second end surface 32 opposite the first end surface 31 extends in a direction intersecting the main surface 20M. In the light receiving module 100, the second end surface 32 is provided inclined with respect to the main surface 20M. Here, “a certain surface is inclined with respect to the main surface 20M” means that the surface forms an acute angle with respect to the main surface 20M. In other words, the surface forms a predetermined angle with respect to the surface perpendicular to the main surface 20M. The third end surface 33 is parallel to the main surface 20M of the substrate 20. The fourth end face 34 and the fifth end face 35 connect the first end face 31 and the second end face 32, respectively, and extend in a direction intersecting the main surface 20M of the substrate 20. there is. In the light receiving module 100, the fourth end face 34 and the fifth end face 35 are provided inclined with respect to the main surface 20M. The resin portion 30 is formed of a resin material such as a thermosetting resin that is optically transparent to light of a predetermined wavelength, for example, an epoxy resin. The refractive index of the resin portion 30 is greater than that of air, and in one example, the refractive index n of the resin portion 30 formed of epoxy resin is about 1.5. Additionally, the resin portion 30 may be formed of a photo-curable resin that is cured by irradiating light of a specific wavelength. Additionally, the resin portion 30 may contain filler for diffusing light.

Three notches 23, 24, and 25 are formed in the substrate 20. The notch portion 23 is continuous on the same surface as the second end surface 32 of the resin portion 30, and connects the side surface 20S2 of the substrate 20 and the second end surface 32. The notch portion 24 is continuous on the same surface as the fourth end surface 34 of the resin portion 30, and connects the side surface 20S3 of the substrate 20 and the fourth end surface 34. Additionally, the notch portion 25 is continuous on the same surface as the fifth end surface 35 of the resin portion 30, and connects the side surface 20S4 of the substrate 20 and the fifth end surface 35. That is, the notches 23, 24, and 25 are provided on the side of the substrate 20. The notches 23, 24, and 25 are inclined with respect to the main surface 20M of the substrate 20. The glass epoxy substrate used as the substrate 20 has a structure in which a layer of glass fiber and a layer of epoxy resin are laminated. The substrate 20 has a glass fiber layer 20a (see Figure 13(a)), which is the uppermost layer including the main surface 20M. The notches 23, 24, and 25 are formed at least in the glass fiber layer 20a. In one example, the thickness of the glass epoxy substrate is approximately 0.2 to 1.6 mm.

The first end surface 31 of the resin portion 30 is an exposed rough surface and functions as a light incident surface. In addition, the second end face 32, the fourth end face 34, and the fifth end face 35 are also rough surfaces and function as diffusion surfaces that diffuse the light incident on the resin portion 30. Meanwhile, the third cross section 33 is a mirror surface. Here, the rough surface refers to a surface that is formed by grinding with a dicing blade in a manufacturing process described later and has a large number of fine irregularities of the micrometer order or more. In the definition by surface roughness, rough surface refers to a surface that has a surface roughness greater than a mirror surface with a surface roughness Ra of 0.2 or less.

The light receiving module 100 is additionally provided with a light shielding film 40 that blocks light of a predetermined wavelength. The light shielding film 40 includes the second end face 32, the third end face 33, the fourth end face 34, and the fifth end face 35 of the resin part 30, and the notch formed on the substrate 20 ( 23, 24, and 25). The light-shielding film 40 is formed of, for example, a metal such as Cr, Ag, Al, Pd, or an alloy such as Ag-Pd or monel. The film thickness of the light-shielding film 40 is 1 μm or less.

Next, the manufacturing method of the light receiving module 100 will be described with reference to FIGS. 3 to 8. 3 is a flowchart showing a method of manufacturing an optical module in some embodiments. 4 to 8 are diagrams showing a part of the object 300 to be processed in one step of the manufacturing method shown in FIG. 3. Here, the object to be processed 300 refers to a structure in the middle stage of the above manufacturing method. In addition, for ease of explanation, the XYZ orthogonal coordinate system is shown in FIG. 5(a), FIG. 6(a), FIG. 7(a), and FIG. 8.

First, the semiconductor optical element is fixed on the main surface 20M of the substrate 20 (step ST1). Specifically, the semiconductor light receiving element 10 is fixed on the terminal portion 21b so that the electrode 12b of the semiconductor light receiving element 10 faces the terminal portion 21b of the substrate 20. To fix the semiconductor light receiving element 10, for example, a conductive die bonding paste such as silver paste may be used. By using a conductive die bonding paste, it is possible to fix the semiconductor light receiving element 10 and electrically connect the electrode 12b and the terminal portion 21b. A die bonder device can be used to fix the semiconductor light receiving element 10. In addition, to fix the semiconductor light receiving element 10, it is not necessarily necessary to use a conductive die bonding paste, and an insulating adhesive or the like may be used.

Next, the semiconductor light receiving element 10 and the terminal portion 21 on the substrate 20 are electrically connected (step ST2). In step ST2, by performing wire bonding, the electrode 12a and the terminal portion 21a of the semiconductor light receiving element 10 are electrically connected through the bonding wire 22, as shown in FIG. 4(a). Additionally, when the electrode 12b and the terminal portion 21b are not electrically connected in step ST1, the electrode 12b and the terminal portion 21b can be electrically connected by performing wire bonding. For the bonding wire 22, Ag, Cu, and Al are used, for example. A wire bonder device can be used for wire bonding in step ST2. Additionally, as a bonding method, a thermal compression method or an ultrasonic thermal compression method can be applied.

Next, the sealing resin portion 50 is formed (step ST3). Specifically, as shown in FIG. 4B, a sealing resin portion 50 is formed that seals the main surface 20M of the substrate 20 and the semiconductor light receiving element 10. The sealing resin portion 50 is formed, for example, by filling an uncured thermosetting resin into a mold or a dam-shaped frame and then heating and curing it. Additionally, as long as the thermosetting resin does not flow out in an uncured state, it may be formed by applying or potting and then heating and curing without using a mold or the like. The sealing resin portion 50 may be formed by filling an uncured photo-curable resin into a dam-shaped frame and then curing it by irradiating light of a specific wavelength. If the photo-curable resin does not leak in an uncured state, it may be formed by curing it by irradiating light of a specific wavelength after application or potting.

Next, a bevel cut is performed in the first direction (Y-axis direction) along the main surface 20M of the substrate 20 to form an inclined surface in the sealing resin portion 50 (step ST4). In step ST4, a bevel cut is performed using a dicing device. Additionally, when performing this bevel cut, the height of the dicing blade is adjusted so that a half cut is performed. For the bevel cut, a first dicing blade (not shown) whose cross section of the blade portion is tapered is used. One side in the thickness direction of the blade portion of the first dicing blade is substantially perpendicular to the rotation axis of the first dicing blade, and the other side is inclined with respect to the rotation axis.

By performing a cut using this first dicing blade, a cross section 51 (the first cross section 31 of the light receiving module 100) is formed substantially perpendicular to the main surface 20M, as shown in FIG. 5(a). ) and an inclined surface 52 (a cross section corresponding to the second end surface 32 of the light receiving module 100) inclined with respect to the main surface 20M are formed in the sealing resin portion 50. do. At this time, as shown in Figures 5(a) and 5(b), the side surface 20S2 is partially shaved off, and a notch portion 23 continuous to the inclined surface 52 is formed in the substrate 20. In the cross section of the object 300 in the first direction (Y-axis direction), the sealing resin portion 50 is continuous, as shown in FIG. 5(c). Since the cross-section 51 and the inclined surface 52 are formed by grinding with the first dicing blade, the shape of the surface of the cross-section 51 and the inclined surface 52 depends on the grain size of the side surface of the first dicing blade. It becomes one side. For the first dicing blade, for example, a general electroformed dicing blade can be used. Additionally, the dicing blade used in step ST4 is not limited to the first dicing blade having a tapered cross section of the blade portion. For example, a dicing braid with a V-shaped cross section of the braid portion may be used.

Next, a half cut is performed in the second direction (X-axis direction) orthogonal to the first direction (Y-axis direction) (step ST5). In step ST5, cutting is performed using a dicing device. The height of the dicing blade is adjusted so that a half cut is performed, similar to step ST4. In step ST5, a second dicing blade (not shown) whose blade portion has a V-shaped cross section is used. One side and the other side in the thickness direction of the blade portion of the second dicing blade are inclined with respect to the rotation axis of the second dicing blade, and are formed so that the thickness increases as they approach the rotation axis. Additionally, the inclination angles of one side and the other side with respect to the rotation axis may be the same or different.

By performing a cut using this second dicing blade, as shown in FIGS. 6(a) and 6(c), an inclined surface 54 ( A cross section corresponding to the fourth end surface 34 of the light receiving module 100) and an inclined surface 55 (corresponding to the fifth end surface 35 of the light receiving module 100) are formed in the sealing resin portion 50. At this time, as shown in (c) of FIG. 6, the side surfaces 20S3 and 20S4 are partially shaved, and a notch portion 24 continuous to the inclined surface 54 and a notched portion continuous to the inclined surface 55 are formed. (25) is formed on the substrate 20. Since the inclined surfaces 54 and 55 are formed by grinding with the second dicing blade, the shapes of the surfaces of the inclined surfaces 54 and 55 are rough surfaces depending on the grain size of the side surface of the second dicing blade. do. For the second dicing blade, for example, a general electroformed dicing blade can be used.

Next, the parallel surface 53 and the inclined surfaces 52, 54, and 55 of the sealing resin portion 50 are covered with a light-shielding film 40 that blocks light of a predetermined wavelength (step ST6). In process ST6, a film forming device such as a sputter device or a vapor deposition device is used. The object to be processed 300 is processed within the film forming apparatus. As shown in (a) to (c) of FIG. 7, the parallel surface 53, the inclined surface 52, the inclined surface 54, and the inclined surface 55 of the sealing resin portion 50 are covered with a light shielding film 40. . Additionally, the notch portions 23, 24, and 25 formed in the substrate 20 are also covered with the light-shielding film 40. By forming inclined surfaces (inclined surfaces 52, 54, and 55, etc.) through steps ST4 and ST5, the light-shielding film 40 can be easily formed on these surfaces. The cross section 51 of the sealing resin portion 50 is substantially perpendicular to the main surface 20M of the substrate 20, and therefore is not covered with the light shielding film 40 and remains exposed. The material of the light-shielding film 40 can be a metal material such as Cr, Ag, or Al. Additionally, the method for forming the light-shielding film 40 is not limited to a dry process such as sputtering or vapor deposition, and a wet process such as plating may be used.

Next, in the manufacturing method shown in FIG. 3, the substrate 20 is separated into pieces (step ST7). In step ST7, cuts are performed in the first and second directions using a dicing device. As a result, the substrate 20 is divided into individual pieces, and individual light receiving modules 100 are formed as shown in FIG. 8. In the cut of step ST7, the height of the dicing blade is adjusted so that the point where the half cut was made in steps ST4 and ST5 is completely cut. Additionally, for this cut, a third dicing blade (not shown) having a rectangular cross-section is used. Both surfaces in the thickness direction of the blade portion of the third dicing blade are substantially perpendicular to the rotation axis of the third dicing blade. For the third dicing blade, for example, a general electroformed dicing blade can be used.

Fig. 9 is a diagram showing the cutting position in the first direction in step ST7. The two-dot chain line in FIG. 9 indicates the point where the dicing blade cuts in step ST7. In the dicing method shown in FIG. 9, dicing is performed at a point between the cross-section 51 and the inclined surface 52 formed in step ST4 (the midpoint excluding the cross-section 51 and the inclined surface 52, and the point with the thinnest thickness). do. In this method, the width to be ground by dicing can be minimized, so the number (yield) of light receiving modules 100 that can be manufactured from one substrate can be increased. Additionally, the cutting position in the first direction in step ST7 is not limited to this, and various modifications are possible.

Hereinafter, a modified example of the cutting position in the first direction in step ST7 will be described. Fig. 10 is a diagram showing a modified example of the cutting position in the first direction in step ST7. The two-dot chain line in FIG. 10 indicates the point where the dicing blade cuts in step ST7. In the dicing method shown in FIG. 10, dicing is performed at a point including the cross section 51 formed in step ST4. By dicing in this way, the cross section 51 formed in step ST4 is ground, and a new cross section 51A is formed. Therefore, even if some light-shielding film 40 is formed on the end surface 51 in step ST6, a completely exposed end surface 51A can be obtained after dicing. This makes it possible to improve the yield. Additionally, in order to perform dicing in this way, the width of the third dicing blade, which has a rectangular cross-section of the blade portion, may be appropriately changed.

Fig. 11 is a diagram showing another modified example of the cutting position in the first direction in step ST7. The two-dot chain line in FIG. 11 indicates the point where the dicing blade cuts in step ST7. In the modification shown in FIG. 11, the bevel cut in step ST4 is performed using a second dicing blade, which is similar to the dicing blade used in step ST5, and has a V-shaped cross section of the blade portion. there is. Thereby, the end surface 51 is provided inclined with respect to the main surface 20M of the substrate 20. In this case, in step ST7, dicing is performed using a third dicing blade whose blade portion has a rectangular cross-section so that the range including the entire inclined cross-section 51 is ground. By performing step ST7 in this way, the inclined cross section 51 is ground, and a new cross section 51B that is approximately perpendicular to the main surface 20M is formed. Therefore, the exposed cross section 51 can be reliably obtained, making it possible to improve the yield. Additionally, the types of dicing blades used in manufacturing the light receiving module 100 can be limited to two types. By these means, it is possible to reduce manufacturing costs.

Next, referring to FIGS. 12 and 13, the effects of the light receiving module 100 manufactured by the above manufacturing method will be described. 12 and 13 are diagrams for explaining the operational effects of the light receiving module 100.

In the light receiving module 100, a light-shielding film 40 is formed on the second end surface 32 and the third end surface 33 of the resin part 30. With this configuration, a light blocking function is realized, and penetration of extraneous light into the light receiving module 100 is suppressed, as shown in FIG. 12 . Additionally, light incident from the first end surface 31 into the inside of the resin portion 30 is reflected by the light shielding film 40 and is trapped inside the resin portion 30. Additionally, since the first end surface 31 is a rough surface, the light incident on the first end surface 31 becomes diffused light and enters the inside of the resin portion 30. The refractive index n of the resin portion 30 is approximately 1.5 and is greater than the refractive index of air (n=1). Due to this difference in refractive index, the diffused light incident on the resin portion 30 is likely to be completely reflected, so the resin portion 30 has the effect of confining the diffused light incident from the first end surface 31. have Due to these effects, it is possible to detect light incident from the first end surface 31 with high sensitivity by the semiconductor light receiving element 10. In addition, since the light-shielding film 40 is integrally molded with the resin portion 30, there is no need to cover the light-receiving module with a cover or case for blocking light, making it possible to miniaturize the light-receiving module 100.

The substrate 20 of the light receiving module 100 is a glass epoxy substrate, and the substrate 20 has a notch portion 23 continuous to the second end surface 32, and the notch portion 23 transmits light of a predetermined wavelength. It is covered with a light-shielding film 40 that blocks light. Since the glass epoxy substrate propagates light, when the notch portion 23 is not covered with a light-shielding film, as shown in FIG. 13(a), extraneous light passes through the glass epoxy substrate to the resin portion ( 30) There is a risk of intrusion. When extraneous light penetrates through the substrate 20, it is assumed that the glass fiber layer 20a including the main surface 20M has a large influence. Accordingly, by forming the notch portion 23 in at least the uppermost glass fiber layer 20a and covering it with the light-shielding film 40, it is possible to prevent extraneous light from entering the glass fiber layer 20a. Therefore, as shown in (b) of FIG. 13, it is possible to block the extraneous light and prevent the extraneous light from penetrating into the interior of the resin portion 30 through the substrate 20. Additionally, in order to suppress incident of disturbance light through the substrate 20, there is no need to use an expensive substrate such as a ceramic substrate. Therefore, it is possible to realize a high-performance light receiving module 100 while maintaining low cost.

In addition to the notch portion 23, the substrate 20 of the light receiving module 100 has a notch portion 24 continuous to the fourth end surface 34 and a notch portion 25 continuous to the fifth end surface 35. Have. The notch portion 24 and the notch portion 25 are also formed to reach at least the glass fiber layer 20a and are covered with the light shielding film 40. With this configuration, the notch portion 24 and the notch portion 25 achieve the same effect as the notch portion 23 covered with the light-shielding film 40 as described above.

In the light receiving module 100, since the second end surface 32 is a rough surface, the diffused light incident on the inside of the resin portion 30 is further diffused than in the second end surface 32. Additionally, the diffused light is reflected by the light-shielding film 40 covering the second end surface 32. Therefore, it is possible to achieve uniformity of luminance inside the resin portion 30, and it is possible to detect light incident from the first end surface 31 with high precision.

In the resin portion 30 of the light receiving module 100, the fourth end face 34 and the fifth end face 35 are covered with a light shielding film 40 that blocks light of a predetermined wavelength. Since the fourth end face 34 and the fifth end face 35 are also covered with the light shielding film 40, the entry of extraneous light into the light receiving module 100 is further suppressed. In addition, light incident into the inside of the resin portion 30 from the first end surface 31 can be confined inside the resin portion 30 more efficiently.

In the light receiving module 100, the fourth end surface 34 and the fifth end surface 35 have a rough surface and are inclined with respect to the main surface 20M of the substrate 20. According to this configuration, the diffused light incident on the inside of the resin portion 30 is further diffused also in the fourth end face 34 and the fifth end face 35. Therefore, inside the resin portion 30, it is possible to achieve greater uniformity of luminance, and it is possible to detect light incident from the first end surface 31 with greater precision.

Next, a modified example of the light receiving module 100 according to the present embodiment will be described with reference to FIGS. 14 and 15. Figure 14(a) and Figure 14(b) are perspective views showing the light receiving module 200 according to this modification. Figure 15 (a) is a cross-sectional view taken along the line XVA-XVA of the light receiving module 200 according to this modification, and Figure 15 (b) is a cross-sectional view taken along the line This is a cross-sectional view. The difference between the light receiving module 200 and the light receiving module 100 according to this modification is that the fourth end surface 34 and the fifth end surface 35 of the resin portion 30 are 20M from the main surface of the substrate 20. ), and that the fourth end face 34 and the fifth end face 35 are not covered with the light shielding film 40.

In the light receiving module 100, only the first end surface 31 of the resin portion 30 is exposed. In contrast, in the light receiving module 200, the first end face 31, the fourth end face 34, and the fifth end face 35 are exposed, and the second end face 32 and the third end face 33 are exposed. ) is covered with a light shielding film 40. The fourth end face 34 and the fifth end face 35 connect the first end face 31 and the second end face 32, and are provided substantially perpendicular to the main surface 20M. Additionally, the fourth end surface 34 and the fifth end surface 35 are exposed rough surfaces.

In the manufacturing method of the light receiving module 200, steps ST1 to ST4 are performed similarly to the manufacturing method shown in FIG. 3. As a result, the object 300 to be processed is processed into the same state as the object 300 shown in FIG. 5 .

Next, step ST6 is executed without executing step ST5. Since step ST5, that is, half cut is not performed in the second direction, step ST6 is performed in a state in which the inclined surfaces 54 and 55 are not formed in the sealing resin portion 50. For this reason, in step ST6, as shown in Fig. 16 (a) to (c), only the inclined surface 52, parallel surface 53, and notch portion 23 of the sealing resin portion 50 are exposed to the light shielding film 40. is covered with

Next, the substrate 20 is separated into pieces (process ST7). To this end, in step ST7, cuts are performed in the first direction (Y-axis direction) and the second direction (X-axis direction) using a dicing device. In the first direction, the point where the half cut was performed in step ST4 is completely cut. Additionally, in the second direction, the substrate 20, the sealing resin portion 50, and the light-shielding film 40 are cut with one cut. As a result, as shown in FIG. 17 , the object to be processed 300 is divided into individual pieces, and the light receiving module 200 is formed.

The light receiving module 200, like the light receiving module 100, is a light receiving module for detecting light incident from the first end surface 31 of the resin portion 30. The second end face 32 and the third end face 33 of the resin part 30 of the light receiving module 200 are covered with a light shielding film 40. As a result, the extraneous light is reflected by the light shielding film 40 and is suppressed from entering the light receiving module 200. Light incident from the first end surface 31 serving as the incident surface penetrates into the interior of the resin portion 30 and is detected by the semiconductor light receiving element 10. Additionally, since the light-shielding film 40 is molded integrally with the light-receiving module 200, it is possible to achieve miniaturization while realizing a light-shielding function. In other respects as well, the light receiving module 200 can achieve substantially the same effects as the light receiving module 100.

In the light receiving module 200, the fourth end face 34 and the fifth end face 35 of the resin part 30 are not covered with the light shielding film 40, so the light blocking property against extraneous light and the resin part 30 ), it may be slightly inferior to the light receiving module 100 regarding the effect of confining diffused light inside the light receiving module 100. However, the light receiving module 200 can be manufactured with fewer processes than the light receiving module 100. Additionally, the types of dicing blades used in manufacturing the light receiving module 200 can be limited to two types. Therefore, it is possible to reduce manufacturing costs and improve mass productivity.

Next, referring to FIG. 18, the light emitting module 400 according to an embodiment of the present disclosure will be described. Figure 18 is a perspective view showing the light emitting module 400 according to an embodiment of the present disclosure. The difference between the light emitting module 400 shown in FIG. 18 and the light receiving module 100 is that a semiconductor light emitting element 410 is mounted on the substrate 420 instead of the semiconductor light receiving element 10.

The light emitting module 400 has substantially the same structure as the light receiving module 100 and includes a semiconductor light emitting element 410, a substrate 420, a resin portion 430, and a light shielding film 440. The semiconductor light emitting device 410 is mounted on the main surface 420M of the substrate 420. A terminal portion 421 is provided on the main surface 420M of the substrate 420. The terminal portion 421 is electrically connected to the semiconductor light emitting device 410. The resin portion 430 is provided on the main surface 420M of the substrate 420, and seals the semiconductor light emitting device 410 and the main surface 420M. The resin portion 430 has a first end face 431, a second end face 432, a third end face 433, a fourth end face 434, and a fifth end face 435. The first end face 431 is exposed, and the second end face 432, third end face 433, fourth end face 434, and fifth end face 435 are covered with a light blocking film 440. The overall dimensions of the light emitting module 400 can be arbitrarily set within the same range as the overall dimensions of the light receiving module 100.

The above light emitting module 400 can be manufactured by a manufacturing method similar to the manufacturing method shown in FIG. 3. In manufacturing the light emitting module 400, in step ST1, the semiconductor light emitting element 410, not the semiconductor light receiving element 10, is fixed on the main surface 20M of the substrate 20. For example, a light emitting diode or a semiconductor laser can be used as the semiconductor light emitting device 410. Additionally, for fixing the semiconductor light-emitting element 410, a conductive die bonding paste can be used, as in fixing the semiconductor light-receiving element 10. Since the processes from step ST2 to step ST7 are the same as the manufacturing method of the light receiving module 100 described above, their description is omitted.

The light emitting module 400 is a light emitting module whose light emitting surface is the first end surface 431 of the resin part 430. The second end face 432, the third end face 433, the fourth end face 434, and the fifth end face 435 of the resin part 430 of the light emitting module 400 are covered with a light blocking film 440. As a result, as shown in FIG. 19, the light emitted from the semiconductor light emitting device 410 is divided into the second end face 432, the third end face 433, the fourth end face 434, and the fifth end face 435. In this case, it is reflected into the inside of the resin part 430 by the light shielding film 440 and is emitted only from the first end surface 431. Accordingly, loss of light emitted from the semiconductor light emitting device 410 can be suppressed, and light can be emitted from the first end surface 431. Additionally, since the light-shielding film 440 is integrally molded with the light-emitting module 400, it is possible to achieve miniaturization while realizing a light-shielding function.

In the light emitting module 400, the second end face 432, third end face 433, fourth end face 434, and fifth end face 435 of the resin part 430 are rough surfaces, so that the semiconductor light emitting device 410 ) The light emitted from ) is diffused inside the resin portion 430. Therefore, the entire surface of the first end surface 431, which is the light emission surface, can emit light. Additionally, since the first end surface 431 is also a rough surface, the light emitted from the first end surface 431 becomes diffused light.

Although various embodiments have been described above, the present invention is not limited to the above-described embodiments and various modifications can be adopted. For example, in the light receiving module 200, the fourth end face 34 and the fifth end face 35 of the resin portion 30 may also be covered with the light shielding film 40. Additionally, in the light emitting module 400, the fourth end face 434 and the fifth end face 435 of the resin portion 430 may be formed substantially perpendicular to the main surface 420M of the substrate 420. In that case, the fourth end surface 434 and the fifth end surface 435 may be exposed. Additionally, in the light receiving module or the light emitting module, a notch portion (notch portion 23, etc.) continuous on the same surface as the inclined surface (second end surface 32, etc.) may be formed below the uppermost layer of the substrate. The notch portion may be formed to reach the bottom surface of the substrate.

According to the present disclosure, it is possible to achieve miniaturization while realizing a light blocking function.

10… Semiconductor light receiving element 11… Sugwang-myeon
12a, 12b... Electrode 20… Board
20M… If you give 20a… fiberglass layer
21… Terminal part 22… bonding wire
23, 24, 25… Notch 30… Resin part
31… First section 32... second section
33… Third section 34... Section 4
35… Fifth section 40... sunshade
50… Sealing resin part 100… light receiving module
200… Light receiving module 300… object to be processed
400… Light emitting module 410… semiconductor light emitting device
420… Substrate 420M… If you give it
421… Terminal part 430… Resin part
440… sunshade

Claims (10)

A semiconductor light receiving element,
A substrate on which the semiconductor light-receiving element is mounted and which has a terminal portion electrically connected to the semiconductor light-receiving element on its main surface;
It is optically transparent to light of a predetermined wavelength and has a resin portion that seals the semiconductor light receiving element and the main surface of the substrate,
The resin part,
a first cross section extending in a direction intersecting the main surface;
a second cross section facing the first cross section and extending in a direction intersecting the main surface;
connecting the first end surface and the second end surface, and having a third end surface parallel to the main surface of the substrate,
The first cross section is rough and exposed,
The second cross section is a rough surface and is inclined with respect to the main surface,
A light receiving module wherein the second end surface and the third end surface are covered with a light shielding film that blocks light of the predetermined wavelength. In claim 1,
The substrate is a glass epoxy substrate,
The substrate has a notch portion continuous with the second cross section,
A light receiving module wherein the notch portion is covered with a light shielding film that blocks light of the predetermined wavelength. In claim 1 or claim 2,
The resin portion connects the first end face and the second end face, and further has a fourth end face and a fifth end face extending in a direction intersecting the main surface of the substrate,
A light receiving module wherein the fourth end face and the fifth end face are covered with a light shielding film that blocks light of the predetermined wavelength. In claim 3,
The light receiving module wherein the fourth end surface and the fifth end surface have a rough surface and are inclined with respect to the main surface of the substrate. In claim 4,
The substrate has separate notch portions continuous with each of the fourth end face and the fifth end face,
A light receiving module wherein the separate notch portion is covered with a light shielding film that blocks light of the predetermined wavelength. A process of fixing a semiconductor light receiving element on the main surface of a substrate;
A step of electrically connecting the semiconductor light receiving element and a terminal portion formed on the main surface of the substrate;
A step of sealing the main surface of the semiconductor light-receiving element and the substrate using a resin that is optically transparent to light of a predetermined wavelength to form a sealing resin portion;
A step of forming an inclined surface inclined with respect to the main surface in the sealing resin portion by performing a bevel cut in a first direction along the main surface of the substrate;
A step of covering the parallel surface and the inclined surface of the sealing resin portion parallel to the main surface with a light-shielding film that blocks light of the predetermined wavelength;
A method of manufacturing a light receiving module including at least a step of performing dicing in a second direction orthogonal to the first direction to separate the substrate into pieces. In claim 6,
A method of manufacturing a light receiving module further comprising a step of performing a half cut in the second direction prior to the step of covering with the light shielding film. In claim 6 or claim 7,
In the step of forming the inclined surface in the sealing resin portion, a notch portion continuous with the inclined surface is formed in the substrate by performing a bevel cut in the first direction. delete delete

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