KR20180103243A - Quantum Dot, Film and Lighting device - Google Patents

Abstract

A lighting device according to an embodiment of the present invention includes: a light source for emitting light; a reflecting member for reflecting the light from the light source to a light emission area; and a fluorescent layer formed on a partial area of the reflecting member. The reflecting member includes a reflective top side facing the light source and a reflective lateral side with a rectangular shape. The fluorescent layer is formed on the reflective lateral side. The fluorescent layer includes a quantum dot with inorganic ligands and beads coated on a surface. Accordingly, the present invention can improve thermal stability.

Description

[0001] The present invention relates to quantum dots, films and lighting devices,

Embodiments relate to quantum dots.

Embodiments relate to films comprising quantum dots.

An embodiment relates to a lighting device.

A quantum dot is a semiconductor material having a crystal structure of a few nanometers in size and exhibits properties between a bulk semiconductor and a discontinuous molecule of the same material. The quantum confinement effect and the large surface-to-volume ratio allow the physical, chemical and electrical properties to be controlled by changing the size of the same material, so the quantum dot has attracted great interest as a new material control method and material .

Conventional quantum dots are formed in a core-shell structure, and organic ligands bind to the surface of the quantum dots.

In the case of the quantum dots to which the organic ligands are bonded, the emission characteristics of the quantum dots are deteriorated at high temperatures.

When the quantum dots to which the organic ligands are bonded are used in an illumination device, the emission characteristics of the quantum dots are lowered due to heat generation of the illumination device, and thus light of a desired color can not be output.

The examples provide quantum dots with improved thermal stability.

The embodiment provides an illumination device with improved quantum efficiency.

A quantum dot according to an embodiment includes a quantum dot having a core-shell structure; And inorganic ligands and beads formed on the surface of the quantum dots.

An illumination apparatus according to an embodiment includes: a light source for emitting light; A reflecting member for reflecting the light from the light source to an outgoing light area; And a fluorescent layer formed on a part of the reflective member, wherein the reflective member includes a reflective upper surface facing the light source and a rectangular reflective side, the fluorescent layer being formed on the reflective side, The layer comprises quantum dots coated with inorganic ligands and beads on the surface.

The quantum dot according to the embodiment has an effect of improving the thermal stability by forming an inorganic ligand on the surface of the quantum dot.

The illumination device according to the embodiment has the effect of improving the quantum efficiency by including the fluorescent layer in which beads are formed on the surface of the quantum dots.

FIG. 1 is a diagram showing a quantum dot according to the first embodiment. FIG.
2 is a graph showing the intensity of light emitted when the quantum dot according to the first embodiment is heated.
FIG. 3 is a graph showing the light emission intensity when the film including the quantum dot according to the first embodiment is heated.
FIG. 4 is a diagram showing a quantum dot according to the second embodiment. FIG.
5 is a graph showing the intensity of light in quantum dots according to the comparative example and the second embodiment.
6 is a perspective view of a lighting apparatus according to an embodiment.
7 is an exploded perspective view of a lighting apparatus according to an embodiment.
8 is a bottom perspective view of a reflective member according to one embodiment.
9 is a cross-sectional view of a lighting apparatus according to an embodiment.
10 is a top view showing a support member and a light source according to an embodiment.
11 is a cross-sectional view taken along the line AA 'in Fig.
12 is a diagram showing wavelengths output by a lighting apparatus according to an embodiment.
13 is a graph showing the intensity of a lighting apparatus according to an exemplary embodiment with respect to time.
14 is a view showing a lighting apparatus according to another embodiment.
15 is a bottom perspective view of a reflecting member according to still another embodiment.
16 is a sectional view of a lighting apparatus according to another embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.

The same reference numerals are used to designate the same components in the same reference numerals in the drawings of the embodiments.

A quantum dot according to an embodiment includes a quantum dot having a core-shell structure; And inorganic ligands and beads formed on the surface of the quantum dots.

The inorganic ligand may include at least one of an ether compound, an unsaturated hydrocarbon, or oleic acid.

The ether compound may include at least one of tri-n-octylphosphine oxide (TOPO), alkylphosphine, octyl ether, and benzyl ether .

The unsaturated hydrocarbons may include at least one of octane and octadecane.

The organic acid may include at least one of oleic acid, stearic acid, myristic acid, and hexadecanoic acid.

The amount of the inorganic ligand relative to the quantum dot may be from 1: 1000 to 1: 100.

The beads may comprise at least one of ZnSt2, SiO2 and TiO2.

The beads may be 1 wt% to 100 wt% of the quantum dots.

The beads include a first bead and a second bead, and the first bead and the second bead may be different materials.

The film according to an embodiment may include the above quantum dots.

An illumination apparatus according to an embodiment includes: a light source for emitting light; A reflecting member for reflecting the light from the light source to an outgoing light area; And a fluorescent layer formed on a part of the reflective member, wherein the reflective member includes a reflective upper surface facing the light source and a rectangular reflective side, the fluorescent layer being formed on the reflective side, The layer comprises quantum dots coated with inorganic ligands and beads on the surface.

And a support member disposed at a lower portion of the reflective member and supporting the light source, wherein the fluorescent layer may be formed on a portion of the reflective side adjacent to the support member.

The quantum dot may be formed in a part of the fluorescent layer.

The quantum dot may be formed only in a region of the fluorescent layer that is spaced apart from the support member.

The fluorescent layer may include a plurality of fluorescent bands spaced apart from each other.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing a quantum dot according to the first embodiment. FIG.

Referring to FIG. 1, a quantum dot 1 according to the first embodiment includes a core 3 and a shell 5.

The shell 5 may be applied on the core 3. Each of the core 4 and the shell 5 may be composed of a single layer or two or more layers. For example, the quantum dot 1 may have a core-shell-shell structure, and may be composed of, for example, CdSe / CdS / ZnS.

The quantum dot 1 is a nano-sized semiconductor material and exhibits a quantum confinement effect. The quantum dot 1 absorbs light from an excitation source and emits energy corresponding to an energy band gap of the corresponding quantum dot 1 when it reaches an energy excited state. Therefore, if the size or the material composition of the quantum dot 1 is controlled, the corresponding energy band gap can be controlled to emit various kinds of light, which can be used as an emitter of an electronic device.

The nano-sized semiconductor material may be selected from Group II-VI compounds, Group III-V compounds, Group IV-VI compounds, Group IV compounds, or mixtures thereof.

CdSeS, CdSeS, CdSeS, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, HgSe, HgTe, ZnTe, ZnSe, ZnTe, ZnO, A trivalent compound such as CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, or a ternary compound such as HggZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe have.

The group III-V compound may be one of GaN, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, GaN, GaN, GaN, GaN, GaN, AlN, AlN, AlN, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, InAlPb, , And the like.

The IV-VI compound may be at least one selected from the group consisting of ternary compounds such as SnSeS, SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe and SnPbTe, SnPbSSe, SnPbSeTe , SnPbSTe, and the like.

The Group IV compound may be selected from the group consisting of single element compounds such as Si and Ge, or these element compounds such as SiC and SiGe.

In the case of the elemental compound, the trivalent compound, or the silane compound, the crystal structure thereof may be partially contained and exist in the same particle or in the form of an alloy.

The surface of the quantum dot 1 may be coated with an inorganic ligand 7.

The inorganic ligand (5) may be coordinately bonded to the surface of the quantum dot (1).

The inorganic ligand (5) may include at least one of an ether compound, an unsaturated hydrocarbon, and an organic acid. The solvent used as the inorganic ligand (5) may include at least one of ether compounds, unsaturated hydrocarbons and organic acids.

The ether compound may include at least one of tri-n-octylphosphine oxide (TOPO), alkylphosphine, octyl ether, and benzyl ether .

The unsaturated hydrocarbons may include at least one of octane and octadecane.

The organic acid may include at least one of oleic acid, stearic acid, myristic acid, and hexadecanoic acid.

The inorganic ligand (7) is coated on the surface of the quantum dot (1) to improve the thermal stability. That is, since the inorganic ligand 7 is coated on the surface of the quantum dot 1, it is possible to prevent the emission characteristic from being degraded even if heat is applied to the quantum dot 1. [

The amount of the inorganic ligand 7 relative to the quantum dot 1 may be from 1: 1000 to 1: 100. When the amount of the inorganic ligand 7 relative to the quantum dot 1 is 1: 000 to 1: 100, there is an effect of improving the thermal stability effectively and the quantum dot efficiency may not be lowered.

When the amount of the inorganic ligand 7 relative to the quantum dot 1 is less than 1: 1000, the effect of thermal stability is small. When the amount of the inorganic ligand 7 is larger than 1: 100 relative to the quantum dot 1, The efficiency of the quantum dot is deteriorated.

2 is a graph showing the intensity of light emitted when the quantum dot according to the first embodiment is heated.

Table 1 shows the emission intensity, half band width and quantum efficiency of the quantum dots in the comparative example and the first embodiment.

division Luminescence intensity (a.u.) Half width (nm) Quantum efficiency (%) Comparative Example 26500 32 77 First Embodiment 29700 31 85

The comparative examples in Table 1 and Fig. 2 show conventional quantum dots without the addition of the inorganic ligand (7), and the first embodiment shows the quantum dots (1) coated with the inorganic ligand (7) in Fig.

In Table 1 and FIG. 2, the quantum dots of the first and comparative examples were heated to a temperature of 150 degrees and then their properties were measured.

As a result, the luminescence intensity of the first embodiment is 12% larger and the quantum efficiency is 8% larger than that of the comparative example. In addition, the half width of the wavelength range of the output light does not substantially change.

As shown in Table 1 and FIG. 2, the first embodiment has a larger luminous efficiency and quantum efficiency than the comparative example. That is, even when the inorganic ligand 7 is applied, the characteristic change of the quantum dot 1 is smaller than that in the case where the inorganic ligand 7 is not applied, even if it is heated to 150 degrees. Therefore, there is an effect that the thermal stability is improved by applying the inorganic ligand 7 to the quantum dot 1.

FIG. 3 is a graph showing the light emission intensity when the film including the quantum dot according to the first embodiment is heated.

Table 2 shows the emission intensity, half band width and quantum efficiency of the film including the quantum dots of the comparative example and the first embodiment.

division Luminescence intensity (a.u.) Half width (nm) Quantum efficiency (%) Comparative Example 9800 42 20 First Embodiment 30000 41 42

The comparative example in Table 2 and Fig. 3 shows a conventional quantum dot-containing film without addition of the inorganic ligand 7, and the first embodiment includes the quantum dot 1 to which the inorganic ligand 7 of Fig. 1 is applied Lt; / RTI >

In Table 2 and FIG. 3, the film including the quantum dots of the first and comparative examples was heated to 150 degrees and then the characteristics were measured.

As a result, the film of the first embodiment has a light emission intensity as high as 306% and a quantum efficiency as high as 22% as compared with the film of the comparative example. And the half width showing the wavelength range of the outputted light is hardly changed.

As shown in Table 2 and Fig. 3, the film of the first embodiment has a larger luminous efficiency and quantum efficiency than the film of the comparative example. That is, even when the inorganic ligand 7 is applied, the characteristic change of the quantum dot 1 is smaller than that in the case where the inorganic ligand 7 is not applied, even if it is heated to 150 degrees. Therefore, by applying the inorganic ligand 7 to the quantum dot 1, the thermal stability of the film including the quantum dot 1 is improved.

FIG. 4 is a diagram showing a quantum dot according to the second embodiment. FIG.

The quantum dot according to the second embodiment is the same as the quantum dot according to the first embodiment except that the quantum dot further includes a bead. Therefore, in describing the second embodiment, the same reference numerals are assigned to the same components as those of the first embodiment, and a detailed description thereof is omitted.

Referring to FIG. 4, the quantum dot 1 according to the second embodiment includes a core 3 and a shell 5.

The surface of the quantum dot 1 may be coated with an inorganic ligand 7. The quantum dot 1 may include a bead 8. The beads 8 may be located inside the inorganic ligand 7. At least a part of the beads 8 may be located on the surface of the inorganic ligand 7 and the beads 8 may be located between the inorganic ligand 7 and the quantum dots 1.

The beads 8 may include at least one of ZnSt2, ZnAc, ZnCl, ZnO, TiO2, SIO2, and CuO2.

The quantum efficiency of the quantum dot 1 can be increased by including the bead 8 in the quantum dot 1.

The beads 8 may be 1 wt% to 100 wt% of the quantum dot (1).

The quantum efficiency can be increased by making the beads 8 1 wt% to 100 wt% with respect to the quantum dot (1). When the weight ratio of the beads 8 to the quantum dots 1 is less than 1 wt% or exceeds 100 wt%, the effect of increasing the quantum efficiency is reduced or decreased.

The beads 8 may comprise a first bead and a second bead. The first bead and the second bead may be different materials. The first bead may be TiO2, and the second bead may be ZnSt2. The quantum efficiency of the quantum dots can be further increased when the beads include different materials as described above.

5 is a graph showing the intensity of light in quantum dots according to the comparative example and the second embodiment.

Table 3 is a table showing the quantum efficiency of quantum dots according to the comparative example and the second embodiment.

division Quantum efficiency (%) Comparative Example 20 Example 2 + ZnSt2 0.1 wt% 33 Example 2 + ZnSt2 0.5 wt% 45 Example 2 + ZnSt2 1.0 wt% 47

5 and Table 3 show quantum dots to which inorganic ligands and beads are not added and quantum dots to which beads are added in the second embodiment. The beads used here were ZnSt2, and the quantum efficiency and light intensity were measured by controlling the weight ratio of ZnSt2.

The quantum efficiency in the comparative example is 20%, the peak value of the light intensity is about 3000, the quantum efficiency is 33% when the weight ratio of ZnSt2 is 0.1 wt% in the second embodiment, and the peak value of the light intensity is about 10000 , The quantum efficiency is 45% and the peak value of the light intensity is about 29000 when the weight ratio of ZnSt2 is 0.5 wt%. When the weight ratio of ZnSt2 is 1.0 wt% in the second embodiment, 47%, and the peak value of the light intensity is about 30000.

Compared to the comparative example, the quantum efficiency increases and the light intensity increases in the second embodiment. In particular, when the weight ratio of ZnSt2 beads is 0.5 wt% to 1.0 wt% in the second embodiment, the quantum efficiency is greatly increased and the light intensity is greatly increased as compared with other cases, thereby improving the characteristics of the quantum dots.

Table 4 is a table showing the quantum efficiency of quantum dot acryl according to the embodiment.

division Quantum efficiency Comparative Example 17 QD + inorganic ligand 36 QD + inorganic ligand + TiO2 25 QD + inorganic ligand + ZnSt2 39 QD + inorganic ligand + TiO2 + ZnSt2 45

Quantum dot acrylics according to the embodiments are prepared by adding inorganic ligands and beads to quantum dots and mixing them with acryl and heating them at a temperature of 300 ° C.

In the comparative example, the quantum efficiency is 17% in the case of the quantum dot acrylic manufactured by mixing with the acrylic in the state that the conventional inorganic ligand and the bead are not added.

The quantum dot acrylate produced by mixing inorganic ligand with acrylate by adding an inorganic ligand to the quantum dots has a quantum efficiency of 36% and quantum dot efficiency of 25% by adding the inorganic ligand and TiO2 beads to the quantum dots and mixing them with acrylic. I have. Quantum-dot acrylics prepared by mixing inorganic ligands and ZnSt2 beads with quantum dots added to the quantum dots were found to have a quantum efficiency of 39%, and quantum dot acrylics prepared by mixing inorganic ligands, TiO2, and ZnSt2 beads with acryl, And has a quantum efficiency of 45%.

Thus, it can be confirmed that the quantum dot acrylate prepared by mixing an inorganic ligand, TiO 2, and ZnSt 2 beads with the acrylic ligand to the quantum dot has the highest quantum efficiency.

Figs. 6 to 11 are diagrams for a lighting device having a fluorescent layer including quantum dots of the first and second embodiments. Fig.

FIG. 6 is a perspective view of a lighting apparatus according to an embodiment, FIG. 7 is an exploded perspective view of a lighting apparatus according to an embodiment, FIG. 8 is a bottom perspective view of a reflective member according to an embodiment, 10 is a top view showing a support member and a light source according to an embodiment, and Fig. 11 is a cross-sectional view taken along the line AA 'in Fig.

6 to 11, a lighting apparatus 9 according to an embodiment may include a frame 10, a reflecting member 20, and a supporting member 30. As shown in Fig.

The frame 10 may be a frame or a frame forming the body of the lighting device 9. [ The frame 10 may have a cylindrical shape with an empty interior. The frame 10 may have a cylindrical shape with a bottom surface opened. The frame 10 may have a cylindrical shape with an upper surface and a lower surface opened.

Although not shown, the frame 10 may further include a heat dissipating member. Alternatively, the frame 10 may be made of a material having high thermal conductivity to facilitate heat dissipation. The heat dissipation capability of the frame 10 is improved, so that the heat in the illumination device 9 can be discharged to the outside, and damage to the internal structure due to heat can be prevented.

Although not shown, the heat dissipating member may be formed on the outer surface of the frame 10, and the heat dissipating member may be formed on the inner surface of the frame 10. When the radiation member is formed on the inner surface of the frame 10, the radiation member may be formed between the frame 10 and the reflection member 20.

The reflective member 20 may be inserted into the frame 10. The reflective member 20 may be fixed to the inside of the frame 10 in a sheet form. A part of the reflection member 20 may be attached to the inside of the frame 10 so that the whole of the reflection member 20 is fixed to the frame 10. [

The reflective member 20 may be formed in a shape corresponding to the frame 10. The reflective member 20 may be formed in a columnar shape having an open end.

The reflective member 20 may include a reflective upper surface 21 and reflective side 23. The reflective upper surface 21 may have a circular shape. The reflective upper surface 21 may have the same center as the circular light exit area 50. That is, the reflective upper surface 21 may have a concentric circular shape with respect to the outgoing light region 50. The reflective upper surface 21 may have a size corresponding to the outgoing area 50. The reflective upper surface 21 may be a surface parallel to the outgoing light area 50.

The reflective side 23 may have a square developed view. The reflective side 23 may have a rectangular shape. The bottom surface of the reflective side 23 may have a length corresponding to the circumference of the reflective top surface 21. [ The bottom surface of the reflective side surface 23 may have a planar shape. Since the bottom surface of the reflective side surface 23 has a planar shape, it is easy to manufacture, and the assembly is easier than the conical shape.

The reflective upper surface 21 and the reflective side surface 23 may be integrally formed. The reflective upper surface 21 and reflective side 23 may comprise the same material.

When the reflective member 20 is formed in the form of a sheet, the reflective member 20 may include a resin layer, a foam or a filler (a diffuser), a metal layer, and a protective layer. For example, the resin layer is formed of a material such as PET, PC, PV, PP and the like, and may contain therein a foaming or oil / inorganic filler such as barium sulfate or potassium carbonate. A metal layer such as aluminum or silver is formed on one surface of the resin layer and a protective layer for protecting the reflective member 20 is formed on one surface of the metal layer.

Examples of the inorganic filler for increasing the reflectance of the reflective member 20 include barium sulfate (BaSO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), barium carbonate (BaCO3), calcium carbonate (CaCO3) , Magnesium hydroxide (MgCl2), aluminum hydroxide (Al (OH) 3), magnesium hydroxide (Mg (OH) 2), calcium hydroxide (Ca (OH) 2), titanium dioxide (TiO2), alumina (Al2O3) ), Talc (H2Mg3 (SiO3) 4 or Mg3Si4O10 (OH) 2), and zeolite. In addition, the reflective member 20 may not include a metal layer, and an ultraviolet absorbing layer (deterioration preventing layer) may be further included on one surface of the resin layer or may be included in the resin layer.

The thickness of the reflective member 20 may be 0.015 mm to 15 mm. The reflectivity of the reflective member 20 may be 60% to 99.8%. Further, according to another embodiment, the reflective member 20 does not include a diffusion pattern or a filler, and can be a highly reflective sheet. In this case, since the reflectivity of the reflective member 20 is high, the amount of light to be lost is small, and as a result, the amount of light to be emitted can be increased.

A photocatalyst can be applied to the surface of the reflective member 20, which reflects light, to prevent the adsorption of dust.

The photocatalyst may include a titanium compound represented by TiOx: D. Here, D means a dopant, and the dopant may include N, C, -OH, Fe, Cr, Co or V. The titanium compound may be titanium dioxide (TiO2) or titanium nitrate (TiON), and may be coated with hydrophilic particles using fine particles. The particle diameter of the photocatalyst may be several nm to several hundred nm. For example, the particle diameter of the photocatalyst may be from 5 nm to 900 nm.

The photocatalyst is coated on the reflective member 20 by applying a binder or a solution including a photocatalyst on the surface of the reflective member 20 and drying the binder or the solution. The binder or the solution containing the photocatalyst is dried to a thickness of 0.05 to 20 탆 .

The electrical properties of the titanium compound exhibit a semiconducting property. The titanium compound exhibits a strong oxidizing power and is chemically stable when exposed to ultraviolet light having a short wavelength (380 nm) or less or visible light having a wavelength of 380 nm to 780 nm. That is, when the titanium compound absorbs ultraviolet rays or visible rays, electrons and holes are generated on the surface, and generated electrons and holes serve to decompose most harmful substances.

The photocatalyst has a hydrophilic effect and thus has a dust-proof effect. That is, when the water is sprayed on the surface of the photocatalyst coating, the angle of contact between the droplet sprayed on the surface of the substrate and the surface of the substrate is reduced, and the hydrophilic effect of the surface is exhibited.

The photocatalyst has the ability to oxidize and decompose various organic substances (carbon compounds). By virtue of this function, the photocatalyst is capable of oxidizing and decomposing various organic substances (carbon compounds), such as ammonia, hydrogen sulfide, acetaldehyde, trimethylamine, methylmercapthalene, methyl sulfide, It is possible to remove odors, purify air, and sterilize / antibacterial effects.

The photocatalyst may be sprayed on the surface of the reflective member 20 in a liquid phase. That is, the user can easily apply the photocatalyst to the surface of the reflecting member 20 by spraying the liquid photocatalyst on the surface of the reflecting member 20 using the injection mechanism.

The photocatalyst may be applied to the surface of the reflective member 20 by a screen printing method, a gravure printing method, a spraying method, or a post-spraying roll brush method.

 The screen printing is a printing method in which a liquid phase containing a photocatalyst is uniformly applied through a fine mesh formed on a screen for printing. The gravure printing is a method in which a liquid containing a photocatalyst buried in a concave roller is applied to the surface The spraying method is a method in which a liquid phase containing a photocatalyst is sprayed onto a surface, and the post-spraying roll brushing method is a method in which a liquid phase containing a photocatalyst is sprayed onto a surface thereof and then rubbed uniformly with a roll brush Method.

According to this embodiment, there is an advantage that the photocatalyst can be efficiently applied to a large amount of the reflective member 20 by the printing method.

The organic or inorganic solvent may be pretreated before the photocatalyst is applied. That is, a photocatalyst can be coated on the surface of the reflective member 20 after the organic contaminants are washed with an organic or inorganic solvent. Here, the organic or inorganic solvent may be an alkaline chemical such as acetone or alcohol, a neutral detergent, or the like.

Also, a coating layer formed of silver nano or aluminum nano may be formed on the surface of the reflective member 20, and then a photocatalyst may be coated thereon. The silver nano or aluminum coating layer has an advantage of enhancing the reflection efficiency of the reflection auxiliary device.

In addition, the photocatalyst may further include an additive for controlling the viscosity.

The reflective member 20 may be formed by a method of being applied to the inner side of the frame 10. A material having a high reflectance is applied to the inside of the frame 10, so that the reflective member 20 can be formed of a material having a high reflectance.

A fluorescent layer 25 may be formed on a part of the reflective member 20. The fluorescent layer 25 may be formed in a strip shape. A fluorescent layer 25 may be formed on a part of the reflective side 23. The fluorescent layer 25 may be formed on a part of the inner side surface of the reflective side 23.

The fluorescent layer 25 may be attached to the reflective side 23 or may be formed by applying a fluorescent material to the reflective side 23.

The fluorescent layer 25 may be formed in a lower region of the reflective side 23. The fluorescent layer 25 may be formed on a part of the reflective side 23 adjacent to the light source 40. The fluorescent layer 25 may be formed in a lower region of the reflective side 23 spaced from the reflective upper side 21. The fluorescent layer 25 may be formed in contact with one end of the reflective side 23 adjacent to the light source 40 and may be spaced apart from one end of the reflective side 23 adjacent to the light source 40, Or may be formed spaced apart.

The fluorescent layer 25 may have a constant height h. The fluorescent layer 25 may have a height h of 8 mm to 16 mm. Preferably, the fluorescent layer 25 may have a height h of 16 mm.

The fluorescent layer 25 is formed in contact with one end of the reflective side 23 adjacent to the light source 40 and has a constant height range so that the fluorescent layer 25 is visible under the illuminating device . In other words, since the fluorescent layer 25 is in contact with one end of the reflective side surface 23 and has a predetermined height range, the fluorescent layer 25 can be covered by the supporting member 30, It is possible to prevent the fluorescent layer 25 from being visible at the lower portion of the lighting apparatus 9. [ That is, the phosphor layer 25 can be prevented from being visually recognized by the first projecting region 31 of the support member 30. [

The fluorescent layer 25 may include an inorganic fluorescent material or an organic fluorescent material. The fluorescent layer 25 may include a quantum dot.

The concentration of the phosphor of the fluorescent layer 25 may be 10% to 50%. Preferably, the concentration of the phosphor of the fluorescent layer 25 may be 20%.

The height of the fluorescent layer 25 may vary depending on the concentration of the fluorescent material. For example, when the concentration of the fluorescent layer 25 is increased, the height of the fluorescent layer 25 can be reduced. If the height of the fluorescent layer 25 is large, the light reflected by the reflecting member 20 may be reduced and the light efficiency may be reduced. Therefore, if the concentration of the fluorescent layer 25 is adjusted to a desired color temperature, The height of the fluorescent layer 25 can be reduced.

The height of the fluorescent layer 25 may be determined according to the size of the phosphor. For example, when the size of the phosphor is large, a desired color temperature can be obtained even if the phosphor layer 25 having a small height is used. Accordingly, the height of the phosphor layer 25 can be reduced to increase the light efficiency.

The phosphor may generate excitation light having a wavelength other than the visible light region generated by the light source 40.

The fluorescent layer 25 is made of YBO3: Ce3 +, Tb3 +; BaMgAl10O17: Eu2 +, Mn2 +; (Sr, Ca, Ba) (Al, Ga) 2S4: Eu2 +; ZnS: Cu, Al; Ca8Mg (SiO4) 4Cl2: Eu2 +, Mn2 +; Ba2SiO4: Eu < 2 + >; (Ba, Sr) 2SiO4: Eu < 2 + >; Ba2 (Mg, Zn) Si2O7: Eu2 +; (Ba, Sr) Al 2 O 4: Eu 2+; Sr2Si3O8.2SrCl2: Eu2 +; (Sr, Mg, Ca) 10 (PO4) 6Cl2: Eu2 +; BaMgAl10O17: Eu < 2 + >; BaMg2Al16O27: Eu < 2 + >; Sr, Ca, Ba, Mg) P2O7: Eu < 2 + >, Mn < 2 + >; (CaLa2S4: Ce3 +, SrY2S4: Eu2 +, (Ca, Sr) S: Eu2 +, SrS: Eu2 +, Y2O3: Eu3 +, Bi3 +, YVO4: Eu3 +, Bi3 +, Y2O2S: Eu3 +, Bi3 +, Y2O2S: Eu3 + And may be a material selected from the group consisting of any one of phosphors.

When the fluorescent layer 25 includes quantum dots, the quantum dots may be quantum dots of the first and second embodiments.

The fluorescent layer 25 may include a red fluorescent material. Since the fluorescent layer 25 includes a red fluorescent material, the light from the light source 40 may be reflected to the fluorescent layer 25 to increase the color rendering index (CRI) and be output to the outside. In addition, the fluorescent layer 25 includes a phosphor and / or a quantum dot, thereby achieving a desired color temperature (CCT).

The CRI represents the degree of change of the color of the object when the natural light (similar to black body radiation) having the same color temperature and the artificially produced illumination are irradiated to the same object, and the natural light, that is, the black body radiation, Indicating how close the illumination is to this. As the CRI approaches 100, the light emitting device implements white light close to natural light.

The CRI of the light output from the lighting device is increased by the fluorescent layer 25 so that white light close to natural light can be output. It is possible to output a high CRI light with a simple structure like the fluorescent layer 25, to reduce manufacturing cost compared with a high CRI light according to the package structure, to reduce defects that may occur in a packaging process, The manufacturing yield can be improved.

Further, the density and type of the fluorescent material and quantum dots of the fluorescent layer 25 can be controlled to control the color temperature, and light with a desired color temperature can be obtained with a simple method.

In addition, light of a desired wavelength can be output by controlling the density and type of the fluorescent material and quantum dots of the fluorescent layer 25. For example, the density and type of the quantum dots included in the fluorescent layer 25 can be controlled to output light of a specific wavelength. Alternatively, light of a specific wavelength can be output by adjusting the physical property of the quantum dot included in the fluorescent layer 25.

By adjusting the quantum dots included in the fluorescent layer 25, the wavelength width of the light output from the illumination device can be changed. For example, by controlling the quantum dots included in the fluorescent layer 25, the width of the red light output from the illumination device can be adjusted to effectively utilize the plant growth illumination. 12A, the wavelength of the red light can be widened by adjusting the quantum dots of the illumination device according to the embodiment of FIG. 12A, and accordingly, the light having a wide wavelength range It can be used as high-efficiency plant growth illumination.

The support member 30 may be positioned at one end of the frame 10 and the reflective member 20. The support member 30 may be formed in a shape corresponding to one end of the reflective member 20. The support member 30 may be formed in a shape corresponding to one end of the frame 10. Since one end of the frame 10 and one end of the reflection member 20 are formed in a circular strip shape, the support member 30 may be formed in a circular strip shape.

The central region of the support member 30 may be open. The central region of the support member 30 may be open to have an outgoing area 50. That is, the light-outgoing region 50 can be defined by the circular band-like support member 30. [ The periphery of the light outgoing area 50 may be defined by the opening of the support member 30. [

The outgoing light region 50 may be formed in a circular shape. Although not shown, a light output sheet may be attached to the light outgoing area 50. The outgoing sheet can transmit all the light directed to the outgoing light area (50). The light-outgoing sheet can block foreign matter flowing into the lighting device 9. [ It is possible to prevent the foreign matter introduced into the illumination device 9 from being blocked by the outgoing sheet so that the reflectance of the reflection member 20 can be prevented from being lowered by the foreign matter.

Although not shown, a reflective sheet may be attached to the upper surface of the support member 30. [ The reflective sheet attached to the upper surface of the support member 30 may be the same sheet as the reflective member 20. [ Alternatively, the upper surface of the support member 30 may be coated with a reflective material.

The reflection sheet is attached to the upper surface of the support member 30 or the reflection material is applied to reflect the light directed toward the support member 30 toward the reflection member 20 so as to be emitted through the outgoing area 50 . As a result, the amount of light of the lighting device 10 increases, and the power consumption of the same amount of light can be reduced.

Although not shown, the support member 30 may further include a heat radiation member. Alternatively, the support member 30 may be formed of a material having high thermal conductivity to facilitate heat dissipation. The support member 30 may be formed of a metal material having high thermal conductivity. The heat dissipation capability of the support member 30 is improved, so that the heat in the illumination device 9 can be discharged to the outside, and damage to the internal structure due to heat can be prevented.

The support member 30 may include a first protruding region 31, a second protruding region 33, and a support region 35. The first protruding region 31 may protrude from the inside of the support member 30 toward the reflective upper surface 21. The second protruding region 33 may protrude from the outer side of the support member 30 toward the reflective upper surface 21.

The support region 35 may connect the first protruding region 31 and the second protruding region 33 with each other. That is, the first protruding region 31 and the second protruding region 33 may protrude from both sides of the support region 35 toward the reflective upper surface 21. The first protruding region 31, the second protruding region 33, and the supporting region 35 may be integrally formed. The support region 35 may support the light source 40.

The first protruding region 31 may be formed between the support region 35 and the outgoing region 50. The first protruding region 31 may be formed between the support region 35 and the outgoing region 50 to block light directly irradiated from the light source 40 to the outgoing region 50. That is, the first protruding area 31 prevents the light from the light source 40 from being emitted to the outgoing area 50 without reflection process by the reflective member 20, .

The first protruding region 31 and the second protruding region 33 are protruded from both sides of the support region 35 so that the flow of the frame 10 and the reflection member 20 in the horizontal direction . The first projecting region 31 and the second projecting region 33 can improve the stability of the lighting apparatus 9 by preventing the horizontal movement of the frame 10 and the reflecting member 20 There is an effect. In addition, the first and second protruding regions 31 and 33 can prevent the light source 40 from flowing in the horizontal direction, thereby improving the stability of the illumination device 9.

The light source (40) may be disposed on the support member (30). The light source 40 may be disposed on a support region 35 of the support member 30. The light source 40 may be arranged so as to correspond to the shape of the support member 30. The light source 40 may be disposed in a shape corresponding to one end of the reflective member 20. The light source 40 may be arranged in a circular band shape. The light source 40 may be arranged to surround the light-outgoing region 50. The light source 40 may be disposed in a closed loop shape surrounding the light outgoing area 50. The light source 40 may be disposed along the periphery of the outgoing light region 50.

The light source 40 may include a plurality of light emitting diodes 41 and a plurality of printed circuit boards 43.

The light emitting diode 41 may be a light emitting diode (LED) or an organic light emitting diode (OLED).

The light emitting diode 41 may be formed on the printed circuit board 43. The light emitting diode 41 may be attached to one surface of the printed circuit board 43. The light emitting diode 41 may be mounted on the printed circuit board 43. The light emitting diode 41 may be mounted on the printed circuit board 43 in the form of a package and the light emitting diode may be mounted on the printed circuit board 43 in the form of a chip on board (COB).

The plurality of light emitting diodes 41 may be arranged to correspond to the shape of the support member 30. The plurality of light emitting diodes 41 may be disposed in a shape corresponding to one end of the reflective member 20. The plurality of light emitting diodes 41 may be arranged in a circular band shape. The plurality of light emitting diodes 41 may be arranged to surround the light outgoing area 50. The plurality of light emitting diodes 41 may be disposed in a closed loop shape surrounding the outgoing light area 50. [ The plurality of light emitting diodes 41 may be disposed along the periphery of the light output region 50.

The plurality of light emitting diodes 41 may be formed on the plurality of printed circuit boards 43. A plurality of light emitting diodes 41 can be mounted on one printed circuit board 43. Each printed circuit board 43 on which the plurality of light emitting diodes 41 are mounted may be electrically connected to each other through a connection wiring 45.

The plurality of light emitting diodes 41 may receive power required for driving the light emitting diodes 41 through a power supply unit 60. The power supply unit 60 is connected to the printed circuit board 43 through a power supply line 61 to transmit power to the printed circuit board 43. The printed circuit board 43 receiving the power from the power supply unit 60 supplies power to the mounted LEDs 41 and supplies power to the adjacent printed circuit board 43 through the connection wiring 45. [ do. The adjacent printed circuit board 43 also supplies power to the mounted light emitting diode 41 and transfers power to the other printed circuit board 43 through the connection wiring 45. Then, power is applied to the plurality of light emitting diodes 41 so that all the light emitting diodes 41 emit light.

The power supply unit 60 may include an AC to DC converter (ADC) that converts AC to DC. The power supply unit 60 converts AC power from the outside into DC power and transmits the DC power to the printed circuit board 43. The power supply unit 60 may reduce the converted direct current power and transmit the reduced direct current power to the printed circuit board 43.

The power supply unit 60 may be located outside the lighting device 9. [ Or the power supply unit 60 may be located inside the lighting device 9. [ Although not shown, the power supply unit 60 may be mounted on at least one of the plurality of printed circuit boards 43 in the form of a chip.

If the power supply unit 60 includes only the ADC function, a separate DC-DC converter may be mounted on the printed circuit board 43. The DC-DC converter may convert the power supply voltage received from the power supply unit 60 to correspond to the driving voltage of the light emitting diode 41 and transmit the converted power supply voltage to the light emitting diode 41 and the adjacent printed circuit board 43 .

Since the power supply unit 60 is mounted on the printed circuit board 43, the lighting unit 9 can be operated and installed integrally without a separate power supply unit 60, which facilitates installation and transportation.

The printed circuit board 43 may include a metallic material. The printed circuit board 43 may be a metal PCB including a material such as Al and Cu. The printed circuit board 43 may be a FR1, FR4, or CEM1 PCB. The printed circuit board may include epoxy or phenol.

Also, the printed circuit board 43 may be a flexible printed circuit board that can be rotated by an external force.

The printed circuit board 43 may include a filling part 47 and a heat radiating part 49.

The filler 47 may be a region where the metal material is filled into a skeleton or a frame of the printed circuit board 43. The heat dissipation unit 49 may be a region where the metal material is not filled.

The heat dissipation unit 49 may be an empty space in which the metal material is not filled. The heat radiating portion 49 may be formed inside the printed circuit board 43. The heat radiating portion 49 may be formed along the side surface of the printed circuit board 43. The area of contact with the outside of the filling part 47 is widened through the heat dissipating part 49 so that the heat generated in the light emitting diode 41 and the printed circuit board 43 can easily escape to the outside have. Accordingly, there is an effect that the defects of the light emitting diode 41 and the printed circuit board 43 due to heat can be reduced.

The heat from the light emitting diode 41 is transmitted to the support member 30 through the printed circuit board 43 and the support member 30 having a high thermal conductivity discharges heat to the outside, The damage of the light emitting diode 41 and the printed circuit board 43 can be reduced.

The reflective upper surface 21 may have a constant width d and the reflective side 23 may have a constant height l.

The ratio of the height d of the reflective upper surface 21 to the height l of the reflective side 23 may be 1: 1.9 to 1: 4.3.

Preferably, the ratio of the height d of the reflective upper surface 21 to the height l of the reflective side 23 may be 1: 2 to 1: 4. When the height l of the reflecting side surface 23 and the width d of the reflecting top surface 21 have the above ratios, the light efficiency increases and the reduction rate decreases.

More preferably, when the ratio of the width d of the reflective upper surface 21 to the height l of the reflective side surface 23 is 1: 2.2 to 1: 3.3, the ratio is less than 1: 2.2 and more than 1: 3.3 Has a relatively high light efficiency, and has a relatively low reduction rate.

The reflective side 23 and the reflective upper side 21 are formed at a ratio of 1: 2.2 to 1: 3.3 in the ratio of the height d of the reflective side 23 to the width d of the reflective upper side 21 Thereby improving the light efficiency and reducing the power consumption of the lighting apparatus.

In addition, the height (1) of the reflecting side surface 23 may be 3 cm to 7 cm to improve the light efficiency. Preferably, the height (1) of the reflecting side surface 23 is set to 4 cm to 6 cm, so that the power consumption of the lighting apparatus can be reduced.

In addition, the reflective side surface 23 may be formed in a rectangular shape having a base-to-base contrast ratio of 10: 1 to 20: 3. The light efficiency can be improved by forming the height of the bottom side of the reflective side surface 23 at a ratio of 10: 1 to 20: 3.

By forming the reflecting member 20 in a cylindrical shape, the number of times of reflection of the light emitted from the light source 40 with respect to the conical shape can be reduced, so that the light efficiency can be improved as compared with the conical reflecting member.

13 is a graph showing the intensity of a lighting apparatus according to an exemplary embodiment with respect to time.

FIG. 13A is a graph showing intensity with time of an illumination device coated with a fluorescent layer including a quantum dot according to the related art, FIG. 13B is a graph showing intensity with time of a lighting device coated with a fluorescent layer containing a quantum dot according to the second embodiment And FIG.

Table 5 shows the intensity of the output light according to the operating time of the illumination device coated with the fluorescent layer including the conventional quantum dots and the illumination device coated with the fluorescent layer containing the quantum dots according to the second embodiment.

division characteristic Initial state Late state Conventional lighting apparatuses coated with fluorescent layers containing quantum dots lm 661 536 lm / W 64.6 53.7 CRI 94.3 86.8 The illuminating device coated with the fluorescent layer containing the quantum dots according to the second embodiment lm 661 659 lm / W 64.6 65.0 CRI 94.3 93.6

Referring to FIGS. 13A and 5B, in the case of a conventional illumination device coated with a fluorescent layer containing a quantum dot, luminous efficiency, light efficiency, and CRI are greatly reduced in a state of 500 hours after light emission compared with the initial state.

On the other hand, in the case of the illuminating device coated with the fluorescent layer including the quantum dot according to the second embodiment of FIG. 13B and FIG. 5, the luminous efficiency, the light efficiency and the change of the CRI even after the lapse of 500 hours Is small.

That is, in the case of the illumination device coated with the fluorescent layer including the quantum dot according to the second embodiment, the thermal stability of the quantum dots is ensured, and even if the light is emitted for a long time, the efficiency of the quantum dots does not change according to the temperature, There is an effect.

14 is a view showing a lighting apparatus according to another embodiment.

The illumination device according to another embodiment of Fig. 14 differs from the embodiment of Figs. 6 to 11 in the formation region of the fluorescent layer 25, and the remaining components are the same. Therefore, in explaining another embodiment, a detailed description is omitted for the configuration common to the embodiment.

14, the illumination device 109 according to another embodiment may include a frame 110, a reflection member 120, and a support member 130. [

The frame 110 may be formed in a cylindrical shape. The reflective member 120 may have a cylindrical shape.

The reflective member 120 may include a reflective upper surface 121 and reflective side surfaces 123. The reflective upper surface 121 may have a circular shape. The reflective side 123 may have a developed view in a rectangular shape. The reflective side surface 123 may have a rectangular shape.

A fluorescent layer 125 may be formed on a part of the reflective member 120. The fluorescent layer 125 may be formed on the reflective side 123. The fluorescent layer 125 may be formed on the inner surface of the reflective side 123. The fluorescent layer 125 may be formed on the front surface of the reflective side 123. The fluorescent layer 125 may have a shape corresponding to the reflecting side 123.

By forming the fluorescent layer 125 in the entire area of the reflective side surface 123, the ratio of the light incident on the fluorescent layer 125 of the light output from the light source 140 increases, It is possible to output light of a uniform wavelength band.

15 is a bottom perspective view of a reflective member according to another embodiment.

The reflective member according to another embodiment of FIG. 15 differs from that of the embodiment of FIGS. 6 to 11 in the shape of the fluorescent layer, and the remaining components are the same. Therefore, in explaining another embodiment shown in FIG. 15, detailed description of the same configuration as that of the embodiment will be omitted.

Referring to FIG. 15, the reflective member 220 according to another embodiment of the present invention may include a reflective upper surface 221 and a reflective side surface 223.

A plurality of fluorescent bands 225 may be formed on the reflective side 223. The plurality of fluorescent strips 225 may have a band shape. The fluorescent band 225 may be attached to the reflective side 223 or may be formed by applying a fluorescent material to the reflective side 223.

The fluorescent band 225 may be formed in a lower region of the reflective side 223. The fluorescent band 225 may be formed in a part of the reflective side surface 223 adjacent to the light source 40. The fluorescent band 225 may be formed in a lower region of the reflective side 223 spaced apart from the reflective upper side 221. The fluorescent band 225 may be spaced apart from the one end of the reflective side 223 adjacent to the light source 40 by a predetermined distance.

The fluorescent band 225 may be formed in a rectangular shape. The fluorescent band 225 may be formed in a rectangular shape. The fluorescent band 225 may be formed to have a predetermined distance from the adjacent fluorescent band. The fluorescent band 225 may have a constant height and a constant width.

The fluorescent band 225 may be formed to have a height of 8 mm to 16 mm. The fluorescent band 225 may have a width of 50 mm to 100 mm. The width and the height of the fluorescent band 225 may be formed to have a predetermined ratio. The ratio of the width to the height of the fluorescent band 225 may be 8:25 to 2:25. The adjacent fluorescent band 225 may have a separation distance of 10 mm to 15 mm.

The fluorescent band 225 may include an inorganic fluorescent material or an organic fluorescent material. The fluorescent band 225 may include a quantum dot.

Since the fluorescent layer is formed of a plurality of fluorescent bands 225, it is possible to output light with a high CRI, and it is possible to output light having a uniform wavelength.

16 is a sectional view of a lighting apparatus according to another embodiment of the present invention.

The illumination device according to another embodiment of the present invention shown in FIG. 16 is the same as the illumination device according to the present invention shown in FIGS. 6 to 11 except that the auxiliary fluorescent layer is further formed. Therefore, in describing still another embodiment of the present invention, detailed description of the configuration common to the embodiment of the present invention will be omitted

Referring to FIG. 16, a lighting apparatus 309 according to another embodiment of the present invention includes a reflective member 320. The reflective member 320 may include a reflective upper surface 321 and a reflective side surface 323.

A fluorescent layer 325 may be formed on a part of the reflective side 323. The fluorescent layer 325 may be attached to the reflective side 323 and the fluorescent material may be applied to the reflective side 323.

The illumination device 9 may further include an auxiliary fluorescent layer 327. [ The auxiliary fluorescent layer 327 may be formed in a region adjacent to the light source 340. The auxiliary fluorescent layer 327 may be formed on the opposite side of the fluorescent layer 325 with respect to the light source 340. The auxiliary fluorescent layer 327 may be formed to face the fluorescent layer 325 with the light source 340 interposed therebetween. That is, the light source 340 may be positioned between the fluorescent layer 325 and the auxiliary fluorescent layer 327.

The auxiliary fluorescent layer 327 may have the same shape as the fluorescent layer 325. The auxiliary fluorescent layer 327 may have a size corresponding to the fluorescent layer 325. The auxiliary fluorescent layer 327 may have the same height as the fluorescent layer 325.

When the fluorescent layer 325 includes a plurality of fluorescent bands, the auxiliary fluorescent layer 327 may include a plurality of auxiliary fluorescent bands. The width and the separation distance of the auxiliary fluorescent layer 327 may correspond to the plurality of fluorescent bands. That is, the plurality of fluorescent bands 325 are arranged in a circular shape with respect to the center point of the outgoing region 50, and the plurality of auxiliary fluorescent bands are arranged in a circular shape with respect to the center point of the outgoing region 50 . The plurality of fluorescent bands (325) are arranged along a constant circumference, and the auxiliary fluorescent bands are also arranged along a certain circumference. The distance from the center point to the plurality of fluorescent bands (325) It is different from the distance. As a result, the circumferences where the plurality of fluorescent bands 325 are arranged vary in the circumferential direction in which the plurality of auxiliary fluorescent bands are arranged, and the width and the separation distance of the auxiliary fluorescent bands are determined so as to correspond to the ratio of the circumferential .

The auxiliary fluorescent layer 327 may be formed of the same material as the fluorescent layer 325.

The light output from the light source 340 is reflected by the fluorescent layer 325 and the auxiliary fluorescent layer 327 and is output, so that the CRI can be raised and output as homogeneous wavelength band light.

By providing the auxiliary fluorescent layer 327 as described above, even if a separate packaging process is omitted, light with a desired color temperature can be output, CRI can be increased, and uniform wavelength range light can be output . As a result, the manufacturing cost can be reduced, defects in the packaging process can be prevented, and the manufacturing yield can be improved.

The auxiliary phosphor layer 327 may be formed on the support member 330. The auxiliary phosphor layer 327 may be formed on the first protruding region 331 of the support member 330. The auxiliary fluorescent layer 327 may be attached to the first protruding region 331 or may be formed by coating the first protruding region 31 with a fluorescent material.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be apparent to those skilled in the art that changes or modifications may fall within the scope of the appended claims.

1: Quantum dot
3: Core
5: Shell
7: Inorganic ligand
9: Bead

Claims (15)

A light source for emitting light;
A reflecting member for reflecting the light from the light source to an outgoing light area; And
And a fluorescent layer formed on a part of the reflective member,
Wherein the reflective member includes a reflective upper side facing the light source and a rectangular reflective side,
Wherein the fluorescent layer is formed on the reflective side,
Wherein the fluorescent layer comprises a quantum dot on which an inorganic ligand and a bead are coated.
The method according to claim 1,
Further comprising a support member disposed below the reflection member and supporting the light source,
Wherein the fluorescent layer is formed on a portion of the reflective side adjacent to the support member.
3. The method of claim 2,
And the quantum dot is formed in a part of the fluorescent layer.
The method of claim 3,
Wherein the quantum dot is formed only in a region of the fluorescent layer that is spaced apart from the support member.
The method according to claim 1,
Wherein the fluorescent layer comprises a plurality of fluorescent strips spaced apart from each other.
A quantum dot having a core-shell structure; And
And quantum dots including inorganic ligands and beads formed on the surfaces of the quantum dots.
The method according to claim 6,
Wherein the inorganic ligand comprises at least one of an ether compound, an unsaturated hydrocarbon, or oleic acid.
8. The method of claim 7,
Wherein the ether compound comprises at least one of tri-n-octylphosphine oxide (TOPO), alkylphosphine, octyl ether, and benzyl ether.
8. The method of claim 7,
Wherein the unsaturated hydrocarbons include at least one of octane and octadecane.
8. The method of claim 7,
Wherein the organic acid comprises at least one of oleic acid, stearic acid, Myristic acid, and hexadecanoic acid.
The method according to claim 6,
Wherein the amount of the inorganic ligand relative to the quantum dot is 1: 1000 to 1: 100.
The method according to claim 6,
Wherein the bead comprises at least one of ZnSt2, SiO2 and TiO2.
The method according to claim 6,
Wherein the bead is 1 wt% to 100 wt% of the quantum dot.
The method according to claim 6,
Wherein the bead comprises a first bead and a second bead,
Wherein the first bead and the second bead are different materials.
A film comprising the quantum dot of any one of claims 6 to 14.

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