KR20180099495A - Flux composition, solder composition, and electronic board - Google Patents

Abstract

The present invention relates to a flux composition, containing (A) resins and (B) activators. Moreover, the flux composition contains carboxylic acid additives, having a structure where the (B) component is represented by chemical formula (1) of (B1) molecular, and (B2) amines.

Description

FLUX COMPOSITION, SOLDER COMPOSITION, AND ELECTRONIC BOARD Technical Field < RTI ID = 0.0 >

The present invention relates to flux compositions, solder compositions and electronic substrates.

The solder composition is a mixture of a solder powder and a flux composition (rosin-based resin, activator, solvent, etc.) kneaded into a paste form (Reference 1: Japanese Patent No. 5887330). In recent years, lead-free solder that does not contain lead (Pb) has been widely used as a solder in consideration of environmental problems. Further, as a flux composition, a non-halogen which does not contain a halogen-free halogen-free halogen reduced in consideration of environmental problems is required.

Halogen compounds in conventional flux compositions are used as active agents with excellent performance. However, in the halogen-free flux composition, it is necessary to supplement the activity with an activator other than a halogen-based agent. Thus, for example, the combination of an organic acid and an amine is studied as an active agent composition. However, such an activator composition can compensate for the activity and improves the solderability. However, since some organic acids and amines easily react at room temperature, there is a problem in terms of storage stability, and there is a limitation in usable materials.

The present invention aims to provide a flux composition having sufficient solder melting property and sufficient storage stability, a solder composition using the flux composition, and an electronic substrate using the same.

In order to solve the above problems, the present invention provides a flux composition, solder composition and electronic substrate as described below.

The flux composition of the present invention comprises a carboxylic acid adduct having (A) a resin and (B) an activator and the component (B) having a structure represented by the following structural formula (1) in the molecule of (B1) ) Amines. ≪ / RTI >

The solder composition of the present invention is characterized by containing the above flux composition and solder powder.

The electronic board of the present invention is characterized by including a soldering portion using the solder composition.

The reason why the flux composition of the present invention has sufficient solder melting property and sufficient storage stability is not necessarily sure, but the present inventors contemplate as follows.

That is, the flux composition of the present invention contains (B) a carboxylic acid adduct (B1) as an active agent and (B2) an amine (an imidazole compound, etc.). Since the carboxyl group is blocked at room temperature, the component (B1) does not readily react at room temperature even when the component (B2) is present. Therefore, sufficient storage stability can be ensured. On the other hand, when the component (B1) is heated in the reflow process, the block of the carboxyl group is removed, so that the oxide film on the metal surface can be removed. Further, the component (B2) can form a coating of a complex on the metal surface from which the oxide film on the metal surface has been removed, thereby preventing the re-oxidation of the metal surface. By such a mechanism, sufficient solder melting property can be ensured. The inventors of the present invention contemplate that the effects of the present invention are achieved as described above.

According to the present invention, it is possible to provide a flux composition having sufficient solder melting property and sufficient storage stability, a solder composition using the flux composition, and an electronic substrate using the same.

Hereinafter, embodiments of the flux composition, solder composition and electronic substrate of the present invention will be described.

[First Embodiment]

[Flux composition]

First, the flux composition of the present embodiment will be described. The flux composition of the present embodiment is a component other than the solder powder in the solder composition, and contains the resin (A) and the activator (B).

[Component (A)] [

Examples of the resin (A) used in the present embodiment include (A1) a rosin-based resin and (A2) a thermosetting resin. Further, the flux composition (A1) used in the rosin-based resin (so-called rosin-based flux) does not have the thermosetting property, while the flux composition using the thermosetting resin (A2) has the thermosetting property.

Further, in the present embodiment, a case where the (A) resin (A1) is used as the resin will be described as an example.

Examples of the rosin-based resin (A1) include rosin and rosin-based modified resins. Examples of the rosin include gum rosin, wood rosin, tall oil rosin, disproportionated rosin, polymerized rosin, hydrogenated rosin, and derivatives thereof. Examples of the rosin-based modified resin include unsaturated organic acid-modified resins of the rosins (such as (meth) acrylic acid, aliphatic unsaturated monobasic acids such as fumaric acid and maleic acid, And modified resins such as unsaturated carboxylic acids having aromatic rings such as aluminosilicate dibasic acids such as carboxylic acid and cinnamic acid) and abietic acid such as modified products thereof, and modified products thereof, etc. . These rosin-based resins may be used singly or in combination of two or more kinds.

The blending amount of the component (A1) is preferably 30% by mass or more and 70% by mass or less, more preferably 35% by mass or more and 60% by mass or less based on 100% by mass of the flux composition. If the amount of the component (A1) is less than the lower limit described above, oxidation of the copper foil surface of the solder land is prevented, so that the solderability can be improved and solder balls can be sufficiently restrained . When the blending amount of the component (A1) is not more than the upper limit, the amount of the flux residue can be sufficiently suppressed.

[Component (B)] [

The activator (B) used in this embodiment needs to contain the following (B1) carboxylic acid adduct and (B2) amine.

The carboxylic acid adduct (B1) used in the present embodiment is a carboxylic acid adduct having a structure represented by the following structural formula (1) in the molecule. Examples of the component (B1) include a carboxylic acid adduct represented by the following general formula (2).

In the general formula (2), n represents an integer of 1 to 6. From the viewpoints of solder melting property and storage stability, n is preferably 1 to 4, more preferably 1 to 3, and particularly preferably 2.

When n is 1, X ¹ is a monovalent hydrocarbon group.

Examples of the monovalent hydrocarbon group include an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 1 to 18 carbon atoms, and an aryl group having 6 to 18 (preferably 6) carbon atoms. The alkyl group and alkenyl group may be linear or branched.

When n is 2, X ¹ is a divalent hydrocarbon group or an organic group or a single bond.

Examples of the divalent hydrocarbon group include an alkylene group having 1 to 18 carbon atoms, an alkenylene group having 1 to 18 carbon atoms, an arylene group having 6 to 18 carbon atoms (preferably 6), and a dimerized hydrocarbon group having 34 carbon atoms. . The alkylene group and alkenylene group may be linear or branched. Among them, an alkylene group having 1 to 18 carbon atoms is more preferable.

Examples of the divalent organic group include an organic group having an ether bond such as - (CH ₂ ) _m -O- (CH ₂ ) _m -. M represents an integer of 1 to 10 (preferably 1 to 3, more preferably 1).

When n is 3, X ¹ is a trivalent hydrocarbon group or organic group.

Examples of the trivalent hydrocarbon group include aliphatic hydrocarbon groups of 1 to 18 carbon atoms, aromatic hydrocarbon groups of 6 to 18 carbon atoms (preferably 6 carbon atoms), and hydrocarbon groups of 51 carbon atoms.

Examples of the trivalent organic group include a group in which a part of hydrogen of a trivalent hydrocarbon group is substituted with a hydroxyl group or the like.

When n is 4, X ¹ is a tetravalent hydrocarbon group or an organic group.

Examples of the tetravalent hydrocarbon group include an aliphatic hydrocarbon group having 1 to 18 carbon atoms and an aromatic hydrocarbon group having 6 to 18 carbon atoms (preferably 6).

Examples of the tetravalent organic group include a group in which a part of hydrogen of a tetravalent hydrocarbon group is substituted with a hydroxyl group or the like.

When n is 5, X ¹ is a pentavalent hydrocarbon group or an organic group.

The 5-valent hydrocarbon group includes an aliphatic hydrocarbon group having 1 to 18 carbon atoms and an aromatic hydrocarbon group having 6 to 18 carbon atoms (preferably 6).

Examples of the five-valent organic group include a group in which a part of hydrogen of a pentavalent hydrocarbon group is substituted with a hydroxyl group or the like.

When n is 6, X ¹ is a hexavalent hydrocarbon group or organic group.

The hexavalent hydrocarbon group includes an aliphatic hydrocarbon group having 1 to 18 carbon atoms and an aromatic hydrocarbon group having 6 to 18 carbon atoms (preferably 6).

Examples of the 6-valent organic group include a group in which a part of hydrogen of a hexavalent hydrocarbon group is substituted with a hydroxyl group or the like.

X ² represents -R ¹ or -R ² -OH.

R ¹ is an alkyl group. The alkyl group may be straight-chain or branched. The number of carbon atoms of the alkyl group is not particularly limited, but is preferably 1 to 20, more preferably 3 to 18.

R ² is an alkylene group or an oxyalkylene group. The alkylene group and oxyalkylene group may be linear or branched. The number of carbon atoms of the alkylene group and the oxyalkylene group is not particularly limited, but is preferably 1 to 20, and more preferably 3 to 18.

Examples of the component (B1) include a carboxylic acid adduct represented by the following general formula (3) in addition to the carboxylic acid adduct represented by the general formula (2).

In the general formula (3), p represents an integer of 0 or more. In addition, the carboxylic acid adduct represented by the general formula (3) is a polymer and is a mixture of components having different degree of polymerization. The weight average molecular weight of the polymer is preferably from 1000 to 15000, more preferably from 1000 to 10000 from the viewpoints of solder melting and storage stability. The weight average molecular weight of the polymer is a standard polystyrene reduced value measured by a gel permeation chromatography (GPC) method.

Y ¹ represents a substituted or unsubstituted ethylene group or propylene group. Of these, the ethylene group is more preferable from the viewpoint of the solder melting property.

Y ² represents -OL ¹ - or -OL ² -OL ² -.

L ¹ is an alkylene group. The alkylene group may be straight-chain or branched. The number of carbon atoms of the alkylene group is not particularly limited, but is preferably 1 or more and 5 or less, and more preferably 1 or more and 3 or less.

L ² is an alkylene group. Examples of the alkylene group include a methylene group, an ethylene group, and a propylene group. Of these, an ethylene group is preferred.

Z represents a hydrogen atom, a group represented by the following formula (3a) or a group represented by the following formula (3b).

The carboxylic acid adduct (B1) used in the present embodiment is obtained, for example, by reacting a carboxylic acid or carboxylic acid anhydride with a vinyl ether compound. More specifically, a carboxylic acid adduct represented by the general formula (2) is obtained by reacting a carboxylic acid with a vinyl ether compound. Further, a carboxylic acid anhydride and a vinyl ether compound are reacted to obtain a carboxylic acid adduct represented by the above general formula (3).

The carboxylic acid adduct represented by the general formula (2) may be prepared by mixing a carboxylic acid and a vinyl ether compound in a predetermined ratio, and stirring the mixture at a predetermined temperature (for example, 20 ° C or more and 150 ° C or less) (For example, 10 minutes to 36 hours). The reaction is terminated when the acid value of the obtained carboxylic acid adduct becomes 10 mgKOH / g or less.

The carboxylic acid may be straight-chain, branched-chain or straight-chain. Examples of the carboxylic acid include a monocarboxylic acid, a dicarboxylic acid, a tricarboxylic acid, and a tetracarboxylic acid. The number of carbon atoms of these carboxylic acids is not particularly limited, but is preferably 2 or more and 54 or less, more preferably 3 or more and 54 or less, and particularly preferably 3 or more and 36 or less.

These carboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimetic acid, suberic acid, azelaic acid, sebacic acid, undecane diacid, dodecane diacid, tetradecanedioic acid, Octadecanedioic acid, octadecanedioic acid, 8-ethyloctadecanedioic acid, 7,12-dimethyloctadecan-1,18-dicarboxylic acid, propanetricarboxylic acid, 1 , 2,3,4-butanetetracarboxylic acid, 8,13-dimethyl-8,12-eicosadienic acid, diglycolic acid, citraconic acid, trimellitic acid, dimeric acid, . These may be used singly or in combination of two or more kinds.

The vinyl ether compound is a compound having a vinyl group and an ether bond in one molecule. Examples of the vinyl ether compound include a compound represented by the following formula (4) and a compound represented by the following formula (5).

H ₂ C = CH-OR ¹ (4)

In the general formula (4), R ¹ is an alkyl group. The alkyl group may be straight-chain or branched.

H ₂ C = CH-OR ² -OH (5)

In the above general formula (5), R ² is an alkylene group or an oxyalkylene group. The alkylene group and oxyalkylene group may be linear or branched.

The number of carbon atoms of the vinyl ether compound is not particularly limited, but is preferably 3 or more and 22 or less, more preferably 3 or more and 20 or less.

Examples of the vinyl ether compound include n-butyl vinyl ether, 2-ethylhexyl vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether.

The carboxylic acid adduct represented by the above general formula (3) can be obtained by compounding a solvent (for example, propylene glycol monomethyl ether acetate), a carboxylic acid anhydride and a vinyl ether compound at a predetermined ratio, (For example, 10 minutes to 36 hours) in a solvent (for example, 20 ° C or more and 150 ° C or less), and then removing the solvent. The reaction is terminated when the acid value of the obtained carboxylic acid adduct becomes 20 mgKOH / g or less.

As the carboxylic acid anhydride, it is preferable to use a cyclic carboxylic acid anhydride. Examples of the cyclic carboxylic acid anhydride include succinic anhydride, maleic anhydride, maleic anhydride, hexahydrophthalic anhydride, phthalic anhydride, 4-methylhexahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, and 3 , 4,5,6-tetrahydrophthalic anhydride, and the like. Of these, succinic anhydride is preferable.

As the vinyl ether compound, those having a hydroxyl group are preferably used. Examples of the vinyl ether compound having a hydroxyl group include a compound represented by the following formula (6) and a compound represented by the following formula (7).

H ₂ C = CH-OL ¹ -OH (6)

In the above general formula (6), L ¹ is an alkylene group. The alkylene group may be straight-chain or branched. The number of carbon atoms of the alkylene group is not particularly limited, but is preferably 1 or more and 5 or less, and more preferably 1 or more and 3 or less.

H ₂ C = CH-OL ² -OL ² -OH (7)

In the general formula (7), L ² is an alkylene group. Examples of the alkylene group include a methylene group, an ethylene group and a propylene group. Of these, an ethylene group is preferred.

Examples of the vinyl ether compound having a hydroxyl group include 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether.

The decomposition initiating temperature of the component (B1) by differential scanning calorimetry (DSC) is preferably 25 ° C to 270 ° C, more preferably 30 ° C to 260 ° C. If the decomposition starting temperature is lower than the lower limit described above, the usable time can be further improved. If the decomposition starting temperature is not higher than the upper limit, the solder wettability can be further improved. Here, the differential scanning calorie can be measured using a known differential scanning calorimeter, and can be measured using, for example, a differential scanning calorimeter "DSC6200" manufactured by Seiko Instruments Inc.

(Also referred to as melting and decomposition starting temperature) measured by thermogravimetric thermal analysis (TG / DTA) of the component (B1) is preferably 25 ° C or more and 270 ° C or less, and more preferably 30 ° C or more and 260 ° C or less. If the softening point is lower than the lower limit, the usable time can be further improved. If the softening point is not more than the upper limit, the solder wettability can be further improved. Here, the softening point can be measured by the following method.

(B1) is used as a sample, weighing 10 mg ± 3 mg, and TG / DTA measurement is carried out under the following conditions while heating to 30 to 250 ° C. As a reference, 10 mg ± 3 mg of inactive alumina powder is weighed and used.

Measurement apparatus: "TG / DTA6200" manufactured by Seiko Instruments Inc.

Atmosphere: Waiting

Heating rate: 10 ° C / min

From the viewpoint of storage stability, the acid value of the component (B1) is preferably 20 mgKOH / g or less, more preferably 10 mgKOH / g or less, and still more preferably 5 mgKOH / g or less.

The blending amount of the component (B1) is preferably 0.1% by mass or more and 22% by mass or less, more preferably 0.5% by mass or more and 20% by mass or less based on 100% by mass of the flux composition. If the amount is less than the lower limit described above, the solderability can be further improved. If the upper limit is not exceeded, the flux residue can be sufficiently suppressed.

Examples of the (B2) amines used in the present embodiment include aliphatic amines, aromatic amines, guanidine compounds, amine adducts, nitrogen-containing heterocyclic compounds (imidazole compounds, pyridine compounds, azole compounds, pyrazole compounds, , Morpholine compounds, and piperazine compounds), amine salts, and the like. Of these, aliphatic amines or imidazole compounds are preferred. These may be used singly or in combination of two or more kinds.

As the aliphatic amine, it is preferable to use an aliphatic amine having 3 to 18 carbon atoms. The aliphatic amine may be any of a primary amine, a secondary amine and a tertiary amine, but is preferably a primary amine. The aliphatic amine may be not only a monoamine, but also a diamine or triamine. The aliphatic amine may be an alkanolamine, an ether amine or an ester amine.

As the primary amine, ethylamine, propylamine, butylamine, isopropylamine, butylamine, isobutylamine, tert-butylamine, hexylamine, dimethylhexylamine, amylamine, octylamine, 2-ethylhexylamine, , 1-aminodecane, cyclohexylamine, dimethylcyclohexylamine, diethylcyclohexylamine, and allylamine. These may be used singly or in combination of two or more kinds.

Examples of secondary amines include diethylamine, dipropylamine, diisopropylamine, di-n-butylamine, diamylamine, dihexylamine, didodecylamine, diallylamine, and dicyclohexylamine . These may be used singly or in combination of two or more kinds.

Examples of tertiary amines include triethylamine, triisopropylamine, tri-n-propylamine, tri-n-butylamine, tri-n-hexylamine, dicyclohexylmethylamine, and N, N-diisopropylcyclohexyl Amine and the like.

Examples of the diamine include diethylethylenediamine, dimethylaminopropylamine, diethyldiaminopropane, dibutylaminopropylamine, tetramethylethylenediamine, and tetramethyltrimethylenediamine. These may be used singly or in combination of two or more kinds.

Examples of the triamine include pentamethyldiethylenetriamine and the like.

Examples of the alkanolamine include ethanolamine, glycol amine, diethanolamine, triethanolamine, methyldiethanolamine, and aminopropanol. These may be used singly or in combination of two or more kinds.

Examples of the ether amine include methoxypropylamine, ethoxypropylamine, bis (2-dimethylaminoethyl) ether, ethylhexyloxypropylamine, polyoxyethylene oleylamine, polyoxyethylene laurylamine, and polyoxyethylene stearylamine And the like. These may be used singly or in combination of two or more kinds.

Examples of ester amines include 2- (dimethylamino) ethyl acetate and the like.

The aromatic amines include benzylamine, aniline, rosin-based amines, and other aromatic amines. These may be used singly or in combination of two or more kinds.

Examples of the benzylamine include phenylpropylamine, phenylethylamine, methoxybenzylamine, diethylbenzylamine, benzylamine, dimethylbenzylamine, ethylnaphthylamine, and dicyclohexylamine. These may be used singly or in combination of two or more kinds.

Examples of the aniline include aniline, methyl aniline, ethyl aniline, dimethylaniline, diethylaniline, tert-butyl aniline, and trimethylaniline. These may be used singly or in combination of two or more kinds.

Examples of the rosin amines include rosin amines and the like.

Other aromatic amines include dihydroxybenzylamine and the like.

Examples of the guanidine compound include diphenyl guanidine (such as 1,3-diphenyl guanidine), dimethyl toluidine, and trivanidine (such as 1,3-di-o -triguanidine). These may be used singly or in combination of two or more kinds.

As amine channels, Fuji Cure FXR-1020, FXR-1030, FXR-1050, FXR-1080, and FXR-1081 (trade name, made by T & K TOKA), Amicure PN- 23, MY- 31, and PN-40 (trade names, manufactured by Ajinomoto Fine-Techno Co., Inc.), ADEKA HARDNER EH-2021, EH-4361S, EH-5046S, EH-3636AS (trade name of ADEKA CORPORATION, P0505 (product of SHIKOKU CHEMICALS CORPORATION, trade name). These may be used singly or in combination of two or more kinds.

Examples of imidazole compounds include 2-phenylimidazole, 2-phenyl-4-methylimidazole, benzimidazole, 2-methylimidazole, 2-ethylimidazole, , 2-heptadecylimidazole, and the like. These may be used singly or in combination of two or more kinds.

Examples of the pyridine compound include 2-hydroxypyridine, 3-hydroxypyridine, 4-hydroxypyridine, 2-aminopyridine, 3-aminopyridine, 4-aminopyridine, 2-amino-5-methylpyridine, 2-pyridinecarboxyaldehyde And 4-acetylpyridine. These may be used singly or in combination of two or more kinds.

As the azole compound, 3-amino-1,2,4-triazole and the like can be mentioned.

As the pyrazole compound, 3,5-dimethylpyrazole and the like can be mentioned.

Examples of the pyrrole compound include pyrrole and pyrrole-2-carboxyaldehyde. These may be used singly or in combination of two or more kinds.

Examples of the morpholine compound include morpholine, methylmorpholine, ethylmorpholine, and bis (2-morpholinethyl) ether. These may be used singly or in combination of two or more kinds.

Examples of the piperazine compound include piperidine, dimethylpiperidine, and 1- (2-dimethylaminoethyl) -4-methylpiperazine. These may be used singly or in combination of two or more kinds.

The amine salt may be an organic acid salt of an amine, an inorganic acid salt of an amine, or an organic acid salt of an amine. Examples of the organic acid in the organic acid salt of the amine include monocarboxylic acid and dicarboxylic acid, and other organic acids. Of these organic acids, dicarboxylic acids having 3 to 8 carbon atoms are preferable, and adipic acid is more preferable. Examples of the amine in the amine salt include the above-mentioned aliphatic amines, aromatic amines, guanidine compounds, amine adducts, and nitrogen-containing heterocyclic compounds. Specific examples of the amine salt include diphenyl guanidine adipate (such as 1,3-diphenyl guanidine adipate), ethylamine adipate, butylamine adipate, hexylamine adipate, benzylamine adipate, benzylamine glutarate Salts of organic acids such as acetylacetonate, acetylacetonate, cyclohexylamine adipate, dimethylamine adipate, triethanolamine adipate, cyclohexylamine salicylate, dicyclohexylamine succinate, diisobutylamine malonate, dimethylamine salicylic acid, diisopropylamine succinic acid Salts, and 2-ethylhexylamine adipate salts. These may be used singly or in combination of two or more kinds.

The mass ratio (B1 / B2) of the blending amount of the component (B1) to the blending amount of the component (B2) is preferably 1/9 to 9/1, more preferably 5/5 to 9/1, 4 or more and 8/2 or less. If the mass ratio is within the above range, the synergistic effect of the component (B1) and the component (B2) can be further improved and the solderability of the solder can be further improved.

The blending amount of the component (B2) is preferably from 0.1 mass% to 20 mass%, more preferably from 0.3 mass% to 16 mass%, and still more preferably from 1 mass% to 15 mass% with respect to 100 mass% And particularly preferably 2% by mass or more and 15% by mass or less. If the blending amount is the above lower limit, solderability can be further improved. If the blending amount is not more than the upper limit, insulation reliability is not lowered.

The component (B) may further contain other activators (organic acid, halogen-based activator) in addition to the components (B1) and (B2) within the range in which the object of the present invention can be achieved. However, from the standpoint of halogen-free, the component (B) is preferably composed only of the component (B1) and the component (B2). The total amount of the components (B1) and (B2) is preferably 85% by mass or more, more preferably 90% by mass or more, and more preferably 95% by mass or more based on 100% Particularly preferred.

The total amount of the component (B) is preferably 1% by mass or more and 40% by mass or less, more preferably 2% by mass or more and 36% by mass or less based on 100% by mass of the flux composition. If the blending amount is the above lower limit, the solder ball can be more reliably suppressed. If the blending amount exceeds the upper limit, the insulation reliability of the flux composition tends to be lowered.

[Component (C)] [

In the flux composition of the present embodiment, it is preferable to further contain a solvent (C) from the viewpoint of printability and the like. As the solvent (C) used herein, a known solvent may be suitably used. As such a solvent, it is preferable to use a solvent having a boiling point of 170 캜 or higher.

Examples of such a solvent include diethylene glycol, dipropylene glycol, triethylene glycol, hexylene glycol, hexyldiglycol, 1,5-pentanediol, methylcarbitol, butylcarbitol, 2-ethylhexyldiglycol, Diol, phenyl glycol, diethylene glycol monohexyl ether, tetraethylene glycol dimethyl ether, and dibutyl maleic acid. These solvents may be used singly or in combination of two or more kinds.

When the component (C) is used, the blending amount thereof is preferably 10% by mass or more and 60% by mass or less, more preferably 20% by mass or more and 40% by mass or less based on 100% by mass of the flux composition. When the blending amount of the solvent is within the above range, the viscosity of the obtained solder composition can be appropriately adjusted within a suitable range.

[Component (D)] [

The flux composition of the present embodiment may further contain (D) a plasticizer from the viewpoint of printability and the like. Examples of the (D) chelating agent used herein include hardened castor oil, polyamines, polyamides, bisamides, dibenzylidene sorbitol, kaolin, colloidal silica, organic bentonite, glass frit and the like. These chelants may be used singly or in combination of two or more kinds.

When the component (D) is used, the blending amount thereof is preferably 1% by mass or more and 15% by mass or less, more preferably 5% by mass or more and 12% by mass or less based on 100% by mass of the flux composition. When the amount is less than the above lower limit, sufficient rigidity is obtained and sagging can be sufficiently suppressed. If the blending amount is less than the upper limit of the above range, the blurring is excessively high and the printing is not defective.

[Other Ingredients]

In addition to the component (A), the component (B), the component (C) and the component (D), other additives and other resins may be added to the flux composition used in the present embodiment. Other additives include antifoaming agents, antioxidants, modifiers, lubricants, foaming agents, curing accelerators and the like. Other resins include epoxy resins, acrylic resins, urethane resins, and polyimide resins.

The flux composition of this embodiment has sufficient solderability and sufficient storage stability. Further, even a halogen-free flux composition can be suitably used with a halogen-free flux composition in that a solder melting property equal to or higher than that in the case of using a halogen-based activator can be ensured.

The halogen-free flux composition preferably has a chlorine concentration of 900 mass ppm or less, a bromine concentration of 900 mass ppm or less, and a halogen concentration of 1500 mass ppm or less. Examples of the halogen include fluorine, chlorine, bromine, iodine, and astatine.

From the viewpoint of environmental compatibility, the chlorine concentration and the bromine concentration are preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. The halogen concentration is preferably 800 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. In the flux composition, it is preferable that no halogen exists, except for inevitable impurities.

The chlorine concentration, the bromine concentration and the halogen concentration in the flux composition can be measured in accordance with the method described in JEITA ET-7304A. Further, it can be calculated simply from the blending component of the flux composition and the blending amount thereof.

[Solder composition]

Next, the solder composition of the present embodiment will be described. The solder composition of the present embodiment contains the flux composition of the present embodiment and the solder powder (E) described below.

The blending amount of the flux composition is preferably 5 mass% or more and 40 mass% or less, more preferably 7 mass% or more and 15 mass% or less, and particularly preferably 8 mass% or more and 12 mass% or less, relative to 100 mass% of the solder composition . If the blending amount of the flux composition is 5 mass% or more (the blending amount of the solder powder is 95 mass% or less), the flux composition as the binder is sufficient, so that the flux composition and the solder powder can be easily mixed. Further, when the blending amount of the flux composition is 40 mass% or less (the blending amount of the solder powder is 60 mass% or more), sufficient solder bonding can be formed when the obtained solder composition is used.

[Component (E)] [

The (E) solder powder used in the present invention is preferably made of only the lead-free solder powder, but may be lead-free solder powder. As the solder alloy in the solder powder, an alloy containing tin (Sn) as a main component is preferable. Examples of the second element of the alloy include silver (Ag), copper (Cu), zinc (Zn), bismuth (Bi), indium (In) and antimony (Sb). Further, other elements (after the third element) may be added to the alloy as necessary. Examples of other elements include copper, silver, bismuth, indium, antimony, cobalt, chromium, nickel, germanium, iron and aluminum.

Here, the lead-free solder powder refers to a solder metal or an alloy powder to which lead is not added. However, it is permitted that lead is present as an unavoidable impurity in the lead-free solder powder, but in this case, the amount of lead is preferably 100 mass ppm or less.

Specific examples of the lead-free solder powder include Sn-Ag, Sn-Ag-Cu, Sn-Cu, Sn-Ag-Bi, Sn-Bi, Sn- Sn-Zn-Sn-Zn-Al, Sn-Zn-Bi-Al, Sn-Ag-Bi-In, Sn-Ag-Cu-Bi-In-Sb and In-Ag. Among these, a Sn-Ag-Cu-based solder alloy is preferably used from the viewpoint of the strength of the solder joint. The melting point of the Sn-Ag-Cu type solder is usually 200 ° C or more and 250 ° C or less. Among the Sn-Ag-Cu solders, the melting point of the solder having a low silver content is 210 占 폚 or more and 250 占 폚 or less. From the viewpoint of a low melting point, a Sn-Bi based solder alloy is preferably used. The melting point of the Sn-Bi-based solder is usually 130 ° C or more and 170 ° C or less.

The average particle diameter of the component (E) is usually not less than 1 탆 and not more than 40 탆, but is more preferably not less than 1 탆 and not more than 35 탆, and more preferably not less than 2 탆 and not more than 35 탆, from the viewpoint that the solder pad has a narrow pitch. And even more preferably from 3 탆 to 32 탆. The average particle diameter can be measured by a dynamic light scattering particle size measuring apparatus.

[Manufacturing method of solder composition]

The solder composition of the present embodiment can be produced by mixing the above-described flux composition and the above-mentioned (E) solder powder in the above-mentioned predetermined ratio and stirring and mixing.

[Electronic Substrate]

Next, the electronic substrate of the present embodiment will be described. The electronic board of the present embodiment is provided with the soldering portion using the above-described solder composition. This electronic board (printed circuit board or the like) can be manufactured by mounting electronic components on an electronic board (printed wiring board or the like).

Examples of a coating apparatus used here include a screen printing machine, a metal mask printing machine, and a dispenser.

The electronic component is placed on the electronic substrate by a reflow process in which the electronic component is placed on the solder composition applied by the application device, heated under a predetermined condition by reflow, and the electronic component is mounted on the printed wiring board Can be mounted. Examples of the reflow furnace include an air reflow apparatus, a vacuum reflow apparatus, a formic acid reflow apparatus, and a plasma reflow apparatus. Among them, an air reflow apparatus is preferable from the viewpoint of the cost of apparatus equipment, and a vacuum reflow apparatus is preferable from the viewpoint of void reduction in the solder after the reflow process.

In the reflow process, the electronic component is placed on the solder composition and heated under a predetermined condition by reflow. Sufficient solder bonding can be performed between the electronic component and the printed wiring board by this reflow process. As a result, the electronic component can be mounted on the printed wiring board.

The reflow condition may be suitably set in accordance with the melting point of the solder. For example, when a Sn-Ag-Cu-based solder alloy is used, the preheat may be performed at a temperature of 150 to 200 占 폚 for 60 to 120 seconds and a peak temperature of 230 to 270 占 폚.

[Second Embodiment]

Next, a second embodiment of the present invention will be described.

The constitution of the second embodiment is the same as that of the first embodiment except that (A2) a thermosetting resin is used as the resin (A), and therefore the (A2) flux composition when a thermosetting resin is used will be explained, It is omitted.

The flux composition of the present embodiment contains (A2) a thermosetting resin and (B) an activator.

[Component (A)] [

As the thermosetting resin (A2) used in the second embodiment, a known thermosetting resin can be suitably used. Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a urethane resin and a polyimide resin. Among them, it is preferable to use an epoxy resin from the viewpoint of having a flux action. From the viewpoint of low-temperature curability, it is preferable to use an acrylic resin.

Further, in the present invention, having a flux action generally means that the coated film covers the metal surface of the brazed body to block the atmosphere, and at the time of brazing, the metal oxide on the metal surface is reduced, The solder is pushed out to make contact between the molten solder and the metal surface, and the residue has a function of insulating the circuits.

As such an epoxy resin, a known epoxy resin can be appropriately used. Examples of such epoxy resins include epoxy resins such as bisphenol A type, bisphenol F type, biphenyl type, naphthalene type, cresol novolak type, phenol novolak type, and dicyclopentadiene type. These epoxy resins may be used singly or in combination of two or more kinds. These epoxy resins preferably contain liquid ones at room temperature (25 DEG C), and when solid resins are used at room temperature, they are preferably used in combination with liquid resins at room temperature. From the standpoint of being able to adjust the dispersibility and paste viscosity of the metal particles among these epoxy resin molds and to improve resistance to drop impacts of the cured product, from the viewpoint that the wetting spreadability of the solder becomes good, the liquid bisphenol A Liquid bisphenol F type, liquid hydrogenated bisphenol A type, naphthalene type, dicyclopentadiene type and biphenyl type are preferable, and liquid bisphenol A type, liquid bisphenol F type and biphenyl type are more preferable.

Examples of such an acrylic resin include a radically polymerizable resin having two or more (meth) acryloyl groups and a polymerizable resin having a reactive diluent having one unsaturated double bond in one molecule.

Examples of the radical polymerizable resin include a urethane acrylate resin, an epoxy acrylate resin and a silicone acrylate resin. These radically polymerizable resins may be used singly or in combination of two or more kinds.

Examples of the reactive diluent include (meth) acrylic acid esters such as 2-hydroxy-3-phenoxypropyl (meth) acrylate, tetrahydrofurfuryl (meth) (Meth) acrylate, methoxyethylene (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, methoxydiethylene glycol (Meth) acrylate, n-lauryl (meth) acrylate, n-lauryl (meth) acrylate, (Meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, isobonyl (meth) acrylate and (meth) acryloylmorpholine. These reactive diluents may be used alone or in combination of two or more.

The blending amount of the thermosetting resin (A2) is preferably 50% by mass or more and 95% by mass or less, more preferably 80% by mass or more and 90% by mass or less based on 100% by mass of the flux composition. When the blending amount of the component (A2) is not lower than the lower limit described above, sufficient strength for fixing the electronic component can be obtained, resistance to drop impact can be improved, and occurrence of residue cracks after reflow can be suppressed. When the blending amount of the component (A2) is not more than the upper limit, the content of the curing component in the flux composition becomes sufficient, and the speed of curing the thermosetting resin can be improved.

[Component (B)] [

The activator (B) used in this embodiment is the same as the (B1) carboxylic acid adduct and (B2) amine in the first embodiment. In the present embodiment, the component (B2) also functions as a curing agent for the component (A2) with respect to amines.

[Component (D)] [

The flux composition of the present embodiment may further contain (D) a plasticizer from the viewpoint of printability and the like. The (D) chelating agent used here is the same as the chelating agent (D) in the first embodiment.

[Other Ingredients]

In addition to the component (A), the component (B) and the component (D), solvents and other additives and other resins may be added to the flux composition used in the present embodiment, if necessary. Other additives include antifoaming agents, antioxidants, modifiers, lubricants, foaming agents, curing accelerators and the like. Other resins include acrylic resins, urethane resins, polyimide resins, and the like.

[Modifications]

Further, the flux composition, solder composition and electronic substrate of the present invention are not limited to the above-described embodiments, and modifications, improvements and the like within the scope of achieving the object of the present invention are included in the present invention.

[Solder composition for jet dispenser]

In the above embodiment, a screen printing machine, a metal mask printing machine, a dispenser, or the like is used as a coating device in the production of the electronic substrate, but the invention is not limited thereto. For example, a jet dispenser may be used as the application device.

When a jet dispenser is used as a coating device, it is preferable to use a combination of diethylene glycol monohexyl ether and?,?,? -Terpineol as a solvent in the flux composition.

The viscosity of the solder composition at 35 캜 is preferably 5 Pa · s or more and 30 Pas · s or less. It is also preferable that the solder composition has a chimney index of 0.2 to 0.9 at 35 캜.

[Solder composition for laser heating]

In the above embodiment, the printed wiring board and the electronic component are bonded by the reflow process in the production of the electronic board, but the invention is not limited thereto. For example, instead of the reflow process, the printed wiring board and the electronic component may be bonded by a process (laser heating process) of heating the solder composition using laser light. In this case, the laser light source is not particularly limited, and can be appropriately adopted in accordance with the wavelength matched to the absorption band of the metal. A as a laser light source, for example a solid-state laser (ruby, glass, YAG and the like), a semiconductor laser (GaAs, InGaAsP and the like), liquid lasers (dye, etc.), a gas laser (He-Ne, Ar, CO _2, excimer, etc.) .

[Solder composition for soldering iron]

In the above embodiment, the printed wiring board and the electronic component are bonded by the reflow process in the production of the electronic board, but the invention is not limited thereto. For example, solder may be bonded between the printed wiring board and the electronic component by heating the solder composition in the form of a thread (wire solder having the resin flux embedded therein) with a soldering iron.

[Solder Bump Forming Solder Composition]

In the above embodiment, the solder composition is used for mounting an electronic component on an electronic substrate, but the present invention is not limited to this. For example, the solder composition may be used to form a solder bump of the package component. A bump forming step of forming a solder bump on the electrode by heating the package substrate after the printing process and melting the solder powder in the solder composition; A cleaning step of cleaning the flux residue on the package substrate after the forming process and a flattening step of grinding the upper end of the solder bump to match the heights of the solder bumps to form the solder bumps of the package parts . When the solder bumps of the package parts are formed, the average particle diameter of the solder powder in the solder composition is preferably 0.5 mu m or more and 10 mu m or less, more preferably 0.5 mu m or more and 8 mu m or less.

[Solder composition for precoating]

In the above embodiment, the solder composition is used for mounting an electronic component on an electronic substrate, but the present invention is not limited to this. For example, solder plating (precoat) may be formed on the electrodes of the printed wiring board using the solder composition. Specifically, a printing process for printing a solder composition on an electrode of a printed wiring board, a plating forming process for forming a solder plating on the electrode by heating the printed wiring board after the printing process and melting the solder powder in the solder composition The solder plating can be formed on the electrode of the printed wiring board by the provided method.

Example

EXAMPLES Next, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited thereto at all. The materials used in Examples and Comparative Examples are shown below.

(Component (A1))

Rosin resin: hydrogenated modified rosin, trade name " Fine Crystal KE-604 ", manufactured by Arakawa Chemical Industries, Ltd.

(Component (A2))

Epoxy resin A: Bisphenol F type epoxy resin, trade name " EXA-830LVP ", manufactured by DIC CORPORATION

Epoxy resin B: Epoxy resin, trade name " NC-3000 ", manufactured by Nippon Kayaku Co., Ltd.

(Component (B1))

Carboxylic acid adduct A: The carboxylic acid adduct obtained in the following Preparation Example 1, the decomposition initiating temperature by differential scanning calorimetry (DSC), was about 170 DEG C

Carboxylic acid adduct B: The decomposition initiating temperature of the carboxylic acid adduct obtained in Preparation Example 2 described below by differential scanning calorimetry (DSC) was about 180 ° C

(Component (B2))

Amine A: 2-phenyl-4-methylimidazole, trade name "2P4MZ", manufactured by SHIKOKU CHEMICALS CORPORATION

Amines B: 2-heptadecylimidazole, trade name " C17Z ", manufactured by SHIKOKU CHEMICALS CORPORATION

Amines C: 4-Acetylpyridine

Amines D: amine adduct, trade name " Fuji Cure FXR-1081 ", manufactured by T & K TOKA

Amines E: N, N-diethylaniline

Amines F: Octylamine

Amines G: 1.3-diphenylguanidine adipate

(Component (C)) [

Solvent: tetraethylene glycol dimethyl ether, trade name "HiSolve MTEM", manufactured by TOHO Chemical Industry Co., Ltd.

(Component (D))

Trade name: SLIPACKS ZHH, manufactured by Nippon Kasei Chemical Company Limited

(Component (E))

Solder powder: particle diameter distribution 20 to 38 mu m (average particle diameter about 30 mu m), solder melting point 217 to 220 DEG C, solder composition Sn / Ag 3.0 / Cu 0.5

(Other components)

Organic acid: succinic acid Halogen activator: trans-2,3-dibromo-2-butene-1,4-diol

[Preparation Example 1]

41.1 g of carboxylic acid (succinic acid) and 126.9 g of vinyl ether compound (n-butyl vinyl ether) were charged into a reaction vessel and heated from room temperature to 120 캜 for 30 minutes and stirred. Thereafter, while maintaining the temperature in the reaction vessel at 120 캜, the reaction was carried out for 4 hours to obtain a carboxylic acid adduct A.

The acid value of the obtained carboxylic acid adduct A was measured. As a result, it was confirmed that the acid value was 10 mgKOH / g or less, and the reaction was completed.

[Preparation Example 2]

45 g of a solvent (propylene glycol monomethyl ether acetate), 41.2 g of a carboxylic acid anhydride (succinic anhydride) and 108.8 g of a vinyl ether compound (diethylene glycol monovinyl ether) were charged into a reaction vessel, The mixture was heated to 80 DEG C and stirred. Thereafter, the reaction was allowed to proceed for 4 hours while maintaining the temperature in the reaction vessel at 80 DEG C, and then the solvent was removed using a diverter to obtain carboxylic acid adduct B.

The acid value of the obtained carboxylic acid adduct B was measured, and the acid value was found to be 14 mgKOH / g.

[Example 1]

51 parts by mass of a rosin resin, 10 parts by mass of a carboxylic acid adduct A, 2.5 parts by mass of an amine A, 8.5 parts by mass of a solvent, and 29 parts by mass of a solvent were mixed as a flux composition and 11 mass% of a flux composition and 89 mass% (100% by mass in total), and the mixture was appropriately mixed to prepare a flux composition and a solder composition.

[Example 2, Comparative Examples 1 to 5]

A flux composition and a solder composition were obtained in the same manner as in Example 1 except that each material was blended according to the composition shown in Table 1.

≪ Evaluation of solder composition >

Evaluation of the solder composition (storage stability, mid-chip solder ball, pinned solder ball, and solder spread (amount)) were carried out in the following manner.

(1) Storage stability

First, the viscosity is measured using the solder composition as a sample. Thereafter, the sample is placed in a sealed container, placed in a thermostatic chamber at a temperature of 30 DEG C, stored for 14 days, and the viscosity of the stored sample is measured. Then, a difference (? 2 -? 1) between the viscosity value? 1 before storage and the viscosity value? 2 after storage for 14 days at a temperature of 30 占 폚 is obtained. The viscosity is measured by spiral viscosity measurement (measurement temperature: 25 캜, rotation speed: 10 rpm).

Then, on the basis of the difference in viscosity value, the storage stability was evaluated according to the following criteria.

A: The difference in viscosity value is greater than -100 Pa · s and less than 100 Pa · s.

C: Difference in viscosity value is -100 Pa s or less, or 100 Pa s or more.

(2) Midchip Solder Ball

A solder composition was printed on a substrate for evaluation ("SP-TDC" manufactured by Tamura Corporation) capable of mounting chip components (1608 chips and 1005 chips) using a metal mask having a thickness of 120 μm, And the solder composition is melted in reflow furnace (made by Tamura Corporation) and soldered, is used as a test board. Here, the reflow condition is a preheat temperature of 150 to 180 ° C (60 seconds), a temperature of 220 ° C or more for 50 seconds, and a peak temperature of 245 ° C. The obtained test plate was observed with a magnifying glass to measure the number of solder balls (chips / chips) generated in the vicinity of the chip components.

Then, based on the results of the number of solder balls (pieces / chip), the mid-chip solder balls were evaluated according to the following criteria. Further, evaluation was made for the case of using the 1608 chip and the case of using the 1005 chip, respectively.

A: The number of solder balls per chip is less than one.

B: The number of solder balls per chip is one or more and less than two.

C: The number of solder balls per chip is 2 or more and less than 3.

D: The number of solder balls per chip is 3 or more.

(3) Pinned solder balls

A solder composition was printed on a substrate (SP-TDC, manufactured by Tamura Corporation) having a QFP (Quad Flat Packing) pattern with a pitch of 0.8 mm by using a metal mask having a thickness of 120 탆 and the solder composition Is melted and soldered, is used as a test board. Here, the reflow condition is a preheat temperature of 150 to 180 ° C (60 seconds), a temperature of 220 ° C or more for 50 seconds, and a peak temperature of 245 ° C. The obtained test plate was observed with a magnifying glass to measure the number (solder / pin) of solder balls generated in the intervals of the pins of the QFP land having a pitch of 0.8 mm.

Then, based on the results of the number of solder balls (pins / pins), the pinned solder balls were evaluated according to the following criteria.

A: The number of solder balls per pin is less than 10.

B: The number of solder balls per pin is 10 or more and less than 15.

C: The number of solder balls per pin is 15 or more and less than 100.

D: More than 100 solder balls per pin.

(4) Solder Spread (quantity)

An amount of the solder composition was placed on a substrate (30 mm x 30 mm x 0.3 mm t) so that the solder composition was 0.30 g 0.03 g, and then heated on a hot plate at 240 DEG C for 30 seconds. The height H of the solder spread by the micrometer is measured, and the spreading rate Sr is obtained from the following formula (F1). This operation is repeated five times, and the average value is determined as the spreading rate of the sample.

Sr = (D-H) / D x 100 (F1)

D = 1.24 V ^1/3 (F2)

Sr: spread rate (%)

H: Height of spread solder (mm)

D: Diameter (mm) when the solder used in the test is regarded as a sphere.

V: mass / density of solder used in test

Then, based on the results of the spreading rate (Sr), the solder spread was evaluated according to the following criteria.

A: The spread rate is more than 87%.

B: The spreading ratio is 80% or more and less than 87%.

C: The spreading ratio is 70% or more and less than 80%.

D: The spreading rate is less than 70%.

As apparent from the results shown in Table 1, the solder compositions (Examples 1 and 2) of the present invention had both good storage stability, midchip solder ball, pinned solder ball and solder spreading results, sufficient solder melting property and sufficient storage stability .

In contrast, the solder compositions obtained in Comparative Examples 1 to 5 were found to be insufficient in at least one of the results of storage stability, mid chip solder ball, pinned solder ball and solder spread.

Further, the solder composition of the present invention (Examples 1 and 2) is halogen-free since it does not contain a halogen-based activator.

[Examples 3 to 11]

A flux composition and a solder composition were obtained in the same manner as in Example 1 except that each material was blended according to the composition shown in Table 2.

Evaluation of the obtained solder composition (storage stability, midchip solder ball, pinned solder ball, solder spread (amount of silver)) was performed by the above-described method. The obtained results are shown in Table 2.

The storage stability of Example 11 was evaluated by changing the storage time from 14 days to 7 days. In the evaluation of the midchip solder ball and the pinned solder ball of Example 11, the reflow conditions were a preheat temperature of 30 to 120 占 폚 (90 seconds), a temperature rise of 4 占 폚 / s to a melting point temperature of solder (218 to 220 占 폚) The time of 220 ° C or more is 30 to 45 seconds, and the peak temperature is 245 ° C.

As apparent from the results shown in Table 2, the solder compositions (Examples 3 to 11) of the present invention had satisfactory storage stability, midchip solder ball, pinned solder ball and solder spreading results, sufficient solder melting property and sufficient storage stability .

Claims (16)

(A) a resin, and (B) an activator,
Wherein the component (B) contains a carboxylic acid adduct having a structure represented by the following structural formula (1) in the molecule (B1) and an amine (B2).

The method according to claim 1,
Wherein the component (B1) is a carboxylic acid adduct represented by the following general formula (2).

Wherein n represents an integer of 1 to 6, X ¹ represents a hydrocarbon group of 1 to 6 valency, an organic group or a single bond, X ² represents -R ¹ or -R ² -OH , R ¹ is an alkyl group, and R ² is an alkylene group or an oxyalkylene group.] The method according to claim 1,
Wherein the component (B1) is a carboxylic acid adduct represented by the following general formula (3).

[In the general formula (3), p represents an integer of 0 or more, Y ¹ is a substituted or unsubstituted ethylene group or a propylene group, Y ² is -OL ¹ - represents, L - or -OL ² -OL ^{2 1} and L ² each represent an alkylene group and Z represents a hydrogen atom, a group represented by the following formula (3a) or a group represented by the following formula (3b).

The method according to claim 1,
Wherein the mass ratio (B1 / B2) of the blending amount of the component (B1) to the blending amount of the component (B2) is 1/9 or more and 9/1 or less. The method according to claim 1,
Wherein the component (A) is a rosin resin (A1). The method according to claim 1,
Wherein the component (A) is a thermosetting resin (A2). The method according to claim 1,
Wherein the component (B2) is at least one member selected from the group consisting of an aliphatic amine, an aromatic amine, a guanidine compound, an amine adduct, a nitrogen-containing heterocyclic compound and an amine salt. The method according to claim 1,
Wherein the component (B2) is at least one member selected from the group consisting of an aliphatic amine and a nitrogen-containing heterocyclic compound. 9. The method according to any one of claims 1 to 8,
Wherein the flux composition has a chlorine concentration of 900 mass ppm or less, a bromine concentration of 900 mass ppm or less, and a halogen concentration of 1,500 mass ppm or less. A solder composition comprising the flux composition according to Claim 1 and a solder powder. 11. The method of claim 10,
Jet dispenser or a dispenser. 11. The method of claim 10,
Wherein the solder composition is adhered by heating using laser light. 11. The method of claim 10,
To form a solder bump of the package part. 11. The method of claim 10,
Wherein the solder plating is formed on the electrode of the printed wiring board. 11. The method of claim 10,
Wherein the solder composition is used for soldering using a soldering iron. An electronic board comprising a soldering portion using the solder composition according to Claim 10.