KR20180099045A - Touch sensor - Google Patents

Abstract

According to the present invention, a touch sensor includes an insulating layer including an alkali-soluble resin including a repeating unit derived from a multifunctional acrylic monomer represented by the following formula 1. According to the present invention, the touch sensor can obtain high transmittance, high reliability, high etching resistance, high thermal stability, high elasticity, and high corrosion resistance of ITO and reduce a crack since the touch sensor includes the insulating layer that does not cause corrosion on an ITO electrode.

Description

Touch sensor {TOUCH SENSOR}

The present invention relates to a touch sensor, and more particularly, to a touch sensor including an insulating layer containing a specific alkali-soluble resin.

There have been attempts to introduce a touch input method into a wider variety of electronic devices while the touch input method is being watched as a next generation input method. Accordingly, research and development on a touch sensor capable of being applied to various environments and capable of accurate touch recognition are actively performed have.

For example, in the case of an electronic device having a touch-type display, an ultra-thin flexible display which achieves an ultra-light weight, low power and improved portability has been attracting attention as a next-generation display, and development of a touch sensor applicable to such a display has been desired.

The touch sensor includes a transparent electrode, such as ITO, and an insulating layer, which functions to insulate the transparent electrode, although the touch sensor is somewhat different depending on the implementation method.

The insulating layer usually uses an alkali-soluble resin as a binder resin. However, the water-permeation is easy due to the hydrophilic part of the alkali-soluble resin, and the transparent electrode is corroded.

Korean Patent Publication No. 2010-0031111 discloses an anti-corrosive adhesive composition which discloses an anti-corrosive adhesive composition comprising (a) a radical-curable resin, (b) a filler, and (c) have.

Korean Patent Laid-Open Publication No. 2008-0094282 relates to an acrylic pressure sensitive adhesive composition comprising: a) 100 parts by weight of an acrylic copolymer; b) 0.001 to 30 parts by weight of an antistatic agent; And c) 0.01 to 10 parts by weight of a corrosion inhibitor. The present invention relates to an acrylic pressure sensitive adhesive composition.

Japanese Unexamined Patent Application Publication No. 2006-045315 relates to a pressure-sensitive adhesive sheet, a metalized film label, a member for a touch panel, and a touch panel. More particularly, (B) is contained in an amount of 1 to 10 wt% based on 100 parts by weight of the acrylic copolymer (A) copolymerized in an amount of not less than 3 wt% and not substantially copolymerized with the hydroxyl group-containing monomer And an epoxy cross-linking agent (C) having a functional group Z capable of reacting with the carboxyl group X in the acrylic copolymer (A) are added to the epoxy cross-linking agent (X) for the carboxyl group X in the acrylic copolymer (A) (X: Z) of the functional group Z in the curing agent (C) is from 1: 0.01 to 1: 0.4, and the pressure-sensitive adhesive layer obtained by cross- And a pressure-sensitive adhesive layer formed on the pressure-sensitive adhesive sheet.

However, there is a problem that the corrosion inhibitor is somewhat insufficient when the corrosion inhibitor is used as in the above documents, and the literature does not suggest that it can be used as an insulating film in the form of a pressure-sensitive adhesive or an adhesive.

Therefore, development of a touch sensor having excellent corrosion resistance against a transparent metal such as an ITO layer is required.

Korean Patent Publication No. 2010-0031111 (Mar. 19, 2010) Korean Patent Publication No. 2008-0094282 (October 23, 2008) Japanese Patent Laid-Open No. 2006-045315 (2006.02.16.)

It is an object of the present invention to provide a transparent electrode which does not cause corrosion on a transparent electrode such as ITO and which is excellent in transmittance, reliability, ITO resistance, resistance to etching, thermal stability, elasticity and ITO corrosion resistance, Delami crack is less likely to occur.

In order to accomplish the above object, the present invention provides a photosensitive resin composition comprising an insulating layer comprising an alkali-soluble resin containing a repeating unit derived from a polyfunctional acrylic monomer represented by the following general formula (1), wherein the repeating unit derived from the polyfunctional acrylic monomer And 20 to 50 parts by weight based on 100 parts by weight of the entire alkali-soluble resin.

[Chemical Formula 1]

In Formula 1,

X is an alkylene group of C1 to C4,

R 'is hydrogen or a methyl group;

Y is hydrogen, a C20 or lower alkyl group, or an electron withdrawing group (EWG).

The touch sensor according to the present invention is excellent in transmittance, reliability, ITO resistance, etch resistance, thermal stability, elastic modulus, and ITO corrosion resistance by including an insulating layer which does not cause corrosion on a transparent electrode such as ITO, (Delami crack) is less likely to occur.

1 is a cross-sectional view of a structure of a touch sensor according to some embodiments of the present invention.

Hereinafter, the present invention will be described in more detail.

When a member is referred to as being " on "another member in the present invention, this includes not only when a member is in contact with another member but also when another member exists between the two members.

Whenever a part is referred to as "including " an element in the present invention, it is to be understood that it may include other elements as well, without departing from the other elements unless specifically stated otherwise.

An embodiment of the present invention includes an insulating layer (50) comprising an alkali-soluble resin containing a repeating unit derived from a polyfunctional acrylic monomer represented by the following formula (1), wherein the repeating unit derived from the polyfunctional acrylic monomer is And 20 to 50 parts by weight based on 100 parts by weight of the entire alkali-soluble resin.

[Chemical Formula 1]

In Formula 1,

X is an alkylene group of C1 to C4,

R 'is hydrogen or a methyl group;

Y is hydrogen, a C20 or lower alkyl group, or an electron withdrawing group (EWG).

In the present invention, the alkyl group may be, for example, linear or branched, and specific examples thereof include methyl, ethyl, n-propyl, isopropyl, n- butyl, isobutyl, tert- Butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, n-hexyl, 1- methylpentyl, 2- methylpentyl, Methylhexyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, 1- Ethyl-propyl, 1,1-dimethyl-propyl, isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl and the like.

The alkylene group is C1 to C4, and the content of the alkyl group can be applied except that the alkylene group is divalent.

The Electron Withdrawing Group (EWG) includes, for example, carbonyl (-C═O), nitrile (-CN), nitro (-NO ₂ ), sulfiryl (-SO ₂ ), carboxyl -COOH), and the like, but the present invention is not limited thereto.

When the repeating unit derived from the polyfunctional acrylic monomer represented by Chemical Formula 1 is included in the acrylic soluble resin, the insulating layer 50 formed using the alkali-soluble resin may cause corrosion of the electrode pattern layer 40 This has the advantage of not causing the same damage. Specifically, due to the structural characteristics of the alkali-soluble resin contained in the insulating layer 50, the metal oxide and the metal complex in the electrode pattern layer 40 such as ITO are formed to prevent metal diffusion due to migration There is an advantage that the occurrence of corrosion is prevented, and the etching resistance and thermal stability of the touch sensor are improved.

The repeating unit derived from the polyfunctional acrylic monomer is contained in an amount of 20 to 50 parts by weight, preferably 30 to 50 parts by weight, more preferably 35 to 45 parts by weight based on 100 parts by weight of the entire alkali-soluble resin. When the repeating unit derived from the polyfunctional acrylic monomer represented by the above formula (1) satisfies the above range, adhesion with the electrode pattern layer (40) can be improved, transparency can be ensured, and an electrode pattern layer ) Can be excellent in corrosion prevention performance. Further, it is preferable because the hardness and the chemical resistance are improved by improving the degree of curing.

In still another embodiment of the present invention, the alkali-soluble resin is a photopolymerization initiator or a reactive alkali-soluble resin exhibiting reactivity against UV irradiation; And a non-reactive alkali-soluble resin showing non-reactivity to a photopolymerization initiator and UV irradiation.

Specifically, the alkali-soluble resin according to the present invention may further comprise a reactive alkali-soluble resin.

When the alkali-soluble resin contains the reactive alkali-soluble resin and the non-reactive alkali-soluble resin in admixture, the reactive alkali-soluble resin and the non-reactive alkali-soluble resin are mixed in a weight ratio of 8: 2 to 2: 8, 7: 3 to 3: 7. When the weight ratio is satisfied, the degree of curing is excellent, and the insulating layer 50 has an excellent etching resistance and thermal stability.

The reactive alkali-soluble resin exhibits reactivity to a photopolymerization initiator or UV irradiation.

The reactive alkali-soluble resin includes a compound (A1) containing an unsaturated bond and an acetoacetyl group in one molecule; A compound (A2) containing an unsaturated bond and a carboxylic acid group in one molecule; A compound (A3) comprising a polymerizable unsaturated bond with (A1) and (A2); And a compound (A4) having an unsaturated bond and an epoxy group in one molecule.

Specifically, it may be a copolymer obtained by reacting a copolymer of the compounds (A1) to (A3) with (A4). It is also possible to add other monomers and polymerize them together. That is, the present invention encompasses the case where other monomers other than the monomers derived from the compounds (A1) to (A4) are further contained and polymerized.

The (A1) contained in the reactive alkali-soluble resin is not limited as long as it is a compound containing an unsaturated bond and an acetoacetyl group in one molecule. When such an acetoacetyl group is contained, the effect of increasing the acid value and controlling the alkali-soluble characteristics can be provided.

Examples of the compound containing an unsaturated bond and an acetoacetyl group in the molecule include acetoacetylmethyl (meth) acrylate, acetoacetylethyl (meth) acrylate, acetoacetylpropyl (meth) acrylate, acetoacetylbutyl Acetoacetylalkyl (meth) acrylate such as acetoacetyl hexyl (meth) acrylate; Acetoacetoxyalkyl (meth) acrylate such as acetoacetoxymethyl (meth) acrylate, acetoacetoxyethyl (meth) acrylate or acetoacetoxypropyl (meth) acrylate; Acetoacetate compounds such as styryl acetoacetate, isopropenyl acetoacetate, hex-5-enyl acetoacetate, allylacetoacetate or vinylacetoacetate; Acetoacetoxyalkyl crotonate such as acetoacetoxyethyl crotonate or acetoacetoxypropyl crotonate, and the like, but is not limited thereto. .

The (A2) contained in the reactive alkali-soluble resin is not limited as long as it is a compound containing an unsaturated bond and a carboxylic acid group in one molecule, and examples thereof include monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid; Dicarboxylic acids such as fumaric acid, mesaconic acid and itaconic acid; Anhydrides of the dicarboxylic acids; (meth) acrylates of a polymer having a carboxyl group and a hydroxyl group at both terminals such as? -carboxypolycaprolactone mono (meth) acrylate, and the like. These may be used alone or in combination of two or more. Among these compounds, acrylic acid and / or methacrylic acid are preferred because of their excellent copolymerization reactivity and solubility in a developing solution.

The (A3) contained in the reactive alkali-soluble resin is not limited as long as it is a compound having an unsaturated bond polymerizable with (A1) and (A2), and examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, butyl Unsubstituted or substituted alkyl ester compounds of unsaturated carboxylic acids such as methyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate and aminoethyl (meth) acrylate; (Meth) acrylates such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, methylcyclohexyl (meth) acrylate, cycloheptyl (Meth) acrylate, cyclohexenyl (meth) acrylate, cycloheptenyl (meth) acrylate, cyclooctenyl (meth) acrylate, pentadienyl An unsaturated carboxylic acid ester compound containing an alicyclic substituent group such as a phenanthryl (meth) acrylate, adamanthyl (meth) acrylate, norbornyl (meth) acrylate or pinenyl (meth) acrylate; 3-ethyloxetane, 3 - ((meth) acryloyloxymethyl) oxetane, 3 - ((meth) acryloyloxymethyl) Unsaturated carboxylic acid ester compounds containing thermosetting substituents such as oxetane and 3 - ((meth) acryloyloxymethyl) -2-trifluoromethyloxetane; Mono-saturated carboxylic acid ester compounds of glycols such as oligoethylene glycol monoalkyl (meth) acrylate; Unsaturated carboxylic acid ester compounds having a substituted or unsubstituted aromatic ring such as benzyl (meth) acrylate and phenoxy (meth) acrylate; Aromatic vinyl compounds such as styrene,? -Methylstyrene, vinyltoluene, and N-benzylmaleimide; Carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl propionate; (Meth) acrylonitrile, and? -Chloroacrylonitrile. Of these, aromatic vinyl compounds are preferable for the purpose of improving sensitivity and reducing outgas.

These may be used alone or in combination of two or more. The (meth) acrylate recorded in this specification means acrylate and / or methacrylate.

(A4) contained in the reactive alkali-soluble resin is not limited as long as it is a compound having an unsaturated bond and an epoxy group in one molecule, and specific examples thereof include glycidyl (meth) acrylate, 3,4-epoxycyclohexyl (meth) (Meth) acrylate, methylglycidyl (meth) acrylate, and the like, more preferably glycidyl (meth) acrylate, and these may be used alone or in combination Or two or more of them may be used in combination.

On the other hand, the reactive alkali-soluble resin contained in the insulating layer 50 of the present invention is not particularly limited as long as it further includes other monomers in addition to the copolymer obtained by polymerization of the compounds containing (A1) to (A4) And are included in the scope of the invention.

That is, by adding other monomers to the copolymer by polymerization of the compounds including (A1) to (A4), light / thermosetting property can be imparted to the alkali-soluble resin to improve heat resistance and chemical resistance.

The reactive alkali-soluble resin preferably has a weight average molecular weight in terms of polystyrene of 3,000 to 100,000, more preferably 5,000 to 50,000. When the weight average molecular weight of the reactive alkali-soluble resin is in the range of 3,000 to 100,000, it is advantageous that the formation of the insulating layer 50 is easy as the viscosity is appropriate.

The acid value of the reactive alkali-soluble resin may preferably be in the range of 30 to 150 mgKOH / g based on the solid content. When the acid value is within the above range, there is an advantage that the insulating layer 50 is not cracked.

The molecular weight distribution of the reactive alkali-soluble resin may be preferably 1.0 to 6.0, more preferably 1.5 to 4.0. When the molecular weight distribution is within the above range, formation of a fine pattern is advantageous.

The reactive alkali-soluble resin can be prepared by reacting the above-mentioned (A1), (A2), (A3) and (A4) , (A3) and (A4) in the following ranges.

(A1): 10 to 60% by weight < RTI ID = 0.0 >

(A2): 20 to 70% by weight < RTI ID = 0.0 >

(A3): 10 to 60% by weight < RTI ID = 0.0 >

(A4): 10 to 60% by weight < RTI ID = 0.0 >

When the composition ratio is within the above range, a good balance of alkali solubility and heat resistance is obtained, and thus a preferable copolymer can be obtained.

The non-reactive alkali-soluble resin may be a photopolymerization initiator and a copolymer which exhibits a non-reactivity with respect to UV irradiation, and which is obtained by polymerization of the compounds containing (A1), (A2) and (A3). However, as a non-reactive alkali-soluble resin, a copolymer obtained by polymerization of compounds containing (A1) to (A3), which is polymerizable with unsaturated double and / or triple bonds polymerizable in a resin molecular chain after polymerization.

In addition to the above-mentioned compounds, the non-reactive alkali-soluble resin is also included in the scope of the present invention when other monomers are added and polymerized so as to have no unsaturated bonds polymerizable in the chain after polymerization.

The non-reactive alkali-soluble resin used in the present invention can be produced in the same manner as the above-mentioned reactive alkali-soluble resin. However, since the non-reactive alkali-soluble resin must be polymerized in the absence of an unsaturated double bond that can cause photopolymerization due to UV irradiation and a radical photoinitiator in the molecular chain, the copolymerization of (A4) contained in the reactive alkali- (A1) compound having an unsaturated bond and an acetoacetyl group in one molecule, a compound (A2) having an unsaturated bond and a carboxylic acid group in one molecule, and a polymerizable unsaturated bond with the above-mentioned (A1) and (A2) Can be prepared by copolymerizing monomers derived from a compound containing the compound (A3) having the above-described structure. The method example is the same as the general synthesis example of the reactive alkali-soluble resin. The compounds (A1) to (A3) may be the same as those exemplified above as the components (A1) to (A3).

In the present invention, the non-reactive alkali-soluble resin may preferably have a weight average molecular weight in terms of polystyrene of 3,000 to 100,000, more preferably 5,000 to 40,000. When the weight average molecular weight of the non-reactive alkali-soluble resin is in the range of 3,000 to 100,000, film reduction of the exposed portion is unlikely to occur at the time of development and the solubility of the unexposed portion tends to be good.

The acid value of the non-reactive alkali-soluble resin may preferably be in the range of 30 to 150 mgKOH / g based on the solid content. If the acid value is less than 30 mgKOH / g, the solubility in the alkaline developer may be lowered and the residue may remain on the substrate. If the acid value exceeds 150 mgKOH / g, the possibility of pattern peeling may increase.

The molecular weight distribution of the non-reactive alkali-soluble resin may be preferably 1.0 to 6.0, more preferably 1.5 to 4.0. When the molecular weight distribution is 1.0 to 6.0, it may be preferable since the developing property is excellent.

(A1), (A2) and (A3), and the proportion of the component derived from each of (A1), (A2) and (A3) A3) is preferably in the following range with respect to the total number of moles of constituent components.

(A1): 10 to 70% by weight < RTI ID = 0.0 >

(A2): 20 to 80% by weight < RTI ID = 0.0 >

(A3): 10 to 70% by weight < RTI ID = 0.0 >

When the composition ratio is within the above range, a good balance of alkali solubility and heat resistance is obtained, and thus a preferable copolymer can be obtained.

In another embodiment of the present invention, the amount of the reactive alkali-soluble resin is 30 to 70 parts by weight, preferably 40 to 75 parts by weight, more preferably 45 to 65 parts by weight, based on 100 parts by weight of the entire alkali- . When the reactive alkali-soluble resin is contained within the above range, there is an advantage that the reliability such as ITO resistance, etch resistance, thermal stability, and corrosion resistance in ITO becomes better, and the occurrence of transfer peeling crack can be advantageously prevented.

In another embodiment of the present invention, the alkali-soluble resin is contained in an amount of 30 to 80 parts by weight, preferably 30 to 60 parts by weight, more preferably 40 to 55 parts by weight, based on 100 parts by weight of the total of the insulating layer 50 And in this case, it is preferable because it has an advantage of securing developability and thermal stability and preventing delamacrack in the transferring step. When the amount of the alkali-soluble resin is less than the above-mentioned range, the developability is deteriorated, the pattern formation is poor, the thermal stability is lowered and delamacrack is generated, and when the above range is exceeded, the residual film ratio is lowered.

In another embodiment of the present invention, the insulating layer 50 may further include a photopolymerizable compound.

The photopolymerizable compound is a compound capable of polymerizing under the action of light and a photopolymerization initiator described later, and examples thereof include monofunctional monomers, bifunctional monomers, and other multifunctional monomers.

Specific examples of monofunctional monomers include nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrolidone And the like.

Specific examples of the bifunctional monomer include 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) Bis (acryloyloxyethyl) ether of A, and 3-methylpentanediol di (meth) acrylate.

Specific examples of other polyfunctional monomers include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol Acrylate, trimethylolpropane trimethacrylate, tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, ethoxylated dipentaerythritol hexa (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like.

Of these, polyfunctional monomers having two or more functionalities can be preferably used, and more preferably, polyfunctional monomers having five or more functionalities can be used.

The photopolymerizable compound may be used in an amount of 20 to 60 parts by weight, preferably 30 to 50 parts by weight, more preferably 40 to 50 parts by weight, based on 100 parts by weight of the insulating layer 50. When the photopolymerizable compound is contained within the above range, it is preferable because the strength, the residual film ratio according to the progress of the process, and the contact hole property tend to be good. When the amount is less than 20 parts, the degree of curing is lowered and the heat resistance and residual film characteristics are poor. When the amount is more than 50 parts, the curing shrinkage is increased or the degree of curing is improved.

The insulating layer 50 may be prepared by mixing the alkali-soluble resin, the photopolymerizable compound and a photopolymerization initiator to be described later with a solvent to prepare a photosensitive resin composition for forming the insulating layer 50, followed by a method commonly used in the art But is not limited thereto.

The photopolymerization initiator is at least one compound selected from the group consisting of, for example, a triazine-based compound, an acetophenone-based compound, a nonimidazole-based compound, and an oxime compound. The insulating layer 50 containing the photopolymerization initiator has high sensitivity, and therefore the insulating layer 50 formed using this composition has good strength and good contact hole characteristics.

Examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6 - (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, (Trichloromethyl) -6- [2- (5-methylfuran-2- (4-methoxystyryl) -1,3,5-triazine, Yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan- , 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethenyl] -1,3,5-triazine, 2,4- ) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

Examples of the acetophenone compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2- (4-methylthioxy) phenyl] -2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2- 2-methyl-1- [4- (1-methylvinyl) phenyl] propane-1-one, 1-one oligomers and the like. Further, a compound represented by the following general formula (2) can be mentioned.

(2)

In Formula 2,

R 1 to R 4 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a phenyl group substituted with an alkyl group having 1 to 12 carbon atoms, a benzyl group substituted or unsubstituted with an alkyl group having 1 to 12 carbon atoms, Or a naphthyl group substituted or unsubstituted with an alkyl group.

Specific examples of the compound represented by Formula 2 include 2-methyl-2-amino (4-morpholinophenyl) ethan-1-one, 2- 1-one, 2-propyl-2-amino (4-morpholinophenyl) ethan- (4-morpholinophenyl) propane-1-one, 2-amino-2- 2-methyl-2-methylamino (4-morpholinophenyl) propane-1-one, 1-one, 2-methyl-2-dimethylamino (4-morpholinophenyl) propan- have.

Examples of the biimidazole compound include 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis -Dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2-chlorophenyl) -4,4' Imidazole, 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetra (trialkoxyphenyl) biimidazole, phenyl group at 4,4' An imidazole compound substituted by a haloalkoxy group, and the like. Of these, 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2,3- 5,5'-tetraphenylbiimidazole is preferably used.

Examples of the oxime compounds include the following formulas (3), (4) and (5).

(3)

[Chemical Formula 4]

[Chemical Formula 5]

Further, as long as the effect of the present invention is not impaired, other photopolymerization initiators generally used in this field can be further used in combination. Examples of other photopolymerization initiators include benzoin-based compounds, benzophenone-based compounds, thioxanthone-based compounds, and anthracene-based compounds. These may be used alone or in combination of two or more.

Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether and the like.

Examples of the benzophenone compound include benzophenone, methyl 0-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3 ', 4,4'-tetra tert-butylperoxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and 4,4'-di (N, N'-dimethylamino) -benzophenone.

Examples of the thioxanthone compound include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4- .

Examples of the anthracene compound include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, .

Other examples include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzyl, 9,10-phenanthrenequinone, camphorquinone, phenylclyoxylic acid Methyl, titanocene compounds and the like can be mentioned as other photopolymerization initiators.

Meanwhile, according to a preferred embodiment of the present invention, when the photopolymerization initiator is used in combination with the photopolymerization initiator, the photosensitive resin composition for forming the insulating layer 50 containing the photopolymerization initiator becomes more sensitive, It is preferable that the productivity is improved.

The photopolymerization initiation auxiliary which can be used in combination with the photopolymerization initiator of the present invention is preferably at least one compound selected from the group consisting of an amine compound and a carboxylic acid compound.

Specific examples of the amine compound in the photopolymerization initiation auxiliary include aliphatic amine compounds such as triethanolamine, methyldiethanolamine and triisopropanolamine;

4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4- Aromatic amine compounds such as bis (dimethylamino) benzophenone (commonly known as Michler's ketone) and 4,4'-bis (diethylamino) benzophenone; And the like. As the amine compound, an aromatic amine compound is preferably used.

Specific examples of the carboxylic acid compound include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenyl And aromatic heteroacetic acids such as thioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, and naphthoxyacetic acid.

The photopolymerization initiator may be used in an amount of 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, based on the total solid content of the photosensitive resin composition for forming the insulating layer 50. The amount of the photopolymerization initiator used is preferably 0.1 To 20 parts by weight, preferably 1 to 10 parts by weight.

When the amount of the photopolymerization initiator used is within the above range, the photosensitive resin composition for forming the insulating layer 50 has a high sensitivity, and the strength of the insulating layer 50 and the smoothness of the surface of the insulating layer 50 become favorable It may be preferable. When the amount of the photopolymerization initiator is within the above range, the sensitivity of the photosensitive resin composition for forming the insulating layer 50 is further increased, and the productivity of the insulating layer 50 formed using the composition tends to be improved It may be preferable.

The solvent contained in the photosensitive resin composition for forming the insulating layer 50 of the present invention is not particularly limited and various organic solvents used in the field of the photosensitive resin composition can be used.

Specific examples of the solvent include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; Propylene glycol dialkyl ethers such as propylene glycol monomethyl ether; Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate; Aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin; Esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate; cyclic esters such as? -butyrolactone; And the like.

Among the above solvents, organic solvents having a boiling point of 100 ° C to 200 ° C in the solvent are preferably used from the viewpoint of coatability and dryness, more preferably alkylene glycol alkyl ether acetates, ketones, 3- Propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, 3- (3-methoxypropionate) and the like, and more preferably propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, Ethyl ethoxypropionate, methyl 3-methoxypropionate, and the like.

These solvents may be used alone or in combination of two or more.

The content of the solvent in the photosensitive resin composition for forming the insulating layer (50) of the present invention is usually 30 to 80 parts by weight, preferably 30 to 80 parts by weight, based on 100 parts by weight of the total of the photosensitive resin composition for forming the insulating layer May be 45 to 70 parts by weight. When the content of the solvent is within the above range within the above-mentioned criterion, the coating property tends to be good when applied by a coating device such as a roll coater, a spin coater, a slit and spin coater, a slit coater (sometimes referred to as a die coater) It may be desirable.

The insulating layer 50 may contain additives such as UV stabilizers, fillers, other polymer compounds, curing agents, dispersing agents, adhesion promoters, antioxidants, and antiredeposition agents, which are conventionally used in the art, as long as they do not impair the object of the present invention But are not limited to, such additives.

In another embodiment of the present invention, the touch sensor includes a substrate 10, a functional layer 30, an electrode pattern layer 40; And a pressure-sensitive adhesive layer or an adhesive layer (20).

In still another embodiment of the present invention, the touch sensor includes the substrate 10; The adhesive layer or adhesive layer 20 provided on at least one side of the substrate 10; The functional layer 30 provided on the pressure-sensitive adhesive layer or the adhesive layer 20; The electrode pattern layer (40) provided on the functional layer (30); And the insulating layer 50 provided on the electrode pattern layer 40.

The touch sensor may further include an electrode pattern layer 40 including a sensing electrode and a pad electrode formed at one end of the sensing electrode, And may be provided on the pattern layer 40 so as to cover the electrode pattern layer 40.

The substrate 10 may be formed of a material having excellent transparency, rigidity and workability such as glass, polymethyl methacrylate (PMMA) resin, polycarbonate (PC) resin, cycloolefin (COP) resin, triacetylcellulose TAC) based resin, polyethylene terephthalate (PET), or the like can be used. A commercially available substrate 10 may be purchased and used, and the substrate 10 may be manufactured by a method commonly used in the art, and the present invention does not limit the production method of the substrate 10 or the like .

The electrode pattern layer 40 includes a sensing electrode for sensing the touch and a pad electrode formed at one end of the sensing electrode. The sensing electrode may include an electrode for sensing a touch, and a wiring pattern connected to the electrode.

The touch sensor may further include a pad pattern layer on an upper portion or a lower portion of the pad electrode. The pad electrode can be electrically connected to the circuit board through the pad pattern layer and serves to lower the contact resistance when connected to the circuit board. When the circuit board is bonded in the direction of the insulating layer 50, the pad pattern layer is formed on the pad electrode, and when the touch sensor includes a separation layer and the circuit board is bonded in the direction of the separation layer The pad pattern layer may be formed under the pad electrode. The pad pattern layer may be omitted when the contact resistance between the pad electrode and the circuit board is sufficiently low.

The pad pattern layer may be formed of at least one material selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks, but is not limited thereto.

The electrode pattern layer 40 may be formed of a metal oxide as a transparent conductive layer. The metal oxide is selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), florinthine oxide (FTO) ZnO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide- -Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO).

The electrode pattern layer 40 may be formed of two or more conductive layers in order to reduce electrical resistance, but the present invention is not limited thereto.

An insulating layer 50 is formed on the electrode pattern layer 40. Since the insulating layer 50 according to the present invention includes the repeating unit derived from the polyfunctional acrylate represented by the above formula (1), the electrode layer has an advantage of preventing corrosion of the electrode pattern and protecting the surface.

It is preferable that the insulating layer 50 is formed to have a predetermined thickness by filling gaps between electrodes or wiring. In the present invention, the thickness of the insulating layer 50 is not limited.

That is, it is preferable that the surface opposite to the surface contacting the electrode pattern layer 40 is formed flat so as not to reveal irregularities of the electrode. Here, the insulating layer 50 may be formed to cover only the sensing electrode so as to be exposed to the outside without covering the pad electrode portion to provide a space for connecting the pad electrode or the pad pattern layer to the circuit board .

In the touch sensor of the present invention, the pad electrode may be electrically connected to the circuit board. The circuit board may be, for example, a flexible printed circuit board (FPCB), and may function to electrically connect the touch control circuit and the touch sensor of the present invention.

Fig. 1 illustrates a touch sensor in which a substrate, a pressure-sensitive adhesive layer or an adhesive layer, a functional layer, an electrode pattern layer and an insulating layer are provided in order, but the present invention is not limited thereto.

In the present invention, the functional layer 30 may be one or more selected from the group consisting of a separation layer and a protective layer.

The separating layer may be a polymer organic film, for example, polyimide, poly vinyl alcohol, polyamic acid, polyamide, polyethylene, polystyrene, Polynorbornene, phenylmaleimide copolymer, polyazobenzene, polyphenylenephthalamide, polyester, polymethyl methacrylate, polyarylate, polyacrylate, At least one material selected from the group consisting of polyarylates, cinnamate polymers, coumarin polymers, phthalimidine polymers, chalcone polymers, and aromatic acetylene polymers, .

The separating layer can be separated from the carrier substrate after forming the electrode pattern layer 40 on the carrier substrate, and then finally separated from the carrier substrate. However, the separating layer is not limited to the separating layer, It is not limited.

The protective layer may include at least one of an organic insulating film and an inorganic insulating film, and may be formed by a method of coating and hardening or by vapor deposition.

The protective layer may be formed except for a portion where a pad electrode is formed for a circuit connection or a portion where a pad electrode is formed. In addition, a pad pattern layer may be formed under the pad electrode. The protective layer may be formed by applying and patterning the entire upper surface of the separation layer to form a pad pattern layer, have.

The pressure-sensitive adhesive layer 20 and the adhesive layer 20 may be formed through a material commonly used in the art, a manufacturing method, and the like, but the present invention is not limited thereto.

The touch sensor may further include an optical control layer or the like commonly used in the art in addition to the above-described structure.

The manufacturing method of the touch sensor according to the present invention can be manufactured, for example, by the following method, but is not limited thereto.

For example, the first film is supplied from the first roller portion to the joining roller portion while controlling the contraction ratio of the first film through heat treatment and tension control on the first film including the conventional substrate 10 film and the bonding agent layer The second film is supplied from the second roller portion to the joining roller portion while adjusting the contraction ratio of the second film through heat treatment and tension control of the second film including the touch sensor and the protective film A second film supplying step and a film joining step of joining the first film and the second film to each other through the joining roller part. For example, the second film supplying step may be configured to separate a second film including a touch sensor and a protective film from a carrier substrate through a delamination process after being formed on a carrier substrate such as a glass substrate.

However, when a touch sensor is manufactured through the above-described method, a delamination crack may occur during the delamination process, but it may include an insulating layer 50 including the compound represented by Formula 1 according to the present invention A crack generated in the electrode pattern layer 40 can be prevented.

Hereinafter, the present invention will be described in detail by way of examples to illustrate the present invention. However, the embodiments according to the present disclosure can be modified in various other forms, and the scope of the present specification is not construed as being limited to the above-described embodiments. Embodiments of the present disclosure are provided to more fully describe the present disclosure to those of ordinary skill in the art. In the following, "%" and "part" representing the content are by weight unless otherwise specified.

Synthetic example  1: Synthesis of alkali-soluble resin (A1)

A flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen inlet tube was prepared, and 20 parts by weight of acetoacetoxyethylmethacrylate, 10 parts by weight of 2-hydroxyethylmethacrylate, 45 parts by weight of benzylmaleimide, 15 parts by weight of methacrylic acid, 10 parts by weight of tricyclodecyl methacrylate, 4 parts by weight of t-butylperoxy-2-ethylhexanoate, propylene glycol monomethyl ether acetate (hereinafter, PGMEA ") was added thereto, followed by stirring and mixing to prepare a monomer dropping tank. 6 parts by weight of n-dodecanethiol and 24 parts by weight of PGMEA were added and stirred to prepare a chain transfer agent dropwise.

Thereafter, 395 parts by weight of PGMEA was introduced into the flask, the atmosphere in the flask was changed to nitrogen in air, and the temperature of the flask was raised to 90 DEG C while stirring. Then, the monomer and the chain transfer agent were added dropwise from the dropping funnel. The mixture was heated to 110 DEG C for 1 hour and maintained at 90 DEG C for 2 hours. The temperature was elevated to 110 DEG C for 3 hours. Thereafter, the mixture was cooled to room temperature to obtain an alkali having a solid content of 29.1 wt.% And a weight average molecular weight of 23,000 and an acid value of 140 mgKOH / To obtain a soluble resin A1.

Synthetic example  2: Synthesis of alkali-soluble resin (A2 to A6)

In the same manner as in Synthesis Example 1, the compositions as shown in Table 1 below were added to obtain alkali-soluble resins (A2 to A6).

division AAEM HEMA BzMI MA DCPA Weight average molecular weight (Mw) Acid value
(MgKOH / g) A1 20 10 45 15 10 23,000 140 A2 30 - 45 15 10 24,000 140 A3 40 - 35 15 10 23,000 130 A4 50 - 25 15 10 25,000 140 A5 15 15 45 15 10 23,000 140 A6 5 20 45 15 10 24,000 140

Synthetic example  3: Synthesis of alkali-soluble resin (B1)

An alkali-soluble resin was synthesized in the same manner as in Synthesis Example 1 and kept at 90 캜 for 2 hours while being kept at 90 캜. After 1 hour, the temperature was elevated by 110 캜 and maintained for 3 hours. / 95 (v / v) mixed gas. Then, 10 parts by weight of glycidyl methacrylate, 0.4 part by weight of 2,2'-methylenebis (4-methyl-6-t-butylphenol) and 0.8 part by weight of triethylamine were charged into a flask, The reaction was continued and then cooled to room temperature to obtain an alkali-soluble resin B1 having a solid content of 29.1 wt% and a weight average molecular weight of 23,000 and an acid value of 114 mgKOH / g.

Synthetic example  4: Synthesis of alkali-soluble resin (B2 to B6)

The alkali-soluble resins (B2 to B6) were obtained in the same manner as in Synthesis Example 3, using the alkali-soluble resins A2 to A6 obtained in Synthesis Example 2.

division AAEM HEMA BzMI MA DCPA Weight average molecular weight (Mw) Acid value
(MgKOH / g) B1 20 10 45 15 10 23,000 114 B2 30 - 45 15 10 24,000 120 B3 40 - 35 15 10 23,000 110 B4 50 - 25 15 10 25,000 122 B5 15 15 45 15 10 23,000 130 B6 5 20 45 15 10 24,000 120

The weight average molecular weight (Mw) of the alkali-soluble resin thus prepared was measured by the GPC method under the following conditions.

Apparatus: HLC-8120GPC (manufactured by TOSOH CORPORATION)

Column: TSK-GELG4000HXL + TSK-GELG2000HXL (Serial connection)

Column temperature: 40 DEG C

Mobile phase solvent: tetrahydrofuran

Flow rate: 1.0 ml / min

Injection amount: 50 μl

Detector: RI

Measurement sample concentration: 0.6 mass% (solvent = tetrahydrofuran)

Standard materials for calibration: TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, A-500 (manufactured by TOSOH CORPORATION)

Example  And Comparative Example : Insulating layer  Photosensitive resin composition for forming

Using the components and compositions shown in Table 3 below, the mixture was diluted with propylene glycol monomethyl ether acetate (solvent) so that the total solid content was 18% by weight and sufficiently stirred to prepare a photosensitive resin composition for forming an insulating layer.

The alkali-soluble resin (A, B) The photopolymerizable compound (C) Light curing
Initiator (D) A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 Example 1 30 - - - - - 15 - - - - - 50.2 4.8 Example 2 - 30 - - - - - 15 - - - - 50.2 4.8 Example 3 - - 30 - - - - - 15 - - - 50.2 4.8 Example 4 - - - 30 - - - - - 15 - - 50.2 4.8 Example 5 20 - - - - - 25 - - - - - 50.2 4.8 Example 6 - 20 - - - - - 25 - - - - 50.2 4.8 Example 7 - - 20 - - - - - 25 - - - 50.2 4.8 Example 8 - - - 20 - - - - - 25 - - 50.2 4.8 Comparative Example 1 - - - - 30 - - - - - 15 - 50.2 4.8 Comparative Example 2 - - - - - 30 - - - - - 15 50.2 4.8 Comparative Example 3 - - - - 45 - - - - - - - 50.2 4.8 Comparative Example 4 - - - - - 45 - - - - - - 50.2 4.8 Comparative Example 5 - - - - - - - - - 45 - 50.2 4.8 Comparative Example 6 - - - - - - - - - - - 45 50.2 4.8 (A1 to A6, B1 to B6) The alkali-soluble resin
(C) Dipentaerythritol hexaacrylate (KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.)
(D) 1,2-octanediol, 1- [4- (phenylthio) -, 2- (O-benzoyloxime)] (IRGACURE OXE01, manufactured by Ciba Specialty Chemicals)

Insulating layer  Produce

An insulating layer was prepared using the photosensitive resin composition for forming an insulating layer according to Examples and Comparative Examples. That is, the photosensitive resin compositions of Examples 1 to 8 and Comparative Examples 1 to 6 were coated on a glass substrate by a spin coating method, and then placed on a heating plate and held at a temperature of 100 캜 for 3 minutes to form a thin film. Then, a test photomask having a square pattern of width 50 占 퐉 x 50 占 퐉 to 10 占 퐉 占 10 占 퐉 and a line / space pattern of 1 占 퐉 to 100 占 퐉 was placed on the thin film, And irradiated with ultraviolet rays. At this time, the ultraviolet light source was irradiated at an exposure dose (365 nm) of 40, 50, and 60 mJ / cm ² using an ultrahigh pressure mercury lamp (trade name: USH-250D) manufactured by Ushio DENKI Co., I did.

The thin film irradiated with ultraviolet rays was immersed in a KOH aqueous solution of pH 10.5 for 80 seconds to develop. The glass plate coated with the thin film was washed with distilled water, dried by blowing nitrogen gas, and heated in a heating oven at 230 ° C for 25 minutes to prepare an insulating layer. The thickness of the insulating layer prepared by the above method was 3.0 mu m.

Experimental Example : Insulating layer  Character rating

The transmittance, reliability, ITO resistance, etch resistance, thermal stability, elastic modulus, Delami crack and ITO corrosion resistance of the insulating layer prepared according to Examples and Comparative Examples were measured and evaluated as described below, Respectively.

(1) Transmittance

The transmittance of light at a wavelength of 550 nm of the substrate on which the insulating layer was formed according to Examples and Comparative Examples was measured using a spectrophotometer (U3210, manufactured by Hitachi, Ltd.).

(2) Reliability

 The substrate on which the insulating layer prepared according to Examples and Comparative Examples was immersed in PGMEA was heated at 100 ° C. for 30 minutes, and the change in thickness before and after the film was measured. The evaluation criteria are as follows.

○: 98% or more

?: 95% or more and less than 98%

×: less than 95%

(3) My ITO Castle

ITO sputtering was performed on the insulating layer of the substrate on which the insulating layer was formed according to Examples and Comparative Examples to a thickness of 1000 Å to measure changes in film wrinkle state. Generally, when the heat resistance of the insulating layer is low, wrinkles occur after ITO sputtering due to the difference in thermal expansion coefficient.

?: No wrinkles in the film when observed with the naked eye

X: state in which film wrinkles occurred when observed with the naked eye

(4) Etchability

The substrate on which the insulating layer was formed according to Examples and Comparative Examples was immersed in ITO etching solution (Kanto Kagaku ITO-02) at 60 degrees for 10 minutes, and the change in film thickness before and after immersion was measured and expressed as a percentage.

○: 98% or more

?: 95% or more and less than 98%

×: less than 95%

(5) Thermal stability

The substrate on which the insulating layer was formed according to Examples and Comparative Examples was further heated at 230 ° C for 20 minutes, and the change in transmittance was measured.

○: 3 ΔT% or less

Δ: 3 ΔT% exceeding 8 ΔT% or less

×: exceed 8 ΔT%

(6) Modulus of elasticity

The elastic modulus of the insulating layer prepared according to Examples and Comparative Examples was measured according to the method of KS M ISO 6721-4.

(7) Warrior separation crack ( Delami  crack)

The insulating layer was peeled off using a 3M # 55 tape (25 mm width / length 10 cm) on the substrate having the insulating layer prepared according to Examples and Comparative Examples, and the cracking of the coat transferred with the tape was visually observed.

○: No crack

×: Crack occurred

(8) ITO Corrosion resistance

ITO sputtering was performed on the insulating layer of the substrate on which the insulating layer was formed according to Examples and Comparative Examples to a thickness of 1000 Å and an insulating layer was formed on the ITO layer in the same manner as in Examples and Comparative Examples, Insulation layer / ITO / insulation layer structure. Thereafter, the substrate was immersed in a 0.1 M solution of acrylic acid in a thermostatic chamber (temperature: 40 ° C / humidity: 60%), and the change in the thickness of the ITO and the change in the surface state were observed by SEM.

Corrosivity evaluation standard

○: 3 ΔT% or less, no change on the surface

Δ: 3 ΔT% or more 8 ΔT% or less, a part of grain change on the surface

∘: 8 ΔT% or more, a large amount of grain change on the surface

Item Transmittance
(T% at 400 nm) Delami Crack responsibility PGMEA My ITO Castle Etchability Thermal stability Corrosivity in ITO Example 1 97.8 ○ ○ ○ ○ ○ ○ Example 2 97.2 ○ ○ ○ ○ ○ ○ Example 3 97.5 ○ ○ ○ ○ ○ ○ Example 4 97.4 ○ ○ ○ ○ ○ ○ Example 5 97.6 ○ ○ ○ ○ ○ ○ Example 6 97.8 ○ ○ ○ ○ ○ ○ Example 7 97.6 ○ ○ ○ ○ ○ ○ Example 8 97.7 ○ ○ ○ ○ ○ △ Comparative Example 1 96.8 ○ ○ ○ ○ ○ △ Comparative Example 2 98.1 ○ ○ × ○ ○ × Comparative Example 3 97.1 △ × × × × △ Comparative Example 4 96.4 × ○ ○ ○ ○ × Comparative Example 5 96.5 × △ × ○ ○ △ Comparative Example 6 96.2 × ○ ○ ○ ○ ×

In Table 4, when an alkali-soluble resin containing 20 to 50 parts of a repeating unit derived from a polyfunctional acrylate represented by the general formula (1) is used, it is excellent in transmittance, ITO resistance, ITO etchability, It can be seen that when 5-15 parts of the repeating unit derived from the polyfunctional acryl represented by the general formula (1) of the comparative examples 1 to 4 is contained, the ITO corrosion resistance is not good. In addition, when only the reactive alkali resins of Comparative Examples 5 to 6 were used, it can be seen that Delami crack occurred.

10: substrate
20: pressure-sensitive adhesive layer or adhesive layer
30: functional layer
40: electrode pattern layer
50: insulating layer

Claims (8)

An insulating layer comprising an alkali-soluble resin containing a repeating unit derived from a polyfunctional acrylic monomer represented by the following formula (1)
Wherein the repeating unit derived from the polyfunctional acrylic monomer is contained in an amount of 20 to 50 parts by weight based on 100 parts by weight of the entire alkali-soluble resin,
[Chemical Formula 1]

In Formula 1,
X is an alkylene group of C1 to C4,
R 'is hydrogen or a methyl group;
Y is hydrogen, a C20 or lower alkyl group, or an electron withdrawing group (EWG). The method according to claim 1,
The alkali-soluble resin may be a photopolymerization initiator or a reactive alkali-soluble resin exhibiting reactivity against UV irradiation; And
A photopolymerization initiator, and a non-reactive alkali-soluble resin exhibiting non-reactivity to UV irradiation. 3. The method of claim 2,
Wherein the reactive alkali-soluble resin is contained in an amount of 20 to 50 parts by weight based on 100 parts by weight of the entire alkali-soluble resin. The method according to claim 1,
Wherein the alkali-soluble resin is contained in an amount of 20 to 60 parts by weight based on 100 parts by weight of the total of the insulating layer. The method according to claim 1,
Wherein the insulating layer further comprises a photopolymerizable compound. The method according to claim 1,
A substrate, a functional layer, and an electrode pattern layer; And a pressure-sensitive adhesive layer or an adhesive layer. The method according to claim 6,
The touch sensor includes: the substrate;
The pressure-sensitive adhesive layer or the adhesive layer provided on at least one surface of the substrate;
The functional layer provided on the pressure-sensitive adhesive layer or the adhesive layer;
The electrode pattern layer provided on the functional layer; And
And the insulating layer provided on the electrode pattern layer. 8. The method of claim 7,
Wherein the electrode pattern layer includes a sensing electrode and a pad electrode formed at one end of the sensing electrode,
Wherein the insulating layer is provided to cover the electrode pattern layer on the electrode pattern layer.

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