KR20180079593A - Apparatus and Method for treating substrate - Google Patents

Abstract

The present invention relates to a substrate treating apparatus capable of increasing capacity utilization. The substrate treating apparatus comprises a bowl providing a space in which a process is performed; a chuck supporting a substrate in the housing during the process; an injection nozzle injecting a processing liquid on a processing surface of the substrate supported by the chuck during the process; and a bowl cleaning member installed in the bowl and cleaning the inner surface of the bowl polluted by the processing liquid dispersed from the substrate during the process.

Description

[0001] APPARATUS AND METHOD FOR TREATING SUBSTRATE [0002]

The present invention relates to a substrate processing apparatus, and more particularly, to a method of replacing an aging substrate in a substrate processing apparatus.

Generally, a semiconductor manufacturing apparatus is manufactured by repetitive execution of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, drying, and the like.

Among the unit processes, the cleaning and drying process is a process for removing a foreign substance or an unnecessary film (for example, PR) remaining on the surface of the semiconductor substrate during each unit process.

The apparatus for performing the cleaning and drying process is divided into a batch type cleaning apparatus for simultaneously cleaning a plurality of substrates and a single sheet type cleaning apparatus for cleaning a substrate by a single unit.

Here, the single wafer type cleaning apparatus includes a chuck for supporting a single substrate and at least one nozzle for supplying processing fluids to the substrate processing surface. When the single wafer cleaning apparatus is started, the substrate is placed on the chuck, The cleaning liquid, the rinse liquid and the drying gas are sequentially sprayed to clean and dry the substrate.

Such a single wafer type substrate cleaning apparatus treats the substrate surface by supplying a chemical solution (cleaning solution) onto a rotating substrate, where the chemical solution is scattered by the rotation of the substrate to contaminate the bowl surrounding the chuck.

Previously, the contaminated bowl was separated and cleaned, and the equipment could not be operated during the bowl cleaning period.

Embodiments of the present invention are intended to provide a substrate processing apparatus and method capable of reducing the cleaning cycle of the bowl and increasing the facility operation rate.

Embodiments of the present invention aim to provide a substrate processing apparatus and method capable of minimizing internal surface contamination of the bowl.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a bowl for providing a space for performing a process therein; A chuck supporting the substrate within the housing at the time of the process; A spray nozzle for spraying the treatment liquid onto the treatment surface of the substrate supported by the chuck in the process; And a bowl cleaning member installed on the bowl and for cleaning the inner surface of the bowl contaminated by the treatment liquid scattered from the substrate in the process.

The bowl cleaning member may further include a cleaning liquid supply unit; A cleaning liquid injection space formed at an upper end of the upper wall of the bowl and in which the cleaning liquid supplied from the cleaning liquid supply unit is temporarily stored; And a slot formed at the upper end of the inner surface of the upper wall and through which the washing liquid filled in the washing liquid injecting space flows.

In addition, the slot may be formed at an upper end of an inclined inner surface of the upper wall.

Further, the slot may be provided in a ring shape along the circumferential direction of the upper wall.

In addition, the slots may be spaced apart from each other along the circumferential direction of the upper wall.

According to an aspect of the present invention, there is provided a process for processing a substrate by rotating a substrate supported on a chuck and supplying a process liquid onto the substrate, wherein, during or after the process is completed, The cleaning liquid may flow to the inner wall of the bowl so as to prevent contamination of the bowl.

According to the present invention, the cleaning liquid flows through the slot and flows along the inner surface of the bowl, thereby minimizing contamination of the bowl by the treatment liquid scattered from the substrate.

1 is a plan view schematically showing a substrate processing facility of the present invention.
2 is a cross-sectional view schematically showing the substrate processing apparatus of FIG.
Fig. 3 is an enlarged sectional view of the main part of the bowl shown in Fig. 2;
4 is a cross-sectional perspective view of the bowl shown in Fig.
5 is a view showing the washing process of the bowl.
6 is a view showing another example of the slot.

Other advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Unless defined otherwise, all terms (including technical or scientific terms) used herein have the same meaning as commonly accepted by the generic art in the prior art to which this invention belongs. Terms defined by generic dictionaries may be interpreted to have the same meaning as in the related art and / or in the text of this application, and may be conceptualized or overly formalized, even if not expressly defined herein I will not.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms' comprise 'and / or various forms of use of the verb include, for example,' including, '' including, '' including, '' including, Steps, operations, and / or elements do not preclude the presence or addition of one or more other compositions, components, components, steps, operations, and / or components. The term 'and / or' as used herein refers to each of the listed configurations or various combinations thereof.

1 is a plan view schematically showing a substrate processing facility of the present invention.

Referring to FIG. 1, the substrate processing apparatus 1 has an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is seated in the load port 140. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the process chambers 260 are provided to be symmetrical with respect to the transfer chamber 240. A plurality of process chambers 260 are provided on one side of the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B. Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). ≪ / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

In the process chamber 260, a substrate processing apparatus 100 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 100 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 100 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are grouped into a plurality of groups such that the substrate processing apparatuses 100 in the process chambers 260 belonging to the same group are identical to one another, and within the process chambers 260 belonging to different groups, (100) may be provided differently from each other.

In the following examples, an apparatus for cleaning a substrate using processing fluids such as hot sulfuric acid, an alkaline chemical solution (including ozone water), an acidic chemical solution, a rinse solution, and a dry gas (gas containing IPA) is taken as an example. However, the technical idea of the present invention is not limited to this, and can be applied to various types of apparatuses that perform a process while rotating a substrate such as an etching process, a development process, and the like.

FIG. 2 is a cross-sectional view schematically showing the substrate processing apparatus of FIG. 1, FIG. 3 is an enlarged cross-sectional view of the bowl shown in FIG. 2, and FIG. 4 is a cross-sectional perspective view of the bowl shown in FIG.

2 to 4, a substrate processing apparatus 100 according to the present invention includes a bowl 110, a chuck 120, a driving part 130, a nozzle member 140 ), And a bowl cleaning member (200).

The bowl 110 provides a space for performing a process of processing the substrate W therein. The bowl 110 has a generally cylindrical shape. The top of the bowl 110 is open and the open top is used as a passageway through which the substrate W is moved into the space during processing. The bowl 110 has an upper wall 111a and a side wall 111b. The upper wall 111a and the side wall 111b are provided in an annular shape. The upper wall 111a extends upward from the upper end of the side wall 111b toward the center of the wafer W. [

The upper wall 111a prevents the process liquid that is scattered from the substrate W during the process from protruding out of the bowl 110.

A passageway member 112, a accommodation member 114 and an exhaust member 116 are provided in the space in the bowl 110. [ The passage portion 112 is provided so that the processing liquid which is scattered from the substrate W in the process is moved to the receiving portion 114. The passage portion 112 is provided annularly along the upper wall 111a and the side wall 111b. The accommodating portion 114 accommodates the processing liquid introduced from the passage portion 112. The receiving portion 114 is connected to the drain line 118. Therefore, the processing liquid accommodated in the accommodating portion 114 is discharged from the bowl 110 through the drain line 118. The exhaust unit 116 exhausts the gas in the bowl 110 to the outside. The exhaust part 116 is installed so as to communicate with the accommodating part 114. The exhaust part 116 and the accommodation part 114 are partitioned by the partition 116a. Therefore, the processing liquid introduced into the accommodating portion 114 is stored in the accommodating portion 114, and the fume generated from the processing liquid accommodated in the accommodating portion 114 is transferred to the exhausting portion 116. The fume transferred to the exhaust section 116 is exhausted from the bowl 110 through the exhaust line 119.

The chuck 120 supports the substrate W within the bowl 110 during processing. The chuck 120 includes a chuck plate 122 and a rotating shaft 124. The chuck plate 122 has a generally disc shape. The chuck plate 122 has a top surface that seats the substrate W during processing. One end of the rotation shaft 124 is coupled to the lower center of the chuck plate 122, and the other end is coupled to the driver 130. The rotation shaft 124 transfers the rotational force of the actuator 130 to the chuck plate 122.

The driver 130 drives the chuck 120 during the process. That is, the actuator 130 rotates the rotation shaft 124 to rotate the substrate W supported by the chuck plate 122 at a predetermined process speed. The actuator 130 moves the rotary shaft 124 upward and downward to adjust the height of the substrate W mounted on the chuck plate 122 during the process.

The nozzle portion 140 ejects the processing fluid to the processing surface of the substrate W supported by the chuck 120 during processing. The nozzle unit 140 includes an injection nozzle 142 and a transfer member 144. At least one injection nozzle 142 is provided. When a plurality of injection nozzles 142 are provided, each of the injection nozzles 142 injects different processing fluids. The transfer member 144 transfers the injection nozzle 142. Here, the processing fluid includes the processing liquid and the processing gas. Various types of chemicals may be used as the treatment liquid, and dry gas may be used as the treatment gas.

Next, the bowl cleaning member 200 according to the present embodiment is configured to prevent the inside of the upper wall 111a of the bowl 110 from being contaminated by the treatment liquid scattered from the substrate during the process.

The bowl cleaning member 200 includes a cleaning liquid injection space 210 formed at the upper end of the upper wall 111a of the bowl 110, a cleaning liquid supply unit 220 for supplying the cleaning liquid to the cleaning liquid injection space 210, And a slot 230 formed on the inner surface of the upper wall 111a and through which the washing liquid filled in the washing liquid injecting space 210 flows.

The slot 230 is preferably formed at the upper end of the inclined inner surface of the upper wall. If the slot 230 is formed on the horizontal inner surface of the upper wall 111a, the cleaning liquid can be dropped immediately without flowing along the inner surface.

The slot 230 may be provided in a ring shape along the circumferential direction of the upper wall 111a. However, the present invention is not limited thereto. As shown in FIG. 6, the slots 230a may be provided at predetermined intervals along the circumferential direction of the upper wall 111a.

5, the washing liquid is supplied to the washing liquid injecting space 210 through the washing liquid supplying unit 220, and the washing liquid filled in the washing liquid injecting space 210 flows out through the slots 230, (111a).

Even if the processing liquid scattered from the substrate is adhered to the inner surface of the upper wall 111a of the bowl 110, contamination of the bowl 110 can be minimized while flowing on the inner surface by the cleaning liquid.

The cleaning process of the bowl with the cleaning liquid may be performed simultaneously with the processing of the substrate, or may be performed during operation to replace the substrate after the processing of the substrate is completed.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

110: bowl 120: chuck
130: driver 140: nozzle unit
200: Bowl cleaning member

Claims (6)

In the substrate processing apparatus,
A bowl for providing a space for performing a process inside;
A chuck supporting the substrate within the housing at the time of the process;
A spray nozzle for spraying the treatment liquid onto the treatment surface of the substrate supported by the chuck in the process; And
And a bowl cleaning member installed on the bowl and for cleaning the inner surface of the bowl contaminated by the treatment liquid scattered from the substrate in the process. The method according to claim 1,
The bowl cleaning member
A cleaning liquid supply unit;
A cleaning liquid injection space formed at an upper end of the upper wall of the bowl and in which the cleaning liquid supplied from the cleaning liquid supply unit is temporarily stored; And
And a slot formed at an upper end of the inner surface of the upper wall and through which the washing liquid filled in the washing liquid injecting space flows. 3. The method of claim 2,
Wherein the slot is formed at an upper end of an inclined inner surface of the upper wall. 3. The method of claim 2,
Wherein the slot is provided in a ring shape along the circumferential direction of the upper wall. 3. The method of claim 2,
The slot
And is provided at a predetermined interval along the circumferential direction of the upper wall. Rotating the substrate supported on the chuck, and supplying the processing solution onto the substrate to process the substrate,
Wherein the cleaning liquid flows into the inner wall of the bowl surrounding the chuck during the process or after the process is completed to prevent contamination of the bowl.

Images